CN1652335A - Stacking packaging structure for light sensitive chips and semiconductor chips - Google Patents
Stacking packaging structure for light sensitive chips and semiconductor chips Download PDFInfo
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- CN1652335A CN1652335A CN 200410003596 CN200410003596A CN1652335A CN 1652335 A CN1652335 A CN 1652335A CN 200410003596 CN200410003596 CN 200410003596 CN 200410003596 A CN200410003596 A CN 200410003596A CN 1652335 A CN1652335 A CN 1652335A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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Abstract
Stacked packaging structure of light-sensing chip and semiconductor chip includes a wire set, a semiconductor chip, a light-sensing chip, several wires, a sealing glue body and a transparent plate. There are several first solder pads distributed on periphery in acting surface of the semiconductor chip. The wire set includes pins and a chip support seat. Keeping away from solder pads, a joint face of the chip support seat is stuck to central part of the semiconductor chip. Several second solder pads are distributed on periphery in acting surface of light-sensing chip. Not acting surface of the light-sensing chip is stuck to another joint face of the chip support seat. Wires are in use for connecting all solder pads and pins. The sealing glue body covers chip support seat, semiconductor chip, part of light-sensing chip etc. A hollow in the sealing glue body is for exposing part of central sensing region on acting surface of the sensing chip. The transparent plate seals the hollow.
Description
Technical field
The relevant a kind of encapsulating structure (package) of the present invention, and particularly relevant a kind of have optical sensing chip (optical sensor chip) and semiconductor chip (semiconductor chip) stack package structure.
Background technology
The integrated circuit encapsulation technology can become single encapsulating structure with one or more semiconductor die package, makes semiconductor chip be enveloped by an opaque adhesive body.Therefore, can't see inner semiconductor chip from the encapsulating structure outside.Yet for an optical sensing chip, it must receive extraneous light.Therefore, the packaged type of optical sensing chip will be different with the packaged type of general semiconductor chip.If will become an optical sensing chip and semiconductor chip to pile up encapsulating structure optical sensing chip and semiconductor die package, also must there be suitable package design to reach.
Please refer to Figure 1A, it illustrates is the profile that the optical sensing chip that disclosed for the 5th, 523, No. 608 of United States Patent (USP) case and semiconductor chip pile up encapsulating structure.In Figure 1A, optical sensing chip and semiconductor chip pile up encapsulating structure 10 and comprise a lead frame (leadframe) 11, semiconductor chip 12, an optical sensing chip 13, adhesive body 16, transparent panel 17 and several wires, as lead 14b, 14c, 15b and 15c.Semiconductor chip 12 has one first relative acting surface 12d and one first non-acting surface, and the first acting surface 12d has several first weld pads, as first weld pad 12b and the 12c.Lead frame 11 comprises a chip supporting seat 11a and several pins, as pin 11b and 11c.Pin 11b and 11c respectively have one first relative lead connecting surface 11f and one second lead connecting surface 11g, and chip supporting seat 11a has one first relative commissure 11d and one second commissure 11e.The first commissure 11d of chip supporting seat 11a is the first non-acting surface that is attached to semiconductor chip 12.Optical sensing chip 13 has one second relative acting surface and one second non-acting surface, and shown in Figure 1B, second acting surface of optical sensing chip 13 has a central optical sensing area part 13a and a peripheral part 13d.Peripheral part 13d has several second weld pads, and as second weld pad 13b and the 13c, second non-acting surface of optical sensing chip 13 and the second commissure 11e of chip supporting seat 11a stick together mutually.Lead 14b is in order to electrically connect the first lead connecting surface 11f of the first weld pad 12b and pin 11b, and lead 15b is in order to electrically connect the two lead connecting surface 11g of the second weld pad 13b and pin 11b.Lead 14c is in order to electrically connect the first lead connecting surface 11f of the first weld pad 12c and pin 11c, lead 15c makes semiconductor chip 12 and optical sensing chip 13 all electrically connect with pin 11b and 11c in order to electrically connect the second lead connecting surface 11g of the second weld pad 13c and pin 11c.Adhesive body 16 is first lead connecting surface 11f of the first commissure 11d, semiconductor chip 12, the first weld pad 12b and 12c, lead 14b and 14c and pin 11b and the 11c of coating chip supporting seat 11a.The end face of adhesive body 16 has a depression 16a, and depression 16a is the second lead connecting surface 11g that exposes central optical sensing area part 13a, the second weld pad 13b and 13c, lead 15b and 15c and pin 11b and 11c.Transparent panel 17 is to be disposed on the end face of adhesive body 16, and with the end face copline of adhesive body 16, transparent panel 17 is in order to seal depression 16a.
It should be noted that, because the first acting surface 12d with the first weld pad 12b and 12c of semiconductor chip 12 does not stick together mutually with the first commissure 11d of chip supporting seat 11a, cause adhesive body 16 necessary coated wire 14b and 14c therefore, encapsulation volume, thickness and weight that optical sensing chip and semiconductor chip pile up encapsulating structure 10 will become big.In addition, will produce heat during 12 runnings of optical sensing chip 13 and semiconductor chip, because semiconductor chip 12 coated by adhesive body 16, making that optical sensing chip and semiconductor chip pile up the radiating effect of encapsulating structure 10 will variation.
Summary of the invention
In view of this, purpose of the present invention is providing a kind of optical sensing chip (optical sensor die) and semiconductor chip (semiconductor die) stack package structure exactly.The second non-acting surface of first acting surface of its semiconductor chip and optical sensing chip respectively with the design of first commissure and the second commissure gluing of chip supporting seat, can dwindle encapsulation volume, thickness and weight that optical sensing chip and semiconductor chip pile up encapsulating structure, and promote the radiating effect that optical sensing chip and semiconductor chip pile up encapsulating structure.
According to purpose of the present invention, propose a kind of optical sensing chip and semiconductor chip and pile up encapsulating structure, comprise a lead frame, semiconductor chip, an optical sensing chip, several wires, an adhesive body and a transparent panel.Semiconductor chip has one first relative acting surface and one first non-acting surface, and first acting surface has one first middle body and one first peripheral part, and first peripheral part has several first weld pads.Lead frame comprises several pins and a chip supporting seat, the chip supporting seat has one first relative commissure and one second commissure, first commissure is to be attached to first middle body in the mode of avoiding described first weld pad, makes these a little first weld pads be positioned at outside the side of chip supporting seat.Optical sensing chip has one second relative acting surface and one second non-acting surface, and second acting surface has central optical sensing area part and one second peripheral part.Second peripheral part has several second weld pads, and the second non-acting surface and second commissure stick together mutually.The lead of part is in order to electrically connecting first weld pad and pin, and the lead of another part makes semiconductor chip and optical sensing chip electrically connect with pin respectively in order to electrically connect second weld pad and pin.Adhesive body is the lead of coating chip supporting seat, first acting surface, the second non-acting surface, part at least and the pin of part.The end face of adhesive body has a depression, and depression is to expose central optical sensing area part at least.Transparent panel is to be disposed on the end face of adhesive body, and seals depression.
The present invention also proposes a kind of optical sensing chip and semiconductor chip piles up encapsulating structure, comprises a lead frame, semiconductor chip, an optical sensing chip, several wires, an adhesive body and a transparent panel.Semiconductor chip has one first relative acting surface and one first non-acting surface, and first acting surface has one first middle body and one first peripheral part, and first peripheral part has several first weld pads.Lead frame comprises several pins and a chip supporting seat, and the chip supporting seat has one first relative commissure and one second commissure.First commissure is to be attached to first middle body in the mode of avoiding described first weld pad, and the weld pad of winning is positioned at outside the side of chip supporting seat, and described pin comprises several relative lead connecting surfaces and several non-lead connecting surfaces.Optical sensing chip has one second relative acting surface and one second non-acting surface, and second acting surface has central optical sensing area part and one second peripheral part.Second peripheral part has several second weld pads, and the second non-acting surface and second commissure stick together mutually.The lead of part is in order to electrically connecting first weld pad and lead connecting surface, and the lead of another part makes a little therewith respectively pins of semiconductor chip and optical sensing chip electrically connect in order to electrically connect second weld pad and lead connecting surface.Adhesive body is these a little leads of coating chip supporting seat, first acting surface, the second non-acting surface, part at least and these a little pins of part, and the first non-action face and this a little non-lead connecting surfaces are to be exposed to outside the adhesive body.The end face of adhesive body has a depression, and depression is to expose central optical sensing area part at least.Transparent panel is to be disposed on the end face of adhesive body, and seals depression.
The present invention proposes a kind of optical sensing chip again and semiconductor chip piles up encapsulating structure, comprises a lead frame, semiconductor chip, an optical sensing chip, several wires, an adhesive body and a transparency cover.Semiconductor chip has one first relative acting surface and one first non-acting surface, and first acting surface has one first middle body and one first peripheral part, and first peripheral part has several first weld pads.Lead frame comprises several pins and a chip supporting seat, and the chip supporting seat has one first relative commissure and one second commissure.First commissure is to be attached to first middle body in the mode of avoiding described first weld pad, and the weld pad of winning is positioned at outside the side of chip supporting seat, and described pin comprises several relative lead connecting surfaces and several non-lead connecting surfaces.Optical sensing chip has one second relative acting surface and one second non-acting surface, and second acting surface has central optical sensing area part and one second peripheral part.Second peripheral part has several second weld pads, and the second non-acting surface and second commissure stick together mutually.The lead of part is in order to electrically connecting described first weld pad and described lead connecting surface, and the lead of another part makes semiconductor chip and optical sensing chip electrically connect with described pin respectively in order to electrically connect described second weld pad and described lead connecting surface.Adhesive body is the described lead of coating chip supporting seat, first acting surface, the second non-acting surface, part at least and the described pin of part, and the first non-action face, second acting surface and described non-lead connecting surface are to be exposed to outside the adhesive body.Transparency cover has a depression, and transparency cover is to be attached to adhesive body and lead frame in the depression mode that Open Side Down, makes the described lead of second acting surface and the part that is connected described second weld pad and described lead connecting surface be arranged in depression.
Above-mentioned purpose, design feature and effect for further specifying the present invention are described in detail the present invention below with reference to accompanying drawing.
Description of drawings
Figure 1A is the profile that the optical sensing chip that disclosed for the 5th, 523, No. 608 of United States Patent (USP) case and semiconductor chip pile up encapsulating structure.
Figure 1B is the vertical view of the optical sensing chip of Figure 1A.
Fig. 2 A is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention one and semiconductor chip.
Fig. 2 B is the vertical view of the semiconductor chip of Fig. 2 A.
Fig. 2 C is the semiconductor chip of Fig. 2 B and the vertical view of lead frame and lead.
Fig. 2 D is the lead frame of Fig. 2 C and the vertical view of semiconductor chip and optical sensing chip and lead.
Fig. 3 is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention two and semiconductor chip.
Fig. 4 is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention three and semiconductor chip.
Fig. 5 is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention four and semiconductor chip.
Fig. 6 is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention five and semiconductor chip.
Fig. 7 is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention six and semiconductor chip.
Embodiment
Embodiment one
Please refer to Fig. 2 A, it is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention one and semiconductor chip.In Fig. 2 A, optical sensing chip and semiconductor chip pile up encapsulating structure 20 and comprise a lead frame (leadframe) 21, semiconductor chip 22, an optical sensing chip 23, adhesive body 26, transparent panel 27 and several wires, as lead 24b, 24c, 25b and 25c.Semiconductor chip 22 has one first relative acting surface 22d and one first non-acting surface 22e, and the first acting surface 22d has one first middle body 22f and one first peripheral part 22g, shown in Fig. 2 B.Several first weld pads of the first peripheral part 22g are as first weld pad 22b and the 22c.Lead frame 21 comprises a chip supporting seat 21a and several pins, as pin 21b and 21c.Pin 21b and 21c respectively have a relative lead connecting surface 21f and a non-lead connecting surface 21g, chip supporting seat 21a has one first relative commissure 21d and one second commissure 21e, the first commissure 21d is attached to the first middle body 22f by liquid or solid-state non-conductive adhesive in the mode of avoiding the first weld pad 22b and 22c, shown in Fig. 2 C.
Refer again to Fig. 2 A, lead 24b and 25b are in order to electrically connect the lead connecting surface 21f of the first weld pad 22b and the second weld pad 23b and pin 21b respectively, lead 24c and 25c make semiconductor chip 22 and optical sensing chip 23 and pin 21b and 21c electrically connect in order to electrically connect the lead connecting surface 21f of the first weld pad 22c and the second weld pad 23c and pin 21c respectively.Adhesive body 26 is optical sensing chip 23, the first weld pad 22b and 22c, the second weld pad 23b and 23c, lead 24b, 24c, 25b and the 25c of coating chip supporting seat 21a, semiconductor chip 22, part and the pin 21b and the 21c of part, and the second non-acting surface 23e, lead connecting surface 21f and non-lead connecting surface 21g are all coated by adhesive body 26.The end face of adhesive body 26 has a depression 26a, and depression 26a exposes central optical sensing area part 23a.Transparent panel 27 is disposed on the end face of adhesive body 26, in order to seal depression 26a.
Yet person skilled in the art person can also understand technology of the present invention and not be confined to this, for example, semiconductor chip 22 is a flash memory (flash memory) chip, a logic (logic) chip or a signal digital processor (digital signal processor, DSP) chip, and optical sensing chip 23 is a complementary metal oxide semiconductors (CMOS) (complementary metal oxide semiconductor, CMOS) chip, a Charged Coupled Device (charge coupled device, CCD) chip or other light sensing induction chip.Lead 24b, 24c, 25b and 25c are four gold threads, and transparent panel 27 is to be selected from a transparent plate, a transparent flange and a transparent notch board wherein any or its combination in any. Pin 21b and 21c respectively also comprise a pin and an outer pin in one, and interior pin is partly to be coated in the adhesive body 26, and outer pin is to be stretched out outside adhesive body 26 by interior pin accordingly.
Embodiment two
Please refer to Fig. 3, it is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention two and semiconductor chip.In Fig. 3, optical sensing chip and semiconductor chip that the optical sensing chip of present embodiment and semiconductor chip pile up encapsulating structure 30 and embodiment one pile up the coating form that encapsulating structure 20 differences are adhesive body, then continue to continue to use identical label as for other identical constitutive requirements, and do not repeat them here.In Fig. 3, the bottom surface of adhesive body 36 is and the first non-acting surface 22e copline of semiconductor chip 22, makes the first non-acting surface 22e of semiconductor chip 22 be exposed to outside the adhesive body 36.Thus, can increase the radiating effect that optical sensing chip and semiconductor chip pile up encapsulating structure 30.
Embodiment three
Please refer to Fig. 4, it is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention three and semiconductor chip.In Fig. 4, the optical sensing chip of present embodiment and semiconductor chip pile up the optical sensing chip of encapsulating structure 50 and embodiment one and semiconductor chip and pile up encapsulating structure 20 differences and be the coating form of adhesive body and the size of transparent panel.In Fig. 4, adhesive body 56 is optical sensing chip 23, the first weld pad 22b and the 22c of coating chip supporting seat 21a, semiconductor chip 22, part, the lead 24b of part and the pin 21b and the 21c of 24c and part.The end face of adhesive body 56 has a depression 56a, and depression 56a is lead 24b and 24c and the pin 21b of part and the lead connecting surface 21f of 21c that exposes central optical sensing area part 23a, weld pad 23b and 23c, lead 25b and 25c, another part.Transparent panel 57 is to be disposed on the end face of adhesive body 56, and seals depression 56a.In other embodiments, first of the semiconductor chip 22 non-acting surface 22e can be exposed to outside the adhesive body 36.
Embodiment four
Please refer to Fig. 5, it is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention four and semiconductor chip.In Fig. 5, optical sensing chip and semiconductor chip pile up encapsulating structure 60 and comprise a lead frame 61, semiconductor chip 22, an optical sensing chip 23, adhesive body 66, transparent panel 67 and several wires, as lead 64b, 64c, 65b and 65c.Wherein, the structure of semiconductor chip 22 and optical sensing chip 23 is continued to use identical label at this, and is repeated no more as described in the embodiment one.Lead frame 61 comprises a chip supporting seat 61a and several pins, as pin 61b and 61c.Pin 61b and 61c respectively have a relative lead connecting surface 61f and a non-lead connecting surface 61g, and chip supporting seat 61a has one first relative commissure 61d and one second commissure 61e.The first commissure 61d is attached to the first middle body 22f of the semiconductor chip 22 shown in Fig. 2 B by liquid or solid-state non-conductive adhesive in the mode of avoiding the first weld pad 22b and 22c, and the second commissure 61e is the second non-acting surface 23e that is attached to optical sensing chip 23 by liquid or solid-state glue.
Embodiment five
Please refer to Fig. 6, it is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention five and semiconductor chip.In Fig. 6, the packaging structure of light-sensing chip 70 of present embodiment is piled up the coating form that encapsulating structure 60 differences are adhesive body with optical sensing chip and the semiconductor chip of embodiment four.In Fig. 6, the end face of adhesive body 76 has a depression 76a, and depression 76a exposes chip supporting seat 61a, central optical sensing area part 23a, the first weld pad 22b and 22c, the second weld pad 23b and 23c, lead 64b, 64c, 65b and 65c and the pin 61b of part and the lead connecting surface 61f of 61c.Transparent panel 67 is to be disposed on the end face of adhesive body 76, and seals depression 76a.
Embodiment six
Please refer to Fig. 7, it is the profile that piles up encapsulating structure according to the optical sensing chip of embodiments of the invention six and semiconductor chip.In Fig. 7, the packaging structure of light-sensing chip 80 of present embodiment is piled up encapsulating structure 60 differences with the optical sensing chip of embodiment four and semiconductor chip and is the coating form of adhesive body and the structure of transparency cover.Adhesive body 86 is the first acting surface 22d of coating chip supporting seat 61a, semiconductor chip 22, the second non-acting surface 23e, the first weld pad 22b and 22c, lead 64b and 64c and the pin 61b of part and the lead connecting surface 61f of 61c of optical sensing chip 23.Transparency cover 87 has a depression 87a, transparency cover 87 is to be attached on lead frame 61 and the adhesive body 86 in the depression 87a mode that Open Side Down, for example transparency cover 87 is arranged on the lead connecting surface 61f of pin 61b and 61c, makes pin 61b of central optical sensing area part 63a, the second weld pad 23b and 23c, lead 65b and 65c and another part and the lead connecting surface 61f of 61c be arranged in depression 76a.It should be noted that transparency cover 87 is to be selected from a transparent plate, a transparent flange and a transparent notch board wherein any or its combination in any.
Optical sensing chip that the above embodiment of the present invention disclosed and semiconductor chip pile up encapsulating structure, the second non-acting surface of first acting surface of its semiconductor chip and optical sensing chip respectively with the design of first commissure and the second commissure gluing of chip supporting seat, can dwindle encapsulation volume, thickness and weight that optical sensing chip and semiconductor chip pile up encapsulating structure, and promote the radiating effect that optical sensing chip and semiconductor chip pile up encapsulating structure.
Though the present invention describes with reference to current specific embodiment, but those of ordinary skill in the art will be appreciated that, above embodiment is used for illustrating the present invention, under the situation that does not break away from spirit of the present invention, also can make the variation and the modification of various equivalences, therefore, as long as variation, the modification to the foregoing description all will drop in the scope of claims of the present invention in connotation scope of the present invention.
Claims (21)
1. optical sensing chip and semiconductor chip pile up encapsulating structure, comprise at least:
The semiconductor chip has one first relative acting surface and one first non-acting surface, and this first acting surface has one first middle body and one first peripheral part, and this first peripheral part has several first weld pads;
One lead frame, comprise several pins and a chip supporting seat, this chip supporting seat has one first relative commissure and one second commissure, this first commissure is to be attached to this first middle body in the mode of avoiding described first weld pad, makes described first weld pad be positioned at outside the side of this chip supporting seat;
One optical sensing chip, have one second relative acting surface and one second non-acting surface, this second acting surface has central optical sensing area part and one second peripheral part, and this second peripheral part has several second weld pads, and this second non-acting surface and this second commissure stick together mutually;
Several wires, the described lead of part is in order to electrically connect described first weld pad and described pin, and the described lead of another part makes this semiconductor chip and this optical sensing chip electrically connect with described pin respectively in order to electrically connect described second weld pad and described pin;
One adhesive body coats the described lead of this chip supporting seat, this first acting surface, this second non-acting surface, part and the described pin of part at least, and the end face of this adhesive body has a depression, and this depression exposes this central optical sensing area part at least; And
One transparent panel is to be disposed on the end face of this adhesive body, and seals this depression.
2. optical sensing chip as claimed in claim 1 and semiconductor chip pile up encapsulating structure, it is characterized in that this first commissure and this first acting surface are to utilize solid-state or liquid non-conductive adhesive to stick together mutually.
3. optical sensing chip as claimed in claim 1 and semiconductor chip pile up encapsulating structure, it is characterized in that this second commissure and this second non-action face are to utilize solid-state or liquid glue to stick together mutually.
4. optical sensing chip as claimed in claim 1 and semiconductor chip pile up encapsulating structure, it is characterized in that this transparent panel is to be selected from a transparent plate, a transparent flange and a transparent notch board wherein any or its combination in any.
5. optical sensing chip as claimed in claim 1 and semiconductor chip pile up encapsulating structure, it is characterized in that described pin also comprises:
Pin in several is partly to be coated in this adhesive body; And
Several outer pins are to be stretched out outside this adhesive body by pin in described accordingly.
6. optical sensing chip as claimed in claim 1 and semiconductor chip pile up encapsulating structure, it is characterized in that this adhesive body is and coats described second weld pad, described lead and described pin.
7. optical sensing chip as claimed in claim 6 and semiconductor chip pile up encapsulating structure, it is characterized in that this adhesive body is and coats this first non-acting surface.
8. optical sensing chip as claimed in claim 6 and semiconductor chip pile up encapsulating structure, it is characterized in that this first non-acting surface is to be exposed to outside this adhesive body.
9. optical sensing chip as claimed in claim 1 and semiconductor chip pile up encapsulating structure, it is characterized in that this depression is and exposes the described lead of described second weld pad and the part that is connected described second weld pad and described pin.
10. optical sensing chip as claimed in claim 9 and semiconductor chip pile up encapsulating structure, it is characterized in that this adhesive body is and coats this first non-acting surface.
11. optical sensing chip as claimed in claim 9 and semiconductor chip pile up encapsulating structure, it is characterized in that this first non-acting surface is to be exposed to outside this adhesive body.
12. optical sensing chip and semiconductor chip pile up encapsulating structure, comprise at least:
The semiconductor chip has one first relative acting surface and one first non-acting surface, and this first acting surface has one first middle body and one first peripheral part, and this first peripheral part has several first weld pads;
One lead frame, comprise several pins and a chip supporting seat, this chip supporting seat has one first relative commissure and one second commissure, this first commissure is to be attached to this first middle body in the mode of avoiding described first weld pad, make described first weld pad be positioned at outside the side of this chip supporting seat, described pin comprises several relative lead connecting surfaces and several non-lead connecting surfaces;
One optical sensing chip, have one second relative acting surface and one second non-acting surface, this second acting surface has central optical sensing area part and one second peripheral part, and this second peripheral part has several second weld pads, and this second non-acting surface and this second commissure stick together mutually;
Several wires, the described lead of part is in order to electrically connect described first weld pad and described lead connecting surface, and the described lead of another part makes this semiconductor chip and this optical sensing chip electrically connect with described pin respectively in order to electrically connect described second weld pad and described lead connecting surface;
One adhesive body, at least coat the described lead of this chip supporting seat, this first acting surface, this second non-acting surface, part and the described pin of part, and this first non-action face and described non-lead connecting surface are to be exposed to outside this adhesive body, the end face of this adhesive body has a depression, and this depression is to expose this central optical sensing area part at least; And
One transparent panel is to be disposed on the end face of this adhesive body, and seals this depression.
13. optical sensing chip as claimed in claim 12 and semiconductor chip pile up encapsulating structure, it is characterized in that this first commissure and this first acting surface are to utilize solid-state or liquid non-conductive adhesive to stick together mutually.
14. optical sensing chip as claimed in claim 12 and semiconductor chip pile up encapsulating structure, it is characterized in that this second commissure and this second non-action face are to utilize solid-state or liquid glue to stick together mutually.
15. optical sensing chip as claimed in claim 12 and semiconductor chip pile up encapsulating structure, it is characterized in that this transparent panel is to be selected from a transparent plate, a transparent flange and a transparent notch board wherein any or its combination in any.
16. optical sensing chip as claimed in claim 12 and semiconductor chip pile up encapsulating structure, it is characterized in that this adhesive body is and coats described second weld pad, described lead and described pin.
17. optical sensing chip as claimed in claim 12 and semiconductor chip pile up encapsulating structure, it is characterized in that this depression is and exposes the described lead of described second weld pad and the part that is connected described second weld pad and described pin.
18. optical sensing chip and semiconductor chip pile up encapsulating structure, comprise at least:
The semiconductor chip has one first relative acting surface and one first non-acting surface, and this first acting surface has one first middle body and one first peripheral part, and this first peripheral part has several first weld pads;
One lead frame, comprise several pins and a chip supporting seat, this chip supporting seat has one first relative commissure and one second commissure, this first commissure is to be attached to this first middle body in the mode of avoiding described first weld pad, make described first weld pad be positioned at outside the side of this chip supporting seat, described pin comprises several relative lead connecting surfaces and several non-lead connecting surfaces;
One optical sensing chip, have one second relative acting surface and one second non-acting surface, this second acting surface has central optical sensing area part and one second peripheral part, and this second peripheral part has several second weld pads, and this second non-acting surface and this second commissure stick together mutually;
Several wires, the described lead of part is in order to electrically connect described first weld pad and described lead connecting surface, and the described lead of another part makes this semiconductor chip and this optical sensing chip electrically connect with described pin respectively in order to electrically connect described second weld pad and described lead connecting surface;
One adhesive body, at least coat the described lead of this chip supporting seat, this first acting surface, this second non-acting surface, part and the described pin of part, and this first non-action face, this second acting surface and described non-lead connecting surface are to be exposed to outside this adhesive body; And
One transparency cover has a depression, and this transparency cover is to be attached to this adhesive body and this lead frame in this depression mode that Open Side Down, makes the described lead of this second acting surface and the part that is connected described second weld pad and described lead connecting surface be arranged in this depression.
19. optical sensing chip as claimed in claim 18 and semiconductor chip pile up encapsulating structure, it is characterized in that this first commissure and this first acting surface are to utilize solid-state or liquid non-conductive adhesive to stick together mutually.
20. optical sensing chip as claimed in claim 18 and semiconductor chip pile up encapsulating structure, it is characterized in that this second commissure and this second non-action face are to utilize solid-state or liquid glue to stick together mutually.
21. optical sensing chip as claimed in claim 18 and semiconductor chip pile up encapsulating structure, it is characterized in that this transparency cover is to be selected from a transparent plate, a transparent flange and a transparent notch board any or its combination in any wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100035967A CN100365813C (en) | 2004-02-03 | 2004-02-03 | Stacking packaging structure for light sensitive chips and semiconductor chips |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100035967A CN100365813C (en) | 2004-02-03 | 2004-02-03 | Stacking packaging structure for light sensitive chips and semiconductor chips |
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| CN1652335A true CN1652335A (en) | 2005-08-10 |
| CN100365813C CN100365813C (en) | 2008-01-30 |
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| CNB2004100035967A Expired - Fee Related CN100365813C (en) | 2004-02-03 | 2004-02-03 | Stacking packaging structure for light sensitive chips and semiconductor chips |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101256966B (en) * | 2007-03-02 | 2010-12-22 | 半导体元件工业有限责任公司 | Semiconductor component and method of manufacture |
| CN101465344B (en) * | 2007-12-18 | 2011-02-02 | 鸿富锦精密工业（深圳）有限公司 | Encapsulation structure of image die set |
| CN110375799A (en) * | 2018-04-11 | 2019-10-25 | 意法半导体(R&D)有限公司 | Electronic module including the ambient light sensor in proximity sensor stacked on top |
| CN112409971A (en) * | 2020-11-20 | 2021-02-26 | 湖北三选科技有限公司 | Liquid mold sealing adhesive for protecting five sides of semiconductor chip and preparation method |
| CN113838839A (en) * | 2020-06-23 | 2021-12-24 | 光宝科技新加坡私人有限公司 | Sensing assembly packaging structure and packaging method thereof |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2843464B2 (en) * | 1992-09-01 | 1999-01-06 | シャープ株式会社 | Solid-state imaging device |
| DE69636920T2 (en) * | 1995-08-02 | 2007-11-22 | Matsushita Electric Industrial Co., Ltd., Kadoma | SOLID BODY RECORDING DEVICE AND MANUFACTURING METHOD |
| JP3502061B2 (en) * | 2001-05-23 | 2004-03-02 | 勝開科技股▲ふん▼有限公司 | Image sensor stack package structure |
| CN1441493A (en) * | 2002-02-26 | 2003-09-10 | 旺宏电子股份有限公司 | Semiconductor element in stacked structure |
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2004
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101256966B (en) * | 2007-03-02 | 2010-12-22 | 半导体元件工业有限责任公司 | Semiconductor component and method of manufacture |
| CN101465344B (en) * | 2007-12-18 | 2011-02-02 | 鸿富锦精密工业（深圳）有限公司 | Encapsulation structure of image die set |
| CN110375799A (en) * | 2018-04-11 | 2019-10-25 | 意法半导体(R&D)有限公司 | Electronic module including the ambient light sensor in proximity sensor stacked on top |
| US10955289B2 (en) | 2018-04-11 | 2021-03-23 | Stmicroelectronics (Research & Development) Limited | Electronic module including an ambient light sensor stacked over a proximity sensor |
| CN110375799B (en) * | 2018-04-11 | 2021-12-21 | 意法半导体(R&D)有限公司 | Electronic module including ambient light sensor stacked over proximity sensor |
| CN113838839A (en) * | 2020-06-23 | 2021-12-24 | 光宝科技新加坡私人有限公司 | Sensing assembly packaging structure and packaging method thereof |
| CN112409971A (en) * | 2020-11-20 | 2021-02-26 | 湖北三选科技有限公司 | Liquid mold sealing adhesive for protecting five sides of semiconductor chip and preparation method |
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| CN100365813C (en) | 2008-01-30 |
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