CN1602142A - Nozzle structure of local soft soldering appts. - Google Patents
Nozzle structure of local soft soldering appts. Download PDFInfo
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- CN1602142A CN1602142A CN 03158745 CN03158745A CN1602142A CN 1602142 A CN1602142 A CN 1602142A CN 03158745 CN03158745 CN 03158745 CN 03158745 A CN03158745 A CN 03158745A CN 1602142 A CN1602142 A CN 1602142A
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- soldering
- scolding tin
- nozzle
- opening
- cylindrical body
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Weif orifice for flooding soldering tin from nozzle is setup at sidewall under edge of opening in feasible distance. Thus, soldering can be carried out reliably under condition out of touching adjacent electronic units by flooded soldering tin, even if parts are configured in high density.
Description
Technical field
The present invention relates to a kind of nozzle arrangements of local soldering apparatus, be used for by making the nozzle contact print circuit substrate of ejection fusion scolding tin, thereby the required privileged site (part) of electronic unit has been disposed in soldering.
Background technology
The installation of electronic unit on tellite, usually to adopt being electrically connected of soldering, but follow the miniaturization of electric product in recent years, SMP (the Surface MountParts: surface mount elements), advanced compactization of the substrate of high-density installation that inserts different two sides Reflow Soldering (fusion scolding tin) substrate of shape parts with lead has in the past appearred using.
But present present situation is to have to be mixed with lead insert type parts, uses after plug-in unit is installed to make by the soldering groove soldering substrate (following slightly be called " substrate ") that lead position (connecting the part of substrate aperture) carried out soldering.
When carrying out the soldering of lead insert type electronic unit of this substrate, in order to realize efficiency of operationization, employing can be flooded the jet flow soldering apparatus of scolder to the part.Fig. 3 is the general perspective of the pith (particularly nozzle segment) of expression jet flow soldering apparatus.This jet flow soldering apparatus (soldering apparatus) M places fusion scolding tin h at soldering groove b, utilize not shown reflux unit that fusion scolding tin h is blowed in the cylindrical body 20 from the bottom connected entrance 40 of the rectangle tubular nozzle 10 of fixed placement on pedestal 30, the fusion scolding tin h that is sprayed overflows from exporting 20 by arrow a among the figure, return soldering groove b once more, wherein, outlet 20 is to realize by marginal portion (edge of opening) 20e of the upper opening of the cylindrical body 20 of nozzle 10 is formed incision-like.
Like this, above-mentioned soldering apparatus M in the past need make fusion scolding tin h overflow from the outlet 20m of nozzle 10 for the surface that makes fusion scolding tin h does not form the oxide-film of scolding tin.
But, as shown in Figure 4, when the interval W of the electronic unit d on the substrate p is big (Fig. 4 (A)), do not contact adjacent electronic unit d from the fusion scolding tin h (hereinafter to be referred as " overflow scolding tin ") of outlet 20m overflow (weir flow or water vein) f, but, to the increasingly stringent that requires of small-sized, densification,, has the tendency (the narrow and smallization tendency of parts space) of the installation interval N ever-smaller of electronic unit d in recent years in order to accomplish intensive configuration as far as possible.
In addition, consider that handlebar used in the past contains lead-tin soldering (tin 6: tin-plumbous eutectic soldering of plumbous 4) replace with the tendency of no lead-tin soldering (tin-silver-copper) from the angle of environmental protection.This no lead-tin soldering and the lead-tin soldering (melt temperature is about about 183 ℃) that contains in the past compare, the solidus height of scolding tin (melt temperature height, about about 218 ℃), so the circular flow of fusion scolding tin after a little while, scolding tin is set in the nozzle easily, therefore, in order to increase circular flow, need increase from the spillway discharge of outlet 20m.
But, increase to the spill-out of transverse direction from outlet 20m like this, so under aforesaid narrow and smallization of parts space trend, have the problem that can contact the lead I of adjacent electronic unit d, so be difficult to correspondence (Fig. 4 (B)) in the reality.In addition,, can consider to set out a mouthful 20m in order to increase the flow of overflow scolding tin more, but because parts are highly denseization, so restricted on allocation position, therefore still be difficult to correspondence.
In addition, from the mode that above-mentioned edge of opening 20e carries out overflow, the liquid on surface fails to be convened for lack of a quorum to wash off and is coated in local scaling powder in advance, and the bad problem of the soldering of generation is also arranged.
Summary of the invention
Purpose of the present invention just is to solve above-mentioned problem, a kind of nozzle arrangements of local soldering apparatus is provided, weif orifice from the overflow scolding tin of nozzle is located at from the sidewall of edge of opening decline suitable distance, even thereby the intensive component configuration of high density, also can accomplish not contact under the situation of adjacent electronic unit, carry out soldering reliably at overflow scolding tin.
In order to achieve the above object, the nozzle arrangements of the local soldering apparatus that the present invention relates to, form top and have the regulation shaped aperture, the cylindrical body that the bottom is communicated with the soldering groove (b) that stores fusion scolding tin (h), utilize reflux unit that described fusion scolding tin (h) is blown to edge of opening in cylindrical body, it is characterized in that,, offer one or more weif orifice (2h) at sidewall (2s) from the cylindrical body (2) of described edge of opening (2e) decline suitable distance.
Parenthesized label in aforesaid right requirement and the summary of the invention be to understand structure of the present invention for easy, and the drawing reference numeral of paying as a reference is not limited to the accompanying drawing form certainly.
Description of drawings
Fig. 1 is the perspective view of the nozzle arrangements of expression present embodiment example.
Fig. 2 is the longitudinal section of the soldering state of expression present embodiment.
Fig. 3 is the nozzle general perspective of expression existing apparatus.
Fig. 4 is the longitudinal section that the soldering state of existing nozzle is adopted in expression.
Embodiment
Below, the embodiment of the nozzle arrangements of the local soldering apparatus that present invention will be described in detail with reference to the accompanying relates to.
Fig. 1 is the perspective view of the nozzle arrangements of expression present embodiment example, and Fig. 2 is the longitudinal section of the soldering state of expression present embodiment.
The nozzle of the execution mode that the present invention relates to is improved the nozzle of above-mentioned structure in the past, improves part in addition with example was identical in the past, thus pay same numeral, and omit its explanation.
Illustrated nozzle 1 forms the cylindrical body 2 of the edge of opening 2e with upper opening established practice setting shape, be set at the pedestal 3 be located among the soldering groove b above.This edge of opening 2e forms and surrounds the opening shape that the substrate p that has disposed electronic unit d needs the privileged site (part) of soldering, is according to the local shape on each substrate p and special formation.
Be positioned at the sidewall 2s of this edge of opening 2e below, have a plurality of weif orifice 2h that connect inside.The degree of lip-rounding of this weif orifice 2h is to form rectangle in the execution mode example, laterally is provided with a plurality of on single face sidewall 2s side by side.Its number and punch position are to consider adjacent electronic unit d and suitable the design, are the position that is opened in from the about 2mm of edge of opening 2e decline in the execution mode example.Its shape except that illustrated rectangle, the grooving shape of also can form circle, ellipse, growing crosswise.
By nozzle 1 is made said structure, utilize reflux unit (diagram slightly) that the fusion scolding tin h that is stored among the soldering groove b is risen in the cylindrical body 2 by connected entrance 4.The fusion scolding tin h of Shang Shenging swells to edge of opening 2e like this, is released to the outside from weif orifice 2h simultaneously.As a result, can increase circular flow, use no lead-tin soldering, can prevent surperficial liquid stream scrubbing scaling powder.This weif orifice 2h is positioned at the below of edge of opening 2e, thus as shown in Figure 2, from the overflow scolding tin f of weif orifice 2h can avoid that contact component is narrow and small at interval, the lead I of the electronic unit d of the intensive configuration of high density etc.
Fusion scolding tin h is from the height of this edge of opening 2e protuberance, can be according to reflux unit sending flow and set from the relation of the amount of releasing of weif orifice 2h in cylindrical body 2.
Use the soldering operation of this nozzle 1, make the edge of opening 2e that part constituted of contact, utilize reflux unit (diagram slightly) to blow in the cylindrical body 2, carry out the soldering of the lead I of electronic unit d according to substrate p.In addition, for carrying out that fully the soldering of substrate p through hole is filled, the additional necessary flowing pressure that send carries out soldering.
The invention effect
The present invention makes the overflow scolding tin of said nozzle from being positioned at the weif orifice stream of edge of opening below Go out, so can avoid that the contact component interval is narrow and small, the electronic unit d of the intensive configuration of high density Lead I etc., can carry out reliably soldering.
In addition, can make overflow scolding tin avoid contacting adjacent component, can the free setting weif orifice On the nozzle cylindrical body, offer the position, can realize that overflow scolding tin is effectively mobile in cylindrical body Design.
Claims (1)
1. the nozzle arrangements of a local soldering apparatus, form top and have the regulation shaped aperture, bottom and the cylindrical body that the soldering groove (b) that stores fusion scolding tin (h) is communicated with utilize reflux unit that described fusion scolding tin (h) is blown to edge of opening in cylindrical body, it is characterized in that
At sidewall (2s), offer one or more weif orifice (2h) from the cylindrical body (2) of described edge of opening (2e) decline suitable distance.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03158745 CN1602142A (en) | 2003-09-22 | 2003-09-22 | Nozzle structure of local soft soldering appts. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03158745 CN1602142A (en) | 2003-09-22 | 2003-09-22 | Nozzle structure of local soft soldering appts. |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1602142A true CN1602142A (en) | 2005-03-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03158745 Pending CN1602142A (en) | 2003-09-22 | 2003-09-22 | Nozzle structure of local soft soldering appts. |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1602142A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115415630A (en) * | 2022-08-30 | 2022-12-02 | 西安空间无线电技术研究所 | Tin pot structure for automatic tin coating equipment |
-
2003
- 2003-09-22 CN CN 03158745 patent/CN1602142A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115415630A (en) * | 2022-08-30 | 2022-12-02 | 西安空间无线电技术研究所 | Tin pot structure for automatic tin coating equipment |
| CN115415630B (en) * | 2022-08-30 | 2024-05-14 | 西安空间无线电技术研究所 | Tin pot structure for automatic tin lining equipment |
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