CN1549058A - Apparatus and method for preventing backsputtering - Google Patents
Apparatus and method for preventing backsputtering Download PDFInfo
- Publication number
- CN1549058A CN1549058A CNA031378323A CN03137832A CN1549058A CN 1549058 A CN1549058 A CN 1549058A CN A031378323 A CNA031378323 A CN A031378323A CN 03137832 A CN03137832 A CN 03137832A CN 1549058 A CN1549058 A CN 1549058A
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- substrate
- liquid
- baffle plate
- prevents splash
- spinner
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- Cleaning Or Drying Semiconductors (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
Abstract
The back sputtering preventing device is used in the yellow light irradiation process of panel or substrate to prevent the liquid dropping to the surface of the substrate or panel from back sputtering to the substrate or panel after being painted and sputtered to the periphery. The back sputtering will cause faults in the pattern making process with yellow light irradiation and inferior product quality. The back sputtering preventing device includes mainly one rotating unit, at least one liquid spraying unit, one baffle encircling at least one part of the rotating unit and one roughening unit. The back sputtering preventing method is also revealed.
Description
Technical field
The invention relates to a kind of apparatus and method that prevent splash, refer to a kind of being applicable in development (Developer) or washing (Scrubber) manufacturing process especially, prevent the apparatus and method of developer solution or water splash.
Background technology
During general manufacturing membrane transistor LCD (TFT-LCD), must make the pattern of membrane transistor earlier on clean glass plate, its manufacturing process is with generally semiconductor manufacture flow path is very similar.At first want Shen to amass film, for example metal film or dielectric film; Enter the gold-tinted chamber then and spray photoresistance liquid, put light shield again and expose: then deliver to the district's spray developing liquid that develops,, make the photoresist layer typing with the photoresistance behind the removal irradiation; The last film that will expose with etching is again removed, and after etching the photoresistance that stays is removed, and electric crystal circuitry needed pattern just completes.
The mode of developing has a variety of: the general employing is sprayed at developer solution on the substrate that places spinner, as shown in Figure 2, developing machine platform 100 is for preventing liquid splash, thereby one section about ten centimeters baffle plate 121 being arranged in the design of enclosing cover 120 (Outercup) upper limb of spinner 110 peripheries, baffle plate 121 is for to make with the smooth stainless steel in enclosing cover 120 integrated planes.Under this kind design, developer solution is when spinner 110 high speed rotating, though can be by stainless steel enclosing cover retaining down, can not spatter to the developing machine platform outside, but under the high velocity impact of developer solution 130 and stainless steel baffle plate 121, the developer solution that has a part again splash to substrate, shown in arrow 131.Cause the acceptance rate of product to descend, this kind situation is more apparent serious under the situation of substrate attenuation, and the angle that the edge is risen and fallen because of substrate is bigger, shown in double-head arrow 132, makes splash even more serious.For example the glass that its splash degree of the glass that 0.63mm is thick is just thick than 0.70mm is serious.
In addition, in washing (Scrubber) board, often have when cleaning the back and be spin-dried at a high speed, deionized water (DI-water) splash is to substrate surface, causes aqueous vapor residual and influence the yield of plated film character or back manufacturing process or the situation of fiduciary level reduction.
Summary of the invention
Fundamental purpose of the present invention is, a kind of device that prevents splash is provided, and can prevent the liquid splash to substrate surface, and improves the yield and the fiduciary level of product.
Another object of the present invention is, a kind of method that prevents splash is provided, and can prevent the liquid splash to substrate surface, and improves the yield and the fiduciary level of product.
For achieving the above object, a kind of device that prevents splash provided by the invention is to cooperate a substrate, mainly comprises:
One spinner is in order to ccontaining and rotate this substrate;
At least one spray liquid unit is positioned at a side of this spinner, in order to spray a liquid to this substrate;
At least one baffle plate around this spinner of part spills in order to prevent this liquid;
One roughening unit is to be coated on this baffle plate of part, in order to prevent that this liquid is by this baffle plate splash.
The described device that prevents splash, wherein this substrate is Silicon Wafer, panel or glass plate.
The described device that prevents splash, wherein this liquid is water or developer solution.
The described device that prevents splash, wherein this baffle plate is a corrosion resistant plate.
The described device that prevents splash, wherein this roughening unit is sponge, stainless (steel) wire or coarse stainless steel surfaces.
The described device that prevents splash, it is applicable to developing machine platform (Developer) or washing board (Scrubber).
For achieving the above object, a kind of method that prevents splash provided by the invention is to cooperate a substrate, mainly may further comprise the steps:
(A) provide a manufacturing process board, this manufacturing process board comprises
One spinner is in order to rotate this substrate;
One spray liquid unit is positioned at a side of this spinner, in order to spray a liquid to this substrate;
One baffle plate around this spinner of part spills in order to prevent this liquid;
(B) with the surface roughening of this baffle plate.
The described method that prevents splash, wherein this manufacturing process board is developing machine platform (Developer) or washing board (Scrubber).
The described method that prevents splash, wherein this substrate is Silicon Wafer, panel or glass plate.
The described method that prevents splash, wherein this liquid is water or developer solution.
The described method that prevents splash, wherein this baffle plate is a corrosion resistant plate.
The described method that prevents splash, wherein the method for step (B) is this baffle surface that rubs with steel mesh.
The described method that prevents splash, wherein step (B) more comprises installing one roughening unit in this baffle plate outside.
The described method that prevents splash, wherein this roughening unit is sponge or stainless (steel) wire.
Substrate in apparatus of the present invention or the method is unrestricted, can be any known substrate, is preferably Silicon Wafer, panel or glass plate.Liquid in apparatus of the present invention or the method is unrestricted, can be any known liquid, and being preferably this liquid is water or developer solution.Baffle plate in apparatus of the present invention or the method is unrestricted, can be any known baffle plate, and being preferably this baffle plate is corrosion resistant plate.
Roughening unit in apparatus of the present invention or the method is unrestricted, can be any known roughening unit, and being preferably this roughening unit is sponge, stainless (steel) wire or coarse stainless steel surfaces.The machine that is suitable in apparatus of the present invention or the method is unrestricted, can be any known machine, is preferably to be applicable to developing machine platform (Developer) or washing board (Scrubber).
The invention has the advantages that, can effectively improve the acceptance rate of product in easy mode.
Description of drawings
Fig. 1 is the synoptic diagram of the developing room of a preferred embodiment of the present invention;
Fig. 2 is known developing room cut-open view.
Embodiment
Technology contents for the clearer explanation invention of energy is described as follows especially exemplified by preferred embodiment.
See also Fig. 1, Fig. 1 is the synoptic diagram of a developing room.Developing room 1 comprises spinner 10, in order to rotary plate 20; Fluid injector 30 be positioned at the side of spinner 10, but spray developing liquid is to substrate 20; The one smooth stainless steel baffle plate 40 in plane around spinner 10 spills developing room in order to prevent developer solution.For improving at existing developing trough structure, to reduce the ratio of developer solution splash, in the present embodiment, the stainless (steel) wire 50 of thickness between 1mm～20mm is coated on the baffle plate 40, utilizes the filtering membrane principle, fluid molecule easily advances to be difficult for, even and have splash also can make fluid molecule reduce volume and acting force because of secondary impact, and divide the submode bounce-back with particulate, allow the interior air extractor of developing machine platform take away, to reduce developer solution by the probability of baffle plate 40 splash to substrate 20.Measure the front and back situation that stainless (steel) wire 50 is coated in baffle plate 40, the loss of yield that causes because of the developer solution splash compares, and it the results are shown in following table 1:
Table 1
| The developing room barrier wall structure | Loss of yield |
| Former stainless steel barricade | 0.11％ |
| Install stainless (steel) wire additional | 0.01％ |
So install the surfaceness that stainless (steel) wire 50 can increase baffle plate 40 really additional, and reduce the ratio of fluid molecule and its surface generation perfectly elastic impact.Except that the stainless (steel) wire 50 that present embodiment uses, any material that increases baffle plate 40 surfacenesses, chemical-resistant resistance etc. all can be used; For example also can use sponge.Or directly make baffle plate 40 surface roughenings, allow clash into produce elastic collision, and splash is to substrate surface to the developer solution molecule of baffle surface is difficult.Wherein, the method for surface roughening, for example can knock for machinery, spray hit, mode such as the surface sprays, friction or chemical etching.
In addition, except that above-mentioned developing room, the present invention also can be used in the manufacturing process means of the mechanism of spraying liquid spin coating arbitrarily, as washing manufacturing process (Scrtlbber).
The foregoing description only is to give an example for convenience of description, and the interest field that the present invention advocated should be as the criterion so that claim is described certainly, but not only limits to the foregoing description.
Claims (14)
1, a kind of device that prevents splash is to cooperate a substrate, it is characterized in that, mainly comprises:
One spinner is in order to ccontaining and rotate this substrate;
At least one spray liquid unit is positioned at a side of this spinner, in order to spray a liquid to this substrate;
At least one baffle plate around this spinner of part spills in order to prevent this liquid;
One roughening unit is to be coated on this baffle plate of part, in order to prevent that this liquid is by this baffle plate splash.
2, the device that prevents splash according to claim 1 is characterized in that, wherein this substrate is Silicon Wafer, panel or glass plate.
3, the device that prevents splash according to claim 1 is characterized in that, wherein this liquid is water or developer solution.
4, the device that prevents splash according to claim 1 is characterized in that, wherein this baffle plate is a corrosion resistant plate.
5, the device that prevents splash according to claim 1 is characterized in that, wherein this roughening unit is sponge, stainless (steel) wire or coarse stainless steel surfaces.
6, the device that prevents splash according to claim 1 is characterized in that, it is applicable to developing machine platform or washing board.
7, a kind of method that prevents splash is to cooperate a substrate, it is characterized in that, mainly may further comprise the steps:
(A) provide a manufacturing process board, this manufacturing process board comprises
One spinner is in order to rotate this substrate;
One spray liquid unit is positioned at a side of this spinner, in order to spray a liquid to this substrate;
One baffle plate around this spinner of part spills in order to prevent this liquid;
(B) with the surface roughening of this baffle plate.
8, the method that prevents splash according to claim 7 is characterized in that, wherein this manufacturing process board is developing machine platform or washing board.
9, the method that prevents splash according to claim 7 is characterized in that, wherein this substrate is Silicon Wafer, panel or glass plate.
10, the method that prevents splash according to claim 7 is characterized in that, wherein this liquid is water or developer solution.
11, the method that prevents splash according to claim 7 is characterized in that, wherein this baffle plate is a corrosion resistant plate.
12, the method that prevents splash according to claim 7 is characterized in that, wherein the method for step (B) is this baffle surface that rubs with steel mesh.
13, the method that prevents splash according to claim 7 is characterized in that, wherein step (B) more comprises installing one roughening unit in this baffle plate outside.
14, the method that prevents splash according to claim 7 is characterized in that, wherein this roughening unit is sponge or stainless (steel) wire.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03137832 CN1258123C (en) | 2003-05-21 | 2003-05-21 | Apparatus and method for preventing backsputtering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03137832 CN1258123C (en) | 2003-05-21 | 2003-05-21 | Apparatus and method for preventing backsputtering |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1549058A true CN1549058A (en) | 2004-11-24 |
| CN1258123C CN1258123C (en) | 2006-05-31 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03137832 Expired - Fee Related CN1258123C (en) | 2003-05-21 | 2003-05-21 | Apparatus and method for preventing backsputtering |
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| Country | Link |
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| CN (1) | CN1258123C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979238A (en) * | 2014-04-14 | 2015-10-14 | 沈阳芯源微电子设备有限公司 | Anti-splash and anti-adhesion type process cavity of TRACK machine glue evening unit |
| CN108445720A (en) * | 2018-03-26 | 2018-08-24 | 京东方科技集团股份有限公司 | A kind of developing apparatus and developing method |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102534696B (en) * | 2011-11-21 | 2015-05-27 | 灵宝华鑫铜箔有限责任公司 | Improved crude foil engine |
-
2003
- 2003-05-21 CN CN 03137832 patent/CN1258123C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104979238A (en) * | 2014-04-14 | 2015-10-14 | 沈阳芯源微电子设备有限公司 | Anti-splash and anti-adhesion type process cavity of TRACK machine glue evening unit |
| CN104979238B (en) * | 2014-04-14 | 2017-12-15 | 沈阳芯源微电子设备有限公司 | A kind of anti-splash and anti-adhesive type process cavity of TRACK boards spin coating unit |
| CN108445720A (en) * | 2018-03-26 | 2018-08-24 | 京东方科技集团股份有限公司 | A kind of developing apparatus and developing method |
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| Publication number | Publication date |
|---|---|
| CN1258123C (en) | 2006-05-31 |
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Granted publication date: 20060531 Termination date: 20210521 |