CN1591914A - 发光二极管元件发光装置 - Google Patents
发光二极管元件发光装置 Download PDFInfo
- Publication number
- CN1591914A CN1591914A CNA031550991A CN03155099A CN1591914A CN 1591914 A CN1591914 A CN 1591914A CN A031550991 A CNA031550991 A CN A031550991A CN 03155099 A CN03155099 A CN 03155099A CN 1591914 A CN1591914 A CN 1591914A
- Authority
- CN
- China
- Prior art keywords
- light
- circuit board
- flexible circuit
- emitting diode
- emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
- H01L2924/3511—Warping
Abstract
Description
Claims (24)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031550991A CN100401534C (zh) | 2003-08-27 | 2003-08-27 | 发光二极管元件发光装置,背光模块及其光源调整方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB031550991A CN100401534C (zh) | 2003-08-27 | 2003-08-27 | 发光二极管元件发光装置,背光模块及其光源调整方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1591914A true CN1591914A (zh) | 2005-03-09 |
CN100401534C CN100401534C (zh) | 2008-07-09 |
Family
ID=34598046
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB031550991A Expired - Fee Related CN100401534C (zh) | 2003-08-27 | 2003-08-27 | 发光二极管元件发光装置,背光模块及其光源调整方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100401534C (zh) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008086682A1 (en) * | 2007-01-15 | 2008-07-24 | Hong Kong Applied Science And Technology_Research Institute Co. Ltd. | Light-emitting device and lens therefor |
US7688526B2 (en) | 2007-01-18 | 2010-03-30 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | Light-emitting devices and lens therefor |
CN1945803B (zh) * | 2006-10-27 | 2010-08-18 | 杭州中宙光电有限公司 | 一种大功率led扩展光源器件的封装方法 |
CN101922660A (zh) * | 2010-07-23 | 2010-12-22 | 深圳市华星光电技术有限公司 | 背光模块及显示装置 |
US7982825B2 (en) | 2006-01-25 | 2011-07-19 | Samsung Electronics Co., Ltd. | Backlight assembly and liquid crystal display apparatus having the same |
CN101517467B (zh) * | 2006-09-21 | 2011-08-10 | 3M创新有限公司 | Led背光源 |
CN102537712A (zh) * | 2010-12-07 | 2012-07-04 | 财团法人工业技术研究院 | 可挠式光源模块 |
CN101452917B (zh) * | 2007-12-05 | 2013-02-20 | 财团法人工业技术研究院 | 光源装置 |
CN109449273A (zh) * | 2018-12-11 | 2019-03-08 | 常熟理工学院 | 一种紫外led封装结构 |
CN117038818A (zh) * | 2023-10-08 | 2023-11-10 | 盐城鸿石智能科技有限公司 | 一种高反射MicroLED及其制备方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5613751A (en) * | 1995-06-27 | 1997-03-25 | Lumitex, Inc. | Light emitting panel assemblies |
EP1161754B1 (en) * | 2000-01-06 | 2006-09-06 | Koninklijke Philips Electronics N.V. | Luminaire and light-emitting panel |
US6733147B2 (en) * | 2000-09-07 | 2004-05-11 | San Zhuang Wang | Backlighting system for displays |
JP2003100126A (ja) * | 2001-09-20 | 2003-04-04 | Citizen Electronics Co Ltd | 導光板による色度補正 |
-
2003
- 2003-08-27 CN CNB031550991A patent/CN100401534C/zh not_active Expired - Fee Related
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7982825B2 (en) | 2006-01-25 | 2011-07-19 | Samsung Electronics Co., Ltd. | Backlight assembly and liquid crystal display apparatus having the same |
CN101517467B (zh) * | 2006-09-21 | 2011-08-10 | 3M创新有限公司 | Led背光源 |
CN1945803B (zh) * | 2006-10-27 | 2010-08-18 | 杭州中宙光电有限公司 | 一种大功率led扩展光源器件的封装方法 |
WO2008086682A1 (en) * | 2007-01-15 | 2008-07-24 | Hong Kong Applied Science And Technology_Research Institute Co. Ltd. | Light-emitting device and lens therefor |
US7688526B2 (en) | 2007-01-18 | 2010-03-30 | Hong Kong Applied Science And Technology Research Institute Co. Ltd. | Light-emitting devices and lens therefor |
CN101452917B (zh) * | 2007-12-05 | 2013-02-20 | 财团法人工业技术研究院 | 光源装置 |
CN101922660A (zh) * | 2010-07-23 | 2010-12-22 | 深圳市华星光电技术有限公司 | 背光模块及显示装置 |
CN102537712A (zh) * | 2010-12-07 | 2012-07-04 | 财团法人工业技术研究院 | 可挠式光源模块 |
US8636381B2 (en) | 2010-12-07 | 2014-01-28 | Industrial Technology Research Institute | Flexible light source module |
CN109449273A (zh) * | 2018-12-11 | 2019-03-08 | 常熟理工学院 | 一种紫外led封装结构 |
CN117038818A (zh) * | 2023-10-08 | 2023-11-10 | 盐城鸿石智能科技有限公司 | 一种高反射MicroLED及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN100401534C (zh) | 2008-07-09 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
ASS | Succession or assignment of patent right |
Owner name: YUDONG TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: LIJIE COMPUTER CO., LTD. Effective date: 20070803 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20070803 Address after: Taipei city of Taiwan Province Applicant after: Transpacific IP Pte Ltd. Address before: No. two, No. 1-1, R & D Park, Hsinchu Science Park, Taiwan Applicant before: Lijie Computer Co., Ltd. |
|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: YUXI SCIENCE CO., LTD. Free format text: FORMER OWNER: YUDONG TECHNOLOGY CO., LTD. Effective date: 20090828 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20090828 Address after: Delaware Patentee after: Transpacific IP Pte Ltd. Address before: Taipei city of Taiwan Province Patentee before: Transpacific IP Pte Ltd. |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080709 Termination date: 20110827 |