CN1635583A - Leadless medium slurry and making method - Google Patents
Leadless medium slurry and making method Download PDFInfo
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- CN1635583A CN1635583A CN 200310110339 CN200310110339A CN1635583A CN 1635583 A CN1635583 A CN 1635583A CN 200310110339 CN200310110339 CN 200310110339 CN 200310110339 A CN200310110339 A CN 200310110339A CN 1635583 A CN1635583 A CN 1635583A
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- lead
- percentage
- weight
- glass powder
- organic solvent
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- Granted
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 239000002002 slurry Substances 0.000 title claims description 30
- 239000000843 powder Substances 0.000 claims abstract description 34
- 239000011521 glass Substances 0.000 claims abstract description 32
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 239000002245 particle Substances 0.000 claims abstract description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 10
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 8
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 claims abstract description 8
- JKWMSGQKBLHBQQ-UHFFFAOYSA-N diboron trioxide Chemical compound O=BOB=O JKWMSGQKBLHBQQ-UHFFFAOYSA-N 0.000 claims abstract description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract 4
- 238000002156 mixing Methods 0.000 claims abstract 4
- 239000000945 filler Substances 0.000 claims description 26
- 239000003960 organic solvent Substances 0.000 claims description 22
- 238000004519 manufacturing process Methods 0.000 claims description 15
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 9
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 7
- 239000011707 mineral Substances 0.000 claims description 7
- CSSYLTMKCUORDA-UHFFFAOYSA-N barium(2+);oxygen(2-) Chemical compound [O-2].[Ba+2] CSSYLTMKCUORDA-UHFFFAOYSA-N 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 6
- 238000005303 weighing Methods 0.000 claims description 6
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 5
- 238000007639 printing Methods 0.000 claims description 5
- 239000011734 sodium Substances 0.000 claims description 5
- ODINCKMPIJJUCX-UHFFFAOYSA-N Calcium oxide Chemical compound [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims description 4
- 239000013530 defoamer Substances 0.000 claims description 4
- 238000005096 rolling process Methods 0.000 claims description 4
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 claims description 3
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 claims description 3
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical group CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 claims description 3
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 claims description 3
- 150000002148 esters Chemical class 0.000 claims description 3
- -1 isopropyl alcohols Chemical class 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229940116411 terpineol Drugs 0.000 claims description 3
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004925 Acrylic resin Substances 0.000 claims description 2
- 229920000178 Acrylic resin Polymers 0.000 claims description 2
- 239000001856 Ethyl cellulose Substances 0.000 claims description 2
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 claims description 2
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- FZFYOUJTOSBFPQ-UHFFFAOYSA-M dipotassium;hydroxide Chemical compound [OH-].[K+].[K+] FZFYOUJTOSBFPQ-UHFFFAOYSA-M 0.000 claims description 2
- 229920001249 ethyl cellulose Polymers 0.000 claims description 2
- 235000019325 ethyl cellulose Nutrition 0.000 claims description 2
- 239000012530 fluid Substances 0.000 claims description 2
- 229910001947 lithium oxide Inorganic materials 0.000 claims description 2
- 239000011812 mixed powder Substances 0.000 claims description 2
- JKQOBWVOAYFWKG-UHFFFAOYSA-N molybdenum trioxide Chemical compound O=[Mo](=O)=O JKQOBWVOAYFWKG-UHFFFAOYSA-N 0.000 claims description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 claims description 2
- 229920001921 poly-methyl-phenyl-siloxane Polymers 0.000 claims description 2
- 229920000193 polymethacrylate Polymers 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 claims description 2
- KKCBUQHMOMHUOY-UHFFFAOYSA-N sodium oxide Chemical compound [O-2].[Na+].[Na+] KKCBUQHMOMHUOY-UHFFFAOYSA-N 0.000 claims description 2
- 229910001948 sodium oxide Inorganic materials 0.000 claims description 2
- 239000012258 stirred mixture Substances 0.000 claims description 2
- 238000003756 stirring Methods 0.000 claims description 2
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 claims description 2
- 229910000416 bismuth oxide Inorganic materials 0.000 claims 1
- 238000001816 cooling Methods 0.000 claims 1
- TYIXMATWDRGMPF-UHFFFAOYSA-N dibismuth;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Bi+3].[Bi+3] TYIXMATWDRGMPF-UHFFFAOYSA-N 0.000 claims 1
- 239000008187 granular material Substances 0.000 claims 1
- 239000011787 zinc oxide Substances 0.000 abstract description 3
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 abstract 1
- KEAYESYHFKHZAL-UHFFFAOYSA-N Sodium Chemical compound [Na] KEAYESYHFKHZAL-UHFFFAOYSA-N 0.000 abstract 1
- 229910001864 baryta Inorganic materials 0.000 abstract 1
- 229910052810 boron oxide Inorganic materials 0.000 abstract 1
- 229910052814 silicon oxide Inorganic materials 0.000 abstract 1
- 238000005245 sintering Methods 0.000 description 12
- 229910004298 SiO 2 Inorganic materials 0.000 description 6
- 239000000047 product Substances 0.000 description 5
- 230000007613 environmental effect Effects 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000002310 reflectometry Methods 0.000 description 3
- 230000001105 regulatory effect Effects 0.000 description 3
- 229910007472 ZnO—B2O3—SiO2 Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000000292 calcium oxide Substances 0.000 description 2
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000005308 flint glass Substances 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000005331 crown glasses (windows) Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 235000021180 meal component Nutrition 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910000510 noble metal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000036314 physical performance Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C3/00—Glass compositions
- C03C3/04—Glass compositions containing silica
- C03C3/062—Glass compositions containing silica with less than 40% silica by weight
- C03C3/064—Glass compositions containing silica with less than 40% silica by weight containing boron
- C03C3/066—Glass compositions containing silica with less than 40% silica by weight containing boron containing zinc
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Glass Compositions (AREA)
Abstract
This invention relates to leadless medium plasm and its process method, which comprises leadless glass powder, filling stuff and organic agent. The said leadless glass powder particle is less than five micron and comprises the following: baryta, boron oxide, zinc oxide, natrium oxide and kalium oxide. The said filling stuff is silicon oxide and alumina mixture particles. The process method comprises the following steps: processing leadless glass powder; processing filling stuff; mixing the leadless glass powder and filling stuff; mixing and blending the mixture and the organic agent; processing the mixture into the leadless medium plasm through pressing.
Description
Technical field
The present invention relates to a kind of dielectric paste and manufacture method thereof, particularly a kind of adopt lead-free glass powder modulation be used to make vacuum fluorescent display (VFD), the dielectric paste of plasma display (PDP) and the preparation method of this dielectric paste.
Background technology
In recent years; along with vacuum fluorescent display (VFD), plasma display (PDP) are applied to all kinds of occasions more and more as flat-panel display device; make its market demand increase day by day, simultaneously, the research field of impelling associated materials is Showed Very Brisk also.Because people are to the enhancing day by day of the deep understanding of environmental protection and protection consciousness, this series products is being produced, may also caused social extensive concern to the problem that influences that natural environment and people's work, life cause in the recycling process.
In the inside of vacuum fluorescent display (VFD), a dielectric layer is arranged between anode wiring layer and the anode.In the inside of plasma display (PDP), be provided with transparent dielectric layer between bus electrode and the discharge space, simultaneously, the back glass substrate inner surface also be laid with reflecting medium layer.
Dielectric layer and transparent dielectric layer, reflecting medium layer all are in manufacture process, with the dielectric paste collective surface that is laid in, make by sintering again.The main component of dielectric paste is a glass dust.
Traditional dielectric paste normally adopts the flint glass powder, and its main component is PbO-SiO
2-B
2O
3Content plumbous in this dielectric paste generally surpasses 50%.Adopt the flint glass powder to make the pollution in the production process bigger, lead also reacts easily in sintering process, and the recovery of waste and old device is also comparatively difficult.The more important thing is, because plumbous pollution to environment makes and adopts the method for this made dielectric paste can not satisfy people to environmental protection institute requirement.
At present, external existing on a small quantity about the open report of lead-free medium slurry, mainly contain ZnO-B
2O
3-SiO
2Series, ZnO-Bi
2O
3-B
2O
3Series, P
2O
5Series and V
2O
5-ZnO-B
2O
3Series.
ZnO-B
2O
3-SiO
2The sintering temperature of series is higher, and contains a large amount of fillers in the composition of slurry, and cost is increased.
ZnO-Bi
2O
3-B
2O
3Contain a large amount of noble metal Bi in the series slurry, so price is more expensive.
P
2O
5Series: as P
2O
5-Al
2O
3-B
2O
3, P
2O
5-ZnO-Na
2O, P
2O
5-ZnO-BaO, the water-resistance of this series slurry is poor.
V
2O
5-ZnO-B
2O
3The color and the compatibility of series slurry are relatively poor.
Because the interior continuous increase of world wide to environmental requirement, restriction to harmful components such as lead contained in vacuum fluorescent display (VFD), plasma display (PDP) device also constantly increases, for example, the deadline date that products containing lead is used in restriction has been announced in Europe, therefore, make not leaded, do not contain precious metal, and have good serviceability, manufacturing property and cheap dielectric paste, now become one of major issue that the personage needed to be resolved hurrily of vacuum fluorescent display (VFD), plasma display (PDP) manufacturing.
Summary of the invention
Main purpose of the present invention is to provide a kind of lead-free medium slurry at the existing deficiency of present employed dielectric paste, does not contain PbO, P in this dielectric paste
2O
5Or V
2O
5, in product processing, there is not harmfulness, help the recovery of environmental protection and waste and old device simultaneously.
Another object of the present invention is to provide the manufacture method of above-mentioned lead-free medium slurry, can produce the different medium slurry that is used for vacuum fluorescent display (VFD), plasma display (PDP) different medium layer easily by this method.
The objective of the invention is to be achieved through the following technical solutions:
A kind of lead-free medium slurry is by lead-free glass powder at least, is used to improve the filler of insulation property behind the sintering and guarantees that the organic solvent of printing performance mixes, and wherein, the percentage by weight of described lead-free glass powder is 68%-76%; The percentage by weight of described filler is 6.5%-12%; The percentage by weight of described organic solvent is 17%-21%.
The granularity of lead-free glass powder should be less than 5 microns, and its main component and each composition shared percentage by weight in lead-free glass powder is respectively barium monoxide (BaO) 10%-50%, boron oxide (B
2O
3) 10%-30%, zinc oxide (ZnO) 20%-40%, sodium oxide molybdena (Na
2O) 1%-4% and potassium oxide (K
2O) 1%-6%.
The granularity of filler can adopt the percentage by weight in filler to be no more than 20% silica (SiO also less than 5 microns
2) and aluminium oxide (Al
2O
3) particle be mixed and made into, perhaps adopt percentage by weight to be no more than 20% silica (SiO
2) with percentage by weight be that the particle of the mineral black of 60%-80% is mixed and made into, above three kinds of particles can also be mixed the composition filler simultaneously.
In lead-free glass powder, can also add percentage by weight and be no more than 3% lithia (Li
2O) or percentage by weight be no more than 12% calcium oxide (CaO) or percentage by weight and be no more than 10% silica (SiO
2) or percentage by weight be no more than 10% aluminium oxide (Al
2O
3) or these compositions are carried out combination in any, be used to adjust every physical property of lead-free glass powder.
Organic solvent is that terpinol or terpineol or butyl carbitol or butyric acid butyl card must ester or isopropyl alcohols; The content of described organic solvent is that 91%-95% and content are the toluene of 91%-95%.
The manufacture method of above-mentioned lead-free medium slurry may further comprise the steps at least: prepare described lead-free glass powder; Prepare described filler; Described lead-free glass powder and described filler are mixed according to the proportioning weighing; Compound is mixed stirring with the described organic solvent that takes by weighing according to proportioning; With institute's stirred mixture through making described lead-free medium slurry through the roller mill rolling.
As shown from the above technical solution, do not contain the material that can pollute and endanger environment in each component of the present invention, and can not damage in process of production yet, be convenient to manipulate manufacturer.
Embodiment
Below, by discussing and in conjunction with specific embodiments the present invention being described in more details.
The present invention is the lead-free product that is used for VFD and the upward alternative leaded dielectric paste of PDP.Because dielectric paste is the insulation property that guarantee between conductive layer and other associated components in function main on VFD and the PDP, therefore require this material that good covering is arranged, for stablizing of guaranteed performance and technology, need consider that also dielectric paste must have the coefficient of expansion that adapts with substrate; Must guarantee repeatedly do not damaging other parts in the sintering; Must have the good insulation performance; Also to guarantee the smooth of its surface at last.
Composition of the present invention mainly comprises three parts: lead-free glass powder, filler and organic solvent.
The main component of lead-free glass powder is BaO, B
2O
3, ZnO, Na
2O, K
2O.Its function is for guaranteeing the key property of slurry, as thermal coefficient of expansion, sintering temperature and insulation property etc.
Table 1 is the composition table of 6 preferred embodiments of lead-free glass powder involved in the present invention, and wherein, what percentage was represented is weight percentage.
Table 1: crown glass meal component
| The component molecules formula | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 |
| ????BaO | ????38％ | ????18.5％ | ????31.5％ | ????22％ | ????27％ | ????34％ |
| ????B 2O 3 | ????20％ | ????29％ | ????16.7％ | ????19％ | ????16％ | ????13％ |
| ????ZnO | ????20％ | ????38％ | ????25.9％ | ????35％ | ????33％ | ????35％ |
| ????CaO | ????6.1％ | ????3％ | ????4％ | ????5％ | ????10％ | ????- |
| ????Na 2O | ????1.6％ | ????2％ | ????1.2％ | ????2.2％ | ????2.6％ | ????2.4％ |
| ????K 2O | ????2.1％ | ????4.6％ | ????2.4％ | ????3.8％ | ????4.2％ | ????5.3％ |
| ????Li 2O | ????1.9％ | ????1％ | ????2.1％ | ????2.5％ | ????2.4％ | ????2.7％ |
| ????Al 2O 3 | ????5％ | ????- | ????6％ | ????7％ | ????1.9％ | ????3.4％ |
| ????SiO 2 | ????5.3％ | ????1.9％ | ????8.7％ | ????3.5％ | ????2.9％ | ????4.2％ |
| ????Bi 2O 3 | ????- | ????2％ | ????1.5％ | ????- | ????- | ????- |
In the various embodiments described above, by adjust each component in lead-free glass powder percentage by weight and by adding a spot of Li
2O, CaO, SiO
2, Al
2O
3, Bi
2O
3Every key property index of lead-free glass powder is adjusted.Wherein, the thermal coefficient of expansion scope is 65-95 * 10
-71/ ℃.The scope of sintering temperature is 550-590 ℃.Insulation resistance must be greater than 10
12Ω.
In the present invention institute, the state of filler requires to be the fine powder of particle diameter less than 5 microns, and its composition is to require color behind (reflectivity or transmitance), insulation property, the sintering and definite according to different application scenarios, different process conditions and according to thermal coefficient of expansion, optical property.The main component of filler is Al
2O
3, SiO
2, mineral black.These three kinds of compositions are with SiO
2Be main, it can be respectively and Al
2O
3, mineral black mixes, and also these three kinds of compositions can be mixed simultaneously, the weight proportion in its each comfortable filler also is to adjust according to concrete application requirements.For example: mainly the acting as of mineral black regulated the color behind the sintering.Al
2O
3Can regulate thermal coefficient of expansion and reflectivity behind the slurry sintering.SiO
2Powder can be regulated the printing performance of slurry and the insulation property behind the sintering.Can also add titanium dioxide in filler, titanium dioxide can be regulated the reflectivity of medium.
The main effect of the organic solvent that is adopted among the present invention is the printing performance that guarantees slurry, its main component be terpinol, terpineol, butyl carbitol, butyric acid butyl card must ester, isopropyl alcohol or toluene, various organic solvent contents require to be 91%-95%.Can also add ethyl cellulose, NC Nitroncellulose, acrylic resin or butyral resin in organic solvent, its percentage by weight in organic solvent is 2%-5%, is used to regulate the viscosity of organic solvent.In organic solvent, can also add organic silicide as defoamer.Defoamer mainly contains methyl silicate, tetraethyl orthosilicate or polymethylphenyl siloxane fluid etc., and its percentage by weight in organic solvent is 0.05%-0.2%.Can reduce the pore that dielectric paste produces by adding defoamer after printing, guarantee its insulation property.In addition, add percentage by weight and be no more than mouldability and the levelability that 2% polymethacrylates or DBP can improve dielectric paste.
Classify the related physical performance of composition example and each example of 6 dielectric pastes provided by the present invention in the table 2 as.
Manufacture method of the present invention is: glass dust and filler were mixed 90 minutes on the V-arrangement batch mixer back well by required proportioning weighing, by the proportioning that is fit to mixed powder and adhesive are put into slurry tank then and stirred on blender 30-45 minute, products obtained therefrom gets final product after the roller mill rolling.
The proportioning of table 2 dielectric paste and performance
| Composition or performance | Example 1 | Example 2 | Example 3 | Example 4 | Example 5 | Example 6 |
| Glass dust | 68％ | 70％ | 72％ | 70％ | 70％ | 78％ |
| Al 2O 3Powder | 1％ | 1％ | - | 1％ | 4％ | 1％ |
| SiO 2Powder | 3％ | 2％ | 2％ | 2％ | 2％ | 2％ |
| Mineral black | 8％ | 8％ | 8％ | - | - | - |
| Titanium dioxide | - | - | - | 8％ | 5％ | - |
| Adhesive | 20％ | 19％ | 18％ | 19％ | 19％ | 19％ |
| Density kg/m 3 | 2.36×10 3 | 2.51×10 3 | 2.60×10 3 | 2.46×10 3 | 2.43×10 3 | 2.38×10 3 |
| Thermal coefficient of expansion (1/ ℃) | 90.1×10 -7 | 70.5×10 -7 | 84.1×10 -7 | 74.1×10 -7 | 78.9×10 -7 | 86.3×10 -7 |
| The sintering temperature (℃) | 570-590 | 550-590 | 560-590 | 550-590 | 560-590 | 550-590 |
| Leak electricity (nA) | ＜50 | ＜100 | ＜80 | ＜80 | ＜80 | ＜80 |
| Breakdown potential (V) | ＞1200 | ＞1200 | ＞1200 | ＞1200 | ＞1200 | ＞1200 |
| The porosity | Do not have | ＜3 | ＜2 | Do not have | Do not have | Do not have |
In the above-mentioned table 2, example 1, example 2, example 3 may be used to make the dielectric layer 1-2 of VFD shown in Figure 1.Example 4, example 5 may be used to make the reflecting medium layer 2-4 of PDP shown in Figure 2.Example 6 is used to make the transparent dielectric layer 2-2 of PDP shown in Figure 2.
It should be noted last that: above embodiment is the unrestricted technical scheme of the present invention in order to explanation only, although the present invention is had been described in detail with reference to the foregoing description, those of ordinary skill in the art is to be understood that: still can make amendment or be equal to replacement the present invention, and not breaking away from any modification or partial replacement of the spirit and scope of the present invention, it all should be encompassed in the middle of the claim scope of the present invention.
Claims (14)
1, a kind of lead-free medium slurry is characterized in that: it is by lead-free glass powder at least, is used to improve the filler of insulation property and guarantees that the organic solvent of printing performance mixes, and wherein, the percentage by weight of described lead-free glass powder is 68%-76%; The percentage by weight of described filler is 6.5%-12%; The percentage by weight of described organic solvent is 17%-21%;
The granularity of described lead-free glass powder is less than 5 microns, and its main component and each composition shared percentage by weight in lead-free glass powder is respectively barium monoxide (BaO) 10%-50%, boron oxide (B
2O
3) 10%-30%, zinc oxide (ZnO) 20%-40%, sodium oxide molybdena (Na
2O) 1%-4% and potassium oxide (K
2O) 1%-6%;
To be granularity be no more than 20% silica (SiO less than 5 microns and percentage by weight in described filler to described filler
2) and aluminium oxide (Al
2O
3) blend of granules whose.
2, lead-free medium slurry according to claim 1 is characterized in that: comprise also in the described lead-free glass powder that percentage by weight is no more than 3% lithia (Li
2O) or percentage by weight be no more than 12% calcium oxide (CaO) or percentage by weight and be no more than 10% silica (SiO
2) or percentage by weight be no more than 10% aluminium oxide (Al
2O
3) or its combination in any.
3, lead-free medium slurry according to claim 1 and 2 is characterized in that: can also comprise in the described lead-free glass powder that percentage by weight is no more than 5% bismuth oxide (Bi
2O
3).
4, lead-free medium slurry according to claim 1 is characterized in that: described filler can also replace with granularity and be no more than 20% silica (SiO less than 5 microns and percentage by weight in described filler
2) with percentage by weight be the mineral black hybrid particles of 60%-80%.
5, lead-free medium slurry according to claim 1 is characterized in that: can also sneak into granularity in the described filler is that mineral black particle or the percentage by weight of 60%-80% is no more than 20% titanium dioxide particle or its hybrid particles less than 5 microns and percentage by weight in described filler.
6, lead-free medium slurry according to claim 4 is characterized in that: described filler comprises that also granularity is no more than 20% aluminium oxide (Al less than 5 microns and percentage by weight in described filler
2O
3) particle or titanium dioxide particle or described aluminium oxide (Al
2O
3) with the hybrid particles of described titanium dioxide.
7, lead-free medium slurry according to claim 1 is characterized in that: described organic solvent is that terpinol or terpineol or butyl carbitol or butyric acid butyl card must ester or isopropyl alcohols; The content of described organic solvent is 91%-95%.
8, according to claim 1 or 2 or the arbitrary described lead-free medium slurry of 4-7, it is characterized in that: comprise also in the described organic solvent that content is the toluene of 91%-95%.
9, according to claim 1 or 2 or the arbitrary described lead-free medium slurry of 4-7, it is characterized in that: ethyl cellulose or NC Nitroncellulose or the acrylic resin or the butyral resin that also can add 2%-5% in the described organic solvent.
10, according to claim 1 or 2 or the arbitrary described lead-free medium slurry of 4-7, it is characterized in that: can also add in the described organic solvent that its percentage by weight that is used for influence liquidity is no more than 2% polymethacrylates or DBP and be methyl silicate or tetraethyl orthosilicate or the polymethylphenyl siloxane fluid of 0.05%-2% as its percentage by weight of defoamer.
11, a kind of manufacture method of making the arbitrary described lead-free medium slurry of claim 1-10, it is characterized in that: it may further comprise the steps:
Step 1: prepare described lead-free glass powder;
Step 2: according to the described filler of set of dispense ratio preparation;
Step 3: described lead-free glass powder and described filler are mixed according to the proportioning weighing;
Step 4: compound in the step 3 is mixed stirring with the described organic solvent that takes by weighing according to proportioning;
Step 5: institute's stirred mixture is made described lead-free medium slurry through the roller mill rolling.
12, manufacture method according to claim 11, it is characterized in that: described step 1 is that each composition that will form lead-free glass powder takes by weighing the fusing of mixing back according to proportioning, cooling is after the roller mill rolling, grinds and sieve to make granularity less than 5 microns described lead-free glass powder.
13, manufacture method according to claim 11 is characterized in that: described step 3 is to mix 90 minutes on the V-arrangement batch mixer.
14, manufacture method according to claim 11 is characterized in that: described step 4 is mixed powder and described organic solvent to be put into jar stirred on blender 30-45 minute.
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| CNB2003101103399A CN100412998C (en) | 2003-12-29 | 2003-12-29 | Leadless medium slurry and making method |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2003101103399A CN100412998C (en) | 2003-12-29 | 2003-12-29 | Leadless medium slurry and making method |
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| CN1635583A true CN1635583A (en) | 2005-07-06 |
| CN100412998C CN100412998C (en) | 2008-08-20 |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101656152B (en) * | 2008-08-19 | 2011-08-17 | 达方电子股份有限公司 | Multilayer ceramic capacitor and forming method thereof |
| CN103508756A (en) * | 2013-07-17 | 2014-01-15 | 南昌大学 | Aqueous alumina medium printing slurry used for ceramic base plate and preparation method thereof |
| CN105185429A (en) * | 2015-08-07 | 2015-12-23 | 昆明贵信凯科技有限公司 | Packaging medium slurry for base-metal-contained electronic slurry and application thereof |
| CN106601392A (en) * | 2016-11-14 | 2017-04-26 | 东莞珂洛赫慕电子材料科技有限公司 | Dielectric paste matched with aluminum silicon carbide base material and preparation method for dielectric paste |
| CN110316963A (en) * | 2019-05-17 | 2019-10-11 | 有研稀土新材料股份有限公司 | A kind of fluorescent glass ceramic material and the light emitting device containing the material |
| CN113286419A (en) * | 2021-07-22 | 2021-08-20 | 西安宏星电子浆料科技股份有限公司 | Multilayer isolation medium slurry for thick film circuit |
| CN114049986A (en) * | 2021-12-28 | 2022-02-15 | 西安宏星电子浆料科技股份有限公司 | Lead-free and bismuth-free high-performance dielectric slurry |
| CN114613529A (en) * | 2022-05-07 | 2022-06-10 | 西安宏星电子浆料科技股份有限公司 | Lead-free thick film resistor paste |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000226231A (en) * | 1999-02-08 | 2000-08-15 | Okuno Chem Ind Co Ltd | Leadless low-melting glass composition |
| JP2001139345A (en) * | 1999-11-10 | 2001-05-22 | Asahi Glass Co Ltd | Leadless low melting point glass and glass frit |
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2003
- 2003-12-29 CN CNB2003101103399A patent/CN100412998C/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101656152B (en) * | 2008-08-19 | 2011-08-17 | 达方电子股份有限公司 | Multilayer ceramic capacitor and forming method thereof |
| CN103508756A (en) * | 2013-07-17 | 2014-01-15 | 南昌大学 | Aqueous alumina medium printing slurry used for ceramic base plate and preparation method thereof |
| CN105185429A (en) * | 2015-08-07 | 2015-12-23 | 昆明贵信凯科技有限公司 | Packaging medium slurry for base-metal-contained electronic slurry and application thereof |
| CN106601392A (en) * | 2016-11-14 | 2017-04-26 | 东莞珂洛赫慕电子材料科技有限公司 | Dielectric paste matched with aluminum silicon carbide base material and preparation method for dielectric paste |
| CN106601392B (en) * | 2016-11-14 | 2018-11-27 | 东莞珂洛赫慕电子材料科技有限公司 | A kind of dielectric paste and preparation method thereof being adapted to aluminium silicon carbide substrate |
| CN110316963A (en) * | 2019-05-17 | 2019-10-11 | 有研稀土新材料股份有限公司 | A kind of fluorescent glass ceramic material and the light emitting device containing the material |
| CN113286419A (en) * | 2021-07-22 | 2021-08-20 | 西安宏星电子浆料科技股份有限公司 | Multilayer isolation medium slurry for thick film circuit |
| CN114049986A (en) * | 2021-12-28 | 2022-02-15 | 西安宏星电子浆料科技股份有限公司 | Lead-free and bismuth-free high-performance dielectric slurry |
| CN114049986B (en) * | 2021-12-28 | 2022-04-19 | 西安宏星电子浆料科技股份有限公司 | Lead-free and bismuth-free dielectric slurry |
| CN114613529A (en) * | 2022-05-07 | 2022-06-10 | 西安宏星电子浆料科技股份有限公司 | Lead-free thick film resistor paste |
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| CN100412998C (en) | 2008-08-20 |
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