CN1617439A - Crystal oscillator capable of self correction and its correcting method and its special integrated circuit - Google Patents
Crystal oscillator capable of self correction and its correcting method and its special integrated circuit Download PDFInfo
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- CN1617439A CN1617439A CN 200310114298 CN200310114298A CN1617439A CN 1617439 A CN1617439 A CN 1617439A CN 200310114298 CN200310114298 CN 200310114298 CN 200310114298 A CN200310114298 A CN 200310114298A CN 1617439 A CN1617439 A CN 1617439A
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- 239000013078 crystal Substances 0.000 title claims abstract description 66
- 238000012937 correction Methods 0.000 title claims description 18
- 238000000034 method Methods 0.000 title description 4
- 230000015654 memory Effects 0.000 claims abstract description 16
- 238000012360 testing method Methods 0.000 claims description 12
- 238000003860 storage Methods 0.000 claims description 9
- 239000000872 buffer Substances 0.000 claims description 4
- 230000009183 running Effects 0.000 claims description 3
- 238000010897 surface acoustic wave method Methods 0.000 claims description 3
- 230000004913 activation Effects 0.000 claims 2
- 230000010355 oscillation Effects 0.000 abstract description 4
- 239000010453 quartz Substances 0.000 description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 13
- 238000010586 diagram Methods 0.000 description 10
- 238000001514 detection method Methods 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 3
- 230000008676 import Effects 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005086 pumping Methods 0.000 description 1
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Abstract
This invention discloses a self-calibrated crystal oscillator includes a phase comparator, a clock signal pad electrically connected to a first input end of said phase comparator, an oscillation element electrically connected to a second input end of said phase comparator, an analog/digital converter connected to the output end of said phase comparator and a memory connected with the output end of said analog/digital converter. Said element is a temperature compensation oscillation element or a surface acoustic oscillation element further including a first switch between the first input end and said clock signal pad, a second switch between the element and the signal pad and a logic control switch.
Description
Technical field
The present invention relates to a kind of crystal oscillator, especially, relate to a kind of crystal oscillator capable of self correction, it can shorten the detection time of finished product and reduce the integrated testability cost.
Background technology
Crystal oscillator generally is applied to need to stablize in the electronic product of output frequency, for example mobile communication electronic product such as mobile phone.This type of crystal oscillator adopts the AT of frequency about 10MHz to block (AT-cut) quartz plate to constitute oscillating circuit as vibration source mostly.Can change with the temperature around it because this AT blocks the output frequency of quartz plate, therefore in fact must design a kind of temperature-compensation circuit to eliminate the variation that this AT blocks the output frequency of quartz plate.
Fig. 1 illustration one AT blocks the graph of a relation of the output frequency of quartz plate to environment temperature.As shown in Figure 1, output frequency and environment temperature that this AT blocks quartz plate roughly are the cubic curve relation, for example: f=α T
3+ β T
2+ γ T+ δ.This cubic curve can be divided into low temperature, middle temperature and three temperature ranges of high temperature.In low temperature interval (35 ℃ to+10 ℃ approximately), this curve comprises the range of linearity of positive slope and changes the nonlinear area of slope polarity.At middle temperature range (+10 ℃ to+50 ℃), this curve has the range of linearity of negative slope.In the high-temperature interval (+50 ℃ to+90 ℃), this curve comprises the range of linearity of positive slope and changes the nonlinear area of slope polarity.
Fig. 2 is the circuit diagram of an existing crystal oscillator 10.As shown in Figure 2, crystal oscillator 10 comprises a temperature sensing circuit 12, an oscillating circuit 20 and a temperature-compensation circuit 40.Oscillating circuit 20 comprises an AT to be blocked quartz plate 22, and is parallel to the feedback resistance 24 and that AT blocks quartz plate 22 and is parallel to the inverter 26 that AT blocks quartz plate 22.The output 28 of crystal oscillator 10 stretches out from the outlet side of inverter 26.Oscillating circuit 20 also comprises and is electrically connected in two direct currents that AT blocks quartz plate 22 two ends respectively and blocks 32,34 and two variable capacitances 36,38 of electric capacity.Temperature sensing circuit 12 can utilize a thermistor to detect AT and block temperature around the quartz plate 22, and temperature-compensation circuit 40 then basis is maintained a predetermined value from the temperature detection signal of temperature sensing circuit 12 with the output frequency of oscillating circuit 20.
Temperature-compensation circuit 40 comprises a memory circuit 42 and a D/A conversion circuit 44.Memory circuit 42 generally is to be made of nonvolatile memory, is used to store carry out the required offset data of temperature-compensating (promptly being used to describe the parameter of cubic curve).D/A conversion circuit 44 is controlled voltage according to this offset data and from the temperature detection signal output one of temperature sensing circuit 12, and this control voltage puts on the positive pole of variable capacitance 36,38 respectively to adjust its oscillating capacitance.Like this, i.e. the frequency of oscillation of this oscillating circuit 20 of may command, and make the output frequency of crystal oscillator 10 maintain in the scope that product specification allows.
Because it is that mechanically (laser) cutting forms that AT blocks quartz plate 22, so each sheet AT blocks the thickness of quartz plate 22 and cutting angle and incomplete same, causes its characteristic using temperature-frequency also different each other.In like manner, the property difference that also exists the processing procedure drift to be caused between the electronic component of crystal oscillator 10.Generally speaking, crystal oscillator 10 exists the difference that produces because of fabrication schedule to each other, therefore the characteristic using temperature-frequency of each crystal oscillator 10 is also inequality, therefore must measure the characteristic using temperature-frequency of each crystal oscillator 10, and produce according to this behind the temperature compensation data in the write storage circuit 42 in the temperature range (high, medium and low three temperature ranges) of running.Yet the characteristic using temperature-frequency of measuring each crystal oscillator 10 respectively is a quite time-consuming job, causes the integrated testability cost of crystal oscillator 10 sharply to increase.
Summary of the invention
Main purpose of the present invention is to provide a kind of crystal oscillator capable of self correction, and its detection time that can shorten finished product is to reduce the integrated testability cost.
In order to achieve the above object, the invention provides a kind of crystal oscillator capable of self correction, it comprises the analog/digital converter that oscillating element, that clock signal pad, that a phase comparator, is electrically connected in the first input end of this phase comparator is electrically connected in second input of this phase comparator is electrically connected in the output of this phase comparator, and a memory that is electrically connected in the output of this analog/digital converter.This oscillating element is a temperature compensating type oscillating element or a surface acoustic wave oscillating element, and this memory is a nonvolatile memory.
Crystal oscillator capable of self correction of the present invention also can comprise one and be arranged at the first input end of this phase comparator and first switch, between this clock signal pad and be arranged at the logic control element that second switch and between this oscillating element and this clock signal pad is used to control this first switch and this second switch.When this crystal oscillator when calibrating voluntarily, this second switch is to be in closed condition and this first switch is to be in opening, therefore a reference clock can be delivered to the first input end of this phase comparator via this clock signal dig pass.Correspondingly, when this crystal oscillator desire was exported a clock signal, this first switch was to be in closed condition and this second switch is to be in opening, so the clock signal of this oscillating element can the output stably via this clock signal pad after temperature compensated.
Compared with prior art, because crystal oscillator of the present invention can be calibrated after receiving this calibrating signal voluntarily, therefore a test platform can carry out temperature correction the while (abreast) behind several crystal oscillators in parallel.Like this, the alignment time that this test platform consumed is divided equally by these several crystal oscillators, thereby the alignment time of reducing each crystal oscillator is to reduce its testing cost.
Description of drawings
Fig. 1 illustration one AT blocks the graph of a relation of the output frequency of quartz plate to environment temperature;
Fig. 2 is the circuit diagram of an existing crystal oscillator;
Fig. 3 is the schematic diagram according to crystal oscillator of the present invention;
Fig. 4 is the functional block diagram according to integrated circuit of the present invention;
Fig. 5 is the operation workflow figure according to crystal oscillator of the present invention;
Fig. 6 is the schematic diagram in parallel according to crystal oscillator of the present invention;
Fig. 7 is the functional block diagram according to application-specific integrated circuit (ASIC) of the present invention.
Component symbol explanation among the figure:
50 crystal oscillators
52 oscillating elements
60 integrated circuits
62,102 clock signal pads
64 power source pads
66 ground mats
68 control pads
70,110 phase comparators,
70A, 110A first input end,
70B, 110B second input,
70C, 110C output
72,112 first switches
74,114 second switches
76 logic control elements
78 high-voltage detector
80,120 analog/digital converters
The 80C output
82,134 digital/analog converters
84,136 Temperature Detectors
90 memories
100 application-specific integrated circuit (ASIC)s,
122 system buss, 124 built-in processors, 126 system storages
132 buffers
Implement best mode of the present invention
Fig. 3 is the schematic diagram according to crystal oscillator capable of self correction 50 of the present invention.As shown in Figure 3, crystal oscillator capable of self correction 50 comprises integrated circuit 60, a clock signal pad 62, a power source pad 64, a ground mat 66 and the control pad 68 that an oscillating element 52, is electrically connected in oscillating element 52.Oscillating element 52 can be a temperature compensating type oscillating element or a surface acoustic wave oscillating element.
The functional block diagram of Fig. 4 according to integrated circuit 60 of the present invention.As shown in Figure 4, integrated circuit 60 comprises the memory 90 that analog/digital converter 80 and that a phase comparator 70, is electrically connected in the output 70C of phase comparator 70 is electrically connected in the output 80C of analog/digital converter 80.Clock signal pad 62 is the first input end 70A that are electrically connected in phase comparator 70, and oscillating element 52 is the second input 70B that are electrically connected in phase comparator 70.Memory 90 is nonvolatile memories.
Also can comprise one according to integrated circuit 60 of the present invention and be arranged at the first input end 70A of phase comparator 70 and first switch 72, between the clock signal pad 62 and be arranged at second switch 74 and between oscillating element 52 and the clock signal pad 62 in order to control the logic control element 76 of first switch 72 and second switch 74, wherein the data flow direction of second switch 74 is in contrast to the data flow direction of first switch 72.The required work clock of logic control element 76 runnings can be provided by a built-in clock generator (for example resistance capacitance clock generator).Integrated circuit 60 also can comprise a high-voltage detector 78 that is electrically connected power source pad 64 and logic control element 76.
When crystal oscillator 50 when calibrating voluntarily, logic control element 76 is closed second switch 74 and is opened first switch 72.Therefore a test platform can be imported the first input end 70A of a reference clock to phase comparator 70 via the clock signal pad 62 and first switch 72.Phase comparator 70 compares the clock of reference clock and oscillating element 52 and produces a phase signal (being frequency error signal), and analog/digital converter 80 then converts this phase signal to one digital signal (temperature compensation data) back and is stored in memory 90 by a booster circuit (pumping circuit).
Correspondingly, when crystal oscillator 50 desires are exported a clock signal, logic control element 76 will be closed first switch 72 and be opened second switch 74.82 bases of digital/analog converter are stored in the temperature compensation data of memory 90 and export a control voltage calibrating the clock of this oscillating element 52 from the temperature detection signal of Temperature Detector 84, so the clock of oscillating element 52 can stably be exported via second switch 74 and clock signal pad 62 after temperature compensated.
Fig. 5 is the operation workflow figure according to crystal oscillator 50 of the present invention.As shown in Figure 5, check at first whether this supply voltage is higher than a critical voltage, wherein this critical voltage can be set as for example 120% supply voltage.If this supply voltage is lower than this critical voltage, then crystal oscillator 50 is to be in the normal operation pattern and to export temperature compensated clock signal.If this supply voltage is to be higher than this critical voltage, check then whether ambient temperature is last calibration temperature (generally speaking, crystal oscillator needs to calibrate in low temperature, middle temperature, three temperature ranges of high temperature respectively).If last calibration temperature then stops calibration procedure.If not last calibration temperature then starts oscillating element 52 and imports a reference clock from clock signal pad 62.Afterwards, phase comparator 70 relatively this reference clock and oscillating element 52 clock and produce a phase signal (being frequency error signal).Analog/digital converter 80 then converts this frequency error signal to a digital signal, and via a booster circuit write memory 90.Afterwards, oscillating element 52 is closed and is carried out the calibration of next temperature.
Fig. 6 is the schematic diagram in parallel according to crystal oscillator 50 of the present invention.Because crystal oscillator 50 of the present invention can be calibrated after being higher than the voltage (being calibrating signal) of supply voltage 120% voluntarily receiving one, therefore after can clock signal pad (CLK) 62, power source pad (VDD) 64, ground mat (GND) 66 and control pad (PDN) 68 of several crystal oscillators 50 in parallel, import these reference clocks by a test platform by clock signal pad 62 again, and import these calibrating signals to activate logic control element 76 via power source pad 64.Afterwards, the logic control element 76 of each crystal oscillator 50 can be controlled the trip temperature calibration procedure of going forward side by side voluntarily.That is to say that each crystal oscillator 50 is that (abreast) carries out temperature correction simultaneously.
Fig. 7 is the functional block diagram according to application-specific integrated circuit (ASIC) 100 of the present invention.As shown in Figure 7, application-specific integrated circuit (ASIC) 100 comprises the analog/digital converter 120 that system storage 126 that built-in processor 124, that a system bus 122, is electrically connected in system bus 122 is electrically connected in system bus 122, phase comparator 110, that a clock signal pad 102, is electrically connected in clock signal pad 102 are electrically connected in the output 110C of phase comparator 110.Analog/digital converter 120 also is electrically connected in system bus 122, so that its output is sent to system storage 124 via system bus 122.Application-specific integrated circuit (ASIC) 100 also comprises one and is arranged at the first input end 110A of phase comparator 110 and first switch 112 between the clock signal pad 102, and a second switch 114 that is arranged between an outside oscillating element 130 and the clock signal pad 102.
Application-specific integrated circuit (ASIC) 100 is when carrying out the temperature correction of outside oscillating element 130, and built-in processor 124 transmits a control command to cut out second switch 114 and to open first switch 112 via system bus 122.Therefore a test platform can be imported the first input end 110A of a reference clock to phase comparator 110 via the clock signal pad 102 and first switch 112.Phase comparator 110 relatively this reference clock and outside oscillating element 130 clock and produce a phase signal (being frequency error signal), analog/digital converter 120 then converts this frequency error signal to a digital signal (temperature compensation data) after be stored in system storage 126 by system bus 122.
Correspondingly, when application-specific integrated circuit (ASIC) 100 desires are exported a clock signal, built-in processor 124 transmits a control command cutting out first switch 112 and to open second switch 114 via system bus 122, and the temperature compensation data that will be stored in system storage 106 loads on buffer 132.134 bases of digital/analog converter are stored in the temperature compensation data of buffer 132 and from the temperature detection signal of Temperature Detector 136, output one control voltage is to calibrate the clock of outside oscillating element 130.Therefore the clock of outside oscillating element 130 can stably be exported via second switch 114 and clock signal pad 102 after temperature compensated.
Compared with prior art, because crystal oscillator 50 according to the present invention can be calibrated voluntarily, therefore can the while (abreast) carry out temperature correction after receiving calibrating signal at several crystal oscillator 50 backs one test platforms in parallel.Like this, the alignment time that test platform consumed is divided equally by several crystal oscillators 50, thereby the alignment time of reducing each crystal oscillator 50 is to reduce its testing cost.
As mentioned above, disclose technology contents of the present invention and technical characterstic, yet those skilled in the art still can reach open all replacement and modifications that does not deviate from spirit of the present invention of doing according to teaching of the present invention.Therefore, protection scope of the present invention should be not limited to the content that embodiment discloses, and should comprise various do not deviate from replacement of the present invention and modifications, and is contained by the present patent application claim.
Claims (13)
1. crystal oscillator capable of self correction is characterized in that comprising:
One phase comparator comprises a first input end, one second input and an output;
One clock signal pad is electrically connected in this first input end;
One oscillating element is electrically connected in this second input;
One analog/digital converter is electrically connected in the output of this phase comparator;
One memory is electrically connected in the output of this analog/digital converter.
2. crystal oscillator capable of self correction as claimed in claim 1 is characterized in that described oscillating element is a temperature compensating type oscillating element or a surface acoustic wave oscillating element.
3. crystal oscillator capable of self correction as claimed in claim 1 is characterized in that also comprising:
One first switch is arranged between the first input end and this clock signal pad of this phase comparator;
One second switch is arranged between this oscillating element and this clock signal pad, and the data flow direction of this second switch is opposite with this first switch;
One logic control element is used to control this first switch and this second switch.
4. crystal oscillator capable of self correction as claimed in claim 3 is characterized in that also comprising:
One power source pad;
One high-voltage detector is electrically connected this power source pad and this logic control element.
5. crystal oscillator capable of self correction as claimed in claim 3 is characterized in that also comprising a built-in clock generator, is used to provide this logic control element running required work clock.
6. crystal oscillator capable of self correction as claimed in claim 5 is characterized in that described built-in clock generator is a RC oscillator.
7. the application-specific integrated circuit (ASIC) of a crystal oscillator is characterized in that comprising:
One system bus;
One built-in processor is electrically connected in this system bus;
One system storage is electrically connected in this system bus;
One clock signal pad can receive a reference clock;
One phase comparator is used to produce the clock of oscillating element of this crystal oscillator and the frequency error of this reference clock;
One analog/digital converter is used for converting this frequency error to a digital signal, and is stored in this system storage through this system bus.
8. the application-specific integrated circuit (ASIC) of crystal oscillator as claimed in claim 7 is characterized in that also comprising:
One first switch is arranged between this phase comparator and this clock signal pad;
One second switch is arranged between this oscillating element and this clock signal pad.
9. the application-specific integrated circuit (ASIC) of crystal oscillator as claimed in claim 8 is characterized in that also comprising a buffer that is electrically connected in system bus, is used for the data of storing this system storage when this second switch is opened.
10. the calibration steps of a crystal oscillator is characterized in that comprising the following step:
Several crystal oscillators in parallel;
By test platform input one test activation signal and reference clock to these several crystal oscillators;
Each crystal oscillator is clock and this reference clock of its inner oscillating element relatively, and produces a frequency error signal;
Each crystal oscillator writes its inner memory with this frequency error signal.
11. the calibration steps of crystal oscillator as claimed in claim 10 is characterized in that described test activation signal is one to be higher than the voltage of a critical voltage.
12. the calibration steps of crystal oscillator as claimed in claim 10 is characterized in that also comprising each crystal oscillator and checks whether an ambient temperature equals the step of a last calibration temperature.
13. the calibration steps of crystal oscillator as claimed in claim 10 is characterized in that it also comprises the step that this frequency error signal is converted to a digital signal.
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CNB2003101142980A CN100395956C (en) | 2003-11-12 | 2003-11-12 | Crystal oscillator capable of self correction and its correcting method and its special integrated circuit |
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CN100395956C CN100395956C (en) | 2008-06-18 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101399577B (en) * | 2007-09-28 | 2012-09-19 | 联芯科技有限公司 | Mobile communication terminal and crystal oscillator parameter calibrating method thereof |
CN105141295A (en) * | 2015-07-30 | 2015-12-09 | 灿芯半导体(上海)有限公司 | Self-calibration circuit of built-in clock |
CN113552794A (en) * | 2021-06-24 | 2021-10-26 | 南方电网科学研究院有限责任公司 | Automatic calibration device and method for clock signal in power chip |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101030777B (en) * | 2006-03-02 | 2010-12-08 | 中颖电子(上海)有限公司 | Apparatus and method for calibrating realtime clock source |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5406228A (en) * | 1994-07-12 | 1995-04-11 | General Instrument | Ring oscillator with frequency control loop |
FR2726705B1 (en) * | 1994-11-04 | 1996-12-20 | Asulab Sa | HIGH STABILITY FREQUENCY GENERATOR |
JPH0918234A (en) * | 1995-04-27 | 1997-01-17 | Seiko Epson Corp | Temperature compensated piezoelectric oscillator |
CN1166051C (en) * | 2001-08-09 | 2004-09-08 | 西安电子科技大学 | Analogue storage method and its temp. compensation crystal oscillator |
-
2003
- 2003-11-12 CN CNB2003101142980A patent/CN100395956C/en not_active Expired - Lifetime
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101399577B (en) * | 2007-09-28 | 2012-09-19 | 联芯科技有限公司 | Mobile communication terminal and crystal oscillator parameter calibrating method thereof |
CN105141295A (en) * | 2015-07-30 | 2015-12-09 | 灿芯半导体(上海)有限公司 | Self-calibration circuit of built-in clock |
CN105141295B (en) * | 2015-07-30 | 2017-10-10 | 灿芯半导体(上海)有限公司 | The self-calibration circuit of embedded clock |
CN113552794A (en) * | 2021-06-24 | 2021-10-26 | 南方电网科学研究院有限责任公司 | Automatic calibration device and method for clock signal in power chip |
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