CN115415630A - Tin pot structure for automatic tin coating equipment - Google Patents
Tin pot structure for automatic tin coating equipment Download PDFInfo
- Publication number
- CN115415630A CN115415630A CN202211051205.3A CN202211051205A CN115415630A CN 115415630 A CN115415630 A CN 115415630A CN 202211051205 A CN202211051205 A CN 202211051205A CN 115415630 A CN115415630 A CN 115415630A
- Authority
- CN
- China
- Prior art keywords
- tin
- cavity
- mesh piece
- box body
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 126
- 238000000576 coating method Methods 0.000 title claims abstract description 13
- 239000011248 coating agent Substances 0.000 title claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 43
- 238000005476 soldering Methods 0.000 claims abstract description 42
- 238000005086 pumping Methods 0.000 claims abstract description 12
- 238000004534 enameling Methods 0.000 claims abstract description 9
- 239000003381 stabilizer Substances 0.000 claims abstract description 9
- 230000005540 biological transmission Effects 0.000 claims abstract description 7
- 230000000087 stabilizing effect Effects 0.000 claims abstract description 7
- 230000006641 stabilisation Effects 0.000 claims abstract description 3
- 238000011105 stabilization Methods 0.000 claims abstract description 3
- 229910000679 solder Inorganic materials 0.000 claims description 5
- 230000000694 effects Effects 0.000 claims description 3
- 238000007747 plating Methods 0.000 description 10
- 238000000034 method Methods 0.000 description 6
- 230000003068 static effect Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000013049 sediment Substances 0.000 description 1
- 239000002893 slag Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
- B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0646—Solder baths
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Molten Solder (AREA)
Abstract
A tin pot structure for automatic tin coating equipment comprises: the device comprises a box body, an impeller pump, a transmission cavity, a motor and a double-layer mesh-shaped flow stabilizing device; the liquid soldering tin is contained in the box body, the motor is fixedly arranged on the outer wall of the box body, and the motor is used for pumping the liquid soldering tin in the box body into the conduction cavity and overflowing from the top of the conduction cavity to flow back into the box body; the double-layer mesh-shaped current stabilizer is arranged inside the conduction cavity and used for performing current stabilization treatment on the liquid soldering tin in the conduction cavity. The invention can provide a clean and fluctuation-free soldering tin liquid level for automatic tin enameling equipment and can ensure the operation stability of the automatic tin enameling equipment.
Description
Technical Field
The invention aims at the structural design of a tin pot for automatic tin plating equipment of components and is suitable for the research and development requirements of automatic tin plating equipment of gold-plated lead components. Belongs to the technical field of electronic assembly.
Background
In a conventional water tank-shaped tin-enameled pot, liquid tin solder is in a static state in the pot and can be called as a static pot, and a heating device is arranged at the bottom of the pot and used for heating tin so as to keep the tin in a liquid state. This type tin pot simple structure, convenient operation nevertheless has more defect when being arranged in automatic tin equipment that wards off, is difficult to guarantee to ward off the tin quality, specifically as follows:
waterfall formula tin pot structure through in the box that holds tin liquid, increases and supplies sap cavity, pumping mechanism, with the continuous pump sending of bottom half liquid soldering tin get into and supply the sap cavity, and the overflow face that flows through and supplies the sap cavity forms the flowing liquid level of waterfall formula soldering tin for carry out the tin sticky operation of chip pin, can call as dynamic tin pot. This kind of tin pan can conduct the clean soldering tin in tin pan bottom to the overflow face, has avoided the overflow face to appear floating the tin oxide sediment to ward off the tin process and cause the influence. However, turbulent disturbances exist on the flowing liquid solder surface, and the tin surface has large fluctuation amplitude.
In the publicly published documents and publications, no solution to the above problems has been found.
Disclosure of Invention
The technical problem solved by the invention is as follows: the defects of the prior art are overcome, the improved tin pot structure is designed, the stability effect of a static tin pot is achieved by adopting the tin pumping structure, and the aim of providing a long-term stable tin liquid level for automatic tin enameling equipment is fulfilled. Before the tin is warded off to the device pin, continuously carry clean liquid soldering tin to tin pot overflow mouth department through pumping mechanism, unnecessary soldering tin falls into the box that holds soldering tin through the overflow limit, and the surface oxide accumulation can be avoided to the soldering tin that flows. The flow channel bent in the pumping mechanism can relieve the periodic flow velocity fluctuation when the impeller pump transmits the liquid soldering tin, the double-layer mesh-shaped flow stabilizing device can further stabilize the flow uniformity of the liquid soldering tin, and finally the tin liquid surface stability effect close to that of a static tin pot is formed at the rectangular overflow port. After the pins of the device are enameled with tin, the pumping mechanism stops running, and the soldering tin at the overflow port stops flowing and falls back into the tin pot, so that the continuous oxidation of the soldering tin can be avoided.
The technical solution of the invention is as follows:
a tin pot structure for automatic tin coating equipment comprises: the device comprises a box body, an impeller pump, a conduction cavity, a motor and a double-layer mesh-shaped current stabilizer;
the liquid soldering tin is contained in the box body, the motor is fixedly arranged on the outer wall of the box body, and the motor is used for pumping the liquid soldering tin in the box body into the conduction cavity and overflowing from the top of the conduction cavity to flow back into the box body;
the double-layer mesh-shaped current stabilizer is arranged inside the conduction cavity and used for performing current stabilization treatment on the liquid soldering tin flowing in the conduction cavity.
Preferably, the vane pump comprises: a wheel stem and an impeller;
one end of the wheel rod is in transmission with the motor through a chain, the other end of the wheel rod is fixedly connected with an impeller, and the impeller is arranged in the transmission cavity.
Preferably, the conductive cavity comprises: the cavity body base, the cavity body cover plate and the rectangular-square-shaped overflow cavity are arranged on the cavity body base;
a cavity cover plate is fixedly arranged at the bottom of the cavity base, and a rectangular-square-shaped overflow cavity is fixedly arranged at the top of the cavity base;
a round groove and an S-shaped groove are processed at the bottom of the cavity base, and the S-shaped groove is used as a flow channel; the circular groove is internally provided with an impeller and communicated with a flow passage, and the flow passage is communicated with the return-shaped overflow cavity;
the cavity cover plate is provided with a through hole corresponding to the impeller, and the through hole is used for enabling the liquid soldering tin contained in the box body to flow into the flow channel under the rotation action of the impeller.
Preferably, one side wall of the opening at the top of the zigzag-shaped overflow cavity is lower than the other three side walls by 3-5 mm, so that an overflow edge is formed, and liquid solder overflowing from the top of the zigzag-shaped overflow cavity flows back into the box body.
Preferably, the flow channel is curved to play a role in stabilizing the flow.
Preferably, the wheel rod is connected with the top of the cavity base through a bearing, and sealing treatment is carried out.
Preferably, the vane pump further comprises: a housing box;
the cover box is arranged outside a chain connecting the wheel rod and the motor.
Preferably, the method further comprises the following steps: a cover plate;
the top of the box body is provided with a cover plate, an opening is processed on the cover plate and used for enabling the top of the zigzag overflow cavity to extend out of the surface of the cover plate, and the size of the opening is larger than the size of the cross section of the zigzag overflow cavity;
the wheel rod is connected with the cover plate through a bearing.
Preferably, the double-layer mesh flow stabilizer comprises: an upper mesh piece and a lower mesh piece;
the upper mesh piece and the lower mesh piece are arranged at the lower half part of the square-back overflow cavity from top to bottom;
a plurality of through holes with the same size are uniformly distributed on the upper mesh piece, and a plurality of through holes with the same size are uniformly distributed on the lower mesh piece;
the opening area of the upper mesh part and the lower mesh part is not more than 50% of the horizontal sectional area of the return-shaped overflow cavity;
the diameter of the upper through hole of the lower mesh piece is larger than that of the upper through hole of the upper mesh piece.
Preferably:
the distance between the upper mesh piece and the lower mesh piece is greater than 2 times of the maximum aperture;
the diameter of the upper through hole of the upper mesh piece ranges from 2.5mm to 3.5mm, and the diameter of the upper through hole of the lower mesh piece is 1.5 to 2.5 times of that of the upper mesh piece;
the distance from the lower mesh piece to the upper surface of the cavity base is not more than twice the height of the flow channel in the conduction cavity.
Compared with the prior art, the invention has the beneficial effects that:
1) The tin plating device can continuously pump the soldering tin to flow through the overflow port before tin plating, and can remove oxides on the surface of the tin pot through continuous flowing of the soldering tin, so that the oxides cannot be accumulated, and the tin liquid surface at the tin plating position is ensured to be always in a clean state.
2) The invention adds the specially designed bent flow channel in the pump tin structure, relieves the periodic flow velocity fluctuation when the impeller pump transmits the liquid soldering tin, and leads the soldering tin flow velocity to be more uniform and consistent.
3) The invention adds the double-layer mesh-shaped current stabilizer at the rear end of the bent flow channel and the front end of the overflow port in the tin pumping structure, and the specially designed hole size and position distribution can restrict the flowing direction and speed of the liquid soldering tin, so that the tin liquid surface at the position of the overflow port is smooth and stable without any disturbance.
4) The tin plating device establishes a stable tin liquid level by pumping soldering tin before tin plating, and stops pumping the soldering tin after tin plating is finished every time, so that the soldering tin at the overflow port stops flowing and falls back into a tin pot, and continuous oxidation of the soldering tin can be avoided.
5) The automatic tin coating device is simple in structure, small in size and convenient to integrate into automatic tin coating equipment for use.
Drawings
FIG. 1 is a view showing the construction of a tin pan according to the present invention;
FIG. 2 is a bottom view of the impeller pump and the conducting cavity in positional relationship;
fig. 3 is a schematic view of the upper and lower mesh members in an assembled position.
Detailed Description
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
As shown in figure 1, the invention relates to a tin pot structure for automatic tin coating equipment, which comprises the following components: the device comprises a groove-shaped box body, an impeller pump, a transmission cavity and a double-layer mesh-shaped flow stabilizing device. The motor 7 is fastened on the side wall of the groove-shaped box body, and the conduction cavity is arranged inside the groove-shaped box body. The impeller pump is fixed with the groove-shaped box body and the conduction cavity through a bearing, and a double-layer mesh-shaped flow stabilizing device is arranged inside the return-shaped overflow cavity 10.
The flute profile box includes: the box body 1, first apron 2, second apron 3. The box body 1 is of a thin-wall cavity structure with an open top, the first cover plate 2 and the second cover plate 3 are fixedly installed at the top of the box body 1 through bolts, an opening is machined in the second cover plate 3 and used for enabling the top of the rectangular-shaped overflow cavity 10 to stretch out of the surface of the second cover plate 3, and the opening of the second cover plate 3 is larger than the cross section size of the rectangular-shaped overflow cavity 10.
The vane pump includes: wheel pole 4, impeller 5, motor 7 and cover box 6. One end of the wheel rod 4 is connected with the impeller 5, and the other end is connected with the motor 7 through a chain. The position of the wheel rod 4 close to the impeller 5 is fixed on a conduction cavity base 8 through a bearing. The wheel rod 4 is close to one side of the motor 7 and is fixed on the first cover plate 2 of the groove-shaped box body through a bearing. The motor 7 is fixed outside the groove-shaped box body 1 through bolts and connected with the wheel rod 4 through a chain, and the chain mounting position is protected safely through the cover box 6. The axis of the wheel rod 4 is vertical to the liquid level of the liquid soldering tin in the box body 1.
As shown in fig. 2, the conductive chamber includes: a cavity base 8, a cavity cover plate 9 and a rectangular-shaped overflow cavity 10. The whole body is L-shaped and is divided into a horizontal part and a vertical part. The bottom of the cavity base 8 is provided with a circular groove and an S-shaped groove, and the S-shaped groove is used as a flow channel. The impeller 5 is accommodated in the circular groove, the circular groove is communicated with the flow channel, the flow channel is communicated with the return-shaped overflow cavity 10, and the cavity cover plate 9 is installed at the bottom of the cavity base 8 to form a closed cavity. Through holes are processed on the cavity cover plate 9 at positions corresponding to the impellers 5 and are used for enabling the liquid soldering tin to flow into the flow channel under the action of the impellers 5. The flow channel is curved to play a role in stabilizing the flow. The height of the conduction cavity ranges from 5mm to 10mm.
The connecting surface of the cavity base 8 and the cavity cover plate 9 is in a horizontal state. The bottom of the rectangular-shaped overflow cavity 10 is fastened on the cavity base 8 through bolts, and the rectangular-shaped overflow cavity 10 is in a vertical state. One side wall of the opening at the top of the rectangular-square-shaped overflow cavity 10 is lower than the other three side walls by 3-5 mm, so that an overflow edge is formed, and liquid soldering tin overflowing from the top of the rectangular-square-shaped overflow cavity 10 flows back into the box body 1. The cavity base 8 is fixedly arranged at the bottom of the box body 1, and the cavity cover plate 9 is not contacted with the bottom of the box body 1.
As shown in fig. 3, the double-layer mesh-shaped flow stabilizer includes: the upper mesh piece 11 and the lower mesh piece 12 are both made of titanium alloy, have the thickness of 2mm, are horizontally fixed inside the zigzag overflow cavity 10 and are horizontally installed. A plurality of through holes are uniformly distributed on the upper mesh part 11 and the lower mesh part 12, and the area of the through holes is not more than 50% of the horizontal sectional area of the square-back overflow cavity 10. The through holes on the upper mesh piece 11 have the same diameter, and the through holes on the lower mesh piece 12 have the same diameter. The diameter of the through hole on the upper mesh piece 11 ranges from 2.5mm to 3.5mm, and the diameter of the through hole on the upper mesh piece 11 in the embodiment of the invention is 3mm. The diameter of the through hole on the lower mesh piece 12 is 1.5-2.5 times of that of the upper mesh piece 11, and the diameter of the through hole on the lower mesh piece 12 is 5mm in the embodiment of the invention. The distance between the upper mesh piece 11 and the lower mesh piece 12 is larger than 2 times of the maximum aperture, and the distance between the upper mesh piece and the lower mesh piece ranges from 10mm to 12mm in the embodiment of the invention. The upper mesh piece 11 is positioned at the lower position near the middle part of the square-back-shaped overflow cavity 10, the lower mesh piece 12 is positioned below the upper mesh piece 11, and the distance from the lower mesh piece 12 to the upper surface of the cavity base 8 is not more than twice the height of the flow channel in the conduction cavity.
The invention relates to a control method for tin plating process by using a tin pot structure of automatic tin plating equipment, which comprises the following working steps:
1) Starting motor 7, motor 7 pass through chain drive wheel pole 4 and rotate, drive synchronous impeller 5 and rotate, go into the conduction intracavity with the interior clean liquid soldering tin pump of box body 1, the crooked runner of flowing through flows through double-deck mesh form current stabilizer, until filling up font overflow chamber 10 that returns, unnecessary soldering tin gets into box body 1 through the overflow face at font overflow chamber 10 top. The rotating speed of the impeller pump can enable the liquid soldering tin in the box body 1 to continuously overflow from the return-shaped overflow cavity 10 and keep the liquid level stable;
2) And forming a stable static tin liquid level on the upper surface of the zigzag overflow cavity 10, and carrying out tin coating treatment on pins of the gold-plated lead components.
3) After the tin coating process is finished, the motor 7 closes the impeller 5 to stop rotating, the pumping tin soldering process stops, the tin soldering at the overflow port stops flowing and falls back into the box body 1, and continuous oxidation of the tin soldering can be avoided.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above. In the present embodiment, the technical features in the embodiments may be combined with each other without conflict.
Those skilled in the art will appreciate that those matters not described in detail in the present specification are well known in the art.
Claims (10)
1. The utility model provides a tin pot structure for automatic tin equipment that wards off which characterized in that includes: the device comprises a box body (1), an impeller pump, a transmission cavity, a motor (7) and a double-layer mesh-shaped flow stabilizing device;
liquid soldering tin is contained in the box body (1), the motor (7) is fixedly installed on the outer wall of the box body (1), and the motor (7) is used for pumping the liquid soldering tin in the box body (1) into the conduction cavity and overflowing from the top of the conduction cavity to flow back into the box body (1);
the double-layer mesh-shaped current stabilizer is arranged inside the conduction cavity and used for performing current stabilization treatment on the liquid soldering tin flowing in the conduction cavity.
2. The tin pot structure for automatic tin enameling equipment according to claim 1, wherein the impeller pump comprises: a wheel rod (4) and an impeller (5);
one end of the wheel rod (4) is in transmission with the motor (7) through a chain, the other end of the wheel rod (4) is fixedly connected with the impeller (5), and the impeller (5) is arranged in the transmission cavity.
3. The tin pot structure for automatic tin enameling equipment according to claim 2, wherein the conduction cavity comprises: a cavity base (8), a cavity cover plate (9) and a Chinese character 'hui' shaped overflow cavity (10);
a cavity cover plate (9) is fixedly arranged at the bottom of the cavity base (8), and a zigzag overflow cavity (10) is fixedly arranged at the top of the cavity base (8);
a round groove and an S-shaped groove are processed at the bottom of the cavity base (8), and the S-shaped groove is used as a flow channel; the impeller (5) is accommodated in the circular groove, the circular groove is communicated with the flow channel, and the flow channel is communicated with the return-shaped overflow cavity (10);
the cavity cover plate (9) is provided with a through hole corresponding to the impeller (5), and the through hole is used for enabling liquid soldering tin contained in the box body (1) to flow into the flow channel under the rotation action of the impeller (5).
4. The tin pot structure for automatic tin coating equipment according to claim 3, characterized in that one side wall of the opening at the top of the rectangular-shaped overflow cavity (10) is lower than the other three side walls by 3-5 mm to form an overflow edge, so that the liquid solder overflowing from the top of the rectangular-shaped overflow cavity (10) flows back into the tank body (1).
5. The tin pot structure for automatic tin coating equipment as claimed in claim 3, wherein the flow channel is curved to provide a steady flow effect.
6. The tin pot structure for automatic tin enameling equipment according to claim 3, wherein the wheel rod (4) and the top of the cavity base (8) are connected through a bearing and are sealed.
7. The tin pot structure for automatic tin enameling equipment according to any one of claims 2 to 6, wherein the impeller pump further comprises: a housing box (6);
the cover box (6) is arranged outside the chain connecting the wheel rod (4) and the motor (7).
8. The tin pot structure for automatic tin enameling equipment according to any one of claims 3 to 6, characterized by further comprising: a cover plate;
a cover plate is arranged at the top of the box body (1), an opening is processed on the cover plate and used for enabling the top of the rectangular-shaped overflow cavity (10) to extend out of the surface of the cover plate, and the size of the opening is larger than the size of the cross section of the rectangular-shaped overflow cavity (10);
the wheel rod (4) is connected with the cover plate through a bearing.
9. The tin pot structure for automatic tin coating equipment according to any one of claims 3 to 6, wherein the double-layer mesh-shaped flow stabilizer comprises: an upper mesh piece (11) and a lower mesh piece (12);
the upper mesh piece (11) and the lower mesh piece (12) are arranged at the lower half part of the rectangular-shaped overflow cavity (10) from top to bottom;
a plurality of through holes with the same size are uniformly distributed on the upper mesh piece (11), and a plurality of through holes with the same size are uniformly distributed on the lower mesh piece (12);
the opening area of the upper mesh piece (11) and the lower mesh piece (12) is not more than 50% of the horizontal sectional area of the zigzag overflow cavity (10);
the diameter of the upper through hole of the lower mesh piece (12) is larger than that of the upper through hole of the upper mesh piece (11).
10. The tin pot structure for automatic tin enameling equipment according to claim 9, characterized in that:
the distance between the upper mesh piece (11) and the lower mesh piece (12) is more than 2 times of the maximum aperture;
the diameter of the through hole on the upper mesh piece (11) ranges from 2.5mm to 3.5mm, and the diameter of the through hole on the lower mesh piece (12) is 1.5 to 2.5 times of the diameter of the through hole on the upper mesh piece (11);
the distance from the lower mesh piece (12) to the upper surface of the cavity base (8) is not more than twice the height of the flow channel in the conduction cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211051205.3A CN115415630B (en) | 2022-08-30 | 2022-08-30 | Tin pot structure for automatic tin lining equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202211051205.3A CN115415630B (en) | 2022-08-30 | 2022-08-30 | Tin pot structure for automatic tin lining equipment |
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| Publication Number | Publication Date |
|---|---|
| CN115415630A true CN115415630A (en) | 2022-12-02 |
| CN115415630B CN115415630B (en) | 2024-05-14 |
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| CN202211051205.3A Active CN115415630B (en) | 2022-08-30 | 2022-08-30 | Tin pot structure for automatic tin lining equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116037577A (en) * | 2022-12-29 | 2023-05-02 | 西安空间无线电技术研究所 | Multifunctional device and method for removing redundant substances |
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