CN1590056A - Jigsaw - Google Patents
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- CN1590056A CN1590056A CN 200410073830 CN200410073830A CN1590056A CN 1590056 A CN1590056 A CN 1590056A CN 200410073830 CN200410073830 CN 200410073830 CN 200410073830 A CN200410073830 A CN 200410073830A CN 1590056 A CN1590056 A CN 1590056A
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- wire saw
- abrasive particle
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- abrasive grain
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Abstract
The present invention provides a linear saw which can optimize the number, distance and core deflecting amount of the abrasive grain adhered on the linear saw thereby effectively preventing the falling off of the abrasive grain. The linear saw is formed by the following mode, namely, the light permeating the linear saw which is fixed with abrasive grain by the adhesive material at the periphery of the core wire is used to shoot the image of the linear saw, the profile of the abrasive grain is detected according to the brightness of the image of the shot linear saw and does detection thereby mastering the position of the abrasive grain, at least the number, distance and projected area of abrasive grain are detected thereby detecting the respective condition of the abrasive grain and therefore lead to that the projected area of the abrasive grain is 2026300660r above or is 801r below relative to the projected area of the abrasive grain layer, leads to that the standard deviation of the distance of the abrasive grain is 200 mu m or below, and leads to that the ratio between thickness of thin abrasive grain layer to the thickness of thick abrasive grain layer is 0.6 or above for the abrasive grain layer which is spaced with a core wire and is formed at the two side of the core wire.
Description
Technical field
The present invention relates to make the optimized wire saw of attachment state of the lip-deep abrasive particle of wire saw.
Background technology
To cut out silicon chip etc. from large diameter silicon ingot is purposes, and wire saw is widely used in recent years.
As this wire saw a kind of the resinoid bond wire saw is arranged, its with the high tensile metal as heart yearn, constitute with following material lining heart yearn, described material with inorganic material such as organic material such as polyamide, polyimide resin or glass as adhesive, make abrasive particle disperse to contain in wherein forming.
Ideal situation is to adhere to a certain amount of abrasive particle on the wire saw surface with almost equal interval rule ground, but because the error on making makes the attachment state confusion of abrasive particle sometimes.
What the cutting performance of wire saw was had influence most is the set state of the abrasive particle of institute's set on the heart yearn surface, and mainly containing abrasive particle number, abrasive particle spacing, core shift amount is important factor.If the set state difference of abrasive particle, then abrasive particle can come off too early, finally causes adhesive material to be peeled off.Because peeling off of adhesive material can cause cutting speed sharply to descend, the precision of machined surface is variation also, also can make the lifetime of wire saw simultaneously.
Therefore, for prevent because of abrasive particle come off the peeling off of the bonding agent that causes, carry out high efficiency processing, be necessary to make abrasive particle set state to become optimum state.
In patent documentation 1, disclose so that the abrasive particle set state on wire saw surface becomes the manufacture method that good state is the wire saw of purpose.
Patent documentation 1: the spy opens 2002-036091 communique (paragraph numbering 0009～0077)
Summary of the invention
But this manufacture method is by the occupied area that is limited to wire saw surface abrasive particle, is that the abrasive particle number comes the cutting performance of wire saw is managed, can not carry out the optimization of abrasive particle spacing or core shift amount.Like this, if only make, then can not prevent coming off of abrasive particle effectively by management abrasive particle number.
The present invention finishes in view of such situation, and its purpose is to provide a kind of abrasive particle number, abrasive particle spacing or core shift amount optimization that makes the abrasive particle that anchors on the wire saw, can prevent the wire saw that abrasive particle comes off effectively.
In order to solve the above problems, wire saw of the present invention is characterised in that, it forms as follows, promptly, utilization has seen through the light that the wire saw of abrasive particle is arranged via the adhesive material set around heart yearn, take the image of aforementioned wire saw, brightness according to the image of captured wire saw detects the profile of grasping abrasive particle, detect the difference state of aforementioned abrasive particle, according to projected area by the detected aforementioned abrasive particle of the detection method of above-mentioned wire saw, control aforementioned abrasive particle projected area, the projected area that makes aforementioned abrasive particle with respect to the projected area of abrasive grain layer more than or equal to 20% smaller or equal to 80%.
When the projected area of aforementioned abrasive particle during,,, produce peeling off of adhesive material so coming off of abrasive particle can be taken place prematurely because effect abrasive particle number is few with respect to the projected area less than 20% of abrasive grain layer.On the other hand, when the projected area of aforementioned abrasive particle surpasses 80% with respect to the projected area of abrasive grain layer,,, cause working (machining) efficiency to descend so can cut the obstruction of powder because effect abrasive particle number is too much.Therefore, by being made as more than or equal to 20% smaller or equal to 80% with respect to the projected area of the aforementioned abrasive particle of the projected area of abrasive grain layer, not only can suppress to stop up, keep working (machining) efficiency, can also prevent that abrasive particle from coming off and the wire saw that cutting performance is good is peeled off, realized to adhesive material simultaneously.
Wire saw of the present invention, it is characterized in that forming as follows, that is, according to controlling aforementioned abrasive particle spacing by the abrasive particle spacing of the detected aforementioned abrasive particle of the detection method of aforesaid wire saw, the standard deviation that makes aforementioned abrasive particle spacing is at 200 μ m or below it.
When the standard deviation of abrasive particle spacing surpassed 200 μ m, it is dispersed relatively poor that abrasive particle is arranged, and the machined surface precision that is cut material in the part of abrasive particle aggegation is lower, and peeling off of adhesive material appears in the part easily wide in the abrasive particle spacing.Therefore, the standard deviation by making the abrasive particle spacing can suppress because reduction of machined surface precision that causes at random and/or the peeling off of adhesive material that abrasive particle is arranged at 200 μ m or below it.
Wire saw of the present invention forms as follows, promptly, according to controlling aforementioned core shift amount by the detected next core shift amount of the detection method of aforesaid wire saw, make for the abrasive grain layer that is formed on both sides for clipping heart yearn, the thickness of thin abrasive grain layer with respect to the ratio of the thickness of thick abrasive grain layer 0.6 or more than it.
When the thickness of thin abrasive grain layer during with respect to the ratio less than 0.6 of the thickness of thick abrasive grain layer, the core shift of abrasive grain layer is bigger, and the machined surface precision that is cut material is low, is easy to produce eccentric wear and decreases.Therefore, the thickness by will approaching abrasive grain layer is made as 0.6 or more than it with respect to the ratio of the thickness of thick abrasive grain layer, can guarantee to be cut the machined surface precision of material well, suppresses the generation that eccentric wear decreases.
Wire saw of the present invention is characterized in that not comprising in aforementioned adhesive material and gathers materials, and the light transmission rate of adhesive material is 80% or more than it.
When in adhesive material, including metal dust and/or inorganic powder etc. and gather materials, be easy to be judged to be abrasive particle with gathering materials, be difficult to carry out the judgement that correct abrasive particle distributes, result of determination easily produces error.In addition, when the light transmission rate less than 80% of adhesive material, then be difficult to measure the position relation of heart yearn and abrasive grain layer, be difficult to carry out the judgement that correct abrasive particle distributes.Therefore, gather materials by making not comprise in the aforementioned adhesive material, the light transmission rate that makes adhesive material can correctly carry out the judgement that abrasive particle distributes 80% or more than it, prevent coming off of abrasive particle and peeling off of adhesive material, realize the good wire saw of cutting performance.
Wire saw of the present invention is characterised in that aforementioned adhesive material is made of photoresist.
Because photoresist is compared setting rate with thermosetting resin quite fast, so, by using photoresist, can promptly carry out the judgement that abrasive particle distributes as adhesive material, can improve the productivity of wire saw.
According to the present invention, can produce following effect.
(1) by forming as follows, promptly, utilization has seen through the light that the wire saw of abrasive particle is arranged via the adhesive material set around heart yearn, take the image of aforementioned wire saw, brightness according to the image of captured wire saw detects the profile of grasping abrasive particle, detect the difference state of aforementioned abrasive particle, according to projected area by the detected aforementioned abrasive particle of the detection method of above-mentioned wire saw, control aforementioned projected area, make the projected area of aforementioned abrasive particle with respect to the projected area of abrasive grain layer 20% or more than it and 80% or below it, obstruction can suppressed thus, when keeping working (machining) efficiency, prevent coming off of abrasive particle and peeling off of adhesive material, realize the good wire saw of cutting performance.
(2) standard deviation by making the abrasive particle spacing is at 200 μ m or below it, can suppress the peeling off of decline, adhesive material of the machined surface precision that produces at random of arranging because of abrasive particle.
(3) be formed on for clipping heart yearn for the abrasive grain layer of its both sides, the thickness by making thin abrasive grain layer 0.6 or more than it, can guarantee to be cut the machined surface precision of material with respect to the ratio of the thickness of thick abrasive grain layer well, suppresses the generation that eccentric wear decreases.
(4) do not gather materials owing in adhesive material, containing, and the light transmission rate of adhesive material is located at 80% or more than it, therefore can correctly carry out the judgement that abrasive particle distributes, prevent coming off of abrasive particle and peeling off of adhesive material, realize the good wire saw of cutting performance.
(5) by using photoresist, can promptly carry out the judgement that abrasive particle distributes, improve the productivity of wire saw as adhesive material.
Description of drawings
Fig. 1 is the figure of an example of the checkout gear of expression wire saw of the present invention.
Fig. 2 is the figure of expression by an example of the rest image of the captured wire saw of CCD camera.
Fig. 3 be shown schematically in heart yearn around a plurality of abrasive particles of set and formed the figure of the form of wire saw.
Fig. 4 is the manufacturing process of explanation wire saw of the present invention and the figure of manufacturing installation.
Label declaration
1 wire saw, 2 CCD cameras
3 led light sources, 4 camera power supplys
5 led light sources power supply 6 camera switch
7 control device, 8 arithmetic units
9 displays, 10 keyboards
11 mouses, 21 heart yearns
22 bond layers, 23 abrasive particles
31 bonding agent grooves, 32 heart yearns
33 covered wires, 34 moulds
35 die location control parts, 36 hardening of resin portions
37 sandwich roller 38 a V groove pulley
39 X-directions are observed with camera head 40 the 2nd V groove pulley
41 Y directions are observed and are used camera head
The specific embodiment
Below, the present invention is described according to the device example.
At first, detection method and the checkout gear to the wire saw that uses in order to make wire saw of the present invention describes.
Fig. 1 is illustrated in employed checkout gear A in the detection operation among the wire saw manufacturing process.
In Fig. 1, along with respect to wire saw 1 vertically for vertical and 2 mutually orthogonal direction of principal axis dispose CCD camera 2, clip wire saw 1 ground to ground and dispose led light source 3 relatively with this CCD camera 2.On CCD camera 2, connect camera with power supply 4, on led light source 3, connecting led light source power supply 5.Connecting camera switch 6 at 2 cameras on power supply 4, this camera switch 6 and 2 led light sources 3 are connected on the control device 7, and control device 7 is connected on the arithmetic unit 8.On arithmetic unit 8, connecting display 9, keyboard 10 and mouse 11 as its peripheral equipment.
In this checkout gear A, though be the image of taking wire saw 1 by CCD camera 2, this moment is by 3 pairs of wire saw 1 irradiates lights of led light source.Therefore, CCD camera 2 utilizes the light on the top layer that sees through wire saw 1 to take the image of wire saw 1.By camera switch 6, switch to the end and be and select in 2 CCD cameras 2 which, by control device 7 control cameras with power supplys 4, led light source on/off with power supply 5, and the switching of camera switch 6.The image of wire saw 1 is taken into arithmetic unit 8, and with the quality of judging wire saw whether these data are handled.
Utilize Fig. 2, Fig. 3 that the detection action of the wire saw of this checkout gear A is described below.
In Fig. 2 (a), represented by CCD camera 2 captured, longitudinally represent the image of wire saw 1.Wire saw 1, be around heart yearn 21, to utilize the abrasive particles 23 such as adhesive material 22 set diamonds of the such light transmission of photoresist to form, and in the arithmetic unit 8 of above-mentioned checkout gear A, at first, brightness in the reading images is drawn curve I along the boundary position that brightness changes significantly.Because can judge this curve I is the outer peripheral face of wire saw 1 and the border in space, so will be in the left and right sides of wire saw 1 location definition of represented curve I be the outer peripheral face of wire saw 1, by in apart from should be in the left and right sides represented curve I be equidistant point and along wire saw 1 vertically draw straight line I, this straight line I is made as the center line of wire saw 1.Secondly, will produce the position that brightness changes with the contour shape of abrasive particle 23 accordingly and set as a reference value, the point that will have this brightness links up and draws curve II, as the outline line of abrasive particle 23.
Fig. 2 (b) is the partial enlarged drawing of Fig. 2 (a), in a side than the more close heart yearn 21 of curve II, draw straight line II along vertical perforation abrasive particle 23 of wire saw 1 (this straight line II is the regression straight line of this curve II of being calculated by curve II), and with this straight line II abreast, draw the straight line III that the distance of binding from straight line I to curve II form for maximum point and link the straight line IV that the distance from straight line I to curve II forms for minimum point.Straight line III is the line that links the tip of abrasive particle 23, and straight line IV represents the concavo-convex baseline of abrasive particle 23.
With straight line II abreast, draw straight line V (in Fig. 2 (b), only expressing the part of being surrounded) with what can comprise abrasive particle 23 most by curve II suchly, with this straight line V vertically, drawing straight line VI from straight line III to the straight line IV.Because this straight line VI is that the position at the cardinal principle center between detected abrasive particle 23 is derivative, therefore can detects the abrasive particle number, and can detect abrasive particle spacing L by the spacing of adjacent straight line VI by the number of straight line VI.
According to Fig. 3, to describing according to the operation of carrying out the quality whether judgement of wire saw 1 by detected abrasive particle number of said method and abrasive particle spacing.
Fig. 3 has schematically shown that a plurality of abrasive particles 23 of set (being represented by drawing oblique line) form the situation of wire saw 1 around heart yearn 21, and the external diameter of wire saw 1 is made as W, and the thickness of abrasive particle 23 that will be positioned at the left side of wire saw 1 is made as W
L, the thickness of abrasive particle 23 that will be positioned at the right side of wire saw 1 is made as W
RIn addition, the projected area with each abrasive particle is made as S
L1, S
L2... S
Ln, S
R1, S
R2... S
RnDeng, L is made as L with the abrasive particle spacing
L1, L
L2... L
Ln, L
R1, L
R2... L
RnDeng.This detection (judgement) operation is carried out according to following steps.
At first, whether the abrasive particle number is judged in threshold value or more than it.At this, represented is along wire saw 1 vertically on the part of length L, about respectively each set the situation of 5 abrasive particles 23 is arranged; With for example on the part of length L the abrasive particle number of institute's set be judged to be non-defective unit 5 or situation more than it.
This judgement is all carried out left side, the right side of wire saw 1, when
Abrasive particle number 〉=5 in left side
Abrasive particle number 〉=5 on right side
In the time, be judged to be very, enters step 2 then, then be judged to be in beyond it can not, and represent that with redness abrasive particle counts detection of end.
Step 2
Judge the ratio of the external diameter of the thickness of the abrasive grain layer comprise abrasive particle and wire saw 1.Thickness W when left side abrasive particle 23
LThickness W with the abrasive particle 23 on right side
RAnd with respect to the ratio of the external diameter of wire saw 1 0.55 or more than it, promptly satisfy (W
L+ W
R)/W 〉=0.55 o'clock is judged to be good and enters step 3, when then be judged to be than 0.55 hour can not, and with this numerical value of red display, detection of end.
Step 3
In the shooting picture to earlier figures 3, the right side of heart yearn 21 (side's side) and left side (the opposing party's side) comprise abrasive particle 23 in the bias of the thickness of interior abrasive grain layer, be that the core shift amount of wire saw 1 is judged.If the thickness W of the abrasive particle in left side 23
LThickness W with the abrasive particle 23 on right side
RRatio more than or equal to 0.9, then be judged to be very, enter step 4, if more than or equal to 0.6 less than 0.9, then be judged to be can, enter step 4.That is,
At W
L〉=W
RThe time, if:
W
R/ WX 〉=0.9 item is judged to be good;
0.6≤W
R/ W
L＜0.9 be judged to be can;
At W
L≤ W
RThe time, if
W
L/ W
R〉=0.9 is judged to be good;
0.6≤W
L/ W
R＜0.9 be judged to be can;
Then be judged to be in the time of beyond this can not, with its numerical value of red display, detection of end.
Step 4
Whether the projected area S to the abrasive particle in abrasive grain layer 23 judges in threshold value or more than it.If establishing the thickness of abrasive grain layer (bonding agent and abrasive particle 23) is W in the left side
L, be W on the right side
R, then the projected area L of abrasive grain layer * W is L * W in the left side with respect to illustrated part exactly
L, be L * W on the right side
RThe projected area S of abrasive particle 23 is (S in the left side
LI+ S
L2+ S
L3+ S
L4+ S
L5), be (S on the right side
R1+ S
R2+ S
R3+ S
R4+ S
R5).With respect to the projected area of this abrasive grain layer, ask for the ratio of the projected area of abrasive particle, when satisfying
0.20≤(S
LI+S
L2+S
L3+S
L4+S
L5)/(L×W
L)≤0.80
0.20≤(S
R1+S
R2+S
R3+S
R4+S
R5)/(R×W
R)≤0.80
The time, then be judged to be very, enter step 5, then be judged to be in the time of beyond this can not, represent its numerical value, detection of end with redness.
More than from step 1 to step 4, be the detection operation of pretreatment stage, be for by the inadequate product of abrasive particle number of discharging set, the product that abrasive grain layer produces core shift, prevent from the good and the bad of abrasive particle spacing is judged, to produce erroneous judgement and be provided with.
Step 5
Calculate the standard deviation of the abrasive particle spacing L that obtains by the spacing that detects the straight line VI among Fig. 2, it is judged, whether the quality of the dispersity of judgement abrasive particle 23.
The standard deviation of abrasive particle spacing L, when the abrasive particle 23 in abrasive particle 23 that satisfies the right side clip heart yearn 21 and left side all be judged as just be judged to be good the time good.That is, be generically and collectively referred to as L at abrasive particle spacing L with the left side
L, the abrasive particle spacing on right side is generically and collectively referred to as L
RThe time,
L
LStandard deviation≤25; And L
RStandard deviation≤25
The time, be judged to be very, beyond this scope, when
L
LStandard deviation≤70; And L
RStandard deviation≤70
The time, being judged to be can.In addition, the employed numerical value of above standard deviation means the pixel count in the still frame, and the unit of these numerical value is counting of pixel.Be scaled abrasive particle spacing L as if this is counted, then the upper limit 70 of above-mentioned standard deviation is 200 μ m.
Be judged to be under the good situation by each above step, just directly continuing the manufacturing of wire saw.Be judged to be can situation under, when continuous occurred predefined number of times " can " judgement the time, then alarm is rung, and carries out the disposal that device stops, and perhaps automatically controls as described later.In addition, above-mentioned illustrated numerical value is an example only, is not limited to above-mentioned situation, can suitably set as required.
As the employed light of above-mentioned mensuration, for example can use the wavelength of visible light scope (light of wavelength 400nm～700nm).The light transmission rate of preferred adhesive material 22 is 80% or more than it.This be because, if the light transmission rate less than 80% of adhesive material 22, then can be owing to light transmission rate is low, cause the position that is difficult to utilize the light that has seen through behind the wire saw 1 to measure heart yearn and abrasive grain layer to concern.In addition, as operable light source in said determination, can adopt the white light of fluorescent lamp, Halogen lamp LED, LED etc.
Step through above can produce wire saw 1 of the present invention.Specifically, by step 4, will with the projected area of abrasive particle with respect to the projected area of abrasive grain layer 20% or more than it 80% or such wire saw that forms below it, by step 5, will form detected abrasive particle spacing L standard deviation smaller or equal to 200 μ m, preferably smaller or equal to 70 μ m, be more preferably less than the wire saw that equals 25 μ m.In addition, by step 3, can form a kind of for detected clip heart yearn 21 and be formed on for the thickness of the abrasive grain layer of its both sides and abrasive particle 23, its thickness of thin abrasive grain layer with respect to the ratio of the thickness of thicker abrasive grain layer 0.6 or wire saw more than it.
Secondly, the method that projected area, abrasive particle spacing, core shift amount with the abrasive particle of wire saw 1 are controlled in above such scope describes.
Fig. 4 represents to make while the distribution of the abrasive particle of controlling wire saw the manufacturing process and the manufacturing installation of wire saw.
Make heart yearn 32 sneak into the bonding agent groove 31 of bonding agent 22 resins such as grade of abrasive particle 23 by storage, abrasive particle 23 and adhesive material 22 are overlayed on the surface of this heart yearn 32, make the lining thickness homogenising of such covered wire 33 that has passed through bonding agent groove 34 by mould 34.
Around mould 34, shown in Fig. 4 (b), in the vertical plane of the direction of passing through with respect to covered wire 33,2 (X-axis, Y-axis) directions along quadrature are provided with die location control part 35.
Passed through the covered wire 33 after the mould 34, made the aqueous hardening of resin of coating by the hardening of resin portion 36 that constitutes by ultraviolet lamp etc.
Then, covered wire 33 is by sandwiching roller 37, thereby is changed direct of travel, in addition, keeps two ends by sandwiching, and can suppress the axial rotation of covered wire 33, prevents the change of X, Y-axis.Then, a V groove pulley 38 of using by vibration proof.Then, the 2nd V groove pulley 40 used by vibration proof of covered wire 33.In this vibration proof interval, carry out the detection of aforementioned checkout gear A.X-direction, Y direction that Fig. 4 (c) expression is vertical with respect to the direct of travel of covered wire 33.By an above-mentioned V groove pulley 38 time, observe with camera head 39 by the X-direction that includes aforementioned CCD camera 2, measure the thickness of Y direction of the abrasive grain layer of covered wire 33.By above-mentioned the 2nd V groove pulley 40 time, observe with camera head 41, measure the X-direction thickness of the abrasive grain layer of covered wire 33 by the Y direction that includes aforementioned CCD camera 2.Then, after covered wire 33 has passed through to sandwich roller 37, it is curled.
Wire saw 1 to be formed the projected area S of aforementioned abrasive particle 23 with respect to the projected area L * W of aforementioned abrasive grain layer 20% or more than it 80% or below it, can realize with following method.That is,, only dose abrasive particle 23 to bonding agent groove 31, so that the density of the abrasive particle 23 in the bonding agent groove 31 improves from abrasive particle feeding device 44 when the projected area S of the abrasive particle 23 that is calculated by arithmetic unit 8 is reduced near 20% the time.On the other hand,, only dose resin to bonding agent groove 31, so that the density of the abrasive particle 23 in the bonding agent groove 31 reduces (projected area control operation) from bonding agent feeding device 45 when the projected area S of abrasive particle 23 increases near 80% the time.The adjusting of the density of the abrasive particle 23 in this bonding agent groove 31 can manual operation, also can automatically carry out by electronic-controlled installation 7.Electronic-controlled installation 7 in this case plays the effect as the projected area control device.
In addition, the standard deviation of spacing L that form abrasive particle 23 can realize with following method at 200 μ m or the wire saw below it 1.That is, when the standard deviation of the spacing L of the abrasive particle 23 that is calculated by arithmetic unit 8 surpasses 200 μ m, bonding agent 31 in, improve mixing speed or make and add dispersant increment (the abrasive particle spacing is controlled operation).The adjusting of the dispersiveness in such bonding agent groove 31 can manual operation, also can automatically carry out by electronic-controlled installation 7.Electronic-controlled installation 7 in this case plays the effect as the abrasive particle pitch control unit.
And then, form the core shift amount at setting or the wire saw below it 1, can realize with following method.Promptly, carry out the position adjustment of the mould 34 of die location control part 35, with controlling like that of the center of covered wire 33 by mould 34, be formed on for its left and right sides abrasive grain layer for clipping heart yearn 21 to form, the thickness of the abrasive grain layer of thin side with respect to the ratio of the thickness of the abrasive grain layer of thicker side 0.6 or such wire saw 1 (core shift amount control operation) more than it.The position of the mould 34 of such die location control part 35 is adjusted, can manual operation, also can automatically carry out by Electronic Control portion 7.The effect as the core shift amount control device is played by Electronic Control portion 7 in this case.
Wire saw with above method manufacturing has been carried out cutting test.
The heart yearn of formation wire saw and abrasive particle are as described below.
Heart yearn: φ 0.18mm
Abrasive particle: Ni coating (Ni コ one ト) abrasive particle 40/60 μ m
Experimental condition is as follows.
Cutter sweep: single line cutter sweep
Linear velocity: average 400m/min
Line tension: 19.5N
Be cut material: soda-lime glass 20mm is wide
The relative result of the test of wire saw that expression is made with the projected area that changes abrasive particle in the table 1.
Table 1
| The projected area of abrasive particle | Sharpness | The sharpness rate of descent | The line wear rate |
| ????12％ | ????56 | ????89 | ????80 |
| ????21％ | ????91 | ????23 | ????18 |
| ????42％ | ????100 | ????15 | ????12 |
| ????78％ | ????95 | ????13 | ????13 |
| ????91％ | ????60 | ????12 | ????11 |
In table 1, sharpness is to represent process grooving length beginning back 5 minute in the index that was made as in the value that is at 42% o'clock at 100 o'clock with the abrasive particle projected area.The sharpness rate of descent, expression with respect to the sharpness in back 5 minutes of processing beginning, begin ratio from processing through the sharpness in after 40 minutes 5 minutes.In addition, the line wear rate, be with processing begin through after 40 minutes in the diameter equalization of 10 wire saws that the position was measured to, the difference of obtaining its diameter of preceding wire saw with processing beginning is calculated the value of being tried to achieve as wire saw vary in diameter amount with calculating formula { (wire saw vary in diameter amount)/(abrasive grain layer thickness * 2) } * 100.
As known from Table 1, when the projected area of abrasive particle with respect to the projected area of abrasive grain layer 20% or more than it 80% or its when following, sharpness, sharpness rate of descent, line wear rate all demonstrate good value.Relative therewith, when the projected area of aforementioned abrasive particle during, for which variation all of sharpness, sharpness rate of descent, line wear rate with respect to the projected area less than 20% of abrasive grain layer.This is because because effect abrasive particle number is few, therefore meeting produces coming off of abrasive particle too early, and peeling off of adhesive material taken place.On the other hand, when the projected area of aforementioned abrasive particle surpassed 80% with respect to the projected area of abrasive grain layer, then sharpness descended, and this is because because effect abrasive particle number is too much, thus can cut the obstruction of powder, thereby the cause that causes working (machining) efficiency to descend.
The relative result of the test of wire saw that table 2 expression is made with the standard deviation that changes the abrasive particle spacing.
Table 2
| The standard deviation of abrasive particle spacing | Sharpness | The sharpness rate of descent | The line wear rate | Roughness |
| ????105μm | ????100 | ????12 | ????11 | ????100 |
| ????211μm | ????95 | ????23 | ????18 | ????118 |
| ????308μm | ????73 | ????56 | ????49 | ????165 |
In the table 2, roughness is to represent with the index that the roughness that is cut material after the processing when the standard deviation with the abrasive particle spacing is 105 μ m was made as 100 o'clock.
As known from Table 2, when the standard deviation of abrasive particle spacing surpassed 200 μ m, it is bad that roughness becomes.This be because, because what abrasive particle was arranged when the standard deviation of abrasive particle spacing surpasses 200 μ m is dispersed relatively poor, be easy to produce the such consequence of peeling off of adhesive material so can appear at abrasive particle spacing wide portions, thereby roughness can't be guaranteed in good state.
The relative result of the test of wire saw that table 3 expression is made with changing the core shift amount.
Table 3
| The core shift amount | Sharpness | The sharpness rate of descent | The line wear rate | Roughness |
| ????0.95 | ????100 | ????12 | ????13 | ????100 |
| ????0.62 | ????94 | ????19 | ????17 | ????115 |
| ????0.31 | ????59 | ????49 | ????53 | ????176 |
At this, so-called core shift amount is meant for the abrasive grain layer that is formed on its both sides for clipping heart yearn, the thickness of thin abrasive grain layer is with respect to the ratio of the thickness of thick abrasive grain layer.
As known from Table 3, when core shift quantity not sufficient 0.6, sharpness, sharpness rate of descent, line wear rate all become bad.So this is because of the machined surface low precision that is cut material owing to the core shift of abrasive grain layer greatly, is easy to take place the cause that eccentric wear decreases.
The present invention can be used as incisory wire saw and uses.
Claims (17)
1. wire saw, it is characterized in that, this wire saw forms as follows, promptly, utilization has seen through the light that the wire saw of abrasive particle is arranged via the adhesive material set around heart yearn, take the image of aforementioned wire saw, brightness according to the image of captured wire saw detects the profile of grasping abrasive particle, detect the difference state of aforementioned abrasive particle, according to projected area by the detected aforementioned abrasive particle of the detection method of above-mentioned wire saw, control the bed thickness of aforementioned abrasive particle, the projected area that makes aforementioned abrasive particle with respect to the projected area of abrasive grain layer 20% or more than it 80% or below it.
2. wire saw as claimed in claim 1, it is characterized in that, this wire saw forms as follows, promptly, according to controlling aforementioned abrasive particle spacing by the abrasive particle spacing of the detected aforementioned abrasive particle of the detection method of aforesaid wire saw, the standard deviation that makes aforementioned abrasive particle spacing is at 200 μ m or below it.
3. wire saw as claimed in claim 1 or 2, it is characterized in that, this wire saw forms as follows, promptly, according to controlling aforementioned core shift amount by the detected next core shift amount of the detection method of aforesaid wire saw, make for the abrasive grain layer that is formed on its both sides for clipping heart yearn, the thickness of thin abrasive grain layer with respect to the ratio of the thickness of thick abrasive grain layer 0.6 or more than it.
4. as any described wire saw in the claim 1 to 3, it is characterized in that do not comprise in the aforementioned adhesive material and gather materials, the light transmission rate of adhesive material is 80% or more than it.
5. as any described wire saw in the claim 1 to 4, it is characterized in that aforementioned adhesive material is made of photoresist.
6. the manufacture method of a wire saw, this method are to make the method for wire saw in the process of sending heart yearn continuously to, comprising:
To around heart yearn by the adhesive material set of light transmission have the wire saw of abrasive particle side-irradiation light, utilize the photo-beat seen through this wire saw to take the photograph the photography operation of the image of aforementioned wire saw;
According to by the brightness of the image of the captured wire saw of photography operation, detect the profile of grasping abrasive particle, the detection operation that detects the distribution of aforementioned abrasive particle; And
Control the projected area control operation of the bed thickness of aforementioned abrasive particle according to the projected area of the detected aforementioned abrasive particle that comes of the detection of the wire saw by this detection operation.
7. the manufacture method of wire saw as claimed in claim 6 is characterized in that, the projected area that aforementioned projected area control operation forms this abrasive grain layer aforementioned abrasive particle with respect to the projected area of abrasive grain layer 20% or more than it 80% or below it.
8. as the manufacture method of claim 6 or 7 described wire saws, wherein, aforementioned detection operation is to detect the operation of abrasive particle spacing of the abrasive particle of aforementioned wire saw; And further comprise according to the abrasive particle spacing control operation of controlling aforementioned abrasive particle spacing by the abrasive particle spacing of the detected aforementioned abrasive particle of this detection operation.
9. the manufacture method of wire saw as claimed in claim 8 is characterized in that, aforementioned abrasive particle spacing control operation is controlled to be its standard deviation at 200 μ m or below it with aforementioned abrasive particle spacing.
10. as the manufacture method of any described wire saw in the claim 6 to 9, wherein, aforementioned detection operation is to detect the operation of the core shift amount of aforementioned wire saw; And further comprise according to the core shift amount control operation of controlling this core shift amount by the core shift amount of the detected aforementioned wire saw of this detection operation.
11. the manufacture method of wire saw as claimed in claim 10, it is characterized in that, aforementioned core shift amount control operation make for clipping aforementioned heart yearn shape for the abrasive grain layer of its both sides, the thickness of thin abrasive grain layer with respect to the ratio of the thickness of thick abrasive grain layer 0.6 or below it.
12. a wire saw manufacturing installation, while this device is to send the wire saw manufacturing installation that heart yearn is made wire saw continuously to, it comprises:
To around heart yearn via the adhesive material set of light transmission have the wire saw of abrasive particle side-irradiation light, utilize the photo-beat seen through this wire saw to take the photograph the camera of the image of aforementioned wire saw;
According to by the brightness of the image of the captured wire saw of camera, detect the profile of grasping abrasive particle, the checkout gear that detects the distribution of aforementioned abrasive particle; And
Control the projected area control device of the bed thickness of aforementioned abrasive particle according to the projected area of the detected aforementioned abrasive particle that comes of the detection of the wire saw by this checkout gear.
13. wire saw manufacturing installation as claimed in claim 12 is characterized in that, the projected area that aforementioned projected area control device forms this abrasive grain layer aforementioned abrasive particle with respect to the projected area of abrasive grain layer 20% or more than it 80% or below it.
14. as claim 12 or 13 described wire saw manufacturing installations, wherein, aforementioned checkout gear is the device of abrasive particle spacing that detects the abrasive particle of aforementioned wire saw; And further comprise according to the abrasive particle pitch control unit of controlling aforementioned abrasive particle spacing by the abrasive particle spacing of the detected aforementioned abrasive particle of this checkout gear.
15. wire saw manufacturing installation as claimed in claim 14 is characterized in that, aforementioned abrasive particle pitch control unit is controlled to be its standard deviation at 200 μ m or below it with aforementioned abrasive particle spacing.
16. as any described wire saw manufacturing installation in the claim 12 to 15, wherein aforementioned checkout gear is the device that detects the core shift amount of aforementioned wire saw; And further comprise according to the core shift amount control device of controlling this core shift amount by the core shift amount of the detected aforementioned wire saw of this checkout gear.
17. wire saw manufacturing installation as claimed in claim 16, it is characterized in that, aforementioned core shift amount control device, will clip aforementioned heart yearn and thickness that shape each abrasive grain layer in its both sides forms thin abrasive grain layer with respect to the ratio of the thickness of thick abrasive grain layer 0.6 or below it.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP310287/2003 | 2003-09-02 | ||
| JP2003310287A JP4236540B2 (en) | 2003-09-02 | 2003-09-02 | Wire saw |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1590056A true CN1590056A (en) | 2005-03-09 |
| CN1322968C CN1322968C (en) | 2007-06-27 |
Family
ID=34412201
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100738303A Expired - Fee Related CN1322968C (en) | 2003-09-02 | 2004-09-02 | Jigsaw |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP4236540B2 (en) |
| CN (1) | CN1322968C (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102317037A (en) * | 2008-12-18 | 2012-01-11 | 新日铁高新材料株式会社 | Saw wire and method of manufacturing saw wire |
| CN102458768A (en) * | 2009-06-05 | 2012-05-16 | 应用材料公司 | Method and apparatus for manufacturing an abrasive wire |
| CN101670544B (en) * | 2008-09-11 | 2014-04-02 | 小松Ntc株式会社 | Wire saw and workpiece machining method |
| CN104260216A (en) * | 2014-09-28 | 2015-01-07 | 长沙岱勒新材料科技股份有限公司 | Automatic centering device and automatic centering method for resin wire saw |
| CN107052452A (en) * | 2014-04-30 | 2017-08-18 | 硅电子股份公司 | The method for cutting out many particularly sections of uniform thickness simultaneously by workpiece |
| CN107921603A (en) * | 2015-08-31 | 2018-04-17 | 小松Ntc株式会社 | The driving method of wire saw and wire saw |
| CN112801973A (en) * | 2021-01-27 | 2021-05-14 | 山东大学 | Method for evaluating distribution uniformity of abrasive particles on surface of diamond wire saw |
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| CN102886569B (en) * | 2011-07-22 | 2014-10-29 | 浙江瑞翌新材料科技有限公司 | Pre-treatment method and pre-treatment system for core wire of diamond wire saw |
| JP6172053B2 (en) * | 2014-05-28 | 2017-08-02 | 信越半導体株式会社 | Fixed abrasive wire, wire saw and workpiece cutting method |
| WO2016146343A1 (en) | 2015-03-13 | 2016-09-22 | Nv Bekaert Sa | Method to produce a fixed abrasive saw wire with a metal alloy fixation layer and the wire resulting therefrom |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09323320A (en) * | 1996-06-07 | 1997-12-16 | Tokyo Seimitsu Co Ltd | Method and apparatus for measuring groove shape of grooved roller for wire saw |
| JPH09323319A (en) * | 1996-06-07 | 1997-12-16 | Tokyo Seimitsu Co Ltd | Method and apparatus for measuring groove shape of grooved roller for wire saw |
| JP2002036091A (en) * | 2000-05-15 | 2002-02-05 | Allied Material Corp | Super-abrasive grain wire saw and manufacturing method |
| JP3475942B2 (en) * | 2001-06-25 | 2003-12-10 | 住友電気工業株式会社 | Surface condition inspection equipment for wire saws |
| JP3976556B2 (en) * | 2001-11-30 | 2007-09-19 | Ｄｏｗａホールディングス株式会社 | Wire saw |
-
2003
- 2003-09-02 JP JP2003310287A patent/JP4236540B2/en not_active Expired - Fee Related
-
2004
- 2004-09-02 CN CNB2004100738303A patent/CN1322968C/en not_active Expired - Fee Related
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101670544B (en) * | 2008-09-11 | 2014-04-02 | 小松Ntc株式会社 | Wire saw and workpiece machining method |
| CN102317037A (en) * | 2008-12-18 | 2012-01-11 | 新日铁高新材料株式会社 | Saw wire and method of manufacturing saw wire |
| CN102317037B (en) * | 2008-12-18 | 2015-11-25 | 新日铁住金株式会社 | The manufacture method of sawline and sawline |
| CN102458768A (en) * | 2009-06-05 | 2012-05-16 | 应用材料公司 | Method and apparatus for manufacturing an abrasive wire |
| CN107052452A (en) * | 2014-04-30 | 2017-08-18 | 硅电子股份公司 | The method for cutting out many particularly sections of uniform thickness simultaneously by workpiece |
| CN107052452B (en) * | 2014-04-30 | 2019-10-15 | 硅电子股份公司 | It is cut into the method for many especially slices of uniform thickness simultaneously by workpiece |
| CN104260216A (en) * | 2014-09-28 | 2015-01-07 | 长沙岱勒新材料科技股份有限公司 | Automatic centering device and automatic centering method for resin wire saw |
| CN107921603A (en) * | 2015-08-31 | 2018-04-17 | 小松Ntc株式会社 | The driving method of wire saw and wire saw |
| CN107921603B (en) * | 2015-08-31 | 2019-05-31 | 小松Ntc株式会社 | The driving method of wire saw and wire saw |
| CN112801973A (en) * | 2021-01-27 | 2021-05-14 | 山东大学 | Method for evaluating distribution uniformity of abrasive particles on surface of diamond wire saw |
| CN112801973B (en) * | 2021-01-27 | 2022-06-14 | 山东大学 | Method for evaluating distribution uniformity of abrasive particles on surface of diamond wire saw |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005074599A (en) | 2005-03-24 |
| JP4236540B2 (en) | 2009-03-11 |
| CN1322968C (en) | 2007-06-27 |
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