CN1627481A - Ultrosonic cleaning nozzle and ultrosonic cleaning appts. - Google Patents

Ultrosonic cleaning nozzle and ultrosonic cleaning appts. Download PDF

Info

Publication number
CN1627481A
CN1627481A CNA2004101002532A CN200410100253A CN1627481A CN 1627481 A CN1627481 A CN 1627481A CN A2004101002532 A CNA2004101002532 A CN A2004101002532A CN 200410100253 A CN200410100253 A CN 200410100253A CN 1627481 A CN1627481 A CN 1627481A
Authority
CN
China
Prior art keywords
cleaning
ultrasonic
cowling panel
ultrasonic waves
peristome
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2004101002532A
Other languages
Chinese (zh)
Other versions
CN100485878C (en
Inventor
三森健一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Publication of CN1627481A publication Critical patent/CN1627481A/en
Application granted granted Critical
Publication of CN100485878C publication Critical patent/CN100485878C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
    • B08B3/04—Cleaning involving contact with liquid
    • B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
    • B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/1316—Methods for cleaning the liquid crystal cells, or components thereof, during manufacture: Materials therefor

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Nonlinear Science (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning By Liquid Or Steam (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

Provided is an ultrasonic washing apparatus capable of removing stain firmly stuck to a treating object by applying ultrasonic wave of a low frequency to a washing solution, applying ultrasonic wave of wide range frequencies of about 20kHz-10MHz, and of applying uniform washing treatment with small amount of the washing solution. This washing apparatus comprises a vibration plate (3a); an ultrasonic vibrator (5) fixed to the vibration plate (3a); a bottom plate (9) facing an opposite side of the vibrator fixing face of the vibration plate (3a) with a space (7); a washing solution supply means supplying the washing solution to the space (7); and a flow straightening plate (10) provided at an opening part formed at the bottom plate (9), and having a lot of holes (10a). A plate thickness of the straightening plate (10) is set to a range of 5 [mu]m to [lambda]/10. The apparatus is provided with the ultrasonic washing nozzle (1) having a control means for controlling the ultrasonic washing solution (11a) formed by applying ultrasonic vibration oscillated by the vibrator (5) to the washing solution (11), to flow as a continuous flow from the opening part.

Description

Ultrasonic waves for cleaning nozzle and ultrasonic cleaning equipment
Technical field
The present invention relates to a kind of ultrasonic waves for cleaning with nozzle with have the ultrasonic cleaning equipment of this nozzle, this ultrasonic waves for cleaning is used for the apparatus for manufacturing substrate of semiconductor-fabricating device, liquid crystal indicator etc. with nozzle, and is used for liquid crystal indicator is carried out clean with substrate, thermal head (サ-マ Le ヘ Star De) with the substrate surface of ceramic substrate, printed circuit board (PCB), semiconductor wafer, film substrate, becket (hoop) material and electronic unit etc. with square glass substrate, glass base plate for color filter, photomask.
Background technology
A kind of as cleaning device has the position that the processing unit of implementing video picture, etching, peeling off etc. is set on base material, carry out the device of the cleaning of the removal of the treatment fluid that uses in the base material treatment and substrate surface.
As this cleaning device, the slot-type device that is provided with oscillator on the bottom surface is arranged.The grooved cleaning device uses the ultrasonic wave of about 20kHz～2MHz wide region frequency band, makes the clean of base material in groove.The pollutant that carries out the base material of clean is fingerprint and particulate etc.
As other cleaning devices, device shown in Figure 16 (for example, with reference to patent documentation 1) is arranged.This cleaning device provides the ultrasonic vibration of the upper frequency of about 800kHz～3MHz to the cleaning fluid of filling in ultrasonic waves for cleaning portion main body 101 by the oscillator 104 that is provided with in main body 101, supply with cleaning fluid 110 that ultrasonic vibration be provided along the Width of the substrate (base material) 100 that moves horizontally by a plurality of carrying rollers (diagram slightly) by the curtain shape to the below of outlet 107 from the outlet 107 of narrow slit shape, and remove the particulate that on substrate 100, adheres to.Outlet 107 be 1mm wide about.
In addition, as other cleaning devices, device shown in Figure 17 (for example, with reference to patent documentation 2) is arranged.
In this cleaning device, with the big particulate in removing on a large scale is purpose, and the cleaning fluid 120 of discharging the low-frequency band ultrasonic vibration that has applied 20kHz～700kHz to substrate (base material) 200 by the ultrasonic nozzle portion 115 from a hole (spot) type carries out the ultrasonic waves for cleaning processing.In addition, among Figure 17, symbol 116 is the oscillators that have in the ultrasonic nozzle portion.
Open the flat 10-209104 of communique number of [patent documentation 1] Japan Patent
Open the flat 10-64868 of communique number of [patent documentation 2] Japan Patent
In the cleaning of using existing grooved cleaning device, can use broadband (20kHz～2MHz), under the situation of the glass blank substrate after clean polluting extremely serious processing etc., provide the suitable cleaning fluid and the ultrasonic wave of low-frequency band (frequency of 28kHz, 40kHz) to clean.In addition, provide a little less than the cleaning force but the ultrasonic wave of the high frequency band that can evenly clean (mega sonic wave メ ガ ソ ニ Star Network) with the cleaning of square glass substrate, made not deterioration such as the metal film that forms circuit for the liquid crystal indicator that has formed circuit.
But, under the situation of using existing grooved cleaning device, in case the particulate that falls into spreads in groove, and adhere to once more easily, so be difficult to obtain the high surface of cleanliness factor.In addition, used in the ultrasonic waves for cleaning of low-frequency band, it is inhomogeneous to occur cleaning easily, as its countermeasure, must shake substrate, follows the maximization of groove etc., and as a result of, cleaning device has also maximized.In addition, big if substrate becomes in the cleaning of using existing slot-type device, it is poor that then the topmost of bottom land (approaching the part of oscillating plate) and groove produces acoustic pressure, and the problem that can not evenly clean is arranged.
Under the situation of removing the less particulate of adhesive force more equably, provide high frequency band hyperacoustic cleaning device shown in Figure 16 though can use, but this cleaning device exists and the problem of the situation of the particulate that the contact area of base material is big and the spot of the comparatively robust that can not remove submicron particulate and fingerprint etc., in addition, cleaning fluid must use about 1 liter of/minute cm (every outlet unit length).
For above-mentioned so firm spot, can use provides the low-frequency band (cleaning device hyperacoustic shown in Figure 17 of about 20kHz～200kHz), but in order to transmit the ultrasonic wave of low-frequency band expeditiously to the downside of outlet 121, the diameter of its cleaning fluid outlet 121 must size be more than the 10mm, therefore, cleaning fluid also is more than 7 liters/minute, and the cleaning fluid use amount is more than 10 times of device with the outlet 107 of discharging the ultrasonic cleaning solution that mhz band is provided shown in Figure 16.
In addition, under the situation of removing the particulate that adheres on the wide substrate of 1m, if use cleaning device with wide outlet of 1mm shown in Figure 16 107, then have to use a large amount of cleaning fluids of 100 liters/minute, when being embedded into actual manufacturing process, if also will take into account the weight of employed cleaning fluid, then be very difficult.
Therefore, in the existing cleaning device, because the opening of outlet footpath is very big, the use amount of cleaning fluid is many, on the contrary, if opening directly diminishes, then ultrasonic wave can not be passed to cleaning fluid.
Especially, the ultrasonic wave that offers cleaning fluid is low frequency more, and required opening footpath is just big more, and the result is offering the ultrasonic wave below the 400kHz in the cleaning device of cleaning fluid, can not realize the device of practical water yield scope.
Summary of the invention
The present invention In view of the foregoing makes, its objective is provides a kind of ultrasonic cleaning equipment, this ultrasonic cleaning equipment can (ultrasonic wave of about 20kHz～200kHz) removes the stubbornness of adhering to and pollutes on object being treated by low-frequency band is provided to cleaning fluid, the ultrasonic wave of the wide region frequency band of about 20kHz～10MHz can also be provided cleaning fluid, and can evenly implement clean by less cleaning fluid at least.
Ultrasonic waves for cleaning nozzle of the present invention, it is characterized in that, comprise: oscillating plate, the ultrasonic oscillator of on this oscillating plate, fixing, with the face of the relative side of oscillator stationary plane of described oscillating plate on be separated by space and opposed base plate, supply with the cleaning solution supplying mechanism of cleaning fluid and have the cowling panel in a plurality of holes that on the peristome that forms on the described base plate, are provided with to described space; The thickness of slab of described cowling panel becomes the scope that 5 μ m are above, λ/10 are following (described λ is by the wavelength in the cowling panel constitute of the ultrasonic vibration of described ultrasonic oscillator vibration); Be provided with controlling organization, it can be controlled and make and to have given by the ultrasonic cleaning solution of the ultrasonic vibration of described ultrasonic oscillator vibration, to have flowed out from described peristome as Continuous Flow to the cleaning fluid of supplying with described space.
Ultrasonic waves for cleaning of the present invention is with in the nozzle, by have oscillating plate, the ultrasonic oscillator of fixing on this oscillating plate, with the face of the relative side of oscillator stationary plane of described oscillating plate on be separated by space and relative base plate, supply with the cleaning solution supplying mechanism of cleaning fluid to described space, the frequency band that runs through low frequency and take the wide region of the high frequency band to (ultrasonic vibration of about 20kHz～200kHz) can be provided the cleaning fluid of supplying with above-mentioned spatial portion.
In addition,, the area of the described relatively peristome of area of the part that wash liquid stream goes out is diminished by the cowling panel with a plurality of holes is set on the peristome of above-mentioned base plate, thus sufficient cleaning force can be obtained, and can suppress the use amount of cleaning fluid.In addition owing to even the ultrasonic wave that offers cleaning fluid is below the 400kHz, as long as the width and the aperture of the above-mentioned peristome of increase are just passable, so can realize the ultrasonic waves for cleaning nozzle of practical liquid measure scope.
Aperture by the cowling panel that is provided with on the peristome that is controlled at above-mentioned base plate, the aperture opening ratio of cowling panel and thickness, from cleaning solution supplying mechanism to flow of above-mentioned space cleaning liquid supplied etc., the cleaning fluid of supplying with above-mentioned space is flowed out from above-mentioned peristome as Continuous Flow, in addition, the liquid type of the cleaning fluid that flows out from above-mentioned peristome also can be the desirable liquid type of funnel-form etc.
In addition, by above-mentioned cowling panel is set on the peristome of above-mentioned base plate, the part that cleaning fluid flows out narrows down, but be made as the following scope in λ/10 by thickness of slab with above-mentioned cowling panel, can make ultrasonic vibrations propagate, to providing ultrasonic vibration as the cleaning fluid that Continuous Flow flows out from above-mentioned peristome.
Promptly, ultrasonic waves for cleaning of the present invention is with in the nozzle, by under above-mentioned cowling panel, cleaning fluid is flowed out and makes the thickness attenuation of cowling panel as Continuous Flow, make can't help cowling panel to be present in cowling panel under cleaning fluid carry out the reflection supersonic wave vibration, and after seeing through, provide ultrasonic vibration.
Ultrasonic waves for cleaning of the present invention is with in the nozzle, and described cowling panel preferably is convex laterally.By being this structure, compare for dull and stereotyped situation with above-mentioned cowling panel, cleaning fluid also can focus near the cowling panel central authorities easily, the liquid type that makes the cleaning fluid that flows out from above-mentioned peristome is the preceding narrow spherical of funnel-form etc., keep Continuous Flow easily, and provide ultrasonic vibration to the cleaning fluid that flows out from above-mentioned peristome easily.
Ultrasonic waves for cleaning of the present invention is with in the nozzle, under the peristome that forms on the described base plate is rectangular-shaped situation, the width of short side direction that is preferably formed as the zone (hole forms the zone) in a plurality of holes of described cowling panel be 5mm above, with scope below the identical size of width of described ultrasonic oscillator, or the peristome that forms on the described base plate for circular situation under, the diameter that is preferably formed as the zone (hole forms the zone) in a plurality of holes of described cowling panel be 5mm above, with scope below the identical size of width of described ultrasonic oscillator.
By being this structure, clean liquid measure by its stream resistance control, can suppress to make fluid volume, the cleaning zone is broadened, can efficiently provide ultrasonic vibration in addition to cleaning fluid.
Ultrasonic waves for cleaning of the present invention is with in the nozzle, and the diameter that is formed on each hole on the above-mentioned cowling panel becomes the following scope of the above 1mm of 0.001mm, and preferably the aperture opening ratio of cowling panel area is the scope below 90% more than 20% relatively.By being this structure, transmit ultrasonic vibration easily, and provide ultrasonic vibration to the cleaning fluid that from above-mentioned peristome, flows out easily as Continuous Flow.
Ultrasonic waves for cleaning of the present invention is with in the nozzle, and the central part that the distribution that is formed on a plurality of holes on the described cowling panel is preferably in cowling panel is thicker.By being this structure, can make the liquid type of the cleaning fluid that flows out from above-mentioned peristome further be controlled to be funnel-form easily.
Ultrasonic waves for cleaning of the present invention is with in the nozzle, and the surface of above-mentioned at least cowling panel is preferably formed by the material with lyophily.By being this structure, it is just easier that the liquid type of the cleaning fluid that will flow out from above-mentioned peristome is controlled to be funnel-form.
Ultrasonic waves for cleaning of the present invention is with in the nozzle, be preferably in configuration second cowling panel between the cowling panel that is arranged on the above-mentioned peristome and the above-mentioned oscillating plate, make it block above-mentioned space, and change the direction of the cleaning fluid stream on above-mentioned space, form, an end of above-mentioned cleaning fluid stream is connected to described cleaning solution supplying mechanism, the other end is connected to extraction sector, at the peristome that is communicated with described base plate midway of above-mentioned cleaning fluid stream, the thickness of slab of above-mentioned second cowling panel is more than the 5 μ m, the scope (above-mentioned λ is by the wavelength in the second cowling panel constitute of the ultrasonic vibration of described ultrasonic oscillator vibration) that λ/10 are following.By being this structure, can prevent that bubble is detained.
Ultrasonic cleaning equipment of the present invention, it is characterized in that, the ultrasonic waves for cleaning of the present invention that is provided with above-mentioned arbitrary structure is provided with this ultrasonic waves for cleaning with the peristome of the cowling panel of nozzle septal space and mobile carrying mechanism mutually on the surface of object being treated with nozzle with making, and constitutes and can go out ultrasonic cleaning solution and clean the object being treated surface with the interstitial row of nozzle to described cowling panel and object being treated surface from described ultrasonic waves for cleaning.
The present invention has following effect.
According to ultrasonic cleaning equipment of the present invention, can (ultrasonic wave of about 20kHz～200kHz) be removed attached to the stubbornness on the object being treated and is polluted by cleaning fluid being provided low-frequency band, also can provide the ultrasonic wave of the wide region frequency band of about 20kHz～10MHz, and can implement clean equably by less cleaning fluid to cleaning fluid.
Description of drawings
Fig. 1 is the stereogram of schematic configuration of the ultrasonic cleaning equipment of the expression first embodiment of the present invention.
Fig. 2 is the summary sectional arrangement drawing of the ultrasonic waves for cleaning that has of the ultrasonic cleaning equipment of presentation graphs 1 with nozzle.
The amplification view of Fig. 3 ultrasonic waves for cleaning that to be expression see Fig. 2 from the base plate side during with nozzle.
Fig. 4 is that expression uses first ultrasonic cleaning equipment to clean the key diagram of the method for processed substrate.
Fig. 5 is that expression uses first ultrasonic cleaning equipment to clean the key diagram of the method for processed substrate.
Fig. 6 is the amplification view of another example of the cowling panel that has in the expression peristome of second ultrasonic waves for cleaning with nozzle.
Fig. 7 is the summary sectional arrangement drawing of the ultrasonic waves for cleaning that has of the ultrasonic cleaning equipment of presentation graphs 1 with another example of nozzle.
Fig. 8 is the summary sectional arrangement drawing of the ultrasonic waves for cleaning that has of the ultrasonic cleaning equipment of presentation graphs 1 with another example of nozzle.
Fig. 9 is the summary sectional arrangement drawing of the ultrasonic waves for cleaning that has of the ultrasonic cleaning equipment of presentation graphs 1 with another example of nozzle.
Figure 10 is the summary sectional arrangement drawing of the ultrasonic waves for cleaning that has of ultrasonic cleaning equipment of the expression second embodiment of the present invention with nozzle.
Figure 11 is the ultrasonic waves for cleaning that has of ultrasonic cleaning equipment of the expression second embodiment of the present invention another routine summary sectional arrangement drawing with nozzle.
Figure 12 is the ultrasonic waves for cleaning that has of ultrasonic cleaning equipment of the expression second embodiment of the present invention another routine summary sectional arrangement drawing with nozzle.
Figure 13 is the stereogram of schematic configuration of the ultrasonic cleaning equipment of expression second embodiment of the invention.
Figure 14 is the summary sectional arrangement drawing of the ultrasonic waves for cleaning that has of ultrasonic cleaning equipment of expression Figure 13 with nozzle.
Figure 15 is the amplification view of ultrasonic waves for cleaning during with nozzle of seeing Figure 14 from the base plate side.
Figure 16 is the summary construction diagram of the example of the existing cleaning device of expression.
Figure 17 is the profile of another routine part of existing cleaning device.
Embodiment
Below, use accompanying drawing to describe embodiments of the invention in detail.
The present invention is not limited to the embodiment that the following describes certainly, and,, easy in the following accompanying drawing for mark on accompanying drawing for the engineer's scale of each component part, each component part is changed engineer's scale put down in writing.
(first embodiment)
Fig. 1 is the stereogram of schematic configuration of the ultrasonic cleaning equipment of expression first embodiment, Fig. 2 is the ultrasonic waves for cleaning that has in the ultrasonic cleaning equipment of the presentation graphs 1 summary sectional arrangement drawing with nozzle, and Fig. 3 is the amplification view of ultrasonic waves for cleaning during with nozzle of seeing Fig. 2 from the base plate side that is provided with cowling panel.
The ultrasonic waves for cleaning that the ultrasonic cleaning equipment of present embodiment is provided with embodiments of the invention with nozzle 1, be provided with this ultrasonic waves for cleaning with the peristome 9a of the aftermentioned cowling panel 10 of nozzle 1 at processed substrate (object being treated) but phase septal space and mobile carrying mechanism 30 on 20 the surface, load the turntable 25 of processed substrate 20, and can go out ultrasonic cleaning solution 11a and clean processed substrate surface with the interstitial row of nozzle 1 from ultrasonic waves for cleaning to cowling panel 10 and processed substrate surface.
Ultrasonic waves for cleaning is constituted as ultrasonic oscillator accommodation section (basket) 3 with long case shape with nozzle 1, that holds in this ultrasonic oscillator accommodation section 3 binds bright ten thousand (the ラ Application ジ ユ バ Application) oscillator (ultrasonic oscillator) 5 of bolt and outside at the lower plate 3a of the oscillating plate of double as ultrasonic oscillator accommodation section 3 be separated by space 7 and the base plate 9 of relative configuration, supply with the cleaning solution supplying mechanism of cleaning fluid 11 to space 7, with the cowling panel 10 that on the OBL peristome 9a that is formed at the plan view on the base plate 9, is provided with as main body.
The material of oscillating plate 3a also determines according to the kind of the cleaning fluid 11 of supplying with spatial portion 7, for example, at cleaning fluid is under the situation of water, use stainless steel, surface-treated stainless steel, at cleaning fluid is under the situation of acid or alkali, uses the metal material applied sapphire, raffinal or PTFE (tetrafluoroethylene resin), pottery, quartz glass etc.
The thickness t of oscillating plate 3a is different because of used ultrasonic oscillator, but for example in the scope of thickness t below the above 3mm of 0.03mm, can select suitable thickness to use to the ultrasonic oscillator of 20kHz～10MHz.
Fixedly bind bolt langevin transducer (BLT) 5 in the inside of this oscillating plate 3a.Therefore, in the present embodiment, the inside of oscillating plate 3a is the oscillator stationary plane, and the outside is the face with oscillator stationary plane opposition side.
Bind bolt langevin transducer 5 and be roughly cylindric, the roughly column of cubic etc. roughly, as shown in Figure 2, configuration two piezoelectricity chinaware 5c, 5d between metal derby 5a, 5b, apply the biasing of compression stress to these piezoelectricity chinawares 5c, 5d by bolt 6, in addition, copper coin 5e is between piezoelectricity chinaware 5c, 5d.
Polarity makes up piezoelectricity chinaware 5c, 5d on the contrary, makes the electricity parallel connection drive.Power supply is connected to piezoelectricity chinaware 5c, 5d.
In addition, above-mentioned piezoelectricity chinaware is not limited to 2, also can be a plurality of.
As shown in Figure 2, with the face of the relative side of oscillator stationary plane of oscillating plate 3a be provided with space 7 between the base plate 9 of configuration relatively therewith, supply with cleaning fluids 11 to this space 7 by cleaning solution supplying mechanism.Above-mentioned cleaning solution supplying mechanism is made of the cleaning solution supplying pipe 12a that is connected to space 7, the cleaning solution supplying source (diagram slightly) that is connected to this supply pipe 12a.In addition, the flow adjusting mechanism (diagram slightly) of cleaning fluid is set in this cleaning solution supplying mechanism, can controls flow to space 7 cleaning liquid supplied.
The gap in above-mentioned space 7 (distances that oscillating plate 3a and cowling panel are 10) is 1mm to about the 7.5mm.
As cleaning fluid 11, can suitably select to use according to the kind of processed substrate 20 and the spot that adheres to thereon, for example, be Al for glass substrate, pollutant at processed substrate 20 2O 3Under the situation of grounds travel, use ammonia spirit, hydrogen water, the hydrogen water that adds ammoniacal liquor, the ammonia spirit after the degasification etc., is under the organic situation at processed substrate 20 for silicon substrate, pollutant, uses Ozone Water, has added the sour Ozone Water and the NaOH aqueous solution etc.
To the quantity delivered of the cleaning fluid 11 in space 7 preferably every 10mm of nozzle length (length direction of peristome) be about 1 liter/minute below.
In addition, the spot that adheres on according to processed substrate 20 of cleaning fluid 11 uses the liquid of having controlled PH better aspect can efficiently cleaning by liquid measure seldom.
In addition, in space 7, be provided with extraction sector.Above-mentioned extraction sector as shown in Figure 2, is made of discharge pipe 12b that is connected to space 7 and the valve 12c that is provided with on this discharge pipe 12b.This extraction sector is opened valve 12c and is extracted the air in space 7 out when supplying with cleaning fluid, in space 7, be full of cleaning fluid 11 after, by valve-off 12c, and can prevent that bubble is rolled in the cleaning fluid 11.
On base plate 9, form OBL peristome 9a shown in Figure 3, on this peristome 9a, be provided with cowling panel 10 with a plurality of hole 10a.
This ultrasonic waves for cleaning with aperture by control cowling panel 10 of nozzle 1, aperture opening ratio, thickness of slab T and from above-mentioned cleaning solution supplying mechanism to the flow of space 7 cleaning liquid supplied 11 etc., can in space 7, be controlled to be the cleaning fluid 11 that ultrasonic vibration is provided is flowed out from peristome 9a as Continuous Flow.Being controlled to be and making ultrasonic cleaning solution is above-mentioned controlling organization as Continuous Flow from the mechanism that peristome 9a flows out.Therefore, the flow adjusting mechanism that is provided with in above-mentioned cleaning solution supplying mechanism also is a controlling organization.
Cowling panel 10 uses the punch metal plate (パ Application チ Application グ メ Le) that has formed a plurality of holes on the metallic plate of stainless steel etc.Because of foregoing reason, the surface of this cowling panel 10 is preferably formed by the material with lyophily at least.
As above-mentioned lyophily material, because of the kind of used cleaning fluid is different, for example, be under the situation of the aqueous solution at cleaning fluid, use metals such as stainless steel after the hydrophilic treated, carried out making plastics, TiO after the surface has the hydrophilic treated of hydrophilic group 2Deng pottery such as metal oxide, aluminium, Si oxide.
The thickness of slab T of cowling panel 10 is the scope that 5 μ m are above, λ/10 are following (above-mentioned λ is the wavelength in the cowling panel constitute of the ultrasonic vibration of oscillator 5 vibrations).So problems such as the intensity of plate reduces if above-mentioned thickness of slab T less than 5 μ m, then produces, the processability price ratio in hole is bad are bad.If above-mentioned thickness of slab T surpassed λ/10, then the ultrasonic vibration from oscillator 5 vibrations becomes big by the cowling panel reflection, can not efficiently transmit for the flowing of cleaning fluid, so bad.That is, even if be ultrasonic cleaning solution in the space 7, cleaning fluid also spills to the outside from hole 10a, ultrasonic attenuation.
In addition, in the scope of thickness of slab T more than 0.03mm, below the 0.5mm of cowling panel 10, the thickness of hyperacoustic oscillator of the 20kHz～10MHz that can select to be suitable for to vibrate uses.
Cowling panel 10 as shown in Figure 2, is arranged to be laterally convex (is convex to processed substrate-side) because of previously described reason.
In addition, the hole of cowling panel 10 width W that forms regional 10b be preferably 5mm above, with the width W of oscillator 5 BLTThe scope that identical size is following, the scope that further more preferably 5mm is above, 17mm is following.By changing width W, can change the current shape of the ultrasonic cleaning solution of discharging as Continuous Flow to the outside from the peristome of base plate, especially change width etc.
If width W less than 5mm, then can not efficiently provide ultrasonic vibration to cleaning fluid.Even because width W is than the width W of oscillator 5 BLTAlso big, hyperacoustic effective range of exposures also is a width W BLTSo, W BLTWidth very abundant.
In addition, the hole of cowling panel 10 form the length L of regional 10b can be according to the decision of the length of processed substrate (object being treated).
Be preferably scope below the above 17mm of 0.001mm at the diameter of each the hole 10a that forms on the cowling panel 10, further the scope below the above 1mm of 0.001mm more preferably.If the diameter of hole 10a is less than 0.001mm, then liquid is difficult to out, is the shape of pushing out by high pressure, and liquid becomes wire.In addition, if the diameter of hole 10a has surpassed 17mm, then liquid under the spontaneous current, becomes and can not carry out liquid measure control from the hole.
The aperture opening ratio of cowling panel 10 (aperture opening ratio of cowling panel area relatively) is preferably the scope below 90% more than 20%.If the aperture opening ratio of cowling panel 10 is less than 20%, then the discharge pressure of liquid uprises, controlled variation; If surpass 90%, then because of the controlled variation of the problem liquid measure of hole machining accuracy.Also produce the problem of the mechanical strength reduction of cowling panel.
In addition, the area of a hole 10a is λ 2Below/100, clean liquid measure and reduce and make fluid volume but can control by its stream resistance, fine on this aspect.
Form on the regional 10b situation about roughly forming evenly distributedly in the hole though represented a plurality of hole 10a among Fig. 3, because of foregoing reason, the hole of best cowling panel 10 forms in the central part of regional 10b to more slightly distributing.
The distance (gap) of the separation point position of oscillating plate 3a and cowling panel 10 be about 7.5mm below, in that can to prevent that bubble is rolled into aspect the ultrasonic cleaning solution 11a that discharges in the nozzle 1 fine.
Processed substrate 20 can be enumerated the base material of liquid crystal indicator square glass substrate, glass base plate for color filter, photomask substrate, thermal head ceramic substrate, printed circuit board (PCB), semiconductor wafer, film substrate, becket material and electronic unit etc. etc.
Turntable 25 can be rotated the structure with lifting for the state that has loaded processed substrate 20 in the above is following.
Carrying mechanism 30 is installed in the length direction both ends of the surface of ultrasonic oscillator accommodation section 3, but ultrasonic waves for cleaning moves with peristome 9a phase septal space on the surface of the processed substrate 20 that loads on the rotating disk 25 of nozzle 1.
If the ultrasonic waves for cleaning of present embodiment is with nozzle 1 by applying the voltage ultrasonic vibration of vibrating to oscillator 5, then oscillating plate 3a vibration, ultrasonic vibration is provided and becomes ultrasonic cleaning solution 11a to the cleaning fluid 11 of supplying with space 7, further, this ultrasonic cleaning solution 11a each hole 10a by on cowling panel 10, forming, after being provided, ultrasonic vibration just confluxes, and as Continuous Flow such as funnel-forms and flow out.This is because because the hole of cowling panel 10 forms the cleaning fluid of the downside (outside) of regional 10b is Continuous Flow such as funnel-form, offers cleaning fluid 11 after passing through by hole 10a neutralization continuously so pass to the ultrasonic vibration in space 7.There is air in the downside (outside) of part (it is outer that the hole forms the zone) beyond the regional 10b because the hole of cowling panel 10 forms, so pass to the ultrasonic vibration in space 7 forms extra-regional the inside and base plate 9 by the hole of cowling panel the inside reflection.Therefore, by making the cleaning fluid of discharging to the outside from the peristome of base plate 9, thereby can efficiently provide ultrasonic wave for not to be involved in the Continuous Flow of gas.
Can be in the wide region of the about 20kHz～100MHz of oscillator 5 vibration, the ultrasonic wave of the frequency band of specific region, the frequency of ultrasonic of being vibrated can be according to attached to the kind of the spot on the processed substrate 20 and the big or small appropriate change of adhesive force.
In addition, when beginning is supplied with cleaning fluid 11 to space 7, form regional 10b by temporary transient plugging holes such as sheet materials at least, after in space 7, being full of cleaning fluid 11, and the discharge ultrasonic cleaning solution or makes on the peristome 9a side direction of accommodation section 3, in space 7, be full of cleaning fluid 11 after, make the peristome 9a of accommodation section 3 downward, and the discharge ultrasonic cleaning solution, so the cleaning fluid 11 that this situation can cut the waste is best, especially, hole 10a be about 1mm～17mm when size very effective.
Remove stains attached on the processed substrate 20 for the ultrasonic cleaning equipment that uses present embodiment, with processed substrate 20 be loaded in turntable 25 above, then, by carrying mechanism 30 ultrasonic waves for cleaning is separated by on the surface of processed substrate 20 moves with gap with the cowling panel side of nozzle 1, and, form regional 10b from the hole of cowling panel 10 and discharge ultrasonic cleaning solution as Continuous Flow, and clean processed substrate surface to the gap of processed substrate surface and cowling panel 10.As Fig. 4～shown in Figure 5,, then can change the scope of processed substrate capable of washing if change the cowling panel 10 of nozzle 1 and the distance of processed substrate surface.In addition, the distance of cowling panel 10 and processed substrate surface can provide the lifting of turntable 25 or the lifting of carrier structure 30 to change.
Ultrasonic cleaning equipment according to present embodiment, by the low-frequency band (ultrasonic wave of about 20kHz～200kHz) is provided to cleaning fluid 11, can remove the stubbornness of adhering on processed substrate 20 pollutes, in addition, owing to can provide the ultrasonic wave of frequency band of the wide region of about 20kHz～10MHz to cleaning fluid 11, so can be by less cleaning fluid to applying uniform clean because of the less particulate of the pollution adhesive force of stubbornness.In addition, ultrasonic waves for cleaning forms regional W with nozzle 1 by the hole that broadens, and the zone that the ultrasonic cleaning solution 11a that can broaden flows out can broaden and can once clean the scope of processed substrate.
In the foregoing description, although understand that ultrasonic oscillator accommodation section 3 is the situation of long case shape, but also can be the cylindric of hollow.
In addition, although understand and on the peristome 9a of ultrasonic waves for cleaning with nozzle 1, be provided with the cowling panel 10 ground situations that constitute by punch metal plate shown in Figure 3, but also can as shown in Figure 6 the cowling panel 40 that has formed net 40a be set.
The thickness of slab of cowling panel 40 is identical with cowling panel 10, is the scope of the above λ of 5 μ m/below 10.
In addition, it is identical that the width W that the net of cowling panel 40 forms regional 40b and the hole of cowling panel 10 form regional 10b, be preferably 5mm above, with scope below the identical size of width of oscillator 5.
In addition, in the foregoing description, although understand that being arranged to cowling panel 10 on the peristome 9a of ultrasonic waves for cleaning with nozzle 1 is the situation of convex laterally, but also can as shown in Figure 7 flat cowling panel 10 be set.
In the foregoing description, although understand the situation that extraction sector is made of discharge pipe 12b that is connected to space 7 and the valve 12c that is provided with on this discharge pipe 12b, but also can be as shown in Figure 8, the end of the discharge pipe 42b that will erect to the side of ultrasonic oscillator accommodation section 3 is connected to space 7, and the other end is an opening.This extraction sector is if supply with cleaning fluid to space 7, and then the gas in space 7 is discharged to the outside by discharge pipe 42b from the above-mentioned other end, is rolled in the cleaning fluid 11 so can prevent bubble.
In the foregoing description, as extraction sector, the situation of the discharge pipe 42b of discharge pipe 12b that Fig. 2 and band valve 12c shown in Figure 7 are set and the side that erects accommodation section 3 as shown in Figure 8 has been described, but also can as shown in Figure 9 second cowling panel 50 be set between oscillating plate 3a and cowling panel 10.This second cowling panel 50 is not for forming the tabular of hole, by being configured to block space 7 up and down, and forms the cleaning fluid stream (change is formed on the direction of the cleaning fluid stream on the space 7) of shape at the downside of oscillating plate 3a.The end of the upside (oscillating plate side) of this stream is connected to cleaning solution supplying pipe 12a, the end of downside (cowling panel 10 sides) is connected to discharge pipe (extraction sector) 52b.Can on this discharge pipe 52b valve be set, can an end be opening also.Midway being communicated with of above-mentioned shape cleaning fluid stream with the peristome of base plate 9.
Because of the reason identical with cowling panel 10, the thickness of slab of second cowling panel 50 is the scope (above-mentioned λ is the wavelength in the second cowling panel constitute of the ultrasonic vibration of vibrating from oscillator 7) of the above λ of 5 μ m/10 below.
In the nozzle 1 of Fig. 9,,, and further discharge to the outside, be rolled in the cleaning fluid 11 so can prevent bubble by discharge pipe 52b then because the gas in space 7 passes through shape cleaning fluid stream if supplied with cleaning fluid 11 to space 7 from cleaning solution supplying pipe 12a.In addition, when extracting the gas in space 7 out, but also the hole of the peristome of closed bottom 9 or first cowling panel forms the zone.
After cleaning fluid 11 becomes ultrasonic cleaning solution 11a under by oscillating plate 3a, flow into, and by each hole 10a, just conflux after ultrasonic vibration is provided, and flow out as Continuous Flow such as funnel-form to cowling panel 10.
(second embodiment)
The ultrasonic cleaning equipment of second embodiment then, is described.
The ultrasonic cleaning equipment of second embodiment is that ultrasonic waves for cleaning is different with structure of nozzle with the ultrasonic cleaning equipment difference of first embodiment.
Figure 10 is the summary sectional arrangement drawing of the ultrasonic waves for cleaning that relates to of expression present embodiment with nozzle.Ultrasonic waves for cleaning is constituted as with ultrasonic oscillator accommodation section (basket) 63 that will long case shape with nozzle 61, be contained in the ultrasonic oscillator 65 in this ultrasonic oscillator accommodation section 63, space 67 base plates 69 of configuration relatively of being separated by in the outside of the lower plate 63a of the oscillating plate of double as ultrasonic oscillator accommodation section 63, supply with the cleaning solution supplying mechanism of cleaning fluid 11 to space 67, with the flat cowling panel 70 that on the OBL peristome that forms on the base plate 69, is provided with at plan view as main body.
Ultrasonic oscillator 65 is formations such as element by metatitanic acid zirconates (PZT) element, barium titanate series element, crystal, ferrite (Off エ ラ イ ト), uses the oscillator of ultrasonic vibration of the frequency of exportable about 20～100MHz scope.This ultrasonic oscillator 65 is connected on the power supply.
Above-mentioned cleaning solution supplying mechanism is made of cleaning solution supplying pipe 72a that is connected to space 67 and the cleaning solution supplying source (diagram slightly) that is connected to this supply pipe 72a.
In addition, on space 67, be provided with extraction sector.Above-mentioned extraction sector as shown in Figure 2, is made of discharge pipe 72a that links space 67 and the valve 72c that is provided with on this discharge pipe 72b.Discharge pipe 72b is set to erect the side to ultrasonic oscillator accommodation section 63.
Cowling panel 70 is provided with the hole that has formed a plurality of hole 70a and forms the zone.
In addition, the hole of cowling panel 70 width W that forms the zone be preferably 5mm above, with the following scope of the identical size of width W T of oscillator 65, the more preferably scope below the above 17mm of 5mm.
The ultrasonic waves for cleaning of present embodiment with nozzle 61 if apply voltage and the ultrasonic vibration of vibrating to oscillator 65, then oscillating plate 63a vibration, on the cleaning fluid 11 of supplying with space 67, provide ultrasonic vibration, and become ultrasonic cleaning solution 11a, further this ultrasonic cleaning solution 11a is by being formed on each hole 70a on the cowling panel 70, after being provided, ultrasonic vibration just confluxes, and as Continuous Flow such as funnels and flow out.
According to the ultrasonic cleaning equipment of present embodiment, obtained effect of the present invention.
In addition, in the foregoing description, be the situation of long case shape although understand ultrasonic oscillator accommodation section (casing) 63 of long case shape, but also can be the accommodation section of hollow cylindrical.
In addition, although understand on the peristome that forms on the base plate of ultrasonic waves for cleaning with nozzle 61 and be provided with cowling panel 70, be flat situation, but also can cowling panel 70 be set as Figure 11 and shown in Figure 12, make it be convex laterally.In addition, as Figure 10 and even shown in Figure 12, can form the width W in zone by the hole that changes cowling panel 70, change the current shape of the ultrasonic cleaning solution 11a that flows out as Continuous Flow from the peristome of nozzle 61, as a result, can change the scope of once cleaning processed substrate.
In the foregoing description, although understand the situation that on discharge pipe 72b, is provided with valve 72c, but also can be as shown in figure 11, the end of discharge pipe 72b that erects the side of ultrasonic oscillator accommodation section 63 is linked space 67, the other end is an opening, or as shown in figure 12, the end of the discharge pipe 82b that will dispose on roughly the same height with space 67 is connected to space 67, and valve (diagram slightly) is set on discharge pipe 82b.
(the 3rd embodiment)
Figure 13 is the stereogram of schematic configuration of the ultrasonic cleaning equipment of expression the 3rd embodiment.Figure 14 is that the ultrasonic waves for cleaning that has is with the summary sectional arrangement drawing of nozzle in the ultrasonic cleaning equipment of expression Figure 13, and Figure 15 is the amplification view of ultrasonic waves for cleaning during with nozzle of seeing Figure 14 from the base plate side that is provided with cowling panel.
The ultrasonic waves for cleaning that the ultrasonic cleaning equipment of present embodiment is provided with embodiments of the invention with nozzle 81, make be provided with this ultrasonic waves for cleaning with the peristome 90a of the aftermentioned cowling panel 90 of nozzle 81 can be on the surface of processed substrate (object being treated) 20 phase septal space and mobile arm (carrying mechanism) 35, load the turntable 25 of processed substrate 20, can go out ultrasonic cleaning solution 11a and clean processed substrate surface with the interstitial row of nozzle 81 from ultrasonic waves for cleaning to cowling panel 90 and processed substrate surface.
Ultrasonic waves for cleaning with nozzle 81 be constituted as be separated by with ultrasonic oscillator cylindraceous accommodation section (casing) 83, the cylindric ultrasonic oscillator 85 that in this ultrasonic oscillator accommodation section 83, holds, in the outside of the lower plate 83a of the oscillating plate of double as ultrasonic oscillator accommodation section 83 space 87 relatively configuration base plates 89, supply with the cleaning solution supplying mechanism of cleaning fluids 11, the cowling panel 90 that on the 89a of circular open portion that forms on the base plate 89, is provided with as main body to space 87 at plan view.
Cowling panel 90 has formed a plurality of hole 90a (net).This cowling panel 90 is set, makes it be convex (is convex to processed substrate-side) laterally.
Because of foregoing reason, the diameter D that the hole of cowling panel 90 forms the zone be preferably 5mm above, with scope below the identical size of width W T of ultrasonic oscillator 85.
Above-mentioned cleaning solution supplying mechanism is made of the cleaning solution supplying pipe 92a that links space 87 and the cleaning solution supplying source (diagram slightly) of linking this supply pipe 92a.In addition, on space 87, be provided with extraction sector.This extraction sector such as Figure 14 and even shown in Figure 15 are made of discharge pipe 92b that is connected to space 87 and the valve 92c that is provided with on this discharge pipe 92b.
Remove attached to for the spot on the processed substrate 20 for the ultrasonic cleaning equipment that uses present embodiment, the processed substrate 20 of loading on turntable 25, then, by arm 35 ultrasonic waves for cleaning is moved with cowling panel side phase septal space on the surface of processed substrate 20 of nozzle 81, and, form zone (net forms the zone) from the hole of cowling panel 90 and discharge ultrasonic cleaning solution 11a and clean processed substrate surface as Continuous Flow to the gap of processed substrate surface and cowling panel 90.
According to the ultrasonic cleaning equipment of present embodiment, obtained effect of the present invention.
(experimental example 1)
Made the ultrasonic cleaning equipment of sample No.1～5 of structure shown in the following table 1.
Ultrasonic waves for cleaning to the ultrasonic cleaning equipment of made is supplied with cleaning fluid with nozzle, forms the zone at the hole from cowling panel and discharges and hyperacoustic cleaning fluid is provided and investigates with the removal efficient that ultrasonic wave is removed when the particulate that glass substrate adheres to.Here the particulate of Qu Chuing is that particle diameter is the above Al of 0.5 μ m 2O 3Grounds travel.According to following its result of table 1 expression.
[table 1]
Sample No.1 Sample No.2 Sample No.3 Sample No.4 Sample No.5
The cleaning device type Figure 13 Figure 13 Fig. 1 Figure 13 Figure 13
Bleed type Fig. 8 Fig. 7 Fig. 2 Fig. 9 Figure 10
Oscillator accommodation section size Diameter 65mm Diameter 65mm 65mm× 130mm Diameter 65mm Diameter 30mm
The oscillator frequency of oscillation 28kHz 50W ?28kHz ?50W 28kHz 100W 28kHz 50W 1MHz 30W
Oscillator (PZT) BLT ?BLT BLT BLT The PZT plate
The oscillator size Diameter 45mm Diameter 45mm Diameter 45mm Diameter 45mm Diameter 20mm
The oscillating plate material Stainless steel (SUS316 L) Stainless steel (SUS316 L) Stainless steel (SUS3 16 L) Stainless steel (SUS316L) Ta
The thickness t of oscillating plate 3mm ?3mm 3mm 2.5mm 0.05mm
The thickness of slab T of cowling panel 0.5mm ?0.5mm 0.5mm 0.5mm 0.05mm
The aperture of cowling panel 0.5mm ?0.5mm 0.5mm 0.5mm 0.1mm
The hole of cowling panel forms area size Diameter 17mm Diameter 17mm Diameter 17mm Diameter 17mm Diameter 17mm
Distance between oscillating plate and cowling panel 5mm ?5mm 7.5mm 6mm 2mm
Have or not second cowling panel Do not have Do not have Do not have Have Do not have
Second cowling panel -- ?-- -- 0.1mm --
Thickness of slab
shape cleaning fluid stream gap -- -- -- 3mm --
Cleaning fluid and PH Ammoniacal liquor PH10 Ammoniacal liquor PH10 Ammoniacal liquor PH10 Ammoniacal liquor PH10 Hydrogen water PH10
The cleaning fluid use amount 0.2 rise/minute 0.2 rise/minute 0.4 rise/minute 0.2 rise/minute 0.2 rise/minute
The cleaning solution supplying time 5 seconds 5 seconds 5 seconds 5 seconds 15 seconds
Clearance (annotate 1) more than 99.7% (annotate 1) more than 99.7% (annotate 1) more than 99.7% (annotate 1) more than 99.7% (annotate 1) more than 99.7%
Notes 1 in the table 1: so-called clearance 99.7% is equivalent to about 19000 particulates are removed to about 40.
From the result shown in the table 1 as can be seen, the ultrasonic cleaning equipment according to as sample No.1～5 of embodiments of the invention can efficiently clean attached to the particulate on the substrate with less cleaning fluid.
(embodiment 2)
Made the ultrasonic cleaning equipment of sample No.6～20 of structure shown in following table 2～table 4.
Hydrogen water from nozzle to the ultrasonic waves for cleaning of having made ultrasonic cleaning equipment that supply with PH10 with is used as cleaning fluid, form the zone from the hole of cowling panel and discharge hyperacoustic cleaning fluid is provided, and measure the use amount of the cleaning fluid when removing attached to the particulate on the glass substrate and impose on the acoustic pressure that above-mentioned hole forms the cleaning fluid between zone and substrate by the overlapping cleaning fluid of ultrasonic wave.In addition, imposing on the acoustic pressure that above-mentioned hole forms the cleaning fluid between zone and substrate is that the acoustic pressure that will not be provided with under the cowling panel situation is made as 100 (standardization), and with respect to the value of this value.According to table 2～table 4 ecbatic.
[table 2]
Sample No.6 Sample No.7 Sample No.8 Sample No.9 Sample No.10
The cleaning device type Figure 13 Figure 13 Figure 13 Figure 13 Figure 13
Bleed type Fig. 2 Fig. 2 Fig. 2 Fig. 2 Fig. 2
Oscillator accommodation section size Diameter 40mm Diameter 65mm Diameter 65mm Diameter 65mm Diameter 65mm
The oscillator frequency of oscillation 19kHz 45W 28kHz 50W 28kHz 50W 28kHz 50W 28kHz 50W
Oscillator (PZT) BLT BLT BLT BLT BLT
The oscillator size Diameter 20mm Diameter 45mm Diameter 45mm Diameter 45mm Diameter 45mm
Oscillating plate plate matter Ti Stainless steel (SUS316 L) Stainless steel (SUS316 L) Stainless steel (SUS316 L) Stainless steel (SUS316 L)
The thickness t of oscillating plate 3mm 3mm 2mm 2mm 2mm
The thickness of slab T of cowling panel 0.5mm 0.5mm 0.2mm 0.2mm 0.5mm
The aperture of cowling panel 0.1mm 0.5mm 0.5mm 0.5mm 0.1mm
The hole of cowling panel forms area size Diameter 17mm Diameter 17mm Diameter 17mm Diameter 30mm Diameter 17mm
Distance between oscillating plate and cowling panel 5mm 5mm 7.5mm 6mm 2mm
The cleaning fluid use amount 1 liter/minute 1 liter/minute 1 liter/minute 1 liter/minute 0.2 rise/minute
The hole forms the cleaning fluid acoustic pressure (standardization) of the downside in zone 100 95 100 100 95
[table 3]
Sample No.11 Sample No.12 Sample No.13 Sample No.14 Sample No.15
The cleaning device type Figure 13 Figure 13 Fig. 1 Figure 13 Figure 13
Bleed type Fig. 2 Fig. 2 Fig. 2 Figure 12 Figure 12
Oscillator accommodation section size Diameter 65mm Diameter 65mm Diameter 65mm Diameter 35mm Diameter 35mm
The oscillator frequency of oscillation 40kHz 50W 40kHz 50W 200kHz 200W 850kHz 50W 1MHz 50W
Oscillator (PZT) BLT BLT The PZT plate The PZT plate The PZT plate
The oscillator size Diameter 45mm Diameter 45mm 35mm× 160mm Diameter 25mm Diameter 25mm
Oscillating plate plate matter Stainless steel (SUS316 L) Stainless steel (SUS316 L) Stainless steel (SUS316 L) Stainless steel (SUS316 L) Stainless steel (SUS316L)
The thickness t of oscillating plate 2mm 2mm 1.5mm 0.1mm 0.1mm
The thickness of slab T of cowling panel 0.2mm 0.2mm 0.1mm 0.05mm 0.05mm
The aperture of cowling panel 0.5mm 0.1mm 0.1mm 0.05mm 0.05mm
The hole of cowling panel forms area size Diameter 17mm Diameter 30mm 17mm× 160mm Diameter 17mm Diameter 17mm
Distance between oscillating plate and cowling panel 3mm 3mm 3mm 3mm 3mm
The cleaning fluid use amount 1 liter/minute 1 liter/minute 0.5 rise/minute 0.5 rise/minute 0.5 rise/minute
The hole forms the cleaning fluid acoustic pressure (standardization) of the downside in zone 95 100 95 95 95
[table 4]
Sample No.16 Sample No.17 Sample No.18 Sample No.19 Sample No.20
The cleaning device type Fig. 1 Figure 13 Figure 13 Figure 13 Figure 13
Bleed type Figure 12 Figure 12 Figure 12 Figure 12 Figure 11 (annotating 2)
Oscillator accommodation section size 55mm× 180mm Diameter 45mm Diameter 45mm Diameter 45mm Diameter 45mm
The oscillator frequency of oscillation 1MHz 300W 1.5MHz 50W 3MHz 50W 1MHz 50W 1MHz 50W
Oscillator (PZT) The PZT plate The PZT plate The PZT plate The PZT plate The PZT plate
The oscillator size 35mm× 160mm Diameter 25mm Diameter 25mm Diameter 25mm Diameter 25mm
Oscillating plate plate matter Stainless steel (SUS316 L) Stainless steel (SUS316 L) Stainless steel (SUS316 L) Stainless steel (SUS316 L) Stainless steel (SUS316L)
The thickness t of oscillating plate 3mm 0.1mm 0.1mm 0.1mm 0.1mm
The thickness of slab T of cowling panel 0.05mm 0.05mm 0.03mm 0.6mm 0.05mm
The aperture of cowling panel 0.05mm 0.05mm 0.05mm 0.05mm 0.05mm
The hole of cowling panel forms area size 17mm× 160mm Diameter 17mm Diameter 17mm Diameter 17mm Diameter 17mm
Distance between oscillating plate and cowling panel 3mm 3mm 3mm 3mm 3mm
Have or not second cowling panel Do not have Do not have Do not have Do not have Have
The thickness of slab of second cowling panel -- -- -- -- 0.05mm
shape cleaning fluid stream gap -- -- -- -- About 1.5mm
The cleaning fluid use amount 0.5 rise/minute 0.5 rise/minute 0.5 rise/minute 0.5 rise/minute 0.5 rise/minute
The hole forms the cleaning fluid acoustic pressure (standardization) of the downside in zone 95 95 90 10 90～95
Notes 2 in the table 4: at ultrasonic waves for cleaning shown in Figure 11 configuration second cowling panel 50 shown in Figure 9 on the space 67 of nozzle 61.
From the result shown in table 2～table 4 as can be seen the thickness of cowling panel be that the ultrasonic cleaning equipment (comparative example) of the sample No.19 of 0.6mm forms the cleaning fluid of discharging in the zone from the hole of cowling panel acoustic pressure is 10, owing to almost do not provide ultrasonic wave, so cleaning performance is very little.
Form the acoustic pressure of the cleaning fluid of discharging in the zone from the hole of cowling panel be more than 90 sample No.6～18,20 ultrasonic cleaning equipment (embodiment) as can be seen, and sufficient ultrasonic wave is provided, and can expect cleaning performance.

Claims (12)

1, a kind of ultrasonic waves for cleaning nozzle is characterized in that,
The involving vibrations plate, ultrasonic oscillator fixing on this oscillating plate, with the face of the relative side of oscillator stationary plane of described oscillating plate on be separated by space and opposed base plate, supply with the cleaning solution supplying mechanism of cleaning fluid and have the cowling panel in a plurality of holes that on the peristome that forms on the described base plate, are provided with to described space;
The thickness of slab of described cowling panel is the scope that 5 μ m are above, λ/10 are following, and described λ is by the wavelength in the cowling panel constitute of the ultrasonic vibration of described ultrasonic oscillator vibration;
Be provided with controlling organization, it can be controlled and make and to have given by the ultrasonic cleaning solution of the ultrasonic vibration of described ultrasonic oscillator vibration, to have flowed out from described peristome as Continuous Flow to the cleaning fluid of supplying with described space.
2, ultrasonic waves for cleaning nozzle according to claim 1 is characterized in that, described cowling panel is convex laterally.
3, ultrasonic waves for cleaning nozzle according to claim 1, it is characterized in that, the peristome that forms on described base plate is a rectangle, the width of short side direction in zone that has formed a plurality of holes of described cowling panel be 5mm above, with scope below the identical size of width of described ultrasonic oscillator.
4, ultrasonic waves for cleaning nozzle according to claim 2, it is characterized in that, the peristome that forms on described base plate is a rectangle, the width of short side direction in zone that has formed a plurality of holes of described cowling panel be 5mm above, with scope below the identical size of width of described ultrasonic oscillator.
5, ultrasonic waves for cleaning nozzle according to claim 1, it is characterized in that, the peristome that forms on described base plate is circular, the diameter in zone that has formed a plurality of holes of described cowling panel be 5mm above, with scope below the identical size of width of described ultrasonic oscillator.
6, ultrasonic waves for cleaning nozzle according to claim 2, it is characterized in that, the peristome that forms on the described base plate is circular, the diameter in zone that has formed a plurality of holes of described cowling panel be 5mm above, with scope below the identical size of width of described ultrasonic oscillator.
7, ultrasonic waves for cleaning nozzle according to claim 5 is characterized in that, the diameter in each hole that forms on the described cowling panel is the scope below the above 1mm of 0.001mm, and the aperture opening ratio of cowling panel area is the scope below 90% more than 20% relatively.
8, ultrasonic waves for cleaning nozzle according to claim 1 is characterized in that, the central part that is distributed in cowling panel that is formed on a plurality of holes on the described cowling panel is thicker.
9, ultrasonic waves for cleaning nozzle according to claim 2 is characterized in that, the central part that is distributed in cowling panel that is formed on a plurality of holes on the described cowling panel is thicker.
10, ultrasonic waves for cleaning nozzle according to claim 1 is characterized in that, the surface of described at least cowling panel is formed by the material with lyophily.
11, ultrasonic waves for cleaning nozzle according to claim 1, it is characterized in that, configuration second cowling panel between cowling panel that is arranged at described peristome and above-mentioned oscillating plate, make it cut off above-mentioned space, and change the direction of the cleaning fluid stream on described space, form, an end of described cleaning fluid stream is connected to described cleaning solution supplying mechanism, the other end is connected to extraction sector, the peristome that is communicated with described base plate midway at described cleaning fluid stream, the thickness of slab of described second cowling panel is more than the 5 μ m, the scope that λ/10 are following, described λ is by the wavelength in the second cowling panel constitute of the ultrasonic vibration of described ultrasonic oscillator vibration.
12, a kind of ultrasonic cleaning equipment, it is characterized in that, be provided with ultrasonic waves for cleaning as claimed in claim 1 and be provided with this ultrasonic waves for cleaning with the peristome of the cowling panel of nozzle septal space and mobile carrying mechanism mutually on the surface of object being treated with making, and constitute and to go out ultrasonic cleaning solution and to clean the object being treated surface with the interstitial row of nozzle from described ultrasonic waves for cleaning to described cowling panel and object being treated surface with nozzle.
CNB2004101002532A 2003-12-11 2004-12-10 Ultrosonic cleaning nozzle and ultrosonic cleaning device Expired - Fee Related CN100485878C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003413179A JP4255818B2 (en) 2003-12-11 2003-12-11 Ultrasonic cleaning nozzle and ultrasonic cleaning device
JP413179/2003 2003-12-11

Publications (2)

Publication Number Publication Date
CN1627481A true CN1627481A (en) 2005-06-15
CN100485878C CN100485878C (en) 2009-05-06

Family

ID=34733383

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004101002532A Expired - Fee Related CN100485878C (en) 2003-12-11 2004-12-10 Ultrosonic cleaning nozzle and ultrosonic cleaning device

Country Status (3)

Country Link
JP (1) JP4255818B2 (en)
KR (1) KR100579613B1 (en)
CN (1) CN100485878C (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102553858A (en) * 2011-11-23 2012-07-11 珠海市翔鹤电子有限公司 Multipurpose ultrasonic cleaner
CN101947526B (en) * 2006-12-19 2013-04-03 朗姆研究公司 Megasonic precision cleaning of semiconductor process equipment components and parts
CN101432622B (en) * 2006-03-03 2013-05-29 国立大学法人新澙大学 Quantitative evaluation device and method of atom vacancy existing in silicon wafer
CN104137180A (en) * 2011-12-28 2014-11-05 Hoya株式会社 Production method for glass substrate for information recording medium

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100683275B1 (en) 2005-11-11 2007-02-15 세메스 주식회사 Vibrating unit and megasonic cleaning apparatus comprising the same
CN101829661A (en) * 2010-04-20 2010-09-15 姚建梁 High-efficiency water-saving ultrasonic cleaning device
KR101536722B1 (en) * 2012-11-06 2015-07-15 세메스 주식회사 Method for treating substrate
CN103489814B (en) * 2013-09-24 2015-12-02 深圳市凯尔迪光电科技有限公司 Full-automatic mega sonic wave semiconductor crystal wafer cleaning equipment

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101432622B (en) * 2006-03-03 2013-05-29 国立大学法人新澙大学 Quantitative evaluation device and method of atom vacancy existing in silicon wafer
CN101947526B (en) * 2006-12-19 2013-04-03 朗姆研究公司 Megasonic precision cleaning of semiconductor process equipment components and parts
CN102553858A (en) * 2011-11-23 2012-07-11 珠海市翔鹤电子有限公司 Multipurpose ultrasonic cleaner
CN104137180A (en) * 2011-12-28 2014-11-05 Hoya株式会社 Production method for glass substrate for information recording medium
CN104137180B (en) * 2011-12-28 2017-04-05 Hoya株式会社 The manufacture method of glass substrate for information recording medium

Also Published As

Publication number Publication date
KR100579613B1 (en) 2006-05-12
CN100485878C (en) 2009-05-06
JP4255818B2 (en) 2009-04-15
JP2005169278A (en) 2005-06-30
KR20050058218A (en) 2005-06-16

Similar Documents

Publication Publication Date Title
CN1200776C (en) Sheat meterial surface treatment device
US9662686B2 (en) Ultrasonic cleaning method and apparatus
CN1712144A (en) Ultrasonic cleaning apparatus
CN101959620A (en) Ultrasonic washing apparatus, and ultrasonic washing method
JP6959120B2 (en) Peeling device
CN1627481A (en) Ultrosonic cleaning nozzle and ultrosonic cleaning appts.
CN101061574A (en) Substrate treatment apparatus
CN1343535A (en) Cleaning method, method of mfg. semiconductor device and method of mfg. active matrix type displaying device
TW200904555A (en) Ultrasonic cleaning method
CN1131733C (en) Soup treatment appts.
US8486199B2 (en) Ultrasonic cleaning method and apparatus
JP3927936B2 (en) Single wafer cleaning method and cleaning apparatus
JP5169264B2 (en) Cleaning device
JP6093638B2 (en) Cleaning device
CN1241241C (en) Spraying nozzle for wet processing, wet processing apparatus and method
JP2008198632A (en) Cleaning device and method
JP5517227B2 (en) Ultrasonic precision cleaning equipment
JP5703625B2 (en) Cleaning apparatus and cleaning method
JP4144201B2 (en) Wet cleaning processing equipment
JP2007266194A (en) Cleaning method of semiconductor substrate, and cleaning apparatus of semiconductor substrate using it
CN1220919A (en) Ultrasonic cleaning apparatus
JP4023103B2 (en) Ultrasonic fluid processing equipment
KR100951922B1 (en) Ultrasonic cleaning apparatus using the multi frequency
JP5320845B2 (en) Cleaning apparatus, cleaning method, and electronic device manufacturing method
JP2011155240A (en) Ultrasonic cleaning method and ultrasonic cleaning apparatus of semiconductor wafer

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090506

Termination date: 20121210