CN1559977A - Mfg. method of nano ceramics - Google Patents
Mfg. method of nano ceramics Download PDFInfo
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- CN1559977A CN1559977A CNA2004100229445A CN200410022944A CN1559977A CN 1559977 A CN1559977 A CN 1559977A CN A2004100229445 A CNA2004100229445 A CN A2004100229445A CN 200410022944 A CN200410022944 A CN 200410022944A CN 1559977 A CN1559977 A CN 1559977A
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Abstract
The invention discloses a nano ceramic making method, washing and drying qualified textile ceramics to be packaged, like ceramic 75, ceramic 95 and ceramic 99, which use aluminum oxide as a base, high-voltage transmission insulator qualified by check and to be glazed, and ceramic for making epoxy resin packages of semiconductor devices as well as ceramics for valves and tap switches, then placing these ceramics in a vacuum container, as the vacuum raches 133.3 X 10 to the power -3-133.3 X 10 to the power -7, raising the temperature of nano material on a heating source up to 20 deg.C-1200 deg.C, keeping the temperature for 0.5-4.0 hours, relieving the vacuum to make the nano material distributed in all the ceramics, stopping heating, naturally lowering temperature and cooling, and taking the product and washing and drying. The texile ceramics changes from porosity to compactibility, and from hydrophilicity to hydrophobic property, increasing lubricating property of ceramics; the high-voltage transmission insulator need not be glazed, not only improving voltage resistance and environmental usability but also able to reduce production cost; and have good sealing and damp-proof properties.
Description
Technical field the present invention relates to a kind of nano-textile pottery, nanometer high voltage power transmission porcelain vase, semiconductor components and devices epoxy encapsulation are used nano ceramics with nano ceramics and valve, water tap method for preparing under vacuum state.
Background technology is along with the high speed development of textile manufacturing machine and improving constantly of automatic degree, the movement velocity of yarn also improves constantly, the broken yarn problem is the major issue that people pay close attention to always in spinning and weaving process process, for head it off, before on spinning and the weaving machine, adopt metalwork to give yarn guide, many in recent years employing 75 porcelain or 95 porcelain spares or 99 porcelain spares are as guide, because the composition and the manufacturing process of material, make two big drawbacks of 75 porcelain or 95 porcelain and 99 porcelain be: the porousness wetting ability, have a strong impact on performance, owing to the friction between porcelain spare and the yarn, reduce the work-ing life of textile ceramic after use for some time.To spin rate in order reducing to break, under the condition that adds large space humidity, more to increase the friction between yarn and the porcelain spare.In order to overcome the shortcoming of 75 porcelain spares or 95 porcelain spares or 99 porcelain spares, improve smooth finish, wear resistance and the raising moisture resistance energy in use of ceramic member itself, must handle (the P of " international electronic material " 2003/12 to textile ceramic
12And the P of 2003/9-10
72Report).
Remove this, must be difficult for by electrical breakdown with anticreep by glaze to increase the compactness on transmission of electricity porcelain vase surface at the outside surface that is applied to the high voltage power transmission porcelain vase on the ultra-high-tension power transmission line in the past.This is complex process by glaze technology one, the 2nd, and the production cost height.Because hole is many, the moisture resistance poor performance influences work-ing life of semiconductor element to the semiconductor components and devices epoxy encapsulation with pottery.
Summary of the invention the object of the present invention is to provide and a kind ofly improves good, the anti abrasive nano-textile pottery of compactness, moisture resistance performance and the nanometer high voltage power transmission porcelain vase of textile ceramic and high voltage power transmission porcelain vase and production cost is low, the moisture resistance performance is than the semiconductor components and devices epoxy encapsulation that reaches high low temperature good cycle well of the plastic packaging manufacture method with nano ceramics and valve, water tap nano ceramics.
For achieving the above object, the technical solution used in the present invention is: utilize that existing what be used for textile enterprise is the textile ceramic of matrix with the aluminium sesquioxide, do not used pottery as the preparation object with pottery and valve, water tap as the porcelain spare of 75 porcelain or 95 porcelain or 99 porcelain and through what be up to the standards by the high voltage power transmission porcelain vase of glaze and semiconductor components and devices epoxy encapsulation, behind the cleaning, drying, they are put into vacuum vessel, simultaneously nano material is positioned on the heating source in the vacuum vessel, treats that the vacuum tightness in the vacuum vessel arrives 133.3 * 10
-3～133.3 * 10
-7During Pa, nano material 20 ℃～1200 ℃ heating, was kept 0.5～4.0 hour, remove vacuum, stop to heat, the cooling back is taken out stand-by.
Adopt the nano-textile pottery of as above technical scheme preparation and nanometer high voltage power transmission porcelain vase and semiconductor components and devices encapsulation to compare with conventional ceramic with nano ceramics with valve, water tap with nano ceramics, its characteristics are:
1. the porousness with original textile ceramic becomes compactness, has increased ceramic lubricity, and wetting ability becomes hydrophobic nature, has increased ceramic oilness.
2. reduced spin and pottery between friction, can reduce by 2～20 times of the broken yarn rates of textile manufacturing machine, can reduce noise.
3. the nano material in the nanometer high voltage power transmission porcelain vase can fetter and isolating metal ion, free state ion and polar molecule, cut off electronic conduction and mechanism of ionic conduction in the porcelain vase, help improving the resistance to pressure of porcelain vase, do not need to the transmission of electricity porcelain vase by glaze, can reduce production costs.
4. the acid and alkali-resistance of nanometer high voltage power transmission porcelain vase, salt spray resistance are applicable to industry zone or coastal ultra-high-tension power transmission line than good by glaze high voltage power transmission porcelain vase performance.
5. the semiconductor components and devices epoxy encapsulation is better than the plastic packaging with the moisture resistance performance of nano ceramics, and high low temperature cycle performance is strong, has improved high-temperature behavior and low-temperature performance.
The water-absorbent of 6. made nano ceramics is littler 50～100 times than the water-absorbent of conventional ceramic.
Below the embodiment the specific embodiment of the present invention is described in further detail.
1. with the textile ceramic part of Proper Packing, as with Al
2O
3The textile ceramic part that manufactures for 75 porcelain of base or 95 porcelain or 99 porcelain and treating through being up to the standards by the high voltage power transmission porcelain vase of glaze and semiconductor components and devices epoxy encapsulation with ceramic member, valve, water tap with ceramic member through cleaning water and organic solvent, clean as alcohol etc., remove the dirt of surface or endoporus, make its surface not stay any physics dirt or oil stain; The mechanical water in surface and the endoporus is removed in oven dry;
2. the textile ceramic part that will cross through clean, treat to be placed vacuum vessel with ceramic member and valve, switch water tap with ceramic member by the high voltage power transmission porcelain vase of glaze and semiconductor components and devices epoxy encapsulation, simultaneously nano material is put on the heating source in the vacuum vessel;
3. to evacuating atmosphere in vacuum vessel, treat that the vacuum tightness in the vacuum vessel reaches 133.3 * 10
-3～133.3 * 10
-7During Pa, the nano material on the heating source is heated up, temperature is controlled at 20 ℃～1200 ℃ and kept 0.5～4.0 hour, to exitting in the vacuum vessel, nano material stops heating source being heated after all being distributed to all pottery the insides, naturally cooling cooling, it is stand-by to take out cleaning, drying.
Through after this technology, nano material all be distributed to textile ceramic and high voltage power transmission porcelain vase and semiconductor components and devices epoxy encapsulation with pottery and valve, water tap with the ceramic product the inside, increased their density, air and steam can not enter in the product; Because nano material is distributed in the pottery the inside, wetting ability becomes hydrophobicity performance, has improved their insulating property simultaneously.
Nano material is: nonmetal, organism etc.
Embodiment 1:
Vacuum tightness in the vacuum vessel is 4.5 * 133.3 * 10
-4Pa, the nano material Heating temperature is 120 ℃, 2.0 hours heat-up times, other condition is identical with the explanation in the specification sheets;
Embodiment 2:
Vacuum tightness in the vacuum vessel is 1.5 * 133.3 * 10
-5Pa, the nano material Heating temperature is 800 ℃, and be 1.5 hours heat-up time, and other condition is identical with the specification sheets explanation;
Embodiment 3:
Vacuum vessel vacuum tightness is: 5.5 * 133.3 * 10
-7Pa, 1000 ℃ of nano material Heating temperatures, be 3.5 hours heat-up time, other condition is identical with explanation in the specification sheets.
Claims (1)
1, a kind of manufacture method of nano ceramics, it is characterized in that: with qualified textile ceramic to be packaged as with the aluminium sesquioxide be 75 porcelain of base or 95 porcelain or 99 porcelain and treat through being up to the standards by the high voltage power transmission porcelain vase of glaze and semiconductor components and devices epoxy encapsulation with pottery, valve and water tap with ceramic with cleaning water and organic solvent cleaning, dry and place vacuum vessel, simultaneously nano material is put on the heating source in the vacuum vessel; Vacuumize, treat that the vacuum tightness in the vacuum vessel reaches 133.3 * 10
-3～133.3 * 10
-7Behind the Pa, nano material is warmed up to 20 ℃～1200 ℃ keeps exitting in vacuum vessel in 0.5～4.0 hour, nano material stops heating after all being distributed to the pottery the inside, cooling cooling naturally, and it is stand-by to take out the product cleaning, drying.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100229445A CN100425573C (en) | 2004-02-27 | 2004-02-27 | Mfg. method of nano ceramics |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100229445A CN100425573C (en) | 2004-02-27 | 2004-02-27 | Mfg. method of nano ceramics |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1559977A true CN1559977A (en) | 2005-01-05 |
| CN100425573C CN100425573C (en) | 2008-10-15 |
Family
ID=34441027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100229445A Expired - Fee Related CN100425573C (en) | 2004-02-27 | 2004-02-27 | Mfg. method of nano ceramics |
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| CN (1) | CN100425573C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102503377A (en) * | 2011-09-30 | 2012-06-20 | 中国电子科技集团公司第十三研究所 | High-strength semiconductor packaging ceramic material and manufacturing method thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE19647368A1 (en) * | 1996-11-15 | 1998-05-20 | Inst Neue Mat Gemein Gmbh | Composites |
| CN1308035A (en) * | 2001-02-05 | 2001-08-15 | 吴哲雄 | Ceramic surface treating technology |
| CN1265017C (en) * | 2001-09-13 | 2006-07-19 | 北京航空航天大学 | Electron-beam physical vapor deposition process of preparing composite nano soft magnet and ceramic film |
| CN1197662C (en) * | 2001-09-24 | 2005-04-20 | 中国科学院理化技术研究所 | Method of forming metal composite titanium dioxide nano particle film on ceramic surface |
| CN1351977A (en) * | 2001-11-26 | 2002-06-05 | 大连理工大学 | Technology for preparing nanometer ceramic particle material with industrial propane |
| TW562790B (en) * | 2002-08-29 | 2003-11-21 | Tien Kuang Entpr Co Ltd | Method of nanoparticulate coating for antifouling product |
-
2004
- 2004-02-27 CN CNB2004100229445A patent/CN100425573C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102503377A (en) * | 2011-09-30 | 2012-06-20 | 中国电子科技集团公司第十三研究所 | High-strength semiconductor packaging ceramic material and manufacturing method thereof |
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| Publication number | Publication date |
|---|---|
| CN100425573C (en) | 2008-10-15 |
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Granted publication date: 20081015 Termination date: 20130227 |