CN107561797A - The manufacture method of display device and its earthing or grounding means - Google Patents

The manufacture method of display device and its earthing or grounding means Download PDF

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Publication number
CN107561797A
CN107561797A CN201710891282.2A CN201710891282A CN107561797A CN 107561797 A CN107561797 A CN 107561797A CN 201710891282 A CN201710891282 A CN 201710891282A CN 107561797 A CN107561797 A CN 107561797A
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CN
China
Prior art keywords
printed circuit
circuit board
pcb
conducting film
protective layer
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Pending
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CN201710891282.2A
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Chinese (zh)
Inventor
何怀亮
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HKC Co Ltd
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HKC Co Ltd
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Application filed by HKC Co Ltd filed Critical HKC Co Ltd
Priority to CN201710891282.2A priority Critical patent/CN107561797A/en
Publication of CN107561797A publication Critical patent/CN107561797A/en
Pending legal-status Critical Current

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Abstract

The embodiment of the present invention provides a kind of display device and its manufacture method of earthing or grounding means, including:Setting display panel, its middle frame is provided with the through hole for connecting the frame roof and bottom made of non-conducting material on framework;Metal side frame is set in four side walls of framework;Top side protecting frame made of non-conducting material is set on framework and display panel;Printed circuit board (PCB) is set not make printed circuit board (PCB) contacting metal side frame below framework;Pliability flat cable is set, the printed circuit board (PCB) is electrically connected with the display panel;Conducting film is attached on the earth terminal and metal side frame of printed circuit board (PCB), is electrically connected with earth terminal and metal side frame;And the protective layer that covering is made up of Ins. ulative material is on a printed circuit, protective layer is attached on the periphery of printed circuit board (PCB) by adhesion material, with fixing printed circuit plate, and extends institute's sheath to cover and fixed pliability flat cable, as electrical barrier.

Description

The manufacture method of display device and its earthing or grounding means
Technical field
The present embodiments relate to display technology field, in particular to the manufacture of display device and its earthing or grounding means Method.
Background technology
Liquid crystal display device is that current city accounts for rate highest Display Types, its light, thin, power saving and be easy to miniaturization it is excellent Point, make to be seen everywhere its trace in daily life, such as mobile phone, notebook computer, numeric type Video Camera, tablet PC It is to use liquid crystal display device mostly Deng product.Now, utilization rate highest liquid crystal display device is to belong to film transistor type Display device (TFT-LCD).
The technologies such as liquid crystal display device and plasma display panel (PDP), organic light emitting diode display (OLED) are different, are Belong to the display of non-spontaneous light type, it is necessary to additionally set backlight.Meanwhile by the drive circuit in display device, by spy Fixed signal is changed and exports and switch voltage, the Liquid Crystal Molecules Alignment direction of display panel is produced change.Above-mentioned backlight Caused light forms picture element by above-mentioned panel, and forms the picture shown by the light transmittance height of every pixel.
According to the displaying principle of above-mentioned display device, extraneous noise, electric charge or electric field change are very easily to liquid crystal point The arrangement of son produces interference, the image of display exception is occurred.Therefore, to prevent above-mentioned interference, it is necessary to set drive circuit Printed circuit board (PCB) must completely cut off ectocine, and try during isolation the electricity do not accumulated in itself because that can not exclude printed circuit board (PCB) Lotus and then interference is produced to the signal of self transmission.
In the prior art, the partial solution tackled above mentioned problem and proposed.Prior art as shown in Figure 1 In, typical display device 10 includes metal outer frame 100, framework 200, display panel 300 and printed circuit board (PCB) 400.Display surface Plate 300 is arranged on the upper surface of framework 200, and printed circuit board (PCB) 400 is arranged on the lower surface of framework 200.Display panel 300 and Framework 200 is electrically connected with by pliability flat cable 510.Metal outer frame 100 is from top to bottom linked in the outside of glue frame 200, And with the hollow region of exposure display panel 300.
For prevent the above-mentioned stored charge of printed circuit board (PCB) 400 institute there may be the problem of, as shown in Fig. 2 in printed circuit The side of the contiguous metal housing 100 of plate 400 sets ground terminal 430, and ground terminal 430 is to be fixed on frame by screw 435 On frame 200.Meanwhile grounding elastic part 440 is set ground terminal 430 is electrically connected to metal outer frame 100.Wherein grounding elastic part 440 be to be fixed on by another screw (being not presented in accompanying drawing) in metal outer frame 100.Pass through above-mentioned setting, printed circuit board (PCB) The electric charge accumulated on 400 can be transferred to metal outer frame 100 by grounding elastic part and is discharged into external environment.
However, metal outer frame is to be connected on display panel in such scheme simultaneously, the electric charge of accumulation still has very big chance Interference is produced and then the arrangement to liquid crystal molecule by the contact with display panel, therefore, still has and waits improved space.
The content of the invention
Technical problems to be solved of the embodiment of the present invention are to provide a kind of manufacture method of display device, can be kept away with obtaining Exempting from stored charge influences the display device of display quality.
The further technical problems to be solved of the embodiment of the present invention are to provide a kind of manufacture of the earthing or grounding means of display device Method, to obtain the earthing or grounding means for the display device for avoiding stored charge from influenceing display quality.
In order to solve the above technical problems, the embodiment of the present invention provides a kind of manufacture method of display device first, including with Lower step:
Display panel is set made of non-conducting material on framework, wherein the framework be provided with the connection frame roof and The through hole of bottom;
Metal side frame is set in four side walls of the framework;
Top side protecting frame made of non-conducting material is set on the framework and the display panel, wherein the top side is protected Frame has the hollow region of the exposure display panel, and the hollow region is less than the display panel;
Printed circuit board (PCB) is set the printed circuit board (PCB) is contacted the metal side frame below the framework;
Pliability flat cable is set, and it is electrically connected with the printed circuit board (PCB), and is connected to described show by the through hole Show panel, the printed circuit board (PCB) is electrically connected with the display panel;
Conducting film is attached on the earth terminal and the metal side frame of the printed circuit board (PCB), makes the earth terminal and the metal Side frame is electrically connected with;
The protective layer that covering is made up of Ins. ulative material is on the printed circuit board;And
The protective layer is attached on the periphery of the printed circuit board (PCB) by adhesion material, with the fixation printed circuit board (PCB), and Extend the protective layer to cover and fix the pliability flat cable, as electrical barrier.
Alternatively, the earth terminal is provided in the lower surface of the printed circuit board (PCB) or from the side of the printed circuit board (PCB) Edge extends to side.
Alternatively, when there is the conducting film one side to paste property, the protective layer is attached and covered by adhesion material The conducting film.
Alternatively, when the conducting film have it is two-sided paste property, the protective layer is sticked directly on the conducting film To cover the conducting film.
Alternatively, attaching has the two-sided conducting film for pasting property on the periphery of the printed circuit board (PCB) to be used as institute Adhesion material is stated, by the protective layer by being covered with the two-sided conducting film for pasting property and attaching the printed circuit Plate.
On the other hand, the embodiment of the present invention also provides a kind of manufacture method of the earthing or grounding means of display device, including following Step:
Metal side frame is set in four side walls of the display device inner frame;
Earth terminal is set to extend in the lower surface of the printed circuit board (PCB) or from the edge of the printed circuit board (PCB) to side;
Conducting film is attached on the earth terminal and the metal side frame of the printed circuit board (PCB), makes the earth terminal and the metal Side frame is electrically connected with;
The protective layer that covering is made up of Ins. ulative material is on the printed circuit board;And
The protective layer is attached on the periphery of the printed circuit board (PCB) by adhesion material, with the fixation printed circuit board (PCB), and Extend the protective layer to cover and fix the pliability flat cable, as electrical barrier.
Alternatively, when there is the conducting film one side to paste property, the protective layer is attached and covered by adhesion material The conducting film.
Alternatively, when the conducting film have it is two-sided paste property, the protective layer is sticked directly on the conducting film To cover the conducting film.
Alternatively, attaching has the two-sided conducting film for pasting property on the periphery of the printed circuit board (PCB) to be used as institute Adhesion material is stated, by the protective layer by being covered with the two-sided conducting film for pasting property and attaching the printed circuit Plate.
Another aspect, the embodiment of the present invention also provide a kind of manufacture method of display device, comprised the following steps:
Display panel is set made of non-conducting material on framework, wherein the framework be provided with the connection frame roof and The through hole of bottom;
Metal side frame is set in four side walls of the framework;
Top side protecting frame made of non-conducting material is set on the framework and the display panel, wherein the top side is protected Frame has the hollow region of the exposure display panel, and the hollow region is less than the display panel;
Printed circuit board (PCB) is set the printed circuit board (PCB) is contacted the metal side frame below the framework;
Pliability flat cable is set, and it is electrically connected with the printed circuit board (PCB), and is connected to described show by the through hole Show panel, the printed circuit board (PCB) is electrically connected with the display panel;
Conducting film is attached on the earth terminal and the metal side frame of the printed circuit board (PCB), makes the earth terminal and the metal Side frame is electrically connected with;
The protective layer that covering is made up of Ins. ulative material is on the printed circuit board;And
The protective layer is attached on the periphery of the printed circuit board (PCB) by adhesion material, with the fixation printed circuit board (PCB), and Extend the protective layer to cover and fix the pliability flat cable, as electrical barrier;
Wherein, the earth terminal is provided in the lower surface of the printed circuit board (PCB) or from the edge of the printed circuit board (PCB) to side Side extends;
Wherein, when there is the conducting film one side to paste property, the protective layer is attached by adhesion material and covers described lead Electrolemma;
Wherein, when the conducting film have it is two-sided paste property, the conducting film be attached to the periphery of the printed circuit board (PCB) with As the adhesion material, and by the protective layer by covering with the two-sided conducting film for pasting property and directly attaching The printed circuit board (PCB).
By using above-mentioned technical proposal, the embodiment of the present invention at least has the advantages that:The embodiment of the present invention carries The display device of confession and its manufacture method of earthing or grounding means, improve and prior art is set using components such as screw, grounding elastic parts The action of the structure formed, the space that those components occupy is saved, display device is more attained lightly.In addition, do not influenceing While the earthing effect of printed circuit board (PCB), the combination substitution tradition of top side protecting frame and metal side frame with insulating properties is set Metal cap, avoid the electric charge for being transferred to metal cap from having influence on display panel, more set through hole to avoid pliability flat cable from transmitting Signal be interfered, in order to avoid have influence on display quality.
Brief description of the drawings
By referring to accompanying drawing detailed description exemplary embodiment, above and other feature and advantage are to people in the art Member will become apparent.In addition, the size of depicted each inter-module and set location are all with order to detailed in accompanying drawing Relation therebetween is explained, and is not intended to limit the size and location relation of such component.
Fig. 1 is the schematic diagram that the circuit board of display device of the prior art is grounded by metal outer frame.
Fig. 2 is the polycrystalline substance schematic diagram of the display device shown in corresponding diagram 1.
Fig. 3 A are the structural representation and the wherein internal structure of dashed region of the display device of one embodiment of the invention Schematic diagram.
Fig. 3 B and Fig. 3 C are the partial structural diagrams of the display device of one embodiment of the invention.
Fig. 3 D are the bottom partial structural diagrams of the display device of one embodiment of the invention.
Fig. 4 A and Fig. 4 B are the bottom partial structural diagrams of the display device of one embodiment of the invention.
Fig. 4 C are the bottom partial structurtes side views of the display device of one embodiment of the invention.
Fig. 4 D are the bottom partial structural diagrams of the display device of one embodiment of the invention.
Fig. 4 E are the bottom partial structurtes side views of the display device of one embodiment of the invention.
Fig. 5 is the bottom partial structurtes side view of the display device of one embodiment of the invention.
Fig. 6 is the partial structural diagram of the display device of one embodiment of the invention.
Fig. 7 is the bottom partial structurtes side view of the display device of one embodiment of the invention.
Fig. 8 A and Fig. 8 B are the partial structural diagrams of the display device of another embodiment of the present invention.
Embodiment
Illustrative embodiments are more fully described hereinafter with reference to accompanying drawing;However, they can embody simultaneously in different forms It is not construed as being limited to embodiment described in text.On the contrary, these embodiments are provided so that the disclosure is thorough and complete, And it will intactly convey the scope of the invention to those skilled in the art.
In the description of the present application, it is to be understood that the instruction such as term " on ", " under ", "left", "right", " interior ", " outer " Orientation or position relationship be based on orientation shown in the drawings or position relationship, be for only for ease of description the application and simplification retouched State, rather than imply signified device or component there must be a specific orientation, therefore it is not intended that limitation to the application.
, it is necessary to illustrate in the description of the present application, unless otherwise clearly defined and limited, term " installation ", " phase Even ", " connection " should be interpreted broadly, for example, it may be being fixedly connected or being detachably connected, or be integrally connected;Can To be mechanical connection or electric connection;Can be joined directly together, can also be indirectly connected by intermediary.Term " attaching ", " pasting " should be interpreted broadly, for example, it may be part attach, can be completely it is closely sealed attaching or it is removable Attaching unloaded etc..For the ordinary skill in the art, it can understand above-mentioned term in this application with concrete condition Concrete meaning.
As shown in Figure 3A, the embodiment of the present invention provides a kind of manufacture method of display device, described to comprise the steps of, its The order of middle step can be changed on demand and arbitrarily:
1) display panel 130 is arranged on framework 110, alternatively, framework 110 can be any can support without producing shape The non-conducting material of change is formed, but not limited to this;
2) setting metal side frame 101, wherein metal side frame 101 can be directly anchored to framework in four side walls of framework 110 In 110 four side walls, or can between framework 110 indwelling space for setting All other routes or component.In above-mentioned indwelling Under the situation in space, relative position that metal side frame 101 can be fixed between framework 110 by other means;
3) setting top side protecting frame 102, alternatively, top side protecting frame 102 can be in the top of framework 110 and display panel 130 Any can support is formed without producing the non-conducting material of deformation, but not limited to this.During wherein top side protecting frame 102 has Dummy section, to exposure display panel 130.The area of above-mentioned hollow region is less than display panel 130, therefore, when top side is protected When frame 102 is arranged on the top of framework 110 and display panel 130, can more be lifted display panel be fixed on it is steady on framework 110 Solidity.Top side protecting frame 102 can be fixed on framework 110 in any suitable manner, such as:Top side protecting frame 102 can be direct Framework 110 is sticked together using adhesion material, or top side protecting frame 102 and metal side frame 101 can have corresponding connection component, Make the relative position that can fix top side protecting frame 102 and metal side frame 101 during the protecting frame 102 of setting top side by above-mentioned connection component Put, be further fixed on framework 110, but method is not limited to above-mentioned carried.Or it can make as shown in Fig. 1 prior art With the integrally formed substituted metal side frame 101 of metal frame 103 and top side protecting frame 102.
In a further embodiment, the manufacture method also includes:
4) printed circuit board (PCB) 150 is set in the lower section of framework 110, such as:The lower section of framework 110 or excision frame can be set directly at The section bottom of frame 110, printed circuit board (PCB) 150 is set partly to be embedded in framework 110.Printed circuit board (PCB) 150 can not connect when setting Touch metal side frame 101.Printed circuit board (PCB) 150 can be transmitted the signal required for showing image by pliability flat cable 151 To display panel 130.As shown in Figure 3A, pliability flat cable 151 can pass through metal side frame 101 along the surface of framework 110 And the indwelling space between framework 110 is electrically connected to display panel 130.Or also can as shown in Fig. 3 B and Fig. 3 C, by Vertically oriented aperture there-through 120 is set in framework 110, pliability flat cable 151 is electrically connected to by above-mentioned through hole 120 Display panel 130.
In a further embodiment, the manufacture method also includes:
5) earth terminal 153 is set in printed circuit board (PCB) 150, as shown in Figure 3 D, alternatively, earth terminal 153 is settable from printing electricity The edge of road plate 150 stretches out, but pliability flat cable 151 of getting along well is arranged on same edge in order to avoid contacting accidentally.6) paste Attached conducting film 160 is on the earth terminal and the metal side frame of the printed circuit board (PCB).Conducting film 160 can be electrically connected with printing electricity The earth terminal 153 and metal side frame 101 of road plate 150, the electric charge for making to accumulate on printed circuit board (PCB) 150 can be moved by conducting film 160 Metal side frame 101 is moved, then is discharged to external environment condition.Conducting film 160 can be by tackness material attachment in printed circuit board (PCB) 150 And metal side frame 101.Alternatively, conducting film 160 is that there is one side to paste property or the two-sided conductive tape for pasting property.It is conductive The material of film 160 can be but the not limited to this such as aluminium foil, copper foil, electroconductive polymer.
Except above-mentioned setting, as shown in Figure 4 A, several earth terminals 153 can be set, to improve earthing effect.The present invention's In another embodiment, several earth terminals 153 can be separately positioned on the same edge of printed circuit board (PCB) 150, or be separately positioned on Different edges, but pliability flat cable 151 of getting along well is arranged on same edge in order to avoid contacting accidentally.Several earth terminals are being set In the case of 153, conducting film 160 can be divided into some fragments, and several earth terminals 153 are electrically connected into metal side frame respectively 101。
In a further embodiment, the manufacture method also includes:
6) attaching protective layer 170 can be made up of with fixing printed circuit plate, protective layer 170 Ins. ulative material.As shown in Figure 4 B, When conducting film 160 is the conductive tape that there is one side to paste property, protective layer 170 can be covered on printed circuit board (PCB) 150, And the periphery of printed circuit board (PCB) 150 and the periphery of conducting film 160 are attached to by adhesion layer 180, with fixing printed circuit plate 150 And conducting film 160.Meanwhile protective layer 170 can as electrical barrier by the circuit on printed circuit board (PCB) 150 and component with it is extraneous every Absolutely, avoid the factor interference signal of external environment condition and cause to show results abnormity.The side schematic view of said structure such as Fig. 4 C institutes Show.Protective layer 170 may be further extended and cover pliability flat cable 151, using as electrical barrier avoid external environment condition because Element interference.Further, while protective layer 170 covers possibility flat cable 151, can be fixed by tackness material can Flexible flat cable 151.
By printing in the manufacture method of the display device provided by above embodiments of the invention, and those embodiments The manufacture method for the earthing or grounding means that combination between printed circuit board, metal side frame, conducting film and protective layer is formed can be effectively improved The problem of earthing or grounding means manufacture method of the prior art and its finished product.In the prior art, more by top side protecting frame 102 and metal Side frame 101 is fabricated to the metal cap being one of the forming, overall all conductive.Therefore, transmitted by excess charge to metal During cover, it may not discharge to external environment condition, or part and first be transferred to the part nearer apart from display panel 130 and just release Put, interfere the signal for being transferred to display panel 130, or because those electric charges influence liquid crystal molecule in display panel 130 Arrangement, the image for causing display device 900 to show produces abnormal.In comparison, the part of present invention contact display panel 130 The only framework 110 and top side protecting frame 102 of non-conducting material, therefore it is transferred to by conducting film 160 electricity of metal side frame 101 Lotus does not interfere with display panel 130, and does not also interfere with the effect that electric charge is discharged into external environment condition by metal side frame 101. In addition, using the structure for substituting screw and grounding elastic part with the conducting film 160 for pasting property, can reduce some in manufacturing process Individual step, the space that screw and grounding elastic part account for can be more saved, and then produce more frivolous display device.
Than the above described, can also match somebody with somebody for several components in preparation method according to actual state and demand Put and optimize, more strengthen advantages of the present invention, will hereafter be illustrated with different embodiments.
In one embodiment, optimize for conducting film 160, taken using with the two-sided conducting film 160 for pasting property In generation, pastes the conducting film 160 of property with one side, and remaining setting is identical with previous embodiment.As shown in Figure 4 D, when conducting film 160 Be have it is two-sided paste property conductive tape when, except conducting film 160 is electrically connected with into earth terminal 153 and metal side frame 101 Outside, conducting film 160 can be also pasted around printed circuit board (PCB) 150.Then, the viscosity of the exposed surface of conducting film 160 is passed through Matter, protective layer 170 is pasted on printed circuit board (PCB) 150, earth terminal 153 and metal side frame 101.Pasted compared to one side The conducting film 160 of property, using the function of substituting adhesion layer 180 with the two-sided conducting film 160 for pasting property, it can save and stick together The thickness of layer 180, the step of adhesion layer 180 are set can be more saved in the processing procedure for manufacturing display device.The side of said structure Schematic diagram is as shown in Figure 4 E.
In another embodiment, optimized for earth terminal 153, earth terminal 153 is arranged on printed circuit board (PCB) 150 Lower surface, rather than by extending on the outside of the edge item of printed circuit board (PCB), remaining setting is identical with previous embodiment.As shown in figure 5, by It is conductive tape in conducting film 160, there is a certain degree of pliability, therefore earth terminal is arranged on printed circuit board (PCB) 150 Lower surface, the setting of conducting film 160 and protective layer 170 is not influenceed.This method to set up can reduce the difficulty on the processing procedure of earth terminal 153 Degree.
In another embodiment, carried out for printed circuit board (PCB) 150, pliability flat cable 151 and protective layer 170 excellent Change, and set up insulating properties connecting portion 155, remaining setting is identical with previous embodiment.As shown in fig. 6, using surface to cover in advance The pliability flat cable substitution pliability flat cable 151 of lid insulating properties protection materials, and it is defined as surface insulation electricity Cable 1511.Insulating properties connecting portion is set up in the tail end of surface insulation cable 1511, that is, with the junction of printed circuit board (PCB) 150 155.Insulating properties connecting portion 155 has insulating properties shell and hollow region, and hollow region has fixable port organization, So that other assemblies are electrically connected with surface insulation cable 1511.In addition, use the printing electricity with corresponding above-mentioned port organization Road plate 1501 substitutes printed circuit board (PCB) 150, and printed circuit board (PCB) 1501 and surface insulation cable 1511 are connected by port organization.Its Afterwards, when setting protective layer 170, protective layer 170 only needs to be arranged on printed circuit board (PCB) 1501 and conducting film 160, without prolonging Stretch to cover surface insulation cable 1511.Because the surface of surface insulation cable 1511 is insulating properties protection materials, therefore not It is vulnerable to other interference.The insulating properties connecting portion 155 set up, can strengthen the soundness between cable and printed circuit board (PCB), wherein, The rigidity Ins. ulative material higher compared with protective layer 170 can be used in insulating properties shell, and then protects relatively fragile junction, with Avoid in processing procedure coming off or damaging caused by collision or other factors.It is stronger to be additionally, since the protective capability of insulating properties shell, can Further lift the service life of display device.
In another embodiment, the earth terminal 153 that can be directed to printed circuit board (PCB) 150 is optimized, and earth terminal 153 is set The border of prominent framework 110 is extended at the edge of printed circuit board (PCB) 150 and laterally, remaining is set and previous embodiment phase Together.As shown in fig. 7, earth terminal 153 extends simultaneously directly the four of contacting metal frame 103 on the outside of the edge picture of printed circuit board (PCB) 150 The bottom of at least side of individual side.In this case, the electric charge that printed circuit board (PCB) 150 is accumulated can be directly via earth terminal 153 Metal frame 103 is moved to, conducting film 160 is set without extra.Earth terminal 153 and metal frame 103 can by adhesion material, such as The metalworks such as screw or any existing method are fixed and keep being electrically connected with.Or metal frame 103 can have can fit earth terminal 153 slot, fix so that earth terminal 153 is inserted directly into slot, and then be electrically connected with metal frame 103.Or earth terminal 153 can be electrically connected with by conductive adhesion material and be fixed on the slot of the metal frame 103;Or connect Ground terminal 153 can be electrically connected with by port organization and be fixed on the slot of the metal frame 103;Or earth terminal 153 can By screw metalwork runs through and is electrically connected with and the slot of metal frame 103 as described in being fixed on.Alternatively, printed circuit The part that plate 150 protrudes framework 110 is only free of other circuits comprising earth terminal 153.Really earth terminal 153 and metal frame are made After 103 are electrically connected with, protective layer 170 is set up by bottom side and is used as electrical barrier.
In another embodiment, the knot of printed circuit board (PCB) 150, pliability flat cable 151 and above-mentioned through hole 120 can be directed to Structure optimizes.As shown in Fig. 8 A and Fig. 8 B, conductive part 190 is set in the rear side of printed circuit board (PCB) 150, that is, towards frame The side of frame 110.In addition, the opening of through hole 120 towards printed circuit board (PCB) 150 is arranged into given shape, alternatively, this is specific Shape is agreed with conductive part 190.When setting printed circuit board (PCB) 150 in the lower surface of framework 110, it is fixed on conductive part 190 In through hole, and pliability flat cable 151 is directly by conductive part 190 and through through hole 120 so that printed circuit board (PCB) 150 and aobvious Show that panel 130 is electrically connected with.In this case, the junction of printed circuit board (PCB) 150 and pliability flat cable 151 is completely disposed in In through hole 120, it is not required to additionally rely on protective layer 170 and external insulation.Wherein, display panel may be, for example, LCD display panel, OLED display panel, QLED display panels, curved face display panel or other display panels.
What said above is only that alternatively embodiment describes in detail according to the present invention, the right being not intended to limit the present invention Scope.Relevant art has usually intellectual and all should be understood that under the technical principle and spirit without prejudice to the present invention, can Above-described embodiment is modified and changed.Therefore the interest field of the present invention should be as described in appended claims.

Claims (10)

1. a kind of manufacture method of display device, it is characterised in that comprise the following steps:
Display panel is set made of non-conducting material on framework, wherein the framework be provided with the connection frame roof and The through hole of bottom;
Metal side frame is set in four side walls of the framework;
Top side protecting frame made of non-conducting material is set on the framework and the display panel, wherein the top side is protected Frame has the hollow region of the exposure display panel, and the hollow region is less than the display panel;
Printed circuit board (PCB) is set the printed circuit board (PCB) is contacted the metal side frame below the framework;
Pliability flat cable is set, and it is electrically connected with the printed circuit board (PCB), and is connected to described show by the through hole Show panel, the printed circuit board (PCB) is electrically connected with the display panel;
Conducting film is attached on the earth terminal and the metal side frame of the printed circuit board (PCB), makes the earth terminal and the metal Side frame is electrically connected with;
The protective layer that covering is made up of Ins. ulative material is on the printed circuit board;And
The protective layer is attached on the periphery of the printed circuit board (PCB) by adhesion material, with the fixation printed circuit board (PCB), and Extend the protective layer to cover and fix the pliability flat cable, as electrical barrier.
2. manufacture method as claimed in claim 1, it is characterised in that the earth terminal is provided in the printed circuit board (PCB) Lower surface extends from the edge of the printed circuit board (PCB) to side.
3. manufacture method as claimed in claim 1, it is characterised in that described when there is the conducting film one side to paste property Protective layer is attached by adhesion material and covers the conducting film.
4. manufacture method as claimed in claim 1, it is characterised in that when the conducting film have it is two-sided paste property, it is described Protective layer is sticked directly on the conducting film to cover the conducting film.
5. manufacture method as claimed in claim 4, it is characterised in that attaching, there is the two-sided conducting film for pasting property to exist The periphery of the printed circuit board (PCB) is using as the adhesion material, by the protective layer by being pasted with two-sided described in property Conducting film covers and attaches the printed circuit board (PCB).
6. a kind of manufacture method of the earthing or grounding means of display device, it is characterised in that comprise the following steps:
Metal side frame is set in four side walls of the display device inner frame;
Earth terminal is set to extend in the lower surface of the printed circuit board (PCB) or from the edge of the printed circuit board (PCB) to side;
Conducting film is attached on the earth terminal and the metal side frame of the printed circuit board (PCB), makes the earth terminal and the metal Side frame is electrically connected with;
The protective layer that covering is made up of Ins. ulative material is on the printed circuit board;And
The protective layer is attached on the periphery of the printed circuit board (PCB) by adhesion material, with the fixation printed circuit board (PCB), and Extend the protective layer to cover and fix the pliability flat cable, as electrical barrier.
7. manufacture method as claimed in claim 6, it is characterised in that described when there is the conducting film one side to paste property Protective layer is attached by adhesion material and covers the conducting film.
8. manufacture method as claimed in claim 6, it is characterised in that when the conducting film have it is two-sided paste property, it is described Protective layer is sticked directly on the conducting film to cover the conducting film.
9. manufacture method as claimed in claim 8, it is characterised in that attaching, there is the two-sided conducting film for pasting property to exist The periphery of the printed circuit board (PCB) is using as the adhesion material, by the protective layer by being pasted with two-sided described in property Conducting film covers and attaches the printed circuit board (PCB).
10. a kind of manufacture method of display device, it is characterised in that comprise the following steps:
Display panel is set made of non-conducting material on framework, wherein the framework be provided with the connection frame roof and The through hole of bottom;
Metal side frame is set in four side walls of the framework;
Top side protecting frame made of non-conducting material is set on the framework and the display panel, wherein the top side is protected Frame has the hollow region of the exposure display panel, and the hollow region is less than the display panel;
Printed circuit board (PCB) is set the printed circuit board (PCB) is contacted the metal side frame below the framework;
Pliability flat cable is set, and it is electrically connected with the printed circuit board (PCB), and is connected to described show by the through hole Show panel, the printed circuit board (PCB) is electrically connected with the display panel;
Conducting film is attached on the earth terminal and the metal side frame of the printed circuit board (PCB), makes the earth terminal and the metal Side frame is electrically connected with;
The protective layer that covering is made up of Ins. ulative material is on the printed circuit board;And
The protective layer is attached on the periphery of the printed circuit board (PCB) by adhesion material, with the fixation printed circuit board (PCB), and Extend the protective layer to cover and fix the pliability flat cable, as electrical barrier;
Wherein, the earth terminal is provided in the lower surface of the printed circuit board (PCB) or from the edge of the printed circuit board (PCB) to side Side extends;
Wherein, when there is the conducting film one side to paste property, the protective layer is attached by adhesion material and covers described lead Electrolemma;
Wherein, when the conducting film have it is two-sided paste property, the conducting film be attached to the periphery of the printed circuit board (PCB) with As the adhesion material, and by the protective layer by covering with the two-sided conducting film for pasting property and directly attaching The printed circuit board (PCB).
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CN1544976A (en) * 2003-11-14 2004-11-10 友达光电股份有限公司 Earthing device and circuit board of liquid crystal display
CN101031191A (en) * 2006-02-27 2007-09-05 明基电通股份有限公司 Display device
CN101201485A (en) * 2006-12-15 2008-06-18 英业达股份有限公司 Display device
US20090011197A1 (en) * 2007-06-26 2009-01-08 Tsutomu Matsuhira Electronic device
CN104992956A (en) * 2015-05-15 2015-10-21 深圳市华星光电技术有限公司 Frameless display apparatus and manufacture method thereof

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Publication number Priority date Publication date Assignee Title
CN1544976A (en) * 2003-11-14 2004-11-10 友达光电股份有限公司 Earthing device and circuit board of liquid crystal display
CN101031191A (en) * 2006-02-27 2007-09-05 明基电通股份有限公司 Display device
CN101201485A (en) * 2006-12-15 2008-06-18 英业达股份有限公司 Display device
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019062753A1 (en) * 2017-09-27 2019-04-04 惠科股份有限公司 Display device, manufacturing method therefor, and grounding device thereof

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