CN1543296A

CN1543296A - Printed circuit board

Info

Publication number: CN1543296A
Application number: CNA2004100346063A
Authority: CN
Inventors: 间岛和宏
Original assignee: Mitsubishi Electric Corp
Current assignee: Mitsubishi Electric Corp
Priority date: 2003-04-16
Filing date: 2004-04-15
Publication date: 2004-11-03
Also published as: JP2004319778A; DE102004017455A1

Abstract

Provided is a printed circuit board wherein a tilt phenomenon and a Manhattan phenomenon of chips or a solder non-wetting phenomenon thereof is suppressed and accurate fitting can be ensured. A plurality of tentacle-shaped patterns (10) are provided on three sides of square soldering lands (2a and 2b) of the printed circuit board (1). The rear end of the respective pattern (10) has a function as a gate to regulate the extension of a melted solder printed on the soldering lands (2a and 2b) to be within the soldering lands (2a and 2b) by keeping the inside area of the land constant without changing it.

Description

Printed circuit board

Technical field

The present invention relates to have the printed circuit board of pad.

Background technology

Figure 12 shows that sheet components and parts and wiring figure top view to the syndeton of the pad that is provided with on the existing printed circuit board (PCB).On printed circuit board 1, a pair of pad 2a and the 2b that are made of Copper Foil for example utilize that silk screen print method forms are set.Pad 2a shown in Figure 12 and 2b have identical rectangular shape and identical size, are separated with the distance of regulation mutually.The wiring figure 3a and the 3b that are made of Copper Foil are connected with a pad 2a, and the wiring figure 3c that is made of identical Copper Foil is connected with another pad 2b with the connection angle of stipulating.

On

such pad

2a and 2b, for example print fusion scolding tin 4, utilize the Reflow Soldering method that sheet components and parts 5 are fixing again.In addition, around

pad

2a and 2b, form soldering-resistance layer borderline region 6 with Rack.Soldering-resistance layer borderline region 6 is in the silk screen print method used when generating

pad

2a and 2b, between the edge of the covering printed layers (not shown) that applies respectively on the edge of the opening portion (not shown) of silk screen and wiring figure 3a, 3b and the 3c, form, when preventing from advance on

pad

2a and 2b, for example to print fusion scolding tin because careless contact the between other conductor (not shown) of printing displacement and the fusion scolding tin that might produce and the outside formation of

pad

2a and 2b played the function as so-called safety area or buffering area.

The following describes the installation method of existing sheet components and parts on pad.

At first; go up the configuration silk screen at base material (not shown); this silk screen has respectively and the predetermined formation position of

pad

2a and 2b and the corresponding opening portion in predetermined formation position (not shown) of wiring figure 3a, 3b and 3c; the an amount of Copper Foil corrosion protection coating of coating above silk screen (not shown) then; unwanted Copper Foil is eroded, by forming

pad

2a and 2b and wiring figure 3a, 3b and the 3c that constitutes by Copper Foil respectively so simultaneously.Then, comprising on the semi-finished product substrate of

pad

2a and 2b, cover the mask that encloses than these

pads

2a and 2b big after, on the part that comprises wiring figure 3a, 3b and 3c (promptly not the part of mask film covering), be coated with an amount of solder resist coating, form and cover printed layers (not shown).Then, remove mask, behind printing fusion scolding tin on pad 2a and the 2b, utilize the Reflow Soldering method, sheet components and parts 5 are contained on the printed circuit board (PCB) 1 from the semi-finished product substrate.

In addition, patent documentation 1 (Japanese patent laid-open 7-30238 communique, with reference to Fig. 1 and claim 1) disclosed a kind of printed circuit board, its purpose is to prevent that the sheet components and parts from producing departs from the displacement of installation site when utilizing the Reflow Soldering method to weld, it is to constitute like this, promptly the zone under the sheet components and parts pin in a pair of pad is provided with the breach that is not coated with scolding tin, and the pin of sheet components and parts embeds in this breach.In addition, patent documentation 2 (Japanese patent laid-open 11-177221 communique, with reference to Fig. 1 and claim 1) disclosed a kind of printed circuit board (PCB), its purpose is to prevent to occur the displacement or the handstand of sheet components and parts on the printed circuit board that utilizes Reflow Soldering to weld the sheet components and parts, it is to constitute like this, i.e. the signal extension equidirectional of the wider width that is electrically connected at the 2nd pad setting that is electrically connected with the narrower signal extension of width and the 1st pad and the projection of same widths.

Owing to have structure as described above, therefore there is following such problem in existing printed circuit board 1.Promptly, existing printed circuit board 1, owing to have the structure that

pad

2a, 2b and

wiring figure line

3a, 3b and 3c directly are electrically connected, therefore according to factors such as the width dimensions of each wiring figure and connection angles, fusion scolding tin expansion sometimes reaches the soldering-resistance layer borderline region 6 in the outside that is positioned at pad 2a and 2b.The problem of Cun Zaiing is in this case, if the scolding tin extended mode between a pair of pad 2a and the 2b, different with the fusion/setting rate of the heat conduction of wiring figure 3a and 3b and 3c or scolding tin, then for example sheet components and parts 5 are pulled to pad one side of first fusion etc., for example as shown in figure 12, sheet components and parts 5 are fixed under the state that tilts with respect to the configuration direction generation of

pad

2a and 2b, perhaps produce components and parts and erect phenomenon (so-called Manhattan phenomenon) or be not stained with the scolding tin phenomenon.In addition, the problem that exists in the existing printed circuit board 1 is, utilize computer-aided design (hereinafter referred to as CAD) system even under the situation about also having be, come the syndeton of design example such as

pad

2a, 2b and wiring figure 3a, 3b, 3c, but originally the designer must simultaneously consider desired symmetry and heat conduction balance between two pad 2a and the 2b, one side designs, and can not reach the automatic wiring of finishing.

Still problem as described above proposes in order to solve in the present invention, and purpose is to obtain suppressing the tilt phenomenon or the Manhattan phenomenon of sheet components and parts or be not stained with generation, the accurate fitting device of scolding tin phenomenon and can utilize CAD system to realize the printed circuit board of complete self routing.

Summary of the invention

The relevant printed circuit board of the present invention has the pad that stator champion device uses and strides across the soldering-resistance layer borderline region that is provided with around this pad and will be positioned at the wiring figure in this soldering-resistance layer borderline region outside and the finger shape figure that described pad is electrically connected.

Description of drawings

Figure 1 shows that rectangular pads that is provided with on the printed circuit board of the invention process form 1 and the top view of pointing the shape figure.

Figure 2 shows that the top view of sheet components and parts to the syndeton of the syndeton of pad shown in Figure 1 and wiring figure adversary finger-type shape figure.

Figure 3 shows that the top view of sheet components and parts to the syndeton of the syndeton of pad shown in Figure 1 and other wiring figures adversary finger-type shape figure.

Figure 4 shows that circular pad that is provided with on the printed circuit board of the invention process form 2 and the top view of pointing the shape figure.

Figure 5 shows that the top view of sheet components and parts to the syndeton of the syndeton of pad shown in Figure 4 and wiring figure adversary finger-type shape figure.

Figure 6 shows that the top view of the rectangular pads, finger shape figure and the ring-type figure that are provided with on the printed circuit board of the invention process form 3.

Figure 7 shows that the top view of sheet components and parts to the syndeton of the syndeton of pad shown in Figure 6 and wiring figure and ring-type figure.

Figure 8 shows that the top view of the rectangular pads, finger shape figure and the ring-type figure that are provided with on the printed circuit board of the invention process form 4.

Figure 9 shows that the top view of sheet components and parts to the syndeton of the syndeton of pad shown in Figure 8 and wiring figure and ring-type figure.

Figure 10 shows that the top view of the circular pad, finger shape figure and the ring-type figure that are provided with on the printed circuit board of the invention process form 5.

Figure 11 shows that the top view of sheet components and parts to the syndeton of the syndeton of pad shown in Figure 10 and wiring figure and ring-type figure.

Figure 12 shows that sheet components and parts and wiring figure top view to the syndeton of the pad that is provided with on the existing printed circuit board.

Symbol description

1 ... printed circuit board, 2a, 2b ... solder pad, 3a, 3b, 3c ... wiring figure, 4 ... fusion scolding tin, 5 ... the sheet components and parts, 6 ... the soldering-resistance layer borderline region, 10,11 ... finger shape figure, 12a, 12b ... solder pad, 13,14 ... wiring figure, 20,21 ... the ring-type figure.

Embodiment

The following describes an example of the present invention

Example 1

Figure 1 shows that the top view of the rectangular pads that is provided with on the printed circuit board of the invention process form 1 and finger shape figure, Figure 2 shows that components and parts promptly for example the sheet components and parts to the top view of the syndeton of the syndeton of pad shown in Figure 1 and wiring figure adversary finger-type attitude figure.In addition, in the inscape of this example 1, for the identical part of existing printed circuit board inscape shown in Figure 12, additional prosign, and the explanation of omitting this part.

The characteristics of this example 1 are, in each four limit of

rectangular pads

2a and 2b, on three limits except two pad 2a one side relative with 2b, a plurality of (each limit has 4) finger shape figure 10 are set.Be arranged on the finger shape figure 10 of pad 2a one side, as shown in Figure 2, be to stride across soldering-resistance layer borderline region 6, to be positioned at the wiring figure 3a in the outside of soldering-resistance layer

borderline region

6 and 3b and pad 2a is electrically connected, be arranged on the finger shape figure 10 of pad 2b one side, be to stride across soldering-resistance layer borderline region 6, the wiring figure 3c and the pad 2b that will be positioned at the outside of soldering-resistance layer borderline region 6 are electrically connected with the connection angle of stipulating.Each points the strip that shape figure 10 forms the weak point of complete same size, thereafter the end does not make its inboard bonding pad area change, keep certain, by having like this, make the expansion that is printed on the fusion scolding tin on pad 2a and the 2b be limited in pad 2a and the 2b as the function (homogenizing maintenance function) that limits the burrock of usefulness.Therefore, finger shape figure 10 reaches the situation of wiring figure 3a, 3b, 3c owing to prevent the expansion of fusion scolding tin reliably, therefore can make the scolding tin extended mode of

pad

2a and 2b reach with the heat conduction of wiring figure 3a, 3b and 3c certain, make the even tension of fusion scolding tin, make the fusion/setting rate of scolding tin certain.Here, be that finger shape figure 10 is formed short strip, but this is an example, is not limited to this shape.

The following describes the installation method of sheet components and parts on pad of the invention process form 1.

At first; go up configuration silk screen (not shown) at base material (not shown); this silk screen has respectively and the predetermined formation position of

pad

2a and 2b, and wiring figure 3a, 3b and the predetermined formation position of 3c and the corresponding opening portion in predetermined formation position (not shown) of a plurality of finger figures 10; the an amount of Copper Foil corrosion protection coating of coating above silk screen (not shown) then; unwanted Copper Foil is eroded, by forming

pad

2a and 2b and wiring figure 3a, 3b and 3c and a plurality of finger shape figure 10 that constitutes by Copper Foil respectively so simultaneously.Then, comprising on the semi-finished product substrate of

pad

2a and 2b, cover than these pads 2a and the big circle of 2b and after covering the mask of the rearward end of pointing shape figure 10, on the part that comprises wiring figure 3a, 3b and 3c (promptly not the part of mask film covering), be coated with an amount of solder resist coating, form and cover printed layers (not shown).Then, remove mask, behind printing fusion scolding tin on pad 2a and the 2b, utilize the Reflow Soldering method from the semi-finished product substrate, with the sheet components and parts be contained on the printed circuit board (PCB) 1.

In addition, Figure 3 shows that the top view of sheet components and parts to the syndeton of the syndeton of pad shown in Figure 1 and other wiring figures adversary finger-type shape figure.In this connects example, be arranged on the major part of a plurality of finger shape figures 10 on three limits of pad 2b and big wiring figure 13 and be electrically connected.In this case, finger shape figure 10 also limits the expansion that is printed on the fusion scolding tin on the pad 2b, also participates in being electrically connected between scolding tin and the wiring figure 13 simultaneously.In addition, wiring figure 13 shown in Figure 3 can form in the formation operation of the finger shape figure 10 in the above-mentioned installation method simultaneously.

As mentioned above, according to this example 1, owing to have the pad 2a and the 2b of stator champion device 5 usefulness, and stride across this

pad

2a and 2b around the wiring figure 3a in the soldering-resistance layer borderline region 6 that is provided with and the outside that will be positioned at soldering-resistance layer

borderline region

6 and 3b and 3c and 13 and the finger shape figure 10 that is electrically connected of

pad

2a and 2b and constituting, therefore the effect that has is, finger shape figure 10 can have as the function that limits the burrock of usefulness, make the expansion that is printed on the fusion scolding tin on pad 2a and the 2b be limited in pad 2a and the 2b, can prevent reliably that the expansion of fusion scolding tin from reaching wiring figure 3a, 3b, the situation of 3c.Thereby, finger shape figure 10 since can make the pad 2a that for example has paired relation and 2b the scolding tin extended mode and and the heat conduction of wiring figure 3a, 3b and 3c certain, make the even tension of fusion scolding tin, make the fusion/setting rate of scolding tin certain, therefore the effect that has is, can suppress inclination, the Manhattan phenomenon of sheet components and parts 5 reliably or not be stained with the generation of scolding tin phenomenon, can accurate fitting device 5.

According to this example 1, owing to making a plurality of finger shape figures 10 participate in

pad

2a and 2b constitutes with being electrically connected of wiring figure 3a, 3b and 3c, so the effect that has is the impedance that is connected that can reduce with these wiring figures.In addition, about this point, in other examples of following explanation too.

In addition, in this example 1, constitute owing in the formation operation of

pad

2a and 2b and wiring figure 3a, 3b and 3c, forming finger shape figure 10 simultaneously, therefore the effect that has is, do not cause manufacturing cost to rise, can form with the approximately equalised manufacturing cost of manufacturing cost with existing printed circuit board 1 shown in Figure 12 because of forming finger shape figure 10.In addition, about this point, in other examples of following explanation too.

Example 2

Figure 4 shows that the top view of the circular pad that is provided with on the printed circuit board of the invention process form 2 and finger shape figure, Figure 5 shows that the top view of sheet components and parts the syndeton of the syndeton of pad shown in Figure 4 and wiring figure adversary finger-type shape figure.In addition, in the inscape of this example 2, with the identical parts such as inscape of example 1, additional prosign, and the explanation of omitting this part.

The characteristics of this example 2 are, on substrate (not shown),

circular pad

12a and 12b are set, replace

rectangular pads

2a and 2b, be provided with in addition and stride across soldering-resistance layer borderline region 16 that is provided with around these pads 12a and the 12b and a plurality of (each pad has 10) finger shape figure 11 that other conductors (not shown) are connected with pad 12a and 12b.Its characteristics are, in each marginal portion of

circular pad

12a and 12b, except two a pad 12a part relative with 12b and remaining marginal portion is provided with a plurality of finger shape figures 11.Be arranged on the finger shape figure 11 of pad 12a one side, as shown in Figure 5, be to stride across soldering-resistance layer borderline region 16, the wiring figure 14 that will be positioned at the outside in territory, soldering-resistance layer limit 16 is electrically connected with pad 12a, be arranged on the finger shape figure 11 of pad 12b one side, be to stride across soldering-resistance layer borderline region 16, the wiring figure 13 that will be positioned at the outside of soldering-resistance layer borderline region 16 is electrically connected with pad 12b.This example 2 respectively to point shape figure 11 identical with example 1, form the strip of the weak point of complete same size, thereafter the end does not make its inboard bonding pad area change, keep certain, by having like this, make the expansion that is printed on the fusion scolding tin on pad 12a and the 12b be limited in pad 12a and the 12b as the function (homogenizing maintenance function) that limits the burrock of usefulness.Therefore, finger shape figure 11 prevents that reliably the expansion of fusion scolding tin from reaching the situation of wiring figure 14 and 13, can make the scolding tin extended mode of

pad

12a and 12b and certain, make the even tension of fusion scolding tin, make the fusion/setting rate of scolding tin certain with wiring figure 14 and 13 heat conduction.

The following describes the installation method of sheet components and parts.

The finger shape figure 11 of this example 2 can utilize the method same with example 1, forms simultaneously in the formation operation of

pad

12a and 12b.

As mentioned above, according to this example 2, owing to have the pad 12a and the 12b of stator champion device 5 usefulness, and stride across soldering-resistance layer borderline region 16 and will be positioned at the wiring figure 14 and 13 and the finger shape figure 11 that is electrically connected of

pad

12a and 12b and constituting in the outside of soldering-resistance layer borderline region 16, therefore make finger shape figure 11 have the function of the burrock of the usefulness of limiting, make the expansion that is printed on the fusion scolding tin on pad 12a and the 12b be limited in pad 12a and the 12b, by preventing that so reliably the expansion of fusion scolding tin from reaching wiring figure 14 and 13, make the scolding tin extended mode of

pad pad

12a and 12b reach with the heat conduction of wiring figure 14 and 13 certain, make the even tension of fusion scolding tin, make the fusion/setting rate of scolding tin certain, therefore the effect that has is, can restrain the inclination of sheet components and parts 5 really, Manhattan phenomenon or be not stained with the generation of scolding tin phenomenon can accurate fitting device 5.

Example 3

Figure 6 shows that the top view of the rectangular pads that is provided with on the printed circuit board of the invention process form 3, finger shape figure and ring-type figure, Figure 7 shows that the sheet components and parts are to the syndeton of pad shown in Figure 6 and the wiring figure top view to the syndeton of ring-type figure.In addition, in the inscape of this example 3, for the identical parts such as inscape of example 1, additional prosign, and the explanation of omitting this part.

The characteristics of this example 3 are, in each four limit of

rectangular pads

2a and 2b, on three limits except two pad 2a one side relative with 2b, a plurality of (each limit has 4) finger shape figure 10 is set, except the formation of above-mentioned such example 1, be arranged on the ring-type or the U font figure 20 of the Rack that the leading section of a plurality of finger shape figures 10 that the outside of soldering-resistance layer borderline region 6 will extend to the outside of soldering-resistance layer borderline region 6 is connected with other leading sections near this leading section again.The ring-type figure 20 that is electrically connected with the finger shape figure 10 that is arranged on pad 2a one side, as shown in Figure 7, be to be electrically connected with wiring figure 3a and 3b, with the ring-type figure 20 that the finger shape figure 10 that is arranged on pad 2b one side is electrically connected, be to be electrically connected with the connection angle of regulation with wiring figure 3c.Ring-type figure 20 is when being electrically connected with wiring figure 3a, 3b and 3c, owing to can be all the time connect with the width of this wiring figure, therefore can will connect impedance Control at setting, can make pad 2a with paired relation and 2b certain with heat conduction wiring figure, make the even tension of fusion scolding tin, make the fusion/setting rate of scolding tin certain.

The following describes the installation method of sheet components and parts.

The ring-type figure 20 of this example 3 can utilize the method same with example 1, forms simultaneously in the formation operation of

pad

12a and 12b and finger shape figure 10.

As mentioned above, according to this example 3, because except the formation of example 1, have also in the outside of soldering-resistance layer borderline region 6 that the leading section of a plurality of finger shape figures 10 that will extend to the outside of soldering-resistance layer borderline region 6 is electrically connected with other leading sections near this leading section and with wiring figure 3a, the ring-type figure 20 that 3b and 3c are electrically connected and constituting, therefore with wiring figure 3a, when 3b and 3c are electrically connected, can be all the time connect with the width of this wiring figure, can will connect impedance Control at setting, can make pad 2a with paired relation and 2b certain with heat conduction wiring figure, make the even tension of fusion scolding tin, make the fusion/setting rate of scolding tin certain.By like this, the effect that has is, can suppress inclination, the Manhattan phenomenon of sheet components and parts 5 really or not be stained with the generation of scolding tin phenomenon, can accurate fitting device 5.

In addition, in this example 3, constitute owing in the formation operation of

pad

2a and 2b and wiring figure 3a, 3b and 3c, forming ring-type figure 20 simultaneously, therefore the effect that has is, do not cause manufacturing cost to rise, can form with the approximately equalised manufacturing cost of manufacturing cost with existing printed circuit board 1 shown in Figure 12 because of forming ring-type figure 20.In addition, about this point, in other examples of following explanation too.

Example 4

Figure 8 shows that the top view of the rectangular pads that is provided with on the printed circuit board of the invention process form 4, finger shape figure and ring-type figure, is the sheet components and parts shown in Fig. 9 to the syndeton of pad shown in Figure 8 and the wiring figure top view to the syndeton of ring-type figure.In addition, in the inscape of this example 4, for the identical parts such as inscape of example 1, additional prosign, and the explanation of omitting this part.

The characteristics of this example 4 are that in the structure of example 3, every limit is provided with 2 finger shape figures 10, replace set a plurality of (every limit is 4) finger shape figure 10 in each three limit of rectangular pads 2a and 2b.This is according to following reason, promptly on the basis of the relation that has ring-type figure 20 in order to be electrically connected with wiring figure, make it bear linkage function with wiring figure owing to there is no need adversary's finger-type shape figure 10, if therefore make 10 performances of finger shape figure evenly keep the configuration structure of function, then can reduce the configurable number of finger shape figure 10 in order to be enough to.Thereby, in this example 4, be that the configurable number that will point shape figure 10 is made as 2 to every limit, but certain every limit also can be 1.In addition, otherwise, if increase the configurable number of finger shape figure 10, then have the effect that is connected impedance that reduces with wiring figure.

The following describes the installation method of sheet components and parts.

The finger shape figure 10 of this example 4 can utilize the method same with example 3, forms simultaneously in the formation operation of

pad

2a and 2b and ring-type figure 20.

As mentioned above, according to this example 4, owing to compare with the formation of example 3, the configurable number that reduces finger shape figure 10 constitutes, therefore except the effect of example 3, owing to can reduce the use amount of fusion scolding tin than example 3, therefore have the effect that can reduce manufacturing cost.

Example 5

Figure 10 shows that the top view of the circular pad that is provided with on the printed circuit board of the invention process form 5, finger shape figure and ring-type figure, Figure 11 shows that the sheet components and parts are to the syndeton of pad shown in Figure 10 and the wiring figure top view to the syndeton of ring-type figure.In addition, in the inscape of this example 5, for the identical parts such as inscape of example 1, additional prosign, and the explanation of omitting this part.

The characteristics of this example 5 are, except each marginal portion at

circular pad

12a and 12b is provided with the formation of example 2 of a plurality of (each pad has 10) finger shape figure 11, be arranged on the ring-type figure 21 of the Rack that the leading section of a plurality of finger shape figures 11 that the outside of soldering-resistance layer borderline region 16 will extend to the outside of soldering-resistance layer borderline region 16 and other leading sections near this leading section are electrically connected again.The ring-type figure 21 that is electrically connected with the finger shape figure 11 that is arranged on pad 12a one side, as shown in figure 11, being to be electrically connected with wiring figure 14, with the ring-type figure 21 that the finger shape figure 11 that is arranged on pad 12b one side is electrically connected, is to be electrically connected with wiring figure 13.Ring-type figure 21 is when being electrically connected with wiring figure 14 and 13, owing to can be all the time connect with the width of this wiring figure, therefore can will connect impedance Control at setting, can make pad 12a with paired relation and 12b certain with heat conduction wiring figure, make the even tension of fusion scolding tin, make the fusion/setting rate of scolding tin certain.

The following describes the installation method of sheet components and parts.

The ring-type figure 21 of this example 5 can utilize the method same with example 3, forms simultaneously in the formation operation of

pad

12a and 12b and finger shape figure 11.

As mentioned above, according to this example 5, because except the formation of example 2, the ring-type figure 21 that has also in the outside of soldering-resistance layer borderline region 16 that the leading section of a plurality of finger shape figures 11 that will extend to the outside of soldering-resistance layer borderline region 16 is electrically connected with other leading sections near this leading section and be electrically connected with wiring figure 14 and 13 and constituting, therefore when being electrically connected with wiring figure 14 and 13, can be all the time connect with the width of this wiring figure, can will connect impedance Control at setting, can make pad 12a with paired relation and 12b certain with heat conduction wiring figure, make the even tension of fusion scolding tin, make the fusion/setting rate of scolding tin certain.By like this, the effect that has is, can suppress inclination, the Manhattan phenomenon of sheet components and parts 5 really or not be stained with the generation of scolding tin phenomenon, can accurate fitting device 5.

In addition, at example 1 to arbitrary form of example 5, if shape, size and the configuration of above-mentioned pad, finger shape figure and/or ring-type figure are constituted in the parts macroblock of logining in advance in CAD system, the effect that then has is, can utilize this parts macroblock, easily obtain printed circuit board pad, finger shape figure and/or the wiring of ring-type figure full automation.

As mentioned above, according to the present invention, since have the pad that stator champion device uses and stride across this pad around the soldering-resistance layer borderline region that is provided with and the wiring figure in the outside that will be positioned at this soldering-resistance layer borderline region and the finger shape figure that pad is electrically connected, therefore the effect that has is, can limit the expansion of the fusion scolding tin on the pad, make it be limited in the inboard of pad.Thereby, if making and being arranged on the pad finger shape figure on every side that for example has paired relation is symmetrical mutually shape, then owing to utilize finger shape figure can make with the heat conduction of wiring figure certain, make the fusion/setting rate of scolding tin even, therefore the effect that has is, can be suppressed at tilt phenomenon, the Manhattan phenomenon of the sheet components and parts that take place on the existing printed circuit board really or not be stained with the scolding tin phenomenon, can the accurate fitting device.In addition, if for example adversary's finger-type shape figure is provided with the ring-type figure, the effect that then has is, can be irrelevant with factors such as the width dimensions of wiring figure and connection angles, to point the shape figure and wiring figure is electrically connected by the ring-type figure, the sheet components and parts will be connected up.Have again, if for example shape, size and the configuration formation of pad, finger shape figure and/or ring-type figure are logined in advance in the parts macroblock of CAD system, the effect that then has is, can utilize this parts macroblock, easily obtain printed circuit board pad, finger shape figure and/or the wiring of ring-type figure full automation.

Claims

1. printed circuit board, it is characterized in that, have the pad that stator champion device uses and stride across this pad around the soldering-resistance layer borderline region that is provided with and the wiring figure in the outside that will be positioned at this soldering-resistance layer borderline region and the finger shape figure that described pad is electrically connected.

2. printed circuit board as claimed in claim 1 is characterized in that, is arranged on the pad finger shape figure on every side with paired relation and is symmetrical mutually shape.

3. printed circuit board as claimed in claim 1, it is characterized in that the ring-type figure that has in the outside of soldering-resistance layer borderline region that the leading section of a plurality of finger shape figures that will extend to the outside of soldering-resistance layer borderline region is electrically connected with other leading sections near this leading section and be electrically connected with wiring figure.

4. as claim 1 each described printed circuit board to the claim 3, it is characterized in that pad, finger shape figure and/or ring-type figure are to utilize the parts macroblock in the computer aided design system that their shape, size and configuration formation have been carried out logining to form.