CN1622308A - Silicon wafer carrier - Google Patents
Silicon wafer carrier Download PDFInfo
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- CN1622308A CN1622308A CN 200410101211 CN200410101211A CN1622308A CN 1622308 A CN1622308 A CN 1622308A CN 200410101211 CN200410101211 CN 200410101211 CN 200410101211 A CN200410101211 A CN 200410101211A CN 1622308 A CN1622308 A CN 1622308A
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Abstract
The present invention relates to container for bearing silicon slice, such as silicon slice for solar cell. The silicon slice bearer can wear acid and alkali washing solution under certain temperature for long time, and has certain rigidity, precise external size and strict weight for the requirement of silicon slice producing line and washing apparatus. Structurally, the silicon slice bearer is one case with opened top and bottom, two flat inclined side walls with inside toothed bars arranged in certain intervals, one H-shaped end wall and one plate end wall. Each of the side walls has three outside horizontal beams, conic leg, horizontal bottom gaps and conic teeth, two positioning slots and square notch for clamping silicon slice protecting bars. The container is made with PVDF and through injection molding.
Description
Affiliated technical field
The present invention relates to develop a kind of container that carries square silicon chip, as carrying solar cell polycrystalline and monocrystalline silicon piece.The carrier (being commonly called as: clean the gaily decorated basket) that requires the splendid attire silicon chip not only can the withstand long term exposure cleaning fluid temperature, the acid of cleaning fluid, caustic corrosion, stronger rigidity, the accurate overall dimension of intensity and strict product weight also to be arranged, to satisfy the requirement of silicon chip production line and cleaning equipment.
Background technology
Previously used silicon wafer carrier all is the carrying that is used for semi-conductor silicon chip and wafer, and these silicon chips are circle.Its production technology need be with liquids and gases to silicon chip washing by soaking in the carrier, and chemical washes wherein contains corrosive liquids such as strong acid, highly basic, and needs to use down at high temperature (180 ℃).The carrier that carries this type of silicon chip when therefore silicon chip cleans generally uses tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA) injection to form, but this kind cost of material height, the big processing difficulties of melt viscosity, and it is serious to equipment corrosion, need to use special equipment to inject, cause finished product rate, production efficiency low, cost an arm and a leg.
The square silicon chip that the present invention relates to, for example silicon chip of solar cell is compared with the used circular single crystal silicon chip of semiconductor industry, and at first profile has four right angles, and secondly silicon chip of solar cell adopts polysilicon mostly, and this just causes it than the easier fragmentation of circular silicon chip.Because circular silicon chip does not have directionality problem, can in silicon wafer carrier, arbitrarily insert, take out, and without any obstacle; Square silicon chip is then higher to the smoothness requirement of carrier, could satisfy silicon chip when turnover carrier direction is also not exclusively vertical, can be adjusted to the tram automatically, and smooth turnover does not have to hinder.When silicon chip cleaned, silicon wafer carrier was vertically placed, because circular silicon chip has minimum point, cleaning fluid can flow out along this minimum point, and carrier is not had specific (special) requirements; And square silicon chip bottom is straight, easily causes cleaning fluid to be detained, and therefore requires the carrier bottom that the space of deriving cleaning fluid is arranged.Though the silicon chip of solar cell production technology also requirement can the withstand long term exposure uniform temperature under acid, the caustic corrosion of cleaning fluid, but its corrosion-resistant degree needn't reach the requirement of circular silicon wafer carrier, therefore can the usability price ratio more reasonable, process easier Kynoar (PVDF), tetrafluoraoethylene-hexafluoropropylene copolymer (FEP), polypropylene materials processing productions such as (PP), can reduce cost like this, obtain higher production efficiency and benefit.
At present, the production of solar cell and application are one of fastest-rising industries in the world, and annual growth is in recent years near 30%, and the volume of trade has reached more than 1,000,000,000 dollars its year at present.Solar cell mostly adopts the semi-conducting material manufacturing, and wherein polycrystal silicon cell accounts for about 50%, is the kind that cost is low in the solar cell, increase of production is the fastest.Its production technology and investigation of materials be all ripe, for we solve the increasingly serious energy and environmental problem, provides effectively, the application approach of the new forms of energy of cleaning, safety and sustainable development.It will dominate the market of solar cell in 10 years futures even longer time according to scholarly forecast.
China has abundant solar energy resources.According to statistics, the solar radiation total amount that annual Chinese land receives is equivalent to 24,000 hundred million t mark coal, and the 2/3 area year hours of daylight of national total area all surpasses some areas of 2000h, particularly northwest and surpasses 3000h.On the other hand, along with the develop rapidly of our times photoelectric technology and Material Used thereof, the photoelectric material cost descends at double, and photoelectric conversion rate improves constantly, and this will bring the decline significantly of cost for solar power generation.World's photovoltaic circle it is generally acknowledged, to solar-energy photo-voltaic cell cost in 2010 will be reduced to can with the degree of conventional energy resource competition.This provides possibility for China develops solar energy resources energetically.
In the production technology of silicon solar cell, need to use silicon wafer carrier, in NaOH solution at a certain temperature, HCl solution, the HF solution silicon chip is cleaned.This carrier need satisfy the requirement of silicon chip conversion, and uses indeformablely for a long time, does not pollute silicon chip during use.In the production of the monocrystalline silicon of IC industry (IC), being used for the carrier that silicon chip cleans is to adopt melting fluoroplastics tetrafluoroethylene-perfluoroalkyl vinyl ether copolymers (PFA) injection machine-shaping, not too adopt polypropylene (PP) injection machine-shaping during the transportation of rigorous environment and silicon chip and be used for requirement, related to the carriage that is used for integrated circuit silicon chip loading and storage as patent CN 1037616A, and its silicon chip that relates to is shaped as disk.And be used for the silicon wafer carrier of solar cell, according to the different user requirement, adopt tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), Kynoar (PVDF), tetrafluoraoethylene-hexafluoropropylene copolymer (FEP) and polypropylene materials such as (PP) injection machine-shaping, the silicon chip of loading is square.
In the processing of melting fluoroplastics, PVDF has lower melt viscosity (with respect to other fluororesin), and fusing point and decomposition temperature differ about 140 ℃, so thermal stability is better, is convenient to processing.Do not need antiseptic special equipment, the moulding of available general thermoplastics injection processing method.Its fusing point is at 165～185 ℃, long-term serviceability temperature scope-70 ℃～150 ℃, and heat decomposition temperature has the better heat-resisting performance more than 316 ℃.Its hot strength, compressive strength, rigidity, hardness and cutting resistance energy occupy the first in fluoroplastics, be a kind of tough structural material with excellent wear, creep resistant, endurance, high rigidity.
Summary of the invention
Square silicon wafer carrier as the silicon chip of solar cell carrier, need meet the following requirements.The silicon chip that it can load is square silicon chip, can satisfy the requirement of silicon chip conversion, and use indeformable for a long time.It more needs to satisfy the requirement that silicon chip cleans, and can make wash liquid stream each corner through silicon chip, does not reside in the carrier, can the withstand long term exposure cleaning fluid higher temperature and acid, the caustic corrosion of cleaning fluid.It also needs certain weight, is unlikely in rinse bath, to topple and overturn, but can not be too heavy, be unfavorable for the carrying of manual operation or machine.
Container constructed in accordance can satisfy above-mentioned requirements.This container also has other unique advantages.At first, structure of container design constructed in accordance is exquisite, raw materials used few more, has saved cost.Secondly, the silicon chip that structure of container constructed in accordance can better protection carries can not fall in conversion, cleaning process and silicon chip is damaged.At last, the navigation system of container constructed in accordance can be connected with the corresponding solar cell manufacturing equipment, makes the location more firmly, accurately.
Therefore, an object of the present invention is to provide a kind of carrying container, it can carry square carrier, such as the solar cell polysilicon sheet.
Another object of the present invention provides a kind of carrying container; it can be used for cleaning as operations such as silicon chip of solar cell; make cleaning fluid inflow and outflow smoothly in container, and protect the article in the container being subjected to that impact, vibration, extruding and friction etc. do that the time spent can not scratch or cracked in operation.
A further object of the invention is that the container that is provided can tolerate acid, caustic corrosion under the uniform temperature.
A further object of the invention provides a kind of more reliable locate mode, and is tightr when the solar silicon wafers carrier is connected with cleaning robot.
A further object of the invention provides a kind of container that can use repeatedly, clean easily.
A further object of the invention is the container that will provide such, is still when it uses on the solar cell automatic assembly line effectively.
More above and other purposes all reach by a kind of container, and this container has following a few part-structure:
A box-shaped body, opening is arranged at main body top and bottom, and the top is used for putting into and taking out of silicon chip;
The opposed sidewall in two sides, sidewall is straight, does not have bending, but has certain gradient, inside comprises a plurality of tooth bars that constant spacing is arranged;
A H shape end wall, a dull and stereotyped end wall.
Square silicon wafer carrier of the present invention for satisfying corrosion-resistant and having the requirement that constant weight topples and overturn when preventing from solution to use, adopts Kynoar (PVDF) or tetrafluoraoethylene-hexafluoropropylene copolymer (FEP) to inject machine-shaping.
By below in conjunction with the accompanying drawing description of a preferred embodiment, can better understand the present invention.
Description of drawings:
Fig. 1 stereogram that is used for the silicon chip of solar cell carrier of the present invention
Fig. 2 front view that is used for the silicon chip of solar cell carrier of the present invention
Fig. 3 front cross-sectional view that is used for the silicon chip of solar cell carrier of the present invention
Fig. 4 right side profile that is used for the silicon chip of solar cell carrier of the present invention
Fig. 5 vertical view that is used for the silicon chip of solar cell carrier of the present invention
With reference to Fig. 1-5, silicon chip of solar cell carrier of the present invention has been described, this carrier main body is represented with label 1.As previously mentioned, this carrier is with the moulding of thermoplastics integral molded plastic.
Square silicon wafer carrier 1 comprises six major parts: the sidewall 2 that open top 11 and bottom 12, two sides oppose mutually, H shape end wall 3 and another dull and stereotyped end wall 4 opposed with it.It below is detailed description to the various piece of entity.
H shape end wall 3 is connected with two opposed sidewalls 2; on its H shape end face 31 respectively projection a horizontal location bar 32 and two perpendicular positioning bars 33; upwards one square groove 34 that is used for blocking silicon chip guard strip 5 (be not shown in figure, the protection silicon chip is not deviate from) when cleaning and dry is arranged at perpendicular positioning bar 33 with the convex surface 28 of sidewall 2 segment distance of being separated by.
With same position, H shape end wall 3 opposed another dull and stereotyped end wall 4 upside two ends two square grooves 34 that also distribute, block silicon chip guard strip 5 jointly with the groove of H shape end wall 3, dull and stereotyped end wall both sides respectively are provided with one and protrude flange 41, so that extract square silicon wafer carrier 1 with bale handle 6 (not being shown among the figure).
The present invention also explores on processing technology according to this structure except structurally being provided with the carrier that is more suitable for carrying square silicon chip of solar cell.
For guaranteeing that silicon chip of solar cell all immerses the corrosivity cleaning fluid when cleaning, the carrier that loads silicon chip also will have enough proportion except need are corrosion-resistant, the silicon wafer carrier that silicon chip is housed can not toppled and overturn in cleaning fluid, suitable raw material comprise tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), Kynoar (PVDF), tetrafluoraoethylene-hexafluoropropylene copolymer (FEP) etc., but consider cost of material and product combination property, PVDF is obviously than both are more suitable for processing of the present invention in addition.
But, PVDF is the bigger resin of a kind of shrinkage, and the excursion of its shrinkage in different moulds and process conditions is bigger, make the contraction of goods size on all directions of self have inhomogeneities, this contraction inhomogeneities shows: the contraction of goods different parts of the same race is inhomogeneous; The contraction of product wall thickness direction is inhomogeneous; The different contractions that cause of resin flows orientation are inhomogeneous; And the contraction of the goods thickness direction of the same race of different moulds is inhomogeneous.The factor that influences the injected articles contraction is from being summed up as three in essence: the residual stress of injected articles; The goods cooling procedure; The orientation of material.Therefore when carrying out mold design, the event of the shrinkage of accurately definite goods all directions is so important, but goods for dimensional requirement strictness of the present invention, also need technology adjustment in addition in injection moulding, note the goods control of cooling time, guarantee that goods do not produce internal shrinkage, to guarantee the dimensional stability of end article.According to processing method of the present invention, the PVDF shrinkage is 2.6～5.2%, and is preferred 2.7～4.0%, more preferably 2.8～3.0%.
Injection technique comprises barrel zone temperature, injection pressure, mold temperature etc.Adopt the raw material of variety classes, different manufacturers, the different trades mark, adopt distinct device processing, processing technology is all inequality.Provide the general range of processing technology below:
PVDF injecting forming temperature scope is from 170 ℃～260 ℃, preferred 190 ℃～240 ℃.
PVDF injection pressure scope is from 30～150MPa, preferred 40～90MPa.
PVDF mold temperature scope is from 70 ℃～140 ℃, preferred 75 ℃～90 ℃.
Embodiment 1
With PVDF injection stage (production of atropic company) is raw material, and shrinkage is 3%, the square silicon wafer carrier mould of design 103mm.Adopt sea, Ningbo day HTF 250X/1 injector, 190 ℃～220 ℃ of injection temperatures, injection pressure 45～60MPa, 80 ℃ of mold temperatures.
With PVDF injection stage (production of atropic company) is raw material, and shrinkage is 3%, the square silicon wafer carrier mould of design 156mm.Adopt sea, Ningbo day HTF 250X/1 injector, 200 ℃～245 ℃ of injection temperatures, injection pressure 35～45MPa, 90 ℃ of mold temperatures.
With PFA injection stage (big King Company produces) is raw material, and shrinkage is 3%, the square silicon wafer carrier mould of design 156mm.Adopt sea, Ningbo day HTF 250X/1 injector, 320 ℃～365 ℃ of injection temperatures, injection pressure 10～65MPa, 80 ℃ of mold temperatures.
Embodiment 4
With FEP injection stage (production of 3F company) is raw material, and shrinkage is 2.4%, the square silicon wafer carrier mould of design 125mm.Adopt sea, Ningbo day HTF 250X/1 injector, 320 ℃～350 ℃ of injection temperatures, injection pressure 55～90MPa, 65 ℃ of mold temperatures.
Embodiment 5
With PP injection stage (production of atropic company) is raw material, and shrinkage is 2%, the square silicon wafer carrier mould of design 103mm.Adopt sea, Ningbo day HTF 250X/1 injector, 210 ℃～240 ℃ of injection temperatures, injection pressure 30～65MPa, mould leads to cooling water.
The present invention can implement by other form under the situation that does not break away from its purport, and therefore, illustrated embodiment is explanation of the present invention rather than restriction, and relating to what show the scope of the invention is appending claims rather than above-mentioned explanation.
Claims (11)
1. square silicon wafer carrier is characterized in that:
A box-shaped body, opening is arranged at main body top and bottom, and the top is used for putting into and taking out of silicon chip;
The opposed sidewall in two sides, sidewall is straight, does not have bending, but has certain gradient, inside comprises a plurality of tooth bars that constant spacing is arranged;
A H shape end wall, a dull and stereotyped end wall.
2. silicon wafer carrier according to claim 1 is characterized in that selecting for use the injection moulding of one of tetrafluoroethylene-perfluoroalkyl vinyl ether copolymer (PFA), Kynoar (PVDF), tetrafluoraoethylene-hexafluoropropylene copolymer (FEP), polypropylene (PP).
3. silicon wafer carrier according to claim 1 is characterized in that preferred polyvinylidene fluoride resin (PVDF) injection moulding.
4. according to claim 1 and 2 described silicon wafer carriers, it is characterized in that the outer surface of this silicon wafer carrier sidewall should have three horizontal girds.
5. according to claim 1 and 2 described silicon wafer carriers, it is characterized in that the lower bottom part taper leg upside of this silicon wafer carrier sidewall comprises a series of horizontal spaces and a plurality of opposed conical tooth.
6. according to claim 1 and 2 described silicon wafer carriers, it is characterized in that the center, lower bottom part taper leg lower end of this silicon wafer carrier sidewall should be distributed with 2 location notchs.
7. according to claim 1 and 2 described silicon wafer carriers, it is characterized in that on the sidewall of this silicon wafer carrier that Ying Youyi also is used to block the square groove of silicon chip guard strip.
8. silicon wafer carrier according to claim 3 is characterized in that the PVDF shrinkage that this silicon wafer carrier adopts is 2.6～5.2%.
9. silicon wafer carrier according to claim 3, the PVDF injecting forming temperature scope that it is characterized in that this silicon wafer carrier employing is from 170 ℃～260 ℃.
10. silicon wafer carrier according to claim 3 is characterized in that PVDF injection pressure scope that this silicon wafer carrier adopts is from 30～150MPa.
11. silicon wafer carrier according to claim 3 is characterized in that PVDF mold temperature scope that this silicon wafer carrier adopts is from 70 ℃～140 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004101012110A CN1303664C (en) | 2004-12-17 | 2004-12-17 | Silicon wafer carrier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004101012110A CN1303664C (en) | 2004-12-17 | 2004-12-17 | Silicon wafer carrier |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1622308A true CN1622308A (en) | 2005-06-01 |
| CN1303664C CN1303664C (en) | 2007-03-07 |
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ID=34766747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004101012110A Expired - Fee Related CN1303664C (en) | 2004-12-17 | 2004-12-17 | Silicon wafer carrier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1303664C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101980376A (en) * | 2010-08-26 | 2011-02-23 | 常州亿晶光电科技有限公司 | Liquid penetration grid plate |
| CN101536174B (en) * | 2006-11-07 | 2012-08-29 | 信越聚合物株式会社 | Substrate container |
| CN103227140A (en) * | 2013-04-22 | 2013-07-31 | 北京市塑料研究所 | Silicon wafer loader |
| CN103258766A (en) * | 2013-05-09 | 2013-08-21 | 北京市塑料研究所 | Cleaning frame |
| CN103868329A (en) * | 2011-12-31 | 2014-06-18 | 聚灿光电科技(苏州)有限公司 | High efficiency drying flower basket |
| CN108183082A (en) * | 2018-02-26 | 2018-06-19 | 上海提牛机电设备有限公司 | A kind of silicon chip load carrier |
| CN109003928A (en) * | 2018-07-21 | 2018-12-14 | 江苏德尔科测控技术有限公司 | A kind of silicon wafer carrying device |
| CN111300838A (en) * | 2020-02-28 | 2020-06-19 | 北京市塑料研究所 | Method for manufacturing wafer carrier and wafer carrier |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4949848A (en) * | 1988-04-29 | 1990-08-21 | Fluoroware, Inc. | Wafer carrier |
| JPH1070182A (en) * | 1996-08-27 | 1998-03-10 | Nec Yamaguchi Ltd | Wafer treatment container |
| JP2002319616A (en) * | 2001-02-15 | 2002-10-31 | Sharp Corp | Wafer carrier and method of soldering solar battery wafer using the same |
| US6758339B2 (en) * | 2001-07-12 | 2004-07-06 | Entegris, Inc. | Thin wafer carrier |
-
2004
- 2004-12-17 CN CNB2004101012110A patent/CN1303664C/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101536174B (en) * | 2006-11-07 | 2012-08-29 | 信越聚合物株式会社 | Substrate container |
| CN101980376A (en) * | 2010-08-26 | 2011-02-23 | 常州亿晶光电科技有限公司 | Liquid penetration grid plate |
| CN103868329A (en) * | 2011-12-31 | 2014-06-18 | 聚灿光电科技(苏州)有限公司 | High efficiency drying flower basket |
| CN103227140A (en) * | 2013-04-22 | 2013-07-31 | 北京市塑料研究所 | Silicon wafer loader |
| CN103227140B (en) * | 2013-04-22 | 2016-06-01 | 北京市塑料研究所 | Silicon wafer carrier |
| CN103258766A (en) * | 2013-05-09 | 2013-08-21 | 北京市塑料研究所 | Cleaning frame |
| CN108183082A (en) * | 2018-02-26 | 2018-06-19 | 上海提牛机电设备有限公司 | A kind of silicon chip load carrier |
| CN109003928A (en) * | 2018-07-21 | 2018-12-14 | 江苏德尔科测控技术有限公司 | A kind of silicon wafer carrying device |
| CN109003928B (en) * | 2018-07-21 | 2021-03-09 | 江苏德尔科测控技术有限公司 | Silicon wafer bearing device |
| CN111300838A (en) * | 2020-02-28 | 2020-06-19 | 北京市塑料研究所 | Method for manufacturing wafer carrier and wafer carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1303664C (en) | 2007-03-07 |
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