CN1654534A - Method for manufacturing inorganic powder contained resin composition, transfer film and components for display screen - Google Patents
Method for manufacturing inorganic powder contained resin composition, transfer film and components for display screen Download PDFInfo
- Publication number
- CN1654534A CN1654534A CNA2005100077220A CN200510007722A CN1654534A CN 1654534 A CN1654534 A CN 1654534A CN A2005100077220 A CNA2005100077220 A CN A2005100077220A CN 200510007722 A CN200510007722 A CN 200510007722A CN 1654534 A CN1654534 A CN 1654534A
- Authority
- CN
- China
- Prior art keywords
- inorganic powder
- resin layer
- methyl
- film
- transfer film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/40—Glass
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0016—Plasticisers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/10—Esters; Ether-esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J11/00—Gas-filled discharge tubes with alternating current induction of the discharge, e.g. alternating current plasma display panels [AC-PDP]; Gas-filled discharge tubes without any main electrode inside the vessel; Gas-filled discharge tubes with at least one main electrode outside the vessel
- H01J11/20—Constructional details
- H01J11/34—Vessels, containers or parts thereof, e.g. substrates
- H01J11/36—Spacers, barriers, ribs, partitions or the like
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Materials Engineering (AREA)
- Gas-Filled Discharge Tubes (AREA)
Abstract
To provide an inorganic powder-containing resin composition excellent in storage stability; a transfer film with a layer comprising the resin composition; and a method for producing a display panel using the transfer film. The inorganic powder-containing resin composition contains: (A) the inorganic powder; (B) a binder resin containing an alkali-soluble resin having a constitutional unit represented by formula (1) (where R denotes a monovalent organic group); (C) a polyfunctional (meth)acrylate; and (D) a photopolymerization initiator. A method for producing a member for a display panel involved in the invention comprises steps of: transferring a resin layer comprising the inorganic powder-containing resin composition onto a substrate using a transfer film with the resin layer; forming a latent image of a pattern by exposing the resin layer; forming the pattern by developing the resin layer; and baking the pattern.
Description
Technical field
Transfer film that the present invention relates to be applicable to the resin combination that contains inorganic powder of components for display screen manufacturing, makes by said composition and the manufacture method that adopts the above-mentioned components for display screen of this transfer film.
Background technology
In recent years, plasma panel (hereinafter referred to as " PDP ") and field-emitter display (hereinafter referred to as " FED ") just receive much attention as plane fluorescence display.PDP is by forming transparency electrode, enclose rare gas elementes such as argon gas or neon between two close sheet glass, cause plasma discharge and make gas luminescence, thereby makes light-emitting phosphor and show the indicating meter of information.On the other hand, FED makes negative electrode emitting electrons under vacuum by applying electric field, by making the fluor on this electron-bombardment anode, makes light-emitting phosphor and shows the indicating meter of information.
Fig. 1 is the cross section mode chart of hitherto known AC type PDP.In Fig. 1,101 and 102 is the glass substrate that is oppositely arranged, and 103 and 111 is dividing plate, is cut apart by glass substrate 101, glass substrate 102, back side dividing plate 103 and frontal baffles 111 to form chamber.104 for being fixed on the transparency electrode on the glass substrate 101; 105 is the bus electrode that purpose forms on this transparency electrode 104 for reducing transparency electrode resistance; 106 for being fixed on the address electrode on the glass substrate 102; 107 for being kept at the fluorescent substance in the chamber; 108 are the covering transparent electrode 104 that forms and the dielectric layer of bus electrode 105 on glass substrate 101 surfaces; 109 dielectric layers for the overlay address electrode 106 that on glass substrate 102 surfaces, forms, 110 serve as reasons protective membrane that magnesium oxide for example forms.In addition, in color PDP,, between glass substrate and dielectric layer, also be provided with colour filter (red, green, blueness) and black matrix" etc. in order to obtain the image of high-contrast.
Fig. 2 opens the mode chart of the cross-sectional shape of disclosed present known Spindt type FED in flat 6-124669 communique (patent documentation 2) etc. for the spy opens clear 61-221783 communique (patent documentation 1) and spy.In Fig. 2,201 and 202 are the glass substrate that is oppositely arranged, form transparency electrode 204 and fluor 207 as anode electrode at the downside of glass substrate 201, on glass substrate 202 lamination cathode electrode 206.On cathode electrode 206, form insulation layer 203 and conical radiator 205.On insulation layer 203, form porous grid (ゲ one ト) 208, be partitioned into chamber by the dividing plate 209 that forms on the grid 208.Radiator 205 is the negative electrode with the cold cathode of high field emission, it is characterized in that also can launching electronics from the radiator end when the loss of voltage that applies.Ejected electron by such excited fluophor 207 outermost electronics, can be carried out pictorial display by the grid 208 impact fluorescence bodies 207 of electric field.
The most suitable use of manufacture method of above-mentioned PDP dielectric layer is included in and forms the resin layer that contains inorganic powder on the substrate, this resin layer is carried out the method for the operation of roasting again.
In addition, the most suitable use of manufacture method of the dielectric layer of above-mentioned PDP, dividing plate, electrode, fluor, colour filter and black matrix" is included in and forms the photo-sensitive resin that contains inorganic powder on the substrate, this resin layer is carried out uv irradiating by photomask develop, again the pattern that forms on the substrate is carried out the light lithography etc. of the operation of roasting.
On substrate, form the method for the resin layer that contains inorganic powder as these, the most suitable use forms the resin layer that contains this inorganic powder on the flexible support film, thereby obtain transfer film, with this transfer film this resin layer that contains inorganic powder is carried out transfer printing again and the method that forms.Like this,, can obtain the good resin layer that contains inorganic powder of thickness evenness, reach the purpose of increasing work efficiency simultaneously by using transfer film.
But, the resin layer that contains inorganic powder that is obtained by this resin combination is being carried out in the operation of roasting, exist on the resin layer surface that contains inorganic powder to be easy to generate problem of cracks.For example, PDP if do not have good surface smoothing and film uniformity, then can not demonstrate stable dielectricity with dielectric layer.And crack and aperture can destroy insulativity.So far,, high temperature must be set carry out long roasting condition, will contain the abundant fusion of resin layer of inorganic powder in order to address this problem.But, cause increasing the weight of the burden of stoving oven and the problem that reduces productivity through long processing of high temperature.Therefore, even just can not produce fissured material by low temperature short period of time calcination process in that demand is a kind of yet.
In addition, in containing the photosensitive polymer combination of inorganic powder, if use the inorganic powder that contains polyvalent metal and/or polyvalent metal oxides, the problem of this resin combination gelation can appear.Its reason is, because in order to make composition have photosensitivity and alkali-soluble, the common alkali-soluble polymkeric substance that contains unsaturated double-bond by employing is as binder resin, and the acidic functionality in the polymkeric substance (carboxyl etc.) reacts with the multivalent metal hydroxides on above-mentioned inorganic powder surface.
Like this, when containing the resin combination gelation of inorganic powder, the filming difficulty that becomes can occur not only, and promptly allow to filming momently, development treatment is problem such as instability also, and therefore, resin combination can not prolonged preservation.Therefore, even the resin combination that contains inorganic powder that needs a kind of prolonged preservation also to be difficult to gelation.
[patent documentation 1] spy opens clear 61-221783 communique
[patent documentation 2] spy opens flat 6-124669 communique
[patent documentation 3] spy opens flat 9-102273 communique
[patent documentation 4] spy opens flat 11-144628 communique
[patent documentation 2] spy opens flat 11-162339 communique
Summary of the invention
Problem of the present invention provide can by low temperature short period of time calcination process adaptation to the ground become the good components for display screen of surface smoothing the resin combination that contains inorganic powder, have the transfer film of the layer that this resin combination forms and with the method for this transfer film manufacturing components for display screen.
In addition, problem of the present invention also provides the good resin combination that contains inorganic powder of storage stability, has the transfer film of the layer that this resin combination forms and the manufacture method of using the components for display screen of this transfer film.
The resin combination that contains inorganic powder that the present invention relates to is characterised in that and comprises:
(A) inorganic powder and
(B) contain the binder resin of polymkeric substance, described polymkeric substance has the structural unit (below, be called structural unit (I)) of following general formula (I) expression,
(in the formula, R is the organic group of 1 valency).
And above-mentioned (B) binder resin can be an alkali soluble resin.
In addition, the resin combination that contains inorganic powder that the present invention relates to can also be further comprise (C) polyfunctional group (methyl) acrylate and (D) photosensitivity of Photoepolymerizationinitiater initiater contain the resin combination of inorganic powder.
The transfer film that the present invention relates to be characterised in that have use that the above-mentioned resin combination that contains inorganic powder forms contain the inorganic powder resin layer.
In addition, transfer film of the present invention can also be the film of further lamination resist film.
The method of the manufacturing components for display screen that the present invention relates to (below, be called manufacture method of the present invention (I)) be characterised in that the resin layer that contains inorganic powder that comprises above-mentioned formation transfer film is transferred on the substrate, carries out the operation of calcination process at the resin layer that this is contained inorganic powder.
The method of the manufacturing components for display screen that the present invention relates to (below, be called manufacture method of the present invention (II)) be characterised in that and comprise following operation: the resin layer that contains inorganic powder of above-mentioned formation transfer film is transferred on the substrate, on containing the resin layer of inorganic powder, this forms resist film, this resist film is carried out exposure-processed, form the latent image of resist pattern, this resist film is carried out development treatment, the resist pattern is displayed, the resin layer that will contain inorganic powder carries out etching processing, form the resin layer pattern that resist contains inorganic powder accordingly, this pattern is carried out calcination process.In addition, for used transfer film in the manufacture method of the present invention (II), constitute its (B) binder resin that contains the inorganic powder resin layer and adopt the binder resin that contains alkali soluble resin.
The method of the manufacturing components for display screen that the present invention relates to (below, be called manufacture method of the present invention (III)) is characterised in that and comprises following operation: the resin layer that contains inorganic powder of above-mentioned formation transfer film is transferred to operation on the substrate, this resin layer that contains inorganic powder is carried out the operation that exposure-processed forms the pattern latent image.This is contained the inorganic powder resin layer carry out the operation of development treatment formation pattern and the operation of this pattern being carried out calcination process.In addition, for used transfer film in the manufacture method of the present invention (III), it contains the inorganic powder resin layer and adopts the resin layer of being made by the above-mentioned resin combination that contains the photosensitive inorganic powder.
According to the present invention, even also can obtain to form the resin combination that contains inorganic powder of the good and components for display screen that leakless produces of surface smoothing by low temperature short period of time calcination process.
In addition, according to the present invention, even can obtain that long-time preservation also can suppress because gelation and the resin combination that contains inorganic powder of increased viscosity.
The transfer film transfer printing excellent property of the present invention of the resin layer that contains inorganic powder that is formed by above-mentioned resin combination by using this transfer film, can form the good components for display screen of surface smoothing and pattern form.
Description of drawings
Fig. 1 is the sectional view of the general PDP of explicit declaration.
Fig. 2 is the sectional view of the general FED of explicit declaration.
Embodiment
Below, be described in detail to the resin combination that contains inorganic powder that the present invention relates to, transfer film and with the method that this transfer film is made plasma panel.
(resin combination that contains inorganic powder)
The resin combination that contains inorganic powder of the present invention is to contain (A) inorganic powder and (B) paste composition of binder resin.(B) binder resin can be an alkali soluble resin.In addition, the resin combination that contains inorganic powder that the present invention relates to can further contain (C) polyfunctional group (methyl) acrylate and (D) photosensitivity of Photoepolymerizationinitiater initiater contain the resin combination of inorganic powder.
(A) inorganic powder
It is of the present invention that to contain inorganic powder used in the resin combination of inorganic powder different and different according to the kind of formed component parts, but any all are the inorganic powders that contain metal and/or metal oxide.
For example, as used inorganic powder in the composition that is used to form " dielectric layer " and " dividing plate " that constitute PDP, can enumerate glass powder.Its softening temperature of above-mentioned glass powder is preferably in 400～600 ℃ the scope.Drop in the above-mentioned scope by the softening temperature that makes glass powder, when manufacturing makes PDP or FED with parts, can successfully carry out calcination process.As a result, owing to organic substances such as not having binder resin remains in the component parts, thereby can not cause that the gas of release causes phosphor lifetime to shorten to the display screen internal diffusion, and glass substrate can not be distorted yet.
As the glass powder that is suitable for most resin combination of the present invention, can enumerate:
(1) plumbous oxide, boron oxide, the silicon oxide, (PbO-B of calcium oxide system
2O
3-SiO
2-CaO system),
(2) zinc oxide, the boron oxide, (ZnO-B of silicon oxide system
2O
3-SiO
2System),
(3) plumbous oxide, boron oxide, silicon oxide, alumina series (PbO-B
2O
3-SiO
2-Al
2O
3System),
(4) plumbous oxide, zinc oxide, the boron oxide, (PbO-ZnO-B of silicon oxide system
2O
3-SiO
2System),
(5) plumbous oxide, zinc oxide, boron oxide, silicon oxide, titanium oxide base (PbO-ZnO-B
2O
3-SiO
2-TiO
2System),
(6) bismuth oxide, the boron oxide, (Bi of silicon oxide system
2O
3-B
2O
3-SiO
2System),
(7) zinc oxide, the phosphorus oxide, (ZnO-P of silicon oxide system
2O
5-SiO
2System),
(8) zinc oxide, the boron oxide, (ZnO-B of potassium oxide system
2O
3-K
2O system),
(9) phosphorus oxide, boron oxide, alumina series (P
2O
5-B
2O
3-Al
2O
3System),
(10) zinc oxide, phosphorus oxide, titanium oxide base (ZnO-P
2O
5-TiO
2Be) mixture etc.Above-mentioned in addition glass powder can also be with inorganic oxide powder mixing uses such as aluminum oxide, chromic oxide, manganese oxide.
For example also can contain (uniting use) above-mentioned glass powder in the composition of electrode, resistance, fluor, colour filter and black matrix" being used to form other component parts.When uniting the inorganic powder that uses beyond above-mentioned glass powder and this glass powder in resin combination of the present invention, this glass powder uses 90 quality % or following amount usually with respect to the total amount of inorganic powder.
As used inorganic powder in the composition of the electrode among Fig. 1 104, bus electrode 105, address electrode 106 etc., can enumerate the metal-powder that forms by Ag, Au, Al, Ni, Ag-Pd alloy, Cu, Cr etc. as " electrode " that form formation PDP.
As used inorganic powder in the composition that forms " resistance " that constitutes PDP, can enumerate RuO
2Deng inorganic powder.
As used inorganic powder in the composition of " fluor " that form to constitute PDP, can enumerate and have Y
2O
3: Eu
3+, Y
2SiO
5: Eu
3+, Y
3Al
5O
12:, YVO
4: Eu
3+, (Y, Gd) BO
3: Eu
3+, Zn
3(PO
4)
2: the redness fluorescent substance that Mn etc. form; Has Zn
2SiO
4: Mn, BaAl
12O
19: Mn, BaMgAl
14O
23: Mn, LaPO
4: (Ce, Tb), Y
3(Al, Ga)
5O
12: the green fluorescent substance that Tb etc. form; By Y
2SiO
5: Ce, BaMgAl
10O
17: Eu
2+, BaMgAl
14O
23: Eu
2+, (Ca, Sr, Ba)
10(PO
4)
6C
12: Eu
2+, (Zn, Cd) inorganic powder that forms with fluorescent substance etc. of the blueness formed such as S:Ag.
As used inorganic powder in the composition that forms " colour filter " that constitute PDP, can enumerate Fe
2O
3, Pb
3O
4Red with material, Cr
2O
3Deng green material, the 2 (Al of using
2Na
2Si
3O
10) Na
2S
4Deng blue inorganic powder with formation such as materials.
As used inorganic powder in the composition that forms " black matrix" " that constitute PDP, can enumerate the metal-powder that Mn, Fe, Cr etc. form.
(B) binder resin
Binder resin in the present composition is the polymkeric substance with structural unit (I) of above-mentioned general formula (I) expression, specifically, is to be the structure polymer of monomers with the acrylate that contains alpha-hydroxymethyl.
In the above-mentioned general formula (I), R is the organic group of 1 valency, for example represents alkyl such as methyl, ethyl, n-propyl group, n-butyl.
Owing to use polymkeric substance with said structure unit (I), can strengthen the adsorptivity of polymkeric substance to inorganic powder, help the fusion of inorganic powder, thereby can obtain to form the resin combination that contains inorganic powder of the good parts of surface smoothing by low temperature short period of time calcination process.
In addition, as used binder resin in the present composition that is applicable to manufacture method of the present invention (II) and manufacture method (III), use be alkali soluble resin.This binder resin contains the alkali soluble resin of 30～100 weight % ratios.In addition, so-called " alkali-soluble " can be meant and can be dissolved by following alkaline etch bath to have the etching processing of making and finish to the character of the solubleness of targeted degree among the present invention, can make resin show alkali-soluble by containing a certain amount of structural unit (I).
Has the alkali soluble resin of said structure unit (I) by use, the resin combination that contains inorganic powder of can obtain being difficult to reacting, storage stability is good with metal and/or metal oxide.
Preferred (methyl) acrylate that contains alpha-hydroxymethyl that uses is for can enumerate α-(methylol) methyl acrylate, α-(methylol) ethyl propenoate, α-(methylol) vinylformic acid n-propyl diester, α-α-(methylol) alkyl acrylates such as (methylol) vinylformic acid n-butyl ester among the present invention.Wherein preferred especially α-(methylol) methyl acrylate, α-(methylol) ethyl propenoate.
In the used polymkeric substance of the present invention, the content ratio of structural unit (I) is 0.1～100 weight % with respect to whole formations unit.Especially, in the present composition that is applicable to manufacture method of the present invention (I), preferred 0.1～70 weight %, more preferably 0.1～20 weight %.Drop in the above-mentioned scope by the content ratio that makes structural unit (I), can give full play to effect of the present invention.In addition, in the present composition that is applicable to making method of the present invention (II) and manufacture method of the present invention (III), the content ratio of structural unit in the used alkali soluble resin (I) is 20～100 weight % with respect to the entire infrastructure unit, is preferably 25～90 weight %.Drop in the above-mentioned scope by the content ratio that makes structural unit (I), can give full play to storage stability effect of the present invention.
As other structure monomer in the used alkali soluble resin of the present invention, can enumerate the monomer that for example is selected from following monomer (イ)～(Ha).
Monomer (イ):
Following can with the monomer that contains caustic solubility functional group of (methyl) acrylic ester copolymerization that contains alpha-hydroxymethyl: (methyl) acrylic acid hydroxy alkyl esters such as (methyl) hydroxyethyl acrylate, (methyl) vinylformic acid 2-hydroxypropyl ester, (methyl) vinylformic acid 3-hydroxypropyl ester, (methyl) vinylformic acid 2-hydroxyl butyl ester, (methyl) vinylformic acid 3-hydroxyl butyl ester, (methyl) vinylformic acid 4-hydroxyl butyl ester; Neighbour-hydroxy styrenes ,-phenol hydroxyl monomer class such as hydroxy styrenes, right-hydroxy styrenes etc.
Monomer (ロ)
Following can with the monomer of (methyl) acrylic ester copolymerization that closes alpha-hydroxymethyl:
(methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) propyl acrylate, (methyl) isopropyl acrylate, (methyl) butyl acrylate, (methyl) isobutyl acrylate, (methyl) tert-butyl acrylate, (methyl) vinylformic acid penta (ペ Application チ Le) ester, (methyl) vinylformic acid pentyl (ア ミ Le) ester, (methyl) vinylformic acid isopentyl ester, (methyl) Ethyl acrylate, (methyl) vinylformic acid heptyl ester, (methyl) Octyl acrylate, (methyl) isooctyl acrylate ester, (methyl) 2-ethylhexyl acrylate, (methyl) vinylformic acid nonyl ester, (methyl) vinylformic acid decyl ester, (methyl) decyl acrylate, (methyl) vinylformic acid isodecyl ester, (methyl) vinylformic acid undecyl ester, (methyl) dodecylacrylate, (methyl) vinylformic acid Lauryl Ester, (methyl) vinylformic acid stearyl, (methyl) vinylformic acid isooctadecane base ester, Deng (methyl) alkyl acrylate;
(methyl) vinylformic acid benzene oxygen ethyl ester, (methyl) vinylformic acid 2-hydroxyl-(methyl) vinylformic acid benzene oxyalkyl esters such as 3-benzene oxygen propyl diester;
(methyl) alkoxyalkyl acrylates such as (methyl) vinylformic acid 2-ethoxyethyl ester, (methyl) vinylformic acid 2-third oxygen ethyl ester, (methyl) vinylformic acid 2-butoxyethyl acetate, (methyl) vinylformic acid 2-methoxy butyl ester;
Polyethyleneglycol (methyl) acrylate, methoxyl group glycol ether (methyl) acrylate, methoxy poly (ethylene glycol) (methyl) acrylate, phenoxy group polyoxyethylene glycol (methyl) acrylate, Nonylphenoxy polyoxyethylene glycol (methyl) acrylate, polypropylene glycol (methyl) acrylate, methoxyl group polypropylene glycol (methyl) acrylate, oxyethyl group polypropylene glycol (methyl) acrylate, poly-alkane glycol (methyl) acrylate such as Nonylphenoxy polypropylene glycol (methyl) acrylate;
(methyl) vinylformic acid cycloalkyl esters such as (methyl) vinylformic acid cyclohexyl ester, (methyl) vinylformic acid 4-butyl cyclohexyl ester, (methyl) vinylformic acid two pentamethylene base esters, (methyl) vinylformic acid dicyclopentenyl ester, (methyl) vinylformic acid dicyclopentadienyl ester, (methyl) vinylformic acid bornyl ester, the different bornyl ester of (methyl) vinylformic acid, (methyl) vinylformic acid cyclodecane base ester;
Monomer (A) (methyl) esters of acrylic acids in addition such as (methyl) benzyl acrylate, (methyl) vinylformic acid tetrahydrochysene glycosyl ester; Aromatic olefin such as vinylbenzene, alpha-methyl styrene class monomer class; Divinyl, isoprene equiconjugate dienes etc.
Monomer (Ha)
The following macromole classes such as macromole that are positioned on polymer chain one end: polystyrene, poly-(methyl) methyl acrylate, poly-(methyl) ethyl propenoate, poly-(methyl) benzyl acrylate etc. with unsaturated groups such as (methyl) acryls;
Wherein, preferably (methyl) alkyl acrylate, (methyl) acrylic acid hydroxy alkyl ester and (methyl) alkyl acrylate oxyalkyl ester, particularly preferred compound can be enumerated (methyl) butyl acrylate, (methyl) 2-ethylhexyl acrylate, (methyl) vinylformic acid Lauryl Ester, (methyl) vinylformic acid isodecyl ester, (methyl) vinylformic acid 2-ethoxyethyl ester and 2-hydroxy-propyl ester.
The weight-average molecular weight of above-mentioned alkali soluble resin (Mw) is preferably 5000～5000000, is preferably 10000～300000 especially.By Mw is dropped in the above-mentioned scope, can obtain enough film forming performances.Wherein above-mentioned Mw is by the weight-average molecular weight of GPC mensuration through polystyrene conversion.
The content that contains the binder resin of above-mentioned polymkeric substance in the present composition is generally 1～50 weight part with respect to the above-mentioned inorganic powder of 100 weight parts, is preferably 1～40 weight part, preferred especially 5～30 weight parts.Drop in the above-mentioned scope by the content that makes binder resin, can give full play to effect of the present invention.
(C) polyfunctional group (methyl) acrylate
Composition of the present invention can also contain as (C) polyfunctional group (methyl) acrylate of photosensitivity composition and (D) Photoepolymerizationinitiater initiater.Polyfunctional group (methyl) acrylate has by the exposure polymerization, makes exposed portion become the character of the insoluble or alkali insoluble of alkali.
As employed polyfunctional group (methyl) acrylate among the present invention, can enumerate alkane glycol two (methyl) esters of acrylic acids such as ethylene glycol, propylene glycol;
Poly-alkane glycol two such as polyoxyethylene glycol, polypropylene glycol (methyl) esters of acrylic acid;
Two (methyl) esters of acrylic acid of two terminal hydroxyl fluidized polymers such as two terminal hydroxyl polyhutadiene, two terminal hydroxyl polyisoprene, two terminal hydroxyl polycaprolactones;
Glycerine, 1,2, poly-(methyl) acrylate of 3 yuan of 4-trihydroxybutane, trimethylolalkane, tetra methylol alkane, tetramethylolmethane, Dipentaerythritols etc. or above polynary alkanol;
Poly-(methyl) esters of acrylic acid of the poly-alkane glycol affixture of 3 yuan or above polynary alkanol;
1,4-cyclohexanediol, 1, poly-(methyl) esters of acrylic acid of cyclic polyols such as 4-dihydroxy-benzene class;
Oligomerization (methyl) esters of acrylic acids such as polyester (methyl) acrylate, epoxy (methyl) acrylate, urethane (methyl) acrylate, Synolac (methyl) acrylate, silicone resin (methyl) acrylate, spirane resin (methyl) acrylate etc.They can use separately, also can 2 kinds or abovely unite use.Wherein, especially preferably use 3 yuan or poly-(methyl) esters of acrylic acid of above polynary alkanol, two (methyl) esters of acrylic acid of poly-alkane glycol.
The molecular weight of above-mentioned polyfunctional group (methyl) acrylate is preferably 100～2000.
The content of above-mentioned polyfunctional group (methyl) acrylate in the present composition is generally 30～70 weight parts with respect to the above-mentioned inorganic powder of 100 weight parts, is preferably 40～60 weight parts.
(D) Photoepolymerizationinitiater initiater
As Photoepolymerizationinitiater initiater, can enumerate dibenzoyl, benzoin, benzophenone, camphorquinone, 2-hydroxy-2-methyl-1-phenyl third-1-ketone, 1-hydroxycyclohexylphenylketone, 2,2-dimethoxy-2-phenyl methyl phenyl ketone, 2-methyl-[4 '-(methylthio group) phenyl]-2-morpholine-1-acetone, 2-benzyl-2-dimethylamino-1-(4-morpholine and phenyl)-Ding-acyl compounds such as 1-ketone; Azo-compound or triazo-compounds such as azo-group isopropyl cyanide, 4-phenylazide formaldehyde; Mercaptan disulphide organosulfur compounds such as (メ Le カ プ Application ジ ス Le Off イ De); Organo-peroxides such as benzoyl peroxide, two-tert-butyl peroxide, tertbutyl peroxide, cumene hydroperoxide, p-menthane hydroperoxide; 1,3-two (trichloromethyl)-5-(2 '-chlorophenyl)-1,3,5-triazines, 2-[2-(2-furyl) vinyl]-4,6-two (trichloromethyl)-three methyl halide classes such as 1,3,5-triazines; 2,2 '-two (2-chlorophenyls)-4,5,4 ' 5 '-tetraphenyl-1, imidazoles dimers such as 2 '-bisglyoxaline etc.They can use separately, also can two kinds or abovely unite use.
The content of above-mentioned Photoepolymerizationinitiater initiater is generally 0.1～100 weight part with respect to the above-mentioned polyfunctional group of 100 weight parts (methyl) acrylate in the present composition, is preferably 1～50 weight part.
(E) solvent
In order to make it have suitable flowability or plasticity-and good film formation property, make usually and contain solvent in the present composition.As the solvent that uses among the present invention, preferably with the affinity of inorganic powder and to the favorable solubility of binder resin, the solvent that can give the suitable viscosity of the present composition, remove by the easy evaporation of drying simultaneously.
As the solvent that uses among the present invention, so long as have the solvent of above-mentioned characteristic, it is had no particular limits, for example can enumerate ethers, ester class, ether-ether class, ketone, ketone ester class, amides, carboxylic acid amide esters class, lactams, lactone, sulfoxide class, sulfone class, hydro carbons, halogenated hydrocarbon etc.
More particularly, can enumerate tetrahydrofuran (THF), methyl-phenoxide, dioxane, the ethylene glycol monoalkyl ether class, the glycol ether dialkyl ether, the propylene-glycol monoalky lether class, the propylene glycol dialkyl ether, acetates, hydroxacetic acid ester class, the alkoxyl group acetates, propionic acid ester, the hydroxy propionate class, the alkoxyl propionic ester class, lactic acid ester, the ethylene glycol monoalkyl ether acetate class, the propylene-glycol monoalky lether acetate esters, the alkoxyl group acetates, the cyclic ketones class, the acyclic ketone, acetoacetic ester, the pyruvate class, N, N-dialkylformamide class, N, N-dialkyl acetamides class, N-alkyl pyrrolidine ketone, the gamma lactone class, the dialkyl sulphoxide class, the dialkyl sulfone class, the terpin alcohols, N-first-2-Pyrrolidone etc.They can use separately, also can two kinds or abovely unite use.
(F) dispersion agent
In the composition of the present invention, can also also have dispersion agent.In manufacture method particularly of the present invention (I) compositions for use, preferably contain dispersion agent.As this dispersion agent, the preferred silane coupling agent ((alkyl) alkoxyl silicone that contains saturated alkyl) that uses following general formula (II) expression.
(in the formula, p is 3～20 integer, and m is 1～3 integer, and n is 1～3 integer, and a is 1 to 3 integer.)
In the above-mentioned general formula (II), the p of the carbonatoms of expression saturated alkyl is 3～20 integer, is preferably 4～16 integer.
When p less than 3 the time, even comprise (alkyl) alkoxyl silicone that contains saturated alkyl, the resin layer that also can cause gained to contain inorganic powder can not show enough plasticity-.On the other hand, the p value surpasses 20 (alkyl) alkoxyl silicone decomposition temperature height that contains saturated alkyl, contain in the calcining process of resin layer of inorganic powder at gained, can cause also not decomposing the moment of removing fully at organic substance (above-mentioned silane derivative), inorganic powder promptly is melted, therefore have partial organic substances matter residual in the dielectric layer that forms, the result has reduced the transmittance of dielectric layer.
Specific examples as the silane coupling agent of above-mentioned general formula (II) expression, can enumerate saturated alkyl dimethyl methyl TMOS class (a=1 such as n-propyl-dimethyl methoxy silane, n-butyl dimethyl methyl TMOS, n-decyl dimethyl methyl TMOS, n-hexadecyldimethyl benzyl ammonium methoxy silane, n-petrosilane base dimethyl methyl TMOS, m=1, n=1);
Saturated alkyl diethyl methoxy silane class (a=1 such as n-propyl group diethyl methoxy silane, n-butyl diethyl methoxy silane, n-decyl diethyl methoxy silane, n-hexadecyl diethyl methoxy silane, n-petrosilane base diethyl methoxy silane, m=1, n=2);
Saturated alkyl dipropyl methoxy silane classes such as n-butyl dipropyl methoxy silane, n-decyl dipropyl methoxy silane, n-hexadecyl dipropyl methoxy silane, n-petrosilane base dipropyl methoxy silane (a=1, m=1, n=3);
Saturated alkyl dimethylethoxysilane class (a=1 such as n-propyl-dimethyl Ethoxysilane, n-butyl dimethylethoxysilane, n-decyl dimethylethoxysilane, n-hexadecyldimethyl benzyl ammonium Ethoxysilane, n-petrosilane base dimethylethoxysilane, m=2, n=1);
Saturated alkyl diethyl Ethoxysilane class (a=1 such as n-propyl group diethyl Ethoxysilane, n-butyl diethyl Ethoxysilane, n-decyl diethyl Ethoxysilane, n-hexadecyl diethyl Ethoxysilane, n-petrosilane base diethyl Ethoxysilane, m=2, n=2);
Saturated alkyl dipropyl Ethoxysilane classes such as n-butyl dipropyl Ethoxysilane, n-decyl dipropyl Ethoxysilane, n-hexadecyl dipropyl Ethoxysilane, n-petrosilane base dipropyl Ethoxysilane (a=1, m=2, n=3);
Saturated alkyl dimethyl propylene TMOS class (a=1 such as n-propyl-dimethyl propoxy-silane, n-butyl dimethyl propylene TMOS, n-decyl dimethyl propylene TMOS, n-hexadecyldimethyl benzyl ammonium propoxy-silane, n-petrosilane base dimethyl propylene TMOS, m=3, n=1);
Saturated alkyl diethyl propoxy-silicane (a=1 such as n-propyl group diethyl propoxy-silane, n-butyl diethyl propoxy-silane, n-decyl diethyl propoxy-silane, n-hexadecyl diethyl propoxy-silane, n-petrosilane base diethyl propoxy-silane, m=3, n=2);
Saturated alkyl dipropyl propoxy-silicane such as n-butyl dipropyl propoxy-silane, n-decyl dipropyl propoxy-silane, n-hexadecyl dipropyl propoxy-silane, n-petrosilane base dipropyl propoxy-silane (a=1, m=3, n=3);
Saturated alkyl methyl dimethoxysilane class (a=2 such as n-propyl group methyl dimethoxysilane, n-butyl methyl dimethoxy silane, n-decyl methyl dimethoxysilane, n-hexadecyl methyl dimethoxysilane, n-petrosilane ylmethyl dimethoxy silane, m=1, n=1);
Saturated alkyl ethyl dimethoxy silicane (a=2 such as n-propyl group ethyl dimethoxy silane, n-butyl ethyl dimethoxy silane, n-decyl ethyl dimethoxy silane, n-hexadecyl ethyl dimethoxy silane, n-petrosilane base ethyl dimethoxy silane, m=1, n=2);
Saturated alkyl propyl group dimethoxy silicane such as n-butyl propyl group dimethoxy silane, n-decyl propyl group dimethoxy silane, n-hexadecyl propyl group dimethoxy silane, n-petrosilane base propyl group dimethoxy silane (a=2, m=1, n=3);
Saturated alkyl methyldiethoxysilane class (a=2 such as n-propyl group methyldiethoxysilane, n-butyl methyl diethoxy silane, n-decyl methyldiethoxysilane, n-hexadecyl methyldiethoxysilane, n-petrosilane ylmethyl diethoxy silane, m=2, n=1);
Saturated alkyl ethyl diethoxy silane class (a=2 such as n-propyl group ethyl diethoxy silane, n-butyl ethyl diethoxy silane, n-decyl ethyl diethoxy silane, n-hexadecyl ethyl diethoxy silane, n-petrosilane base ethyl diethoxy silane, m=2, n=2);
Saturated alkyl propyl group diethoxy silane classes such as n-butyl propyl group diethoxy silane, n-decyl propyl group diethoxy silane, n-hexadecyl propyl group diethoxy silane, n-petrosilane base propyl group diethoxy silane (a=2, m=2, n=3);
Saturated alkyl methyl dipropoxy silicane (a=2 such as n-propyl group methyl dipropoxy silane, n-butyl methyl dipropoxy silane, n-decyl methyl dipropoxy silane, n-hexadecyl methyl dipropoxy silane, n-petrosilane ylmethyl dipropoxy silane, m=3, n=1);
Saturated alkyl ethyl dipropoxy silicane (a=2 such as n-propyl group ethyl dipropoxy silane, n-butyl ethyl dipropoxy silane, n-decyl ethyl dipropoxy silane, n-hexadecyl ethyl dipropoxy silane, n-petrosilane base ethyl dipropoxy silane, m=3, n=2);
Saturated alkyl propyl group dipropoxy silicane such as n-butyl propyl group dipropoxy silane, n-decyl propyl group dipropoxy silane, n-hexadecyl propyl group dipropoxy silane, n-petrosilane base propyl group dipropoxy silane (a=2, m=3, n=3);
Saturated alkyl Trimethoxy silane classes such as n-propyl trimethoxy silicane, n-butyl trimethoxy silane, n-decyl Trimethoxy silane, n-hexadecyl Trimethoxy silane, n-petrosilane base Trimethoxy silane (a=3, m=1);
Saturated alkyl triethoxysilicane alkanes such as n-propyl-triethoxysilicane, n-butyl triethoxyl silane, n-decyl triethoxyl silane, n-hexadecyl triethoxyl silane, n-petrosilane ethyl triethoxy silicane alkane (a=3, m=2);
Saturated alkyl tripropoxy silicane (a=3 such as n-propyl group tripropoxy silane, n-butyl tripropoxy silane, n-decyl tripropoxy silane, n-hexadecyl tripropoxy silane, n-petrosilane base tripropoxy silane, m=3) etc., they can use separately, perhaps two kinds or abovely unite use.
Wherein, preferred especially n-butyl trimethoxy silane, n-decyl Trimethoxy silane, n-hexadecyl Trimethoxy silane, n-decyl dimethyl methyl TMOS, n-hexadecyldimethyl benzyl ammonium methoxy silane, n-butyl triethoxyl silane, n-decyl triethoxyl silane, n-hexadecyl triethoxyl silane, n-decyl ethyl diethoxy silane, n-hexadecyl ethyl diethoxy silane, n-butyl tripropoxy silane, n-decyl tripropoxy silane, n-hexadecyl tripropoxy silane etc.
The present invention contains the content ratio of the silane coupling agent in the resin combination of inorganic powder, with respect to 100 weight part inorganic powders, is preferably 0.001～10 weight part, more preferably 0.001～5 weight part.When the ratio of silane coupling agent is too small, can not gives full play to the effect that improves the inorganic powder dispersion stabilization and improve the formed plastic effect that contains the inorganic powder resin layer.On the other hand, when this ratio was excessive, viscosity can increase along with the time when resin combination that can cause containing inorganic powder was preserved, and silane coupling agent reacts each other, and the transmittance of the parts after the roasting (particularly dielectric medium) descends.
(G) softening agent
In order to make the formed resin layer that contains inorganic powder show good plasticity-and combustibility, can also contain softening agent in the composition of the present invention.In manufacture method particularly of the present invention (I) compositions for use, preferably contain softening agent.This softening agent preferably uses the softening agent of the compound of following general formula (III) expression.
(in the formula, R
2And R
5Represent that respectively identical or different carbonatoms is 1～30 alkyl, R
3And R
4Represent that respectively identical or different methylene radical or carbonatoms are 2～30 alkylidene group, s is 0～5 numeral, and t is 1～10 numeral).
If have the transfer film that contains the inorganic powder resin layer of plasticizer-containing, even then it is curled, this contains on the surface of inorganic powder resin layer small be full of cracks (crack) can not occur yet, and, the flexibility of this transfer film is also fine, can be easy to it is rolled into cylindric.Particularly because the softening agent of above-mentioned general formula (III) compound formation can decompose by heat at an easy rate and remove, thereby this contains the dielectric transmittance of resin layer gained of inorganic powder can not reduce roasting.
In above-mentioned general formula (III), R
2Or R
5The alkyl and the R of expression
3Or R
4The alkylidene group of expression can straight chain, and also can be side chain, and can be saturated group, also can be unsaturated group.
R
2Or R
5The carbonatoms of alkyl of expression is 1～30, is preferably 2～20, more preferably 4～10.When the carbonatoms of this alkyl surpasses 30, then reduced the solubleness of softening agent in solvent of the present invention, can cause obtaining good flexible.
As the specific examples of the compound of said structure formula (III) expression, can enumerate hexanodioic acid dibutyl ester, hexanodioic acid diisobutyl ester, hexanodioic acid two (2-ethylhexyl) ester, nonane diacid two (2-ethylhexyl) ester, sebacic acid dibutyl ester, dibutyl glycol ether di adipate (ジ Block チ Le ジ グ リ コ one Le ア ジ ペ one ト) etc.Preferred n represents 2～6 compound.
The present invention contains the content ratio of softening agent in the resin combination of inorganic powder, with respect to 100 weight part inorganic powders, is preferably 0.1～20 weight part, more preferably 0.5～10 weight part.When the ratio of softening agent was too small, it was flexible to cause fully improving transfer film, and on the other hand, when this ratio was excessive, the binding property (viscosity) that gained contains the resin layer of inorganic powder became excessive, makes the operability worsens of transfer film.
In the present composition, can also further contain various additives such as bonding agent, anti-halation agent, preserving stabilizer, defoamer, oxidation inhibitor, UV light absorber, weighting agent as any composition.
(transfer film)
Transfer film of the present invention is by containing the inorganic powder resin layer and obtain supporting to form on the film, and this resin layer contains (A) inorganic powder and (B) has the polymkeric substance of structural unit (I).The above-mentioned resin layer (following also abbreviate as " resin layer ") that contains inorganic powder is normally filmed by the resin combination that contains inorganic powder of the present invention being coated on support to form on the film, this is filmed carry out drying and make.
The support film that constitutes transfer film is preferably to have thermotolerance and solvent resistance and has the flexible resin film simultaneously.To support that film has flexible if make, and then can be coated with the composition of pasty state with roll coater, and can be rolled into cylinder and keep and come into operation containing the inorganic powder resin layer.In addition, support the thickness of film as long as at the scope that is fit to use, for example 20～100 μ m.
As forming the resin of supporting film, can enumerate for example fluorine resins such as polyethylene terephthalate, polyester, polyethylene, polypropylene, polystyrene, polyimide, polyvinyl alcohol, polyvinyl chloride, fluorinated ethylene propylene, nylon, Mierocrystalline cellulose etc.
As the present composition being applied to the method for supporting on the film, so long as can form filming of thickness big (for example 10 μ m or more than) and excellent in uniform efficiently, then it is had no particular limits, for example can enumerate the coating process of the method for using roll coater, the coating process that uses scraper-type coating machine, use curtain coater, the coating process that the use mould is coated with machine, the coating process of use cable coating machine etc.
In addition, preferably carry out the demoulding on the support film surface of the present composition and handle being coated with, like this, in the transfer printing process in plasma display is made, just can support the strip operation of film at an easy rate.
Can carry out suitable adjusting to the drying conditions of filming, dry back dissolvent residual ratio (solvent ratio in the resin layer) is dropped in the 2 quality %, for example under 50～150 ℃ drying temperature, dry about 0.5～30 minute.
The thickness of supporting the resin layer that forms on the film as mentioned above according to the content ratio of inorganic powder with size etc. and different, 5～500 μ m for example.
In addition, as the protective film layer that is provided with on the resin layer surface, can enumerate polyethylene film, polyvinyl alcohol film etc.
In addition, transfer film of the present invention can also support to form resist film on the film, and lamination forms the resin layer that contains inorganic powder thereon again.Resist film can be coated with following resist composition by containing the identical coating process of inorganic powder resin layer method therefor with formation, carry out drying again and make.
(manufacture method of components for display screen)
Manufacture method of the present invention can be used for PDP component parts and FED component parts etc., is particularly preferred for the PDP component parts.
1. manufacture method of the present invention (I)
In the manufacture method of the present invention (I), (i) that display screen the application of the invention contains the resin combination of inorganic powder or transfer film of the present invention contains that the inorganic powder resin layer forms operation and (ii) this contains the formation of inorganic powder resin layer calcining process.
(i) contain the formation operation of inorganic powder resin layer
Containing the inorganic powder resin layer can be by being coated on the inorganic powder composition that contains of the present invention on the substrate, perhaps uses transfer film of the present invention that the inorganic powder resin layer that contains of this transfer film is carried out transfer printing and forms.
According to the method for using transfer film, what can form the film thickness excellent in uniform at an easy rate contains the inorganic powder resin layer, reaches the purpose of the uniform film thicknessization of the pattern that makes formation.And, repeat n transfer printing by using above-mentioned transfer film, can also form and have the n layer layered product that (n represent 2 or above integer) contains the inorganic powder resin layer.Perhaps also can have the transfer film that the n layer contains the layered product of inorganic powder resin layer and entirely be transferred on the substrate, form above-mentioned layered product by using supporting to form on the film.
As the method that the present composition is applied on the substrate, can enumerate silk screen print method, rolling method, spin-coating method, flow coat method (Liu Yan Tu cloth method) etc. the whole bag of tricks.Behind these method coating compositions, will film and carry out drying, can form the resin layer that contains inorganic powder.In addition, above-mentioned operation is repeated n time, can also form the layered product of n layer.
One of transfer printing process example of using transfer film of the present invention is as follows.After the protective film of the transfer film of use is peeled off as required; the surface that will contain the inorganic powder resin layer contacts with substrate surface; transfer film is overlapped; after this transfer film carried out hot pressing by warming mill etc.; the resin layer that will contain inorganic powder is from supporting that film strips down, the resin layer that contains inorganic powder like this be transferred and close adhesion on substrate surface.
The transfer printing condition is 60～140 ℃ for for example warming mill surface temperature, and the roll-in of warming mill is that the travelling speed of 0.1～10kg/cm, warming mill is 0.1～10m/ minute.And, can also carry out preheating to substrate, preheating temperature is for example 60～140 ℃.In addition, also can carry out preheating to substrate, can be for example 40～100 ℃ as preheating temperature.
(ii) calcining process
For the organic substance that will contain in the inorganic powder resin layer is burnt, the resin layer that contains inorganic powder that forms is carried out calcination process.The calcination process condition must satisfy and the organic substance roasting that contains in the inorganic powder resin layer can be removed.Usually, maturing temperature is 400～650 ℃, and roasting time is 5～90 minutes.
By comprising the manufacture method of the present invention of above operation, can form components for display screen, especially preferably can form the PDP dielectric layer.
2. manufacture method of the present invention (II)
In the manufacture method of the present invention (II), contain the developing procedure of exposure process, [4] resist film of formation operation, [3] resist film of formation operation, [2] resist film of inorganic powder resin layer, etching procedure that [5] contain the inorganic powder resin layer, [6] by containing the calcining process of inorganic powder resin layer pattern by [1], form components for display screen.
[1] contains the formation operation of inorganic powder resin layer
This operation is similarly carried out with (i) operation in the invention described above manufacture method (I).Wherein, in this operation, can also be formed on the substrate having the layered product transfer printing that contains the inorganic powder resin layer for the different multilayer of etching liquid solvability.By this layered product is carried out etching processing,, can form pattern with rectangle or nearly preferred cross-sectional shape of orthogonal owing on depth direction, etching is produced anisotropy.The lamination number that contains the inorganic powder resin layer be generally 10 or below, be preferably 2～5.
[2] the formation operation of resist film
In this operation, on the formed surface that contains the inorganic powder resin layer, form resist film.As the resist that constitutes this resist film, any one of eurymeric resist or negative resist all can, for its concrete composition, will set forth hereinafter.
Resist film can be by using resist reticulated printing method, rolling method, spin-coating method, flow coat method (Liu Yan Tu cloth method) etc. after the whole bag of tricks coating, will film and carry out drying and form.
The film thickness of resist film is generally 0.1～40 μ m, more preferably 0.5～20 μ m.
In addition, can also be by forming supporting the resist film that form on the film be transferred on the surface that contains the inorganic powder resin layer.According to this formation method, can reach the purpose of improving operation (high efficiency) in resist film formation operation, simultaneously, can also reach the purpose of the uniform film thicknessization that makes formed inorganic powder pattern.
More preferably, can also use lamination above-mentioned resist film with contain the transfer film of inorganic powder resin layer, to contain inorganic powder resin layer and substrate contacts, will contain inorganic powder resin layer and resist layer and carry out transfer printing, and the operation of [1] and [2] is carried out in the lump.
[3] exposure process of resist film
In this operation, to containing the resist film surface that forms on the inorganic powder resin layer, by exposure with mask ray (exposure) such as irradiation ultraviolet radiation optionally, the latent image of formation resist pattern.
Here, there is no particular limitation to beam exposure apparatus, used exposure apparatus etc. in the time of can enumerating the UV irradiation equipment used in the above-mentioned smooth lithography, semi-conductor and liquid crystal indicator and make.
In addition, when forming resist film, preferably under the state that the support film that will not cover on this film is peeled off, expose by transfer printing.
[4] developing procedure of resist film
In this operation, carry out development treatment by resist film with exposure, resist pattern (latent image) is displayed.
Here, the condition of development treatment can suitably select the kind of developing solution to form concentration, development time, development temperature, developing method (for example pickling process, jolting method, spraying process, spray method, paddling process), developing apparatus etc. according to the kind of resist film etc.
By this developing procedure, form residual of resist and resist removal portion and form resist pattern (the exposure pattern of mask correspondence).
This resist pattern plays the etch mask effect in next operation (etching procedure), the constituent material of the residual portion of resist (photocuring resist) must be littler than the constituent material that contains the inorganic powder resin layer for its dissolution rate of etching liquid.
[5] contain the etching procedure of inorganic powder resin layer
In this operation, carry out etching processing to containing the inorganic powder resin layer, what form resist pattern correspondence contains inorganic powder resin layer pattern.
That is, in containing the inorganic powder resin layer, make the resist of resist pattern remove the corresponding part of part and optionally be dissolved in the etching liquid and remove, the part place glass substrate that contains resist removal portion correspondence in the inorganic powder resin layer is come out.Like this, form by what residual of resin layer and resin layer removal portion constituted and contain inorganic powder resin layer pattern.
Here, the condition of etching processing can according to the kind that contains the inorganic powder resin layer etc. suitably the kind of selective etching liquid form concentration, treatment time, treatment temp, treatment process (for example pickling process, jolting method, spraying process, spray method, paddling process), treatment unit etc.,
In addition, as etching liquid, can be by selecting resist film and the kind that contains the inorganic powder resin layer, make its can use with developing procedure in the identical solution of used developing solution, developing procedure and etching procedure can be carried out continuously, thereby can reach the purpose that improves manufacturing efficient by simplifying working process.
Here, the residual quality award from the ministry of resist that constitutes the resist pattern is selected in dissolving lentamente in the etching processing process, is removed fully in the moment that contains the formation of inorganic powder resin layer pattern (when etching processing finishes).
In addition, the residual portion of resist also can left behind partially or entirely after the etching processing, and the residual portion of this resist is removed in calcining process.
[6] contain the calcining process of inorganic powder resin layer pattern
In this operation, carry out calcination process to containing inorganic powder resin layer pattern, form components for display screen (for example dielectric layer, dividing plate, electrode, resistance, fluor, colour filter or black matrix").Like this, the organic substance burning-off in residual of the material inorganic layers such as peel ply, metal level, luminescent coating can be formed, the screen material of the pattern of components for display screen can be obtained forming.
Here, the temperature of calcination process must be able to the temperature with the organic substance burning-off in residual of the resin layer, is generally 400～600 ℃.In addition, roasting time is generally 10～90 minutes.
3. manufacture method of the present invention (III)
In the manufacture method of the present invention (III), contain the formation operation of inorganic powder resin layer, the exposure process that (2) contain the inorganic powder resin layer, the developing procedure that (3) contain the inorganic powder resin layer, the calcining process that (4) contain inorganic powder resin layer image by (1), form components for display screen.
(1) contains the formation operation of inorganic powder resin layer
(i) operation is similarly carried out in this operation and the invention described above manufacture method (I).
(2) exposure process
To containing the inorganic powder resin layer surface, by exposure with mask ray (exposure) such as irradiation ultraviolet radiation optionally, the latent image of formation pattern on resin layer.To when exposure used beam exposure apparatus there is no particular limitation, used exposure apparatus etc. in the time of can enumerating UV irradiation equipment commonly used in the above-mentioned smooth lithography, semi-conductor and liquid crystal indicator and make.
In addition, when containing the inorganic powder resin layer by transfer printing and form, preferably expose will covering under the unstripped state of support film on this resin layer.
(3) developing procedure
The resin layer of exposure is developed, form the resin layer pattern.Developing method (for example pickling process, jolting method, spraying process, spray method, paddling process etc.) and development treatment condition (for example the kind of developing solution is formed concentration, development time, development temperature etc.) etc. can suitably be selected, set according to the kind that contains the inorganic powder resin layer.
(4) calcining process
Organic substance burning-off in residual of the resin layer in back that will develop carries out calcination process to formed resin layer pattern.The calcination process condition must be with the organic substance burning-off that contains in the inorganic powder resin layer (residual portion), and maturing temperature is 400～600 ℃ usually, and roasting time is 10～90 minutes.
By comprising the manufacture method of the present invention of above operation, can form components for display screen (for example PDP component parts such as dividing plate, electrode, resistance, dielectric medium, fluor, colour filter or brown matrix).Especially, manufacture method of the present invention is preferably as the method for making dividing plate.The film thickness of the pattern that makes according to the present invention according to the content ratio of purposes or inorganic powder etc. and different, for example is 1～200 μ m.
Below, material used in above-mentioned each operation, various conditions etc. are described.
(substrate)
Used baseplate material can be enumerated for example insulativity materials such as glass, polysiloxane, polycarbonate, polyester, aromatic amides, polymeric amide-imines, polyimide among the present invention, as required, can also carry out films such as chemical treatment, plasma treatment, ion plating method, sputtering method, gas-phase reaction method, vacuum vapour deposition such as silane coupling agent to substrate surface and form the pre-treatment of handling etc.
In addition, in the present invention, as substrate, the preferred use has stable on heating glass.This glass substrate can be enumerated for example Asahi Glass (strain) system PD200.
(resist film (resist composition))
In manufacture method of the present invention (II), by forming resist film containing on the inorganic powder resin layer on the substrate being transferred to, again this resist film is carried out exposure-processed and development treatment, form the resist film pattern on the inorganic powder resin layer in above-mentioned containing.
As forming the employed resist composition of resist film, can exemplify (1) alkali-developable radiation sensitive linear resist composition, (2) organic solvent developable radiation sensitive linear resist composition, (3) water-based developable radiation sensitive linear resist composition etc.Wherein, consider preferred (1) alkali-developable radiation sensitive linear resist composition that uses from the angle that the developing procedure of resist film and the etching procedure that contains the inorganic powder resin layer can carry out continuously.Below, these resist compositions are described.
(1) alkali-developable radiation sensitive linear resist composition
Alkali-developable radiation sensitive linear resist composition contains alkali soluble resin and the conduct of radiation sensitive linear composition must composition.
As the alkali soluble resin that constitutes alkali-developable radiation sensitive linear resist composition, can enumerate as the illustrated alkali soluble resin of composition binder resin constituent that contains the inorganic powder resin combination.
Constitute the radiation sensitive linear composition of alkali-developable radiation sensitive linear resist composition, as preferred composition, for example can exemplify (イ) polyfunctional monomer and photopolymerization initiator composition, (mouth) melamine resin and form sour photic acid by radiation exposure combination of agents thing etc. takes place, in last (イ) composition, especially preferably above-mentioned (C) polyfunctional group (methyl) acrylate and (D) composition of Photoepolymerizationinitiater initiater.
In addition, in order to give its good film formation property, alkali-developable radiation sensitive linear resist composition contains appropriate organic solvent.As this organic solvent, can enumerate illustrative solvent with the material that formation contains the inorganic powder resin combination.
(2) organic solvent developable sense ray resist composition:
Organic solvent developable radiation sensitive linear resist composition comprises that at least a rubber of thermoprene of being selected from natural rubber, synthetic rubber and their cyclisation and obtaining etc. and triazo-compound are as neccessary composition.
As the triazo-compound specific examples that constitutes organic solvent develop type radiation sensitive linear resist composition, can enumerate 4,4 '-two nitrine benzophenone, 4,4 '-two nitrine ditanes, 4,4 '-two nitrine toluylene, 4,4 '-two nitrine phenyl styryl ketone, 4,4 '-two nitrine benzalacetones, 2,6-two (4 '-nitrine benzylidene) pimelinketone, 2,6-two (4 '-nitrine benzylidene)-4-methylcyclohexanone etc., they can be separately or 2 kinds or above being used in combination.
In addition, in order to give its good film formation property, contain organic solvent usually in the organic solvent developable radiation sensitive linear resist composition.As this organic solvent, can enumerate as the composition formation solvent that solvent exemplified that contains the inorganic powder resin combination.
(3) water-based developable radiation sensitive linear resist composition:
Water-based developable radiation sensitive linear resist composition contains water soluble resin such as polyvinyl alcohol for example and is selected from least a as neccessary composition in diazonium compound and the dichromic acid compound.
As mentioned above because resist film develops used developing solution with contain etching liquid used in the inorganic powder resin layer etching procedure and be preferably with a kind of solution, therefore, as the resist composition, preferred (1) alkali-developable sense ray resist composition.
In the used resist composition of manufacture method of the present invention, can also contain various additives such as development accelerant, bonding agent, anti-halation agent, preserving stabilizer, defoamer, oxidation inhibitor, UV light absorber, weighting agent, fluor, pigment, dyestuff as composition arbitrarily.
(exposure mask)
Resist film or photosensitivity contain the inorganic powder resin layer in exposure process used exposure with the exposing patterns of mask, according to material and difference is generally the wide striped of 10～500 μ m.
(developing solution)
The developing solution that uses in the developing procedure of resist film can be according to the kind of resist film (resist composition) and suitably select.Specifically, the resist film that alkali-developable radiation sensitive linear resist composition forms can use alkaline-based developer, the resist film that organic solvent developable radiation sensitive linear resist composition forms is developing solution with an organic solvent, and the resist film that water-based developable radiation sensitive linear resist composition forms can use aqueous developer solution.In addition, the photosensitivity of manufacture method of the present invention (III) contains the developing solution that uses in the developing procedure of inorganic powder resin layer and can enumerate alkaline-based developer usually.
As the effective constituent of alkaline-based developer, can enumerate for example inorganic alkaline compounds such as lithium hydroxide, sodium hydroxide, potassium hydroxide, sodium hydrogen phosphate, Secondary ammonium phosphate, dipotassium hydrogen phosphate, Sodium phosphate dibasic, primary ammonium phosphate, potassium primary phosphate, SODIUM PHOSPHATE, MONOBASIC, lithium silicate, water glass, potassium silicate, Quilonum Retard, yellow soda ash, salt of wormwood, lithium tetraborate, Sodium Tetraborate, potassium borate, ammonia; Organic basic compounds such as tetramethyl ammonium hydroxide, hydroxide trimethylammonium hydroxyethyl ammonium, monomethylamine, dimethyl amine, Trimethylamine, an ethylamine, diethylamide, triethylamine, an isopropylamine, diisopropylamine, thanomin etc.
Used alkaline-based developer can be by regulating in solution water more than a kind or 2 kinds in the above-mentioned basic cpd etc. in the resist film developing procedure.Here, alkaline-based developer neutral and alkali compound concentrations is generally 0.001～10 weight %, is preferably 0.01～5 weight %.In addition, carry out development treatment with alkaline-based developer after, also wash processing usually.
As the specific examples of organic solvent developing solution, can enumerate organic solvents such as toluene, dimethylbenzene, N-BUTYL ACETATE.They can be separately or 2 kinds or above being used in combination.In addition, after carrying out development treatment, also wash processing as required with poor solvent with the organic solvent developing solution.
As the specific examples of aqueous developer solution, can enumerate water, alcohol etc.
As mentioned above because resist film develops used developing solution with contain etching liquid used in the inorganic powder resin layer etching procedure and be preferably with a kind of solution, therefore, preferably use alkaline-based developer.
(etching liquid)
Manufacture method of the present invention (II) contain the etching liquid that uses in the inorganic powder resin layer etching procedure, be preferably basic solution.Like this, can remove containing alkali soluble resin dissolving contained in the inorganic powder resin layer at an easy rate.
In addition, owing to contain inorganic powder contained in the inorganic powder resin layer and disperseed equably, therefore, also can simultaneously inorganic powder be removed by making alkali soluble resin as binder resin be dissolved in basic solution and cleaning by alkali soluble resin.
Here, as the alkali-soluble solution that etching liquid uses, can enumerate the solution that has same composition with developing solution.
And when etching liquid was the solution identical with used alkaline-based developer in the developing procedure, developing procedure and etching procedure can carry out continuously, therefore can reach and simplify working process, improve the purpose of making efficient.
In addition, carry out etching processing with basic solution after, also wash processing usually.
In addition, as etching liquid, also can use the organic solvent that can dissolve the binder resin that contains the inorganic powder resin layer.This organic solvent can be enumerated as the composition that contains the inorganic powder resin combination and constitute the solvent that solvent exemplified.
In addition, after carrying out etching processing, also wash processing as required with weak solvent with organic solvent.
[embodiment]
Below, by embodiment the present invention is carried out specific description, but the present invention is not limited to this.
Wherein, the following stated " part " expression " weight part ".In addition, weight-average molecular weight (Mw) is measured under the following conditions by gel permeation chromatography (GPC), and the weight-average molecular weight of process polystyrene conversion.
(condition determination)
The HLC-802A that GPC determinator: East ソ one Co., Ltd. makes
The TSKguardcolumn SuperHz-L that GPC post: East ソ one makes
Solvent: THF
Measure temperature: 40 ℃.
In addition, the evaluation of resulting composition storage stability is carried out in accordance with the following methods.At first, use rotational viscosimeter (Tokyo gauge make EMD-R type) under 25 ℃, to measure after the compositions formulated immediately, with this as initial viscosity.Then, said composition is preserved under the condition of 5 ℃ of lucifuges, results of regular determination viscosity simultaneously, adopt when the viscosity ratio initial viscosity increases 50% the fate of process storage stability is estimated.
(synthesis example 1)
550 parts of propylene glycol methyl ether acetates, 45 parts of α-(methylol) methyl acrylates, 135 parts of methacrylic acid n-butyl, 270 parts of methylol vinylformic acid 2-ethyl esters, 3 parts of Diisopropyl azodicarboxylates are put in the autoclave that agitator is housed, under nitrogen environment, stirred in 60 ℃.After the stirring, drop into 2 parts of Diisopropyl azodicarboxylates again,, under 95 ℃, proceed 1 hour polyreaction again, be cooled to room temperature then, get polymers soln 70 ℃ of following polymerizations 4 hours.Resulting polymers solution polymerization rate is 98%, and the Mw of the multipolymer of separating out from this polymers soln is 127000.
(embodiment 1)
(1) contains the preparation of the resin combination of inorganic particle.
With 100 parts as inorganic particle by plumbous oxide, boron oxide, silicon oxide, aluminum oxide, barium oxide (PbO-B
2O
3-SiO
2-Al
2O
3-BaO system) mixture (560 ℃ of softening temperatures) that forms, the 17 parts of butyl methacrylate (BMA) as synthesis example 1 gained of binder resin/methacrylic acid 2-ethylhexyl (EHMA)/α-(methylol) methyl acrylate (RHMA-M) multipolymer (weight ratios 30/60/10, weight-average molecular weight 127000), 1.0 part n-decyl Trimethoxy silane as dispersion agent, 2.5 part nonane diacid two (2-ethylhexyl) ester as softening agent, 14.4 part 3-ethoxyl ethyl propionate as solvent mixes with decollator, making viscosity is the present composition of 2230mPas (20rpm, the TV-30 type viscometer that eastern machine industry is made).
(2) manufacturing of transfer film and evaluation (flexible operability):
With scraper-type coating machine the present composition for preparing in above-mentioned (1) is coated on the polyethylene terephthalate of handling through the demoulding in advance (PET) and supports film (wide 400mm, long 30m, thick 38 μ m) on, filming of formation descended dry 5 minutes except that desolvating at 100 ℃, like this, supporting that forming thickness on the film is the resin layer that contains inorganic particle of 77 μ m.Then, on this contains the resin layer of inorganic particle, stick the PET overlay film of handling through the demoulding in advance (wide 400mm, long 30m, thick 38 μ m), make and have the transfer film of the present invention of formation as shown in Figure 2.
The gained transfer film has flexibility, can carry out the operation of coiled tubular at an easy rate.In addition,, crack (crooked be full of cracks) on the surface that contains the inorganic particle resin layer, also can not occur, thereby this resin layer that contains inorganic particle has good flexible even this transfer film is curled.
In addition, by overlay film is stripped down from transfer film, to contain the inorganic particle resin layer surface and butt up against glass baseplate surface, transfer film (supporting film and the layered product that contains the inorganic particle resin layer) is overlapped with substrate under the situation of not exerting pressure, then, when this transfer film is taken off when coming from glass baseplate surface, this resin layer that contains inorganic particle demonstrates the viscosity of appropriateness to glass substrate, and, can contain under the condition that bond damage does not take place the inorganic particle resin layer at this transfer film is taken off, thereby the transfer film operability is good.
(3) contain the transfer printing of the resin layer of inorganic particle:
After overlay film peeled off from the transfer film that makes according to above-mentioned (2), to contain the inorganic particle resin layer surface and butt up against 21 inches display screens with glass baseplate surface (fixing is the face of the silver electrode (OK/spacing (ラ イ Application/ス ペ one ス)=100 μ m/200 μ m) of 12 μ m by height), this transfer film (supporting film and the layered product that contains the inorganic particle resin layer) is overlapped, this transfer film is carried out hot pressing by warming mill.Here, as the pressing condition, the surface temperature of warming mill is 90 ℃, and roll-in is 2kg/cm
2, the travelling speed of warming mill is 0.8m/ minute.
After the hot pressing processing finishes, will support film to contain the inorganic particle resin layer at glass baseplate surface and peel off and remove, finish the transfer printing that this contains the inorganic particle resin layer from fixing (adding heat bonding).
In this transfer printing process, when peeling off the support film, contain the inorganic particle resin layer and bond damage can not take place, this resin layer that contains inorganic particle has enough strong film toughness.And the inorganic particle resin layer that contains of transfer printing has good binding property to glass baseplate surface.
(4) contain the roasting (dielectric formation) of inorganic particle resin layer:
Will be according to above-mentioned (3) transfer printing contain the inorganic particle resin layer glass substrate place in the stoving oven, speed with 10 ℃ of per minutes rises to 570 ℃ with temperature in the stove, 570 ℃ of following calcination process 10 minutes, on glass baseplate surface, form glass sintering body dielectric layer then.
(Japanese optics industry Co., Ltd. system X6UW-NR) is observed under 50 times multiple the surface of gained dielectric layer, does not occur the crack on silver electrode, and surface smoothing is good with opticmicroscope.
(embodiment 2～5)
Except in embodiment 1, adopt the multipolymer shown in the table 1 as beyond the binder resin respectively, similarly operate preparation glass paste composition with embodiment 1 (1), use each glass paste composition of gained and embodiment 1 (2) similarly to operate and form transfer film.Each transfer film of gained all has flexibility, can easily be rolled into the operation of tubular.And, even this transfer film is curled, containing on the resin layer surface of inorganic particle and also can not produce crack (crooked be full of cracks), this resin layer that contains inorganic particle has good flexible.
Adopt gained transfer film and embodiment 1 (3) similarly to operate and carry out transfer printing, when using any one transfer film, bond damage can not take place in the resin layer that contains inorganic particle when peeling off the support film, and this resin layer that contains inorganic particle has enough strong film toughness.And the inorganic particle resin layer that contains of transfer printing has good binding property to glass baseplate surface.
Then, similarly operate, form dielectric layer, the surface of gained dielectric layer is observed at microscopically similarly to Example 1 with embodiment 1 (4).The result lists in table 1 with embodiment 1.
Table 1
| Embodiment | The multipolymer of binder resin is than (weight ratio) | Fissured generation on the silver electrode | |||||
| ????BMA | ????EHMA | ????HPMA | ?RHMA-M | ?RHMA-E | ?i-DMA | ||
| ??1 | ????30 | ????60 | ????0 | ????10 | ????0 | ????0 | Do not have |
| ??2 | ????30 | ????50 | ????10 | ????10 | ????0 | ????0 | Do not have |
| ??3 | ????30 | ????60 | ????5 | ????5 | ????0 | ????0 | Do not have |
| ??4 | ????30 | ????60 | ????5 | ????0 | ????5 | ????0 | Do not have |
| ??5 | ????0 | ????0 | ????10 | ????30 | ????0 | ????60 | Do not have |
* HPMA: methacrylic acid hydroxyl propyl ester
The RHMA-E:(methylol) vinylformic acid ethyl ester
I-DMA: methacrylic acid isodecyl ester
(comparative example 1)
Except using butyl methacrylate/2-methacrylic acid (ethyl hexyl) ester/methacrylic acid 2-hydroxypropyl ester copolymer (weight ratio 30/60/10, weight-average molecular weight is 150000) replacement butyl methacrylate (BMA)/methacrylic acid 2-ethylhexyl (EHMA)/α-(methylol) methyl acrylate (RHMA-M) multipolymer (weight ratio 30/60/10, weight-average molecular weight 127000), and the umber of binder resin is beyond 17 parts, similarly operate with embodiment, preparation viscosity is the composition of 1200mPas (20rpm ， East Machine Productivity already makes TV-30 type viscometer).Similarly operate with resulting composition and embodiment and to make transfer film and it is estimated, though it is flexible good with operability, but when similarly dielectric surface being observed under 50 multiples with opticmicroscope with embodiment, occur the crack on the silver electrode, surface smoothing is poor.
(synthesis example 2)
With 150 parts of propylene glycol methyl ether acetates, 70 parts of α-(methylol) methyl acrylates, 30 parts of methacrylic acid 2-(ethyl hexyl) esters, 1.5 parts of Diisopropyl azodicarboxylates and 2 part 2,4-phenylbenzene-4-methyl-1-pentene is put in the autoclave that agitator is housed, and is even in stirring at room under nitrogen environment.After the stirring,, under 100 ℃, proceed 1 hour polyreaction again, be cooled to room temperature then, get polymers soln 80 ℃ of following polymerizations 4 hours.Resulting polymers solution polymerization rate is 87%, and the Mw of the multipolymer (hereinafter referred to as " polymkeric substance (A) ") of separating out from this polymers soln is 22000.
(synthesis example 3)
Except in synthesis example 2, changing α-(methylol) methyl acrylate into 50 parts for 70 parts, and with beyond 30 parts of methacrylic acid 2-(ethyl hexyl) esters of 50 parts of methacrylic acid ethoxyethyl group esters replacements, operation similarly to Example 2 obtains the polyreaction rate and is 88%, Mw is 31000 multipolymer (hereinafter referred to as " polymkeric substance (B) ").
(synthesis example 4)
Except in synthesis example 2, putting into the monomer composition of 200 parts of 3-ethoxyl ethyl propionates, 85 parts of methacrylic acid n-butyl esters, 15 parts of methacrylic acids, 1 part of Diisopropyl azodicarboxylate in the autoclave, operation obtains polymers soln similarly to Example 2.Here, the polyreaction rate is 98%, and the weight-average molecular weight (Mw) of the multipolymer of separating out from this polymers soln (hereinafter referred to as " polymkeric substance C ") is 50000.
(embodiment 6)
To be 1.8m as 100 parts of specific surface areas of inorganic powder
2The Ag powder (electroconductive powder) of/g and 10 parts of Bi that median size is 3 μ m
2O
3-B
2O
3-SiO
2Be that the glass glaze is (amorphous, softening temperature is 520 ℃), 30 parts of polymkeric substance as alkali soluble resin (A), 1 part of oleic acid as dispersion agent, 10 parts of (2-ethylhexyl) esters of the nonane diacid two as softening agent and 100 parts of propanedioic acid monomethyl ethers as solvent mix with ball mill (PVC one ズ ミ Le), then with steel sieve (400 orders, 38 μ m net the footpath) filter, make be used to form electrode contain inorganic powder resin combination (hereinafter referred to as " containing inorganic powder resin combination (1) ").
Then, with roller coating machine gained is contained inorganic powder resin combination (1) and be coated in advance support film (the wide 200mm that polyethylene terephthalate (PET) film handled through the demoulding constitutes, long 30m, thick 38 μ m) on, formation is filmed, filming of formation removed solvent fully at 100 ℃ times dry 3 minutes, like this, making supporting to form on the film thickness is that the electrode of 10 μ m forms with containing the inorganic powder resin layer transfer film of (hereinafter referred to as " containing inorganic powder resin layer (1) ") (hereinafter referred to as " transfer film (1) ").
(embodiment 7)
To be 1.8m as 100 parts of specific surface areas of inorganic powder
2The Ag powder (electroconductive powder) of/g and 10 parts of Bi that median size is 3 μ m
2O
3-B
2O
3-SiO
2Be that the glass glaze is (amorphous, softening temperature is 520 ℃), 30 parts of polymkeric substance as alkali soluble resin (B), 1 part of oleic acid as dispersion agent, 10 parts of (2-ethylhexyl) esters of the nonane diacid two as softening agent and 100 parts of propanedioic acid monomethyl ethers as solvent mix with ball mill (PVC one ズ ミ Le), then with steel sieve (400 orders, 38 μ m net the footpath) filter, make be used to form electrode contain inorganic powder resin combination (hereinafter referred to as " containing inorganic powder resin combination (2) ").
Then, except the use gained contains inorganic powder resin combination (2), similarly operate with Production Example 1, the resin combination that contains inorganic powder by coating, and solvent removed fully, making supporting to form on the film thickness is that the electrode of 10 μ m forms with containing the inorganic powder resin layer transfer film of (hereinafter referred to as " containing inorganic powder resin layer (2) ") (hereinafter referred to as " transfer film (2) ").
(Production Example)
By 50 parts of polymkeric substance as alkali soluble resin (C), 40 parts of tetramethylol methane tetraacrylates as polyfunctional monomer (radiation sensitive linear composition), 5 parts of 2-benzyl-2-dimethylamino-1-(4-morpholine and phenyl)-Ding-1-ketone as Photoepolymerizationinitiater initiater (radiation sensitive linear composition), 150 parts of 3-ethoxyl ethyl propionates as solvent are mixed, make pasty state alkali developable radiation sensitive linear resist composition.
Then, with roller coating machine gained gained resist composition is coated in advance on the support film (wide 200mm, long 30m, thick 38 μ m) that polyethylene terephthalate (PET) film that the demoulding is handled constitutes, formation is filmed.Filming of forming removed solvent down at 110 ℃ in dry 5 minutes fully, like this, make and supporting that forming thickness on the film is the transfer film (hereinafter referred to as " transfer film (3) ") of the resist film (hereinafter referred to as " resist film (1) ") of 5 μ m.
(embodiment 8)
According to the operation of following (a)～(c), be manufactured on the transfer film (hereinafter referred to as " transfer film (4) ") of supporting to form on the film layered product that contains inorganic powder resin layer (2 layers) and resist film.
(a) with roller coating machine resist composition used in the above-mentioned Production Example is coated on support film (the wide 200mm that the PET film handled through the demoulding constitutes, long 30m, thick 38 μ m) on, it is following dry 5 minutes at 110 ℃ to film, solvent is removed fully, supported that forming thickness on the film is the resist film (hereinafter referred to as resist film (1 ')) of 5 μ m.
(b) with roller coating machine the inorganic powder resin combination (2) that contains that uses among the embodiment 7 is coated on the resist film (1 '), it is following dry 5 minutes at 110 ℃ to film, solvent is removed fully, resist film (1 ') go up to form thickness be 10 μ m contain inorganic powder resin layer (hereinafter referred to as " containing inorganic powder resin layer (2 ') ").
(c) with roller coating machine the inorganic powder resin combination (1) that contains that uses among the embodiment 6 is coated on and contains on the inorganic powder resin layer (2 '), it is following dry 5 minutes at 110 ℃ to film, solvent is removed fully, contain inorganic powder resin layer (2 ') go up to form thickness be 10 μ m contain inorganic powder resin layer (hereinafter referred to as " containing inorganic powder resin layer (1 ') ").
(embodiment 9)
[the formation operation that contains the inorganic powder resin layer]
Dock with the surface of glass substrate with 6 inches display screen on the surface that contains inorganic powder resin layer (1) that electrode is formed usefulness, and transfer film (1) is overlapped, and adopts warming mill that this transfer film is carried out hot pressing.Here, as the pressing condition, the surface temperature of warming mill is 90 ℃, and roll-in is 4kg/cm
2, the travelling speed of warming mill is 0.5m/ minute.After the hot pressing processing finishes, will support that film strips down from the paste layer (1) that is dispersed with inorganic powder.Like this, contain inorganic powder resin layer (1) be transferred and close adhesion on the surface of glass substrate.This thickness that contains the inorganic powder resin layer is measured, and its thickness drops in the scope of 10 μ m ± 1 μ m.
Then, dock with the surface that contains inorganic powder resin layer (1) on the surface that will contain inorganic powder resin layer (2), and transfer film (2) is overlapped, and uses warming mill that this transfer film (2) is carried out hot pressing with pressing condition same as described above.The hot pressing processing will support film to strip down from containing inorganic powder resin layer (2) after finishing.Like this, will contain (2) transfer printing of inorganic powder resin layer and close adhesion on the surface that contains inorganic powder resin layer (1).Thickness to the layered product that contains inorganic powder resin layer (1)～(2) that forms on the glass substrate is measured, and it drops in the scope of 20 μ m ± 2 μ m.
[the formation operation of resist film]
The surface of resist film (1) is docked with the surface that contains inorganic powder resin layer (2), make transfer film (3) overlap, this transfer film (3) is carried out hot pressing under pressing condition same as described above with warming mill.The hot pressing processing will support film to strip down from resist film (1) after finishing.Like this resist film (1) be transferred and close adhesion containing on the inorganic powder resin layer (2).
Measure being transferred to the thickness that contains the lip-deep resist film of inorganic powder resin layer (2) (1), it drops in 5 μ m ± 1 mu m range.
[exposure process of resist film]
With mask (the wide candy strip of 70 μ m) resist film (1) that forms on the layered product that contains the inorganic powder resin layer is shone i line (wavelength is the ultraviolet ray of 365nm) by exposure with ultrahigh pressure mercury lamp.Here, irradiation dose is 400mJ/cm
2
[developing procedure of resist film]
With the aqueous sodium hydroxide solution (30 ℃) of 0.3 weight % as developing solution by carry out 20 seconds development treatment towards the resist film (1) of pouring method after to exposure-processed.Then wash processing, like this, remove the uncured resist of non-irradiated with ultraviolet radiation, form the resist pattern with ultrapure water.
[etching procedure that contains the inorganic powder resin layer]
Continuous above-mentioned operation, with the aqueous sodium hydroxide solution (30 ℃) of 0.3 weight % as etching liquid by carry out 2 minutes etching processing towards the pouring method.
Then, use the washing processing and the drying treatment of ultrapure water.Like this, form by what residual of material and material removal portion constituted and contain inorganic powder resin layer pattern.
[calcining process that contains the inorganic powder resin layer]
The glass substrate that formation is contained inorganic powder resin layer pattern carries out 30 minutes calcination process in 600 ℃ of environment in stoving oven.Like this, obtain on glass baseplate surface, forming the display screen material of electrode.
With the cross-sectional shape of electrode in the sem observation gained display screen material, measure the bottom width and the height of this cross-sectional shape, bottom width is 50 μ m ± 2 μ m, highly is 10 μ m ± 1 μ m, dimensional precision is high.
(embodiment 10)
[transfer printing process of laminated film]
The surface that will contain inorganic powder resin layer (1 ') be docked at embodiment 9 on the surface of used same glass substrate, make transfer film (4) overlap, this transfer film is carried out hot pressing with warming mill.Here, as the pressing condition, the warming mill surface temperature is 120 ℃, and roll-in is 4kg/cm
2, the travelling speed of warming mill is 0.5m/ minute.The hot pressing processing will support film to strip down from laminated film (surface of resist film (1 ')) after finishing.Like this, laminated film be transferred and close adhesion on glass baseplate surface.Thickness to this laminated film (laminated film that contains inorganic powder resin layer (2 layers) and resist film) is measured, and it drops in the scope of 25 μ m ± 2 μ m.
[the exposure process developing procedure of resist film]
By resist film (1 ') to forming on the layered product that contains the inorganic powder resin layer, carry out exposure-processed (uviolizing), potassium hydroxide aqueous solution development treatment and washing with the condition identical and handle, on the layered product that contains the inorganic powder resin layer, form the resist pattern with embodiment 4.
[etching procedure that contains the inorganic powder resin layer]
Continuous above-mentioned operation with the condition identical with embodiment 9, is carried out the potassium hydroxide aqueous solution etching processing, washing is handled and drying treatment, forms the pattern that contains the inorganic powder resin layer.
[calcining process that contains inorganic powder resin layer pattern]
The glass substrate that formation is contained inorganic powder resin layer pattern carries out 30 minutes calcination process in the environment of 600 ℃ of temperature in stoving oven.Like this, make the display screen material that on glass baseplate surface, forms electrode.
With the cross-sectional shape of electrode in the sem observation gained display screen material, measure the bottom width and the height of this cross-sectional shape, bottom width is 50 μ m ± 2 μ m, highly is 10 μ m ± 1 μ m, dimensional precision is high.
(synthesis example 5)
Except in synthesis example 2, replacing similarly operating with synthesis example 1 30 parts of methacrylic acid 2-(ethyl hexyl) esters, make Mw and be 20000 multipolymer (hereinafter referred to as " polymkeric substance (D) ") with 30 parts of methacrylic acid ethoxy ethyl esters.
(synthesis example 6)
Except in synthesis example 2, replacing 70 parts of α-(methylol) methyl acrylates and the 30 parts of methacrylic acid 2-(ethyl hexyl) esters with 40 parts of methyl-2-ethylhexyl methacrylic ester, 20 parts of methacrylic acids, 30 parts of methacrylic acid n-butyl esters, 10 parts of methacrylic acid 2-hydroxy-propyl esters, similarly operate with synthesis example 1, make Mw and be 100000 multipolymer (hereinafter referred to as " polymkeric substance E ").
(embodiment 11)
(1) contain the preparation of inorganic powder resin combination:
With 100 parts of median sizes as (A) inorganic powder is the PbO-SiO of 1.7 μ m
2Be that the low melting glass glaze is (amorphous, softening temperature is 570 ℃), 14 parts (B) is as the polymkeric substance (A) of gained in the synthesis example 2 of alkali soluble resin (binder resin), the Viscoat 295 of 8 parts of conducts (C) polyfunctional groups (methyl) acrylic compound and 8 parts of polyethyleneglycol diacrylates, 2-benzyl-2-dimethylamino-1-(4-morpholine and the phenyl)-Ding-1-ketone of 4 parts of conducts (D) Photoepolymerizationinitiater initiater, the positive decyl Trimethoxy silane of the propylene glycol methyl ether acetate of 20 parts of conducts (E) solvent and 1 part of conduct (F) dispersion agent mixes with ball mill (PVC one ズ ミ Le), then with steel sieve (500 orders, 25 μ m net the footpath) filter, make the resin combination that contains inorganic powder.
Resulting composition is carried out the evaluation of storage stability, and its storage stability reached more than 90 days.
(2) manufacturing of transfer film
With scraper-type coating machine gained is contained the inorganic powder resin combination and be coated in advance support film (the wide 200mm that the PET film handled through the demoulding constitutes, long 300m, thick 38 μ m) on, to film and at 100 ℃ times dry 5 minutes solvent be removed fully, forming mean thickness is the photo-sensitive resin that 46 μ m contain inorganic powder.Then, on above-mentioned resin layer, the protective membrane that the PET film that hot pressing one deck is handled through the demoulding in advance constitutes has made successively lamination and has supported film, contained the photo-sensitive resin of inorganic powder, the transfer film of protective film.
(3) formation of parts
(i) contain the transfer printing process of inorganic powder resin layer:
With the protective membrane of gained transfer film peel off remove after, resin layer surface is butted up against 6 inches display screens with the dielectric layer that forms on the glass baseplate surface (20 μ m), make transfer film overlap, this transfer film is carried out hot pressing with warming mill.At this moment, the pressing condition is: the warming mill surface temperature is 90 ℃, and roll-in is 2kg/cm
2, the travelling speed of warming mill is 0.5m/ minute.Like this, the photo-sensitive resin that contains inorganic powder be transferred and close adhesion on glass baseplate surface.
The (ii) exposure process of photo-sensitive resin and developing procedure:
With ultrahigh pressure mercury lamp by exposure with mask (the wide candy strip of 400 μ m) to as above formed photo-sensitive resin irradiation 400mJ/cm
2I line (wavelength is the ultraviolet ray of 365nm).
After exposure process finishes, after will supporting film to peel off from the resin layer to remove, with the aqueous sodium hydroxide solution (30 ℃) of 0.1 specification as developing solution by the resin layer of exposure-processed being carried out 1 minute development treatment towards the pouring method.Then, wash processing with ultrapure water, like this, remove the uncured resin layer of non-irradiated with ultraviolet radiation, formation contains inorganic powder resin layer pattern.
The (iii) calcining process of resin layer pattern:
The glass substrate that has formed the resin layer pattern on the dielectric layer carried out 50 minutes calcination process in the environment of 590 ℃ of temperature in stoving oven.With the cross-sectional shape of sem observation gained display screen material median septum, measure the bottom width and the height of this cross-sectional shape, bottom width is 400 μ m, highly is 20 μ m, obtains the good roasting pattern of shape.Like this, make the display screen material that on dielectric medium, forms dividing plate.
(embodiment 12 and 13, comparative example 2)
Except alkali soluble resin being changed into the resin shown in the table 2, operation similarly to Example 11, preparation contains the resin combination of inorganic powder.Its storage stability is estimated.Then, make transfer film, make the display screen material, transfer printing performance and pattern form are estimated with this transfer film with said composition.The results are shown in table 2.
Table 2
| Embodiment 11 | Embodiment 12 | Embodiment 13 | Comparative example 2 | |
| Polymkeric substance (part) | ????(A) ????14 | ????(D) ????14 | ????(B) ????14 | ????(E) ????14 |
| Storage stability | ＞90 days | ＞90 days | ＞90 days | 7 days |
| The transfer printing performance | Well | Well | Well | Well |
| Pattern form | Well | Well | Well | Well |
Polymkeric substance (A): α-(methylol) methyl acrylate/methacrylic acid 2-(ethyl hexyl) ester=70/30
Polymkeric substance (D): α-(methylol) methyl acrylate/methacrylic acid ethoxy ethyl ester=70/30
Polymkeric substance (B): α-(methylol) methyl acrylate/methacrylic acid ethoxy ethyl ester=50/50
Polymkeric substance (E): methyl-2-ethylhexyl (methyl) acrylate/methacrylic acid/methacrylic acid n-butyl ester/methacrylic acid 2-hydroxy propyl ester
(embodiment 14)
(1) contain the preparation of inorganic powder resin combination:
With 100 parts of median sizes as (A) inorganic powder is the PbO-SiO of 1.1 μ m
2Be that the low melting glass glaze is (amorphous, softening temperature is 560 ℃), 14 parts (B) is as the polymkeric substance (A) of gained in the synthesis example 2 of alkali soluble resin (binder resin), the Viscoat 295 of 8 parts of conducts (C) polyfunctional groups (methyl) acrylic compound and 8 parts of polyethyleneglycol diacrylates, 2-benzyl-2-dimethylamino-1-(4-morpholine and the phenyl)-Ding-1-ketone of 4 parts of conducts (D) Photoepolymerizationinitiater initiater, the positive decyl Trimethoxy silane of the propylene glycol methyl ether acetate of 20 parts of conducts (E) solvent and 1 part of conduct (F) dispersion agent mixes with ball mill (PVC one ズ ミ Le), then with steel sieve (500 orders, 25 μ m net the footpath) filter, make the resin combination that contains inorganic powder.
(2) manufacturing of transfer film
With scraper-type coating machine gained is contained the inorganic powder resin combination and be coated in advance support film (the wide 200mm that the PET film handled through the demoulding constitutes, long 300m, thick 38 μ m) on, to film and at 100 ℃ times dry 10 minutes solvent be removed fully, forming mean thickness is the photo-sensitive resin that 200 μ m contain inorganic powder.Then, on above-mentioned resin layer, the protective membrane that the PET film that hot pressing one deck is handled through the demoulding in advance constitutes has made successively lamination and has supported film, contained the photo-sensitive resin of inorganic powder, the transfer film of protective film.
(3) formation of parts
(i) contain the transfer printing process of inorganic powder resin layer:
With the protective membrane of gained transfer film peel off remove after, resin layer surface is butted up against 6 inches display screens with on the glass substrate, make transfer film overlap, this transfer film is carried out hot pressing with warming mill.At this moment, the pressing condition is: the warming mill surface temperature is 90 ℃, and roll-in is 2kg/cm
2, the travelling speed of warming mill is 0.5m/ minute.Like this, the photo-sensitive resin that contains inorganic powder be transferred and close adhesion on glass baseplate surface.
The (ii) exposure process of photo-sensitive resin and developing procedure:
With ultrahigh pressure mercury lamp by exposure with mask (the wide candy strip of 40 μ m) to as above formed photo-sensitive resin irradiation 400mJ/cm
2I line (wavelength is the ultraviolet ray of 365nm).
After exposure process finishes, after will supporting film to peel off from the resin layer to remove, with the aqueous sodium hydroxide solution (30 ℃) of 0.1 specification as developing solution by the resin layer of exposure-processed being carried out 3 minutes development treatment towards the pouring method.Then, wash processing with ultrapure water, like this, remove the uncured resin layer of non-irradiated with ultraviolet radiation, formation contains inorganic powder resin layer pattern.
The (iii) calcining process of resin layer pattern:
The glass substrate that has formed the resin layer pattern carried out 15 minutes calcination process in the atmosphere gas of 560 ℃ of temperature in stoving oven.With the cross-sectional shape of sem observation gained display screen material median septum, measure the bottom width and the height of this cross-sectional shape, bottom width is 40 μ m ± 2 μ m, highly be 120 μ m ± 3 μ m, dimensional precision is high, and, do not observe residue or pattern and come off, be out of shape.Like this, make the display screen material that on glass substrate, forms dividing plate.
Claims (17)
1. resin combination that contains inorganic powder, it is characterized in that comprising (A) inorganic powder and
(B) contain the binder resin of polymkeric substance, described polymkeric substance has the structural unit of following general formula (I) expression,
In the formula, R is the organic group of 1 valency.
2. the described resin combination that contains inorganic powder of claim 1, the structural unit that it is characterized in that above-mentioned formula (I) the expression structural unit that the acrylate that contains alpha-hydroxymethyl derives of serving as reasons.
3. the described resin combination that contains inorganic powder of claim 2 is characterized in that the above-mentioned acrylate of alpha-hydroxymethyl that contains is for being selected from least a of α-(methylol) methyl acrylate, α-(methylol) ethyl propenoate and α-(methylol) vinylformic acid n-butyl ester.
4. the described resin combination that contains inorganic powder of claim 1 is characterized in that (B) binder resin is an alkali soluble resin.
5. the described resin combination that contains inorganic powder of claim 4 is characterized in that alkali soluble resin is at least a (methyl) acrylate selected and the multipolymer that contains the acrylate of alpha-hydroxymethyl from the group that (methyl) methyl acrylate, (methyl) ethyl propenoate, (methyl) butyl acrylate, methacrylic acid 2-(ethyl hexyl) ester, (methyl) vinylformic acid benzyl ester, (methyl) vinylformic acid glyceryl ester, (methyl) vinylformic acid ethoxyethyl group ester and (methyl) vinylformic acid cyclopentyl ester constitute.
6. the described resin combination that contains inorganic powder of claim 4 is characterized in that further containing (C) polyfunctional group (methyl) acrylate and (D) Photoepolymerizationinitiater initiater.
7. the described resin combination that contains inorganic powder of claim 1 is characterized in that inorganic powder has 400～600 ℃ softening temperature.
8. a transfer film is characterized in that having with the described resin layer that contains inorganic powder that contains the formation of inorganic powder resin combination of claim 1.
9. the described transfer film of claim 8 is characterized in that having with the described resin layer that contains inorganic powder that contains the formation of inorganic powder resin combination of claim 6.
10. the described transfer film of claim 8, the resist film that it is characterized in that further lamination.
11. the manufacture method of a components for display screen is characterized in that comprising that the inorganic powder resin layer that contains with constituting the described transfer film of claim 8 is transferred on the substrate, and this is contained the operation that the inorganic powder resin layer carries out calcination process.
12. the manufacture method of a components for display screen, it is characterized in that comprising that the inorganic powder resin layer that contains with constituting the described transfer film of claim 8 is transferred on the substrate, contain on the inorganic powder resin layer at this and to form resist film, this resist film is carried out exposure-processed, form the latent image of resist pattern, this resist film is carried out development treatment displays the resist pattern, to contain the inorganic powder resin layer and carry out etching processing, form the pairing inorganic powder resin layer pattern that contains of resist pattern, this pattern is carried out the operation of calcination process.
13. the manufacture method of claim 11 or 12 described components for display screen is characterized in that above-mentioned components for display screen is a plasma display panel member.
14. the manufacture method of the described plasma display panel member of claim 13 is characterized in that above-mentioned plasma display panel member is at least a parts that are selected from dividing plate, electrode, resistance, dielectric medium, fluor, colour filter and black matrix".
15. the manufacture method of a components for display screen is characterized in that comprising:
With constitute the described transfer film of claim 9 contain the inorganic powder resin layer be transferred to operation on the substrate,
To this contain the inorganic powder resin layer carry out exposure-processed with the operation that forms the pattern latent image,
To this contain the inorganic powder resin layer carry out development treatment with the operation that forms pattern and
This pattern is carried out the operation of calcination process.
16. the manufacture method of the described components for display screen of claim 15 is characterized in that above-mentioned components for display screen is a plasma display panel member.
17. the manufacture method of the described plasma display panel member of claim 16 is characterized in that above-mentioned plasma display panel member is at least a parts that are selected from dividing plate, electrode, resistance, dielectric medium, fluor, colour filter and black matrix".
Applications Claiming Priority (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP037168/2004 | 2004-02-13 | ||
| JP2004037168A JP2005227607A (en) | 2004-02-13 | 2004-02-13 | Inorganic powder-containing resin composition, transfer film and method for producing member for display panel |
| JP2004044555A JP2005232357A (en) | 2004-02-20 | 2004-02-20 | Resin composition containing inorganic particle, transfer film and method for producing dielectric layer for plasma display panel |
| JP044555/2004 | 2004-02-20 | ||
| JP224641/2004 | 2004-07-30 | ||
| JP2004224641A JP2006045270A (en) | 2004-07-30 | 2004-07-30 | Resin composition containing inorganic powder, transfer film and manufacturing method of plasma display panel |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1654534A true CN1654534A (en) | 2005-08-17 |
Family
ID=34916079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2005100077220A Pending CN1654534A (en) | 2004-02-13 | 2005-02-08 | Method for manufacturing inorganic powder contained resin composition, transfer film and components for display screen |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20060041842A (en) |
| CN (1) | CN1654534A (en) |
| TW (1) | TW200531998A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101435996B (en) * | 2008-12-09 | 2011-12-21 | 彩虹集团公司 | Sensitizing type medium powder coating and method for preparing cathode insulation layer by the same |
| CN101059656B (en) * | 2006-04-21 | 2012-05-16 | Jsr株式会社 | Photo-sensitive resin composition containing inorganic particle, photo-sensitive film, and process of forming inorganic pattern |
| CN104614939A (en) * | 2015-01-09 | 2015-05-13 | 苏州瑞红电子化学品有限公司 | Negative photoresist composition for being mixed with glass powder in GPP process |
| CN107870506A (en) * | 2016-09-26 | 2018-04-03 | 康达智株式会社 | Pattern forms piece, pattern manufacture device, method of manufacturing pattern and pattern fabrication schedule |
| CN108135819A (en) * | 2015-10-30 | 2018-06-08 | 株式会社资生堂 | Decoration powder composition |
| CN114730127A (en) * | 2019-11-18 | 2022-07-08 | 东丽株式会社 | Photosensitive resin composition, photosensitive resin sheet, hollow structure, cured product, method for producing hollow structure, electronic component, and elastic wave filter |
-
2005
- 2005-02-03 TW TW094103310A patent/TW200531998A/en unknown
- 2005-02-07 KR KR1020050011390A patent/KR20060041842A/en not_active Application Discontinuation
- 2005-02-08 CN CNA2005100077220A patent/CN1654534A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101059656B (en) * | 2006-04-21 | 2012-05-16 | Jsr株式会社 | Photo-sensitive resin composition containing inorganic particle, photo-sensitive film, and process of forming inorganic pattern |
| CN101435996B (en) * | 2008-12-09 | 2011-12-21 | 彩虹集团公司 | Sensitizing type medium powder coating and method for preparing cathode insulation layer by the same |
| CN104614939A (en) * | 2015-01-09 | 2015-05-13 | 苏州瑞红电子化学品有限公司 | Negative photoresist composition for being mixed with glass powder in GPP process |
| CN108135819A (en) * | 2015-10-30 | 2018-06-08 | 株式会社资生堂 | Decoration powder composition |
| CN108135819B (en) * | 2015-10-30 | 2021-09-07 | 株式会社资生堂 | Decorative powder composition |
| CN107870506A (en) * | 2016-09-26 | 2018-04-03 | 康达智株式会社 | Pattern forms piece, pattern manufacture device, method of manufacturing pattern and pattern fabrication schedule |
| CN114730127A (en) * | 2019-11-18 | 2022-07-08 | 东丽株式会社 | Photosensitive resin composition, photosensitive resin sheet, hollow structure, cured product, method for producing hollow structure, electronic component, and elastic wave filter |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200531998A (en) | 2005-10-01 |
| KR20060041842A (en) | 2006-05-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN1130749C (en) | Plasma display and method of mfg. the same | |
| CN1138181C (en) | Photosensitive composition and use thereof | |
| CN1271664C (en) | Plasma displaying device and its mfg. method | |
| CN1123040C (en) | Method and device for mfg. plasma display | |
| CN1230857C (en) | Plasma display panel and method for production thereof | |
| CN1129946C (en) | Phosphor material, phosphor material powder, plasma display panel, and processes for producing these | |
| CN1223576C (en) | Compound with (methyl) acrylyl radical and its preparation process | |
| CN1690735A (en) | Dyed layer forming radiation linear combination, colour filter and liquid crystal display screen | |
| CN1654534A (en) | Method for manufacturing inorganic powder contained resin composition, transfer film and components for display screen | |
| CN1683943A (en) | Radioactive ray sensitive composition for forming coloring layer, color filter and color liquid crystal display plate | |
| CN1585806A (en) | Oil-based ink composition for ink-jet recording | |
| CN1525516A (en) | Plasma display panel manufacturing method for manufacturing a plasma display panel with superior picture quality, a manufacturing apparatus, and a phosphor ink | |
| CN1677138A (en) | Radiation-ray sensitive composition for colour-filtering piece, colour filtering piece and colour liquid crystal display device | |
| CN1555590A (en) | Modified polyvinyl acetal resin | |
| CN1462305A (en) | Fluorescent powder, process for producing the same, display panel and flat display | |
| CN101052658A (en) | Method for producing polymer composition and polymer composition | |
| CN1192068C (en) | Coating composition | |
| CN101059656A (en) | Photo-sensitive resin composition containing inorganic particle, photo-sensitive film, and process of forming inorganic pattern | |
| CN1918005A (en) | Newton ring preventing sheet and touch panel using it | |
| CN1119701C (en) | Photosensitive paste, plasma display and process for production thereof | |
| CN1969232A (en) | Inorganic powder-containing resin composition, transfer film and method for producing member for plasma display panel | |
| CN1609709A (en) | Black photosensitive resin composition | |
| CN1145926A (en) | Energy ray hardened resin composition and its preparing method | |
| CN1733845A (en) | Method for manufacturing inorganic powder contained resin composition, transfer printing film and plasma display panel | |
| CN1927943A (en) | Glass powder-containing resin composition, transfer film, and process for producing plasma display panel using the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |