CN1622738A - Hot pressing manufacturing method for printed circuit board - Google Patents
Hot pressing manufacturing method for printed circuit board Download PDFInfo
- Publication number
- CN1622738A CN1622738A CN 200310115095 CN200310115095A CN1622738A CN 1622738 A CN1622738 A CN 1622738A CN 200310115095 CN200310115095 CN 200310115095 CN 200310115095 A CN200310115095 A CN 200310115095A CN 1622738 A CN1622738 A CN 1622738A
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- CN
- China
- Prior art keywords
- copper foil
- hot pressing
- diaphragm
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Manufacturing Of Printed Circuit Boards (AREA)
- Laminated Bodies (AREA)
Abstract
The hot press process of making protecting film of printed circuit board includes adhering at least one insulating board and one copper foil with adhesive, etching the copper foil to form circuit, applying one protecting film on the copper foil and hot pressing to form. The hot press process features that before pressing, hot air is blown over the protecting film while pumping out air from the copper foil layer interval so that the protecting film can well contact with the surface of the copper foil. The said production process can prevent adhesive from flowing and copper foil from deforming, save protecting film and electric energy and raise product quality.
Description
＜affiliated technical field 〉
The present invention is that method for making in a kind of diaphragm hot pressing of printed circuit board (PCB); be by at least one insulation board and a Copper Foil by solid with the two bonded to each other after; make Copper Foil become a circuit loop through etching and processing; again a diaphragm is located at the Copper Foil top; and move in the press tool hot pressing in addition and moulding; before it is characterized in that this diaphragm is being pressed; blow up with hot-air earlier; extracted into the air in the copper foil layer gap of diaphragm below out vacuum state simultaneously; make diaphragm can more be fitted in copper foil surface; impose hot pressing processing again; prevent that to reach solid from flowing and the Copper Foil size distortion; and then save diaphragm use cost and electric energy, and make more to meet economic benefit and promote product quality, have industrial utilization.
＜prior art 〉
See also Fig. 1 to shown in Figure 4, the step of known single-layer printed circuit plate method for making is:
One, between an insulation board 10 and a Copper Foil 30, the two is bonded into one (as shown in Figure 1) mutually by solid (Adhesive) 20;
Two, make this Copper Foil 30 form required circuit loop (as shown in Figure 2) via etching and processing;
Three, a side that has solid 41 on the diaphragm 40 is puted up be covered in (as shown in Figure 3) on the Copper Foil 30;
Four, again above-mentioned composition is moved to and impose hot pressing in the press tool and moulding, make this diaphragm 40 complete closely connected finished products (as shown in Figure 4) of on this Copper Foil 30, promptly finishing a single-layer printed circuit plate.
The hot pressing of above-mentioned steps four in the process, be to conduct heat to by heating platen 60 pressing on the pad 50 with thermal source, and with force value at 40～50kg/cm
2Between pressure, directly press on this diaphragm 40, make the former solid-state solid 41 that is attached on this diaphragm 40 form the shape that can flow, and sticked together closely connected on the surface of Copper Foil 30 fully.
As shown in Figure 5, it is the structure of known double-layer printing circuit board, the step of its method for making is identical with the single-layer printed circuit plate, after only in step 1, on the upper and lower two sides of this insulation board 10, with solid 20 two Copper Foils 30 being bonded into one respectively respectively as for difference part, can complete by other subsequent step.
Continuous seeing also shown in Fig. 6-A and Fig. 6-B, meet the position of perforate when diaphragm 40, solid 41 on it is when being subjected to hot pressing and, can cause the space mobile (as in Fig. 6-B arrow C shown in) of this solid 41 from temperature of pressing pad 50 and pressure toward perforate, fraction defective after causing hot pressing increases, and this kind disappearance is the main cause that printed circuit panel products yield can't promote for a long time always; Moreover, since hot pressing when from the pressure of pressing pad 50 at every turn all at 40～50kg/cm
2Between, therefore also often cause the size distortion of Copper Foil 30, make the product fraction defective also can increase, especially common on multilayer board.In addition, this is pressing pad 50 often to be under the weight number of times frequency, also can cause product to shorten useful life, and consuming cost improves.
＜summary of the invention 〉
The main purpose of method for making in the diaphragm hot pressing of a kind of printed circuit board (PCB) of the present invention; be by at least one insulation board and a Copper Foil by solid with the two bonded to each other after; make Copper Foil become a circuit loop through etching and processing; again a diaphragm is located at the Copper Foil top; and move in the press tool hot pressing in addition and moulding; before it is characterized in that this diaphragm is being pressed; blow up with hot-air earlier; extracted into the air in the copper foil layer gap of diaphragm below out vacuum state simultaneously; make diaphragm can more be fitted in copper foil surface; impose hot pressing processing again; prevent that to reach solid from flowing and the Copper Foil size distortion; and then save diaphragm use cost and electric energy, and make more to meet economic benefit and promote product quality, have industrial utilization.
Method for making in the diaphragm hot pressing of a kind of printed circuit board (PCB) of the present invention, is to comprise:
One insulation board;
One Copper Foil, by solid with Copper Foil and insulation board the two bonded to each other after, make Copper Foil become a circuit loop through etching and processing; And
One diaphragm is bonded in after the Copper Foil top by solid, and above-mentioned composition integral body is moved in the press tool in addition hot pressing moulding;
It is characterized in that: before this diaphragm is being pressed; blow up with hot-air earlier; extracted into the air in the Copper Foil gap of diaphragm below out vacuum state simultaneously; make diaphragm can more be fitted in copper foil surface; move to then in the press tool; by the heating platen that thermal source is provided and a hot pressing film in addition hot pressing moulding, just become a printed circuit board construction.
Wherein, the design of pressure of this heating platen and the hot pressing of hot pressing film 10 to 20kg/cm
2Between.
Method for making in the diaphragm hot pressing of a kind of single-layer printed circuit plate of the present invention, and its advantage is: save diaphragm use cost and hot pressing and the required electric energy of processing, improved the product qualified rate of printed circuit board (PCB) greatly, have industrial utilization.
＜description of drawings 〉
Fig. 1: be one of fabrication steps of known single-layer printed circuit plate.
Fig. 2: be first figure fabrication steps two.
Fig. 3: be first figure fabrication steps three.
Fig. 4: be first figure fabrication steps four.
Fig. 5: the method for making structure in the diaphragm hot pressing that is known double-layer printing circuit board.
Fig. 6-A: the diaphragm that is known printed circuit board (PCB) is fitted in one of copper foil surface view.
Fig. 6-B: the diaphragm that is known printed circuit board (PCB) is fitted in two of copper foil surface view.
Fig. 7: the method for making structure that is the present invention.
Fig. 8: the diaphragm that is the present invention is fitted in the copper foil surface view.
Number in the figure is as follows:
10-insulation board 20,41-solid 30-Copper Foil
40-diaphragm 50-is pressing pad 60-heating platen
70-hot pressing film
＜embodiment 〉
Below help again with accompanying drawing for embodiment it is described in detail in detail, sincerely see also.
To shown in Figure 8, the present invention's method for making is to comprise as Fig. 7:
One insulation board 10;
One Copper Foil 30, by solid 20 with Copper Foil 30 and insulation board 10 the two bonded to each other after, make Copper Foil 30 through etching and processing, become a circuit loop;
One diaphragm 40 is bonded in after Copper Foil 30 tops by solid 41, and above-mentioned composition integral body is moved in the press tool (not showing on the figure) hot pressing in addition moulding;
It is characterized in that: before this diaphragm 40 is being pressed; blow up with hot-air earlier; extracted into the air in Copper Foil 30 gaps of diaphragm 40 belows out vacuum state simultaneously; make diaphragm 40 can more be fitted in Copper Foil 30 surfaces; move to then in the press tool, by the heating platen 60 that thermal source is provided and a hot pressing film 70 with " all pressing type of action " in addition hot pressing that (force value only need be set in 10 to 20kg/cm usually
2Between get final product) moulding, just become single-layer printed circuit plate structure.Or as the frame mode of above-mentioned Fig. 5, also can be made into the double-layer printing circuit board structure.
By above-mentioned method for making; the present invention makes diaphragm 40 because be subjected to top hot blow gas; being subjected to aspiration vacuum below reaching acts on simultaneously; and with the uniform voltage function of hot pressing film 70; make diaphragm 40 present very docile state on Copper Foil 30 surfaces; this can not only effectively reach and prevent flowing and Copper Foil 30 size distortions of solid 41; and need not use fully expensive eliminate the rate of changing high again pressing pad 50; and then the use cost of saving diaphragm 40; and the required electric energy of processing in hot pressing; meet economic benefit and lifting product quality in the manufacturing more, have industrial utilization.
Claims (2)
1. method for making in the diaphragm hot pressing of a printed circuit board (PCB), is to comprise:
One insulation board;
One Copper Foil, by solid with Copper Foil and insulation board the two bonded to each other after, make Copper Foil through etching and processing, become a circuit loop; And
One diaphragm is bonded in after the Copper Foil top by solid, and above-mentioned composition integral body is moved in the press tool in addition hot pressing moulding;
It is characterized in that: before this diaphragm is being pressed; blow up with hot-air earlier; extracted into the air in the Copper Foil gap of diaphragm below out vacuum state simultaneously; make diaphragm can more be fitted in copper foil surface; move to then in the press tool; by the heating platen that thermal source is provided and a hot pressing film in addition hot pressing moulding, just become a printed circuit board construction.
2. method for making according to the diaphragm hot pressing of the described a kind of printed circuit board (PCB) of claim 1, wherein, the design of pressure that this heating platen and the hot pressing of hot pressing film 10 to 20kg/cm
2Between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101150953A CN100456908C (en) | 2003-11-28 | 2003-11-28 | Hot pressing manufacturing method for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2003101150953A CN100456908C (en) | 2003-11-28 | 2003-11-28 | Hot pressing manufacturing method for printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1622738A true CN1622738A (en) | 2005-06-01 |
| CN100456908C CN100456908C (en) | 2009-01-28 |
Family
ID=34760310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101150953A Expired - Fee Related CN100456908C (en) | 2003-11-28 | 2003-11-28 | Hot pressing manufacturing method for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100456908C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101590702A (en) * | 2008-05-29 | 2009-12-02 | 罗伯特别克勒有限公司 | Be used for forcing press and method that lamination is the workpiece of plate shape substantially |
| CN109005637A (en) * | 2018-08-23 | 2018-12-14 | 苏州群策科技有限公司 | Edge coats substrate and its production method |
| WO2021017652A1 (en) * | 2019-07-26 | 2021-02-04 | 德清量丰电子科技股份有限公司 | Pcb ruler blank |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07170061A (en) * | 1993-12-15 | 1995-07-04 | Fujitsu Ltd | Mounting of electric component |
| IT1313118B1 (en) * | 1999-08-25 | 2002-06-17 | Morton Int Inc | VACUUM APPLICATION EQUIPMENT EQUIPPED WITH CONVEYING MEANS PROCEDURE FOR APPLYING A DRY FILM RESIST TO A PANEL |
| JP3115567B1 (en) * | 1999-09-29 | 2000-12-11 | 株式会社タムラ製作所 | Power supply circuit block |
| EP1289356A4 (en) * | 2000-06-08 | 2008-05-21 | Matsushita Electric Ind Co Ltd | Method and device for drying materials and method of producing circuit boards using the same |
-
2003
- 2003-11-28 CN CNB2003101150953A patent/CN100456908C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101590702A (en) * | 2008-05-29 | 2009-12-02 | 罗伯特别克勒有限公司 | Be used for forcing press and method that lamination is the workpiece of plate shape substantially |
| CN101590702B (en) * | 2008-05-29 | 2013-02-20 | 罗伯特别克勒有限公司 | Press and method for laminating essentially plate-shaped workpieces |
| CN109005637A (en) * | 2018-08-23 | 2018-12-14 | 苏州群策科技有限公司 | Edge coats substrate and its production method |
| WO2021017652A1 (en) * | 2019-07-26 | 2021-02-04 | 德清量丰电子科技股份有限公司 | Pcb ruler blank |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100456908C (en) | 2009-01-28 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090128 Termination date: 20091228 |