CN1580636A - Toxic gas treatment device and method in vortex reaction chamber - Google Patents

Abstract

The present invention provides a vortex-type reaction chamber toxic gas treatment device and method, so that the gas entering the reaction chamber enters the reaction chamber in a tangential direction, so that the distribution of the velocity field generated by the device has the function of scrubbing the inner wall surface of the reactor and its subsequent channels, reducing the accumulation of small molecular solids generated by the toxic gas during the cracking process on the inner wall of the reactor, thereby extending the time required for regular cleaning of the reactor; in addition, in order to more effectively treat the small molecular solids scrubbed off the inner wall of the reaction chamber by the gas, the present invention further divides the subsequent water tank group into two major parts, namely the first water tank and the second water tank, according to the function, which can effectively take out all the small molecules suspended on the surface of the water in the water tank group.

Description

Toxic gas treatment device and method in vortex reaction chamber

technical field

The present invention relates to a toxic gas treatment device and method in a vortex reaction chamber, in particular to a method of washing the inner wall of the reactor, which can introduce gas into the reaction chamber without external force, so as to reduce the toxic gas in the cracking process The generated small molecular solids accumulate on the inner wall of the reactor, thereby prolonging the time for which the reactor needs to be cleaned regularly.

Background technique

All gases are one of the regulated greenhouse gases, among which SF ₆ , HFCs and PFCs are mainly man-made greenhouse gas components. Although HFCs and PFCs do not deplete the ozone layer, they are both potent greenhouse gases. Their high Global Warming Potential (GWP) is a thousand times higher than that of carbon dioxide, and they can stay in the atmosphere for a long time. Long lifetime, cumulative effect in the atmosphere is irreversible. In recent years, the semiconductor process (such as the cleaning process of dry etching chemical vapor deposition, etc.) has widely used CF ₄ , C ₂ F ₆ , C ₃ F ₈ , NF ₃ and other fluorides (Perfluorocompounds or PFCs) as process gases, and Only a small part of these gases is actually used in the manufacturing process, and most of the rest, such as: about 90% of the chemical vapor deposition process (Chemical Vapor Deposition; CVD) is discharged as waste gas, causing an important source of greenhouse effect. Since countries with developed semiconductor industries have a common understanding and agreement to formulate regulations to reduce PFCs gas emissions in the future, Taiwan's semiconductor industry will also be bound by this agreement. However, the use of perfluorinated compounds in the manufacturing technology of semiconductor equipment components is increasing day by day with the progress of semiconductor manufacturing processes. Therefore, it is necessary to control and treat them to avoid environmental hazards, and to adopt a new PFCs waste gas treatment system to cope with more stringent future conditions. Exhaust emission standards.

At present, the toxic gas waste gas treatment device, based on the design principle of pyrolysis and washing, has the best performance, and uses plasma method (plasma) for pyrolysis. As shown in Figure 1, it is characterized in that the waste gas is introduced into the reaction chamber to directly interact with the plasma, and then enters the reaction chamber for treatment, and a sprinkler group is installed at the outlet of the reaction chamber. After the waste gas is cooled by the sprinkler group, it is introduced into a wet The scrubber is discharged after treatment, and the circulating water of this wet scrubber is provided with a water tank for supply.

Its operation is as follows: the reactor 110 includes three parts: an exhaust gas inlet 111 , a plasma torch 112 , and a reaction chamber 113 , wherein the interior of the reaction chamber is constructed of refractory and heat-insulating materials. The extremely high-temperature beam generated by the plasma torch 112 and the toxic gas waste gas entering through the waste gas inlet 111 are instantly pyrolyzed, atomized or ionized in the reaction chamber 113 to form hydrogen (H ₂ ), Products of carbon monoxide (CO), carbon dioxide (CO ₂ ) and hydrogen fluoride (HF). Next, at the outlet of the reaction chamber 113 of the reactor 110, a water sprayer group 120 is set, so that the sprayed water mist absorbs heat to rapidly cool down the product and dissolve part of the hydrogen fluoride (HF) in the product. For the rest of the products that fall on the surface of the water tank, the water tank will discharge the waste water by means of bottom drainage. Because high temperature affects the solubility of the gas, after the product is spray cooled, impurities and solids are filtered through a filter 140, and then the waste gas is introduced into a wet scrubber 150 filled with high surface area fillers. When the toxic gas waste gas passes through this wet scrubber 150, the entrained solids, such as silicon-containing powder, etc., can be washed and filtered, and hydrogen fluoride is also absorbed here. Water mist can be added with lye to neutralize the acidity of hydrogen fluoride. However, according to the current situation, there is a wastewater treatment plant in the Science Park, and fluorine-containing wastewater can usually be treated by the wastewater treatment plant. Therefore, the water stored in the tank can be discharged in batches or continuously to the wastewater treatment plant. When the static pressure of the airflow provided by the waste gas source is insufficient, a windmill 160 can be installed at the rear end of the wet scrubber 150 to supplement the static pressure and discharge the designed air volume smoothly.

However, in the existing technology, in order to improve the efficiency of toxic gas waste gas treatment, harmful waste gas produced by semiconductor and other industrial processes, such as: C ₂ F ₆ , SiH ₄ , CF ₄ , NF ₃ , CHF ₃ , etc. are often simultaneously in the reactor Handle the reaction. Its reaction formula procedure is as follows:

The products of all waste gas reactions are gases, except that the _SiO2 solid produced after SiH cracking is easily adsorbed on the inner wall of the reactor. In order to maintain the performance of the reactor, the inner wall needs to be cleaned more frequently, so it has the effect of reducing the life of the equipment and increasing the cost of the enterprise. shortcoming.

Contents of the invention

The main purpose of the present invention is a device and method for treating toxic gas in a vortex reaction chamber. The gas can be introduced into the reaction chamber without external force, and the small molecules adsorbed on the inner wall of the reactor are scrubbed while the reaction is in progress. solid.

Another object of the present invention is a device and method for treating toxic gas in a vortex reaction chamber, which uses the force generated by the velocity field caused by the reacted gas to wash away the small molecular solids adsorbed on the inner wall surface.

Another object of the present invention is a toxic gas treatment device in a vortex reaction chamber. A connecting water pipe is provided between the first water tank and the second water tank to effectively take small molecules out of the first water tank.

Technical scheme of the present invention is:

A method for treating toxic gas in a vortex reaction chamber of the present invention is characterized in that it comprises:

(a) waste gas enters the reaction chamber through the torch, and the waste gas is instantly pyrolyzed in the reaction chamber to form waste gas products, and the waste gas products are composed of gaseous molecules and small solid molecules;

(b) Introduce gas from a reaction chamber gas inlet of the reaction chamber, and the force generated by the velocity field of the introduced gas scrubs the inner wall of the reaction chamber to remove the small solid molecules attached to the inner wall of the reaction chamber ;

(c) the gaseous molecules dissolve part of the hydrogen fluoride in the gaseous molecules through a water tank set and take away the solid small molecules floating on the water surface of the water tank set; and

(d) Wet scrubbers process the remaining said gaseous molecules and solid small molecules.

Wherein the reaction chamber includes an exhaust gas inlet, a torch, a reaction chamber, and an air inlet of the reaction chamber.

Wherein said torch is formed for one of plasma mode, electrothermal mode and gas mode.

The number of gas inlets in the reaction chamber can be plural.

Wherein the reaction chamber is perpendicular to the gas inlet of the reaction chamber, so that the gas enters the reaction chamber in a tangential direction.

Wherein said gas is an inert gas such as nitrogen.

Wherein the water tank group includes a water tank connected with the reaction chamber.

Wherein the water tank group includes first and second water tanks, and the positional relationship with the reaction chamber is the reaction chamber, the first water tank and the second water tank in sequence from top to bottom, wherein the first water tank and the The second sinks are connected by a connector.

The upper opening of the connector protrudes from the bottom of the connected upper tank, which is close to but lower than the normal water surface, and the lower end opening of the connector is inside the connected lower tank, which is used to take away the floating on the water surface in step (c). solid small molecules.

A method for treating toxic gas in a vortex reaction chamber of the present invention is characterized in that it comprises:

(a) waste gas is introduced into the reaction chamber through the waste gas inlet, and the waste gas product composed of gaseous molecules and solid small molecules is formed by cracking the waste gas by providing high heat from the torch, wherein the waste gas inlet is perpendicular to the reaction chamber;

(b) the gaseous molecules dissolve part of the hydrogen fluoride in the gaseous molecules through a water tank set and take away the small solid molecules floating on the water surface of the water tank set; and

(c) A wet scrubber treats the remainder of said off-gas product.

Wherein said reaction chamber includes exhaust gas inlet, a torch and a reaction chamber.

Wherein said torch is formed for one of plasma mode, electrothermal mode and gas mode.

Wherein the number of exhaust gas inlets may be plural.

Wherein the exhaust gas inlet is vertical to the reaction chamber, the force generated by the velocity field generated when the exhaust gas is introduced can wash the inner wall of the reaction chamber.

The water tank set includes a water tank connected with the reaction chamber.

Wherein said water tank group includes first and second water tanks, and the positional relationship with the reaction chamber, from top to bottom, is the reaction chamber, the first water tank and the second water tank, wherein the first water tank and the reaction chamber The second sinks are connected by a connector.

The connector mentioned therein has an upper opening protruding from the bottom of the connected upper tank, which is close to but lower than the normal water surface, and its lower end opening is inside the connected lower tank to take away the floating water in step (b). Solid small molecules described on the water surface.

A device for treating toxic gases in a vortex reaction chamber according to the present invention is characterized in that it comprises:

a reaction chamber;

A reaction chamber gas inlet, located on the reaction chamber and perpendicular to the reaction chamber, so that the gas enters the reaction chamber in a tangential direction;

A tank set, wherein the tank set is connected to the reaction chamber; and

A wet scrubber, wherein the tank group is connected to the wet scrubber;

The exhaust gas and the torch are directly mixed into the reaction chamber for reaction, and the foreign gas will be introduced into the gas inlet of the reaction chamber during the reaction to take away the reacted solid small molecules adsorbed on the inner wall of the reaction chamber; then, after the reaction Part of the product falls into the tank group and is discharged after being separated and precipitated, and the rest is introduced into the wet washing tower for treatment and then discharged.

The reaction chamber is composed of at least one exhaust gas inlet group and the torch.

Wherein the gas inlets of the reaction chamber may be plural.

Wherein said torch is formed for one of them in plasma mode, electric heating mode and gas mode.

The number of gas inlets in the reaction chamber can be plural.

Wherein the external gas is perpendicular to the reaction chamber, and the force generated by the velocity field generated when the gas is introduced can wash the inner wall of the reaction chamber.

Wherein said foreign gas is an inert gas such as nitrogen.

Wherein said water tank group includes first and second water tanks, and the positional relationship between it and the reaction chamber, from top to bottom, is the reaction chamber, the first water tank and the second water tank, wherein the first The water tank is connected with the second water tank by a connector.

A device for treating toxic gases in a vortex reaction chamber according to the present invention is characterized in that it comprises:

A reaction chamber, wherein a waste gas inlet is located on the reaction chamber and is perpendicular to the reaction chamber, so that the waste gas enters the reaction chamber in a tangential direction;

A tank set, wherein the tank set is connected to the reaction chamber; and

A wet scrubber, wherein the tank group is connected to the wet scrubber;

The exhaust gas is directly mixed with the exhaust gas inlet and the torch into the reaction chamber for reaction, and at the same time, it carries the solid small molecules adsorbed on the inner wall of the reaction chamber after reaction; then the reaction products fall into the water tank group and are separated and discharge after the precipitation process, and the rest is then introduced into the wet scrubber for treatment and then discharged.

The reaction chamber is composed of at least the waste gas inlet group and the torch.

Wherein the exhaust gas inlets may be plural.

The torch described therein is one of plasma mode, electric heating mode and gas mode.

Wherein the water tank group includes a water tank connected with the reaction chamber.

Wherein the water tank group includes first and second water tanks, and the positional relationship with the reaction chamber is, from top to bottom, the reaction chamber, the first water tank and the second water tank, wherein the first water tank It is connected with the second sink by a connector.

Description of drawings

In order to further illustrate the technical content of the present invention, the following detailed description is as follows in conjunction with the embodiments and accompanying drawings, wherein:

Fig. 1 is a prior art toxic gas waste gas treatment device.

Fig. 2 is the incineration treatment device of the toxic gas waste gas combustion furnace according to the embodiment of the present invention.

3A and B are the simulation diagrams of the velocity field in the front section of the upstream and downstream of the process exhaust port of the present invention.

Detailed ways

The present invention can be applied in the factory to process the waste gas of perfluorinated compounds (PFCs), introducing gas to form a vortex flow to clean the products that will adhere to the inner wall of the reaction chamber during the process of burning the perfluorinated compounds (PFCs).

Please refer to Fig. 2, which is the incineration treatment device of the toxic gas waste gas combustion furnace of the present invention. The same as the incineration treatment of general waste gas incinerators, the waste gas is firstly introduced and mixed with plasma directly, and then enters the reaction chamber for treatment. After the water unit cools down, it is introduced into a wet scrubber for treatment and then discharged, and the circulating water of this wet scrubber is supplied by a water tank. The difference is: the treatment device of the present invention introduces gas during the treatment process, and the force generated by the velocity field generated by the gas scrubs the small solid molecules adsorbed on the inner wall of the reactor. It works like this:

The plasma reactor 310 includes four parts: an exhaust gas inlet 311, a plasma torch 312, a reaction chamber 313, and a reaction chamber gas inlet 314. The interior of the reaction chamber is constructed of refractory and heat-insulating materials. Under heating, a high temperature environment can be formed. The toxic gas waste gas enters the reaction chamber 313 from the waste gas inlet 311, passes through the extremely high temperature (10,000°C) plasma beam of the plasma torch 312, and the toxic gas waste gas is instantly pyrolyzed, atomized or ionized in the reaction chamber 313, and its The chemical bonds are thus disintegrated and destroyed, forming some simple and easy-to-handle molecules or atoms such as hydrogen, carbon monoxide, carbon dioxide and hydrogen fluoride, and producing solid small molecules such as silicon dioxide and other silicon-containing powders that are easily adsorbed on the surface of the inner cavity.

In order to remove solid molecules on the surface of the inner chamber, the present invention makes more than one reaction chamber gas inlet 314 perpendicular to the chamber body in the reaction chamber 313 to introduce gas, so that the direction of the gas inlet enters the reaction chamber in a tangential direction, by which The force generated by the velocity field of the introduced gas scours the inner walls of the reactor and its subsequent channels. Because, during the process of burning exhaust gas, the reaction chamber 313 is in a negative pressure state. Therefore, gas can be introduced into the reaction chamber 313 from the reaction chamber gas inlet 314 without any external assistance, and the introduced gas is mainly an inert gas that does not participate in the reaction, such as nitrogen.

To achieve the purpose of removing solid small molecules in the reaction chamber, if the reaction chamber gas inlet 314 is not formed in the reaction chamber 313, a similar design can also be made at the waste gas inlet 311 for introducing waste gas. That is to say, the exhaust gas inlet 311 is designed to be perpendicular to the reaction chamber 313, so that the exhaust gas entering it will also have a force generated by the velocity field to wash the inner wall of the reactor and its subsequent passages. This embodiment also makes a simulation diagram of the velocity field related to the process equipment. Taking the four exhaust gas inlets as an example, the intake volume is 50 LPM, as shown in Figure 3A and B, which can prove that the introduced gas can indeed achieve the function of scrubbing the inner wall.

After the combustion reaction, the exhaust gas products fall into the first water tank 330, and a sprayer group 320 in it sprays water mist, so that the water absorbs heat to rapidly cool the product and dissolve part of the hydrogen fluoride (HF) in the exhaust gas product, but due to high temperature It affects the solubility of the product, so after the exhaust gas product is sprayed and cooled, it passes through the first water tank 330 and filters impurities and solids with a filter 340, and then the exhaust gas product is introduced into a wet scrubber 350 filled with high surface area fillers. When the waste gas product passes through this wet scrubber 350, the entrained solids, such as silicon-containing powder, etc., can be washed and filtered, and the gasified hydrogen is also absorbed here. When processing the gasified hydrogen product, The sprayed water mist can be added with lye to neutralize the acidity of gasified hydrogen.

Due to the influence of high temperature, the small solid molecules in the waste gas product fall and suspend on the water surface of the first water tank 330. It is difficult to take these small solid molecules out of the water tank by the traditional bottom drainage method, which will affect the absorption efficiency of the wet scrubber. Therefore, the solution composed of solid small molecules and water in the first water tank 330 protrudes through the opening to a connecting water pipe 332 close to the water surface of the upper water tank, and the small molecules on the water surface of the first water tank 330 are brought to the second water tank 331 by the water flow. Precipitate; in this way, after a proper time, the small molecules will settle to the bottom of the second water tank 331 , and at this time, all the small molecules can be effectively taken out through the drainage method at the bottom. The remaining undissolved waste gas products and their entrained solids, such as silicon-containing powder, are introduced into a wet scrubber 350 through a filter 340 to complete subsequent treatment actions, and finally the windmill 360 discharges the gas that meets environmental protection standards. When the static pressure of the airflow provided by the waste gas source is insufficient, a windmill 360 can be installed at the rear end of the wet scrubber 350 to supplement the static pressure and discharge the designed air volume smoothly.

In the embodiment of the present invention, plasma is used as an example for illustration, but the present invention can also be applied to other combustion methods such as: gas or electric heating methods. The use of gas or electric heating will also encounter the same problem in the combustion process, which can be solved by using the present invention.

The above descriptions are only preferred embodiments of the present invention, and should not be used to limit the scope of the present invention. All partial modifications made according to the content of the present invention, without violating the spirit of the present invention, should belong to the present invention range.

In addition, this invention has not been seen in any public places or publications before the application, so this case has the conditions for invention patents of "practicability, novelty and creativity", so the application for invention patent is filed according to law.

Claims (31)

1. A method for treating toxic gas in a vortex reaction chamber, characterized in that it comprises: (a) waste gas enters the reaction chamber through the torch, and the waste gas is instantly pyrolyzed in the reaction chamber to form waste gas products, and the waste gas products are composed of gaseous molecules and small solid molecules; (b) Introduce gas from a reaction chamber gas inlet of the reaction chamber, and the force generated by the velocity field of the introduced gas scrubs the inner wall of the reaction chamber to remove the small solid molecules attached to the inner wall of the reaction chamber ; (c) the gaseous molecules dissolve part of the hydrogen fluoride in the gaseous molecules through a water tank set and take away the solid small molecules floating on the water surface of the water tank set; and (d) Wet scrubbers process the remaining said gaseous molecules and solid small molecules. 2 . The method for treating toxic gas in a vortex reaction chamber according to claim 1 , wherein the reaction chamber comprises a waste gas inlet, a torch, a reaction chamber, and an air inlet of the reaction chamber. 3 . 3. The method for treating toxic gas in a vortex reaction chamber according to claim 1, wherein the torch is formed in one of a plasma method, an electric heating method and a gas method. 4. The method for treating toxic gas in a vortex reaction chamber according to claim 1, wherein the number of gas inlets in the reaction chamber can be plural. 5. The method for treating toxic gas in a vortex reaction chamber according to claim 1, wherein said reaction chamber is perpendicular to said reaction chamber gas inlet so that said gas enters said gas in a tangential direction. reaction chamber. 6. The method for treating toxic gas in a vortex reaction chamber according to claim 1, wherein the gas is an inert gas such as nitrogen. 7 . The method for treating toxic gas in a vortex reaction chamber according to claim 1 , wherein the set of water tanks comprises a water tank connected to the reaction chamber. 8 . 8. The method for treating toxic gas in a vortex reaction chamber as claimed in claim 1, wherein said water tank group includes first and second water tanks, and the positional relationship with the reaction chamber is from top to bottom. The sequence is the reaction chamber, the first water tank and the second water tank, wherein the first water tank and the second water tank are connected by a connector. 9. The method for treating toxic gas in a vortex reaction chamber according to claim 7, wherein the upper opening of the connector protrudes from the bottom of the connected upper water tank, which is close to but lower than the normal water level, and the lower opening of the connector is at the The inside of the lower tank connected to it is used to take away the small solid molecules floating on the water surface in the step (c). 10. A method for treating toxic gas in a vortex reaction chamber, characterized in that it comprises: (a) waste gas is introduced into the reaction chamber through the waste gas inlet, and the waste gas product composed of gaseous molecules and solid small molecules is formed by cracking the waste gas by providing high heat from the torch, wherein the waste gas inlet is perpendicular to the reaction chamber; (b) the gaseous molecules dissolve part of the hydrogen fluoride in the gaseous molecules through a water tank set and take away the small solid molecules floating on the water surface of the water tank set; and (c) A wet scrubber treats the remainder of said off-gas product. 11. The method for treating toxic gas in a vortex reaction chamber according to claim 10, wherein said reaction chamber comprises a waste gas inlet, a torch, and a reaction chamber. 12. The method for treating toxic gas in a vortex reaction chamber according to claim 10, wherein said torch is formed in one of plasma, electric heating and gas methods. 13. The method for treating toxic gas in a vortex reaction chamber according to claim 10, wherein the number of exhaust gas inlets can be plural. 14. The method for treating toxic gas in a vortex reaction chamber according to claim 10, wherein the waste gas inlet is vertical to the reaction chamber, and the force generated by the velocity field generated by introducing the waste gas can be washed away. The inner wall of the reaction chamber. 15. The method for treating toxic gas in a vortex reaction chamber according to claim 10, wherein said water tank group comprises a water tank connected to said reaction chamber. 16. The method for treating toxic gas in a vortex reaction chamber as claimed in claim 10, wherein said water tank group includes first and second water tanks, and the positional relationship with the reaction chamber is from top to bottom The sequence is the reaction chamber, the first water tank and the second water tank, wherein the first water tank and the second water tank are connected by a connector. 17. The method for treating toxic gas in a vortex-type reaction chamber according to claim 16, wherein the upper end opening of the connector protrudes from the bottom in the upper water tank connected to it, and is close to but lower than the normal water surface, and its lower end The opening is inside the connected sink to take away the small solid molecules floating on the water surface in step (b). 18. A device for treating toxic gases in a vortex reaction chamber, characterized in that it comprises: a reaction chamber; A reaction chamber gas inlet, located on the reaction chamber and perpendicular to the reaction chamber, so that the gas enters the reaction chamber in a tangential direction; A tank set, wherein the tank set is connected to the reaction chamber; and A wet scrubber, wherein the tank group is connected to the wet scrubber; The exhaust gas and the torch are directly mixed into the reaction chamber for reaction, and the foreign gas will be introduced into the gas inlet of the reaction chamber during the reaction to take away the reacted solid small molecules adsorbed on the inner wall of the reaction chamber; then, after the reaction Part of the product falls into the tank group and is discharged after being separated and precipitated, and the rest is introduced into the wet washing tower for treatment and then discharged. 19. The device for treating toxic gases in a vortex reaction chamber according to claim 18, wherein the reaction chamber comprises at least one waste gas inlet group and the torch. 20. The device for treating toxic gas in a vortex reaction chamber according to claim 18, wherein there may be multiple gas inlets in the reaction chamber. 21. The device for treating toxic gas in a vortex reaction chamber as claimed in claim 18, wherein said torch is formed in one of plasma, electric heating and gas methods. 22. The device for treating toxic gas in a vortex reaction chamber as claimed in claim 18, wherein the number of gas inlets in the reaction chamber can be plural. 23. The device for treating toxic gas in a vortex reaction chamber as claimed in claim 18, wherein the external gas is perpendicular to the reaction chamber, and the force generated by the velocity field generated when the gas is introduced into the gas The inner wall of the reaction chamber can be washed. 24. The method for treating toxic gas in a vortex reaction chamber according to claim 18, wherein said external gas is an inert gas such as nitrogen. 25. The method for treating toxic gas in a vortex reaction chamber as claimed in claim 18, wherein said water tank group includes first and second water tanks, wherein the positional relationship with said reaction chamber is as follows: The sequence from the bottom is the reaction chamber, the first water tank and the second water tank, wherein the first water tank and the second water tank are connected by a connector. 26. A device for treating toxic gases in a vortex reaction chamber, characterized in that it comprises: A reaction chamber, wherein a waste gas inlet is located on the reaction chamber and is perpendicular to the reaction chamber, so that the waste gas enters the reaction chamber in a tangential direction; A tank set, wherein the tank set is connected to the reaction chamber; and A wet scrubber, wherein the tank group is connected to the wet scrubber; The exhaust gas is directly mixed with the exhaust gas inlet and the torch into the reaction chamber for reaction, and at the same time, it carries the solid small molecules adsorbed on the inner wall of the reaction chamber after reaction; then the reaction products fall into the water tank group and are separated and discharge after the precipitation process, and the rest is then introduced into the wet scrubber for treatment and then discharged. 27. The device for treating toxic gases in a vortex reaction chamber as claimed in claim 26, wherein the reaction chamber is composed of at least the waste gas inlet group and the torch. 28. The device for treating toxic gas in a vortex reaction chamber as claimed in claim 26, wherein the waste gas inlets can be plural. 29. The device for treating toxic gas in a vortex reaction chamber as claimed in claim 28, wherein the torch is one of the plasma method, the electric heating method and the gas method. 30. The device for treating toxic gas in a vortex reaction chamber as claimed in claim 26, wherein the set of water tanks comprises a water tank connected to the reaction chamber. 31. The device for treating toxic gases in a vortex reaction chamber according to claim 26, wherein the tank group includes first and second tanks, and the positional relationship with the reaction chamber is from top to The bottom is the reaction chamber, the first water tank and the second water tank in sequence, wherein the first water tank and the second water tank are connected by a connector.

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