CN102865472A - High-heat-conductivity flexible ultrathin LED (light-emitting diode) lamp - Google Patents
High-heat-conductivity flexible ultrathin LED (light-emitting diode) lamp Download PDFInfo
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- CN102865472A CN102865472A CN2012101924510A CN201210192451A CN102865472A CN 102865472 A CN102865472 A CN 102865472A CN 2012101924510 A CN2012101924510 A CN 2012101924510A CN 201210192451 A CN201210192451 A CN 201210192451A CN 102865472 A CN102865472 A CN 102865472A
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Abstract
The invention discloses a high-heat-conductivity flexible ultrathin LED (light-emitting diode) lamp, which comprises a flexible aluminum base material component consisting of a first aluminum foil layer, a first heat conducting and insulating rubber layer and a copper foil layer in an overlapping and bonding way. The first heat conducting and insulating rubber layer is a middle layer. The copper foil layer and the first aluminum foil layer are respectively arranged on the two sides of the first heat conducting and insulating rubber layer. The high-heat-conductivity flexible ultrathin LED lamp additionally comprises a high-heat-conductivity aluminum covering film component which is bonded on the external side surface of the aluminum foil layer, and consists of a second aluminum foil layer, a second heat conducting and insulating rubber layer and a release protection layer which are sequentially connected together and are overlapped and bonded. A plurality of LEDs are arranged at intervals on the copper foil layer. On the premise that the flexibility is not influenced, the working stability and reliability of the high-heat-conductivity flexible ultrathin LED lamp can be greatly improved.
Description
Technical field
The present invention relates to light-emitting device, be specifically related to the super book type of a kind of high heat conduction deflection LED lamp.
Background technology
In the prior art, need to the electroluminescent lamp that the LED luminous tube is made the super book type of deflection be installed at some flexible LED aluminium bases, therefore needing a kind of is flexible use, and job stability and reliability all very strong LED aluminium base assemble, but this substrate must cooperate a kind of flexible radiating component, the normal operation of guarantee LED luminous tube.
Summary of the invention
Order of the present invention is being; For the defects of prior art, provide under a kind of prerequisite that does not affect flexural property, can greatly improve the super book type of the high heat conduction deflection LED lamp of job stability and reliability and perfect heat-dissipating.
A kind of super book type LED lamp of high heat conduction deflection is provided, comprise the deflection aluminium base member that is superimposed and bonds and form by the first aluminium foil layer, the first heat conductive insulating glue-line and copper foil layer, the heat conductive insulating layer is the intermediate layer, and the both sides of heat conductive insulating glue-line are respectively the first copper foil layer and the first aluminium foil layer; Also comprise the high heat conduction aluminum overlay film member that sticks on the first aluminium foil bed of material lateral surface, high heat conduction aluminum overlay film member is by the second aluminium foil layer that is connected in turn, the second heat conductive insulating glue-line and three layers of superimposed bonding composition of release protective layer; Be interval with a plurality of LED luminous tubes at copper foil layer.
In the super book type LED lamp of above-mentioned high heat conduction deflection, described a plurality of LED luminous tubes adopt the mode of arrays to stick on the electronic circuit of described copper foil material layer to consist of matrix form electroluminescent lamp group.
The super book type LED lamp of high heat conduction deflection provided by the invention, formed by the aluminium foil layer that is connected in turn, heat conductive insulating glue-line and release layer by aluminium foil, copper foil material, heat conductive insulating glue-line and three layers of deflection aluminium base member that forms of copper foil material layer and high heat conduction aluminum overlay film member, be aluminium foil layer topmost, it is the heat conductive insulating glue-line below the aluminium foil, be copper foil material above the heat conductive insulating layer, apply one deck thermal conductive insulation glue and copper foil material applying at aluminium foil.Be specially adapted to make the LED lamp with high heat conduction and deflection characteristic, under the prerequisite that does not affect flexural property, can greatly improve job stability and the reliability of the super book type LED of high heat conduction deflection.
Description of drawings
Fig. 1 is the structure cutaway view of the super book type LED lamp of high heat conduction deflection.
The specific embodiment
With reference to shown in Figure 1; Design a kind of super book type LED lamp of high heat conduction deflection, be provided with the deflection aluminium base member that is superimposed and bonds and form by the first aluminium foil layer 5, the first heat conductive insulating glue-line 3 and copper foil layer 1, the first heat conductive insulating glue-line 3 is intermediate layers, and the two sides of the first heat conductive insulating glue-line 3 adopt adhesive- layer 2,4 to be bonded with copper foil layer 1 and the first aluminium foil layer 5; Also be provided with a kind of high heat conduction aluminum overlay film member that sticks on the first aluminium foil layer 5 lateral surfaces, high heat conduction aluminum overlay film member is by the second aluminium foil layer 7 that is connected in turn, the second heat conductive insulating glue-line 9 and 11 3 layers of superimposed bonding composition of release protective layer; The second heat conductive insulating glue-line 9 is intermediate layers; the second aluminium foil layer 7 and release protective layer 11 are bonded on the two sides of the second heat conductive insulating glue-line 9 by adhesive- layer 8,10 respectively; the second aluminium foil layer 7 is bonding by adhesive-layer 6 and the first aluminium foil layer 5, is interval with a plurality of LED luminous tubes 13 at copper foil layer 1.
In the super book type LED lamp of above-mentioned high heat conduction deflection, a plurality of LED luminous tubes 13 adopt the mode of arrays to stick on the electronic circuit of described copper foil layer 1 to consist of matrix form electroluminescent lamp group; On copper foil layer 1, also do not have the power drives interface, be used for driving LED luminous tube 13.
Claims (3)
1. the super book type LED lamp of a high heat conduction deflection, comprise the deflection aluminium base member that is superimposed and bonds and form by the first aluminium foil layer, the first heat conductive insulating glue-line and copper foil layer, the first heat conductive insulating layer is the intermediate layer, and the both sides of the first heat conductive insulating glue-line are respectively copper foil layer and the first aluminium foil layer; Also comprise the high heat conduction aluminum overlay film member that sticks on the described aluminium foil layer lateral surface, high heat conduction aluminum overlay film member is by the second aluminium foil layer that is connected in turn, the second heat conductive insulating glue-line and three layers of superimposed bonding composition of release protective layer; It is characterized in that: be interval with a plurality of LED luminous tubes at described copper foil layer.
2. the super book type LED lamp of high heat conduction deflection according to claim 1 is characterized in that: described a plurality of LED luminous tubes adopt the mode of arrays to stick on the electronic circuit of described copper foil layer to consist of matrix form electroluminescent lamp group.
3. the super book type LED lamp of high heat conduction deflection according to claim 2 is characterized in that: also do not have the power drives interface on described copper foil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101924510A CN102865472A (en) | 2012-06-13 | 2012-06-13 | High-heat-conductivity flexible ultrathin LED (light-emitting diode) lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012101924510A CN102865472A (en) | 2012-06-13 | 2012-06-13 | High-heat-conductivity flexible ultrathin LED (light-emitting diode) lamp |
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| Publication Number | Publication Date |
|---|---|
| CN102865472A true CN102865472A (en) | 2013-01-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012101924510A Pending CN102865472A (en) | 2012-06-13 | 2012-06-13 | High-heat-conductivity flexible ultrathin LED (light-emitting diode) lamp |
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| CN (1) | CN102865472A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015161652A1 (en) * | 2014-04-25 | 2015-10-29 | 陈弘昌 | Mounting method for self-adhesion substrate |
| CN105757537A (en) * | 2016-03-25 | 2016-07-13 | 京东方科技集团股份有限公司 | Backlight module and display device |
| CN106838846A (en) * | 2017-02-24 | 2017-06-13 | 厦门源乾电子科技有限公司 | A kind of light fixture is used can flexible aluminium base heat sink and its production technology |
| CN104806900B (en) * | 2014-01-28 | 2017-07-14 | 晋挥电子有限公司 | LED lamp and its manufacture method |
| CN109724022A (en) * | 2017-10-31 | 2019-05-07 | 光宝电子(广州)有限公司 | Outdoor illumination device |
| US10520664B2 (en) | 2016-03-25 | 2019-12-31 | Boe Technology Group Co., Ltd. | Backlight module and display device |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004009349A1 (en) * | 2002-07-19 | 2004-01-29 | Pilkington Plc. | Laminated glazing panel |
| CN201491371U (en) * | 2009-04-16 | 2010-05-26 | 惠州国展电子有限公司 | Metal base cover layer used for printed circuit board |
| TW201104150A (en) * | 2009-07-16 | 2011-02-01 | Top Victory Invest Ltd | Backlight module |
| CN202182365U (en) * | 2011-08-08 | 2012-04-04 | 创维液晶器件(深圳)有限公司 | LED light strip, side light type backlight module and display |
| CN202262031U (en) * | 2011-08-10 | 2012-05-30 | 田茂福 | Heat dissipation type led flexible circuit board |
| CN203010225U (en) * | 2012-06-13 | 2013-06-19 | 东莞市天晖电子材料有限公司 | High heat conduction flexible ultra-thin LED lamp |
-
2012
- 2012-06-13 CN CN2012101924510A patent/CN102865472A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004009349A1 (en) * | 2002-07-19 | 2004-01-29 | Pilkington Plc. | Laminated glazing panel |
| CN201491371U (en) * | 2009-04-16 | 2010-05-26 | 惠州国展电子有限公司 | Metal base cover layer used for printed circuit board |
| TW201104150A (en) * | 2009-07-16 | 2011-02-01 | Top Victory Invest Ltd | Backlight module |
| CN202182365U (en) * | 2011-08-08 | 2012-04-04 | 创维液晶器件(深圳)有限公司 | LED light strip, side light type backlight module and display |
| CN202262031U (en) * | 2011-08-10 | 2012-05-30 | 田茂福 | Heat dissipation type led flexible circuit board |
| CN203010225U (en) * | 2012-06-13 | 2013-06-19 | 东莞市天晖电子材料有限公司 | High heat conduction flexible ultra-thin LED lamp |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104806900B (en) * | 2014-01-28 | 2017-07-14 | 晋挥电子有限公司 | LED lamp and its manufacture method |
| WO2015161652A1 (en) * | 2014-04-25 | 2015-10-29 | 陈弘昌 | Mounting method for self-adhesion substrate |
| CN105098019A (en) * | 2014-04-25 | 2015-11-25 | 晋挥电子有限公司 | Self-adhered substrate mounting method |
| CN105098019B (en) * | 2014-04-25 | 2018-02-06 | 晋挥电子有限公司 | The attaching method of self-adhesion substrate |
| CN105757537A (en) * | 2016-03-25 | 2016-07-13 | 京东方科技集团股份有限公司 | Backlight module and display device |
| US10234124B2 (en) | 2016-03-25 | 2019-03-19 | Boe Technology Group Co., Ltd. | Backlight module and display device |
| US10520664B2 (en) | 2016-03-25 | 2019-12-31 | Boe Technology Group Co., Ltd. | Backlight module and display device |
| CN106838846A (en) * | 2017-02-24 | 2017-06-13 | 厦门源乾电子科技有限公司 | A kind of light fixture is used can flexible aluminium base heat sink and its production technology |
| CN109724022A (en) * | 2017-10-31 | 2019-05-07 | 光宝电子(广州)有限公司 | Outdoor illumination device |
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Application publication date: 20130109 |