CN1607425A - Hot pressing bonding device and method - Google Patents
Hot pressing bonding device and method Download PDFInfo
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- CN1607425A CN1607425A CNA2004100858733A CN200410085873A CN1607425A CN 1607425 A CN1607425 A CN 1607425A CN A2004100858733 A CNA2004100858733 A CN A2004100858733A CN 200410085873 A CN200410085873 A CN 200410085873A CN 1607425 A CN1607425 A CN 1607425A
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- press section
- flange connector
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- tcp3
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
- B23K20/021—Isostatic pressure welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
Abstract
The invention provides a thermal-compression bonding method and device for connecting a wiring body such as TCP with a display unit reliably even in a liquid crystal display device whose glass substrate has a larger deviation in thickness. The display unit of a panel display device is loaded on a load table; and a terminal group which is positioned on the periphery of the display unit and connected with a convex-edge group and a lamellar wiring body is thermal-compressed bonded from above through an ACF heating tool. The invention is characterized in that a pressing part for pressing the wiring body of the heating tool consists of a rolling body.
Description
The present invention is to be on Dec 25th, 2002, application number to be dividing an application that the patent application of " thermo-compression bonding device and thermal pressure welding method " is done for " 02152844.0 ", denomination of invention with regard to the applying date.
Technical field
The present invention relates to utilizing TCP (Tape Carrier Package) to make from the external drive system when display unit carries out the flat display apparatus of signal input, be thermo-compression bonding device and method thereof at the periphery device TCP of display unit etc.
Background technology
Liquid crystal indicator forms the liquid crystal cells in image displaying area territory and the driving circuit that picture intelligence and other drive signals are input to this liquid crystal cells is constituted by arranging pixel.From of the drive signal input of this driving circuit, undertaken by the connecting portion that is arranged on the liquid crystal cells periphery to liquid crystal cells.In general, at this periphery, dispose a plurality of input signals of timing controlled in accordance with regulations and generate the driving IC chip of output signal.
Driving IC chip is assemblied in mode on the liquid crystal cells, COG (the Chip On Glass) mode of direct loading driving IC chip is arranged, but adopt the mode of utilizing TCP mostly.
Shown in Figure 16,17, so-called TCP3 normally on the rectangle strip flexible print wiring board of forming forming wiring figure on the insulation film 9 of polyimide etc. (FPC), loads driving IC chip 6.
Rectangular-shaped one side along TCP3 is provided with a plurality of outgoing side terminals 7, one side with a plurality of input side terminals of being provided with of its subtend.The outgoing side terminal 7 of each TCP3 carries out machinery with the flange connector 8 of liquid crystal cells 1 periphery and is electrically connected.
Along each TCP3 input side part on one side, import with printed circuit board (PCB) (to call PCB in the following text) 2 with scolding tin and driving and to carry out machinery and be electrically connected.
The part of the outgoing side terminal 7 of TCP is connected with the flange connector 8 of liquid crystal cells 1, because the terminal pitch of these terminal groups is narrow, generally is to be undertaken by anisotropic conductive film.So-called anisotropic conductive film is in thermosetting or thermoplastic resin film, and the dispersed electro-conductive particle in the place that is subjected to thermo-compressed, realizes clamping conducting between the terminal of resin molding.As anisotropic conductive film, for convenient on the flow chart, the general anisotropic conductive film of supplying with as band-like film (ACF:Anisotropic Conductive Film) that adopts.
To the assembling of the TCP3 of glass substrate 5 peripheries of liquid crystal cells 1 and PCB2, under the situation of using ACF4, can be undertaken by the operation of following (1)～(5).Figure 17 is the mode chart of these operations of expression.
(1) ACF4 is attached to the periphery of liquid crystal cells 1.
(2) prepare heating with 71 couples of ACF4 of preparation heating head.
(3) as shown in figure 10, with CCD106 etc. the outgoing side terminal 7 of each TCP3 and the flange connector on the liquid crystal cells 18 are carried out engagement position after, the pressure testing of carrying out TCP3 connects.
(4) with heating tool 111, carry out the formal crimping of TCP3.
(5) with soldering heating head 172, the input side terminal group and the driving that are connected TCP3 by soldering are imported with the terminal group on the PCB2.
As mentioned above, TCP3 can be installed on the liquid crystal cells 1, when product is substandard product, also can take out TCP3, carry out repair.
The method of this repair is: make ACF4 overheated with flatiron, peel off TCP3 after, in order to remove residual ACF4, with organic solvent wipe rub flange connector 8 after, again this flange connector 8 is carried out last wiping.
After the bad part of repaired item, method is as described above installed new TCP again.
In the formal crimping process of above-mentioned (4), for being connected of the flange connector 8 of the outgoing side terminal 7 that reliably carries out TCP3 and liquid crystal cells 1, the heating head 111 of thermo-compression bonding device and form glass substrate 5 fine balances mutually of the flange connector 8 of liquid crystal cells 1.Just, the situation of the depth of parallelism between the mounting table of the crimping face of heating head 111 and liquid crystal cells 1 must be fully.Usually, the depth of parallelism is represented by the difference of the sensation value between minimum place, the interval of the crimping face of heating head 111 and glass substrate 5 and the maximum.This value is more little, and then parallel degree is high more.The conducting particles diameter that ACF adopts is 5-6 μ m when the typical case fires, this moment depth of parallelism value must about 5 μ m in.
Yet up-to-date liquid crystal indicator in order to reach the slimming requirement, also must polish the glass substrate 5 that glass manufacturer provides.Just, after assembling liquid crystal cells 1, also the surface and the back side of liquid crystal cells 1 are polished, make its thickness attenuation.
Specifically, before the thickness of glass substrate be 1.1mm to 0.7mm, its thickness deviation mostly is below the 5 μ m most.But, this glass substrate 5 is polished, its thickness is that 0.8mm is to 0.4mm recently.Thus, because such polishing, it is big that its thickness deviation degree becomes, and this deviation becomes 40 μ m.
Therefore, when utilizing ACF4 that TCP3 is connected to liquid crystal cells 1, because thickness deviation is big, then ACF4 is a floating state, can come in contact bad problem between flange connector 8 and outgoing side terminal 7.
When carrying out above-mentioned repair, for the liquid crystal cells 1 that TCP3 has been installed once more, the pollutant during repair is attached near the flange connector 8, has that electrical wiring disconnects, line defect is bad and move bad etc. image quality to be produced the occasion of bad influence.
This be since during repair operator's sweat and other pollutants (mainly being the ionic species pollutant) attached on the flange connector 8, dispose ACF4 thereon, lamination TCP3.
When the ACF4 that contains these pollutants when utilization carries out thermo-compressed to the lead-out terminal of flange connector 8 and TCP3, in the base portion side of the flange connector 8 of the ACF4 that has accumulated fusion because the pollutant aggegation, with other parts relatively, quickened the metal erosion of flange connector 8, sometimes flange connector 8 broken strings.
Summary of the invention
At the problems referred to above, the deviation that the invention provides a kind of thickness of glass substrate that promptly is used in flat display apparatus is big slightly, also the thermo-compression bonding device and the method thereof that can reliably Wiring bodies such as TCP be connected with display unit.
It is a kind of when carrying out repair that the present invention also provides, even when existing under the state of pollutant with Wiring bodies such as ACF thermo-compressed TCP on the flange connector surface, also can not cause the thermo-compression bonding device and the method thereof of the metal erosion of flange connector.
The thermo-compression bonding device of the 1st invention of the present invention, with the display unit mounting of flat display apparatus on mounting table, utilize heating tool by anisotropic conductive film, from the top to carrying out thermo-compressed the flange connector group of above-mentioned display unit periphery and the terminal group of laminar Wiring body, it is characterized in that: be split into a plurality ofly by the press section of the above-mentioned Wiring body that is pressed in above-mentioned heating tool, be provided with the moving-member that above-mentioned divided each press section is moved to the below.
The thermo-compression bonding device of the 2nd invention of the present invention on mounting table, utilizes heating tool by anisotropic conductive film with the display unit mounting of flat display apparatus.To carrying out thermo-compressed the flange connector group of above-mentioned display unit periphery and the terminal group of laminar Wiring body, it is characterized in that: the press section by the above-mentioned Wiring body that is pressed in above-mentioned heating tool is made of roller body from the top.
The thermal pressure welding method of the 3rd invention of the present invention, utilize heating tool by anisotropic conductive film, from the top to carrying out thermo-compressed the flange connector group of the display unit periphery of flat display apparatus and the terminal group of laminar Wiring body, it is characterized in that: the press section of above-mentioned heating tool is cut apart along above-mentioned flange connector group's configuration direction, after pushing above-mentioned terminal group, push above-mentioned terminal group in proper order by the press section, both sides of clamping above-mentioned middle body press section by above-mentioned divided middle body press section.
The thermal pressure welding method of the 4th invention of the present invention, utilize heating tool by anisotropic conductive film, from the top to carrying out thermo-compressed the flange connector group of the display unit periphery of flat display apparatus and the terminal group of laminar Wiring body, it is characterized in that: the press section of above-mentioned heating tool is cut apart along above-mentioned flange connector group's length direction, after pushing above-mentioned terminal group by the press section of above-mentioned flange connector base portion side, to the end of above-mentioned flange connector, push in proper order above-mentioned divided press section
The thermal pressure welding method of the 5th invention of the present invention, utilize heating tool by anisotropic conductive film, from the top to carrying out thermo-compressed the flange connector group of the display unit periphery of flat display apparatus and the terminal group of laminar Wiring body, it is characterized in that: the press section of above-mentioned heating tool is made of roller body, rotate above-mentioned roller body from the base portion side of above-mentioned flange connector to the end side of above-mentioned flange connector, push above-mentioned terminal group.
If adopt the thermo-compression bonding device of the 1st invention of the present invention, be split into a plurality ofly owing to push the press section of Wiring body, then the pressing force of may command heating tool distributes.This divided press section can be connected with main press section with elastic components such as springs.If cut apart the press section at the cross direction of Wiring body, the pressing force that then can control cross direction distributes, but thermo-compressed is carried out in the bending of absorptive substrate, even the substrate slimming also can obtain good connection.
If cut apart the press section at the length direction of Wiring body, the pressing force that then can control length direction distributes, if push from the base portion side of the flange connector of the easy aggegation of impurity, then can suppress metal erosion in this zone not aggegation of impurity.
If adopt the hot pressing of the 2nd invention of the present invention to press device,, then, can suppress the impurity aggegation in the base portion side of flange connector by pushing Wiring body from the flange connector base portion side owing to constitute by roller body by the press section of the above-mentioned Wiring body that is pressed in heating tool.
If adopt the thermal pressure welding method of the 3rd invention of the present invention, because the press section of heating tool is cut apart along flange connector group's configuration direction, after pushing by the middle body press section of cutting apart terminal group, again by the order press-side subgroup, press section, both sides of clamping above-mentioned middle body press section, the pressing force that then can be controlled at the Wiring body cross direction distributes, thermo-compressed is carried out in bending that can absorptive substrate, even the substrate slimming also can obtain good connection.
If adopt the thermal pressure welding method of the 4th invention of the present invention, because the press section of heating tool is cut apart along flange connector group's length direction, behind press-side subgroup, press section by the flange connector base portion side, end to above-mentioned flange connector, push in proper order above-mentioned divided press section, push Wiring body by base portion side, then can suppress the aggegation of impurity in the base portion side of flange connector from flange connector.
If adopt the thermal pressure welding method of the 5th invention of the present invention, the press section of heating tool is made of roller body, because rotating roller body from the base portion side of flange connector to the end of flange connector pushes terminal group, then push Wiring body, can suppress the aggegation of impurity in the base portion side of flange connector by base portion side from flange connector.
The simple declaration of accompanying drawing
Fig. 1 is the oblique view of the thermo-compression bonding device of expression the present invention the 1st embodiment.
Fig. 2 is the in-built front view (FV) of expression heating head.
Fig. 3 is the A-A line sectional view of Fig. 2.
Fig. 4 carries out the preceding state description figure of thermo-compressed.
Fig. 5 carries out thermo-compressed key diagram midway.
Fig. 6 is the block scheme of thermo-compression bonding device 10.
Fig. 7 is the structure of the heating head 16 of the 2nd embodiment.
Fig. 8 is the ground plan of heating tool 20 cutting states of expression the 3rd embodiment.
Fig. 9 is the ground plan of heating tool 20 cutting states of expression the 4th embodiment.
Figure 10 is the figure of the thermo-compression bonding device variation of presentation graphs 1.
Figure 11 is the figure of explanation the 5th embodiment thermo-compressed operation.
Figure 12 is the figure of explanation the 5th embodiment thermo-compressed operation.
Figure 13 is the figure of explanation the 5th embodiment thermo-compressed operation.
Figure 14 is the figure of expression the 6th embodiment thermo-compression bonding device.
Figure 15 is the figure of expression the 7th embodiment thermo-compression bonding device.
Figure 16 is the oblique view of expression liquid crystal cells and TCP engagement position state.
Figure 17 is the process chart of the assembled state of expression TCP.
Embodiment
Inventive embodiment
(the 1st embodiment)
Below, the thermo-compression bonding device 10 of the present invention the 1st embodiment is described to Fig. 6 according to Fig. 1.
(1) formation of thermo-compression bonding device 10
Thermo-compression bonding device 10 for the flange connector 8 of the liquid crystal cells 1 of liquid crystal indicator and the lead-out terminal 7 of TCP3 are carried out electricity and mechanical connection, is carried out thermo-compressed by ACF4.
Fig. 1 is the oblique view of thermo-compression bonding device 10.
This thermo-compression bonding device 10 is by the mounting table 12 of mounting liquid crystal cells 1, constitute from the upright support sector 14 that establishes in one side of this mounting table 12, the heating head of hanging in this support sector 14 16, and the mobile device 18 of the motor driven of heating head 16 by being arranged on support sector 14 inside moves downwards.In the following description, as shown in Figure 1, be called X-direction along the direction of signal wire driving side, be called Y direction along the direction of scanning line driving side, high direction is called Z-direction.
Fig. 2 represents the internal structure of heating head 16, and Fig. 3 is the A-A sectional view of Fig. 2.
In the heating head 16, at each TCP3 heating tool 20 is set, each heating tool 20 is made of a plurality of press sections 22.The main press section 24 of configuration above heating tool 20.Below this main press section 24, the length during by compression is identical, and the long spring of short more elastic component more laterally of central authorities is connected with each press section 22 of heating tool 20.
This elastic component is made of the spring that uses the equal length member to form the same volume number, and the spring total length difference when making non-the compression just, adopts the spring that compresses more more laterally from central authorities.Like this, when all push the press section, be controlled to be impartial pressure.
The structure of each main press section is to be connected as a single entity and to be supported by the mobile post 19 of mobile device 18, moves downwards as one.Heating tool 20 is heated to 300 ℃ by heating heating head 16 from 200 ℃.Just, in the heating head 16 that constitutes by heat conductors such as metals, built-in heater, by with each press section 22 contacts side surfaces of heating tool 20, heating press section 22.As shown in figure 10, also can with thermal source and heating head 16 body portion of heating press section 22 from, the heating head 200 that contacts each 22 side, press section and surround frame-like is set.Also can be at each press section 22 interior arrangement well heater.
The formation of press section 22 is described according to Fig. 3 below.
As mentioned above, heating tool 20 is segmented in a plurality of press sections 22, and its state is cut apart along the configuration direction of the flange connector 8 of liquid crystal cells 1 as shown in Figure 3.Just, form the state of cutting apart along an edge direction of TCP3 rectangle.Among Fig. 3, simple in order to illustrate, flange connector 8 only is 8, and in fact a plurality of flange connectors 8 are arranged.
Fig. 6 is the block scheme of the electric system of expression thermo-compression bonding device 10.
As shown in Figure 6, thermo-compression bonding device 10 connects the engagement position device 32 that the motor 28 of mobile device 18, the heating arrangement 30 that heats heating head 16, CCD etc. constitute on the control device 26 that is made of computing machine.
(2) thermal pressure welding method
The thermal pressure welding method of the thermo-compression bonding device 10 of above-mentioned formation is described according to Fig. 4 and Fig. 5.
Mounting liquid crystal cells 1 on mounting table 12.At this moment, the glass substrate 5 of liquid crystal cells 1 is polished to thickness 0.5mm, and thickness deviation is 40 μ m.
As shown in Figure 4, engagement device 32 grades in use location are being carried out under the state of engagement position the outgoing side terminal 7 of TCP3 and the flange connector 8 of liquid crystal cells 1 by ACF4, and pressure testing connects.
Then, control device 26 moves to the below with mobile device 18.So main press section 24 moves to the below, below each press section 22 that a plurality of springs 34 are hung also moves to, contacts on TCP3 and pushes.At this moment, the interim surface of main press section 24 is the outstanding downwards state of central portion, the surface of the press section of cutting apart 22 is the outstanding downwards state of central portion, in the press section of cutting apart 22, the 22 pairs of liquid crystal cells 1 in press section that at first are positioned at middle body are pushed TCP3, by ACF4, the lead-out terminal 7 of this position and flange connector 8 carry out electricity and mechanical connection.
As shown in Figure 5, when main press section 24 moved to the below, press section 22 was pushed TCP3 from the central portion order to both sides, and order is carried out thermo-compressed to both sides to the outgoing side terminal 7 of TCP3 and the flange connector 8 of liquid crystal cells 1 again.Push under the state of TCP3 in whole press sections 22, the central pressure of control press section 22 is impartial.
When thermo-compressed finished, control device 26 rose heating head 16, and the thermo-compressed operation finishes.
If above-mentioned thermal pressure welding method, at first, owing to carry out thermo-compressed from middle body to the both sides order, then liquid crystal cells 1 and TCP3 do not produce offset, can correctly carry out thermo-compressed at institute's allocation.
And because press section 22 is a cutting state, even some deviation on the glass substrate 5 of liquid crystal cells 1, because each of press section 22 pushed the lead-out terminal 7 of TCP3, then the conducting particles in the ACF4 is crushed, can carry out the thermo-compressed of electricity and machinery reliably.
(the 2nd embodiment)
Among the 1st embodiment, connect main press section 24 and each press section 22 respectively with spring 34, but also can be replaced with following structure.
As shown in Figure 7, below main press section 24, be arranged on the elastic component 40 of taking in liquid 38 in the bag 36, the press section of cutting apart 22 is set below this elastic component 40.
In this structure, when main press section 24 moved to the below, by elastic component 40, each press section 22 its middle body was pushed TCP3 earlier, carries out thermo-compressed.
(the 3rd embodiment)
In the foregoing description, along the wiring direction of flange connector 8 just the configuration side of the outgoing side terminal 7 of TCP3 press section 22 is divided into band shape, yet as shown in Figure 8, also can be to be divided into cancellate heating tool 20.
Then, the structure of this press section of cutting apart 22 is pushed in formation respectively.
If this structure can be according to the thickness of glass substrate 5 thermo-compressed TCP3 more subtly.
(the 4th embodiment)
Among the 1st embodiment, along the wiring direction of flange connector 8 just the wiring direction of outgoing side terminal 7 cut apart press section 22, but at present embodiment, as shown in Figure 9, constitute press sections 22 cutting apart heating tool 20 with the direction of these distributions tendencies.
If the structure of cutting apart like this and since formed with respect to each flange connector 8 tilt and also with the press section 22 of the direction adjacency of wiring direction quadrature, the connection that carry out between a plurality of wirings then available 1 press section 22 can be carried out thermo-compressed more reliably.Even there is the not press section 22 of action, crimping also can be carried out in other press sections 22 of adjacency, has further improved the yield rate of making.
Each press section 22 also can configured separate.
(modification 1)
In the foregoing description, be the structure that on liquid crystal cells 1, connects TCP3, yet even replace under its situation also applicable this thermo-compression bonding device 10 connecting flexible substrate (FPC) on the liquid crystal cells 1.
(modification 2)
Be not limited to liquid crystal indicator, also can be suitable for for general display device such as organic EL displays.
(modification 3)
Also can carry out moving up and down of each press section by computer control.
(the 5th embodiment)
The thermo-compression bonding device and the thermal pressure welding method of present embodiment are described with Figure 11 to Figure 13.The difference of the thermo-compression bonding device of present embodiment and the 1st embodiment shown in Figure 1 is: among the 1st embodiment, the press section is cut apart at the cross direction of the wiring of pushing, and in the present embodiment, the press section is cut apart at the length direction of the wiring of pushing.
The 1st operation is: liquid crystal cells 1 is positioned on the mounting table 12.The liquid crystal cells 1 of this mounting can be the product that TCP3 is installed after the assembling first, also can be the product of place under repair after the repair.
The 2nd operation is: utilize engagement position device 32 to carry out the engagement position of the lead-out terminal 7 of the flange connector 8 of liquid crystal cells 1 and TCP3.Figure 11 is the state that carries out this engagement position.
The 3rd operation is: by mobile device 18 supporting pillar 19 is moved a below (Z-direction), when heating head 16 being moved to the below, main press section 24 also moves to the below, below each press section 22 that spring 34 is hung also moves to.Then, in the press section of cutting apart 22, at first, TCP3 (state of Figure 12) is pushed in the press section 22 that is positioned at flange connector 8 base portion side (with respect to the inboard on liquid crystal cells 1 end limit), and after this, to the end side of flange connector 8, press section 22 orders are pushed TCP3.At this moment, by elastic component spring 34, TCP3 can be pushed along the surface of TCP3 in press section 22.When from the base portion side of flange connector 8 when end side is pushed, the ACF that dissolves sidewinders to end side from the base portion of flange connector 8, ACF4's overflows the end side that part arrives flange connector 8.Then, TCP3 is pushed in the press section 22 of end, and the thermo-compressed operation of TCP3 finishes.At this moment, ACF4 accumulates in the end side of flange connector 8, and does not accumulate in the base portion side (Figure 13) of flange connector 8.
The 4th operation is: promote heating head 16 by mobile device 18, the thermo-compressed operation finishes.
If adopt the thermal pressure welding method of present embodiment, because ACF4 accumulates in the end side of flange connector 8, and do not accumulate in base portion side, then the base portion side of flange connector 8 can not cause metal erosion.Therefore, the demonstration that can not take place before is bad.
(the 6th embodiment)
According to Figure 14 the 6th embodiment is described.
Among the 5th embodiment, use spring 34, but as shown in figure 14, can be used on the elastic body 40 of taking in liquid 38 in the bag 36 and replace as elastic component.
Use this elastic body 40. can push TCP3 in proper order along the press section 22 that the length direction of flange connector 8 is cut apart.
(the 7th embodiment)
According to Figure 15 the 7th embodiment is described.
Among the 5th embodiment, push TCP3 with the press section 22 of cutting apart heating tool 20, but in the present embodiment, push TCP with the roller body of heating shown in Figure 15 and replace.The heating of this roller body, the same with thermo-compression bonding device shown in Figure 1, will be loaded in the well heater in the heating head 16 that constitutes by heat conductors such as metals, can also can will be loaded in the roller body in the well heater by carrying out with the roller body contacts side surfaces.
The method of pushing TCP3 with the roller body 42 of heating is: push the CTP3 that is positioned at flange connector 8 base portion side by roller body 42, after this, to flange connector 8 end side rotation roller body 42 on one side push TCP3 on one side.
Like this, the same with the 5th embodiment when utilizing ACF4 to carry out the TCP3 thermo-compressed, ACF4 extrudes in the end side of flange connector 8, pollutant too aggegation in the end side of flange connector 8.
Therefore, can prevent the metal erosion of flange connector 8, can not show bad.
Among the present invention, constitute heater and have the press section and be split into a plurality ofly, Wiring bodies such as TCP can be pushed in each press section of cutting apart.
By cutting apart the press section at the Wiring body cross direction, even constitute some deviation of thickness of glass substrate of display unit, also can push Wiring body reliably, carry out electricity and mechanical connection.By cutting apart the press section at the Wiring body length direction, can prevent the base portion side of the pollutant aggegation of ACF at flange connector, prevent the generation of unfavorable conditions such as metal erosion.
Claims (2)
1. thermo-compression bonding device, with the display unit mounting of flat display apparatus on mounting table, use heating tool by anisotropic conductive film, carry out thermo-compressed, it is characterized in that from the top to the flange connector group that is positioned at above-mentioned display unit periphery and the terminal group of laminar Wiring body:
The press section that the above-mentioned Wiring body of above-mentioned heating tool is pushed is made of roller body.
2. thermal pressure welding method uses heating tool by anisotropic conductive film, carries out thermo-compressed from the top to the flange connector group of the display unit periphery that is positioned at flat display apparatus and the terminal group of laminar Wiring body, it is characterized in that:
The press section of above-mentioned heating tool is made of roller body,
Rotate above-mentioned roller body from the base portion side of above-mentioned flange connector to the end side of above-mentioned flange connector, push above-mentioned terminal group.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001392886 | 2001-12-25 | ||
| JP2001392886 | 2001-12-25 | ||
| JP2002019077 | 2002-01-28 | ||
| JP2002019077 | 2002-01-28 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021518440A Division CN1202435C (en) | 2001-12-25 | 2002-12-25 | Hot pressing bonding device and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1607425A true CN1607425A (en) | 2005-04-20 |
| CN1327269C CN1327269C (en) | 2007-07-18 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100858733A Expired - Fee Related CN1327269C (en) | 2001-12-25 | 2002-12-25 | Hot pressing bonding device and method |
| CNB021518440A Expired - Fee Related CN1202435C (en) | 2001-12-25 | 2002-12-25 | Hot pressing bonding device and method |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021518440A Expired - Fee Related CN1202435C (en) | 2001-12-25 | 2002-12-25 | Hot pressing bonding device and method |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR100533766B1 (en) |
| CN (2) | CN1327269C (en) |
| TW (1) | TW569062B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303460B (en) * | 2007-05-09 | 2010-08-18 | 群康科技(深圳)有限公司 | Method for assembling flexible circuit board machine table and liquid crystal display module group |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100363787C (en) * | 2004-07-13 | 2008-01-23 | 鸿富锦精密工业（深圳）有限公司 | Bond structure of coiled material frame and holding frame |
| CN100464214C (en) * | 2005-12-08 | 2009-02-25 | 群康科技(深圳)有限公司 | Mfg. apparatus for liquid crystal display device and method thereof |
| KR100935423B1 (en) * | 2008-04-22 | 2010-01-06 | 인성산업주식회사 | Pressure device, Pressure device unit and method for making stopwater plate |
| JP2012038747A (en) * | 2010-08-03 | 2012-02-23 | Hitachi High-Technologies Corp | Acf sticking device for fpd module |
| JP2017092313A (en) * | 2015-11-12 | 2017-05-25 | 株式会社東芝 | Semiconductor manufacturing equipment |
| CN105690735A (en) * | 2016-02-18 | 2016-06-22 | 东莞工易机器人有限公司 | Press fitting device for press fitting of AB glue in workpieces and press fitting method thereof |
| CN107450206A (en) * | 2017-09-06 | 2017-12-08 | 惠科股份有限公司 | A kind of bolster and press fit device |
| IT201800020275A1 (en) * | 2018-12-20 | 2020-06-20 | Amx Automatrix S R L | SINTERING PRESS FOR SINTERING ELECTRONIC COMPONENTS ON A SUBSTRATE |
| KR20210150035A (en) * | 2020-06-03 | 2021-12-10 | 주식회사 엘지에너지솔루션 | Pressure device having fluid and manufacturing method for electrode and electrode assembly using the same |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5055076A (en) * | 1989-03-09 | 1991-10-08 | Stanley Electric Co., Ltd. | Electroluminescent panel and method of manufacturing the same |
| JP3491415B2 (en) * | 1995-01-13 | 2004-01-26 | セイコーエプソン株式会社 | Manufacturing method of liquid crystal display device |
| JP2000183111A (en) * | 1998-12-16 | 2000-06-30 | Matsushita Electric Ind Co Ltd | Mounting method for semiconductor element |
-
2002
- 2002-12-20 TW TW091136829A patent/TW569062B/en not_active IP Right Cessation
- 2002-12-24 KR KR10-2002-0083227A patent/KR100533766B1/en active IP Right Grant
- 2002-12-25 CN CNB2004100858733A patent/CN1327269C/en not_active Expired - Fee Related
- 2002-12-25 CN CNB021518440A patent/CN1202435C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101303460B (en) * | 2007-05-09 | 2010-08-18 | 群康科技(深圳)有限公司 | Method for assembling flexible circuit board machine table and liquid crystal display module group |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200301832A (en) | 2003-07-16 |
| CN1202435C (en) | 2005-05-18 |
| CN1327269C (en) | 2007-07-18 |
| CN1434329A (en) | 2003-08-06 |
| KR100533766B1 (en) | 2005-12-06 |
| KR20030057350A (en) | 2003-07-04 |
| TW569062B (en) | 2004-01-01 |
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