CN1621573A - Electroplating clamp for electronic parts and electrolytic plating device - Google Patents
Electroplating clamp for electronic parts and electrolytic plating device Download PDFInfo
- Publication number
- CN1621573A CN1621573A CNA2004100860288A CN200410086028A CN1621573A CN 1621573 A CN1621573 A CN 1621573A CN A2004100860288 A CNA2004100860288 A CN A2004100860288A CN 200410086028 A CN200410086028 A CN 200410086028A CN 1621573 A CN1621573 A CN 1621573A
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- electronic parts
- lead
- electroplating clamp
- wire
- electronic
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention aims to provide a tool for plating electronic parts capable of relaxing the control of each length of leads and earth leads forming electronic parts. The tool for plating electronic parts positions a plurality of electronic parts each composed of a base where leads inserted into through holes formed at the flat part of a metallic member are sealed with an insulating material and earth leads 18 whose one end part is joined thereto, and applies electroplating to the whole face of the exposed face in each member. The plating tool is provided with: a power supply member 34 arranged on one side of a pedestal 32 where a plurality of magnets 30 are disposed so as to be sealed at prescribed intervals in such a manner that each tip of the leads and earth leads is attracted; spherical bodies 36 of a magnetic substance connected to the power supply member and in which part of each tip of the leads and earth leads attracted by each magnet is simultaneously abutted on the spherical face; and a guide board 42 at which guide holes 44 are formed for guiding each tip of the leads and earth leads to the corresponding spherical body 36.
Description
Technical field
The present invention relates to electroplating clamp for electronic parts and electrolytic plating apparatus, in more detail, relate to a plurality of electronic components that are made of pedestal and ground lead are located respectively, to whole electroplating clamp for electronic parts and the electrolytic plating apparatus of implementing metallide that exposes face by each parts that metal constituted that form the aforementioned electronic part, wherein said pedestal, the lead-in wire that will be inserted into by insulating material such as glass in the communicating pores on the par that is formed on the metal member made seals, said ground lead, one end are engaged with on the one side side of aforementioned metal member made.
Background technology
In electronic components such as semiconductor device, shown in Fig. 5 (a) and (b), the use that has head (ヘ Star ダ one) 10,20.
In addition, head 20 shown in Fig. 5 (b), the lead-in wire 16 pass respectively on the par that is formed on metal member made 22 two communicating poress 24,24 and by glass capsulation, an end of ground lead 18 is docked and is engaged thereon with the one side side of the par of metal member made 22 simultaneously, wherein this metal member made is by implement the metal member made that punch process is formed with recess on metal plate-shaped member.
In the head shown in these Fig. 5 (a) and (b) 10,20, on the scatterer 26 on the another side side of the par of another side side that is bonded on the pedestal 12 that for example constitutes by scolder or metal member made 22, be equipped with semi-conductor original paper 28 by the metal member made, carried out after the wire-bonded in this a semi-conductor original paper 28 and an end of lead-in wire 16,16, coating member is covered on the another side side of par of pedestal 12 or metal member made 22, sealing keeps carrying the semi-conductor original paper 28 on scatterer 26 etc.
, in the head shown in Fig. 5 (a) and (b) 10,20,,, be formed with coating (plated film) by metallide in exposing on the face of each parts that constitutes by the metal that constitutes head 10,20 for antirust etc.
But, because lead-in wire 16,16 is sealed on the pedestal 12 (metal member made 22) by glass capsulation, therefore, to go up to form and generate coating whole of face of exposing of lead-in wire 16,16, ground lead 18 and pedestal 12 (or metal member made 22), just be necessary to lead-in wire 16,16 and ground lead 18 power supplies by metallide.
Therefore, when head 10 (20) is implemented metallide, all adopted barrel plating (barrel plating) in the past.
In barrel plating, be make contain a plurality of heads 10 (20) and as the dummy of energising subsidiary material roll cage body rotation, thereby each head 10 (20) is implemented metallides.Therefore, because lead-in wire 16 grades of head 10 (20) can kink together each other in metallide, therefore perhaps dummy can be sandwiched between the lead-in wire 16 of head 10 (20), when metallide is finished, also is necessary to carry out head 10 (20) the unfolded one by one operations with kinking together.
And then, in metallide, can cause occurring cut because a plurality of heads 10 (20) etc. collide each other, perhaps go between 16,16 and ground lead 18 easily bend.Therefore, for the head 10 (20) that from roll the cage body, takes out, also be necessary to carry out the finishing operation of those lead-in wire that is bent 16 grades.
In addition, in the past, as shown in Figure 6, also carry out forming the lead-in wire 16,16 of head 10 (20) respectively and each leading section of ground lead 18 is connected on the wires 100 with a plurality of, thereby by each head 10 (20) being implemented the way of metallides to metal wire 100 power supplies.
In method shown in Figure 6, though can prevent to go between 16,16 and ground lead 18 situation about in metallide, being bent, but be necessary to carry out each leading section with lead-in wire 16,16, ground lead 18 and be connected to attended operation on the wires 100, and will go between 16,16 from the metal wire 100, each leading section of ground lead 18 cuts off cuts off operation.
Relative with this method in the past, in following patent documentation 1, proposed when the metallide of head 10 (20), to use the scheme of electroplating clamp shown in Figure 7.
Electroplating clamp shown in Figure 7, on the one side side of the base station 102 that constitutes by resin, be provided with as power supply board 106 to lead-in wire 16,16 and ground lead 18 power supply part of powering respectively, and wherein said base station 102, the front end of the lead-in wire 16,16 of head 10 and ground lead 18 can be attracted the mode near prescribed position, sealing is equipped with a plurality of magnet 104,104... on each prescribed position.
And then, in electroplating clamp shown in Figure 7, on the length of lead-in wire 16,16, ground lead 18, have nuance, in order to power to each front end face from power supply board 106 reliably, on power supply board 106, set electroconductibility non-woven fabrics 108.
The surface of this electroconductibility non-woven fabrics 108, except that the contacting part that front end face touched of the lead-in wire 16,16 of head 10 and ground lead 18 with and neighbouring, cover by mask parts 110.
On these mask parts 110, for the contacting part of the electroconductibility non-woven fabrics 108 that front end face touched of the lead-in wire 16,16 that makes head 10 and ground lead 18 with and near expose, be formed with communicating pores 112.This communicating pores 112 also is the lead-in wire 16,16 of this head 10 of guiding and the guide hole of ground lead 18.
Moreover mask parts 110 are by pin 114,114 location, so that its communicating pores 112 is positioned on the corresponding magnet 104.
Patent documentation 1: the spy opens 2003-213497 communique (Fig. 5)
By a plurality of heads 10 (20) being implemented metallide with electroplating clamp shown in Figure 7, can omit each leading section with the lead-in wire 16,16 of head 10 (20) and ground lead 18 and be connected attended operation on the wires 100, and from metal wire 100 will go between 16,16, each leading section of ground lead 18 cuts off cuts off operations such as operation, can more easily implement metallide.
But, the difference of each length of the lead-in wire 16,16 of head 10 (20) and ground lead 18 to be controlled at the trickle degree that can enough electroconductibility non-woven fabrics 108 absorbs, just be necessary to go between 16,16 and each length of ground lead 18 carry out strict length management.
In addition, because each front end face of lead-in wire 16,16 and ground lead 18 contacts with electroconductibility non-woven fabrics 108, therefore can not carry out tone and the good metallide of tack.
On the other hand, utilizing the electric test of head 10 (20) the resulting semiconductor devices of having implemented metallide, is that test is carried out fetching with probe each front end face with lead-in wire 16,16 and ground lead 18.Therefore, require on each front end face of lead-in wire 16,16 and ground lead 18, also will form good coating.
Summary of the invention
Therefore, the object of the present invention is to provide the length management that can relax, and can on each leading section of lead-in wire and ground lead, form the electroplating clamp for electronic parts of coating for each length of lead-in wire that forms electronic component and ground lead.
The present invention examines in order to solve foregoing problems, found that the following fact, promptly, even if it is uneven how much to have some on the length of the lead-in wire of head and ground lead, if but be in contact with it for a part for each leading section of lead-in wire that is furthered by attraction and ground lead, and the contact surface that makes contact component forms curved surface, then be very favorable, and by powering to lead-in wire and ground lead from contact component, can on the major part of lead-in wire and each leading section of ground lead, form coating, thereby just reach purpose of the present invention.
Promptly, the present invention is a kind of electroplating clamp for electronic parts, it is that make a plurality of electronic components that comprise pedestal and ground lead each is self-align, to whole the electroplating clamp for electronic parts of implementing metallide that exposes face by each parts that metal constituted that form the aforementioned electronic part, wherein said pedestal is sealing the lead-in wire in the communicating pores that is inserted on the par that is formed on the metal member made by insulating material such as glass, described ground lead one end engages with the one side side of aforementioned metal member made; It is characterized in that possessing: power supply part, be provided on the one side side of base station, this base station is equipped with a plurality of magnet with the predetermined distance sealing so that form the mode that each front end of side-prominent lead-in wire of the one side to pedestal of this each electronic component and ground lead is attracted; Contact component is connected with aforementioned power supply part, by constituting with the magnetic substance that the mode that is contacted by the part of each leading section of lead-in wire that constitutes electronic component that aforementioned each magnet attracted and ground lead forms curved surface; And positioning element, be formed with and will constitute the guide hole of each front end of the lead-in wire of aforementioned each electronic component and ground lead to the curved surface guiding of the aforementioned contact component of correspondence.
In addition, the present invention is a kind of electrolytic plating apparatus, it is characterized in that, the power supply part that is loaded in the described electroplating clamp for electronic parts of claim 1 in the plating tank that stores metallide liquid is made as negative electrode, is being provided with anode with the positioning element of electroplating clamp at a distance of the place of predetermined distance with the aforementioned electronic part.
In the present invention, use spheroid, can more easily form the contacted curved surface of a part thus with each leading section of lead-in wire and ground lead as contact component.
Power supply part as to this contact component power supply uses flaky power supply part, covers the part except that the part that sets contact component on the surface of this power supply part with the mask parts, thus, can prevent to form coating on the surface of power supply part.
In addition, as positioning element, use metal positioning element, and with aforementioned positioning element as power supply part to lead-in wire and ground lead power supply, thus, to lead-in wire and ground lead, can power at Liang Chu, can seek reliability to the power supply of lead-in wire and ground lead.
This positioning element is set to and can swings, and be provided with so that constitute the pendulous device that different piece and the contacted mode of curved surface of corresponding contact component of each leading section of the lead-in wire of each electronic component and ground lead make aforementioned positioning element swing, thus, can on lead-in wire and each leading section of ground lead whole substantially, form coating.
Moreover in electroplating clamp for electronic parts of the present invention, can use from the radical of side-prominent lead-in wire of the one side of pedestal and ground lead is three electronic component more satisfactoryly.
According to electroplating clamp for electronic parts of the present invention, constitute the guide hole guiding of the parts that are positioned and be sealed in the lead-in wire of electronic component of the attraction in the base station and the part of each leading section of ground lead, even if the length of lead-in wire and ground lead is more or less different, also can contact with the curved surface of the contact component that constitutes by magnetic substance and be connected with power supply part.That is, even if the length of lead-in wire and ground lead is more or less different, when power supply, the part of each leading section of lead-in wire and ground lead also can contact with the curved surface of contact component simultaneously.
Therefore, by electroplating clamp for electronic parts of the present invention being loaded in the plating tank of having stored metallide liquid, the power supply part of this electroplating clamp for electronic parts is made as negative electrode, and this negative electrode and and the anode that is provided with at a distance of the place of predetermined distance of positioning element between logical on electric current, just can contact lead-in wire on the curved surface at contact component and ground lead in the part of leading section and form coating on the face with respectively exposing of metal member made of an engaged at end of ground lead.
In this metallide,, therefore can easily carry out the taking-up operation after metallide is finished because a plurality of electronic components are implemented metallide independently of one another.
And, because electronic component, be that the part of each front end by making its lead-in wire and ground lead contact with the curved surface of contact component and implements metallide, thus can go between and the major part of each leading section of ground lead on form coating.Therefore, even if in the electric test of final obtained semiconductor device etc., also can make test with the probe contact go between and each front end face of ground lead on and test.
Description of drawings
Fig. 1 is the summary section of an example of explanation electroplating clamp for electronic parts of the present invention.
Fig. 2 is the partial elevation view as the guiding part of positioning element shown in Figure 1.
Fig. 3 is another routine summary section of explanation electroplating clamp for electronic parts of the present invention.
Fig. 4 is that explanation replaces part sectioned view spheroid, another contact component as employed contact component in the electroplating clamp for electronic parts shown in Figure 1.
Fig. 5 is the fragmentary cross-sectional view of an example of explanation electronic component.
Fig. 6 is the front view of a form that the electronic component of enforcement metallide in the past is described.
Fig. 7 is the summary section that an example of the electroplating clamp for electronic parts of improveing is described.
Label declaration
10,20 heads, 12 pedestals
16 lead-in wires, 18 ground leads
30 magnet, 32 base stations
34 power supply parts, 36 spheroids (contact component)
38 mask parts, 40 communicating poress
42 guide plates (positioning element), 44 guide holes
46 pendulous devices
Embodiment
One example of in Fig. 1, having showed electroplating clamp for electronic parts of the present invention.Fig. 1 is the summary section of electroplating clamp for electronic parts, on separation seal assortment in accordance with regulations has one side side with the base station that is made of resin 32 of a plurality of magnet 30,30..., is equipped with flaky power supply part 34.
On the one side side of this power supply part 34, as contact component, the spheroid 36, the 36... that are made of the stainless steel as magnetic substance set in the mode that is attracted by corresponding magnet 30.Each spheroid 36,36..., the part of its sphere contacts with the surface of power supply part 34, and is electrically connected.
Be equipped with the one side side of the power supply part 34 of this spheroid 36, the part that sets except that spheroid 36 with and neighbouring, cover by resinous mask parts 38.That is, on mask parts 38, on the position corresponding, be equipped with the communicating pores 40 that sets spheroid 36,36... with each magnet 30,30....
Like this, on the corresponding locational spheroid 36 of each magnet 30,30... on the prescribed position that is provided in and is equipped on substrate 32, the lead-in wire 16,16 of the head 10 shown in Fig. 5 (a) and each front end of ground lead 18 are attracted by magnet 30.With will go between 16,16 and ground lead 18 reliably to the mode of the direction guiding of the corresponding spheroid 36 of its each front end, what will be formed with a plurality of guide holes 44,44... is provided in the top of spheroid 36,36... as the guide plate 42 of positioning element.
On this guide plate 42, be provided in triangular shape under the situation on the head 10 at lead-in wire 16,16 and ground lead 18, as shown in Figure 2, form leg-of- mutton guide hole 44,44....In guide hole shown in Figure 2 44, lead-in wire 16,16 and ground lead 18 are positioned near its each summit, be inserted in the guide hole 44 by lead-in wire 16,16 and ground lead 18 head 10, can be reliably with each front end of lead-in wire 16,16 and ground lead 18 direction guiding to spheroid 36.
Be inserted into each guide hole 44 of the guide plate 42 of electroplating clamp for electronic parts shown in Figure 1, the lead-in wire 16,16 of the head 10 among the 44... and each front end of ground lead 18, the magnetic force of guiding by guide hole 44,44... and magnet 30,30..., the sphere contact of the part of its leading section and corresponding spheroid 36.
At this because the contact surface that a part contacted of lead-in wire 16,16 and each leading section of ground lead 18 is a sphere, even if therefore go between 16,16 and the length of ground lead 18 somewhat different, the part of each leading section also can contact with contact surface.Therefore, can relax the degree of the length management of lead-in wire 16,16 and ground lead 18.
To when the exposing face and implement metallide of each parts that constitutes by metal of the lead-in wire 16,16 that is loaded in head 10 on the electroplating clamp for electronic parts shown in Figure 1, a plurality of, 10... and ground lead 18 etc., the electroplating clamp for electronic parts shown in Figure 1 that has loaded a plurality of heads 10,10... is loaded in the plating tank of having stored metallide liquid, the power supply part 34 of this electroplating clamp for electronic parts is made as negative electrode, with guiding part 42 anode (figure does not show) is being set at a distance of the place of predetermined distance simultaneously.
Then, leading to galvanic current between this power supply part 34 and the anode, head 10, the 10... that is loaded on the electroplating clamp for electronic parts implemented metallide.By this metallide, can head 10,10... respectively go between 16,16, exposing on whole of face of ground lead 18 and pedestal 12 form coating.
At this moment, on each leading section of lead-in wire 16,16 and ground lead 18, except the contact part that the sphere with spheroid 36 contacts, on the major part of each leading section, also can form coating.
In this metallide, head 10,10... can implement metallide under separate state, can not produce cut because of colliding each other, also can not kink together with other lead-in wire 16 grades of head 10.Therefore when metallide is finished,, can take out at an easy rate by each head 10,10... are pulled up from the guide plate 42 of electroplating clamp for electronic parts.
Each head 10, the 10... that take out can both form coating in exposing on whole of face of lead-in wire 16,16, ground lead 18 and pedestal 12.
In the electroplating clamp for electronic parts shown in the figure, in metallide, on the sphere of spheroid 36,36..., also formed coating.Therefore, preferably regularly replace spheroid 36,36....
In addition, even if use electroplating clamp for electronic parts shown in Figure 1, on the contact part that the sphere with spheroid 36 in each leading section of lead-in wire 16,16 and ground lead 18 contacts, can not form coating yet.
For this reason, by using electroplating clamp for electronic parts shown in Figure 3, can on whole substantially of each leading section of lead-in wire 16,16 and ground lead 18, form coating.
Electroplating clamp for electronic parts shown in Figure 3 is made of the parts identical substantially with Fig. 1 and electroplating clamp for electronic parts shown in Figure 2.Therefore, be under the situation of same parts at the parts that constitute electroplating clamp for electronic parts shown in Figure 3 with the parts that constitute electroplating clamp for electronic parts shown in Figure 1, in Fig. 3 additional phase with label and omit detailed explanation.
In electroplating clamp for electronic parts shown in Figure 3, be provided with in the mode that can swing as the guide plate 42 of positioning element, swing along arrow A direction (Fig. 3) by pendulous device 46.By the swing of this guide plate 42, lead-in wire 16,16 and each leading section of ground lead 18, by the magnetic attraction of magnet 30 on the sphere of spheroid 36, and with the different piece and swinging like that the sphere of spheroid 36 contacts of each leading section.Therefore, in each leading section of lead-in wire 16,16 and ground lead 18, different piece becomes the contact part that contacts with the sphere of spheroid 36 in turn, thereby by to lead-in wire 16,16 and ground lead 18 power supplies, just can form coating on whole substantially of each leading section.
And then, because the lead-in wire 16,16 that contacts with the inner-wall surface of the guide hole 44 of guide plate 42 and the contact part of ground lead 18, also can leave, therefore can on the periphery of lead-in wire 16,16 and ground lead 18, be formed uniformly coating by the swing of guide plate 42.
In addition, in Fig. 1 and electroplating clamp for electronic parts shown in Figure 3, preferably guide plate 42 is made as metal system, and guide plate 42 is used as the power supply part to lead-in wire 16,16 and ground lead 18 power supplies.
Like this, by guide plate 42 is used as power supply part, even if go between 16,16 and any one sphere of the leading section of ground lead 18 from spheroid 36 leave, also can be from guide plate 42 power supplies, can be reliably to lead-in wire 16,16 and ground lead 18 power supplies.
Though the contact component as Fig. 1 and electroplating clamp for electronic parts shown in Figure 3 has used spheroid 36, and is also hemispherical, also can use contact component shown in Figure 4 50.
Contact component 50 shown in Fig. 4 (a) is to be formed with to the side-prominent hemisphere 54 of one side, the parts of 54... with predetermined distance on the regulation position of metal tabular body 52.This hemisphere 54,54... can be hemisphere 54a, the 54a... of hollow form shown in Fig. 4 (b) like that also.
In addition, as contact component 50, also can be as Fig. 4 (c), on the regulation position of tabular body 52 to hemispheric recess 54b, the 54b... of a side opening.
Moreover, on the tabular surface of tabular body shown in Figure 4 52, be covered with resinous mask parts 38.
In addition, the contact component of electroplating clamp for electronic parts is not limited to above-mentioned hemispherical, if go between at least 16,16 and the face that contacted of ground lead 18 be curved surface with a radius-of-curvature.
Claims (18)
1. electroplating clamp for electronic parts, it is that make a plurality of electronic components that comprise pedestal and ground lead each is self-align, to whole the electroplating clamp for electronic parts of implementing metallide that exposes face by each parts that metal constituted that form the aforementioned electronic part, wherein said pedestal is sealing the lead-in wire in the communicating pores that is inserted on the par that is formed on the metal member made by insulating material such as glass, described ground lead one end engages with the one side side of aforementioned metal member made; It is characterized in that possessing:
Power supply part is provided on the one side side of base station, and this base station is equipped with a plurality of magnet with the predetermined distance sealing so that form the mode that each front end of side-prominent lead-in wire of the one side to pedestal of this each electronic component and ground lead is attracted;
Contact component is connected with aforementioned power supply part, by constituting with the magnetic substance that forms curved surface like that is contacted by the part of each leading section of lead-in wire that constitutes electronic component that aforementioned each magnet attracted and ground lead; And
Positioning element is formed with and will constitutes the guide hole of each front end of the lead-in wire of aforementioned each electronic component and ground lead to the curved surface guiding of the aforementioned contact component of correspondence.
2. electroplating clamp for electronic parts as claimed in claim 1, wherein contact component is the spheroid that is made of magnetic substance.
3. electroplating clamp for electronic parts as claimed in claim 1 or 2, wherein power supply part is flaky power supply part, the surface of aforementioned flaky power supply part covers by the mask parts except that the part that sets contact component.
4. electroplating clamp for electronic parts as claimed in claim 1 or 2, wherein positioning element is metal positioning element, aforementioned positioning element is still to the power supply part that goes between and ground lead is powered.
5. electroplating clamp for electronic parts as claimed in claim 3, wherein positioning element is metal positioning element, aforementioned positioning element is still to the power supply part that goes between and ground lead is powered.
6. electroplating clamp for electronic parts as claimed in claim 1 or 2, wherein positioning element is provided with in the mode that can swing, and is provided with so that constitute the pendulous device that different piece and the contacted mode of curved surface of corresponding contact component of each leading section of the lead-in wire of each electronic component and ground lead make aforementioned positioning element swing.
7. electroplating clamp for electronic parts as claimed in claim 3, wherein positioning element is provided with in the mode that can swing, and is provided with so that constitute the pendulous device that different piece and the contacted mode of curved surface of corresponding contact component of each leading section of the lead-in wire of each electronic component and ground lead make aforementioned positioning element swing.
8. electroplating clamp for electronic parts as claimed in claim 4, wherein positioning element is provided with in the mode that can swing, and is provided with so that constitute the pendulous device that different piece and the contacted mode of curved surface of corresponding contact component of each leading section of the lead-in wire of each electronic component and ground lead make aforementioned positioning element swing.
9. electroplating clamp for electronic parts as claimed in claim 5, wherein positioning element is provided with in the mode that can swing, and is provided with so that constitute the pendulous device that different piece and the contacted mode of curved surface of corresponding contact component of each leading section of the lead-in wire of each electronic component and ground lead make aforementioned positioning element swing.
10. electroplating clamp for electronic parts as claimed in claim 1 or 2, wherein electroplating clamp for electronic parts is to be the electroplating clamp for electronic parts that three electronic component is implemented metallide to the radical from side-prominent lead-in wire of the one side of pedestal and ground lead.
11. electroplating clamp for electronic parts as claimed in claim 3, wherein electroplating clamp for electronic parts is to be the electroplating clamp for electronic parts that three electronic component is implemented metallide to the radical from side-prominent lead-in wire of the one side of pedestal and ground lead.
12. electroplating clamp for electronic parts as claimed in claim 4, wherein electroplating clamp for electronic parts is to be the electroplating clamp for electronic parts that three electronic component is implemented metallide to the radical from side-prominent lead-in wire of the one side of pedestal and ground lead.
13. electroplating clamp for electronic parts as claimed in claim 5, wherein electroplating clamp for electronic parts is to be the electroplating clamp for electronic parts that three electronic component is implemented metallide to the radical from side-prominent lead-in wire of the one side of pedestal and ground lead.
14. electroplating clamp for electronic parts as claimed in claim 6, wherein electroplating clamp for electronic parts is to be the electroplating clamp for electronic parts that three electronic component is implemented metallide to the radical from side-prominent lead-in wire of the one side of pedestal and ground lead.
15. electroplating clamp for electronic parts as claimed in claim 7, wherein electroplating clamp for electronic parts is to be the electroplating clamp for electronic parts that three electronic component is implemented metallide to the radical from side-prominent lead-in wire of the one side of pedestal and ground lead.
16. electroplating clamp for electronic parts as claimed in claim 8, wherein electroplating clamp for electronic parts is to be the electroplating clamp for electronic parts that three electronic component is implemented metallide to the radical from side-prominent lead-in wire of the one side of pedestal and ground lead.
17. electroplating clamp for electronic parts as claimed in claim 9, wherein electroplating clamp for electronic parts is to be the electroplating clamp for electronic parts that three electronic component is implemented metallide to the radical from side-prominent lead-in wire of the one side of pedestal and ground lead.
18. electrolytic plating apparatus, it is characterized in that, the power supply part that is loaded in the described electroplating clamp for electronic parts of claim 1 in the plating tank that stores metallide liquid is made as negative electrode, is being provided with anode with the positioning element of electroplating clamp at a distance of the place of predetermined distance with the aforementioned electronic part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP376041/2003 | 2003-11-05 | ||
| JP2003376041A JP4164435B2 (en) | 2003-11-05 | 2003-11-05 | Electronic parts plating jig and electrolytic plating equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1621573A true CN1621573A (en) | 2005-06-01 |
| CN100587125C CN100587125C (en) | 2010-02-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200410086028A Active CN100587125C (en) | 2003-11-05 | 2004-10-22 | Electroplating clamp for electronic parts and electrolytic plating device |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP4164435B2 (en) |
| KR (1) | KR101153276B1 (en) |
| CN (1) | CN100587125C (en) |
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| CN101240443B (en) * | 2006-11-15 | 2011-02-09 | 新光电气工业株式会社 | Electroplating apparatus and electroplating method and plating jig |
| CN102376588A (en) * | 2010-08-09 | 2012-03-14 | 美士美积体产品公司 | Side wettable plating for semiconductor chip package |
| CN114875467A (en) * | 2021-05-13 | 2022-08-09 | 唐中山 | Sensor tube seat lead electroplating tooling equipment |
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| JP4961518B2 (en) * | 2006-03-07 | 2012-06-27 | 株式会社日本アレフ | Electroplating equipment |
| JP2010098112A (en) * | 2008-10-16 | 2010-04-30 | Shinko Electric Ind Co Ltd | Stem for optical semiconductor, method of electrolytic gold plating semiconductor stem, and optical semiconductor device |
| CN102776551B (en) * | 2012-07-04 | 2015-11-25 | 中国电子科技集团公司第四十一研究所 | A kind of hard microstrip circuit electroplating clamp |
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| US4042480A (en) * | 1973-10-04 | 1977-08-16 | Noz Francis X | Apparatus for selectively applying a metal coating to the metallic parts of elements which pass through an insulator |
| JPH0823063A (en) * | 1994-07-06 | 1996-01-23 | Sumitomo Kinzoku Ceramics:Kk | Ic package plating frame and dismounting method thereof |
| JP2000038696A (en) * | 1998-05-20 | 2000-02-08 | Toshiba Electronic Engineering Corp | Production of bearing |
| JP2002249892A (en) * | 2001-02-23 | 2002-09-06 | Nec Tokin Ceramics Corp | Soldering device for lead terminal of electronic parts |
| JP3620531B2 (en) * | 2001-11-14 | 2005-02-16 | 松下電器産業株式会社 | Electronic component, plating jig, and plating method using the same |
| JP4820736B2 (en) * | 2006-11-15 | 2011-11-24 | 新光電気工業株式会社 | Electrolytic plating apparatus, electrolytic plating method, and plating jig |
-
2003
- 2003-11-05 JP JP2003376041A patent/JP4164435B2/en not_active Expired - Lifetime
-
2004
- 2004-10-12 KR KR1020040081459A patent/KR101153276B1/en active IP Right Grant
- 2004-10-22 CN CN200410086028A patent/CN100587125C/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101240443B (en) * | 2006-11-15 | 2011-02-09 | 新光电气工业株式会社 | Electroplating apparatus and electroplating method and plating jig |
| CN102376588A (en) * | 2010-08-09 | 2012-03-14 | 美士美积体产品公司 | Side wettable plating for semiconductor chip package |
| CN102376588B (en) * | 2010-08-09 | 2016-12-28 | 马克西姆综合产品公司 | For the wettable plating in the side of semiconductor die package |
| CN114875467A (en) * | 2021-05-13 | 2022-08-09 | 唐中山 | Sensor tube seat lead electroplating tooling equipment |
| CN114875467B (en) * | 2021-05-13 | 2023-10-20 | 唐中山 | Sensor tube seat lead electroplating tooling equipment |
Also Published As
| Publication number | Publication date |
|---|---|
| KR101153276B1 (en) | 2012-06-07 |
| KR20050043618A (en) | 2005-05-11 |
| JP2005139500A (en) | 2005-06-02 |
| JP4164435B2 (en) | 2008-10-15 |
| CN100587125C (en) | 2010-02-03 |
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