CN1614759A

CN1614759A - Plastic moulding method and composite granules for integrated plug

Info

Publication number: CN1614759A
Application number: CN 200310112069
Authority: CN
Inventors: 黄伟鹏
Original assignee: Individual
Current assignee: Individual
Priority date: 2003-11-05
Filing date: 2003-11-05
Publication date: 2005-05-11
Anticipated expiration: 2023-11-05
Also published as: CN1309037C

Abstract

The method includes following steps: 1) the epoxy resin is heated to become liquid state; 2) the liquid epoxy resin is poured into mould for embedding; 3) the signal pin is inserted into the mould and is fixed; 4) the mould is baked until the epoxy resin cure; 5) demoulding.

Description

A kind of integrated mold manufacture method and composite plastic mould grain thereof that receives head

Technical field

The present invention relates to a kind of integrated mold manufacture method of head and composite plastic mould grain that manufactures with this method of receiving.

Background technology

The integrated conventional packing forms that receives head is the hot-die encapsulation, is primarily aimed at the integrated encapsulation that receives head of profile as shown in figure 15.Its main implementation is as follows:

1, encapsulating mould adopts cover die;

2, sealed in unit has hydraulic press, high frequency preheater;

3, the encapsulation materials are the hot-die plastics;

4, be encapsulated as the hot-die encapsulation.

The specific implementation step simply is described below:

1, hot-die plastics (because of being prefabricated into cheese, often being referred to as biscuit) are put into high frequency preheater, support is put in preheating 10 minutes;

2, open mould, put into support;

3, softening biscuit is put into hydraulic press, hydraulic press is aimed at the blanking hole of mould, urges the material bar to press down, and makes the mould material be pressed into the mould hole;

4, mould adopts temperature control up and down, and the heating cure moulding about 30 minutes, is got packaged support.

5, clear up mould with air pressure gun.

The used mould die sinking expense of this routine method for packing is about 100,000 yuan of every moulds, the expense costliness, the new external form development time is longer, be 60---70 days, employing be the hot-die plastics, be controlled by only a few import supplier of family, purchase cost is than mold embedding height, reach 500 yuan/kg, the material storage condition is also relatively harsher, use 0 degree centigrade of storage of refrigerator-freezer.Packaging machinery involves great expense, for: hydraulic press: one, Taiwan production fluid press price is 380,000 a yuan/platform; High frequency preheater: one, price is 40,000 a yuan/platform.

Summary of the invention

Purpose of the present invention provides a kind of economical and practical integrated mold manufacture method that receives head, and manufactures composite plastic mould grain with this method.

The present invention is achieved in that

A kind of integrated mold manufacture method that receives head comprises raw material heating, embedding, pin, curing, the demoulding, and its processing step is as follows:

A is heated into liquid state with epoxy resin.

B pours liquid-state epoxy resin in mold mould embedding.

C inserts signal pins in the mold mould and gives fixing.

D is baked to curing with step C gained mold mould.

The described epoxy resin of step a is AB glue epoxy resin, and heating-up temperature is between 100-140 °, and the time is between 30 seconds-2 minutes.

The described mold mould of step b comprises mold base and mold lid.

The baking temperature of steps d is between 100-160 °, and the time is between 20-80 minute.

A kind of integrated composite plastic mould grain that receives head comprises body and inserts in intrinsic signal pins that its body selects for use AB glue epoxy resin to make.

The body of described composite plastic mould grain is a square body, and sidepiece has the projection of a semicircle, and the bottom is inserted with signal pins.

Mold embedding die sinking cost economic of the present invention, conventional encapsulating mould die sinking expense are about 100,000 yuan of every moulds, 160 nibs of every mould; Single composite plastic mould grain is adopted in the mold embedding, in 3000 yuan of 4000 groups of total costs, 200 of supporting encapsulation aluminium sheets, 5 yuan of every costs, amount to 4000 yuan in.The new profile development time is shorter, is generally 7---and 10 days; The time that the product encapsulation consumes: the mold embedding is 60 minutes/batch, and routine is encapsulated as 30 minutes/160; Will grow though the mold embedding encapsulation time is compared conventional encapsulation, it is much more that every batch of quantity encapsulates than routine, and every batch reaches 6000.The raw material of mold embedding is an epoxy resin, and very easily buying prepares 60 yuan/kg of material total cost, room storage; The packaging machinery cost is low, for: filling and sealing machine: 4000 yuan/platform, enough 6000 groups of mould grains use; The far infrared baker is equipped with 10,1200 yuan/platform of price; One of microwave oven, about 300 yuan of prices.

Description of drawings

Fig. 1 is a mold base front view of the present invention;

Fig. 2 is the vertical view of Fig. 1;

Fig. 3 is mold lid front view of the present invention;

Fig. 4 is the vertical view of Fig. 3;

Fig. 5 covers structural representation after compound for mold base and mold;

Fig. 6 is the vertical view of Fig. 5;

Fig. 7 is an embodiment of the invention filling and sealing machine mold understructure schematic diagram;

Fig. 8 is the filling and sealing machine structural representation of the lid of the present invention's composite plastic molding;

Fig. 9 is the filling and sealing machine structural representation that presses aluminum strip;

Figure 10 is an embedding status architecture schematic diagram;

Figure 11 is the supporting structure schematic diagram;

Figure 12 is the structural representation of support after inserting;

The structural representation that Figure 13 links to each other with the plastic film lid for the support that is removed after toasting;

Figure 14 is for pulling down plastic film lid postforming product structure schematic diagram;

Figure 15 is a plastics mould grain stereogram.

Embodiment

Technical process of the present invention comprises raw material heating, embedding, pin, curing, the demoulding, and its processing step is as follows:

A is heated into liquid state with epoxy resin.

B pours liquid-state epoxy resin in mold mould embedding.

C inserts signal pins in the mold mould and gives fixing.

D is baked to curing with step C gained mold mould.

To make integrated reception head (profile shown in Figure 15) is example:

Fig. 1, shown in Figure 2 is single mold base 1 structural representation, Fig. 3, Figure 4 shows that mold covers 2 structural representations, Fig. 5, Figure 6 shows that mold base and the mold lid structural representation after compound.As shown in Figure 7, a plurality of mold base 1 usefulness aluminium sheets 3 are fixed, as shown in Figure 8, more a plurality of molds lid is compounded on the mold base, as shown in Figure 9, cover in mold that to cover aluminum strip 4 more fixing; With the deployed AB glue epoxy resin of microwave oven preheating, be chosen as 1 minute warm-up time, as shown in figure 10, with filling and sealing machine 5 the mold lid is gone in the embedding of AB glue epoxy resin, as Figure 11, shown in Figure 12, the shaped support 6 that will have signal pins is inserted in the mold lid, and fixing with clip 7, then packaged aluminium sheet is put into the far infrared baker, heated 60 minutes down at 120 degrees centigrade.Take out aluminium sheet, open fixedly aluminum strip, pull down support, at this moment the mold lid can and support connect together split get off (Figure 13); Take the mold lid on the packaged support apart, promptly get packaged product 8 (seeing Figure 12, Figure 15).With air pressure gun cleaning mold base and mold lid.

As shown in figure 15, plastics mould grain 8 comprises body 80 and inserts in intrinsic signal pins 81, and body 80 selects for use AB glue epoxy resin to make, and is square body, and sidepiece has the projection 801 of a semicircle, and the bottom is inserted with signal pins.

Claims

1. an integrated mold manufacture method that receives head comprises raw material heating, embedding, pin, curing, the demoulding, and its processing step is as follows:

A is heated into liquid state with epoxy resin,

B pours liquid-state epoxy resin in mold mould embedding,

C, insert signal pins in the mold mould and give fixing,

D is baked to epoxy resin cure with step C gained mold mould,

E, the demoulding.

2. a kind of integrated mold manufacture method that receives head according to claim 1 is characterized in that the described epoxy resin of step a is AB glue epoxy resin, and heating-up temperature is between 100-140 °, and the time is between 30 seconds-2 minutes.

3. a kind of integrated mold manufacture method that receives head according to claim 1 is characterized in that the described mold mould of step b comprises mold base and mold lid.

4. a kind of integrated mold manufacture method that receives head according to claim 1, the baking temperature that it is characterized in that steps d is between 100-160 °, and the time is between 20-80 minute.

5. a composite plastic mould grain made from the described method of claim 1 comprises body and inserts in intrinsic signal pins, it is characterized in that body selects for use AB glue epoxy resin to make.

6. composite plastic mould grain according to claim 5, the body that it is characterized in that composite plastic mould grain is a square body, and sidepiece has the projection of a semicircle, and the bottom is inserted with signal pins.