CN1608789A - 无银高强度软钎料合金 - Google Patents
无银高强度软钎料合金 Download PDFInfo
- Publication number
- CN1608789A CN1608789A CN 200310110785 CN200310110785A CN1608789A CN 1608789 A CN1608789 A CN 1608789A CN 200310110785 CN200310110785 CN 200310110785 CN 200310110785 A CN200310110785 A CN 200310110785A CN 1608789 A CN1608789 A CN 1608789A
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- Prior art keywords
- solder
- present
- alloy
- brazing filler
- filler alloy
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
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Claims (2)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 200310110785 CN1285442C (zh) | 2003-10-22 | 2003-10-22 | 无银高强度软钎料合金 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN 200310110785 CN1285442C (zh) | 2003-10-22 | 2003-10-22 | 无银高强度软钎料合金 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1608789A true CN1608789A (zh) | 2005-04-27 |
CN1285442C CN1285442C (zh) | 2006-11-22 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN 200310110785 Expired - Fee Related CN1285442C (zh) | 2003-10-22 | 2003-10-22 | 无银高强度软钎料合金 |
Country Status (1)
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CN (1) | CN1285442C (zh) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101280433B (zh) * | 2007-12-31 | 2010-06-02 | 浙江工业大学 | 电解装置中钛基贵金属电极与阴极连接方法及合金材料 |
CN110125571A (zh) * | 2019-06-21 | 2019-08-16 | 深圳市唯特偶新材料股份有限公司 | 一种高强度低温无铅焊料及其焊锡膏 |
CN112621011A (zh) * | 2020-12-10 | 2021-04-09 | 北京有色金属与稀土应用研究所 | 一种高强度铅基合金钎料及其制备方法 |
-
2003
- 2003-10-22 CN CN 200310110785 patent/CN1285442C/zh not_active Expired - Fee Related
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101280433B (zh) * | 2007-12-31 | 2010-06-02 | 浙江工业大学 | 电解装置中钛基贵金属电极与阴极连接方法及合金材料 |
CN110125571A (zh) * | 2019-06-21 | 2019-08-16 | 深圳市唯特偶新材料股份有限公司 | 一种高强度低温无铅焊料及其焊锡膏 |
CN112621011A (zh) * | 2020-12-10 | 2021-04-09 | 北京有色金属与稀土应用研究所 | 一种高强度铅基合金钎料及其制备方法 |
Also Published As
Publication number | Publication date |
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CN1285442C (zh) | 2006-11-22 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20050427 Assignee: Kunming Sunlight Science & Technology Co., Ltd. Assignor: Li Zhiping Contract record no.: 2012530000046 Denomination of invention: High-strength silver-less soft brazing filler alloy Granted publication date: 20061122 License type: Exclusive License Record date: 20120815 |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061122 Termination date: 20161022 |