CN1580171A - Thermosetting rubber film for flexible circuit assembly and its preparing method - Google Patents
Thermosetting rubber film for flexible circuit assembly and its preparing method Download PDFInfo
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- CN1580171A CN1580171A CN 200310111842 CN200310111842A CN1580171A CN 1580171 A CN1580171 A CN 1580171A CN 200310111842 CN200310111842 CN 200310111842 CN 200310111842 A CN200310111842 A CN 200310111842A CN 1580171 A CN1580171 A CN 1580171A
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- epoxy
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- glued membrane
- thermofixation
- bisphenol
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- 229920001971 elastomer Polymers 0.000 title abstract description 7
- 239000005060 rubber Substances 0.000 title abstract description 7
- 238000000034 method Methods 0.000 title abstract 3
- 229920001187 thermosetting polymer Polymers 0.000 title 1
- 239000003292 glue Substances 0.000 claims abstract description 29
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 claims abstract description 19
- 229920000459 Nitrile rubber Polymers 0.000 claims abstract description 12
- 238000002360 preparation method Methods 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 10
- 239000002904 solvent Substances 0.000 claims abstract description 10
- 239000012528 membrane Substances 0.000 claims description 55
- 239000004593 Epoxy Substances 0.000 claims description 51
- 229920005989 resin Polymers 0.000 claims description 40
- 239000011347 resin Substances 0.000 claims description 40
- 238000009998 heat setting Methods 0.000 claims description 31
- 238000003756 stirring Methods 0.000 claims description 25
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 22
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 20
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 claims description 18
- 229920003986 novolac Polymers 0.000 claims description 13
- 239000000463 material Substances 0.000 claims description 11
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 10
- 150000001875 compounds Chemical class 0.000 claims description 10
- 229920006267 polyester film Polymers 0.000 claims description 9
- 239000007787 solid Substances 0.000 claims description 9
- 150000004982 aromatic amines Chemical class 0.000 claims description 8
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims description 7
- 150000002576 ketones Chemical class 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 6
- 239000011248 coating agent Substances 0.000 claims description 5
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 4
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims description 4
- 238000006243 chemical reaction Methods 0.000 claims description 4
- 125000003700 epoxy group Chemical group 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- LLEASVZEQBICSN-UHFFFAOYSA-N 2-undecyl-1h-imidazole Chemical compound CCCCCCCCCCCC1=NC=CN1 LLEASVZEQBICSN-UHFFFAOYSA-N 0.000 claims description 3
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 claims description 3
- 239000002775 capsule Substances 0.000 claims description 2
- 238000007731 hot pressing Methods 0.000 abstract description 11
- 125000003118 aryl group Chemical group 0.000 abstract description 2
- 229920000768 polyamine Polymers 0.000 abstract description 2
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 abstract 6
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 abstract 1
- 239000004568 cement Substances 0.000 abstract 1
- 238000010276 construction Methods 0.000 abstract 1
- 239000012745 toughening agent Substances 0.000 abstract 1
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- 239000010935 stainless steel Substances 0.000 description 9
- 238000001035 drying Methods 0.000 description 8
- 239000000758 substrate Substances 0.000 description 8
- 238000012360 testing method Methods 0.000 description 8
- 206010013786 Dry skin Diseases 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- 238000005303 weighing Methods 0.000 description 7
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- 239000004642 Polyimide Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- -1 acrylic acid lipid Chemical class 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- VQKFNUFAXTZWDK-UHFFFAOYSA-N alpha-methylfuran Natural products CC1=CC=CO1 VQKFNUFAXTZWDK-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 150000002460 imidazoles Chemical class 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000297 Rayon Polymers 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011152 fibreglass Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000007719 peel strength test Methods 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 1
Abstract
It is about hot set rubber film for flexibility circuit assemblage and its preparation methods. This -can be used in ---circuit construction. It is made from epoxy resin, butadiene acrylonitrile rubber toughening agent, fixing tanning agents of imidazole derivates and solvent by form them into liquid cement and application. The binding strength and tenacity can be advanced by the combination of epoxy resin. The curing speed in the high temperature can be improved by the complex fixing tanning agents of aromatic polyamines and imidazole derivates. The whole process can finish within decades of seconds in temperature of 180 degree. So it is propitious to snap couple flexible electric. Compared with the exiting technique, the invention can keep the film of rubber stable in normal temperature and can fast set in high temperature and hot pressing without excessive glue and uncover.
Description
Technical field
The present invention relates to the preparation of polymer viscose glue agent, relate in particular to the preparation that flexible circuit assembles used thermofixation glued membrane.
Background technology
Because current electronic industrial products develops towards small-sized, lightening direction, the use of flexible circuit more and more widely thereby guarantees that flexible circuit is extremely important with the reliability that other components and parts are connected.When being connected with the components and parts of other flexibility or rigidity, the polyimide flexible circuit must use the thermofixation glued membrane, promptly this tunic is sticked between flexible circuit and other base material, fast setting under hot pressing, cured article has high-adhesive-strength, good heat endurance, chemical resistant properties and electrical property to materials such as Kapton face, copper-clad surface, stainless steel and FR-4 Resins, epoxy.As commodity selling, as the PyraluxLF glued membrane of du pont company, the R/Flex1500 of U.S. Luo Jieshi (Rogers) company assembles glued membrane, and the D3410 glued membrane of Sony corporation of Japan all belongs to this class and assembles special-purpose thermofixation glued membrane.
The material of glued membrane has multiple, and is wherein general with Resins, epoxy and acrylic acid lipid.Resins, epoxy particularly, because it has advantages of good caking property and thermotolerance, electrical property is good, it is the first-selected resin material of thermofixation glued membrane, this is wherein the most frequently used with bisphenol A epoxide resin again, because the molecular weight of this based epoxy resin can in very large range change the softening temperature difference, liquid and solid form are arranged, be fit to make glued membrane.Bromated Resins, epoxy often uses in the preparation of fire-retardant glued membrane.And in order to improve thermotolerance, as Japanese Patent JP 11012545, JP 2001-344418 is disclosed, also often uses adjacent sylvan formaldehyde epoxy resin.
In order to give the glued membrane flexibility, need to add toughner, adopt rubber usually, as Japanese Patent JP 04328183, JP04197746, JP 2001-348418, JP 2000-273415, JP2002-088338 and Korean Patent KR 2000-051521 are disclosed; Perhaps as Japanese Patent JP-11012545, JP 2002-268128, JP 2001-329241, JP 2002-220576 and European patent EP 1167483 are disclosed, adopt acrylic acid fat rubber; Also just like Japanese Patent JP 11012545, JP2000-154360 is disclosed, adopts phenoxy resin.
The key component of epoxy resin-matrix thermofixation glued membrane is a latent curing agent, glued membrane is stable under the requirement normal temperature, high temperature is the energy fast setting down, as Japanese Patent JP 2000-017148, JP 2000-273415 and Korean Patent KR 2000-051521 are disclosed, usually adopt diaminodiphenylsulfone(DDS) (DDS) or diaminodiphenylmethane aromatic amines such as (DDM), this class solidifying agent can react with Resins, epoxy when filming, and forms the B stage epoxy resin.Another kind of latent curing agent is an imdazole derivatives, as Japanese Patent JP 10298508, JP 2000-154360, JP 2000-154361, JP 2002-268128, JP 6307143 and JP 01121385 are disclosed, 2-ethyl-4 Methylimidazole, 2-phenyl-4-methyl-5 hydroxy methylimidazole and C11Z long-chain imidazoles.
The existing thermofixation glued membrane that is used for the flexible circuit assembling still can not satisfy well at room temperature stable, the elevated temperature heat of glued membrane are depressed fast setting, excessive glue and the high composite request of stripping strength.
Summary of the invention
The technical problem to be solved in the present invention is to avoid above-mentioned the deficiencies in the prior art part, depresses fast setting, overflow glue and the high thermofixation glued membrane of stripping strength and propose a kind of at room temperature stable, elevated temperature heat.
The technical scheme that the present invention solve the technical problem employing is, prepare a kind of thermofixation glued membrane that is used for the flexible circuit assembling, it is to form glue by Resins, epoxy, nitrile rubber toughner, aromatic amine curing agent, imdazole derivatives solidifying agent and ketones solvent to obtain through coating.Combination by multiple Resins, epoxy improves cohesive strength toughness, by aromatic polyamine and imdazole derivatives composite curing agent, improve high temperature curing speed down, but under 180 ℃ of temperature condition completely solidified in tens seconds, be suitable for flexible circuit assembling connection fast.
The Resins, epoxy that the present invention uses adopts the mixture of multiple Resins, epoxy, as E-44, E-51 liquid bisphenol A epoxide resin, E-20, E-42 solid bisphenol A epoxy resin, EX-46, EX-20D brominated bisphenol A Resins, epoxy, F-44, F-51 novolac epoxy resin, the adjacent sylvan formaldehyde epoxy resin of ECN etc.Wherein, liquid epoxies is given glued membrane high cohesive strength, and viscosity and excessive glue phenomenon that solid epoxy can reduce glued membrane take place, and brominated epoxy resin can improve the flame retardant properties of glued membrane, and novolac epoxy then can improve the resistance toheat of glued membrane.
The toughner that the present invention uses adopts nitrile rubber, as fourth fine-40,1072 carboxyl nitrile rubbers, and the existence of carboxyl can improve cohesive strength in the carboxyl nitrile rubber, help mixing satisfied toughness, flexible requirement to glued membrane by continuous interpolation oxidation inhibitor, vulcanizing agent, promotor and the stablizer practiced of rubber.
The solidifying agent that the present invention uses adopts compound latent curing agent aromatic amine to do main composition, as diaminodiphenylmethane (DDA), diaminodiphenylsulfone(DDS) (DDM), reaction is cured to a certain degree in the coating process to be implemented in, another composition is an imdazole derivatives, as 2,4 diamino-6-[2-undecyl imidazole base]-ethyl-cis triazine (C11Z-AZINE), and the HX3748 or the little encapsulate capsule of the HX3748 imdazole derivatives of producing by the company of Japanese Asahi Chemical Industry that the reaction of imidazoles and cis triazine obtains.
The solvent of preparation glue is can fully dissolve all components, and boiling point can not be too high, and in coating drying tunnel dissolving volatilization easily, toxicity is low, so the present invention uses butanone or acetone.
Formulate basic recipe in sum, by weight as follows:
30 parts of liquid bisphenol A epoxide resins;
20 parts of solid bisphenol A epoxy resin;
20 parts of brominated bisphenol A Resins, epoxy;
30 parts of novolac epoxys;
Nitrile rubber toughner 50-100 part;
Aromatic amine curing agent 7-15 part;
Imdazole derivatives solidifying agent 2-8 part;
All the other are mixed with 35-45% solution for ketones solvent.
Glued membrane preparation technology of the present invention comprises the preparation of glue and the coating of glue, at first nitrile rubber is joined to stir in the reaction kettle and add solvent down, temperature is controlled at 40-50 ℃, adding various Resins, epoxy again continues to stir, after treating all resins dissolving, add DDM or DDS, amine curing agent stirred 1-2 hour under this temperature, added at room temperature to place 10-24 hour after the imdazole derivatives solidifying agent stirs again.Coating is that the glue for preparing is coated onto on the separate-type paper, and oven dry is 6-10 minute under 80-90 ℃ of temperature condition, and the compound polyester film of going up obtains the thick thermofixation glued membrane of 30-40 μ m that is.Performance test is: glued membrane is put between Kapton and stainless steel substrates or the Copper Foil, 160-180 ℃ of temperature, under the 3-5Mpa pressure condition, hot pressing 30-80 second, the specimen that obtains, carry out peel strength test by the GB/T13557 standard, carry out anti-soldering performance test by the IPC-TM-650-2B standard.
Compare with prior art, the thermofixation glued membrane that the present invention is used for flexible circuit assembling can satisfy well depresses fast setting, excessive glue and the high composite request of stripping strength at room temperature stable, the elevated temperature heat of glued membrane.
Embodiment
The present invention is used for thermofixation glued membrane of flexible circuit assembling and preparation method thereof and is described in detail by following examples.
Embodiment 1
Take by weighing the fine 80g of 1702 carboxyl fourths, add butanone 288g, under 40-60 ℃ of stirring, dissolve, add E-44 Resins, epoxy 30g then successively, F-44 novolac epoxy 30g, E-20 Resins, epoxy 20g, EX-46 brominated epoxy resin 20g, stirring and dissolving under same temperature, add diaminodiphenylsulfone(DDS) 8g then, stirring and dissolving adds imdazole derivatives HX3748 2g again, at room temperature places after the dissolving to obtain glue in 12 hours, and glue is applied on the separate-type paper, 80 ℃ of dryings 7 minutes, the compound polyester film of going up obtains the thermofixation glued membrane, and thickness is 35 μ m.
Glued membrane is put between the materials such as polyimide, stainless steel substrates, the copper-clad plate of FR-4 woven fiber glass reinforced epoxy, hot pressing obtained sample in 5 seconds under 180 ℃, 4Mpa pressure, after testing: its stripping strength 1.2kg/cm2,288 ℃ of solder temperature resistances.
Embodiment 2
Take by weighing fine-40 50g of fourth, add butanone 288g, under 40-60 ℃ of stirring, dissolve, add E-44 then successively, Resins, epoxy 30g, F-44 novolac epoxy 30g, E-20 Resins, epoxy 20g, EX-46 brominated epoxy resin 20g, stirring and dissolving under same temperature adds diaminodiphenylsulfone(DDS) 15g then, and stirring and dissolving adds imdazole derivatives HX3748 8g again, at room temperature place after the dissolving and obtained glue in 12 hours, glue is applied on the separate-type paper 80 ℃ of dryings 7 minutes, the compound polyester film of going up, obtain the thermofixation glued membrane, thickness 35 μ m.
Glued membrane is put between the materials such as polyimide, stainless steel substrates, FR-4, hot pressing obtained sample in 5 seconds under 180 ℃, 4Mpa pressure, after testing: its stripping strength 1.0kg/cm
2, 280 ℃ of solder temperature resistances.
Embodiment 3
Take by weighing the fine 100g of 1702 carboxyl fourths, add butanone 288g, under 40-60 ℃ of stirring, dissolve, add E-44 then successively, Resins, epoxy 30g, F-44 novolac epoxy 30g, E-20 Resins, epoxy 20g, EX-46 brominated epoxy resin 20g, stirring and dissolving under same temperature adds diaminodiphenylsulfone(DDS) 8g then, stirring and dissolving adds imdazole derivatives 2 again, 4 diamino-6-[2-undecyl imidazole]-2 bases-cis triazine 4g, at room temperature place after the dissolving and obtained glue in 12 hours, glue is applied on the separate-type paper, 80 ℃ of dryings 7 minutes, the compound polyester film of going up obtains the thermofixation glued membrane, thickness 35 μ m.
Glued membrane is put between the materials such as polyimide, stainless steel substrates, FR-4, hot pressing obtained sample in 5 seconds under 180 ℃, 4Mpa pressure, after testing: its stripping strength 1.1kg/cm
2, 280 ℃ of solder temperature resistances.
Comparative example 4
Take by weighing the fine 80g of 1702 carboxyl fourths, add butanone 288g, under 40-60 ℃ of stirring, dissolve, add E-44 then successively, Resins, epoxy 30g, F-44 novolac epoxy 30g, E-20 Resins, epoxy 20g, EX-46 brominated epoxy resin 20g, stirring and dissolving under same temperature adds diaminodiphenylsulfone(DDS) 9.2g then, and stirring and dissolving adds imdazole derivatives HX3748 4g again, at room temperature place after the dissolving and obtained glue in 12 hours, glue is applied on the separate-type paper 80 ℃ of dryings 7 minutes, the compound polyester film of going up, obtain the thermofixation glued membrane, thickness 35 μ m.
Glued membrane is put between the materials such as polyimide, stainless steel substrates, FR-4, hot pressing obtained sample in 5 seconds under 180 ℃, 4Mpa pressure, after testing: its stripping strength 1.0kg/cm
2, 280 ℃ of solder temperature resistances.
Embodiment 5
Take by weighing the fine 80g of 1702 carboxyl fourths, add butanone 288g, under 40-60 ℃ of stirring, dissolve, add E-44 then successively, Resins, epoxy 30g, F-44 novolac epoxy 30g, E-20 Resins, epoxy 20g, EX-46 brominated epoxy resin 20g, stirring and dissolving under same temperature adds diaminodiphenylmethane 12g then, and stirring and dissolving adds imdazole derivatives HX3748 2g again, at room temperature place after the dissolving and obtained glue in 12 hours, glue is applied on the separate-type paper 80 ℃ of dryings 7 minutes, the compound polyester film of going up, obtain the thermofixation glued membrane, thickness 35 μ m.
Glued membrane is put between the materials such as polyimide, stainless steel substrates, FR-4, hot pressing obtained sample in 5 seconds under 180 ℃, 4Mpa pressure, after testing: its stripping strength 1.1kg/cm
2, 280 ℃ of solder temperature resistances.
Embodiment 6
Take by weighing the fine 80g of 1702 carboxyl fourths, add butanone 288g, after dissolving under the 40-60 ℃ of stirring, E-20 Resins, epoxy 20g successively, EX-46 brominated epoxy resin 20g, E-44 Resins, epoxy 60g is in same temperature dissolving, add diaminodiphenylsulfone(DDS) 8g then, at room temperature placed after the stirring and dissolving 12 hours, and obtained glue glue is applied on the separate-type paper, 7 minutes compound polyester films of going up of 80 ℃ of dryings, obtain the thermofixation glued membrane, thickness 35 μ m.
Glued membrane is put into polyimide film, stainless steel substrates, between the materials such as FR-4 between, at 180 ℃, hot pressing obtained sample in 5 seconds under the 4Mpa pressure, after testing: its stripping strength 1.2kg/cm
2, 260 ℃ in anti-scolding tin, not stratified non-foaming.
Compare enforcement according to example case, contrast as follows:
Comparative examples A
Take by weighing the fine 80g of 1702 carboxyl fourths, add butanone 288g, adding E-44 Resins, epoxy 30g successively, F-44 novolac epoxy 30g, E-20 Resins, epoxy 20g after the dissolving under the 40-60 ℃ of stirring, EX-46 brominated epoxy resin 20g, in same temperature stirring and dissolving, add diaminodiphenylsulfone(DDS) 8g then, stirring and dissolving, at room temperature placed after the dissolving 12 hours, and obtained glue glue is applied on the separate-type paper.7 minutes compound polyester films of going up of 80 ℃ of dryings obtain the thermofixation glued membrane, thickness 35 μ m.
Glued membrane is put into Kapton, and between the stainless steel substrates FR-4, under 180 ℃, 4Mpa pressure, hot pressing obtained sample in 5 seconds, after testing: its stripping strength 0.3kg/cm
2, solder temperature resistance is lower than 260 ℃.Obtained its stripping strength 0.8kg/cm in 10 minutes through hot pressing as sample
2
Comparative example 1 and Comparative examples A
The prescription of two kinds of situations is basic identical, and difference only is: be added with imdazole derivatives HX3748 among the embodiment 1, and do not have in the Comparative examples A, by last sample test, the effect of improvement is remarkable.
Claims (10)
1. thermofixation glued membrane that is used for flexible circuit assembling is characterized in that: this thermofixation glued membrane is to be mixed with glue by Resins, epoxy, nitrile rubber toughner, aromatic amine curing agent, imdazole derivatives solidifying agent and ketones solvent to be coated with and to obtain.
2. thermofixation glued membrane as claimed in claim 1 is characterized in that: described Resins, epoxy is by the liquid bisphenol A epoxide resin, solid bisphenol A epoxy resin, and brominated bisphenol A Resins, epoxy and novolac epoxy mix to be formed.
3. thermofixation glued membrane as claimed in claim 2, it is characterized in that: described liquid bisphenol A epoxide resin comprises E-44 and E-51 Resins, epoxy, described solid bisphenol A epoxy resin comprises E-20 Resins, epoxy, described brominated bisphenol A Resins, epoxy comprises EX-48 Resins, epoxy, and described novolac epoxy comprises F-51 and F-44 Resins, epoxy.
4. thermofixation glued membrane as claimed in claim 1 is characterized in that: described nitrile rubber toughner comprises that fourth fine-40 and 1702 carboxyl fourths are fine.
5. thermofixation glued membrane as claimed in claim 1 is characterized in that: described aromatic amine curing agent comprises diaminodiphenylsulfone(DDS) and diaminodiphenylmethane.
6. thermofixation glued membrane as claimed in claim 1 is characterized in that: described imdazole derivatives solidifying agent comprises HX3748, HX3941 little encapsulate capsule imdazole derivatives and 2,4 diamino-6-[2-undecyl imidazole base]-2 bases-cis triazine.
7. thermofixation glued membrane as claimed in claim 1 is characterized in that: described ketones solvent comprises butanone and acetone.
8. as thermofixation glued membrane as described in arbitrary in the claim 1 to 7, it is characterized in that: each component is by weight:
30 parts of liquid bisphenol A epoxide resins;
20 parts of solid bisphenol A epoxy resin;
20 parts of brominated bisphenol A Resins, epoxy;
30 parts of novolac epoxys;
Nitrile rubber toughner 50-100 part;
Aromatic amine curing agent 7-15 part;
Imdazole derivatives solidifying agent 2-8 part;
All the other are mixed with 35-45% solution for ketones solvent.
9. be used for the preparation method of the thermofixation glued membrane of flexible circuit assembling according to claim 1, it is characterized in that, comprising:
Step 1: the preparation of glue
Nitrile rubber toughner is joined reaction to be stirred in the kettle, add ketones solvent simultaneously, temperature is controlled at 40-50 ℃, adding liquid bisphenol A epoxide resin, solid bisphenol A epoxy resin, brominated bisphenol A Resins, epoxy and novolac epoxy again continues to stir, after treating all resins dissolving, add aromatic amine curing agent, under this temperature, stirred 1-2 hour, add again and at room temperature placed 10-24 hour after the imdazole derivatives solidifying agent stirs;
Step 2: the coating of glue
The glue for preparing is applied on the separate-type paper, and oven dry is 6-10 minute under 80-90 ℃ of temperature condition, and the compound polyester film of going up obtains the thick thermofixation glued membrane of 30-40 μ m that is.
10. the preparation method of thermofixation glued membrane as claimed in claim 9 is characterized in that: the various materials of using in the described step 1 are by weight:
30 parts of liquid bisphenol A epoxide resins;
20 parts of solid bisphenol A epoxy resin;
20 parts of brominated bisphenol A Resins, epoxy;
30 parts of novolac epoxys;
Nitrile rubber toughner 50-100 part;
Aromatic amine curing agent 7-15 part;
Imdazole derivatives solidifying agent 2-8 part;
All the other are mixed with 35-45% solution for ketones solvent.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310111842 CN1244661C (en) | 2003-10-17 | 2003-10-17 | Thermosetting rubber film for flexible circuit assembly and its preparing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200310111842 CN1244661C (en) | 2003-10-17 | 2003-10-17 | Thermosetting rubber film for flexible circuit assembly and its preparing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1580171A true CN1580171A (en) | 2005-02-16 |
| CN1244661C CN1244661C (en) | 2006-03-08 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200310111842 Expired - Fee Related CN1244661C (en) | 2003-10-17 | 2003-10-17 | Thermosetting rubber film for flexible circuit assembly and its preparing method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102417804A (en) * | 2010-09-28 | 2012-04-18 | 比亚迪股份有限公司 | Adhesive, its preparation method and application method |
| CN106398654A (en) * | 2016-08-30 | 2017-02-15 | 广东永创鑫电子有限公司 | Heat conduction material for LED (light-emitting diode) flexible circuit board and preparation method of heat conduction material |
| CN107474750A (en) * | 2017-07-28 | 2017-12-15 | 宁波启合新材料科技有限公司 | A kind of glued membrane and its manufacture method |
| CN109852308A (en) * | 2018-12-24 | 2019-06-07 | 惠州市杜科新材料有限公司 | A kind of fire resistant epoxy glue film and preparation method thereof |
| CN110194941A (en) * | 2019-05-29 | 2019-09-03 | 厦门艾贝森电子有限公司 | A kind of dimensionally stable resting form heating curable epoxy jelly membrane and preparation method |
| CN112300739A (en) * | 2020-11-03 | 2021-02-02 | 西安西电电工材料有限责任公司 | Adhesive for diamond-lattice adhesive-dispensing insulating paper and preparation method thereof |
-
2003
- 2003-10-17 CN CN 200310111842 patent/CN1244661C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102417804A (en) * | 2010-09-28 | 2012-04-18 | 比亚迪股份有限公司 | Adhesive, its preparation method and application method |
| CN102417804B (en) * | 2010-09-28 | 2013-12-18 | 比亚迪股份有限公司 | Adhesive, its preparation method and application method |
| CN106398654A (en) * | 2016-08-30 | 2017-02-15 | 广东永创鑫电子有限公司 | Heat conduction material for LED (light-emitting diode) flexible circuit board and preparation method of heat conduction material |
| CN107474750A (en) * | 2017-07-28 | 2017-12-15 | 宁波启合新材料科技有限公司 | A kind of glued membrane and its manufacture method |
| CN109852308A (en) * | 2018-12-24 | 2019-06-07 | 惠州市杜科新材料有限公司 | A kind of fire resistant epoxy glue film and preparation method thereof |
| CN110194941A (en) * | 2019-05-29 | 2019-09-03 | 厦门艾贝森电子有限公司 | A kind of dimensionally stable resting form heating curable epoxy jelly membrane and preparation method |
| CN112300739A (en) * | 2020-11-03 | 2021-02-02 | 西安西电电工材料有限责任公司 | Adhesive for diamond-lattice adhesive-dispensing insulating paper and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN1244661C (en) | 2006-03-08 |
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