CN1550536A - Silicone rubber adhesive composition for mobile body - Google Patents
Silicone rubber adhesive composition for mobile body Download PDFInfo
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- CN1550536A CN1550536A CNA200410038647XA CN200410038647A CN1550536A CN 1550536 A CN1550536 A CN 1550536A CN A200410038647X A CNA200410038647X A CN A200410038647XA CN 200410038647 A CN200410038647 A CN 200410038647A CN 1550536 A CN1550536 A CN 1550536A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W60/00—Affiliation to network, e.g. registration; Terminating affiliation with the network, e.g. de-registration
- H04W60/06—De-registration or detaching
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/02—Terminal devices
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/08—Access point devices
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Abstract
Provided are a silicone rubber adhesive composition for a mobile body which shows a good adhesion to a thermoplastic resin suitable for the molding without a primer and can be molded in a short time, and a molded product integrated with a film or thin film-type mobile member using the composition. The silicone rubber adhesive composition comprises 100 parts by weight of a heat curing organopolysiloxane composition; 1-100 parts by weight of a reinforcing silica micropowder; and 0.1-50 parts by weight of an adhesion imparting component. Preferably the adhesion imparting component is an organic compound or organosilicon compound containing at least one kind of group selected from the group consisting of an epoxy group, an alkoxysilyl group, an acryl group, a methacryl group, an ester group, a carboxyl anhydride group, an isocyanate group, an amino group and an amide group; an organic compound or organosilicon compound having at least one Si-H group and/or alkenyl group and containing at least one kind of group selected from the group consisting of an epoxy group, an alkoxysilyl group, an acryl group, a methacryl group, an ester group, a carboxyl anhydride group, an isocyanate group, an amino group and an amide group; an organic compound or organosilicon compound of Si1-Si100 having at least one Si-H group and/or alkenyl group and containing at least one phenylene structure or phenyl group; an organic compound or organosilicon compound having at least one ester group and containing at least one unsaturated aliphatic group; or their mixture.
Description
[technical field]
When the present invention relates to particularly to obtain thermohardening type rubber composition and moving body with the one-body molded body of resin, can be simply and the short period of time moulding, be applicable to the good moving body silicone adhesive composition of cementability of no base paint, said composition is suitable for movably electrical equipment, telecommunication equipment etc. such as mobile phone, mobile communication equipment, portable computer parts, game machine, clock and watch, video receiver, DVD player, MD machine, CD player most.
[background technology]
In recent years, silicon rubber silicon utilizes its characteristic to be widely used in electrical equipment, electronics, automobile, building field etc., requires to have assembling operation, stopping property, insulativity etc.And according to use must be with resin bonding, that many situations often utilize base paint to carry out is bonding, and the base paint painting process must be arranged in the operation, waste time and energy.Use the situation that is added with tackiness agent in the rubber composition from the adhesion type rubber composition, owing to do not need aforementioned painting process,, can reduce cost so can shorten the activity duration, also because of the operation raising, so on the one-body molded body of manufacturing and resin, become effective means.
The no base paint moulding of the thermohardening type rubber composition of add-on type has been reported many and adhering method organic resin.For example, make from cementability rubber composition solidified method on resin, relevant being somebody's turn to do from the cementability rubber composition propose many technology specific to bonding composition.In addition, also proposed in organic resin, to add and contained and 30 moles of organic hydrogen diene polysiloxane more than the % of the direct bonded hydrogen atom of Siliciumatom, the method bonding (special fair 2-34311 communique) with the silicon rubber of addition reaction curing, adopt silicon rubber with the chimeric method of organic resin physical property incorporate method (the public clear 63-4529 communique of spy), make compound connect the olefin resin and the bonding incorporate method of silicon rubber (spy opens clear 63-183843 communique) of skill with aliphatics unsaturated group and the water-disintegrable base of Siliciumatom key, add contain the aliphatics unsaturated group and with thermoplastic resin and the bonding incorporate method of silicon rubber of the compound of the direct bonded hydrogen atom of Siliciumatom, (spy opens flat 9-165516 communique to cooperate the one-body molded body of the resin that contains the thermoplastic oligomer that the aliphatics unsaturated group forms and the oily property separated out silicon rubber in thermoplastic resin, Te Kaiping 9-165517 communique) etc.
Right also have, the situation of the thermohardening type rubber composition of add-on type, to general thermoplastic resin, for example to ABS resin, polyphenylene oxide resin, polyphenylene sulfide, polycarbonate resin, polyvinyl resin, acrylic resin, the polybutylene terephthalate resin, pet resin, acrylic resin, polyamide resin, aromatic polyamide resin, the various resins of urethane resin etc., adopt the short period of time moulding can not obtain sufficient cementability, in order to have sufficient cementability, must be described to resin modified as above-mentioned motion.To resin modified situation, need operation especially, cost up sometimes because modification changes the characteristic of resin easily, yet is not directly carried out bonding situation to resin modified, has the problem of bonding mould when using mould to carry out moulding.
One-body molded about with resin is just like above-mentioned motion.But especially not at movably motions of the moving body of electrical equipment, communication equipment etc. such as mobile phone, mobile communication equipment, portable computer parts, game machine, clock and watch, image receiver, DVD player, MD machine, CD players.
Moving body, its sealing, key mat portion, housing section, other peripheries etc. use silicon rubber, but do not use base paint and make the motion of the one-body molded bonding composition of silicon rubber.The walls such as resin of the shell portion of uses such as moving body, key portion, other peripheries approach, wherein also have membranaceous film key situation, because adopt high temperature or long moulding to cause distortion, so must adopt the short period of time to carry out forming process.Wherein, in order to form the one-body molded body of resin and silicon rubber, even thirst for to require use the also not bonding mould of mould, but moulding in the short period of time, and the silicone adhesive composition of moving body use that can the various thermoplastic resins of film and silicon rubber is bonding securely.
The object of the invention is to provide, when the one-body molded body of rubber composition that obtains the moving body use and thermoplastic resin, but moulding in the short period of time, give and be applicable to the good silicone adhesive composition of cementability of the thermoplastic resin of no base paint moulding, can obtain not bonding and thermoplastic resin is out of shape and the moving body silicone adhesive composition of one-body molded body that can be bonding mold for forming.
[summary of the invention]
The result that the present inventor concentrates on studies in order to achieve the above object repeatedly, it is effective that discovery uses the tackiness of bonding silicon rubber and resin that moving body uses to give composition.And find to give the silicone adhesive composition that composition cooperates with rubber constituent by using with this tackiness, when making said composition and resin one-body molded, can obtain the bonding securely one-body molded body of silicone adhesive composition and thermoplastic resin.Also find to use the hot briquetting method, can obtain this silicone adhesive composition thermoplastic resin is had enough clinging powers under the condition of cure of short period of time, can peel off from forming mould fully on actual the use, do not cause the silicone adhesive composition of thermoplastic resin distortion and the one-body molded body of thermoplastic resin, as thermoplastic resin, use the situation of thin resin of the wall easily cause thermal distortion and membranaceous resin also effective.Therefore, by adopt mechanical fixation such as injection moulding, extrusion moulding, spreading mode, robot to make organic resin (thermoplastic resin) and silicon rubber bonding, can be provided as make moving body with one-body molded body suitable moving body silicone adhesive composition.And moving body silicone adhesive composition of the present invention in making the operation of formed body, by selecting the material of mould, can present mould not bondingly when using mould, only thermoplastic resin is had adhesive specific performance.
Therefore, the invention provides the moving body silicone adhesive composition that contains following composition.
(A) thermohardening type organopolysiloxane composition 100 weight parts
(B) reinforcement fine silica 1～100 weight part
(C) tackiness gives composition 0.1～50 weight part
This situation, can enumerate movably electrical equipment, the communication equipment of selecting in mobile phone, mobile communication equipment, portable computer parts, game machine, clock and watch, image receiver, DVD player, MD machine, the CD player as moving body, especially effective as bonding usefulness to the moving body member that is selected from key mat portion in the moving body, sealing, waterproof gasket, barrier property, film loudspeaker.As the shape of this moving body member, also be fit to the situation of the membranaceous or film like member of thermoplastic resin formation.
Therefore, the present invention provides the one-body molded body of the formed membranaceous or film like moving body member of the cured article of silicone adhesive composition and thermoplastic resin again.
[embodiment]
Below, the present invention is described in more detail.
Thermohardening type organopolysiloxane composition (A) in the silicone adhesive composition of the present invention can use any of organic peroxide curing type organopolysiloxane composition or addition reaction curing organopolysiloxane composition.Preferred addition reaction curing organopolysiloxane composition.
Moving body of the present invention is the situation of organic peroxide curing type organopolysiloxane composition with (A) composition of silicone adhesive composition, preferably contain at least in the molecule by (I) following general formula (1) expression the organopolysiloxane of average alkenyl more than 2 and (II) organo-peroxide constitute.
R
1 aSiO
(4-a)/2Formula (1)
In the formula, R
1Be C
1～C
12Displacement or non-metathetical monovalence alkyl, but R
11.0 * 10
-5Mole %, preferred 1.0 * 10
-4Mole %, more preferably 0.01 mole more than the %, 20 moles below the %, most preferably 10 moles is alkenyl below the %.A is 1.5～2.8 positive number.
This situation, (I) the above-mentioned formula (1) of composition contains in the organopolysiloxane of alkenyl R
1Be C
1～C
12, C preferably
1～C
8Displacement or non-metathetical monovalence alkyl.Can enumerate the alkyl of methyl, ethyl, propyl group, sec.-propyl, butyl, isobutyl-, the tertiary butyl, amyl group, neo-pentyl, hexyl, cyclohexyl, octyl group, nonyl, decyl etc. particularly, the alkenyl of vinyl, allyl group, propenyl, pseudoallyl, butenyl, isobutenyl, hexenyl, cyclohexenyl, octenyl etc., the aryl of phenyl, tolyl, xylyl, naphthyl etc., the aralkyl of benzyl, styroyl, hydrocinnamyl etc., chloromethyl, bromotrifluoromethane, 3,3, the displacement of halogens such as 3-trifluoro propyl, 3-chloropropyl, cyanoethyl, cyano group displacement alkyl etc.In addition, each sub stituent can be distinguished difference, also can be identical, but the amount of alkenyl in total organic radical 1.0 * 10
-5Mole %, preferred 1.0 * 10
-4Mole %, more preferably 0.01 mole more than the %, 20 moles below the %, most preferably 10 moles is alkenyl below the %, also has in the molecule at least 2 alkenyl must be arranged.R
1Can be above-mentioned any base, but as alkenyl, preferred vinyl as other sub stituent, preferably import methyl, phenyl.In addition, a is 1.5～2.8, preferably 1.5～2.5, be more preferably the positive number of 1.98～2.02 scopes.
The organopolysiloxane of above-mentioned formula (1), its molecular structure can be the straight chain shapes, also can be to contain R
1SiO
3/2Unit or SiO
4/2Unitary chain, but common main chain part is basically by R
1 2SiO
2/2Two organo-siloxane unit repeat to constitute, generally be that molecular chain two ends are by R
1 3SiO
1/2Unit terminated straight chain shape two organosilicon polysiloxanes of three organo-siloxanes.Also have, alkenyl in the molecule can combine with molecule chain end or any one Siliciumatom of disengaging latch intermediary, can also close with two reef knots, but consider preferably have organopolysiloxane at least from the viewpoint of the rerum natura of solidified nature, cured article etc. with the Siliciumatom bonded alkenyl of molecular chain two ends.The mean polymerisation degree of above-mentioned organopolysiloxane preferably 10～100000 is arranged again.
The above-mentioned organopolysiloxane that contains alkenyl can adopt known method manufacturing, can make organopolysiloxane and six organic sily oxide carry out balanced reaction and make by in the presence of alkali or acid catalyst particularly.
Organo-peroxide as the solidifying agent of (II) composition, for example, can enumerate benzoyl peroxide, 2,4-dichlorobenzoyl peroxide, peroxidation are to toluyl, peroxidation-2,4-diisopropylbenzene(DIPB), 2, organic peroxide catalyst of 5-dimethyl-two (2, the 5-t-butyl peroxy) hexane, ditertiary butyl peroxide, t-butylperoxyl benzoate etc.
The addition of organic peroxide catalyst with respect to organopolysiloxane 100 weight parts of (I) composition, can be 0.1～10 weight part.
In addition, as the organic peroxide curing type organopolysiloxane composition of (A) composition, only become to be grouped into by above-mentioned (I), (II).
On the other hand, (A) composition is the situation of addition reaction curing organopolysiloxane composition, is fit to use the composition of following compositions.That is, be fit to use (a) and (b), (c) composition as main component.
(a) be the organopolysiloxane that contains average 2 above alkenyls in the molecule of following general formula (1) expression at least
R
1 aSiO
(4-a)/2Formula (1)
In the formula, R
1Be C
1～C
12Displacement or non-metathetical monovalence alkyl, but R
11.0 * 10
-5Mole %, preferred 1.0 * 10
-4Mole %, more preferably 0.01 mole more than the %, 20 moles below the %, most preferably 10 moles is alkenyl below the %.A is 1.5～2.8 positive number.
(b) organic hydrogen diene polysiloxane of preferred Siliciumatom bonded hydrogen more than 3 is arranged in the molecule of following general formula (2) expression at least and average 2
R
2 bH
cSiO
(4-b-c)/2Formula (2)
In the formula, R
2Be C
1～C
10Displacement or non-metathetical monovalence alkyl, b is 0.7～2.1 positive number, c is 0.002～1 positive number, b+c is 0.8～3 positive number.
(c) addition reaction catalyst of catalytic amount.
Above-mentioned formula (1) contains in the organopolysiloxane of alkenyl, R
1Be C
1～C
12, preferred C
1～C
8Displacement or non-metathetical monovalence alkyl.Can enumerate the alkyl of methyl, ethyl, propyl group, sec.-propyl, butyl, isobutyl-, the tertiary butyl, amyl group, neo-pentyl, hexyl, cyclohexyl, octyl group, nonyl, decyl etc. particularly, the alkenyl of vinyl, allyl group, propenyl, pseudoallyl, butenyl, isobutenyl, hexenyl, cyclohexenyl, octenyl etc., the aryl of phenyl, tolyl, xylyl, naphthyl etc., the aralkyl of benzyl, styroyl, hydrocinnamyl etc., chloromethyl, bromotrifluoromethane, 3,3, the displacement of halogens such as 3-trifluoro propyl, 3-chloropropyl, cyanoethyl, cyano group displacement alkyl etc.In addition, each sub stituent can be distinguished difference, also can be identical, but the amount of alkenyl, in total organic radical 1.0 * 10
-5Mole %, preferred 1.0 * 10
-4Mole %, more preferably 0.01 mole more than the %, 20 moles below the %, most preferably 10 moles is alkenyl below the %, in addition, at least 2 alkenyl must be arranged in the molecule.Moreover, R
1Can also be above-mentioned any base,,, preferably import methyl, phenyl as other sub stituent as the alkenyl preferred vinyl.Also have, a is 1.5～2.8 positive number, preferably 1.8～2.5, be more preferably the positive number of 1.98～2.02 scopes.
The organopolysiloxane of above-mentioned formula (1) can be liquid or rubber-like, or mixture.Its molecular structure can be the straight chain shape, or contains R
1SiO
3/2Unit or SiO
4/2Unitary chain, but common main chain part is basically by R
1 2SiO
2/2Two organo-siloxane unit repeat to constitute, generally be that molecular chain two ends are by R
1 3SiO
1/2Unit terminated straight catenate two organosilicon polysiloxanes of three organo-siloxanes.Also have, alkenyl in the molecule can or divide any one Siliciumatom of chain intermediary to combine with molecule chain end, also can be to close with two reef knots, but consider preferably have organopolysiloxane at least from the viewpoint of the rerum natura of solidified nature, cured article etc. with the Siliciumatom bonded alkenyl of molecular chain two ends.
The above-mentioned viscosity that contains the organopolysiloxane of alkenyl is 100～10000000cps at 25 ℃ preferably, most preferably is 500～1000000cps.
The above-mentioned organopolysiloxane that contains alkenyl can adopt known method manufacturing, can make organopolysiloxane and six organic sily oxide carry out balanced reaction and make by in the presence of alkali or acid catalyst particularly.
In addition, in organic hydrogen diene polysiloxane of above-mentioned formula (2), R
2With R
1Identical, but preferably do not have the structure of aliphatics unsaturated chain, b satisfies 0.7～2.1, and is preferred 1～2, and c satisfies 0.002～1, preferred 0.01～0.9, and b+c satisfies 0.8～3, preferred 1～2.6, more preferably satisfies 1.5～2.2 positive number.
This organic hydrogen diene polysiloxane, it is the compound that in the presence of addition reaction catalyst, the host of aforementioned (a) composition is played the linking agent effect, be to have at least in the molecule and average 2, the structure of preferred Siliciumatom bonded hydrogen atom more than 3, this Si-H base can be positioned at molecule chain end or any position of molecular chain intermediary, can also be the position that is positioned at two sides.As so organic hydrogen diene polysiloxane, can enumerate two terminal trimethylsiloxane group end-blocking methyl hydrogen diene polysiloxane, two terminal trimethylsiloxane group end-blocking dimethyl siloxane-methyl hydrogen diene silicone copolymers, two terminal dimethyl hydrogen diene siloxanes end-blocking dimethyl siloxanes, two terminal dimethyl hydrogen diene siloxanes end-blocking dimethyl siloxane-methyl hydrogen diene silicone copolymers, two terminal trimethylsiloxane group end-blocking methyl hydrogen diene siloxanes-diphenyl siloxane-dimethylsiloxane copolymers, two terminal trimethylsiloxane group end-blocking methyl hydrogen diene polysiloxane, methylphenyl siloxane-dimethylsiloxane copolymer, two terminal dimethyl hydrogen diene siloxanes end-blocking methyl oxygen diene siloxanes, diphenyl siloxane, dimethylsiloxane copolymer, two terminal dimethyl hydrogen diene siloxanes end-blocking methyl hydrogen diene siloxanes, methylphenyl siloxane, dimethylsiloxane copolymer, (CH
3)
2HSiO
1/2Unit and SiO
4/2Multipolymer, (CH that the unit constitutes
3)
2HSiO
1/2Unit and SiO
4/2Unit and (C
6H
5) SiO
3/2The multipolymer that the unit constitutes etc.
Organic hydrogen diene polysiloxane of above-mentioned formula (2), its molecular structure can be the straight chain shape, also can be ring-type, a chain or the compound that tridimensional network is arranged.Molecular weight does not have particular restriction, but is liquid under the preferred normal temperature, and it is 0.1～10000cps that its viscosity is preferably in 25 ℃, most preferably be 0.5～5000cps, and the number of the Si-H base in the molecule on average is 2.01～300, preferably about 2.5～100.
In addition, above-mentioned organic hydrogen diene polysiloxane can adopt the known method manufacturing.
The use level of above-mentioned organic hydrogen diene polysiloxane, the organopolysiloxane 100 weight alkane with respect to (a) composition are 0.1～300 weight parts usually, preferably 0.3～200 weight part most preferably is the scope of 0.5～100 weight part.
In addition, also can cooperate this organic hydrogen diene polysiloxane, make with molecule in Siliciumatom bonded hydrogen atom (Si-H yl) be calculated in molar ratio as 0.3～20 moles/mole with respect to the alkenyl in the organopolysiloxane of (a) composition, be preferably 0.8～3 moles/mole.
As the addition reaction catalyst of (c) composition, can enumerate platinum group catalyst, palladium series catalyst, rhodium series catalysts of the complex compound, diacetyl acetate platinum etc. of reactant, Platinic chloride and the olefines of platinum black, platinum chloride, Platinic chloride and monohydroxy-alcohol etc.The addition of this addition reaction catalyst is a catalytic amount.Usually with respect to (a) composition, be 0.1～1000ppm, most preferably be 1～200ppm as platinum, palladium or rhodium metal.
In the above-mentioned addition reaction curing organopolysiloxane composition, basically mismatch fine silica, other inorganic filler, but except that above-mentioned main component, in the scope that does not influence effect of the present invention, also can add and contain the vinyl organopolysiloxane as the vinyl cyclotetrasiloxane of any composition etc., triallyl isocyanate, the toxilic acid alkyl ester, the alkynol class of ethynylcyclohexanol etc., and silane, silicone-modified thing, hydroperoxide, Tetramethyl Ethylene Diamine, the addition reaction control agent of the compound of selecting in the group that benzotriazole and these mixture are formed etc.Therefore, as the addition reaction curing organopolysiloxane composition of (A) composition, only form by the addition reaction control agent of above-mentioned (a) and (b), (c) composition and any composition of conduct.
Secondly, (B) the reinforcement fine silica of composition, the kind of silicon-dioxide does not have particular restriction, can use the fine silica of using as rubber reinforcing filler usually.As this reinforcement fine silica, can use the fine silica of using in the rubber composition in the past, but the most handy specific surface area is 50m
2The reinforcement fine silica that/g is above.Especially be fit to use 50～400m
2The precipitated silica of/g, pyrolytic silicon dioxide, burn till silicon-dioxide etc.In order to improve rubbery intensity, pyrolytic silicon dioxide the best.
In addition, above-mentioned reinforcement fine silica also can be surface-treated fine silica, and during this situation, these fine silica also can be the fine silica of directly handling under the powder state in advance.Can adopt general known technical finesse as common treatment process, for example, add above-mentioned untreated silica fine powder and treatment agent under normal pressure in airtight mechanically milling device or the fluidized-bed, combination treatment is carried out in room temperature or employing thermal treatment in the presence of rare gas element as required.According to circumstances use catalyzer can promote to handle.The fine silica of processing can be made by carrying out drying in mixing back.The use level of treatment agent can be in the amount that is covered by this treatment agent more than the amount that area calculated.
Treatment agent can be enumerated the hexamethyldisilazane class, methyltrimethoxy silane, ethyl trimethoxy silane, propyl trimethoxy silicane, butyl trimethoxy silane, dimethyldimethoxysil,ne, the diethyl dimethoxy silane, vinyltriethoxysilane, vinyltrimethoxy silane, the trimethylammonium methoxy silane, the triethyl methoxy silane, vinyl three (methoxy ethoxy) silane, trimethylchlorosilane, dimethyldichlorosilane(DMCS), the silane coupling agent of divinyl dimethoxy silane and r-chloropropyl trimethoxyl silane etc., polymethyl siloxane, the silicoorganic compound of organic hydrogen diene polysiloxane etc., use these to carry out surface treatment, use as the hydrophobic silica fine powder.As treatment agent, most preferably silane coupling agent or silazane.
(B) use level of composition is 1～100 weight parts with respect to (A) composition 100 weight parts.Machinery weak strength during less than 1 weight part, the filling difficulty of (B) composition when surpassing 100 weight parts, operation, poor in processability.Can preferred 2～80 weight parts.
In addition, the fine silica that above-mentioned hydrophobic treatment can also be crossed during cooperation is carried out hydrophobic treatment again.During this situation, the surface treatment agent of employed hydrophobic property when cooperating, can enumerate as the silane series coupling agent of silicon compound or its partial hydrolystate, silazane, titanic acid ester is coupling agent, organopolysiloxane oil or organic hydrogen diene polysiloxane wet goods.
In the employed surface treatment agent, as silane series coupling agent, can enumerate methyltrimethoxy silane, ethyl trimethoxy silane, propyl trimethoxy silicane, butyl trimethoxy silane, dimethyldimethoxysil,ne, the diethyl dimethoxy silane, vinyltriethoxysilane, vinyltrimethoxy silane, the trimethylammonium methoxy silane, the triethyl methoxy silane, vinyl three (methoxy ethoxy) silane, trimethylchlorosilane, the trimethylammonium aminosilane, glycidoxypropyltrime,hoxysilane, glycidoxy propyl group methyldiethoxysilane, (epoxycyclohexyl) ethyl trimethoxy silane, methacryloxypropyl trimethoxy silane, the methacryloxypropyl triethoxyl silane, dimethyldimethoxysil,ne, divinyl dimethoxy silane and r-chloropropyl trimethoxyl silane etc., but, can also use the partial hydrolystate of above-mentioned silane so long as silane system then can not have particular restriction ground to use.
As employed silazane class, can enumerate hexamethyldisilazane, divinyl tetramethyl-silazane, phenylbenzene tetramethyl-silazane etc.
As employed titanic acid ester is coupling agent, can enumerate tetra isopropyl titanate, tetra-n-butyl titanic acid ester, butyltitanate dipolymer, four stearyl titanic acid ester, trolamine titanic acid ester, titanium acetylacetone, ethyl acetoacetic acid titanium, lactic acid titanium and octylene glycol titanate, sec.-propyl three stearyl titanic acid ester, sec.-propyl three (dodecyl) benzene sulfonyl titanic acid ester, sec.-propyl three (octadecyl) tetra-sodium ester group) titanic acid ester, two (dioctylphyrophosphoric acid is bought base) oxyacetic acid ester group titanic acid ester, two (dioctylphyrophosphoric acid ester group) ethylidene titanic acid ester etc.
As employed organopolysiloxane oil, can be ring-type, chain, a chain, netted any one, viscosity is fit to use 0.65～100000 centistoke.
As employed organic hydrogen diene polysiloxane oil, can be ring-type, chain, a chain, netted any one, but preferably use the structure of following formula (3) expression.
Formula (3)
Wherein, r is 0～50 in the formula, and s is 1～50 scope.R was greater than 50 o'clock, and the viscosity height is difficult.S was greater than 50 o'clock, and the high surface of viscosity is difficult wetting and not preferred similarly.
The use level of treatment agent can be the amount more than the amount that the lining area by this treatment agent is calculated.If the following use level of no problem preferably employing is carried out.During with respect to above-mentioned fine silica 100 weight part less thaies 0.1 weight part,, when surpassing 20 weight parts, do not waste on the operation as the effect of treatment agent, unfavorable on the cost.Therefore should be the amount of 0.1～20 weight part, preferably become the amount of 0.5～10 weight part.
Treatment process and other composition limit mixing limit processing etc., can adopt general known technical finesse, for example, in the mechanically milling device, add other title complex and treatment agent under the normal pressure, have rare gas element to exist down as required and adopt normal temperature or thermal treatment to carry out combination treatment.Also can according to circumstances use catalyzer to promote to handle.
The tackiness of (C) composition that uses among the present invention is given composition, can use in the past employed tackiness such as addition reaction curing type silicone tackiness agent to give composition effectively.
Tackiness as this situation (C) composition is given composition, can enumerate following composition.
(i) contain organic compound more than a kind or 2 kinds or the silicoorganic compound of selecting alkoxysilyl, acrylic, methacrylic acid group, ester group, carboxylic acid anhydride base, isocyanate group, amino and the amide group of epoxy group(ing) from glycidoxy etc., trimethoxysilyl, triethoxysilyl, methyl dimethoxy oxygen base silyl etc. in molecule.
(ii) have 1 Si-H base and/or alkenyl in molecule at least and contain the organic compound or the silicoorganic compound of from alkoxysilyl, ester group, carboxylic acid anhydride base, isocyanate group, amino and the amide group of epoxy group(ing), trimethoxysilyl, triethoxysilyl, methyl dimethoxy oxygen base silyl etc., selecting of base more than a kind or 2 kinds.
(iii) have 1 Si-H base and/or alkenyl in molecule at least and have the organic compound of at least 1 phenylene skeleton or phenyl or the silicoorganic compound of Siliciumatom several 1～100.
The organic compound or the silicoorganic compound that (iv) have 1 ester group in molecule at least have the compound of 1 aliphatics unsaturated group at least in the molecule.
During this situation, can use the tackiness of above-mentioned (i)～(iv) to give a kind in the composition or will be used in combination more than 2 kinds.
Like this, tackiness as (C) composition is given composition, can suitably use the organic compound more than a kind or 2 kinds or silicoorganic compound or these the mixture that contain Si-H base, alkenyl, propenyl, methylpropenyl, epoxy group(ing), alcoxyl silyloxy, ester benzene, carboxylic acid anhydride base, amino, amide group and isocyanate group in the molecule.Most preferably have 1 Si-H base (that is, with Siliciumatom bonded hydrogen atom) and/or alkenyl in the molecule at least and contain the silicoorganic compound more than a kind or 2 kinds of epoxy group(ing), alcoxyl silyl, acrylic, methacrylic acid group, ester group, carboxylic acid anhydride base, isocyanate group, amino and amide group.Above-mentioned Si-H base, alkenyl (as alkenyl, C such as preferred vinyl, allyl group, propenyl, butenyl, hexenyl
2～C
6Alkenyl) respectively with above-mentioned addition reaction curing organopolysiloxane composition in the alkenyl that contains the alkenyl organopolysiloxane, the Si-H base of organic hydrogen diene polysiloxane carry out crosslinking reaction.
Also have, tackiness as (C) composition is given composition, preferably has 1 Si-H base and/or alkenyl in the molecule at least and has the organic compound or several 1～100, preferred 2～30 the silicoorganic compound of Siliciumatom of 1 phenyl skeleton or phenylene skeleton at least.
Give composition if enumerate above-mentioned tackiness, then can use in the molecule and have 1 at least, common 1～10, best about 2～6 Si-H base (promptly, on the Siliciumatom in conjunction with hydrogen atom), and/or alkenyl, and the epoxy group(ing) that contains glycidoxy etc., trimethoxysilyl, triethoxy-silicane, the alkoxysilyl of methyl dimethoxy oxygen base silyl etc., ester group, acrylic, methacrylic acid group, anhydride group, isocyanate group, amino, the Siliciumatom more than a kind or 2 kinds several 1～30 of amide group, preferred 2～20, the silicoorganic compound of about 4～10 straight chain shape or cyclic organo-siloxane oligopolymer or organoalkoxysilane etc. most preferably.
Specifically, as containing epoxy group(ing), the alcoxyl silyl, alkenyl, amino, anhydride group, acrylic, the compound of methacrylic acid group, for example, can enumerate glycidyl allyl ether etc. has the non-silicon series organic compound of alkenyl and epoxy group(ing), γ-glycidoxypropyltrime,hoxysilane, β-(3, the 4-epoxycyclohexyl) ethyl trimethoxy silane etc. contains ring and contains functionality base organoalkoxysilane, vinyltrimethoxy silane, vinyltriethoxysilane, vinyl three (methoxy ethoxy) silane etc. contains the organoalkoxysilane of alkenyl, the gamma-amino propyl trimethoxy silicane, γ-An Jibingjisanyiyangjiguiwan, N-β (amino-ethyl)-gamma-amino propyl trimethoxy silicane, N-β (amino-ethyl)-gamma-amino propyl group methyl dimethoxysilane, N-phenyl-gamma-amino propyl trimethoxy silicane etc. contains the organoalkoxysilane system of amino organoalkoxysilane etc., in addition, can be listed below the compound of stating as the organo-siloxane oligopolymer.
[changing 2]
(n is 1～4)
[changing 3]
(n is 1～4)
In addition, as (C) composition tackiness give composition, contain the phenylene skeleton in the molecule shown in can being listed below, have the epoxy group(ing) of being selected from least, 2 functional groups' of alkenyl, hydroxyl non-silicon series organic compound or silicoorganic compound.
[changing 4]
(R is hydrogen atom or C
1～C
3Alkyl, m is 0 or 1～16 integer)
[changing 5]
(n is 1～4)
[changing 6]
(n is 1～4, and P is 2～30, R
1As hereinbefore)
[changing 7]
[in the formula, X is
Y is following
(n＝1～4)
Or
R ' is selected from following base,
R’：
-O-CH
2CH
2CH
2-，-CH
2CH
2CH
2-，-OCH
2CH
2CH
2O-
R
w, R
xBe displacement or non-metathetical monovalence alkyl, q=1～50, h=0～100, preferred q=1～20, h=1～50).R " be to be selected from following base,
[changing 8]
-O-，-CH
2-，
(R
w, R
xSame as described above, y=0～100)
Y ' is
[changing 9]
(n=1～4) or
(R
w, R
x, q, h is same as described above), z=1～10]
In addition, above-claimed cpd also can use the alkoxysilyl that contains trimethoxysilyl, triethoxysilyl, methyl dimethoxy oxygen base silyl etc., the organic compound or the silicoorganic compound of acrylic, methacrylic acid group, ester group, anhydride group, isocyanate group, amino, amide group etc.
In addition, as above-mentioned R
w, R
xDisplacement or non-metathetical monovalence alkyl, can enumerate C
1～C
12C most preferably
1～C
8Alkyl, alkyl, aryl, aralkyl, alkenyl etc., with R
1In addition cited identical alkyl, can be enumerated with metathetical alkyl such as alkoxyl group, acrylic, methacrylic acid group, acryl, methacryloyl, amino, alkoxyl groups as displacement monovalence alkyl.
As the organic compound or the silicoorganic compound that have 1 ester group in the molecule at least, as long as it can be any that ester group is arranged, there is not particular restriction, it can be the compound that has 1 aliphatics unsaturated group in the molecule at least, can also be silicon atoms not in the molecule, most preferably not contain the compound of silica alkyl structure.For example, can enumerate butyl acrylate, Octyl acrylate, the alkyl of dodecylacrylate etc. is an acrylic acid series ester class, phenyl acrylate, benzyl acrylate, vinylformic acid 2-ethyl phenolic ester etc. has the acrylic acid series ester class of aromatic nucleus, alkyl system or the metha crylic ester class of aromatic nucleus is arranged, alkyl is or the aromatic nucleus vinylacetic acid is arranged is the ester class, the allyl ester class of alkyl system, have by phenylformic acid, terephthalic acid, tetrahydrochysene O-phthalic ester, the allyl ester class of Pyromellitic Acid deutero-aromatic nucleus, by other vinyl carbinols, the ester class of the saturated polycarboxylic acid of methallyl alcohol deutero-or the ester class of unsaturated polycarboxylic acid, the propenyl silicane, methylpropenyl silicane etc.Preferred acrylic acid series ester class or by unsaturated monohydroxy-alcohol deutero-allyl ester class.The aliphatics unsaturated group is most preferably at molecule chain end.
In addition, this tackiness is given composition can use mentioned component separately, also can and use mentioned component.Can also use the reactant of mentioned component.
(C) use level of composition can be 0.1～50 weight part with respect to (A) composition 100 weight parts, during use level less than 0.1 weight part, can not obtain sufficient tackiness, when surpassing 50 weight parts, might cause that rerum natura reduces.It most preferably is 0.2～30 weight part.
Except that above-mentioned composition, also can be added with and (A) silicoorganic compound of the non-siloxane backbone that mixes of composition in order to improve tackiness, for example, can enumerate and contain phenyl silicone oil, fluorosilicon oil, silicon modification perfluoroalkyl ether compound, polyether modified silicon oil, amino-modified silicone oil, acid amides modified silicon oil, urethane-modified silicone oil etc.
Silicone adhesive composition of the present invention, except mentioned component, can add various additives as required, for example, can add titanium oxide, ferric oxide, cerium oxide, palladous oxide, cobalt oxide, chromic oxide, the metal oxide of manganese oxide etc. and mixture thereof, silica powder, diatomite, lime carbonate, magnesiumcarbonate, aluminum oxide, carbon, hollow glass fibre, gold, silver, copper etc. have the inorganic powder of electroconductibility, the inorganic filler of plating powder etc. can also not add pigment so long as do not destroy desired characteristic, heat-resistant agent, fire retardant, softening agent, reaction control agent etc.Moreover the addition of these any compositions can be common amount in the scope that does not influence effect of the present invention.
Silicone adhesive composition of the present invention, only with above-mentioned (A)～(C) composition, arbitrarily composition at normal temperatures uniform mixing then can make.Preferably (B) composition with except (II) composition of (A) composition, or (b) composition beyond composition, (c) composition uses the thermal treatment 1～4 hour in 100～200 ℃ scope of planet mixing machine or kneader, also can add above-mentioned treatment agent this moment.Then, at room temperature or (b), with (II) composition of (A) composition (c) composition and (C) composition mixed composition.
Forming method can freely be selected according to the viscosity of mixture, can adopt injection moulding, any methods such as compressed moulding, distribution moulding, injection molding, extrusion moulding, transfer mould moulding.Its condition of cure can carry out hot briquetting usually in 60～200 ℃ of following scopes of 10 seconds～24 hours.
Silicone adhesive composition of the present invention is used for the movably electrical equipment that mobile phone, mobile communication equipment, portable computer parts, game machine, clock and watch, image receiver, DVD player, MD machine, CD player select, the moving body of this class of communication equipment.Especially be suitable for bonding to the moving body parts selected in the key mat portion in the moving body, sealing, waterproof gasket, spacer, the film loudspeaker.Be suitable as most in these moving body parts, use by the membranaceous or film-like members that thermoplastic resin forms.
The moving body thermoplastic resin that the present invention uses can be enumerated the thermoplastic resin of common olefinic polymerization system or polycondensation system etc.Specifically, use acrylonitrile-butadiene-styrene (ABS) (ABS) resin, polycarbonate (PC) resin, urethane (PU) resin, styrene resin, polyvinyl resin, acrylic resin, acrylic resin, polyethylene terephthalate (PET) resin, polybutylene terephthalate (PBT) resin, polyphenylene oxide resin, polyphenylene sulfide, polysulfone resin, nylon resin, aromatic polyamide resin, polyimide resin, liquid crystalline resin etc., or the resin of the mixture of these resins or arborescens, membranaceous, film like.Moreover during this situation, thickness is 0.001～3mm, preferred 0.01～2mm, most preferably 0.01～1mm.
The method of carrying out moulding as the above-mentioned uncured rubber composition one of on above-mentioned thermoplastic resin, such composition being made, can enumerate and uncured rubber composition is made desired shape be loaded on the preformed thermoplastic resin, dissolve the method that heats under the temperature of temperature being lower than thermoplastic resin, uncured rubber composition is loaded on the preformed thermoplastic resin, be lower than the method for compressing under the thermoplastic resin fused temperature, use injection moulding machine earlier thermoplastic resin to the mold injects moulding, inject the method etc. of uncured rubber composition then at this mould internal heating.Generally can use the machine that is called injection moulding machine, transfer mould shaper.And carry out integrated situation with membranaceous resin, after film is molded into definite shape, with injector or discharge machine easily or manual metering is loaded in the uncured rubber composition of necessary amount on the part that needs, with mould part clamp, or the finishing shape is cured.
On the other hand, rubber composition also can be any state of liquid, putty-like, pasty state under uncured state, but is conceived to easy moulding preferred liquid shape or pasty state.
In addition, the condition of cure of silicone adhesive composition of the present invention, in order to present and the firm tackiness of thermoplastic resin, must be indeformable, do not dissolve, the temperature of not modification, carry out in set time at resin.Though depend on the kind of resin, descended about 0.2～30 minute at 60～170 ℃, especially can obtain one-body molded body under the condition of cure about 0.4～10 minute.
[invention effect]
The invention provides when the one-body molded body of rubber composition that obtains the moving body use and thermoplastic resin, but moulding in the short period of time, the silicone adhesive composition good with the tackiness of the thermoplastic resin that is applicable to no base paint moulding.This silicone adhesive composition, non-stickingly connecing mold for forming and do not make the thermoplastic resin shifting ground bonding, is the composition of manufacturing of key mat portion, sealing, waterproof gasket, spacer, wafer speaker, other circumferential component of the movably electrical equipment that is used for mobile phone, mobile communication equipment, portable computer parts, game machine, clock and watch, image receiver etc., communication equipment.
[embodiment]
Below, enumerate embodiment and comparative example, but the invention is not restricted to following embodiment.Moreover the part in each example all is weight parts.
[silicone adhesive composition preparation example 1]
Use as (a) composition in (A) composition two end be 100 parts of the dimethyl polysiloxanes of 10000cps, the specific surface area 200m of conduct (B) composition fine silica with the end capped 25 ℃ viscosity of dimethyl vinylsiloxane base respectively
240 parts of the pyrolytic silicon dioxides of/g with respect to 8 parts of 100 parts of addings of (a) composition hexamethyl silazane, behind the cooperation uniform mixing, mix getting the silicon rubber base-material in 1 hour again 150 ℃ of heating in mediating mixing machine.10 parts of the dimethyl hydrogen diene polysiloxane that adding is represented as the following formula (4) of (b) composition in remaining (A) composition in this silicon rubber base-material,
[changing 10]
Formula (4)
As 0.1 part of the 1%2-ethylhexanol solution of the Platinic chloride of (c) composition, 50% ethanolic soln of the ethynylcyclohexanol of adding conduct reaction control agent is 0.05 part again, again the organic compound or the silicoorganic compound of following (I)～(VI) expression of giving composition as the tackiness of (C) composition are mixed equably, make silicone adhesive composition.
[silicone adhesive composition preparation example 2]
Use as two ends of (I) composition in (A) composition use 100 parts of the dimethyl polysiloxanes of the end capped mean polymerisation degree 10000 of dimethyl ethene siloxanes respectively, as the specific surface area 200m of the fine silica of (B) composition
240 parts of the pyrolytic silicon dioxides of/g add 8 parts of hexamethyldisilazanes for 100 parts with respect to (I) composition, behind the cooperation uniform mixing, mix making the silicon rubber base-material in 1 hour again 150 ℃ of heating in mediating mixing machine.In this silicon rubber base-material, add peroxidation 2 as the crosslinking catalyst composition, 3 parts of 4-diisopropylbenzene(DIPB)s, uniform mixing is given the organic compound or the silicoorganic compound composition of following (I)～(VI) expression of composition as the tackiness agent of (C) composition again, makes silicone adhesive composition.
(C) composition
(I) Phthalic acid, diallyl ester
(II) Pyromellitic Acid tetraene propyl ester
[changing 11]
(III)
(IV) KBE9007 (γ-isocyanate group propyl-triethoxysilicane: chemical industrial company of SHIN-ETSU HANTOTAI system, trade(brand)name)
[changing 12]
[embodiment 1]
Use general polycarbonate resin (PC) respectively as the number-average molecular weight of preformed thermoplastic resin about 10,000, the pet resin (PET) of number-average molecular weight about 20,000, urethane resin (PU), each resin sheet of ABS resin, measure-alike chrome-plated metal plate, PC as resins in film form, PET, PU, polyimide, the resin sheet sheet material of thick 2mm * wide 25mm * long 100mm, measure-alike chrome-plated metal plate, the film like sheet material of thick 0.1mm * wide 25mm * long 100mm, be fixed on and make on the sheet material tensile shear adhesive test plate clamp mould, make the silicone adhesive composition that cooperates tackiness to give 5 parts of preparation examples that make 2 of composition (V) flow into this mould in right amount, use 120 ℃ extrusion forming heating to make it in 10 minutes to solidify.Use the test film that makes in this wise to measure tackiness according to the method for JIS K6850.
[embodiment 2]
Use the resin identical with embodiment 1, the film like sheet material of the resin sheet sheet material of thick 2mm * wide 25mm * long 100mm, measure-alike chrome-plated metal plate, thick 0.1mm * wide 25mm * long 100mm, be fixed on and make on the sheet material tensile shear adhesive test plate clamp mould, make the silicone adhesive composition that cooperates tackiness to give 5 parts of preparation examples that make 1 of composition (I) flow into the stream anchor clamps in right amount, adopt 120 ℃ extrusion forming heating to make it in 10 minutes to solidify.Use the test film that makes in this wise to measure tackiness according to the method for JIS K6850.
[embodiment 3]
Use the resin identical with embodiment 1, the film like sheet material of the resin plate of thick 2mm * wide 25mm * long 100mm, measure-alike chrome-plated metal plate, thick 0.1mm * wide 25mm * long 100mm, be fixed on and make on the sheet material tensile shear adhesive test plate clamp mould, make the silicone adhesive composition that cooperates tackiness to give the composition preparation example that (II) makes 1 suitably flow into these anchor clamps, adopt 120 ℃ extrusion forming pressurization to make it in 10 minutes to solidify.Use the test film that makes in this wise to measure tackiness according to the method for JIS K6850.
[embodiment 4]
Use the resin identical with embodiment 1, the film like sheet material of the resin sheet sheet material of thick 2mm * wide 25mm * long 100mm, measure-alike chrome-plated metal plate, thick 0.1mm * wide 25mm * long 100mm, be fixed on and make on the sheet material tensile shear adhesive test plate clamp mould, make the silicone adhesive composition that cooperates tackiness to give 5 parts of preparation examples that make 1 of composition (III) flow into these anchor clamps in right amount, adopt 120 ℃ extrusion forming heating to make it in 10 minutes to solidify, use the test film that makes in this wise, measure tackiness according to the method for JIS K6850.
[experimental example 5]
Use the resin identical with embodiment 1, the film like sheet material of the resin sheet sheet material of thick 2mm * wide 25mm * long 100mm, measure-alike chrome-plated metal plate, thick 0.1mm * wide 25mm * long 100mm, be fixed on and make on the sheet material tensile shear adhesive test plate clamp mould, make the silicone adhesive composition that cooperates tackiness to give 5 parts of preparation examples that make 1 of composition (IV) flow into these anchor clamps in right amount, adopt 120 ℃ extrusion forming to heat 10 minutes, make it to solidify.Use the test film that makes in this wise to measure tackiness according to the method for JIS K6850.
[experimental example 6]
Use the resin identical with embodiment 1, the film like sheet material of the resin sheet sheet material of thick 2mm * wide 25mm * long 100mm, measure-alike chrome-plated metal plate, thick 0.1mm * wide 25mm * long 100mm, be fixed on and make on the sheet material tensile shear adhesive test plate clamp mould, make the silicone adhesive composition that cooperates tackiness to give 5 parts of preparation examples that make 1 of composition (V) flow into these anchor clamps in right amount, adopt 120 ℃ extrusion forming to heat 10 minutes, make it to solidify.Use the test film that makes in this wise, measure tackiness according to the method for JIS K6850.
[experimental example 7]
Use the resin identical with embodiment 1, the film like sheet material of the resin sheet sheet material of thick 2mm * wide 25mm * long 100mm, measure-alike chrome-plated metal plate, thick 0.1mm * wide 25mm * long 100mm, be fixed on and make on the sheet material tensile shear adhesive test plate clamp mould, make the silicone adhesive composition that cooperates tackiness to give 5 parts of preparation examples that make 1 of composition (VI) flow into these anchor clamps in right amount, adopt 120 ℃ extrusion forming to heat 10 minutes, make it to solidify.Use the test film that makes in this wise to measure tackiness according to the method for JIS K6850.
[experimental example 8]
Use the resin identical with embodiment 1, the film like sheet material of the resin sheet sheet material of thick 2mm * wide 25mm * long 100mm, measure-alike chrome-plated metal plate, thick 0.1mm * wide 25mm * long 100mm, be fixed on and make on the sheet material tensile shear adhesive test plate clamp mould, make cooperate respectively tackiness give composition (II) and (III) silicone adhesive composition of 2.5 parts of preparation examples that make 1 suitably flow into these anchor clamps, adopt 120 ℃ extrusion forming to heat 10 minutes, make it to solidify.Use the test film that makes in this wise, measure tackiness according to the method for JIS K6850.
[comparative example 1]
Use the resin identical with embodiment 1, the film like sheet material of the resin sheet sheet material of thick 2mm * wide 25mm * long 100mm, measure-alike chrome-plated metal plate, thick 0.1mm * wide 25mm * long 100mm, being fixed on sheet material tensile shear adhesive test sheet makes on the jig plate, make and do not add that tackiness is given composition and the silicone adhesive composition of the preparation example 1 that makes flows into these anchor clamps in right amount, adopt 120 ℃ extrusion forming to heat 10 minutes, make it to solidify.Use the test film that makes in this wise to measure tackiness according to the method for JIS K6850.
[comparative example 2]
Use the resin identical with embodiment 1, the film like sheet material of the resin sheet sheet material of thick 2mm * wide 25mm * long 100mm, measure-alike chrome-plated metal plate, thick 0.1mm * wide 25mm * long 100mm, being fixed on sheet material tensile shear(ing) test sheet makes on the jig plate, make and do not add that tackiness is given composition and the silicone adhesive composition of the preparation example 2 that makes flows into these anchor clamps in right amount, adopt 120 ℃ extrusion forming to heat 10 minutes, make it to solidify.Use the test film that makes in this wise to measure tackiness according to the method for JIS K6850.
The tackiness evaluation result of the foregoing description 1～8 and comparative example 1,2 is shown in table 1.
Assessment item
Adhesive test condition: the adhesive test of JIS K6850 tensile shear, bonding 25kgf/cm
2More than.
[table 1]
| Composition (weight part) | Embodiment 1 | Embodiment 2 | Embodiment 3 | Embodiment 4 | Embodiment 5 | Embodiment 6 | Embodiment 7 | Embodiment 8 | Comparative example 1 | Comparative example 2 |
| Preparation of compositions example 1 | ??100 | ??100 | ???100 | ???100 | ???100 | ???100 | ???100 | ??100 | ||
| Preparation of compositions example 2 | ??100 | ??100 | ||||||||
| (C) tackiness is given composition | ||||||||||
| (I) | ??5 | |||||||||
| (II) | ??5 | ???2.5 | ||||||||
| (III) | ???5 | ???2.5 | ||||||||
| (IV) | ???5 | |||||||||
| (V) | ??5 | ???5 | ||||||||
| (VI) | ???5 | |||||||||
| Tabular resin adhesiveness | ||||||||||
| PC | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Peel off | Peel off |
| PU | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Peel off | Peel off |
| PET | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Peel off | Peel off |
| ABS | Peel off | Peel off | Peel off | Peel off | Peel off | Peel off | Peel off | Adhesion | Peel off | Peel off |
| Chromium plating (mould) | Peel off | Peel off | Peel off | Peel off | Peel off | Peel off | Peel off | Peel off | Peel off | Peel off |
| The resins in film form tackiness | ||||||||||
| PC | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Peel off | Peel off |
| PET | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Peel off | Peel off |
| PU | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Peel off | Peel off |
| PI | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Adhesion | Peel off | Peel off |
Result by table 1 finds out, silicone adhesive composition of the present invention, but the short period of time solidify, resin is indeformable, distortion also do not occur with each tabular resin, resins in film form are bonding securely, can obtain good one-body molded body.And mold releasability might as well.
Claims (12)
1. the moving body silicone adhesive composition is characterized in that containing
(A) thermohardening type organopolysiloxane composition 100 weight parts
(B) reinforcement fine silica 1～100 weight part
(C) tackiness is given composition 0.1-50 weight part.
2. the described moving body silicone adhesive composition of claim 1, wherein, to give composition be to contain organic compound or the silicoorganic compound that are selected from epoxy group(ing), alcoxyl silyl, acrylic, methacrylic acid group, ester group, anhydride group, isocyanate group, amino and the amide group base more than a kind or 2 kinds in (i) molecule to the tackiness in the silicone adhesive composition.
3. the described moving body silicone adhesive composition of claim 1, wherein, to give composition be (ii) to have 1 Si-H base and/or alkenyl in molecule at least and contain organic compound more than a kind or 2 kinds or the silicoorganic compound that are selected from epoxy group(ing), alcoxyl silyl, acrylic, methacrylic acid group, ester group, anhydride group, isocyanate group, amino and the amide group to the tackiness in the silicone adhesive composition.
4. the described moving body silicone adhesive composition of claim 1, wherein, it is (iii) to have 1 Si-H base and/or alkenyl at least in a molecule that tackiness in the silicone adhesive composition is given composition, and has the organic compound of at least 1 phenylene skeleton or phenyl or the silicoorganic compound of Siliciumatom several 1～100.
5. the described moving body silicone adhesive composition of claim 1, wherein, it is (iv) to have 1 ester group at least in a molecule that tackiness in the silicone adhesive composition is given composition, has the organic compound or the silicoorganic compound of 1 aliphatics unsaturated group in the molecule at least.
6. the described moving body silicone adhesive composition of claim 1, wherein, the tackiness in the silicone adhesive composition is given composition and is
(i) contain the organic compound or the silicoorganic compound of base more than a kind or 2 kinds that are selected from epoxy group(ing), alcoxyl silyl, acrylic, methacrylic acid group, ester group, anhydride group, isocyanate group, amino and the amide group in molecule,
(ii) have 1 Si-H base and/or alkenyl in molecule at least and contain the organic compound or the silicoorganic compound of base more than a kind or 2 kinds that are selected from epoxy group(ing), alcoxyl silyl, acrylic, methacrylic acid group, ester group, anhydride group, isocyanate group, amino and the amide group
(iii) have 1 Si-H base and/or alkenyl in molecule at least and have the organic compound of at least one phenylene skeleton or phenyl or the silicoorganic compound of Siliciumatom several 1～100,
(iv) have 1 ester group at least in a molecule, have at least the tackiness of (i)～(iv) of the compound of 1 aliphatics unsaturated group or silicoorganic compound to give among the composition in the molecule, the tackiness more than 2 kinds is given the composition of composition combination.
7. the described moving body silicone adhesive composition of any one of claim 1～6, wherein, (A) the thermohardening type organopolysiloxane composition of composition is an addition reaction curing organopolysiloxane composition.
8. the described moving body silicone adhesive composition of any one of claim 1～6, wherein, (A) the thermohardening type organopolysiloxane composition of composition is the organic peroxide curing type organopolysiloxane composition.
9. the described moving body silicone adhesive composition of any one of claim 1～6, wherein, moving body is movably electrical equipment, the communication equipment that is selected from mobile phone, mobile communication equipment, portable computer parts, game machine, clock and watch, image receiver, DVD player, MD machine, the CD player.
10. the described silicone adhesive composition of claim 9, wherein, it is to be used for bonding to the movable member that is selected from key mat portion, sealing, waterproof gasket, spacer, wafer speaker.
11. the described silicone adhesive composition of claim 10, wherein, the moving body member is the membranaceous or film like member that thermoplastic resin forms.
12. the one-body molded body of the membranaceous or film like moving body member that the cured article of the described silicon rubber sizing composition of any one of claim 1～6 and thermoplastic resin form.
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| JP2008218864A (en) * | 2007-03-07 | 2008-09-18 | Denso Corp | Multi-layer type piezoelectric element |
| JP5105052B2 (en) * | 2007-04-20 | 2012-12-19 | Ｎｅｃカシオモバイルコミュニケーションズ株式会社 | Manufacturing method of electronic device casing and structure of electronic device casing |
| DE102007024099A1 (en) * | 2007-05-22 | 2008-11-27 | Evonik Degussa Gmbh | adhesives |
| JP5541025B2 (en) * | 2009-10-05 | 2014-07-09 | 信越化学工業株式会社 | Addition-curing self-adhesive silicone rubber composition |
| WO2015194158A1 (en) * | 2014-06-20 | 2015-12-23 | 東レ・ダウコーニング株式会社 | Silicone exhibiting hot-melt properties, and curable hot-melt composition |
-
2003
- 2003-05-08 JP JP2003129769A patent/JP2004331820A/en active Pending
-
2004
- 2004-05-07 KR KR1020040032105A patent/KR20040095702A/en not_active Application Discontinuation
- 2004-05-07 TW TW093112927A patent/TW200427808A/en unknown
- 2004-05-08 CN CNA200410038647XA patent/CN1550536A/en active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101179614B (en) * | 2007-06-08 | 2010-09-22 | 青岛海信移动通信技术股份有限公司 | Mobile phone with waterproof keyboard |
| CN101679833B (en) * | 2007-06-21 | 2012-07-25 | 丰田自动车株式会社 | Adhesive silicone rubber composition and separator seal material for fuel cells |
| CN104524707A (en) * | 2007-08-31 | 2015-04-22 | 3M创新有限公司 | Respiratory protection composite facepiece and method of forming same |
| CN103448186A (en) * | 2013-01-24 | 2013-12-18 | 际华三五零二职业装有限公司 | Glove glue implanting method |
| CN103450840A (en) * | 2013-01-24 | 2013-12-18 | 际华三五零二职业装有限公司 | Preparation method of silica gel for glove plant gum |
| CN110637069A (en) * | 2017-08-07 | 2019-12-31 | 日东电工株式会社 | Adhesive layer, optical film with adhesive layer, optical laminate, and image display device |
| CN112011309A (en) * | 2020-09-04 | 2020-12-01 | 忍嘉有机硅新材料(东莞)有限公司 | Self-adhesive liquid silicone rubber for bonding PC and PA and preparation method thereof |
| CN114015353A (en) * | 2021-12-14 | 2022-02-08 | 深圳市康利邦科技有限公司 | Primer coating for improving bonding strength of silicone rubber and PPSU and preparation method thereof |
| CN114015353B (en) * | 2021-12-14 | 2022-11-11 | 深圳市康利邦科技有限公司 | Primer coating for improving bonding strength of silicone rubber and PPSU and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2004331820A (en) | 2004-11-25 |
| TW200427808A (en) | 2004-12-16 |
| KR20040095702A (en) | 2004-11-15 |
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