CN1664700A - High performance emulsion type cylinder photosensitizing glue - Google Patents
High performance emulsion type cylinder photosensitizing glue Download PDFInfo
- Publication number
- CN1664700A CN1664700A CN2005100247236A CN200510024723A CN1664700A CN 1664700 A CN1664700 A CN 1664700A CN 2005100247236 A CN2005100247236 A CN 2005100247236A CN 200510024723 A CN200510024723 A CN 200510024723A CN 1664700 A CN1664700 A CN 1664700A
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- photosensitizing
- glue
- high performance
- type cylinder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003504 photosensitizing agent Substances 0.000 title claims abstract description 22
- 239000000839 emulsion Substances 0.000 title claims description 34
- 239000003292 glue Substances 0.000 title claims description 17
- 230000002165 photosensitisation Effects 0.000 title claims description 17
- 239000003822 epoxy resin Substances 0.000 claims abstract description 41
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 41
- -1 alkyl fatty alcohol Chemical class 0.000 claims abstract description 26
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000178 monomer Substances 0.000 claims abstract description 20
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 16
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 14
- 239000000203 mixture Substances 0.000 claims abstract description 7
- 230000004048 modification Effects 0.000 claims description 10
- 238000012986 modification Methods 0.000 claims description 10
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 claims description 9
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 8
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 7
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 7
- 229920001568 phenolic resin Polymers 0.000 claims description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 claims description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims description 6
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 claims description 6
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 claims description 4
- 238000004945 emulsification Methods 0.000 claims description 4
- SLGWESQGEUXWJQ-UHFFFAOYSA-N formaldehyde;phenol Chemical compound O=C.OC1=CC=CC=C1 SLGWESQGEUXWJQ-UHFFFAOYSA-N 0.000 claims description 4
- ZXEKIIBDNHEJCQ-UHFFFAOYSA-N isobutanol Chemical compound CC(C)CO ZXEKIIBDNHEJCQ-UHFFFAOYSA-N 0.000 claims description 4
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 claims description 4
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 3
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical class [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 229930185605 Bisphenol Natural products 0.000 claims description 3
- 244000028419 Styrax benzoin Species 0.000 claims description 3
- 235000000126 Styrax benzoin Nutrition 0.000 claims description 3
- 235000008411 Sumatra benzointree Nutrition 0.000 claims description 3
- 239000003963 antioxidant agent Substances 0.000 claims description 3
- 230000003078 antioxidant effect Effects 0.000 claims description 3
- 229960002130 benzoin Drugs 0.000 claims description 3
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 238000006266 etherification reaction Methods 0.000 claims description 3
- 235000019382 gum benzoic Nutrition 0.000 claims description 3
- 239000003112 inhibitor Substances 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 238000006116 polymerization reaction Methods 0.000 claims description 3
- 229920005749 polyurethane resin Polymers 0.000 claims description 3
- 239000003381 stabilizer Substances 0.000 claims description 3
- 150000005208 1,4-dihydroxybenzenes Chemical class 0.000 claims description 2
- 239000005711 Benzoic acid Substances 0.000 claims description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N Benzoic acid Natural products OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 2
- 239000004952 Polyamide Chemical class 0.000 claims description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N acetone Substances CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 2
- 150000001412 amines Chemical class 0.000 claims description 2
- 150000008064 anhydrides Chemical class 0.000 claims description 2
- PYKYMHQGRFAEBM-UHFFFAOYSA-N anthraquinone Natural products CCC(=O)c1c(O)c2C(=O)C3C(C=CC=C3O)C(=O)c2cc1CC(=O)OC PYKYMHQGRFAEBM-UHFFFAOYSA-N 0.000 claims description 2
- 150000004982 aromatic amines Chemical class 0.000 claims description 2
- 235000010233 benzoic acid Nutrition 0.000 claims description 2
- 229910052796 boron Inorganic materials 0.000 claims description 2
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical class CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 claims description 2
- 229940035429 isobutyl alcohol Drugs 0.000 claims description 2
- 229910052757 nitrogen Inorganic materials 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 2
- 150000002989 phenols Chemical class 0.000 claims description 2
- 229920002647 polyamide Chemical class 0.000 claims description 2
- 235000013824 polyphenols Nutrition 0.000 claims description 2
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 abstract description 18
- SOCTUWSJJQCPFX-UHFFFAOYSA-N dichromate(2-) Chemical compound [O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O SOCTUWSJJQCPFX-UHFFFAOYSA-N 0.000 abstract description 8
- 238000000034 method Methods 0.000 abstract description 6
- 239000002699 waste material Substances 0.000 abstract description 2
- 231100000614 poison Toxicity 0.000 abstract 2
- 230000007096 poisonous effect Effects 0.000 abstract 2
- 239000006071 cream Substances 0.000 abstract 1
- 239000012530 fluid Substances 0.000 abstract 1
- 150000001455 metallic ions Chemical class 0.000 abstract 1
- 239000003505 polymerization initiator Substances 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 229910052759 nickel Inorganic materials 0.000 description 6
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 238000007605 air drying Methods 0.000 description 4
- 238000011010 flushing procedure Methods 0.000 description 4
- 231100000331 toxic Toxicity 0.000 description 4
- 230000002588 toxic effect Effects 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 239000008399 tap water Substances 0.000 description 3
- 235000020679 tap water Nutrition 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- LEJBBGNFPAFPKQ-UHFFFAOYSA-N 2-(2-prop-2-enoyloxyethoxy)ethyl prop-2-enoate Chemical compound C=CC(=O)OCCOCCOC(=O)C=C LEJBBGNFPAFPKQ-UHFFFAOYSA-N 0.000 description 2
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 2
- 238000001723 curing Methods 0.000 description 2
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 1
- GTELLNMUWNJXMQ-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical class OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO GTELLNMUWNJXMQ-UHFFFAOYSA-N 0.000 description 1
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 206010034960 Photophobia Diseases 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 239000012752 auxiliary agent Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 238000010382 chemical cross-linking Methods 0.000 description 1
- 229910001430 chromium ion Inorganic materials 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 125000000664 diazo group Chemical group [N-]=[N+]=[*] 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229910001385 heavy metal Inorganic materials 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 208000013469 light sensitivity Diseases 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical class OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 239000002383 tung oil Substances 0.000 description 1
- 238000010792 warming Methods 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
Abstract
This invention discloses an efficient cylinder photoresist in the form of water-cream, which comprises modified SBQ resin water solution, composition of actinic cured resin and epoxy resin, epoxy resin curing agent, hydrophilic unsaturated monomer, photo polymerization initiator, lower alkyl fatty alcohol, and so on. The invention doesn't adopt bichromate as photosensitizer and contain poisonous solution like toluene. No poisonous gas and no heavy metallic ion waste fluid need to be discharged in the using process.
Description
Technical field
The present invention is about high performance emulsion type cylinder photosensitizing glue, in use nontoxic, the free of contamination aqueous emulsion type cylinder photoresists that particularly adopt modification SBQ resin to make as photosensitizer.
Background technology
Currently marketed aqueous emulsion type cylinder photoresists principal ingredient is to constitute photosensitive system with dichromate/PVA; Constitute bonding system with epoxy resin.Because price comparison is cheap, photosensitive property good, the system net is convenient, print characteristics such as fastness is good.Long-term next, ruled domestic and international ROTARY SCREAM PRINTING market.
In the above-mentioned aqueous emulsion type cylinder photoresists, employed photosensitizer dichromate can combine with hydroxyl among the PVA under illumination and form water-fast macromolecular compound, securely attached on the nickel screen.Not illumination part, hydroxyl unreacted still are water-soluble, so can pass through the water development imaging, make flower type net tube.Obviously the toxicity of this chromium ion has brought difficulty for the discharging of developer solution, and dichromate/PVA photosensitive system is not adopted in people's expectation.
In the commercially available in addition aqueous emulsion type cylinder photoresists, epoxy resin has used and has accounted for the solvent that contain toluene of total constituent more than 10%.Give the dry forming process of filming from being applied to, the volatilization of toxic solvent causes influencing problems such as labor safety, environmental pollution, disaster hidden-trouble, expects to have the aqueous emulsion type cylinder photoresists that do not contain toxic solvents such as toluene.
We replace dichromate/PVA with the SBQ resin, attempt to prepare environment-friendly type cylinder photoresists.Practice shows that the SBQ resin can provide outstanding light sensitivity, but can not satisfy the water development fastness, is difficult to make the good colored type net tube of image repetition.
Summary of the invention
The objective of the invention is to disclose a kind of high performance emulsion type cylinder photosensitizing glue, do not adopt dichromate to make photosensitizer, do not contain toxic solvents such as toluene, safety, environmental protection in the use.
The objective of the invention is to realize by following technical method: adopt modification the SBQ resin replace dichromate/PVA, that adds q.s has the light-curable resin of compatibility with epoxy resin, and the monomer of water wettability tool vinyl unsaturated link fully mixes with epoxy resin, without toluene, reduced epoxy resin viscosity and be convenient to emulsification.During photocuring, light-curable resin, water wettability tool vinyl unsaturated link monomer unsaturated group in the SBQ resin participates in photochemical reaction, form network,, be fixed on firmly on the nickel screen mesh the epoxy resin mechanical interlocking, thereby improve the water development fastness significantly, satisfied ctp request.The existence of water wettability tool vinyl unsaturated link monomer is except that generating the IPN network, in emulsion process, owing to the stability that has improved emulsion that aligns of hydrophilic radical.When solidifying behind the flower type net tube high temperature, the further chemical crosslinking of epoxy resin and hardening agent forms long-lived colored type net tube, thereby finishes the present invention.
A kind of high performance emulsion type cylinder photosensitizing glue of the present invention, said composition is mainly composed of the following components by weight percentage;
Modification SBQ resin aqueous solution 10%～40%
Mutual tolerant 5%～15% of photo curable resin and epoxy resin
Water wettability tool unsaturated vinyl monomer 0.5%～10%
Epoxy curing agent 5%～12%
Photoepolymerizationinitiater initiater 0.03%～1%
Low alkyl group fatty alcohol 0.5%～5%
Water surplus.
Epoxy resin of the present invention is selected from a kind of or its potpourri in bisphenol A type epoxy resin, bisphenol f type epoxy resin, resorcinol type epoxy resin, line style phenol formaldehyde (PF) epoxy resin, orthoresol formaldehyde epoxy resin, the modified toughened epoxy resin.
Photo curable resin of the present invention is selected from acrylic modified epoxy resin, acrylic acid modified polyurethane resin.
Epoxy curing agent of the present invention is selected from a kind of or its potpourri in phenolics, etherification of phenolic resin, polyamide, aromatic amine, alicyclic amine, aromatic anhydride class, alicyclic acid anhydrides class, halogen-containing anhydrides, the boron trifluoride-amine complex.
Water wettability tool unsaturated vinyl monomer of the present invention is meant the monomer that has many alkylene glycols in molecular structure, the monomer that contains the monomer of carboxyl and contain hydroxyl, and concrete example is:
The monomer of the many alkylene glycols of tool is: dipropylene glycol two (methyl) acrylate, tripropylene glycol two (methyl) acrylate, ethoxylated neopentylglycol two (methyl) acrylate, many ethylene glycol bisthioglycolates (methyl) acrylate, phenoxy group diethylene glycol two (methyl) acrylate, ethoxylated trimethylolpropane triacrylate etc.
The monomer that contains carboxyl can be: β-carboxyethyl (methyl) acrylate, succinic acid list (methyl) acrylate, phthalic acid list hydroxyethyl (methyl) acrylate etc.
The monomer that contains hydroxyl is: 2-hydroxyethyl (methyl) acrylate, 2-hydroxypropyl (methyl) acrylate, 3-chloro-2-hydroxypropyl (methyl) acrylate etc.
Water wettability tool unsaturated vinyl monomer of the present invention is to contain one of said structure or their potpourri all can.
Low alkyl group fatty alcohol of the present invention is selected from a kind of or its potpourri in methyl alcohol, ethanol, n-propanol, isopropyl alcohol, normal butyl alcohol, the isobutyl alcohol.
Photoepolymerizationinitiater initiater of the present invention is meant the material that is easy to generate free radical under illumination, can select more than one as composition main composition thing from benzoin alkylether class, tert-butyl peroxide class, tert-butyl group anthraquinone, thioxanthones.
Above-mentioned Photoepolymerizationinitiater initiater can be with p-dimethyl amido benzoic acid Arrcostab and photopolymerization promoter that the 2-methyl isophthalic acid-[4-methyl mercapto phenyl]-the 2-morpholinyl-1-acetone etc. is known and sensitizer and with for well.
The stabilizing agent, polymerization inhibitor that high-efficiency environment friendly aqueous emulsion type cylinder photoresists of the present invention can add the antioxidant known, light and heat be phenols, hydroquinones, hindered amines, nitrogen heterocycles etc. for example.Addition is with respect to 0.001%～0.5% of whole aqueous emulsion type cylinder photoresists weight.
Under the prerequisite that does not influence performance of the present invention, can add other composition, as: dyestuff, pigment, surfactant, defoamer, levelling agent, wax emulsion etc.
The present invention also can suitably add diazo resin before the use as required.Its addition is with respect to 0.03%～0.3% of whole aqueous emulsion type cylinder photoresists weight.
Specifications of raw materials:
Per 100 parts of epoxy resin add 20～50 parts of photo curable resins, after stirring, add 20～50 parts of water wettability tool unsaturated vinyl monomers again and fully stir evenly.Cp/25 ℃ of light-curable resin range of viscosities (6000～25000).Unsaturated group content (0.1～0.5) mol/100g.
Modification SBQ resin method for making:
It is (12～14) % that the SBQ resin is adjusted its aqueous solution solid content, regulate its PH≤3.0 with acid, be warming up to 40～90 ℃, add N-hydroxyalkyl (methyl) acrylamide (carbon number of alkyl is 1～3), be incubated 1～9 hour, reduce to room temperature, neutralization, make PH=4.0～6.0, be modification SBQ resin aqueous solution.
Its specification is as follows:
PH 4.0～6.0
Solid content %w.t 10.0～14.0
Viscosity 500～5000cp/25 ℃
Unsaturated group content mol/100g 0.01～0.1
The method for making of aqueous emulsion type cylinder photoresists of the present invention:
Epoxy resin and/or hardening agent by above-mentioned prescription has diluted add auxiliary agent as required, in per 100 parts, add 100～250 parts of modifications SBQ resin aqueous solution and 0～20 portion of non-ionic surfactant carry out emulsification, make cylinder photoresists aqueous emulsion.
The method for making of colored type net tube of the present invention:
At the order number is on 25～155 purpose nickel screens, is coated with above-mentioned emulsion type garden net photoresists, after 40 ℃ of heated-air dryings, and the exposure of flower type.Soak in 20～40 ℃ of water after 2 minutes, the flowing water flushing obtains the flower type and films.Further after 150～180 ℃, solidified 0.5～2.0 hour, obtain flower type net tube.
High performance emulsion type cylinder photosensitizing glue disclosed in this invention, its advantage shows: do not adopt dichromate as photosensitizer, do not contain toxic solvents such as toluene.In use, nonhazardous gas discharging, heavy metal free ion discharging of waste liquid.This cylinder photoresists water development fastness can satisfy the meticulous decorative pattern requirement of preparation, solidifies tool good printing fastness in back behind the high temperature, and use has a extensive future.
Embodiment
Below in conjunction with embodiment the present invention is further described.
Embodiment 1
Epoxy resin/hardening agent 100g
Modification SBQ resin aqueous solution: (13% weight concentration) 100g
DPGDA 80g
Normal butyl alcohol 7g
Thioxanthone 2g
Water 711g
Annotate 1, this epoxy resin is to be that the acrylic modified epoxy resin of 0.4mol/100g constitutes by adding 20g unsaturated group content in the 100g phenol F type 6420; Hardening agent adopts etherification of phenolic resin 284.
The emulsion that above-mentioned prescription is made is cast on the nickel screen, and the exposure of flower type is soaked in 20 ℃ of water after 40 ℃ of heated-air dryings, and type is now spent in entry.With tap water flushing net tube, image repetition is good after 2 minutes.Flower type net tube after 2 hours, is printed 3 myriametre fabrics through 165 ℃ of heat curings, and the flower type does not have breakage.
Embodiment 2:
Epoxy resin/hardening agent 270g
Modification SBQ resin aqueous solution (13% weight concentration) 400g
Phenoxy group diethylene glycol diacrylate 10g
Ethanol 70g
Benzoin dimethylether 8g
Water 242g
Notes 2, epoxy resin are bisphenol A-type E-21, and adding 30g unsaturated group content in every 100g epoxy resin is the acrylic modified epoxy resin of 0.15mol/100g; Hardening agent adopts polyamide 6 50.
The emulsion that above-mentioned prescription is made is cast on the nickel screen.After 40 ℃ of heated-air dryings, the exposure of flower type.In 30 ℃ of water, soak, go into bloom type and manifest.1.5 with the tap water flushing, present colored type and film after minute, image repetition is good.Flower type net tube is printed 3 myriametre fabrics after 180 ℃ of elevated temperature heat are solidified 1.5 hours, the flower type does not have breakage.
Embodiment 3:
Epoxy resin/hardening agent 180g
Modification SBQ resin aqueous solution: (13% weight concentration) 250g
Hydroxy-ethyl acrylate 20g
EO-TMPTA 30g
Isopropyl thioxanthone 3g
P-dimethylamino-ethyl benzoate 3g
Methyl alcohol 5g
Water 509g
Notes 3, epoxy resin are modified toughened epoxy resin, and adding 35g unsaturated group content in every 100g epoxy resin is the acrylic acid modified polyurethane resin of 0.15mol/100g; Hardening agent adopts tung oil acid anhydride.
Be modulated into aqueous emulsion with above-mentioned prescription, be cast on the nickel screen, after 40 ℃ of heated-air dryings, the exposure of flower type is soaked in 25 ℃ of water, and pattern is seen in entry.With the tap water flushing, obtain the flower type and film after 2 minutes.Image repetition is good.Flower type net tube is printed 3 myriametre fabrics after 180 ℃ of elevated temperature heat are solidified 1 hour, the flower type does not have breakage.
Claims (11)
1, a kind of high performance emulsion type cylinder photosensitizing glue is characterized in that: said composition is mainly composed of the following components by weight percentage;
Modification SBQ resin aqueous solution 10%～40%
Mutual tolerant 5%～15% of photo curable resin and epoxy resin
Epoxy curing agent 5%～12%
Water wettability unsaturated monomer 0.5%～10%
Photoepolymerizationinitiater initiater 0.03%～2%
Low alkyl group fatty alcohol 0.5%～5%
Water surplus
2, according to the high performance emulsion type cylinder photosensitizing glue of claim 1, it is characterized in that: described epoxy resin is selected from a kind of or its potpourri in bisphenol A type epoxy resin, bisphenol f type epoxy resin, resorcinol type epoxy resin, line style phenol formaldehyde (PF) epoxy resin, orthoresol formaldehyde epoxy resin, the modified toughened epoxy resin.
3, according to the high performance emulsion type cylinder photosensitizing glue of claim 1, it is characterized in that: described photo curable resin is selected from acrylic modified epoxy resin, acrylic acid modified polyurethane resin.
4, according to the high performance emulsion type cylinder photosensitizing glue of claim 1, it is characterized in that: described water wettability unsaturated monomer is selected from one of unsaturated vinyl monomer, the unsaturated vinyl monomer that contains carboxyl that contains many alkylene glycols, the unsaturated vinyl monomer that contains hydroxyl or its potpourri.
5, according to the high performance emulsion type cylinder photosensitizing glue of claim 3, it is characterized in that: described photo curable resin, should be earlier and epoxy resin stir, mix with the water wettability unsaturated monomer again, after stirring, go emulsification again.
6, according to the high performance emulsion type cylinder photosensitizing glue of claim 1, it is characterized in that: described epoxy curing agent is selected from phenolics, etherification of phenolic resin, polyamide, aromatic amine, alicyclic amine, aromatic anhydride class, alicyclic acid anhydrides class, contains a kind of or its potpourri in the plain anhydrides of tooth, the boron trifluoride-amine complex.
7, according to the high performance emulsion type cylinder photosensitizing glue of claim 1, it is characterized in that: described low alkyl group fatty alcohol is selected from a kind of or its potpourri in methyl alcohol, ethanol, n-propanol, isopropyl alcohol, normal butyl alcohol, the isobutyl alcohol.
8, according to the high performance emulsion type cylinder photosensitizing glue of claim 1, it is characterized in that: described Photoepolymerizationinitiater initiater is selected from a kind of or its potpourri in benzoin alkylether class, di-tert-butyl peroxide class, tert-butyl group anthraquinone, the thioxanthones.
9, high performance emulsion type cylinder photosensitizing glue according to Claim 8, it is characterized in that: described Photoepolymerizationinitiater initiater can with photopolymerization promoter and sensitizer and usefulness, photopolymerization promoter and sensitizer are selected from right-dimethyl amido benzoic acid Arrcostab, 2 methyl isophthalic acids-[4-methyl mercapto phenyl]-2-morpholinyl-1-acetone.
10, according to the high performance emulsion type cylinder photosensitizing glue of claim 1, it is characterized in that: these photoresists contain stabilizing agent, the polymerization inhibitor of antioxidant, light and heat.
11, according to the high performance emulsion type cylinder photosensitizing glue of claim 10, it is characterized in that: stabilizing agent, the polymerization inhibitor of described antioxidant, light and heat are selected from phenols, hydroquinones, hindered amines, nitrogen heterocycles.Its addition is with respect to 0.001%～0.5% of whole aqueous emulsion type cylinder photoresists weight.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100247236A CN100472323C (en) | 2005-03-29 | 2005-03-29 | High performance emulsion type cylinder photosensitizing glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100247236A CN100472323C (en) | 2005-03-29 | 2005-03-29 | High performance emulsion type cylinder photosensitizing glue |
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| Publication Number | Publication Date |
|---|---|
| CN1664700A true CN1664700A (en) | 2005-09-07 |
| CN100472323C CN100472323C (en) | 2009-03-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB2005100247236A Expired - Fee Related CN100472323C (en) | 2005-03-29 | 2005-03-29 | High performance emulsion type cylinder photosensitizing glue |
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| CN (1) | CN100472323C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101241304B (en) * | 2007-02-09 | 2012-05-09 | 上海中大科技发展有限公司 | Waterfast environment-friendly type rotary screen stenciling photoresist |
| CN101592864B (en) * | 2008-05-30 | 2012-07-11 | 上海中大科技发展有限公司 | Single-component water-emulsion type rotary screen stenciling sensitive material |
| CN110083011A (en) * | 2019-05-06 | 2019-08-02 | 浙江易能感光材料有限公司 | A kind of high sensitivity environmental protection one-component Photoactive Gum for Rotary Screen and its preparation method and application |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3771714B2 (en) * | 1998-05-12 | 2006-04-26 | 互応化学工業株式会社 | Photosensitive resin composition and photo solder resist ink for printed wiring board manufacture |
| JP4022004B2 (en) * | 1998-10-12 | 2007-12-12 | 互応化学工業株式会社 | Photosensitive resin composition and photoresist ink for production of printed wiring board |
| JP2001352157A (en) * | 2000-06-06 | 2001-12-21 | Goo Chemical Co Ltd | Photo-setting type plugging ink for manufacturing printed wiring board with through-hole and method for manufacturing printed wiring board with through-hole using the same ink |
-
2005
- 2005-03-29 CN CNB2005100247236A patent/CN100472323C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101241304B (en) * | 2007-02-09 | 2012-05-09 | 上海中大科技发展有限公司 | Waterfast environment-friendly type rotary screen stenciling photoresist |
| CN101592864B (en) * | 2008-05-30 | 2012-07-11 | 上海中大科技发展有限公司 | Single-component water-emulsion type rotary screen stenciling sensitive material |
| CN110083011A (en) * | 2019-05-06 | 2019-08-02 | 浙江易能感光材料有限公司 | A kind of high sensitivity environmental protection one-component Photoactive Gum for Rotary Screen and its preparation method and application |
| CN110083011B (en) * | 2019-05-06 | 2022-07-01 | 浙江易能感光材料有限公司 | High-sensitivity environment-friendly single-component rotary screen photosensitive adhesive and preparation method and application thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100472323C (en) | 2009-03-25 |
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