CN1638077A - 用于产生楔形－楔形引线连接的方法 - Google Patents

用于产生楔形－楔形引线连接的方法 Download PDF

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CN1638077A
CN1638077A CNA2005100037435A CN200510003743A CN1638077A CN 1638077 A CN1638077 A CN 1638077A CN A2005100037435 A CNA2005100037435 A CN A2005100037435A CN 200510003743 A CN200510003743 A CN 200510003743A CN 1638077 A CN1638077 A CN 1638077A
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wire
lead
capillary
wedge
tie point
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迈克尔·迈尔
海因里希·贝希托尔德
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Besi Switzerland AG
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Abstract

在产生第二楔形连接之后进行引线的剥离时，球形引线键合器能够用于产生第一和第二连接点(10.1，10.2，…；11.1，11.2，…)间的楔形－契形引线连接，使得伸出毛细管的引线指向待进行的下一引线连接的方向。为了通过剥离引线(5)来完成实际的楔形－契形引线连接(10.1，10.2，…)和准备伸出毛细管(4)的引线以产生将进行的下一楔形－契形引线连接(10.1，10.2，…)，进行下述步骤：计算水平面上的二维矢量v，其从毛细管(4)的在将进行的下一楔形－契形引线连接的第一连接点上的所需作用点指向毛细管(4)的在将进行的下一楔形－契形引线连接的第二连接点上的所需作用点，及在将引线(5)贴到第二连接点上后，将毛细管(4)沿着由矢量v与垂直线形成的平面中的行进路径(13)移动，从而引线(5)在到达行进路径(13)末端时剥离。

Description

用于产生楔形-楔形引线连接的方法
技术领域
本发明涉及一种用于利用在商业中公知为球形-引线键合器(Ball-Wire Bonder)的引线键合器(Wire Bonder)来产生楔形-楔形(wedge-wedge)引线连接的方法。
背景技术
引线键合器是一种将被安装在衬底上的半导体芯片进行引线接合的机器。在商业中，存在两种不同类型的引线键合器，一种为球形-楔形引线键合器，简称为球形引线-键合器，另一种为楔形-楔形引线键合器，简称为楔形-引线键合器。
球形-引线键合器具有一个被夹到操纵杆(horn)的顶端的毛细管(capillary)。毛细管将引线贴到半导体芯片的连接点上和衬底上的连接点上，以及引导这两个连接点之间的引线。在产生芯片上的连接点和衬底上的连接点之间的引线连接时，伸出毛细管的引线的末端被首先熔化成球。然后，这个球被通过压力和超声波贴到半导体芯片上的连接点。通过这种方式，来自超声波换能器的超声波被施加到操纵杆上。这个过程称为球键合。然后，引线被拉到所需的长度，形成引线环并焊入(热压缩键合)衬底上的连接点。这个最后的子过程称为楔形键合。在将引线贴到衬底上的连接点上之后，引线被剥离且可以开始下一轮的键合。
楔形-引线键合器具有引线引导和联接工具，其将引线贴到半导体芯片上的连接点和衬底上的对应连接点。在产生半导体芯片上的连接点和衬底上的连接点之间的引线连接时，引线引导和联接工具所提供的引线的末端被通过压力和超声波贴到衬底上的连接点。然后，引线被拉到所需的长度，形成引线环并焊入衬底上的连接点。这两个子过程称为楔形键合。在将引线贴到衬底上的连接点上之后，引线被剥离或切断且可以开始下一轮的键合。一般而言，楔形-楔形连接进行这样的引线连接：在两个连接点上，通常在较高的温度下，从毛细管伸出的对应引线被通过压力和超声波键入对应的连接点，而没有前面所述的熔化为球。
楔形-引线键合器的键合头与球形-引线键合器的键合头之间有本质的不同，因为对于楔形-楔形键合过程，将被贴到第一连接点上的引线的末端总是呈将进行的引线连接的方向。因此，对于楔形-引线键合器，操纵杆必须可旋转地安置在竖直轴上，其中在操纵杆的顶端固定引线引导和联接工具。楔形-引线键合器的键合头必须使引线引导和联接工具的移动具有总共五个自由度，而球形-引线键合器的键合头只需使毛细管的移动具有总共三个自由度。
发明内容
本发明是基于这样的发现而作出的：在产生第二楔形连接之后进行引线的剥离时，球形引线键合器也能够用于产生楔形-契形引线连接，使得伸出毛细管的引线指向待进行的下一引线连接的方向。
因此，根据本发明，提供了以如下的方式对球形-引线键合器进行编程：为了通过剥离引线来完成实际楔形-契形引线连接的产生和准备伸出毛细管的引线以产生下一楔形-契形引线连接，在将引线贴到第二连接点之后，进行下述的步骤：
-计算水平面上的二维矢量v，其从毛细管的在待进行的下一楔形-契形引线连接的第一连接点上的所需作用点指向毛细管的在待进行的下一楔形-契形引线连接的第二连接点上的所需作用点，以及
-在将引线贴到第二连接点上之后，将毛细管沿着由矢量v与垂直线所形成的平面中的行进路径移动。在将引线贴到第二连接点上时，像通常那样产生预定断开点，其中引线将在到达行进路径的末端时被剥离。
基本上，毛细管的行进路径包括四个连续的行进移动：
a)将毛细管升高预定的距离Δz1；
b)以矢量v所限定的方向，将毛细管在水平方向上移动预定的距离Δw1;
c)将毛细管降低预定的距离Δz2；以及
d)以矢量v所限定的方向，将毛细管在水平方向上移动预定的距离Δw2。距离Δw2形成的尺寸使得引线剥离。
在进行步骤a、b和c中毛细管的移动时引线夹张开且在引线被剥离之前将引线与矢量v的方向对准。引线在预定的断开点上剥离，使得引线从毛细管伸出，其被与矢量v的方向对准。
步骤a、b和c中毛细管的移动为水平或竖直移动。这些移动也可以互相叠加，以避免突然的停止以及毛细管的相关振荡，其具有使毛细管的行进时间变短的优点。
如上所述，球形-引线键合器的键合头具有这样的毛细管，其引导引线并且使毛细管的移动具有三个自由度，即座标的笛卡尔系统的x、y和z方向上的移动。满足这些需求但是在设计上基本不同的不同键合头在专利EP 317787、US 5330089或US 6460751中有描述。
本发明的基本原理也可以用于这样的应用：通过首先将引线贴到衬底上、然后贴到半导体芯片上的方式来产生引线连接。对于这些应用，通常需要通过必须先前被施加到半导体芯片上的附加引线材料来加固引线与半导体芯片之间的连接。在球形连接被首先施加到半导体芯片上的连接点且不形成引线连接而立即剥离引线的情况中，采用上述的应用。在商业中，所产生的球形连接被称为“凸起(bump)”或“球形凸起”。然后，产生球形-楔形引线连接，其中伸出毛细管的引线被熔化为球且被贴到衬底上的连接点，然后拉出所需的引线长度，通过这种方式，形成引线环和引线被贴到凸起上，作为楔形连接。这种引线连接的特征在于其具有位于两个末端的“球”或“凸起”。在商业中，这种方法公知为球形-凸起-反向-环(Ball-Bump-Reverse-Loop)方法。本发明简化了对于这种类型应用的引线连接的产生，其中本发明使伸出毛细管的引线首先被贴到施加在半导体芯片上的凸起上，作为楔形连接，然后被拉出所需的引线长度，通过这种方式立即形成引线环并将引线贴到衬底上的连接点上，作为楔形连接。从而，进行两种不同的程序。
对于第一种程序，半导体芯片上的所有连接点都首先以公知的方法设置凸起。然后，设置半导体芯片与衬底之间的引线环，作为如上所述的楔形-契形连接。
对于第二种程序，从开始到结束依次完整地产生一个引线连接。这种引线连接的产生的特征在于以下的步骤：
将伸出毛细管的引线熔化为球(“球的形成”)，
计算水平面上的二维矢量v，其从毛细管在半导体芯片的连接点上的所需作用点指向毛细管在衬底的连接点上的所需作用点，
球的形成通过以下方式：
-将球贴到半导体芯片上的连接点，以及
-将毛细管沿着由矢量v与垂直线所形成的平面中的行进路径移动，从而在行进路径的末端剥离引线。在此，行进路径也包括如第一示例所描述的a到d的行进移动。凸起被贴到半导体芯片上的连接点且伸出毛细管的引线指向将产生的引线连接的方向。
-将毛细管移回到刚产生的凸起上，
-将伸出毛细管的引线贴到凸起上，从而创建了楔形连接，
-将引线拉出所需长度，从而，像通常那样，引线形成环，且将引线贴到衬底上的连接点上，作为楔形连接。
附图说明
附图合并入本文件中并作为本文件的一部分，附图示出了本发明的一个或多个实施例，且与详细的说明一起解释本发明的原理和实现。附图没有刻度比例。在附图中：
图1示意性地示出了球形-引线键合器，
图2是示出了具有若干半导体芯片的衬底的示意性平面图，
图3是图2的剖面图，
图4A-E示出了引线的剥离和引线的末端形成下一楔形连接所需的形状的连续瞬态图，以及
图5A-E示出了毛细管的不同行进路径，
图6示出了完成的引线连接，以及
图7A-F示出了用于产生如图6所示的引线连接的毛细管的不同行进路径。
具体实施方式
图1示出了理解本发明所必需的引线键合器的若干部分的示意性侧视图。球形-引线键合器包括键合头2，该键合头2以及操纵杆3可通过两个驱动器在水平xy平面1中移动，其中在操纵杆3的顶端夹有毛细管4。毛细管4具有纵向钻孔，通过该钻孔馈送引线5。操纵杆3能够通过第三驱动器绕水平轴6旋转。因此，这三个驱动器使毛细管4的顶端的移动从一个位置A移动到任一位置B。根据这种设计，毛细管4的自由度的数目n总共为n＝3。此外，电极12被联接到键合头2上，通过该电极，可以将伸出毛细管的引线熔化为球。对这种电极的细节描述在中国专利申请CN 1472786和CN 1487574中有示例。
图2示出了具有若干安装在衬底7上的半导体芯片8的衬底7的示意性平面图。衬底7也可以为半导体芯片。每个半导体芯片8具有预定数目的连接点9.1、9.2等，每个连接点通过引线连接10.1、10.2等与衬底7上的对应的连接点11.1、11.2等进行电连接。
现在根据图3和图4A-4E对根据本发明的方法进行详细的描述。图3示出了被图2的虚线包围的部分。图3的左手侧所示出的引线连接10.1已进行到这样的程度：通过球形-引线键合器的毛细管4，引线环已从半导体芯片8上的第一连接点9.1延伸到衬底7上的对应的第二连接点11.1，且末端被焊入两个连接点9.1和11.1。但是，从毛细管4中出来的引线5还未与引线连接10.1分开。下一步要做的是产生两个连接点9.2和11.2之间的引线连接10.2。因此，矢量v＝(vx，vy，vz)的两个分量vx和vy确定为位于水平xy平面中，且从第一连接点9.2指向第二连接点11.2：矢量v连接各个连接点9.2和11.2上的毛细管4的所需作用点。一般而言，两个连接点9.2和11.2位于不同的的z高度，矢量v的z分量vz不重要。因此，两个分量vx和vx限定了位于水平xy平面中的二维矢量v1。当第一连接点9.2上的毛细管4的所需作用点的坐标用(x1，y1，z1)指定且第二连接点11.2上的毛细管4的所需作用点的坐标用(x2，y2，z2)指定时，则这导致矢量v1为v1＝(x2-x1，y2-y1)的结果。同样示出了从实际还未完成的引线连接10.1的连接点11.1出来的矢量v2。矢量v2与矢量v1平行且示出了毛细管4所经过的水平xy平面1中的行进方向，其将在下面的步骤描述。
图4A-4E示出了连续瞬态图中的第二连接点11.1、引线5和毛细管4，其示出了引线5与引线连接10.1的分离。引线5的分离使得：在剥离之后，伸出毛细管4的引线的末端与矢量v1或v2平行。附图示出了与矢量v2平行的竖直平面中的竖直部分。箭头表示毛细管4的行进方向。
图4A示出了在将引线5贴到第二连接点11.1之后紧接的状况。进行下述的步骤：
-毛细管4被升高预定的距离Δz1。这个状况在图4B中示出。
-毛细管4被以矢量v2所限定的方向在水平方向上移动预定的距离Δw1。这个状况在图4C中示出。
-毛细管4被降低预定的距离Δz2。这个状况在图4D中示出。一般而言，距离Δz2小于距离Δz1，因此，在毛细管4的后面的行进移动中，引线5没有与半导体芯片8摩擦或只与其产生小摩擦。
-毛细管4再次被以矢量v2所限定的方向在水平方向上移动预定的距离Δw2。距离Δw2形成的尺寸使得引线剥离。图4E示出了在剥离引线5之后的状况。
毛细管4在水平方向上移动距离Δw1和毛细管4在后来降低距离Δz2具有这样的效果：伸出毛细管4的引线的末端在水平方向上远离毛细管4的顶端突起。在矢量v1的方向上的行进方向具有这样的效果：引线的末端为将进行的下一引线连接的方向。
剥离引线5的过程步骤具有这样的效果：伸出毛细管4的引线的末端与矢量v1平行。毛细管4现在被移动到将进行的下一引线连接10.2第一连接点9.2且引线5被贴到连接点9.2上。引线5的联接通过预定键合力和超声波被施加到毛细管4上来完成。由于引线的末端先前没有形成球，所以引线5与连接点9.2之间的连接为楔形连接。引线现在以通常的方式被拉出所需的长度，形成引线环且贴到第二连接点11.2上。同时或者在后来，对将进行的下一引线连接10.3计算矢量v1且根据上述的过程步骤剥离引线。
在完成半导体芯片与衬底之间的最末引线连接时，对下一半导体芯片与衬底之间将进行的第一引线连接确定矢量v。通过这种方式，所有的半导体芯片可以容易地通过楔形-契形连接接合。
只存在一个问题，在开始产生时，伸出毛细管的引线的末端没有指向与将进行的第一引线连接对应的矢量v1的方向。这个问题可以通过以下的方式解决：或者对于引线连接，引线的末端形成为球且引线被联接为球形连接，或者引线被贴到衬底上的合适位置上，根据本发明的过程步骤对将进行的第一引线连接计算矢量v1和剥离引线。伸出毛细管的引线的末端现在指向矢量v1的方向且第一引线连接能够产生为楔形-契形连接。
本发明的一个重要优点在于省去了引线球的形成，这总的来说缩短了循环时间。另一个优点是所产生的楔形-契形连接的环高度小于球形-楔形连接。
图5A示出了根据上面基于图4A-4E所述的方法、毛细管4(图4A)在矢量v1和垂直线(即z方向)所形成的平面中所经过的行进路径13，其在将引线5贴到第二连接点11.1上直到引线5被剥离之后。这个行进路径包括两个竖直和两个水平的移动，其距离由Δz1、Δw1、Δz2和Δw2限定。根据本发明的方法也可以将毛细管4的行进移动进行稍微的修改，其特别被优化为在行进移动期间消除停止的效果。在图5B-5E示出了四个示例。对于图5B中的示例，将水平方向上的移动距离Δw1、毛细管4升高的距离Δz1和毛细管4降低的距离Δz2叠加：毛细管4的行进路径13为锯齿形。对于图5C的示例，将毛细管4降低的距离Δz2与水平方向上的移动距离Δw1叠加：毛细管4的行进路径13部分为弓形。此外，为了尽可能防止在毛细管4的突然停止时毛细管4出现不能避免的振荡以及获得较短的循环时间，可以通过弓形部分来平滑行进路径13中的剩下的拐角点。图5B和5C的示例中所示的行进路径13被修改为如图5D和5E所示。至少在毛细管4完全经过行进路径13时，引线5被剥离引线连接10.1(图2)。
本发明的第二实施例涉及这样的应用：图2所示的半导体芯片8上的连接点9.1、9.2等以及衬底7上的连接点11.1、11.2等之间的引线连接10.1、10.2等被通过以“凸起”的形式施加到半导体芯片8上的连接点9.1、9.2等上的附加引线材料而加固。对于这个实施例，引线连接被一个接一个地产生：首先，“凸起”，更确切地说为所谓的“球凸起”被施加到半导体芯片8上的连接点，然后，毛细管4以将进行的引线连接的方向移动，直到引线5被剥离，然后毛细管4移回到凸起上，然后进行从凸起到衬底7上的连接点的楔形-契形引线连接。现在参考图7A-7F对图6所示的引线连接10.2的产生进行描述，其中图7A-7F示出了与引线连接10.2的方向对准的竖直面的竖直部分，即由矢量v1和垂直线所形成的平面。图7A-7F还示出了引线夹14的张开或闭合的状况。固定基准轴17用于示出矢量v1的方向上的毛细管4的各水平位置。
图7A示出了在伸出毛细管4的引线被熔化为球且贴到半导体芯片8上的第一连接点9.2之后且在引线5被剥离之前的状况。在联接时，熔化的球被压平。引线5仍然与被压平的球15连接，但是已预形成预定断开点16，在预定断开点16上引线5将被剥离。毛细管4现在被升高至所谓的尾部高度，使得在后来剥离引线5之后，伸出毛细管4的引线5(所谓的“尾部”)具有预定的长度。这种状况如图7B所示。毛细管4被同时向侧边和向上移动，优选沿着以预定断开点16为中心的弓形，从而这种行进移动的水平分量指向将进行的引线连接10.2的方向。毛细管4所经过的轨迹路径如标号18所示。这个方向通过第一连接点9.2和第二连接点11.2上的毛细管4的所需作用点之间的连接线来限定。这个连接线对应于如图2所示的引线连接10.2，作为矢量v1。当沿着以预定断开点16为中心的弓形进行移动时，预定断开点16未变形且引线5还未剥离。这个状况如图7C所示。引线夹14现在被闭合且毛细管4进一步远离第一连接点9.1移动，优选地沿着连接预定断开点16和毛细管4的开口的线移动。由于引线夹14被闭合，所以引线5在预定断开点16上被剥离。“球凸起”的形成现在完成了且伸出毛细管4的引线与将进行的引线连接10.1的方向对准。这个状况如图7D所示。毛细管4现在移回到“球凸起”(图7E)上且被降低(图7F)且伸出毛细管4的引线通过压力和超声波贴到“球凸起”上。然后，以通常的方式完成引线连接10.2，其中引线5被拉出预定的长度，像通常那样形成为引线环并贴到第二连接点，作为楔形连接。
本发明的基本优点在于：
-环高度H(图6)小于球形-楔形引线连接。
-楔形-契形引线连接的产生无需所谓的反向移动，其是球形-契形引线连接所需的，以预形成引线环，使引线连接具有所需的弯曲。通过这种方式，连接点9.1、9.2等的空间需求降低了，这提供了连接点9.1与相邻设置的半导体芯片19之间的最小距离A小于当从连接点9.1、9.2等开始必须进行球形连接时的距离要小的优点，这对于“层叠的芯片”应用更是如此。
-键合周期所需的时间小于球形-凸起-反向-环方法，由于对于每个引线连接，引线被熔化为球只需一次而不是两次。
虽然已示出和描述了本发明的实施例和应用，但是对于可从本公开中获益的本发明的技术人员来说显而易见，在不脱离本发明的范围的情况下，可以进行多种修改，而不是上述的实施例。因此，本发明只受所附的权利要求及其等同物所限制。

Claims (2)

1.一种用于通过引线键合器来产生第一连接点(9.1、9.2、...)和第二连接点(11.1、11.2、...)之间的楔形-契形引线连接(10.1、10.2、...)的方法，其特征在于：为了通过剥离引线(5)来完成楔形-契形引线连接和准备伸出毛细管(4)的引线以产生将进行的下一楔形-契形引线连接(10.1、10.2、...)，引线(5)由固定至操纵杆(3)的毛细管(4)引导，从而键合头(2)使操纵杆(3)的移动具有总共三个自由度，并且进行下述步骤：
-计算水平面上的二维矢量v，二维矢量v从毛细管(4)的在将进行的下一楔形-契形引线连接的第一连接点上的所需作用点指向毛细管(4)的在将进行的下一楔形-契形引线连接的第二连接点上的所需作用点，以及
-在将引线(5)贴到第二连接点上之后，将毛细管(4)沿着由矢量v与垂直线所形成的平面中的行进路径(13)移动。
2.一种用于通过引线键合器来产生第一连接点(9.1、9.2、...)和第二连接点(11.1、11.2、...)之间的引线连接(10.1、10.2、...)的方法，使得引线(5)由固定至操纵杆(3)的毛细管(4)引导，且键合头(2)使操纵杆(3)的移动具有总共三个自由度，所述方法包括下述步骤：
-将伸出毛细管(4)的引线熔化为球，
-计算水平面上的二维矢量v，二维矢量v从毛细管(4)的在第一连接点(9.1、9.2、...)上的所需作用点指向毛细管(4)的在第二连接点(11.1、11.2、...)上的所需作用点，
-第一连接点(9.1、9.2、...)上的凸起通过以下方式形成：
-将球贴到第一连接点(9.1、9.2、...)上，以及
-将毛细管(4)沿着由矢量v与垂直线所形成的平面中的行进路径移动，从而在矢量v的方向上对准并且之后剥离引线，
-将毛细管(4)移回到刚产生的凸起上，
-将伸出毛细管(4)的引线贴到凸起上，
-将引线拉出所需的长度，且将引线贴到第二连接点(11.1、11.2、...)上。
CNA2005100037435A 2004-01-09 2005-01-05 用于产生楔形－楔形引线连接的方法 Pending CN1638077A (zh)

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CN104813455B (zh) * 2012-11-16 2017-11-21 株式会社新川 引线接合装置以及半导体装置的制造方法
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