CN1538487A - Plasma display device - Google Patents

Plasma display device Download PDF

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Publication number
CN1538487A
CN1538487A CNA031225624A CN03122562A CN1538487A CN 1538487 A CN1538487 A CN 1538487A CN A031225624 A CNA031225624 A CN A031225624A CN 03122562 A CN03122562 A CN 03122562A CN 1538487 A CN1538487 A CN 1538487A
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China
Prior art keywords
panel
thermal conductivity
metallic plate
erection part
erection
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Granted
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CNA031225624A
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CN1288695C (en
Inventor
林裕凯
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AU Optronics Corp
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AU Optronics Corp
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Abstract

Plasma display includes panel, metal plate and driving module. The metal plate is connected to the panel in thermal conductivity. The metal plate includes body part, erection part and platform part. The body part is configured on faceplate. One end of the erection part is connected to an end of the body part. The erection part is perpendicular to body part in the rough. One end of the platform part is connected to another end of the erection part, and the platform part is perpendicular to the erection part in the rough. The driving module is connected to aluminium plate in thermal conductivity. The driving module includes aluminium sheet and flexible circuit board. The aluminium sheet is configured on the platform part. The flexible circuit board configured on aluminium sheet, connected to aluminium sheet in thermal conductivity, and connected to panel electrically.

Description

Plasm display device
Technical field
(plasma display panel PDP), and particularly relates to a kind of plasm display device that increases the radiating effect of driver module and panel to the present invention relates to a kind of plasm display device.
Background technology
In the epoch that development in science and technology is maked rapid progress, display unit has been dissolved in the middle of the modern lives.For example, display unit can be applied on TV, mobile phone, computer screen and the personal digital assistant widely.Wherein, display unit comprise at least liquid crystal indicator (liquid crystal display, LCD), plasm display device and organic LED display device (organic light emittingdiode display, OLED).With regard to plasm display device,, satisfy user's visual enjoyment because the advantage at its wide visual angle is convenient to the user and flatly or is vertically furnished.
Please refer to Fig. 1, it shows the part end view of traditional plasma display unit.In Fig. 1, plasm display device 100 comprises panel 102, aluminium sheet 104, spacer (stand-off) 106 and driver module 108 at least.Aluminium sheet 104 is configured on the panel 102, and is connected with panel 102 thermal conductivity, and spacer 106 erectly is configured on the aluminium sheet 104.Driver module 108 is configured on the spacer 106 by a screw (screw) 114, makes to have a difference in height between driver module 108 and the aluminium sheet 104.Driver module 108 can be via chip film joining technique (chip on film, COF) or chip substrate joining technique (chip on board, COB) form, with regard to chip film joining technique, driver module 108 comprises flexible PCB (flexible printed circuit board, FPC) 112 and aluminium flake 110.Flexible PCB 112 is configured on the spacer 106, and is electrically connected with panel 102.Wherein, the lower surface of flexible PCB 112 has several chips 116.Aluminium flake 110 is configured on the upper surface of flexible PCB 112, and is connected with flexible PCB 112 thermal conductivity.
Please refer to Fig. 2, it shows the fragmentary cross-sectional view of another traditional plasma display floater.In Fig. 2, plasm display device 200 comprises panel 202, aluminium sheet 204, spacer 206 and driver module 208.Aluminium sheet 204 is configured on the panel 202, and is connected with panel 202 thermal conductivity, and spacer 206 erectly is configured on the aluminium sheet 204.Driver module 208 is configured on the spacer 206 by screw 214, makes to have a difference in height between driver module 208 and the aluminium sheet 204.Driver module 208 comprises flexible PCB 212 and aluminium flake 210, and aluminium flake 210 is configured on the spacer 206, and flexible PCB 212 to be being configured on the aluminium flake 210 with aluminium flake 210 thermal conductivity ways of connecting, and is electrically connected with panel 202.Wherein, the upper surface of flexible PCB 212 has several chips 216.
Because driver module 108 and 208 must apply higher voltage when being driven, and causes the chip 116 and 216 on flexible PCB 112 and 212 will produce higher working temperature.Because the area of dissipation of aluminium flake 110 and 210 is limited, cause chip 116 and 216 heats that when work, produce to go out via aluminium flake 110 and 210 loss effectively, influence the service behaviour of driver module 108 and 208 greatly.Even, shorten the useful life of driver module 108 and 208.
Summary of the invention
The purpose of this invention is to provide a kind of plasm display device, the design that its driver module is connected with the metallic plate thermal conductivity can increase the area of dissipation of driver module, improves the useful life of driver module.In addition, the present invention disposes the design of fin, can promptly reach driver module and panel better heat radiating effect.
According to purpose of the present invention, a kind of plasm display device is provided, comprise panel, metallic plate and driver module at least.Metallic plate is connected with the panel thermal conductivity, and metallic plate comprises body, erection part and platform part.One end of erection part is connected with body, and erection part stands upright on the top of panel.Platform part is connected with the other end of erection part, and platform part is parallel with panel.Driver module is configured on the platform part or descends, and is connected with the metallic plate thermal conductivity.
According to a further object of the present invention, a kind of plasm display device is provided, comprise panel, metallic plate and driver module at least.Metallic plate is connected with the panel thermal conductivity, and metallic plate comprises body and erection part.Body is configured on the panel, and an end of erection part is connected with body, and this erection part is positioned at the top of panel.Driver module to be being configured on the side of erection part with metallic plate thermal conductivity ways of connecting, and is electrically connected with panel.
According to another object of the present invention, a kind of plasm display device is provided, comprise panel, metallic plate, driver module and thermal transfer plate at least.Metallic plate is connected with the panel thermal conductivity, and metallic plate comprises first body, first erection part and first platform part.First body is configured on the panel, and an end of first erection part is connected with first body, and first erection part stands upright on the top of panel.First platform part is connected with the other end of first erection part, and parallel with panel.Thermal transfer plate is connected with the metallic plate thermal conductivity, and thermal transfer plate comprises second body, second erection part and second platform part.Second body is configured on first body, and an end of second erection part is connected with second body, and second erection part stands upright on the top of panel.Second platform part is connected with the other end of second erection part, and parallel with panel, and second platform part is positioned on first platform part.Driver module to be being configured on second platform part with thermal transfer plate thermal conductivity ways of connecting, and is electrically connected with panel.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and conjunction with figs. is described in detail as follows:
Description of drawings
Fig. 1 shows the part end view of traditional plasma display unit.
Fig. 2 shows the part end view of another traditional plasma display unit.
Fig. 3 shows the part end view according to the plasm display device of the embodiment of the invention one.
Fig. 4 A shows the part end view according to the plasm display device of the embodiment of the invention two.
Fig. 4 B shows the part stereogram according to the plasm display device of the embodiment of the invention two.
Fig. 5 shows the part end view according to the plasm display device of the embodiment of the invention three.
Fig. 6 shows the part end view according to the plasm display device of the embodiment of the invention four.
Fig. 7 shows the part end view according to the plasm display device of the embodiment of the invention five.
Fig. 8 shows the part end view according to the plasm display device of the embodiment of the invention six.
Fig. 9 shows the part end view according to the plasm display device of the embodiment of the invention seven.
Figure 10 shows the part end view according to the plasm display device of the embodiment of the invention eight.
Figure 11 A shows the part end view according to the plasm display device of the embodiment of the invention nine.
Figure 11 B shows another part end view according to the plasm display device of the embodiment of the invention nine.
Figure 12 shows the part end view according to the plasm display device of the embodiment of the invention ten.
Figure 13 shows the part end view according to the plasm display device of the embodiment of the invention 11.
Figure 14 shows the part end view according to the plasm display device of the embodiment of the invention 12.
Embodiment
Embodiment one
Please refer to Fig. 3, it shows plasm display device (plasmadisplay panel, part end view PDP) according to the embodiment of the invention one.In Fig. 3, plasm display device 300 comprises panel 302, metallic plate 304 and driver module 308.Metallic plate 304 is configured on the panel 302, and metallic plate 304 comprises body 304a, erection part 304b and platform part 304c, and body 304a is configured on the panel 302, and is connected with panel 302 thermal conductivity.The end of erection part 304b is connected with body 304a, and erection part 304b stands upright on the top of panel 302.Platform part 304c is connected with the other end of erection part 304b, and parallel with panel 302.As shown in Figure 3, the end of erection part 304b is connected with the end of body 304a, and erection part 304b is roughly vertical with body 304a.The end of platform part 304c is connected with the other end of erection part 304b, and platform part 304c is roughly vertical with erection part 304b.Platform part 304c is positioned at the top of an end of panel 302, and platform part 304c and body 304a are positioned at the both sides of erection part 304b.
Driver module 308 is configured on the platform part 304c by a screw (screw) 315, and driver module 308 comprises flexible PCB (flexible printed circuit board, FPC) 312 and aluminium flake 310.Aluminium flake 310 is configured on the platform part 304c, and is connected with metallic plate 304 thermal conductivity.Flexible PCB 312 to be being configured on the aluminium flake 310 with aluminium flake 310 thermal conductivity ways of connecting, and is electrically connected with panel 302.Wherein, the upper surface of flexible PCB 312 has several chips 317.
The design that 304 thermal conductivity of driver module 308 of the present invention and metallic plate are connected can increase the area of dissipation of driver module 308, improves the useful life of driver module 308.
Embodiment two
Please be simultaneously with reference to Fig. 4 A and Fig. 4 B, it shows respectively according to the part end view of the plasm display device of the embodiment of the invention two and part stereogram.The plasm display device 400 of present embodiment is with plasm display device 300 differences of embodiment one, plasm display device 400 also has fin (heat sink) 412, cooling pad/thermal grease 414 and at least one perforation 418, and all the other same structures are all continued to use the label of Fig. 3.In Fig. 4 A and Fig. 4 B, fin 412 to be being configured under the platform part 304c with sheet metal 304 thermal conductivity ways of connecting, and is arranged in the formed opening 416 of an end of platform part 304c, erection part 304b and panel 302.Wherein, under platform part 304c, dispose the design of fin 412, can increase the radiating effect of panel 302 and driver module 308.
Cooling pad/thermal grease 414 is configured between platform part 304c and the aluminium flake 310, and is connected with aluminium flake 310 thermal conductivity with sheet metal 304.Therefore, can increase the contact area between driver module 308 and the metallic plate 304, and improve the radiating effect of driver module 308.In addition, perforation 418 is formed among the erection part 304b, can increase near the thermal convection speed the fin 412, and can promptly reduce the temperature of fin 412.
Embodiment three
Please refer to Fig. 5, it shows the part end view according to the plasm display device of the embodiment of the invention three.In Fig. 5, plasm display device 500 comprises panel 502, metallic plate 504 and driver module 508.Metallic plate 504 comprises body 504a, erection part 504b and platform part 504c, and body 504a is configured on the panel 502, and is connected with panel 502 thermal conductivity.The end of erection part 504b is connected with body 504a, and erection part 504b stands upright on the top of panel 502.Platform part 504c is connected with the other end of erection part 504b, and parallel with panel 502.As shown in Figure 5, the end of erection part 504b is connected with the end of body 504a, and erection part 504b is roughly vertical with body 504a.The end of platform part 504c is connected with the other end of erection part 504b, and platform part 504c is roughly vertical with erection part 504b.Platform part 504c is positioned at the top of the end of body 504a, and platform part 504c and body 504a are positioned at the side of erection part 504b.
Driver module 508 is configured on the platform part 504c by a screw 515, and driver module 508 comprises flexible PCB 512 and aluminium flake 510.Aluminium flake 510 is configured on the platform part 504c, and is connected with metallic plate 504 thermal conductivity.Flexible PCB 512 to be being configured on the aluminium flake 510 with aluminium flake 510 thermal conductivity ways of connecting, and is electrically connected with panel 502.Wherein, the upper surface of flexible PCB 512 has several chips 517.
Embodiment four
Please refer to Fig. 6, it shows the part end view according to the plasm display device of the embodiment of the invention four.The plasm display device 600 of present embodiment is with plasm display device 500 differences of embodiment three, plasm display device 500 also has fin 612, cooling pad/thermal grease 614 and at least one perforation 618, and all the other same structures are all continued to use the label of Fig. 5.In Fig. 6, fin 612 to be being configured under the platform part 504c with sheet metal 504 thermal conductivity ways of connecting, and is arranged in platform part 504c, erection part 504b and the formed opening 616 of body 504a.Wherein, the design of configuration fin 612 can increase the radiating effect of panel 502 and driver module 508 under platform part 504c.
Cooling pad/thermal grease 614 is configured between platform part 504c and the aluminium flake 510, and is connected with aluminium flake 510 thermal conductivity with sheet metal 504, can increase the contact area of 504 of driver module 508 and metallic plates, and improves the radiating effect of driver module 508.Perforation 618 is formed among the erection part 504b, can increase near the thermal convection speed the fin 612, and can reduce the temperature of fin 612 rapidly.
Embodiment five
Please refer to Fig. 7, it shows the part end view according to the plasm display device of the embodiment of the invention five.In Fig. 7, plasm display device 700 comprises panel 702, metallic plate 704, driver module 708, fin 713 and cooling pad/thermal grease 714.Metallic plate 704 comprises body 704a, erection part 704b and platform part 704c, and body 704a is configured on the panel 702, and is connected with panel 702 thermal conductivity.The end of erection part 704b is connected with the end of body 704a, and erection part 704b is roughly vertical with body 704a.The end of platform part 704c is connected with the other end of erection part 704b, and platform part 704c is roughly vertical with erection part 704b.Platform part 704c is positioned at the top of an end of panel 702, and platform part 704c and body 704a are positioned at the both sides of erection part 704b.
Cooling pad/thermal grease 714 is configured under the platform part 704c, and is connected with metallic plate 704 thermal conductivity.Driver module 708 is configured in cooling pad/thermal grease 714 times by a screw 715, and driver module 708 comprises flexible PCB 712 and aluminium flake 710.Aluminium flake 710 is configured in cooling pad/thermal grease 714 times, and is connected with cooling pad/thermal grease 714 thermal conductivity.Flexible PCB 712 to be being configured in aluminium flake 710 times with aluminium flake 710 thermal conductivity ways of connecting, and is electrically connected with panel 702.Wherein, the lower surface of flexible PCB 712 has several chips 717.Fin 713 is configured on the platform part 704c, and is connected with metallic plate 704 thermal conductivity.
Certainly, plasm display device 700 also can omit fin 713 and cooling pad/thermal grease 714, makes driver module 708 directly be configured under the platform part 704c, reaches driver module 708 and metallic plate 704 thermal conductivity purpose of connecting.
Embodiment six
Please refer to Fig. 8, it shows the part end view according to the plasm display device of the embodiment of the invention six.In Fig. 8, plasm display device 800 comprises panel 802, metallic plate 804, driver module 808 and cooling pad/thermal grease 814.Metallic plate 804 comprises body 804a, erection part 804b and platform part 804c, and body 804a is configured on the panel 802, and is connected with panel 802 thermal conductivity.The end of erection part 804b is connected with the end of body 804a, and erection part 804b is roughly vertical with body 804a.The end of platform part 804c is connected with the other end of erection part 804b, and platform part 804c is roughly vertical with erection part 804b.Platform part 804c is positioned at the top of the end of body 804a, and platform part 804c and body 804a are positioned at the side of erection part 804b.
Cooling pad/thermal grease 814 is configured under the platform part 804c, and is connected with metallic plate 804 thermal conductivity.Driver module 808 is configured in cooling pad/thermal grease 814 times by a screw 815, and driver module 808 comprises flexible PCB 812 and aluminium flake 810.Aluminium flake 810 is configured in cooling pad/thermal grease 814 times, and is connected with cooling pad/thermal grease 814 thermal conductivity.Flexible PCB 812 to be being configured in aluminium flake 810 times with aluminium flake 810 thermal conductivity ways of connecting, and is electrically connected with panel 802.Wherein, the lower surface of flexible PCB 812 has several chips 817.
In addition, as long as platform part 804c and flexible PCB 812 has enough spaces between the warp architecture above the platform part 804c, present embodiment also can install a fin additional on platform part 804c, and this fin is connected with metallic plate 804 thermal conductivity.
Certainly, plasm display device 800 also can omit cooling pad/thermal grease 814, makes driver module 808 directly be configured under the platform part 804c, reaches driver module 808 and metallic plate 804 thermal conductivity purpose of connecting.
Embodiment seven
Please refer to Fig. 9, it shows the part end view according to the plasm display device of the embodiment of the invention seven.In Fig. 9, plasm display device 900 comprises panel 902, metallic plate 904, driver module 908, fin 913 and cooling pad/thermal grease 914.Metallic plate 904 comprises body 904a and erection part 904b, and body 904a is configured on the panel 902, and is connected with panel 902 thermal conductivity.Erection part 904b is connected with body 904a, and erection part 904b stands upright on the top of panel 902.As shown in Figure 9, the end of erection part 904b is connected with the end of body 904a, and erection part 904b is roughly vertical with body 904a, and erection part 904b is positioned on the end of panel 902.Cooling pad/thermal grease 914 is configured on the outside of erection part 904b, and is connected with metallic plate 904 thermal conductivity.Driver module 908 is configured on cooling pad/thermal grease 814 by a screw 915, and driver module 908 comprises flexible PCB 912 and aluminium flake 910.Aluminium flake 910 is configured on cooling pad/thermal grease 814 in the mode of the 904b of parallel upright portion, and is connected with cooling pad/thermal grease 914 thermal conductivity.Flexible PCB 912 to be being configured on the outside of aluminium flake 910 with aluminium flake 910 thermal conductivity ways of connecting, and is electrically connected with panel 902.Wherein, the outside of flexible PCB 912 has several chips 917.Fin 913 is configured on the inboard of erection part 904b, and is connected with metallic plate 904 thermal conductivity.
Certainly, plasm display device 900 also can omit fin 913 and cooling pad/thermal grease 914, makes driver module 908 directly be configured on the outside of erection part 904b, reaches driver module 908 and metallic plate 904 thermal conductivity purpose of connecting.
Embodiment eight
Please refer to Figure 10, it shows the part end view according to the plasm display device of the embodiment of the invention eight.In Figure 10, plasm display device 1000 comprises panel 1002, metallic plate 1004, driver module 1008, fin 1013 and cooling pad/thermal grease 1014.Metallic plate 1004 comprises body 1004a and erection part 1004b, and body 1004a is configured on the panel 1002, and is connected with panel 1002 thermal conductivity.Erection part 1004b is connected with body 1004a, and erection part 1004b stands upright on the top of panel 1002.As shown in figure 10, the end of erection part 1004b is connected with the end of body 1004a, and erection part 1004b is roughly vertical with body 1004a, and erection part 1004b is positioned on the end of panel 1002.Cooling pad/thermal grease 1014 is configured on the inboard of erection part 1004b, and is connected with metallic plate 1004 thermal conductivity.Driver module 1008 is configured on cooling pad/thermal grease 1014 by a screw 1015, and driver module 1008 comprises flexible PCB 1012 and aluminium flake 1010.Aluminium flake 1010 is configured on cooling pad/thermal grease 1014 in the mode of the 1004b of parallel upright portion, and is connected with cooling pad/thermal grease 1014 thermal conductivity.Flexible PCB 1012 to be being configured on the aluminium flake 1010 with aluminium flake 1010 thermal conductivity ways of connecting, and is electrically connected with panel 1012.Wherein, flexible PCB 1012 has several chips 1017.Fin 1013 is configured on the outside of erection part 1004b, and is connected with metallic plate 1004 thermal conductivity.
Certainly, plasm display device 1000 also can omit fin 1013 and cooling pad/thermal grease 1014, makes driver module 1008 directly be configured on the inboard of erection part 1004b, reaches driver module 1008 and metallic plate 1004 thermal conductivity purpose of connecting.
Embodiment nine
Please refer to Figure 11 A, it shows the part end view according to the plasm display device of the embodiment of the invention nine.In Figure 11 A, plasm display device 1100 comprises panel 1102, aluminium flake 1104, spacer (stand-off) 1106, driver module 1108 and fin 1113 at least.Aluminium flake 1104 is configured on the panel 1102, and is connected with panel 1102 thermal conductivity, and spacer 1106 erectly is configured on the aluminium sheet 1104.Driver module 1108 is configured on the spacer 1106, makes to have a difference in height between driver module 1108 and the aluminium sheet 1104.Driver module 1108 comprises flexible PCB 1112 and aluminium flake 1110, and flexible PCB 1112 is configured on the spacer 1106, and is electrically connected with panel 1102.Wherein, the lower surface of flexible PCB 1112 has several chips 1117.Aluminium flake 1110 is configured on the flexible PCB 1112, and is connected with flexible PCB 1112 thermal conductivity.Fin 1113 is configured on the aluminium flake 1110, and is connected with aluminium flake 1110 thermal conductivity.
Because plasm display device 1100 has several driver modules 1108, shown in Figure 11 B, and the space between the two adjacent driver modules 1108 can install a thermal transfer plate 1122 additional, connect fin 1113 and aluminium sheet 1104 with thermal conductivity, make the heat of fin 1113 can conduct on the aluminium sheet 1104.At this moment, aluminium sheet 1104 can be regarded as a big fin.
Embodiment ten
Please refer to Figure 12, it shows the part end view according to the plasm display device of the embodiment of the invention ten.In Figure 12, plasm display device 1200 comprises panel 1202, metallic plate 1204, driver module 1208 and thermal transfer plate 1222.Metallic plate 1204 comprises the first body 1204a, the first erection part 1204b and the first platform part 1204c, and the first erection part 1204a is configured on the panel 1202, and is connected with panel 1202 thermal conductivity.The end of the first erection part 1204b is connected with the first body 1204a, and the first erection part 1204b stands upright on the top of panel 1202.The first platform part 1204c is connected with the other end of the first erection part 1204b, and parallel with panel 1202.As shown in figure 12, the end of the first erection part 1204b is connected with the end of the first body 1204a, and the first erection part 1204b is roughly vertical with the first body 1204a.The end of the first platform part 1204c is connected with the other end of the first erection part 1204b, and the first platform part 1204c is roughly vertical with the first erection part 1204b.The first platform part 1204c and the first body 1204a are positioned at the both sides of the first erection part 1204b, and the first platform part 1204c is positioned at the top of panel 1,202 one ends.
In addition, thermal transfer plate 1222 comprises the second body 1222a, the second erection part 1222b and the second platform part 1222c.The second body 1222a is configured on the first body 1204a, and is connected with metallic plate 1204 thermal conductivity.The end of the second erection part 1222b is connected with the second body 1222a, and the second erection part 1222b stands upright on the top of panel 1202.The second platform part 1222c is connected with the other end of the second erection part 1222b, and parallel with panel 1202.As shown in figure 12, the end of the second erection part 1222b is connected with the end of the second body 1222a, and the second erection part 1222b is roughly vertical with the second body 1222a.The end of the second platform part 1222c is connected with the other end of the second erection part 1222b, and the second platform part 1222c is roughly vertical with the second erection part 1222b.And the second platform part 1222c and the second body 1222a are positioned at the both sides of the second erection part 1222b, make the second platform part 1222c can be configured on the first platform part 1204c, reach the effect that thermal transfer plate 1222 is connected with metallic plate 1204 thermal conductivity.
Driver module 1208 is configured on the second platform part 1222c by a screw 1215, and driver module 1208 comprises flexible PCB 1212 and aluminium flake 1210.Aluminium flake 1210 is configured on the second platform part 1222c, and is connected with thermal transfer plate 1222 thermal conductivity.Flexible PCB 1212 to be being configured on the aluminium flake 1210 with aluminium flake 1210 thermal conductivity ways of connecting, and is electrically connected with panel 1202.Wherein, the upper surface of flexible PCB 1212 has several chips 1217.
The present invention disposes the design of thermal transfer plate 1222 on metallic plate 1204, can increase whole area of dissipation, and improves the radiating effect of driver module 1208 and panel 1202.
Embodiment 11
Please refer to Figure 13, it shows the part end view according to the plasm display device of the embodiment of the invention 11.In Figure 13, plasm display device 1300 comprises panel 1302, metallic plate 1304, driver module 1308 and thermal transfer plate 1322.Metallic plate 1304 comprises the first body 1304a, the first erection part 1304b and the first platform part 1304c, and the first erection part 1304a is configured on the panel 1302, and is connected with panel 1302 thermal conductivity.The end of the first erection part 1304b is connected with the first body 1304a, and the first erection part 1304b stands upright on the top of panel 1302.The first platform part 1304c is connected with the other end of the first erection part 1304b, and parallel with panel 1302.As shown in figure 13, the end of the first erection part 1304b is connected with the end of the first body 1304a, and the first erection part 1304b is roughly vertical with the first body 1304a.The end of the first platform part 1304c is connected with the other end of the first erection part 1304b, and the first platform part 1304c is roughly vertical with the first erection part 1304b.The first platform part 1304c and the first body 1304a are positioned at the side of the first erection part 1304b, and the first platform part 1304c is positioned at the top of panel 1,302 one ends.
In addition, thermal transfer plate 1322 comprises the second body 1322a, the second erection part 1322b and the second platform part 1322c.The second body 1322a is configured on the first body 1304a, and is connected with metallic plate 1304 thermal conductivity.The end of the second erection part 1322b is connected with the second body 1322a, and the second erection part 1322b stands upright on the top of panel 1302.The second platform part 1322c is connected with the other end of the second erection part 1322b, and parallel with panel 1302.As shown in figure 13, the end of the second erection part 1322b is connected with the end of the second body 1322a, and the second erection part 1322b is roughly vertical with the second body 1322a.The end of the second platform part 1322c is connected with the other end of the second erection part 1322b, and the second platform part 1322c is roughly vertical with the second erection part 1322b.And the second platform part 1322c and the second body 1322a are positioned at the both sides of the second erection part 1322b, make the second platform part 1322c can be configured on the first platform part 1304c, reach the effect that thermal transfer plate 1322 is connected with metallic plate 1304 thermal conductivity.
Driver module 1308 is configured on the second platform part 1322c by a screw 1315, and driver module 1308 comprises flexible PCB 1312 and aluminium flake 1310.Aluminium flake 1310 is configured on the second platform part 1322c, and is connected with thermal transfer plate 1322 thermal conductivity.Flexible PCB 1312 to be being configured on the aluminium flake 1310 with aluminium flake 1310 thermal conductivity ways of connecting, and is electrically connected with panel 1302.Wherein, the upper surface of flexible PCB 1312 has several chips 1317.
Embodiment 12
Please refer to Figure 14, it shows the part end view according to the plasm display device of the embodiment of the invention 12.In Figure 14, plasm display device 1400 comprises panel 1402, metallic plate 1404 and driver module 1408.Metallic plate 1404 comprises body 1404a, erection part 1404b and platform part 1404c, and body 1404a is configured on the panel 1402, and is connected with panel 1402 thermal conductivity.The end of erection part 1404b is connected with body 1404a, and stands upright on the top of panel 1402.Platform part 1404c is connected with the other end of erection part 1404b, and parallel with panel 1402.As shown in figure 14, the end of erection part 1404b is connected with body 1404a, and erection part 1404b stands upright on the body 1404a.The end of platform part 1404c is connected with erection part 1404b, and platform part 1404c is roughly vertical with erection part 1404b, and platform part 1404c is positioned at the top of the end of body 1404a.
Driver module 1408 is configured on the platform part 1404c by a screw 1415, and driver module 1408 comprises flexible PCB 1412 and aluminium flake 1410.Aluminium flake 1410 is configured on the platform part 1404c, and is connected with metallic plate 1404 thermal conductivity.Flexible PCB 1412 to be being configured on the aluminium flake 1410 with aluminium flake 1410 thermal conductivity ways of connecting, and is electrically connected with panel 1402.Wherein, the upper surface of flexible PCB 1412 has several chips 1417.
Those skilled in the art can understand that technology of the present invention is not confined to this, and for example, the material of metallic plate and thermal transfer plate is copper, aluminium or other high-cooling property material.Wherein, driver module of the present invention can via chip film joining technique (chip on film, COF), chip substrate joining technique (chipon board) or other correlation technique and form.In addition, the present invention also can be installed one cooling pad/thermal grease additional between panel and metallic plate, and increases the contact area between panel and the metallic plate, and improves the radiating effect of panel.In addition, the present invention also can be installed one cooling pad/thermal grease additional between metallic plate and fin, and increases the contact area between metallic plate and the fin, and improves whole radiating effect.
The plasm display device that the above embodiment of the present invention is disclosed, the design that its driver module is connected with the metallic plate thermal conductivity can increase the area of dissipation of driver module, improves the useful life of driver module.In addition, the present invention disposes the design of fin, thermal transfer plate and cooling pad/thermal grease, can promptly reach the better heat radiating effect of driver module and panel.
In sum; though the present invention discloses as above in conjunction with a preferred embodiment; right its is not in order to limit the present invention; those skilled in the art; without departing from the spirit and scope of the present invention; can do various changes and retouching, so protection scope of the present invention is with being as the criterion that claims were defined.

Claims (20)

  1. A plasm display device (plasma disp1ay panel PDP), comprises at least:
    One panel;
    One metallic plate is connected with this panel thermal conductivity, and this metallic plate comprises:
    One body is configured on this panel;
    One erection part, the one end is connected with this body, and this erection part stands upright on the top of this panel; And
    One platform part is connected with the other end of this erection part, and parallel with this panel; And
    One driver module is configured on this platform part or down, and is connected with this metallic plate thermal conductivity.
  2. 2. as claims 1 described device, wherein this driver module comprises:
    One aluminium flake is configured on this platform part, and is connected with this metallic plate thermal conductivity; And
    One flexible PCB being configured on this aluminium flake with this aluminium flake thermal conductivity ways of connecting, and is electrically connected with this panel.
  3. 3. as claims 2 described devices, wherein an end of this erection part is connected with an end of this body, and this platform part and this body are positioned at the both sides of this erection part.
  4. 4. as claims 3 described devices, wherein this plasma display unit also comprises:
    One fin being configured under this platform part with this metallic plate thermal conductivity ways of connecting, and is arranged in the formed opening of an end of this platform part, this erection part and this panel
  5. 5. as claims 2 described devices, wherein an end of this erection part is connected with an end of this body, and this platform part and this body are positioned at a side of this erection part.
  6. 6. as claims 5 described devices, wherein this plasma display unit also comprises:
    One fin being configured under this platform part with this metallic plate thermal conductivity ways of connecting, and is arranged in this platform part, this erection part and the formed opening of this body.
  7. 7. as claims 1 described device, wherein this driver module comprises:
    One aluminium flake is configured under this platform part, and is connected with this metallic plate thermal conductivity; And
    One flexible PCB being configured under this aluminium flake with this aluminium flake thermal conductivity ways of connecting, and is electrically connected with this panel.
  8. 8. as claims 7 described devices, wherein this plasma display unit also comprises:
    One fin is configured on this platform part, and is connected with this metallic plate thermal conductivity.
  9. 9. as claims 1 described device, wherein this plasma display unit also comprises:
    One cooling pad/thermal grease is configured between this panel and this metallic plate, and is connected with this metallic plate thermal conductivity with this panel.
  10. 10. plasm display device comprises at least:
    One panel;
    One metallic plate is connected with this panel thermal conductivity, and this metallic plate comprises:
    One body is configured on this panel; And
    One erection part, the one end is connected with this body, and this erection part is positioned at the top of this panel; And
    One driver module being configured on the side of this erection part with this metallic plate thermal conductivity ways of connecting, and is electrically connected with this panel.
  11. 11. as claims 10 described devices, wherein this driver module comprises:
    One aluminium flake is configured on this side of this erection part, and is connected with this metallic plate thermal conductivity; And
    One flexible PCB being configured on this aluminium flake with this aluminium flake thermal conductivity ways of connecting, and is electrically connected with this panel.
  12. 12. as claims 11 described devices, wherein this plasma display unit also comprises:
    One fin is configured on the opposite side of this erection part, and is connected with this metallic plate thermal conductivity.
  13. 13. as claims 10 described devices, wherein this plasma display unit also comprises:
    One cooling pad/thermal grease is configured between this panel and this metallic plate, and is connected with this panel and this metallic plate thermal conductivity.
  14. 14. a plasm display device comprises at least:
    One panel;
    One metallic plate is connected with this panel thermal conductivity, and this metallic plate comprises:
    One first body is configured on this panel;
    One first erection part, the one end is connected with this first body, and this first erection part stands upright on the top of this panel; And
    One first platform part is connected with the other end of this first erection part, and parallel with this panel;
    One thermal transfer plate is connected with this metallic plate thermal conductivity, and this thermal transfer plate comprises:
    One second body is configured on this first body;
    One second erection part, the one end is connected with this second body, and this second erection part stands upright on the top of this panel; And
    One second platform part is connected with the other end of this second erection part, and parallel with this panel, and this second platform part is positioned on this first platform part; And
    One driver module being configured on this second platform part with this thermal transfer plate thermal conductivity ways of connecting, and is electrically connected with this panel.
  15. 15. as claims 14 described devices, wherein an end of this first erection part is connected with an end of this first body, and this first platform part and this first body are positioned at the both sides of this first erection part.
  16. 16. as claims 15 described devices, wherein an end of this second erection part is connected with an end of this second body, and this second platform part and this second body are positioned at the both sides of this second erection part.
  17. 17. as claims 16 described devices, wherein this driver module comprises:
    One aluminium flake is configured on this second platform part, and is connected with this thermal transfer plate thermal conductivity; And
    One flexible PCB being configured on this aluminium flake with this aluminium flake thermal conductivity ways of connecting, and is electrically connected with this panel.
  18. 18. as claims 14 described devices, wherein an end of this first erection part is connected with an end of this first body, and this first platform part and this first body are positioned at a side of this first erection part.
  19. 19. as claims 18 described devices, wherein an end of this second erection part is connected with an end of this second body, and this second platform part and this second body are positioned at the both sides of this second erection part.
  20. 20. as claims 19 described devices, wherein this driver module comprises:
    One aluminium flake is configured on this second platform part, and is connected with this thermal transfer plate thermal conductivity; And
    One flexible PCB being configured on this aluminium flake with this aluminium flake thermal conductivity ways of connecting, and is electrically connected with this panel.
CNB031225624A 2003-04-18 2003-04-18 Plasma display device Expired - Fee Related CN1288695C (en)

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Application Number Priority Date Filing Date Title
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CN1288695C CN1288695C (en) 2006-12-06

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102074166A (en) * 2009-11-19 2011-05-25 Lg电子株式会社 Plasma display device and multi plasma display device
CN103036618A (en) * 2012-12-13 2013-04-10 深圳市易飞扬通信技术有限公司 Light transmit-receive element and sealing method thereof
CN103199432A (en) * 2013-03-22 2013-07-10 烽火通信科技股份有限公司 Mounting structure and mounting method of tunable laser
WO2021035538A1 (en) * 2019-08-27 2021-03-04 京东方科技集团股份有限公司 Display apparatus and fabrication method, heat dissipation film layer, and electronic device

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102074166A (en) * 2009-11-19 2011-05-25 Lg电子株式会社 Plasma display device and multi plasma display device
CN103036618A (en) * 2012-12-13 2013-04-10 深圳市易飞扬通信技术有限公司 Light transmit-receive element and sealing method thereof
CN103199432A (en) * 2013-03-22 2013-07-10 烽火通信科技股份有限公司 Mounting structure and mounting method of tunable laser
CN103199432B (en) * 2013-03-22 2014-12-31 烽火通信科技股份有限公司 Mounting structure and mounting method of tunable laser
WO2021035538A1 (en) * 2019-08-27 2021-03-04 京东方科技集团股份有限公司 Display apparatus and fabrication method, heat dissipation film layer, and electronic device
CN112715058A (en) * 2019-08-27 2021-04-27 京东方科技集团股份有限公司 Display device and preparation method thereof, heat dissipation film layer and electronic equipment
CN112715058B (en) * 2019-08-27 2023-05-16 京东方科技集团股份有限公司 Display device, manufacturing method, heat dissipation film layer and electronic equipment
US11980081B2 (en) 2019-08-27 2024-05-07 Boe Technology Group Co., Ltd. Display device, method for manufacturing display device, heat dissipation layer, and electronic device

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