CN1645585A - Production of direct brazing filler metal button by double electrothermal filament smelting and cutting method - Google Patents
Production of direct brazing filler metal button by double electrothermal filament smelting and cutting method Download PDFInfo
- Publication number
- CN1645585A CN1645585A CN 200510009617 CN200510009617A CN1645585A CN 1645585 A CN1645585 A CN 1645585A CN 200510009617 CN200510009617 CN 200510009617 CN 200510009617 A CN200510009617 A CN 200510009617A CN 1645585 A CN1645585 A CN 1645585A
- Authority
- CN
- China
- Prior art keywords
- solder wire
- solder
- wire
- salient point
- heating wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The method includes following steps: 1, through the positional adjustment in the direction of horizontal on the objective table, the basal plate bonding pad fixed on the objective table is moved to the place where salient point is made, and aims at solder wire and guiding positional funnel; 2, the solder wire is vertically moved downward for making the bottom part of solder wire thread the place between the two heating wires. 3, the two heating wires close, and then open to make the bottom of solder wire melt; the molten drop is dropped on the basal plate bonding pad through the funnel to form the salient point.
Description
Technical field:
The present invention relates to the convex point production method of the unilateral array package of a kind of ic core.
Background technology:
Because, having promoted the Electronic Packaging form to low-cost, high-speed, multi-functional development, integrated circuit transforms to novel face array package by traditional packing forms.The face array package mainly comprises BGA Package (BGA) and wafer-level package (CSP).Face array package technology relies on its excellent processing performance and technical characterstic now to be widely used in the various aspects of microelectronics Packaging.The characteristics of face array package are to make spherical salient point as pin by array way on whole of substrate.How to seek to provide reliable connection, and the convex point production method with cost advantage becomes the key in the packaging technology research.Existing stud bump making technology mainly contains evaporation, plating, mould printing, metal jet (MJT) etc.These methods all are widely used, but all have deficiency, and certain application limitations is arranged: evaporation process cost height, and because tin is different with plumbous amounts of pressurized gaseous, therefore can't evaporates and make eutectic tin lead salient point.Because photoresist will be arranged, increased cost in the electroplating process, because the chemical property difference of tin, lead, the Composition Control of therefore electroplating salient point is relatively more difficult.Mould printing is used now widely, is that mainly its efficient height, solder paste composition range of choice are wide.But mould printing can't be used for the thin space stud bump making, can not satisfy encapsulation technology development requirement.The advantage of metal jet technology is that the formation of drop by digital control, does not need template or mask, only forms solder bump at the needs place, reduces the postorder operation, reduces cost the flexibility height.But the metal jet technical equipment is too complicated and heavy, is having much room for improvement aspect the drop stability simultaneously.
Summary of the invention:
The existing bump making method operation is many in order to overcome, the complicated heaviness of equipment needed thereby, defective that production cost is high, and the production of direct brazing filler metal button by double electrothermal filament smelting and cutting method that a kind of operation is less, equipment needed thereby is simple, production cost is low is provided.Technical scheme of the present invention realizes by following step: one, adjust by the position of objective table on horizontal plane, the position alignment that makes the substrate pads that is fixed on the objective table move to required making salient point is arranged on the solder wire and the guide-localization funnel of substrate pads top; Two, solder wire feeding is vertically downward passed between two heating wire of horizontal direction parallel setting the bottom of solder wire, and two heating wire are connected in parallel on the power supply; Three, separate after two heating wire close up, the bottom of solder wire is fused and is molten into that the guiding through the guide-localization funnel is dropped on the substrate pads behind the molten drop again, and molten drop heated substrates pad also forms salient point with it and connects; Repeat above three steps and just can finish stud bump making on the whole base plate pad, more than three steps all be under the environment of inert gas or nitrogen protection, to carry out.Two heating wire parallel connections are turned on the power supply, and heating wire is owing to the reason of internal resistance will produce Joule heat.When the heating wire temperature reaches the solder fusing point when above, drive it by mechanical device and do periodic relative shear solder wire motion.Solder wire vertically send down particular length, when heating wire touches solder wire, its heat can conduct to solder wire, above molten point of contact,, therefore only press close to melt near the solder wire in point of contact and just can melt owing to heat can upwards conduction be lost along solder wire, and the solder wire termination of below, molten point of contact, thermal capacity is little, no conducting path, fusing rapidly.Because capillary effect, the solder of fusing can form sphere.Because selected heating wire material and solder material are nonwetting, solder droplet can drip under action of gravity naturally.Below solder droplet, face substrate pads, utilize the entrained heat heating pad of liquid solder molten drop and form salient point with it to connect.This technical process distributes with heating process the alloy between solder droplet and the substrate pads to carry out synchronously, does not need contacting of template and heating tool simultaneously, has avoided the damage to the integrated circuit (IC) chip surface.And the heating be local, to chip or the encapsulation integral body do not add thermal impact.Because the step of this method seldom, not only thoroughly changed original various stud bump making process, the more important thing is and reduced many undesirable elements that original production link brought.Ensured the reliability that salient point forms.This method applying flexible is controlled easyly, and equipment needed thereby is simple.By the difference of the each amount of feeding of control solder wire, can melt within the specific limits and cut the solder ball that forms different size.Change the size of electric current on the heating wire, i.e. the temperature of may command heating wire.Adjust simultaneously that electrothermal filament smelting is cut, the speed of homing action, can control the temperature of solder droplet within the specific limits.This is very crucial to forming reliable salient point.Method reliable operation of the present invention, cost be low, be suitable for promotion and implementation.
Description of drawings:
Fig. 1 is the structural representation of the employed device of the specific embodiment of the invention, and Fig. 2 is a syndeton schematic diagram of shearing suspension bracket and heating wire in the execution mode.
Embodiment:
Present embodiment is realized by following step: one, adjust by the position of objective table 8 on horizontal plane, the position alignment that makes the substrate pads 10 that is fixed on the objective table 8 move to required making salient point is arranged on the solder wire 2 and the guide-localization funnel 13 of substrate pads 10 tops; Two, solder wire 2 feeding is vertically downward passed between two heating wire 11 of horizontal direction parallel setting the bottom of solder wire 2, and two heating wire 11 are connected in parallel on the power supply; Three, separate after two heating wire 11 close up, the bottom of solder wire 2 is fused and is molten into that the guiding through guide-localization funnel 13 is dropped on the substrate pads 10 behind the molten drop again, and molten drop heated substrates pad 10 also forms salient point with it and connects; Repeat above three steps and just can finish stud bump making on the whole base plate pad 10, more than three steps all be under the environment of inert gas or nitrogen protection, to carry out.As shown in Figure 1, be an accurate wire-feed motor 1 in the top of present embodiment device, solder wire 2 vertically send down under the driving of accurate wire-feed motor 1.The length of wire feed and interlude can be set and adjust by control circuit.A pair of drive magnet 3 is housed on upper mounting plate 4, below upper mounting plate 4, hangs a pair of shearing suspension bracket 6 by gudgeon frame 5.Shearing suspension bracket 6 upper ends for two partly is connected with the armature of a pair of drive magnet 3 respectively.When the solenoid of drive magnet 3 was switched on, it produced electromagnetic attraction, and pulling is sheared suspension bracket 6 and done the relative shear campaign, and two heating wire 11 are separately fixed on the lower end of two shearing suspension brackets 6.When solenoid cut off the power supply, no electromagnetic attraction was sheared suspension bracket 6 under the effect of back-moving spring 12, opened to reset.Whole device is placed in the airtight transparent protective shield 7, charges into inert gas or nitrogen protection during work.On the platform an accurate X-Y objective table 8 is being housed below the device, the substrate pads 10 aligning molten drops that can drive integrated circuit (IC) chip are made the X-Y plane motion positions.Device below control cabinet 9 in power supply and control section are housed, comprise heating wire heating power supply, wire-feed motor power supply, solenoid actuated power supply, objective table driving power and Programmable Logic Controller.
Claims (1)
1, production of direct brazing filler metal button by double electrothermal filament smelting and cutting method, it is characterized in that it realizes by following step: one, adjust by the position of objective table on horizontal plane, the position alignment that makes the substrate pads that is fixed on the objective table move to required making salient point is arranged on the solder wire and the guide-localization funnel of substrate pads top; Two, solder wire feeding is vertically downward passed between two heating wire of horizontal direction parallel setting the bottom of solder wire, and two heating wire are connected in parallel on the power supply; Three, separate after two heating wire close up, the bottom of solder wire is fused and is molten into that the guiding through the guide-localization funnel is dropped on the substrate pads behind the molten drop again, and molten drop heated substrates pad also forms salient point with it and connects; Repeat above three steps and just can finish stud bump making on the whole base plate pad, more than three steps all be under the environment of inert gas or nitrogen protection, to carry out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100096170A CN1317751C (en) | 2005-01-12 | 2005-01-12 | Production of direct brazing filler metal button by double electrothermal filament smelting and cutting method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100096170A CN1317751C (en) | 2005-01-12 | 2005-01-12 | Production of direct brazing filler metal button by double electrothermal filament smelting and cutting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1645585A true CN1645585A (en) | 2005-07-27 |
| CN1317751C CN1317751C (en) | 2007-05-23 |
Family
ID=34875392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100096170A Expired - Fee Related CN1317751C (en) | 2005-01-12 | 2005-01-12 | Production of direct brazing filler metal button by double electrothermal filament smelting and cutting method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1317751C (en) |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3210456B2 (en) * | 1992-12-25 | 2001-09-17 | 田中電子工業株式会社 | Method of forming ball on metal wire |
| US6025258A (en) * | 1994-01-20 | 2000-02-15 | Fujitsu Limited | Method for fabricating solder bumps by forming solder balls with a solder ball forming member |
| US5899737A (en) * | 1996-09-20 | 1999-05-04 | Lsi Logic Corporation | Fluxless solder ball attachment process |
| JP2985840B2 (en) * | 1997-07-31 | 1999-12-06 | 日本電気株式会社 | Manufacturing method of solder bump electrode |
| JP3733775B2 (en) * | 1998-03-11 | 2006-01-11 | セイコーエプソン株式会社 | Projection electrode forming device |
| JP2003133353A (en) * | 2001-10-22 | 2003-05-09 | Orient Semiconductor Electronics Ltd | Device for forming metal projection |
| CN1282995C (en) * | 2003-03-11 | 2006-11-01 | 哈尔滨工业大学 | Preparation of projective spots for laser welding |
-
2005
- 2005-01-12 CN CNB2005100096170A patent/CN1317751C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1317751C (en) | 2007-05-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103295991B (en) | For making the self aligned double solder semiconductor chips of the solder projection in semiconductor assemblies, device and double solder methods | |
| CN100495690C (en) | High performance reworkable heatsink and packaging structure and method of making same | |
| JP2019062199A (en) | Gang bonding process for assembling matrix of light emitting elements | |
| US8012866B2 (en) | Method of bonding semiconductor devices utilizing solder balls | |
| US8686299B2 (en) | Electronic element unit and reinforcing adhesive agent | |
| JP2002164560A (en) | Outer mutual connection method of solar battery and solar battery panel | |
| JP2004533327A (en) | High temperature lead-free solder compositions, methods and devices | |
| US20140124920A1 (en) | Stud bump structure and method for manufacturing the same | |
| US5113581A (en) | Outer lead bonding head and method of bonding outer lead | |
| US20130221521A1 (en) | Solder bump stretching method for forming a solder bump joint in a device | |
| WO2010053454A1 (en) | In-situ melt and reflow process for forming flip-chip interconnections and system thereof | |
| US6193143B1 (en) | Solder bump forming method and mounting apparatus and mounting method of solder ball | |
| CN105226011A (en) | The interconnecting method of hot binding device and method of operation and close pin distance flip-chip assembly | |
| US20150235975A1 (en) | Methods for Stud Bump Formation and Apparatus for Performing the Same | |
| CN1317751C (en) | Production of direct brazing filler metal button by double electrothermal filament smelting and cutting method | |
| CN102184875A (en) | Manufacturing method of nail head gold bump | |
| CN1228826C (en) | Electronic package method | |
| CN1440066A (en) | Preparation of projective spots for laser welding | |
| CN106233443B (en) | Bump forming method, convex block form the manufacturing method of device and semiconductor device | |
| CN105458435B (en) | A kind of lead bonding device and technique for semiconductor power device encapsulation | |
| JP2008027954A (en) | Process for producing electronic component mounting substrate | |
| CN1220571C (en) | Method for preparing microshere solder and micro spraying device utilized | |
| CN220710344U (en) | LED chip packaging structure and light-emitting device | |
| CN1328774C (en) | Tin ball maker by double electrothermal filament smelting and cutting method | |
| CN218975397U (en) | Novel eutectic machine |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070523 Termination date: 20100212 |