CN1544976A - Earthing device and circuit board of liquid crystal display - Google Patents

Earthing device and circuit board of liquid crystal display Download PDF

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Publication number
CN1544976A
CN1544976A CNA2003101135883A CN200310113588A CN1544976A CN 1544976 A CN1544976 A CN 1544976A CN A2003101135883 A CNA2003101135883 A CN A2003101135883A CN 200310113588 A CN200310113588 A CN 200310113588A CN 1544976 A CN1544976 A CN 1544976A
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China
Prior art keywords
circuit board
pcb
printed circuit
lcd
earth terminal
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Granted
Application number
CNA2003101135883A
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Chinese (zh)
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CN1320390C (en
Inventor
游宗熹
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AU Optronics Corp
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AU Optronics Corp
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Priority to CNB2003101135883A priority Critical patent/CN1320390C/en
Publication of CN1544976A publication Critical patent/CN1544976A/en
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Publication of CN1320390C publication Critical patent/CN1320390C/en
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Abstract

The invention is a LCD grounding device, including a glue frame for supporting a LCD panel, and the metallic outer frame covers the glue frame from top to bottom. The circuit board is mounted on the bottom surface of the glue frame and is connected to the LCD panel through a soft bus extending upwards along the side of the glue frame. The conductive film layer adheres to the grounding end of the circuit board and the side of the metallic outer frame to conduct the charges accumulated by the circuit board from the metallic outer frame to the external.

Description

LCD grounding device and circuit board
Technical field
The present invention relates to a kind of LCD grounding device.
Background technology
Along with the thin film transistor (TFT) manufacturing technology is progressive fast, advantages such as LCD is frivolous owing to having possessed, power saving, no width of cloth ray, and a large amount of being applied in the various electronic products such as personal digital aid (PDA), mobile computer, digital camera, Video Camera, mobile phone.In addition, because LCD is a non-self luminous display, be as backlight traditionally with a cold cathode fluorescent lamp, to import the signal interpretation of LCD simultaneously by a liquid crystal display drive circuit, produce shows signal data and scanning sequence data, with the demonstration of each picture element on the control display panels.
Generally speaking, in order to improve the area of viewing area on the display panels, simultaneously, simplify the making flow process of display panels.Liquid crystal display drive circuit directly is not made on the display panels, and normally be made in a printed circuit board (PCB) (Print Circuit Board, PCB) on, collocation such as winding lead-in wire connects (Tape Automated Bounding, TAB), glass flip chip engage (Chip On Glass, COG) or mantle chip bonding (Chip On Film, mode such as COF), be connected with display panels by flexible flat cable again, with input control signal.
In addition, disturb in order to prevent that the external environment noise from producing for liquid crystal display drive circuit, to guarantee the correctness of input panel control signal.On printed circuit board (PCB), must make the appropriate insulation protective film, with isolated this extraneous neighbourhood noise.Simultaneously, in operation, residual charge accumulates on the printed circuit board (PCB) for fear of liquid crystal display drive circuit, and the control signal of display panels is produced interference, on printed circuit board (PCB), need increase by an earthing device, to get rid of charges accumulated.
Please refer to Fig. 1, show the package assembly of a typical liquid crystal 10, comprise a metal outer frame 100, a glue frame 200, a display panels 300 and a printed circuit board (PCB) 400.Display panels 300 is to be assembled in this glue frame 200 corresponding upper and lower surfaces respectively with printed circuit board (PCB) 400, and interconnect by flexible flat cable 410, and metal outer frame 100 is the outsides that from top to bottom are sleeved on this glue frame 200, and forms a space to hold display panels 300.
In order to prevent on the printed circuit board (PCB) 400, because of the electric charge accumulation influences its normal operation, please refer to Fig. 2, be adjacent to the dual-side 400b of metal outer frame 100 at this printed circuit board (PCB) 400, be manufactured with a ground terminal 430 respectively.Please be simultaneously with reference to Fig. 1, this ground terminal 430 is to be locked on the glue frame 200 by a circuit board screw 435, simultaneously, by a grounding elastic part 440, is electrically connected to metal outer frame 100.And this grounding elastic part 440 is by a side ground connection screw (not icon), is locked on a screw hole 460 that is made on the metal outer frame 100 and thinks fixing.
As mentioned above, in known techniques,, must increase assemblies such as ground terminal 430, grounding elastic part 440, circuit board screw 435 and side ground connection screw in order to reach purpose with printed circuit board ground, cause in assembling process, also must expend suitable time and labour.In addition, get loose, influence the firm of earthing device in order to prevent screw, prevent simultaneously in the screw locking process, to these LCD 10 other comparatively fragile assemblies, such as: metal outer frame 100 and printed circuit board (PCB) 400, damage, therefore, must suitably control the dynamics of screw locking.With regard on the general processing procedure, typically use a ft lbf calibration equipment and detect, the poundage of control screw locking within the specific limits, to guarantee the fiduciary level of processing procedure.Based on above-mentioned all,, simultaneously, also cause the increase of cost of manufacture except causing expending of 10 Production Times of LCD.
In view of this, the present invention reduces required grounding assembly quantity by the design that improves printed circuit board (PCB) 400 earthing device, and assembles the required time of this earthing device, still keeps desirable ground connection effect simultaneously.
Summary of the invention
Fundamental purpose of the present invention provides a kind of designs simplification, and reduces the LCD grounding device and the circuit board of built-up time.
Above-mentioned purpose of the present invention is realized by following technical scheme.
A kind of LCD earthing device comprises:
One display panels;
One glue frame is in order to carry this display panels;
One metal outer frame is from top to bottom to be sleeved on outside this glue frame, and, form a space to hold this display panels;
One circuit board is the lower surface that is assembled in this glue frame, and, by being connected to this display panels along the upwardly extending flexible flat cable of this glue frame side; It is characterized in that:
One conductivity type rete is to be made in the earth terminal of this circuit board and the side of this metal outer frame, in order to this circuit board charges accumulated, conducts to external environment via this metal outer frame.
Described LCD grounding device is characterized in that: comprise that more the lower surface that a diaphragm is attached at this circuit board thinks insulation protection.
Described LCD grounding device is characterized in that: this diaphragm also covers this flexible flat cable simultaneously.
Described LCD grounding device is characterized in that: this conductivity type rete is to be attached between this earth terminal and this metal outer frame in the mode of pasting.
Described LCD grounding device; it is characterized in that: this conductivity type rete is a conductivity type double faced adhesive tape; one side sticks in the earth terminal of this circuit board and the side of this metal outer frame simultaneously; another side is pasted a diaphragm; make the lower surface that is fixed in this circuit board, avoid external interference with the assembly of protecting this circuit board.
Described LCD grounding device, it is characterized in that: this flexible flat cable collocation uses the winding lead-in wire to connect (Tape Automated Bounding, TAB), (Chip On Film, mode COF) connects this display panels and this circuit board for glass flip chip joint (Chip On Glass) or mantle chip bonding.
Described LCD grounding device is characterized in that: this earth terminal is to be positioned at this circuit board not to be connected with the dual-side of this flexible flat cable.
Described LCD grounding device is characterized in that: this earth terminal is the lower surface that is made in this circuit board.
Described LCD grounding device is characterized in that: this earth terminal is stretched out by the edge of this printed circuit board (PCB).
Described LCD grounding device is characterized in that: this conductivity type rete is attached at around this circuit board.
This aspect also provides a kind of printed circuit board (PCB) that is used for described LCD, this circuit board group is loaded in the LCD, demonstration in order to the control display panels, this printed circuit board (PCB) comprises: a plurality of flexible flat cables, by a side of this printed circuit board (PCB), extension is connected to this display panels; One earth terminal is to be positioned on this printed circuit board (PCB); One diaphragm is the surface that is covered in this printed circuit board (PCB), thinks insulation protection; It is characterized in that:
One conductivity type rete has adhesive effect, is attached at the periphery of this printed circuit board (PCB); in order to fixing this diaphragm, and, fit between this earth terminal and this LCD metal outer frame; in order to this printed circuit board (PCB) charges accumulated, conduct to external environment via this metal outer frame.
Described printed circuit board (PCB) is characterized in that: this earth terminal is to be positioned on this printed circuit board (PCB), is not manufactured with the side of flexible flat cable.
Described printed circuit board (PCB) is characterized in that: this earth terminal is to be made on the exposed surface of this printed circuit board (PCB), and the side of contiguous this printed circuit board (PCB).
Described printed circuit board (PCB) is characterized in that: this earth terminal is stretched out by the edge of this printed circuit board (PCB).
Described printed circuit board (PCB); it is characterized in that: this conductivity type rete is a conductivity type double faced adhesive tape; one side sticks in the side of this earth terminal and this LCD metal outer frame simultaneously; another side is pasted this diaphragm; make the surface that is fixed in this printed circuit board (PCB), avoid external interference to protect this printed circuit board (PCB).
Described printed circuit board (PCB), it is characterized in that: this flexible flat cable can be arranged in pairs or groups and be used the winding lead-in wire to connect (Tape Automated Bounding, TAB), (Chip On Film, mode COF) connects this display panels and this printed circuit board (PCB) for glass flip chip joint (Chip On Glass) or mantle chip bonding.
Can be further understood specific embodiment and detailed description in conjunction with the accompanying drawings by following about the advantages and spirit of the present invention.
Description of drawings
Fig. 1 shows in the exemplary lcd that circuit board is by the synoptic diagram of metal outer frame ground connection.
Fig. 2 is the backplan corresponding to LCD shown in Figure 1.
Fig. 3 A is the synoptic diagram of LCD first embodiment of the present invention.
Fig. 3 B is the backplan corresponding to LCD shown in the 3rd A figure.
Fig. 4 A shows LCD second embodiment of the present invention, corresponds to the synoptic diagram of LCD bottom surface.
Fig. 4 B is in the LCD of second embodiment of the invention, and the applying protective film is thought the synoptic diagram of protection in the circuit board lower surface.
Fig. 4 C is in the LCD of second embodiment of the invention, utilizes conductivity type double faced adhesive tape applying protective film in the synoptic diagram of circuit board lower surface.
Fig. 4 D is in the LCD of second embodiment of the invention, and applying conductivity type double faced adhesive tape is in the synoptic diagram of another embodiment of circuit board lower surface.
Fig. 5 is the synoptic diagram of LCD the 3rd embodiment of the present invention.
Embodiment
The following stated is first embodiment of LCD of the present invention.At first, please refer to Fig. 3 A, this LCD 10 comprises a display panels 300, a glue frame 200, a metal outer frame 100 and a printed circuit board (PCB) 500.Glue frame 200 is in order to carrying display panels 300, and metal outer frame 100 is from top to bottom to be sleeved on glue frame 200 outsides, forms a space to hold above-mentioned display panels 300.Printed circuit board (PCB) 500 is the lower surfaces that are assembled in above-mentioned glue frame 200, arrange in pairs or groups simultaneously such as connected modes (not icon) such as the connection of winding lead-in wire, glass flip chip joint or mantle chip bondings, pass through again along the upwardly extending flexible flat cable 510 of glue frame 200 sides, be connected to display panels 300, with input control signal.
Please be simultaneously with reference to Fig. 3 B, this figure is the bottom surface that corresponds to LCD 10 shown in Fig. 3 A.Be not connected with a side 500b of flexible flat cable 510 at printed circuit board (PCB) 500, be manufactured with the side 500b that a ground terminal 530 protrudes printed circuit board (PCB).Simultaneously, one conductivity type rete 520 is to attach this ground terminal 530 and contiguous metal outer frame 100, first in order to ground terminal 530 directly is solidly connected on the glue frame 200, with fixed printed circuit board 500, first as the electrical conductive medium of 100 of ground terminal 530 and metal outer frame, to reach the purpose that printed circuit board (PCB) 500 charges accumulated is conducted to external environment by metal outer frame 100.
Generally speaking, solid that can applying implenent electric conductivity on the surface of this conductivity type rete 520, for example: elargol, to attach the side 100b of ground terminal 530, contiguous glue frame 200 and metal outer frame 100 simultaneously.In addition,, can directly select the conductivity type rete 520 of tool gluing characteristic for use, directly paste this ground terminal 530, the glue frame 200 of vicinity and the side 100b of metal outer frame 100, think the step of applying to omit above-mentioned coating solid in order further to simplify processing procedure.
Only use a ground terminal 530 to get rid of charges accumulated on the printed circuit board (PCB) in the above-described embodiments, yet, in order further to improve the ground connection effect, shown in Fig. 4 A, in the second embodiment of the present invention, be not connected with the relative dual-side 500b of flexible flat cable at printed circuit board (PCB) 500, all make ground terminal 530, and conductivity type rete 520 also is attached at the side 100b of this two ground terminal 530, contiguous glue frame 200 and metal outer frame 100 respectively.
Secondly, be subjected to the outside noise interference in order to prevent the circuit unit on the printed circuit board (PCB) 500, and the correct output of influence surface plate control signal.Please refer to Fig. 4 B,, must cover an insulation protection rete 540 with isolated this extraneous noise at the lower surface that printed circuit board (PCB) 500 exposes.It should be noted that this insulation protection rete 540 is to cover printed circuit board (PCB) 500 and conductivity type rete 520 simultaneously, disturb the normal operation of printed circuit board (PCB) 500 to avoid outside noise.Simultaneously, this insulation protection rete 540 also extends and covers above-mentioned flexible flat cable 510, is interfered to prevent that printed circuit board (PCB) 500 output liquid crystal from controlling signal in the process of display panel 300, and causes the display frame distortion.
For this insulation protection rete 540 being bonded to the lower surface of printed circuit board (PCB) 500 and conductivity type rete 520; with regard to a preferred embodiment; shown in Fig. 4 B; can be at the surface perimeter coating solid 550 of insulation protection rete 540; in the mode of pasting; directly conform to the edge of conductivity type rete 520 and printed circuit board (PCB) 500, and solid as used herein 550 is not limited to make the solid of apparatus electric conductivity.
On the other hand; paste the step of fixing this insulation protection rete 540 in order further to simplify; with regard to a preferred embodiment, please refer to Fig. 4 C, can directly select for use the conductivity type double faced adhesive tape 560 of the two-sided gluing effect of tool to replace the employed conductivity type rete 520 of the foregoing description.The one side of this conductivity type double faced adhesive tape 560 is gluing ground terminal 530, the glue frame 200 of vicinity and the side 100b of metal outer frame 100 simultaneously; another side then gluing thereby can be bonded to insulation protection rete 540 lower surface of printed circuit board (PCB) 500 to insulation protection rete 540.
In addition; fixing really in order to ensure this insulation protection rete 540; guarantee that simultaneously this insulation protection rete 540 can protect the electronic package on this printed circuit board (PCB) 500 fully; shown in Fig. 4 D; conductivity type double faced adhesive tape 570 can be pasted around printed circuit board (PCB) 500, so that bigger gluing area and preferable gluing effect to be provided.
Please refer to Fig. 5, show the third embodiment of the present invention among the figure, in the present embodiment, the ground terminal 580 of printed circuit board (PCB) 500 is the surfaces that directly are made in printed circuit board (PCB) 500, and and can't help the side 500b of printed circuit board (PCB) and stretch out.This ground terminal 580 is the electrical conduction by conductivity type rete 590, is connected to metal outer frame 100, thereby can reduce in the previous embodiment, the manufacture difficulty of ground terminal 530, the unlikely ground connection effect that influences simultaneously.
Compared to utilizing screw that grounding elastic part 440 is locked in metal outer frame 100 traditionally, to carry out the purpose of printed circuit board ground, earthing device of the present invention has following advantage:
Therefore the assembly that earthing device of the present invention need not use screw, grounding elastic part 440 etc. to be exclusively used in printed circuit board (PCB) 400 ground connection, can save the installation cost time required with assembling of LCD.
Shown in Fig. 4 A, earthing device of the present invention is to use conductivity type rete 520 to replace traditional earthing device, and utilizes the mode of fitting to fix this conductivity type rete 520, to carry out the required conduction of printed circuit board (PCB) 500 ground connection.Therefore, not involving has in the known techniques, the problem that screw locking dynamics must be controlled.
Shown in Fig. 4 C, conductivity type double faced adhesive tape 560 used in the present invention is except being used for printed circuit board (PCB) 500 ground connection; the set insulation protection rete 540 that simultaneously also is used to fit, therefore, can be in one fabrication steps; reach the purpose of ground connection and insulation protection simultaneously, and can significantly simplify processing procedure.
In the third embodiment of the present invention, please refer to Fig. 5, ground terminal 580 can directly be made in printed circuit board (PCB) 500 surfaces, and does not need to be stretched out by the side 500b of printed circuit board (PCB), therefore, can simplify the making flow process of ground terminal 580.In comparison, please refer to Fig. 2, in classic method, ground terminal 430 must stretch out, and grounding elastic part 440 can contact ground terminal 430, to reach the purpose of ground connection.
The above is to utilize preferred embodiment to describe the present invention in detail, but not limit the scope of the invention, and know this type of skill personage and all can understand, suitably do slightly change and adjustment, will not lose main idea of the present invention place, also not break away from the spirit and scope of the present invention.

Claims (16)

1, a kind of LCD earthing device comprises:
One display panels;
One glue frame is in order to carry this display panels;
One metal outer frame is from top to bottom to be sleeved on outside this glue frame, and, form a space to hold this display panels;
One circuit board is the lower surface that is assembled in this glue frame, and, by being connected to this display panels along the upwardly extending flexible flat cable of this glue frame side; It is characterized in that:
One conductivity type rete is to be made in the earth terminal of this circuit board and the side of this metal outer frame, in order to this circuit board charges accumulated, conducts to external environment via this metal outer frame.
2, LCD grounding device according to claim 1 is characterized in that: comprise that more the lower surface that a diaphragm is attached at this circuit board thinks insulation protection.
3, LCD grounding device according to claim 2 is characterized in that: this diaphragm also covers this flexible flat cable simultaneously.
4, LCD grounding device according to claim 1 is characterized in that: this conductivity type rete is to be attached between this earth terminal and this metal outer frame in the mode of pasting.
5, LCD grounding device according to claim 1; it is characterized in that: this conductivity type rete is a conductivity type double faced adhesive tape; one side sticks in the earth terminal of this circuit board and the side of this metal outer frame simultaneously; another side is pasted a diaphragm; make the lower surface that is fixed in this circuit board, avoid external interference with the assembly of protecting this circuit board.
6, LCD grounding device according to claim 1 is characterized in that: this flexible flat cable collocation uses the winding lead-in wire to connect, glass flip chip engages or the mode of mantle chip bonding connects this display panels and this circuit board.
7, LCD grounding device according to claim 1 is characterized in that: this earth terminal is to be positioned at this circuit board not to be connected with the dual-side of this flexible flat cable.
8, LCD grounding device according to claim 1 is characterized in that: this earth terminal is the lower surface that is made in this circuit board.
9, LCD grounding device according to claim 1 is characterized in that: this earth terminal is stretched out by the edge of this printed circuit board (PCB).
10, LCD grounding device according to claim 1 is characterized in that: this conductivity type rete is attached at around this circuit board.
11, a kind of printed circuit board (PCB) that is used for the described LCD of claim 1, this circuit board group is loaded in the LCD, demonstration in order to the control display panels, this printed circuit board (PCB) comprises: a plurality of flexible flat cables, by a side of this printed circuit board (PCB), extension is connected to this display panels; One earth terminal is to be positioned on this printed circuit board (PCB); One diaphragm is the surface that is covered in this printed circuit board (PCB), thinks insulation protection; It is characterized in that:
One conductivity type rete has adhesive effect, is attached at the periphery of this printed circuit board (PCB); in order to fixing this diaphragm, and, fit between this earth terminal and this LCD metal outer frame; in order to this printed circuit board (PCB) charges accumulated, conduct to external environment via this metal outer frame.
12, printed circuit board (PCB) according to claim 11 is characterized in that: this earth terminal is to be positioned on this printed circuit board (PCB), is not manufactured with the side of flexible flat cable.
13, printed circuit board (PCB) according to claim 11 is characterized in that: this earth terminal is to be made on the exposed surface of this printed circuit board (PCB), and the side of contiguous this printed circuit board (PCB).
14, printed circuit board (PCB) according to claim 11 is characterized in that: this earth terminal is stretched out by the edge of this printed circuit board (PCB).
15, printed circuit board (PCB) according to claim 11; it is characterized in that: this conductivity type rete is a conductivity type double faced adhesive tape; one side sticks in the side of this earth terminal and this LCD metal outer frame simultaneously; another side is pasted this diaphragm; make the surface that is fixed in this printed circuit board (PCB), avoid external interference to protect this printed circuit board (PCB).
16, printed circuit board (PCB) according to claim 11 is characterized in that: this flexible flat cable collocation uses the winding lead-in wire to connect, glass flip chip engages or the mode of mantle chip bonding connects this display panels and this printed circuit board (PCB).
CNB2003101135883A 2003-11-14 2003-11-14 Earthing device and circuit board of liquid crystal display Expired - Lifetime CN1320390C (en)

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Application Number Priority Date Filing Date Title
CNB2003101135883A CN1320390C (en) 2003-11-14 2003-11-14 Earthing device and circuit board of liquid crystal display

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2003101135883A CN1320390C (en) 2003-11-14 2003-11-14 Earthing device and circuit board of liquid crystal display

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CN1544976A true CN1544976A (en) 2004-11-10
CN1320390C CN1320390C (en) 2007-06-06

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103823312A (en) * 2013-11-27 2014-05-28 京东方科技集团股份有限公司 Circuit driving board, backboard and display device
CN107561797A (en) * 2017-09-27 2018-01-09 惠科股份有限公司 Display device and method for manufacturing grounding device thereof
CN107643635A (en) * 2017-09-27 2018-01-30 惠科股份有限公司 Display device and grounding device thereof
CN107688261A (en) * 2017-09-27 2018-02-13 惠科股份有限公司 Display device and grounding device thereof
CN107688260A (en) * 2017-09-27 2018-02-13 惠科股份有限公司 Display device and grounding device thereof
CN107688259A (en) * 2017-09-27 2018-02-13 惠科股份有限公司 Display device and grounding device thereof
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JPH09138389A (en) * 1995-11-16 1997-05-27 Hitachi Ltd Liquid crystal display device
JP2002100842A (en) * 2000-09-22 2002-04-05 Sumitomo Wiring Syst Ltd Flexible flat wiring board and method of adjusting its impedance
CN1410954A (en) * 2001-10-10 2003-04-16 胜园科技股份有限公司 Structure of display device
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CN103823312A (en) * 2013-11-27 2014-05-28 京东方科技集团股份有限公司 Circuit driving board, backboard and display device
CN103823312B (en) * 2013-11-27 2018-09-11 京东方科技集团股份有限公司 A kind of circuit drives plate, backboard and display device
CN107688262A (en) * 2017-09-27 2018-02-13 惠科股份有限公司 Display device and grounding device thereof
CN107688261A (en) * 2017-09-27 2018-02-13 惠科股份有限公司 Display device and grounding device thereof
CN107688260A (en) * 2017-09-27 2018-02-13 惠科股份有限公司 Display device and grounding device thereof
CN107688259A (en) * 2017-09-27 2018-02-13 惠科股份有限公司 Display device and grounding device thereof
CN107643635A (en) * 2017-09-27 2018-01-30 惠科股份有限公司 Display device and grounding device thereof
CN107561797A (en) * 2017-09-27 2018-01-09 惠科股份有限公司 Display device and method for manufacturing grounding device thereof
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