CN1573381A - Coupling structure for optical waveguide and optical device and optical alignment method by using the same - Google Patents
Coupling structure for optical waveguide and optical device and optical alignment method by using the same Download PDFInfo
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- CN1573381A CN1573381A CNA2003101223348A CN200310122334A CN1573381A CN 1573381 A CN1573381 A CN 1573381A CN A2003101223348 A CNA2003101223348 A CN A2003101223348A CN 200310122334 A CN200310122334 A CN 200310122334A CN 1573381 A CN1573381 A CN 1573381A
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- optical
- substrate
- waveguide
- optical waveguide
- coupled structure
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/12007—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind forming wavelength selective elements, e.g. multiplexer, demultiplexer
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/28—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals
- G02B6/293—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means
- G02B6/29346—Optical coupling means having data bus means, i.e. plural waveguides interconnected and providing an inherently bidirectional system by mixing and splitting signals with wavelength selective means operating by wave or beam interference
- G02B6/29361—Interference filters, e.g. multilayer coatings, thin film filters, dichroic splitters or mirrors based on multilayers, WDM filters
- G02B6/29368—Light guide comprising the filter, e.g. filter deposited on a fibre end
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
- G02B6/4221—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
- G02B6/4224—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera using visual alignment markings, e.g. index methods
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4246—Bidirectionally operating package structures
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4238—Soldering
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Light Receiving Elements (AREA)
Abstract
A coupling structure for coupling an optical waveguide and an optical device is provided. The coupling structure enables to precisely align the optical waveguide and the optical device so that an optical-alignment error can be reduced within a range of a few mum. The coupling structure includes a first substrate, at least one optical waveguide formed on the first substrate to transmit an optical signal, optical alignment dummy waveguides symmetrically aligned on the first substrate about the optical waveguide, a second substrate bonded to the first substrate, at least one optical device mounted on a bottom surface of the second substrate and optically connected to the optical waveguide, and optical-alignment patterns formed at the bottom surface of the second substrate corresponding to the optical alignment dummy waveguides, wherein an optical alignment for the optical waveguide and the optical device is achieved by aligning the optical alignment dummy waveguides with the optical-alignment patterns.
Description
Technical field
The present invention relates to the optical coupled between optical transport medium and the optical device.More particularly, the present invention relates to a kind of coupled structure and by utilizing the upside-down method of hull-section construction bonding process that described optical device is bonded on the substrate so that described optical device accurately centering to optical correction's method of planar lightwave circuit.
Background technology
Because recently for the demand of the data communication that in Internet, includes the Voice ﹠ Video signal, replaced by optical communication system based on traditional communication system of electric signal.
Described optical communication comprises and converts the electrical signal to luminous energy, then luminous energy is stored into electric signal.For this reason, it need use optical launcher, optical delivery to be situated between and optical receiver.PLC (planar lightwave circuit) device mainly is used as optical transport medium.LD (laser diode) or VCSEL (Vcsel) mainly are used as optical launcher.Semiconductor optical device, for example PD (photodiode) mainly is used as the optics receptacle.
The upside-down method of hull-section construction bonding technology is normally used for making the electronic circuit that needs small size and high-speed cruising.Utilize described upside-down method of hull-section construction bonding technology, the volume of made electronic circuit can be reduced to about 1/10 of traditional ceramic encapsulated ic volume.In addition, the design aspect of described electronic circuit can be simplified and the length of electric connection line can be shortened.Therefore, it is for realizing that high-speed cruising is favourable.
When making optical launcher and optical receiver, the optical device that includes described LD, VCSEL and PD is directly coupled on the described substrate so that described optical device can be connected on the optical fiber optically.In addition, by adopting a kind of bonding technology that is similar to described upside-down method of hull-section construction bonding technology, described PLC can be arranged on the described substrate.When making optical transport medium, optical launcher and the mutual optical coupled of optics receptacle, must think over coupling efficiency, because coupling efficiency obtains the principal element of the ideal performance of described optical transport medium, optical launcher and optics receptacle often.Therefore, be starved of accurate optical correction.
Figure 1A to 1D shows a kind of traditional VCSEL and the view of the calibration steps between the PLC.
Shown in Figure 1A, V-shaped groove 3 is formed on the substrate 2 that is connecting VCSEL1.Then, the projection 5 corresponding to V-shaped groove 3 is formed on the pick device 4 that is used to pick up described substrate 2.Pick device 4 picks up described substrate 2 in a kind of feasible protruding 5 modes (with reference to Figure 1B) that are positioned in the described V-shaped groove 3, thereby VCSEL1 and V-shaped groove 3 is remained on the preposition along the direction of arrow.The described substrate 2 that is picked up by described pick device 4, by being installed in the guide finger 6 on the pick device 4, be inserted in the pilot hole 8 that is formed among shell or the OSA7 (as the optical sub-assembly 7 as shown among Fig. 1 C), so that described substrate 2 can be installed on the predetermined portions of described OSA7.
Fig. 2 A and 2B are the views of the traditional calibration steps of demonstration another kind.Fig. 2 A has shown the guide finger 14 that is formed at structural pilot hole 12 of an OSA (optical sub-assembly) and chip assembly unit 13, and they align by a kind of passive alignment method.Fig. 2 B is the front view of the chip assembly unit 13 that shows among Fig. 2 A.Drawing reference numeral 15 and 16 is represented PLC and metal ferrules respectively.
Yet, carry out above traditional calibration and have following shortcoming:
At first, described pick device is big and need complicated structure, also need be corresponding to many pick devices of substrate kind.Secondly, because described V-shaped groove is formed on the upper surface of described substrate, the size or the erection space that are formed at described on-chip pattern are reduced, the feasible size that is difficult to reduce described substrate.In addition, described guide finger and pilot hole must be respectively formed among described substrate and described shell or the described OSA, so that described substrate is installed among described shell or the described OSA.Similarly, described pilot hole need be precisely defined among described shell or the described OSA, this has further strengthened the size of described shell or described OSA.For this reason, although traditional method can be by utilizing described guide finger to pick up to be formed with the described substrate of V-shaped groove, described substrate is installed on described shell or the described OSA complex structure of described pick device, substrate, shell and OSA and big undesirably.In addition, according to classic method, therefore the output power band of transceiver, is difficult to regulate as required transport property owing to the mechanically actuated error has been increased.In addition, because the level of the light that receives is not constant, be difficult to regulate the sensitivity of described running gear in light detecting device.At last, in order to reduce the mechanically actuated mistake in main element, manufacturing cost can increase, the result, and the price competitiveness of product has been subjected to infringement.
Summary of the invention
Correspondingly, the present invention is intended to the advantage that addresses the above problem and provide additional, and it provides a kind of coupled structure that is used for optical waveguide and optical device and a kind of described optical waveguide and described optical device accurately calibrated so that its calibration error reaches the optical correction's method within several microns.
In one embodiment, it provides a kind of and is used for the coupled structure of optical waveguide and optical device and comprises: first substrate; At least one is formed on described first substrate optical waveguide with the transmission optics signal; On first substrate with respect to the illusory waveguide of the optical correction of described optical waveguide symmetric offset spread (optical alignment dummy waveguides); Be bonded in described first on-chip second substrate; At least one optical device, it is installed on the bottom surface of described second substrate, so that described optical device is connected in the described optical waveguide optically; And be formed on the described bottom surface of described second substrate corresponding to the illusory waveguide of described optical correction optical correction's pattern, the optical correction that wherein is used for described optical waveguide and described optical device is by calibrating the illusory waveguide of described optical correction and described optical correction pattern is realized.
Preferred implementation according to the present invention, the front of described second substrate is glued on the upper surface of described first substrate.The action face of described optical device is facing to the described bottom surface of described second substrate, and metal gasket is set on the edge of described action face of described optical device.
Preferred implementation according to the present invention, a kind of WDM light filter is configured on the front of described second substrate described action face corresponding to described optical device, so that transmit selectively or be reflected into the light with predetermined wavelength that is mapped in the described optical device or launches from described optical device.
In another embodiment, it provides a kind of optical correction's method that is used for the optical coupled between optical waveguide and the optical device.Said method comprising the steps of: on substrate, form the illusory waveguide of optical correction symmetrically with respect to described optical waveguide; Form optical correction's pattern symmetrically with respect to described optical waveguide being formed with on the substrate of optical device; And calibrate the illusory waveguide of described optical correction and optical correction's pattern, thereby realize the optical correction between described optical waveguide and the described optical device.
Description of drawings
By below in conjunction with the detailed description that accompanying drawing carried out, above characteristic of the present invention and advantage will become and understand and easy to understand more, wherein:
Figure 1A to 1D is the view that shows the example of a kind of conventional calibration structure that is used for PLC and VCSEL;
Fig. 2 A and 2B are the views that shows by a kind of traditional passive alignment structure of utilizing pilot hole and guide finger;
Fig. 3 is the view that shows the coupled structure that is used for optical waveguide and optical device of a preferred embodiment of the invention;
Fig. 4 is the vertical view that is used to represent the coupled structure shown in Fig. 3 of a kind of set top box (set-top box);
Fig. 5 A and 5B are the detailed views that shows the action face of VCSEL and PD; With
Fig. 6 is the vertical view that is used to represent the coupled structure shown in Fig. 3 of a kind of optical network unit.
Embodiment
Hereinafter with reference to accompanying drawing, preferred implementation of the present invention is elaborated.In order to reach simple and clear purpose,,, omitted at this because it may make subject content of the present invention become obviously outstanding for following known function that adopts and structure.
Fig. 3 is the view that shows according to the coupled structure that is used for optical waveguide and optical device of one embodiment of the present invention.As showing among the figure, be provided with VCSEL (vertical cavity surface emitting laser), PD (photodiode) and change the glass substrate 200 of impedance amplifier (transimpedance amplifier), be glued on the OSA main body 100 with the PLC substrate 110 that is formed with optical waveguide. Drawing reference numeral 300 and 301 is represented flexible printed circuit board and signal wire respectively.
Described OSA main body 100 comprises silicon chip 101, PLC layer 110 and illusory (dummy glasssubstrate) glass substrate 102.
PLC layer 110 comprises optical waveguide 111 that is used for the transmission optics signal and illusory waveguide 112a, the 112b (dummy waveguides) that is used for optical correction when PLC layer 110 is being glued on the glass substrate 200.
Be installed on the glass substrate 200 is as the VCSEL210 of luminescent device and as the photodiode 220,230 of light detecting device.In addition, change impedance amplifier 240,250 and be installed on the glass substrate 200, so that will convert voltage signal to by the detected current signal of described light detecting device.Change impedance amplifier 240,250 and be connected on the described glass substrate 200, and be connected on the photodiode 220,230 by wire bonds (wire-bond) technology by pressing mold bonding (die-bond) technology.In addition, glass substrate 200 comprises dummy pattern 260a of optical correction and 260b.Note that also to be adopted as other substrate that well known to those of ordinary skill in the art other can absorbing wavelength, replace described glass substrate 200.
Fig. 4 is the vertical view of the coupled structure that shows among Fig. 3, and the part that it represents optical coupling structure is bonded to the VCSEL BiDi transceiver that is used for STB, and calibrates described PLC layer 110 and described glass substrate 200.Drawing reference numeral 211,221 is represented metal gasket, and drawing reference numeral 214 is represented the wire bonds part.
With reference to Fig. 3 and 4, PLC layer 110 comprises the optical waveguide 111 with three branch line 111a, 111b and 111c, and with respect to the illusory waveguide 112a, the 112b that are used for optical correction of described optical waveguide 111 symmetric offset spread.
Antireflecting coating 270 is formed on the bottom surface of described glass substrate 200.VCSEL210 and photodiode 220,230, be installed on the antireflecting coating 270 so that the action face of described VCSEL210 and photodiode 220,230 is faced the mode of described glass substrate 200 by a kind of upside-down method of hull-section construction bonding process, in order to help described bonding process, as shown in Figure 5, metal gasket 211,221 is formed on the edge of described VCSEL210 and photodiode 220,230.
Fig. 5 A and 5B are the detailed views that shows the action face of described VCSEL and described photodiode.Fig. 5 A has shown the described action face (front) of described VCSEL, and Fig. 5 B has shown the action face (front) of described photodiode.Drawing reference numeral 212 and 222 is represented window, and drawing reference numeral 213 and 223 representatives are formed (Au-patterned) part of pattern by gold.Although do not show that the back side of described VCSEL and described photodiode is coated with gold.
Referring again to Fig. 4, the dummy pattern 260a of optical correction, 260b are arranged on the both sides of photodiode 220,230, and comprise metallic film or thin dielectric film.As described below, the optical coupled between described optical device and the optical waveguide 111 realizes by the illusory waveguide 112a, the 112b that utilize the dummy pattern 260a of optical correction, 260b and be formed on the PLC layer 110.
In calibration process, the light that passes 112a, 112b aligns with the dummy pattern 260a of optical correction, 260b.Then, by ultraviolet light and epoxide-resin glue 290 PLC110 is bonded on the glass substrate 200.
WDM light filter 280 is installed in the predetermined front of described glass substrate 200, it is parts that are bonded on the PLC110, action face corresponding to photodiode 220,230, so that the optical signalling that allows to have predetermined wavelength and incide in the photodiode 220,230 passes through, or so that reflect there from the light signal.WDM light filter 280 can adopt triplexer (triplexer).In addition, WDM light filter 280 can form by traditional thin-film technique.
Fig. 6 shows to be used for ONU (optical network unit) and in order to the view of the part of the optical coupling structure of calibration PLC layer 110 and glass substrate 200.Optical device on being installed in described optical base-substrate and the structure corresponding to the WDM light filter of described optical device, Fig. 6 is similar to the Fig. 4 that shows described STB structure.Therefore, for fear of unnecessary being repeated in this description, below will only describe different parts.
With reference to Fig. 6, photodiode 310 and two VCSELs320,330 are installed on the bottom surface of glass substrate 200.With identical for the mode of VCSEL210 shown in Fig. 4 and photodiode 220,230, photodiode 310 and two VCSELs320,330 are bonded on the glass substrate 200 by the upside-down method of hull-section construction bonding process, so that photodiode 310 and two VCSELs320,330 action face are in the face of glass substrate 200.
In addition, WDM light filter 380 is installed on the predetermined front of glass substrate 200, it is parts that are bonded on the PLC layer 110, corresponding to two VCSELs320,330 action face, so that allow to pass with presetted wavelength, perhaps so that reflect there from the described optical signalling from two VCSELs320,330 light signals of launching.WDM light filter 380 can adopt triplexer (triplexer).In addition, WDM light filter 280 can form by traditional thin-film technique.
As described above, according to the present invention, illusory waveguide and optical correction's pattern are arranged on the upper surface of described glass substrate, and described PLC substrate and described optical device are installed above, so that calibrate described optical waveguide and described optical device optically.Therefore, when carrying out described optical waveguide, utilize the method optical correction's error can be reduced in several microns the scope to the optical coupled of described optical device.In addition, after being installed to described optical device on the described glass substrate, by upside-down mounting mull technique technology described glass substrate is bonded on the described PLC substrate, the distance between described like this PLC substrate and the described optical device keeps constant, thereby improves coupling efficiency.
Though the present invention has obtained explanation in conjunction with its specific preferred implementation, should be appreciated that, for the technician in the described technical field, can under the situation that does not deviate from the marrow of the present invention that limits by appended claims and scope, carry out various variations at it in form and on the details.
Claims (12)
1. device that is used for coupling optical waveguide and optical device, it comprises:
First substrate;
At least one is formed on the optical waveguide that is used for the transmission optics signal on described first substrate;
The illusory waveguide of on described first substrate, disposing symmetrically with respect to described optical waveguide;
Be coupled to described first on-chip second substrate;
At least one is installed in the optical device on the bottom surface of described second substrate, so that described optical device optics is connected in the described optical waveguide; With
Be formed on the bottom surface of second substrate corresponding to optical correction's pattern of described illusory waveguide, the optical correction of wherein said optical waveguide and optical device realizes by described illusory waveguide is calibrated with respect to described optical correction pattern.
2. coupled structure as claimed in claim 1 is characterized in that the front of described second substrate is glued on the upper surface of described first substrate.
3. coupled structure as claimed in claim 1 is characterized in that described optical device is glued on described second substrate by upside-down mounting mull technique technology, so that the action face of described optical device is in the face of the described second substrate bottom surface.
4. coupled structure as claimed in claim 3 also comprises on the edge of the described action face that is located at described optical device to help the metal gasket of described upside-down method of hull-section construction bonding process.
5. coupled structure as claimed in claim 1 is characterized in that described optical waveguide comprises at least three branch lines.
6. coupled structure as claimed in claim 5, also comprise an optical detection device and at least two VCSEL on the described bottom surface that is installed in described second substrate, so that described optical detection device and VCSEL are connected on the described branch line of described optical waveguide.
7. coupled structure as claimed in claim 6, also comprise on the front that is located at described second substrate WDM light filter, so that transmission or reflection are penetrated or the light with predetermined wavelength of the described VCSELs of directive from described VCSEL selectively corresponding to the action face of described VCSEL.
8. coupled structure as claimed in claim 5, also comprise first optical detection device, second optical detection device and VCSEL on the bottom surface that is installed in described second substrate, so that described first, second optical detection device and described VCSEL are connected on three branch lines of described optical waveguide.
9. coupled structure as claimed in claim 8, also comprise on the front that is located at described second substrate WDM light filter, so that transmit selectively or be reflected into the light that is mapped in described first and second optical detection devices with predetermined wavelength corresponding to the action face of described first and second optical detection devices.
10. coupled structure as claimed in claim 7 is characterized in that described WDM light filter comprises the thin film filter of making by the thin film coated technology.
11. coupled structure as claimed in claim 1 is characterized in that described optical correction pattern comprises metallic film or thin dielectric film.
12. the optical correction's method that is used for coupling optical waveguide and optical device said method comprising the steps of:
Form illusory waveguide symmetrically having on first substrate of described optical waveguide;
Form optical correction's pattern symmetrically being coupled on second substrate of described optical device, so that described optical device is connected in the described optical waveguide optically; With
Utilization is delivered to light signal on the described optical correction pattern through described illusory waveguide, calibrates described illusory waveguide and optical correction's pattern.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR200341191 | 2003-06-24 | ||
| KR10-2003-0041191A KR100526505B1 (en) | 2003-06-24 | 2003-06-24 | Structure of coupling up optical device to optical waveguide and method for coupling arrangement using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1573381A true CN1573381A (en) | 2005-02-02 |
| CN1318869C CN1318869C (en) | 2007-05-30 |
Family
ID=33536218
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2003101223348A Expired - Fee Related CN1318869C (en) | 2003-06-24 | 2003-12-17 | Coupling structure for optical waveguide and optical device and optical alignment method by using the same |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US6952514B2 (en) |
| JP (1) | JP3914220B2 (en) |
| KR (1) | KR100526505B1 (en) |
| CN (1) | CN1318869C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102981223A (en) * | 2012-12-07 | 2013-03-20 | 武汉光迅科技股份有限公司 | Optical waveguide chip and PD (photodiode) array coupling packaging structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7554974B2 (en) * | 2004-03-09 | 2009-06-30 | Tekelec | Systems and methods of performing stateful signaling transactions in a distributed processing environment |
| US7684660B2 (en) * | 2005-06-24 | 2010-03-23 | Intel Corporation | Methods and apparatus to mount a waveguide to a substrate |
| JP2008158440A (en) * | 2006-12-26 | 2008-07-10 | Toshiba Corp | Photoelectric wiring board and method of manufacturing photoelectric wiring apparatus |
| JP4910788B2 (en) * | 2007-03-07 | 2012-04-04 | ソニー株式会社 | Optical module and optical waveguide manufacturing method |
| US20100183266A1 (en) * | 2007-06-14 | 2010-07-22 | Kazuya Shimoda | Optical module and method for manufacturing the same |
| US7526151B1 (en) * | 2007-07-16 | 2009-04-28 | Infinera Corporation | Highly symmetric optical structures |
| US8705906B2 (en) * | 2009-04-23 | 2014-04-22 | Korea Electronics Technology Institute | Photoelectric conversion module |
| CN101621081B (en) * | 2009-08-06 | 2010-12-08 | 无锡市晶源微电子有限公司 | Structure of overlapping capacitors in semiconductor manufacture process |
| US20120241600A1 (en) * | 2011-03-24 | 2012-09-27 | Centera Photonics Inc. | Optical electrical module |
| US11009788B2 (en) | 2011-09-09 | 2021-05-18 | Centera Photonics Inc. | Method for manufacturing optical electrical module and substrate of an optical electrical module |
| US9581772B2 (en) | 2011-09-09 | 2017-02-28 | Centera Photonics Inc. | Optical electrical module used for optical communication |
| US9036952B2 (en) * | 2012-07-25 | 2015-05-19 | International Business Machines Corporation | Electro-optical assembly for silicon photonic chip and electro-optical carrier |
| JP5667649B2 (en) * | 2013-02-05 | 2015-02-12 | 日本電信電話株式会社 | Optical device fabrication method |
| JP6617404B2 (en) * | 2014-12-25 | 2019-12-11 | 富士通株式会社 | Switchable optical amplifier and optical transmission device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5790729A (en) * | 1996-04-10 | 1998-08-04 | Ohmeda Inc. | Photoplethysmographic instrument having an integrated multimode optical coupler device |
| EP0950204B1 (en) * | 1996-12-31 | 2002-01-23 | Honeywell Inc. | Flexible optic connector assembly |
| JPH11337779A (en) * | 1998-05-27 | 1999-12-10 | Nec Corp | Optically coupled structure and its manufacture |
| KR100296384B1 (en) * | 1999-06-21 | 2001-07-12 | 윤종용 | AWG WDM comprising alignment waveguide and apparatus for aligning it |
| US6986608B2 (en) * | 2001-01-16 | 2006-01-17 | Molex Incorporated | Passive alignment connection for fiber optics |
| US6654523B1 (en) * | 2001-08-10 | 2003-11-25 | Lightwave Microsystems Corporation | Optical alignment guide and method for aligning an optical fiber array with an optical integrated circuit |
| JP2003057467A (en) * | 2001-08-15 | 2003-02-26 | Toshiba Corp | Optical module and its manufacturing method |
| US6868207B2 (en) * | 2002-01-10 | 2005-03-15 | Corona Optical Systems, Inc. | Method to diffract and attenuate an optical signal |
-
2003
- 2003-06-24 KR KR10-2003-0041191A patent/KR100526505B1/en not_active IP Right Cessation
- 2003-10-10 US US10/683,373 patent/US6952514B2/en not_active Expired - Fee Related
- 2003-12-17 CN CNB2003101223348A patent/CN1318869C/en not_active Expired - Fee Related
-
2004
- 2004-06-23 JP JP2004184597A patent/JP3914220B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102981223A (en) * | 2012-12-07 | 2013-03-20 | 武汉光迅科技股份有限公司 | Optical waveguide chip and PD (photodiode) array coupling packaging structure |
| CN102981223B (en) * | 2012-12-07 | 2014-10-01 | 武汉光迅科技股份有限公司 | Optical waveguide chip and PD (photodiode) array coupling packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20050000706A (en) | 2005-01-06 |
| US6952514B2 (en) | 2005-10-04 |
| CN1318869C (en) | 2007-05-30 |
| US20040264871A1 (en) | 2004-12-30 |
| JP2005018065A (en) | 2005-01-20 |
| JP3914220B2 (en) | 2007-05-16 |
| KR100526505B1 (en) | 2005-11-08 |
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