CN1567044A - Carrying and inverting platform - Google Patents
Carrying and inverting platform Download PDFInfo
- Publication number
- CN1567044A CN1567044A CN 03148673 CN03148673A CN1567044A CN 1567044 A CN1567044 A CN 1567044A CN 03148673 CN03148673 CN 03148673 CN 03148673 A CN03148673 A CN 03148673A CN 1567044 A CN1567044 A CN 1567044A
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- platform
- glass substrate
- carrying
- support portion
- overturn
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
A support turnover platform is used to support a glass base plate of a LCD panel, which comprises a rotation shaft, a platform connected rotationally with the shaft with at least one support part and a connection part. And the support part is to support glass base plate and the connection part is to connect the shaft and support part with multiple holes on its surface. The platform is located inside with a gas channel, which is formed by the connection part stretching to the support part and connecting with gas holes. The total area contacted with the support part and glass base plate is less than the area of the glass base plate.
Description
Technical field
The present invention relates to a kind of carrying overturn platform, particularly relate to a kind of carrying overturn platform that is applicable to that the bearing glass substrate is used in the liquid crystal panel manufacturing process, can carry the glass substrate of different size, avoid causing scratch at glass baseplate surface, reducing the carrying overturn platform that glass substrate is scrapped.
Background technology
In liquid crystal panel manufacturing process, the glass substrate of liquid crystal panel as shown in Figure 1a, when glass substrate need be moved to by the conveying belt 10 as the figure left as scheming right-hand 10 ' time of conveying belt, just need use carrying overturn platform 14 when mobile.And for example shown in Fig. 1 b,, also need use carrying overturn platform 14 when glass substrate 16 need be moved to by the workbench 12 as the figure left as scheming right-hand 12 ' time of workbench.Similarly, as Fig. 1 c and Fig. 1 d, when glass substrate 16 will be moved to by the conveying belt 10 as the figure left when scheming right-hand workbench 12, or, glass substrate 16 just need carrying overturn platform 14 to move when scheming right-hand conveying belt 10 when will being moved to by the workbench 12 as the figure left.
Please refer to Fig. 2, existing carrying overturn platform is described.
As shown in Figure 2, one carrying overturn platform 20 comprises a rotating shaft 21, one platform 23, be connected with rotating shaft 21 in rotatable mode, in order to support glass substrate 29, on the surface of platform 23 a plurality of holes 233 are arranged, be provided with gas passage 25 in the platform and communicate with the hole 233 on platform 23 surfaces, gas passage 25 is connected with a valve switch 27.
In the time will carrying carrying glass substrate 29, glass substrate 29 is placed on the platform 23, Open valve switch 27 also vacuumizes and makes glass substrate 29 be adsorbed on the platform 23, valve-off switch 27 makes and keeps vacuum in the gas passage 25, so carrying overturn platform 20 can be with glass substrate 29 to move together, after glass substrate 29 both was carried to allocation, Open valve switch 27 made air duct 25 internal gas pressures get back to an atmospheric pressure, and then glass substrate 29 breaks away from platform 23.
As shown in Figure 2, the area of platform 23 is greater than the area of glass substrate 29, in the process of carrying, because the burr that the edge of glass substrate 29 is produced when cutting is arranged, and the edge of glass substrate 29 can stay glass chip (chip) with after platform 20 contacts on platform 20, and this glass chip will pollute the next glass substrate 29 that needs carrying, cause the scratch of circuit in the surperficial scratch, glass substrate 29 of glass substrate 29, cause scrapping of glass substrate 29 sometimes.
If will address the above problem, then the glass substrate of necessary corresponding different specification size is changed the platforms of suitable different sizes, but will be caused the waste in manpower, man-hour thus.
Before carrying overturn platform 20 is being carried glass substrate 29, several warming-up exercise is arranged.At first, must stick one layer tape on whole platform 23, the purpose of one is for providing a protective effect, and when minimizing glass substrate 29 contacted with platform 23,23 pairs of glass substrates 29 of platform caused damage.Its another purpose then is to seal not need the hole of bleeding.
As shown in Figure 2, the area of platform 23 is greater than the area of glass substrate 29.In a manufacture craft, when the glass substrate 29 that uses is a small dimension size, the specification size of corresponding glass substrate 29 on platform, give perforate with pasting the true hole 233 of last layer adhesive tape in this scope, so could when platform 23 carrying glass substrates 29, control the hole 233 of bleeding by valve switch 27 and make glass substrate 29 be adsorbed on the platform 23 via these perforates.And when next manufacture craft, the glass substrate 29 that uses ' specification when being specification greater than glass substrate 29 in the aforementioned manufacture craft, similarly, corresponding glass substrate 29 on platform ' the specification size, the hole 233 that pastes the last layer adhesive tape in this scope is given perforate, so could be in 29 ' time of platform 23 carrying glass substrates, make glass substrate 29 ' be adsorbed on the platform 23 by bleed hole 233 through each perforate thus of valve switch 27 controls.
Finish after the above-mentioned manufacture craft, if the specification of the glass substrate of the required carrying of next manufacture craft be less than glass substrate 29 in the aforementioned manufacture craft ' specification the time, then need the adhesive tape on the platform 23 is Removed All this moment, again paste the new adhesive tape of one deck, the specification size of corresponding glass substrate 29 on platform again, the hole 233 that pastes the last layer adhesive tape in this scope is given perforate, repeat the work of this numerous rope complexity always.Thus, not only cause a large amount of uses of adhesive tape, and labor intensive, man-hour are in removing, paste adhesive tape.
As above-mentioned paste adhesive tape, corresponding glass substrate specification to hole 233 do perforate action, to remove adhesive tape or the like work be necessary, if because not corresponding the specification perforate of glass substrate, then when the hole scope of perforate during greater than the glass substrate area, in handling process, because valve switch 27 will be opened and bleed, and the action of platform 23 not only translation also can be overturn, at this moment, open perforate will be for producing flow-disturbing because bleed, the air-flow variation of subrange is big, will cause the difficulty of carrying glass sheet.
Summary of the invention
Carrying overturn platform one purpose of the present invention is to avoid glass chip to drop on platform, reduces glass chip and causes scratch at glass baseplate surface, avoids the scrappage that circuit on the glass substrate is impaired, reduce glass substrate.
Its another purpose of carrying overturn platform of the present invention is to go for the glass substrate of all different specification sizes, not be used in spended time when changing different platforms, reduce manpower, the waste in man-hour, also need not to make the platform of different sizes, can save cost.
Its another purpose of carrying overturn platform of the present invention is to reduce the use amount of adhesive tape, reduces cost.
According to a kind of carrying overturn platform of the present invention, be used to support the glass substrate of a liquid crystal panel, comprise a rotating shaft; One platform, be connected with rotating shaft in rotatable mode, comprise at least one support portion and a junction, support portion support glass substrate, connecting portion connects rotating shaft and support portion, is provided with a plurality of holes in abutment surfaces, and at least one gas channel is set in platform, the gas channel extends to the support portion by connecting portion and is connected with above-mentioned hole, and the area that glass substrate contacts with the support portion is less than the area of glass substrate.
Above-mentioned carrying overturn platform also comprises at least one valve switch, connects the gas channel, in order to the open and close of pilot-gas channel.
The L-shaped arrangement in above-mentioned connecting portion and support portion.
Also comprise one layer tape on the above-mentioned carrying overturn platform, stick on the support portion.
Description of drawings
Fig. 1 a is the synoptic diagram of one of use occasion of carrying overturn platform;
Fig. 1 b is two synoptic diagram of the use occasion of carrying overturn platform;
Fig. 1 c is three synoptic diagram of the use occasion of carrying overturn platform;
Fig. 1 d is four synoptic diagram of the use occasion of carrying overturn platform;
Fig. 2 is existing carrying overturn platform synoptic diagram;
Fig. 3 is the carrying overturn platform synoptic diagram of first embodiment of the invention;
Fig. 4 a is the carrying overturn platform synoptic diagram of second embodiment of the invention;
Fig. 4 b is the carrying overturn platform synoptic diagram of third embodiment of the invention.
Embodiment
Below with specific embodiment, each form content that the present invention is disclosed is described in detail.
First embodiment
See also Fig. 3, describe carrying overturn platform in detail according to first embodiment of the present invention.
As shown in Figure 3, carrying overturn platform 30 of the present invention, the glass substrate 39 that is used to support a liquid crystal panel comprises a rotating shaft 31, one platforms 33, platform 33 comprises a support portion 331, a junction 333.
In the time will carrying carrying glass substrate 39, glass substrate 39 is placed on the platform 33, Open valve switch 37 also vacuumizes and makes glass substrate 39 be adsorbed on the platform 33, valve-off switch 37 makes and keeps vacuum in the gas passage 35, so carrying overturn platform 30 can be with glass substrate 39 to move together, after glass substrate 39 both was carried to allocation, Open valve switch 37 made air duct 35 internal gas pressures get back to an atmospheric pressure, and then glass substrate 39 breaks away from platform 33.
As shown in Figure 3, the area that glass substrate 39 contacts with support portion 331 is less than the area of glass substrate 39, therefore in the process of carrying, the area that the edge of glass substrate 39 contacts with platform 33 is reduced to minimum, therefore just can on platform 33, not stay glass chip (chip), then can not pollute the next glass substrate 39 that needs carrying, can reduce the scratch of circuit in the surperficial scratch, glass substrate 39 of glass substrate 39, avoid scrapping of glass substrate 39.
Before carrying overturn platform 33 carrying glass substrates 39, still can on whole platform 33, stick one layer tape earlier, provide a protective effect to glass substrate 39.Owing on platform 33, post one layer tape, therefore, be necessary with 335 perforates of the hole on the platform 33.
As from the foregoing, carrying overturn platform advantage of the present invention is the area of the contact area of glass substrate and support portion less than glass substrate, be the contact area of the area of glass substrate greater than glass substrate and support portion, the edge of glass substrate is unsettled, therefore on platform 33, just do not have the glass chip (chip) that drops, can not pollute the next glass substrate 39 that needs carrying, can reduce the scratch of circuit in the surperficial scratch, glass substrate 29 of glass substrate 29, avoid scrapping of glass substrate 29.
Second embodiment
See also Fig. 4 a, describe carrying overturn platform in detail according to second embodiment of the present invention.
Shown in Fig. 4 a, carrying overturn platform 40 of the present invention, the glass substrate 49 that is used to support a liquid crystal panel comprises a rotating shaft 41, one platforms 43, platform 43 comprises four support portion 431a, 431b, 431c, 432, a junction 433.
Platform 43 is connected with rotating shaft 41 in rotatable mode, support portion 431a, 431b, 431c, 432 support liquid crystal panel 49, connecting portion 433 connects rotating shaft 41 and support portion 431a, 431b, 431c, 432, on support portion 431a, 431b, 431c surface a plurality of holes 435 are arranged, three gas passage 45a, 45b, 45c are set in platform 43, and gas passage 45a, 45b, 45c extend to support portion 431 by connecting portion 433 and are connected with hole 435.Gas passage 45a, 45b, the 45c other end are connected to outside valve switch 47a, 47b, 47c, and valve switch 47a, 47b, 47c are controlling the open and close of gas passage.By on Fig. 4 a as can be seen, gas passage 45a is set in the 431a of support portion, gas passage 45b is set in the 431b of support portion, gas passage 45c is set in the 431c of support portion, support portion 432 is that the supplemental support glass substrate uses.
In the time will carrying carrying glass substrate 49, glass substrate 49 is placed on the platform 43, Open valve switch 47a, 47b also vacuumize and make glass substrate 49 be adsorbed on the platform 43, valve-off switch 47a, 47b make and keep vacuum in gas passage 45a, the 45b, so carrying overturn platform 40 can be with glass substrate 49 to move together, after glass substrate 49 both is carried to allocation, Open valve switch 47a, 47b make air duct 45a, 45b internal gas pressure get back to an atmospheric pressure, and then glass substrate 49 breaks away from platform 43.
By Fig. 4 a as can be known, the total area that glass substrate 49 contacts with support portion 431a, 431b is less than the area of glass substrate 49, therefore in the process of carrying, the area that the edge of glass substrate 49 contacts with platform 43 is reduced to minimum, therefore just can on platform 43, not stay glass chip (chip), then can not pollute the next glass substrate 49 that needs carrying, can reduce the scratch of circuit in the surperficial scratch, glass substrate 49 of glass substrate 49, avoid scrapping of glass substrate 49.
Before carrying overturn platform 43 carrying glass substrates 49, still can on whole platform 43, stick one layer tape earlier, provide a protective effect to glass substrate 49.Owing on platform 43, post one layer tape, therefore, be necessary with hole 435 perforates on support portion 431a, the 431b of platform 43.
The 3rd embodiment
See also Fig. 4 b again, describe carrying overturn platform in detail according to the 3rd embodiment of the present invention.
Shown in Fig. 4 b, carrying overturn platform 40 of the present invention is used to support the glass substrate 49 of a liquid crystal panel ' comprise a rotating shaft 41, one platforms 43, and platform 43 comprises four support portion 431a, 431b, 431c, 432, a junction 433.
Platform 43 is connected with rotating shaft 41 in rotatable mode, support portion 431a, 431b, 431c, 432 support liquid crystal panels 49 ', connecting portion 433 connects rotating shaft 41 and support portion 431a, 431b, 431c, 432, on support portion 431a, 431b, 431c surface a plurality of holes 435 are arranged, three gas passage 45a, 45b, 45c are set in platform 43, and gas passage 45a, 45b, 45c extend to support portion 431 by connecting portion 433 and are connected with hole 435.Gas passage 45a, 45b, the 45c other end are connected to outside valve switch 47a, 47b, 47c, and valve switch 47a, 47b, 47c are controlling the open and close of gas passage.By on Fig. 4 a as can be seen, gas passage 45a is set in the 431a of support portion, gas passage 45b is set in the 431b of support portion, gas passage 45c is set in the 431c of support portion, support portion 432 is that the supplemental support glass substrate uses.
When carrying carrying 49 ' time of glass substrate, glass substrate 49 ' be placed on the platform 43, Open valve switch 47a, 47b, 47c and bleeding makes glass substrate 49 ' be adsorbed on the platform 43, valve-off switch 47a, 47b, 47c makes gas passage 45a, 45b, keep vacuum in the 45c, so carrying overturn platform 40 can be with glass substrate 49 ' together to move, after glass substrate 49 ' be carried to both allocation, Open valve switch 47a, 47b, 47c makes air duct 45a, 45b, the 45c internal gas pressure is got back to an atmospheric pressure, then glass substrate 49 ' break away from platform 43.
By Fig. 4 b as can be known, the total area of glass substrate 49 ' contact with support portion 431a, 431b, 431c less than glass substrate 49 ' area, therefore in the process of carrying, glass substrate 49 ' the edge contact with platform 43 be reduced to minimum, therefore just can on platform 43, not stay glass chip (chip), then can not pollute the next glass substrate 49 that needs carrying ', can reduce glass substrate 49 ' surperficial scratch, glass substrate 49 ' go up the scratch of circuit, avoid glass substrate 49 ' scrap.
Carrying overturn platform 43 carrying glass substrates 49 ' before, still can on whole platform 43, stick one layer tape earlier, to glass substrate 49 ' a provide protective effect.Owing on platform 43, post one layer tape, therefore, be necessary with support portion 431a, the 431b of platform 43, all hole 435 perforates on the 431c.
Be provided with the gap between above-mentioned support portion 431a, 431b, the 431c, 432.
At least one is the L type among above-mentioned support portion 431a, 431b, the 431c, 432.
Above-mentioned gas passage 45a, 45b, 45c do not communicate with each other.
Above-mentioned support portion 431a, 431b, the hole 435 on the 431c do not need to be evenly distributed on the surface of platform 43, can increase and decrease the quantity of hole 435 according to need.
Via as can be known above-mentioned, carrying overturn platform advantage of the present invention is the area of the gross contact area of glass substrate and support portion less than glass substrate, be the gross contact area of the area of glass substrate greater than glass substrate and support portion, the edge of glass substrate is unsettled, therefore on platform 43, just do not have the glass chip (chip) that drops, can not pollute the next glass substrate 49,49 that needs carrying ', can reduce glass substrate 49,49 ' surperficial scratch, glass substrate 49,49 ' go up the scratch of circuit, avoid glass substrate 49,49 ' scrap.
Another advantage of carrying overturn platform of the present invention is to go for the glass substrate of all different specification sizes, in changing different platforms, reduces manpower, the waste in man-hour without spended time, also need not to make the platform of different sizes, can save cost.In second embodiment and the 3rd embodiment, the specification of glass substrate varies in size, but all can use carrying overturn platform of the present invention to carry.
Another advantage of carrying overturn platform of the present invention is to reduce the use amount of adhesive tape, reduces cost.In second embodiment and the 3rd embodiment, after pasting one layer tape on the platform 43, to all hole 435 perforates on support portion 431a, 431b, the 431c, afterwards when the different glass substrate of carrying specification, only whether the open and close of need by-pass valve control switch 47a out of the ordinary, 47b, 47c, do not need to remove, paste adhesive tape again, saved many manpowers, man-hour.
Though disclosed the present invention in conjunction with above several preferred embodiments; yet it is not in order to limit the present invention; any skilled personnel without departing from the spirit and scope of the invention; still can do some change and retouching, so protection scope of the present invention should be with being as the criterion that claim was defined.
Claims (8)
1. one kind carries overturn platform, is used to support the glass substrate of a liquid crystal panel, comprising:
One rotating shaft;
One platform, be connected with this rotating shaft in rotatable mode, comprise at least one support portion and a junction, this glass substrate is supported in this support portion, this connecting portion connects this rotating shaft and this support portion, is provided with a plurality of holes in this abutment surfaces, and at least one gas channel is set in this platform, this gas channel extends to this support portion by this connecting portion and is connected with this each hole, and the area that this support portion contacts with this glass substrate is less than the area of this liquid crystal panel.
2. carrying overturn platform as claimed in claim 1, it also comprises at least one valve switch, connects this gas passage, in order to control the open and close of this gas passage.
3. carrying overturn platform as claimed in claim 1, wherein this connecting portion and this support portion are the arrangement of L type.
4. carrying overturn platform as claimed in claim 1 wherein also comprises one layer tape, sticks on this platform.
5. carrying overturn platform as claimed in claim 1, wherein above-mentioned support portion are a plurality of, and are provided with the gap between this each support portion.
6. carrying overturn platform as claimed in claim 5, wherein above-mentioned gas passage are a plurality of, and are provided with a gas channel in each support portion, and this each gas channel does not communicate with each other.
7. as claim 5 or 6 described carrying overturn platforms, wherein the gross contact area of this glass substrate and this each support portion is less than the area of glass substrate.
8. carrying overturn platform as claimed in claim 5, at least one is the L type in the wherein above-mentioned support portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031486738A CN100410750C (en) | 2003-06-17 | 2003-06-17 | Carrying and inverting platform |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031486738A CN100410750C (en) | 2003-06-17 | 2003-06-17 | Carrying and inverting platform |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1567044A true CN1567044A (en) | 2005-01-19 |
| CN100410750C CN100410750C (en) | 2008-08-13 |
Family
ID=34472343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031486738A Expired - Fee Related CN100410750C (en) | 2003-06-17 | 2003-06-17 | Carrying and inverting platform |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100410750C (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100335431C (en) * | 2005-01-28 | 2007-09-05 | 广辉电子股份有限公司 | Base plate transfer device |
| CN101167172B (en) * | 2005-04-29 | 2010-05-19 | 飞科公司 | Method and device for supplying and discharging carriers with electronic components |
| CN101488469B (en) * | 2009-02-13 | 2010-06-02 | 友达光电股份有限公司 | Turnover device and method for turning substrate over |
| CN1924545B (en) * | 2005-09-02 | 2010-08-25 | 由田新技股份有限公司 | Two-basin working system |
| CN101894635A (en) * | 2010-05-25 | 2010-11-24 | 宁波康兴电缆有限公司 | Mobile overturn platform |
| CN108526721A (en) * | 2018-06-12 | 2018-09-14 | 武汉华星光电半导体显示技术有限公司 | The method and device of chamfered area defect in a kind of improvement laser cutting parameter |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08330383A (en) * | 1995-05-31 | 1996-12-13 | Dainippon Screen Mfg Co Ltd | Substrate transferer |
| JPH1094931A (en) * | 1997-10-08 | 1998-04-14 | Dainippon Screen Mfg Co Ltd | Substrate holding stage and roll-coater using it |
| JP2003045935A (en) * | 2001-05-21 | 2003-02-14 | Takehide Hayashi | Vertical type cassette for flat panel such as liquid crystal grass substrate, shifter, and robot |
| JP2003167223A (en) * | 2001-11-29 | 2003-06-13 | Sharp Corp | Tool for conveying substrate and method of manufacturing electric display device using the same |
| JP2003300618A (en) * | 2002-04-10 | 2003-10-21 | Orc Mfg Co Ltd | Base transporting mechanism |
-
2003
- 2003-06-17 CN CNB031486738A patent/CN100410750C/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100335431C (en) * | 2005-01-28 | 2007-09-05 | 广辉电子股份有限公司 | Base plate transfer device |
| CN101167172B (en) * | 2005-04-29 | 2010-05-19 | 飞科公司 | Method and device for supplying and discharging carriers with electronic components |
| CN1924545B (en) * | 2005-09-02 | 2010-08-25 | 由田新技股份有限公司 | Two-basin working system |
| CN101488469B (en) * | 2009-02-13 | 2010-06-02 | 友达光电股份有限公司 | Turnover device and method for turning substrate over |
| CN101894635A (en) * | 2010-05-25 | 2010-11-24 | 宁波康兴电缆有限公司 | Mobile overturn platform |
| CN108526721A (en) * | 2018-06-12 | 2018-09-14 | 武汉华星光电半导体显示技术有限公司 | The method and device of chamfered area defect in a kind of improvement laser cutting parameter |
| CN108526721B (en) * | 2018-06-12 | 2020-10-13 | 武汉华星光电半导体显示技术有限公司 | Method and device for improving defect of chamfer area in laser cutting process |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100410750C (en) | 2008-08-13 |
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