CN1657656A - Method for manufacturing moulded plate with microstructure pattern - Google Patents
Method for manufacturing moulded plate with microstructure pattern Download PDFInfo
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- CN1657656A CN1657656A CN 200410005420 CN200410005420A CN1657656A CN 1657656 A CN1657656 A CN 1657656A CN 200410005420 CN200410005420 CN 200410005420 CN 200410005420 A CN200410005420 A CN 200410005420A CN 1657656 A CN1657656 A CN 1657656A
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- pressuring template
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Abstract
A process for manufacturing the die plate with a microstructure pattern on its surface includes such steps as providing a substrate, generating the first pattern which is a reverse microstructure pattern, generating the second pattern for limiting the boundary of die plate, and electrocasting to form an enclosing wall determined by the second pattern.
Description
Technical field
The invention provides the method for a kind of making pressuring template (stamper), refer to that especially a kind of making exempts from the method for cutting type pressuring template.
Background technology
But since injection-molded have product molding easily mass production, reduce production costs and can be fit to advantage such as complicated finished product moulding, so be widely used in optical disc recording medium, daily living article, electrical home appliances and the automobile spare part, become now plastics and the metal-processing industry forming technique of widespread use the most.And in above-mentioned injection-molded operation, the model that is used for duplicating the microstructure graph of finished surface has been played the part of epochmaking role, its quality even determined the height of product yield.
General large size Modelling mode often is that pressuring template (stamper) is fixed on the mould to use as model.Traditionally, after the processing of ejaculation pattern is finished on the pressuring template surface, be mostly pressuring template to be cut into required core rod size in the mechanical workout mode.Yet, in the known machinery knives course of processing, usually cause pressuring template to produce micro-deformation, or produce the burr cause because of cutting, make the mirror surface mould of injection-molded time damage board, even the precision that penetrates product can't reach product requirement, especially the making of optical module such as light guiding plate.Therefore, cut pressuring template in traditional mechanical workout mode, not only consuming time, also can't satisfy the requirement of cutting accuracy.
In addition, when pressuring template is when being applied to the electronics of ultraprecise or microinjection molding etc. or optical articles, have meticulous microstructure graph condition in order to satisfy to produce on the pressuring template surface, novel technology is directly to produce the monoblock pressuring template in the electroforming mode.Yet; be subjected to the restriction of mould on the electroforming process; pressuring template size after finishing can be bigger than needed finished product; usually can with electroforming process in to be used to carry the size of substrate of pressuring template identical; therefore the worker master mold need use its redundance excision with the size that cooperates injection-molded mould.Therefore, the electroforming pressuring template still has the problem that cuts.
Summary of the invention
Therefore main purpose of the present invention is to provide a kind of method of utilizing the growth enclosure wall to produce pressuring template in electroforming process, to solve the problem of known making pressuring template method.
The present invention discloses the method that a kind of making has the pressuring template of microstructure graph.This method provides a substrate earlier, then form one first graph layer on substrate, and the figure of this first graph layer is opposite with the microstructure graph of the predetermined pressuring template of making.On substrate, form a second graph layer then, be used for limiting the size edge of pressuring template, carry out an electroforming process at last again, and utilize the second graph layer as the electroforming enclosure wall of growing, on substrate, to form at least one this pressuring template.
Because the present invention is before electroforming process, on substrate, form second graph layer earlier as electroforming growth enclosure wall, so that the pressuring template that electroforming is made has the size that meets injection-molded mould, therefore after forming pressuring template, just do not need to carry out again in addition the cutting process of mechanical workout, so can effectively avoid problems such as the distortion that causes because of traditional mechanical workout and burr.
Description of drawings
Fig. 1 to Fig. 7 makes the operation synoptic diagram of first embodiment of pressuring template method for the present invention.
Fig. 8 makes the synoptic diagram of the 3rd embodiment of pressuring template method for the present invention.
The reference numeral explanation:
10 substrates, 12 photoresist layers
12 ' first graph layer, 14 electroforming crystal seed layers
16 second graph layer 18a, 18b pressuring template
30 substrates, 32 electroforming crystal seed layers
34 first graph layers, 36 second graph layers
38a, 38b pressuring template
Embodiment
Referring to figs. 1 to Fig. 7, Fig. 1 to Fig. 7 makes the operation synoptic diagram of first embodiment of pressuring template method for the present invention.As shown in Figure 1, at first provide a substrate 10, substrate 10 can be clean glass substrate or other insulated substrate.Then at substrate 10 surface coated one photoresist layer 12, and utilize yellow optical micro-image operation, with the figure transfer that designs to photoresist layer 12, and then through developing, to form first graph layer 12 ' as shown in Figure 2.Wherein, the microstructure graph that the figure of first graph layer 12 ' and the predetermined pressuring template surface that makes are had is opposite, and in the present embodiment, first graph layer 12 ' is formed by having photosensitive photoresist, is not limited to eurymeric or minus photoresistance.
With reference to figure 3, then form the thin electroforming crystal seed layer (seed layer) 14 of one deck at substrate 10 and first graph layer, 12 ' surface, and ladder covers (step cover) in first graph layer 12 ' and substrate 10 surfaces, so that electroforming crystal seed layer 14 presents the figure identical with first graph layer 12 '.Wherein, the main effect of electroforming crystal seed layer 14 is to help the electroforming metal thing to adhere in electroforming process and long crystalline substance, therefore, the thickness system of electroforming crystal seed layer 14 needs according to operation and decides, and thickness unit can be as small as nanometer (nanometer, nm) grade, and be the function that reaches electroforming crystal seed layer 14, its material is that conductive metallic substance is preferable, material such as nickel, silver for example, and can sputter, mode such as evaporation or electroless plating forms.In addition, the non-metallic material such as carbon film of tool electroconductibility also can be used as electroforming crystal seed layer 14.
With reference to figure 4, after forming electroforming crystal seed layer 14, then on substrate 10, form one deck insulating second graph layer 16 again.In the present embodiment, second graph layer 16 is a sensitive materials, for example eurymeric or minus photoresist.And the generation type of the figure of second graph layer 16 also is to utilize yellow optical micro-image operation, exposes, develops via a light shield with special pattern, finishes figure transfer.It should be noted that, second graph layer 16 of the present invention mainly is the growth enclosure wall that is used as in the electroforming process, therefore its figure can limit the size edge of the pressuring template of desire making, so thickness is thicker, reach hundreds of micron (micrometer approximately, μ m) to thousands of microns, decide on operation, but all must be greater than the thickness of the follow-up pressuring template that will make.
With reference to figure 5, Fig. 5 is the top view of the substrate 10 shown in Fig. 4, second graph layer 16 and electroforming crystal seed layer 14.Because first graph layer 12 ' is the microstructure graph that is used for limiting the pressuring template surface, and second graph layer 16 is the size edges that are used for limiting pressuring template, so both figures are on substrate 10 surfaces and are in staggered distribution, and can not overlap.Also promptly as shown in Figure 5, the electroforming crystal seed layer 14 of part is covered in first graph layer, the 12 ' surface of projection, and second graph layer 16 then is distributed in first graph layer, 12 ' periphery.
Then,, carry out an electroforming process, make metallic substance, but be not attached to insulating second graph layer 16 surface, to form two pressuring template 18a, 18b on substrate 10 surfaces along 14 surface growths of electroforming crystal seed layer with reference to figure 6.As previously mentioned, electroforming thickness must so that second graph layer 16 is brought into play the function of growth enclosure wall, and be limited to the size of pressuring template 18a, 18b in 16 area surrounded of second graph layer less than the thickness of second graph layer 16.So, the pressuring template 18a, the 18b that produce just have the fixed size, and do not need the action of cutting in addition or processing.
At last, as shown in Figure 7, carry out a demoulding operation, pressuring template 18a, 18b and substrate 10, second graph layer 16 and first graph layer 12 ' are separated from each other, and do not needed pressuring template 18a, 18b, and directly be arranged at and be used as core rod in the injection-molded mould and use via cutting.In addition, if the material of electroforming crystal seed layer 14 is with the pressuring template 18a that produces, when the 18b material is identical, for example both are all metallic nickel, then do not need the lip-deep electroforming crystal seed layer 14 of pressuring template 18a, 18b is removed, use and can directly pressuring template 18a, 18b behind the demoulding be used as core rod together with its lip-deep electroforming crystal seed layer 14.On the other hand, when the formation material of electroforming crystal seed layer 14 and pressuring template 18a, 18b not simultaneously, then in the demoulding operation, also electroforming crystal seed layer 14 must be removed from pressuring template 18a, 18b surface.
In the second embodiment of the present invention, the material of first graph layer and second graph layer is all non-sensitive materials.With first graph layer is example, its generation type can form a non-photosensitive material layer and a photoresist layer at substrate surface earlier in regular turn, carry out a yellow optical micro-image operation then, with figure transfer to photoresist layer, after developing, come non-photosensitive material layer is carried out etching as etch shield with patterned photoresist layer again, at last photoresist layer is removed, finish first graph layer of non-photosensitive.And the operation that forms the second graph layer of non-sensitive materials also is same as first graph layer, so do not add to give unnecessary details.
With reference to figure 8, Fig. 8 makes the synoptic diagram of the 3rd embodiment of pressuring template method for the present invention.In the third embodiment of the present invention, electroforming crystal seed layer 32 is to be formed between the substrate 30 and first graph layer 34.Therefore in the 3rd embodiment, be to form electroforming crystal seed layer 32 on substrate 10 surfaces earlier, just form first graph layer 34 and second graph layer 36 on electroforming crystal seed layer 32 surfaces.It should be noted that because the figure of first graph layer 34 and second graph layer 36 does not overlap, so both formation order can exchange, or form by the same material layer.For example, when first and second graph layer 34,36 be when being formed by the same material layer, because the thickness of second graph layer 36 must be greater than pressuring template 38a, the 38b of follow-up formation, and the thickness of first graph layer 34 needs less than pressuring template 38a, 38b, therefore first and the material of second graph layer 34,36 can select the non-photosensitive material, utilize repeatedly graphical photoresist layer to carry out the several etching respectively then, to form first and the second graph layer 34,36 of different thickness.On the other hand, in order to improve the effect of electroforming process, first graph layer 34 is optionally made with electro-conductive material, can form the microstructure graph of first graph layer 34 of fitting to guarantee pressuring template 38a, 38b surface.
In the fourth embodiment of the present invention, being directly to use this substrate as electro-conductive material, and forming first and the second graph layer that limits microstructure graph and pressuring template marginal dimension respectively thereon, serves as the growth enclosure wall with the second graph layer then, carry out electroforming process, to form pressuring template.Similarly, first graph layer is optionally made with electro-conductive material, to improve the effect of electroforming process.
Compare with known technology, the inventive method mainly is to utilize twice yellow optical micro-image operation and an electroforming process to produce to exempt to cut and the pressuring template of tool arbitrary shape, its method mainly is to utilize the second graph layer made from the insulativity material to be used as the growth enclosure wall of restriction electroforming pressuring template, makes the pressuring template of producing have predetermined size and shape.Though the first, the 3rd embodiment of the present invention is an example to make two rectangle pressuring templates simultaneously, is not limited to pressuring template quantity and the shape that can produce simultaneously in the electroforming process.Utilize the produced pressuring template of this inventive method, distortion and the burr problem that can avoid traditional mechanical type cutting to be produced also can accurately be produced the pressuring template size that needs, and save time and process cost.
The above only is preferred embodiment of the present invention, and all equivalent variations and modifications of being done according to the present patent application claim all should belong to the covering scope of patent of the present invention.
Claims (15)
1. a making has the method for the pressuring template of microstructure graph, and this method includes the following step:
One substrate is provided;
On this substrate, form one first graph layer, and the figure of this first graph layer is opposite with this microstructure graph;
On this substrate, form a second graph layer, and this second graph layer is used for limiting the size edge of this pressuring template; And
Carry out an electroforming process, and utilize this second graph layer, on this substrate, to form at least one this pressuring template as electroforming growth enclosure wall.
2. method as claimed in claim 1 is characterized in that: this method includes the step that forms an electroforming crystal seed layer in addition.
3. method as claimed in claim 2 is characterized in that: this electroforming crystal seed layer is formed at this substrate surface and ladder covers on this first photoresist layer, so that this electroforming crystal seed layer presents the figure identical with this first graph layer.
4. method as claimed in claim 2 is characterized in that: this electroforming crystal seed layer is formed between this substrate and this first photoresist layer.
5. method as claimed in claim 2 is characterized in that: this electroforming crystal seed layer is a metal level.
6. method as claimed in claim 1 is characterized in that: this substrate is made of electro-conductive material.
7. method as claimed in claim 1 is characterized in that: this second graph layer does not overlap mutually with this first graph layer.
8. method as claimed in claim 1 is characterized in that: the thickness of this second graph layer is greater than the thickness of this pressuring template.
9. method as claimed in claim 1 is characterized in that: this first graph layer is made of a sensitive materials.
10. method as claimed in claim 9 is characterized in that: this first graph layer is eurymeric photoresist or minus photoresist.
11. method as claimed in claim 1 is characterized in that: this second graph layer is made of a sensitive materials.
12. the method as claim 11 is characterized in that: this second graph layer is eurymeric photoresist or minus photoresist.
13. method as claimed in claim 1 is characterized in that: this first graph layer is made of an electro-conductive material.
14. method as claimed in claim 1 is characterized in that: this second graph layer be by an insulating material be the institute constitute.
15. method as claimed in claim 1 is characterized in that: this method also includes one and makes this pressuring template and this substrate separation steps, to obtain complete and this pressuring template that need not cut.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410005420 CN1657656A (en) | 2004-02-18 | 2004-02-18 | Method for manufacturing moulded plate with microstructure pattern |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200410005420 CN1657656A (en) | 2004-02-18 | 2004-02-18 | Method for manufacturing moulded plate with microstructure pattern |
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| CN1657656A true CN1657656A (en) | 2005-08-24 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 200410005420 Pending CN1657656A (en) | 2004-02-18 | 2004-02-18 | Method for manufacturing moulded plate with microstructure pattern |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104570595A (en) * | 2014-12-30 | 2015-04-29 | 上海蓝沛新材料科技股份有限公司 | Imprinting mold with low surface roughness and preparation method thereof |
| CN114086220A (en) * | 2021-07-30 | 2022-02-25 | 达运精密工业股份有限公司 | Method for manufacturing metal mask and electroformed master plate |
-
2004
- 2004-02-18 CN CN 200410005420 patent/CN1657656A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104570595A (en) * | 2014-12-30 | 2015-04-29 | 上海蓝沛新材料科技股份有限公司 | Imprinting mold with low surface roughness and preparation method thereof |
| CN104570595B (en) * | 2014-12-30 | 2019-06-11 | 上海量子绘景电子股份有限公司 | Imprint mold and preparation method thereof with low surface roughness |
| CN114086220A (en) * | 2021-07-30 | 2022-02-25 | 达运精密工业股份有限公司 | Method for manufacturing metal mask and electroformed master plate |
| CN114086220B (en) * | 2021-07-30 | 2023-11-14 | 达运精密工业股份有限公司 | Manufacturing method of metal mask and electroformed mother board |
| TWI826810B (en) * | 2021-07-30 | 2023-12-21 | 達運精密工業股份有限公司 | Method for manufacturing metal mask and electroforming plate |
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Open date: 20050824 |