CN1635613A - 一种避免漩涡效应缺陷的方法 - Google Patents
一种避免漩涡效应缺陷的方法 Download PDFInfo
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- CN1635613A CN1635613A CN 200310109860 CN200310109860A CN1635613A CN 1635613 A CN1635613 A CN 1635613A CN 200310109860 CN200310109860 CN 200310109860 CN 200310109860 A CN200310109860 A CN 200310109860A CN 1635613 A CN1635613 A CN 1635613A
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- Prior art keywords
- copper
- avoiding
- seed layer
- eddy effect
- effect defective
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Claims (13)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101098600A CN1326216C (zh) | 2003-12-30 | 2003-12-30 | 一种避免漩涡效应缺陷的方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CNB2003101098600A CN1326216C (zh) | 2003-12-30 | 2003-12-30 | 一种避免漩涡效应缺陷的方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1635613A true CN1635613A (zh) | 2005-07-06 |
CN1326216C CN1326216C (zh) | 2007-07-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2003101098600A Expired - Fee Related CN1326216C (zh) | 2003-12-30 | 2003-12-30 | 一种避免漩涡效应缺陷的方法 |
Country Status (1)
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CN (1) | CN1326216C (zh) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3628170B2 (ja) * | 1998-03-04 | 2005-03-09 | 株式会社荏原製作所 | めっき装置 |
US6558518B1 (en) * | 1999-07-08 | 2003-05-06 | Ebara Corporation | Method and apparatus for plating substrate and plating facility |
US6627542B1 (en) * | 1999-07-12 | 2003-09-30 | Applied Materials, Inc. | Continuous, non-agglomerated adhesion of a seed layer to a barrier layer |
JP2001049494A (ja) * | 1999-08-11 | 2001-02-20 | Ebara Corp | めっき装置 |
US6660153B2 (en) * | 2000-10-20 | 2003-12-09 | Shipley Company, L.L.C. | Seed layer repair bath |
US6664122B1 (en) * | 2001-10-19 | 2003-12-16 | Novellus Systems, Inc. | Electroless copper deposition method for preparing copper seed layers |
-
2003
- 2003-12-30 CN CNB2003101098600A patent/CN1326216C/zh not_active Expired - Fee Related
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Publication number | Publication date |
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CN1326216C (zh) | 2007-07-11 |
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Legal Events
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C06 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111205 |
|
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20111205 Address after: 201203 Shanghai Zhangjiang Road, Zhangjiang High Tech Park of Pudong New Area No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai Zhangjiang Road, Zhangjiang High Tech Park of Pudong New Area No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20070711 Termination date: 20181230 |
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CF01 | Termination of patent right due to non-payment of annual fee |