CN1534752A - IC wafer electrical property testing equipment for prerenting electrostatic destruction and method of preventing electrostatic destruction - Google Patents
IC wafer electrical property testing equipment for prerenting electrostatic destruction and method of preventing electrostatic destruction Download PDFInfo
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- CN1534752A CN1534752A CNA031090451A CN03109045A CN1534752A CN 1534752 A CN1534752 A CN 1534752A CN A031090451 A CNA031090451 A CN A031090451A CN 03109045 A CN03109045 A CN 03109045A CN 1534752 A CN1534752 A CN 1534752A
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Abstract
An antistatic electric performance tester of IC chip and its method for preventing electrostatic destroy are disclosed. Said tester has a temp controlled oven casing, an oven door connected to said casing, at least one pair of thermally insulating refractory clamping bars on one surface of said door and a linkage-type guide rod installed to oven door for controlling the open or close of said clamping bars. When said clamping bars are separated from each other, a test board (DUT board) of the elements to be tested can pass through the gap between them without friction with them, so not generating static electricity.
Description
Technical field
The invention provides the method that a kind of IC wafer device of testing electrical properties and a kind of antistatic destroy, especially refer to that a kind of can preventing causes element under test (device under test, DUT) method of ruined IC wafer device of testing electrical properties and a kind of antistatic destruction because of electrostatic phenomenon.
Background of invention
In the IC wafer manufacturing process, " reliability (reliability) " of product is one of very important considerations, and reliability can simply be described as product under regular service conditions, the useful life that can work smoothly.The IC manufacturer is in order to learn the useful life of product at short notice; usually can use " accelerated aging test experiments " (Accelerated lifetime test) to predict the average life of product; its mode is to utilize the operational environment stricter than normal running conditions; for example under higher ambient temperature, voltage, electric current or pressure, carry out the life of product test; try to achieve the life-span of product under impaired condition, utilize lifetime model (Lifetime Model) to calculate the life-span of product under regular service conditions again.The reliability testing of general IC factory can be divided into " wafer level " (Wafer-Level Reliability according to its method of testing, WLR) reach " encapsulation level " (Package-Level Reliability, PLR) two kinds, the former does test with the tester table that wafer is directly put on the general production line, the latter then is that elder generation is packaged into the wafer cutting more than test sample book, then these samples are inserted test board, it is positioned in the special high temperature furnace does test again.Wherein the life test experiment condition (stress condition) of " encapsulation level " reliability testing is near the product normal running conditions, the result also comparatively industry accept.
At present IC wafer factory the encapsulation level IC wafer device of testing electrical properties of normal use be as shown in Figure 1, Fig. 1 is the schematic appearance of a known IC wafer device of testing electrical properties 10, IC wafer device of testing electrical properties 10 comprises a temperature-controlled oven housing 12 and one or two exotic material 20, as rubber, be located at regularly on the fire door 14.Exotic material 20 is to move, and is used for the inside and outside temperature of isolated temperature-controlled oven, and the slit 22 of several incisions is arranged on it, inserts on the fire door 14 for test board (DUT board) 18 passes.Known IC wafer device of testing electrical properties 10 comprises one group of measurement circuit contact (not shown) usually in addition and is located at fire door 14 outsides, is used for external measurement circuit, carries out the testing electrical property of IC wafer to use this measurement circuit.When testing, element under test (the device under test of test sample book will be packaged into, DUT) 16 slots (socket) 26 that are installed on the test board 18, and test board 18 inserted on the fire door 14, as shown in Figure 1, fire door 14 is closed, utilize temperature-controlled oven to provide reliability testing required hot environment then, the mat measurement circuit provides electric current, voltage to test.
But the disappearance that can't prevent the electrostatic breakdown element under test is being arranged in the design of known IC wafer device of testing electrical properties 10: when the slit 22 that operating personnel pass exotic material with test board 18 inserts on the fire door 14 (loadDUT boards), understand mutual friction mutually with this exotic material and produce electrostatic phenomenon at golden finger 24 on the test board 18 and plate face conduction place, destroy the structure and the integrality of element under test, cause when official testing is not electrical as yet, element loses normal function with regard to suffering electrostatic breakdown, same, finish in test, operating personnel with test board 18 when fire door 14 takes off (unload), also can be because of producing static with this exotic material friction, destroy the yield of element, cause greatest loss.
At present at the means to save the situation of the disappearance of known IC wafer device of testing electrical properties, the special fixtures that is provided by the former factory of testing equipment generally is provided, when test sample book is positioned over the slot of test board, earlier seal each IC element under test with this special fixtures, make operating personnel when the insertion test board is on fire door, not have generation of static electricity, before carrying out testing electrical property, again the anchor clamps on each element under test are pulled down one by one then, just can be tested; Test finishes, and before operating personnel's desire is taken off test board, equally also must load onto the appended antistatic anchor clamps of former factory earlier, just can take off test board.Though this utilizes the method for anchor clamps can effectively prevent generation of static electricity, but when carrying out testing electrical property, must install, take off anchor clamps the expensive time, step also bothers very much, even when operating personnel in installing during anchor clamps, also may destroy element under test, still can't effectively improve the cost and the effect of testing electrical property because step complicated causes artificial careless mistake.Therefore a kind of IC wafer device of testing electrical properties that uses the simple antistatic of step to destroy real as institute of current I C manufactory in a hurry need.
Summary of the invention
Main purpose of the present invention is to provide a kind of step of using simple and can effectively prevent the IC wafer device of testing electrical properties and the method for electrostatic breakdown element, to solve the problem of above-mentioned known IC wafer device of testing electrical properties and method.
The IC wafer device of testing electrical properties that a kind of antistatic destroys, it includes:
One temperature-controlled oven housing;
One fire door is linked to this temperature-controlled oven housing;
At least one pair of is high temperature resistant, and adiabatic clamp bar is located at one of this fire door side, with the temperature inside and outside isolated this temperature-controlled oven; And
One linkage type guide rod is located in this fire door, connect this to high temperature resistant adiabatic clamp bar with control this to the unlatching of high temperature resistant adiabatic clamp bar with closed, make this when opening, can allow a test board of placing element under test pass this high temperature resistant adiabatic clamp bar to plug on this fire door to high temperature resistant adiabatic clamp bar, and do not touch this high temperature resistant adiabatic clamp bar that rubs, avoid producing electrostatic phenomenon by this.
Described testing equipment comprises a switch in addition to be located at outside this temperature-controlled oven housing, can control this unlatching and closure to high temperature resistant adiabatic clamp bar.
Described testing equipment includes a heat insulation foam in addition to be located in this fire door, is used to seal the inside and outside temperature of isolated this temperature-controlled oven, wherein has the slit of at least one incision on this heat insulation foam, plugs on this fire door for this test board passes from this slit.
Slit on described this heat insulation foam is the thickness greater than this test board, can not produce electrostatic phenomenon because of touching this heat insulation foam that rubs when making this test board pass this slit.
A kind of method of using IC wafer device of testing electrical properties antistatic to destroy, wherein this testing equipment comprises a temperature-controlled oven housing, a fire door and is connected in this temperature-controlled oven housing, at least two pairs of high temperature resistant adiabatic clamp bars and is located at the outside in this fire door respectively and is located in this fire door to seal the temperature inside and outside the isolated stove to seal temperature, a high temperature resistant heat insulation cotton inside and outside isolated this temperature-controlled oven, and at least two linkage type guide rod may command each to unlatching of high temperature resistant adiabatic clamp bar with closed, wherein this method comprises the following step:
Utilize this linkage type guide rod that each is opened high temperature resistant adiabatic clamp bar;
With the test board of placing element under test pass each to the high temperature resistant adiabatic clamp bar opened to insert on this fire door;
Utilize this linkage type guide rod to make each to high temperature resistant adiabatic clamp bar closure;
Close this fire door; And
Carry out test jobs.
Described method comprises the following step in addition: utilize this linkage type guide rod that each is opened high temperature resistant adiabatic clamp bar after carrying out test jobs; And this test board taken off from this fire door.
Described method wherein can allow this test board pass when each is opened high temperature resistant adiabatic clamp bar and not touch this high temperature resistant adiabatic clamp bar that rubs, and avoids producing electrostatic phenomenon by this.
Described high temperature resistant adiabatic clamp bar is made of high temperature polymeric materials.
Described linkage type guide rod is to be located at the outer switch of this temperature-controlled oven housing with one to be controlled, by this switch controls of operation each unlatching and closure to high temperature resistant adiabatic clamp bar.
Described switch is an automatic button formula device.
Described switch is a manual draw bar formula device.
The slit that has at least one incision on the described high temperature resistant heat insulation cotton, for passing from this slit, this test board plugs on this fire door, and this slit is greater than this test board, can be because of the touching cotton electrostatic phenomenon that produces of this high temperature resistant heat insulation that rubs when making this test board pass this slit.
Described testing equipment is to be used to measure the electrical of element under test.
Because IC wafer device of testing electrical properties of the present invention has a linkage type guide rod that is arranged in the fire door, can high temperature resistant adiabatic clamp bar be opened manually or automatically to control, make operating personnel when inserting in test board on the fire door, can not touch the high temperature resistant adiabatic clamp bar that rubs, therefore can not produce the phenomenon of electrostatic breakdown element under test, and after finishing this action, this linkage type guide rod of may command makes this high temperature resistant adiabatic clamp bar closure, carries out testing electrical property.Therefore the present invention can utilize simple method, just effectively prevents the generation of static, not only saves the whole testing time, also can improve the accuracy of all IC wafer sorts.
Your, see also following about detailed description of the present invention and accompanying drawing in order to make juror can further understand feature of the present invention and technology contents.Yet appended accompanying drawing is only for reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Fig. 1 is the schematic appearance of a known IC wafer device of testing electrical properties;
Fig. 2 is the schematic appearance of the IC wafer device of testing electrical properties of first embodiment of the invention antistatic destruction;
Fig. 3 is the front schematic view of door structure among Fig. 2;
Fig. 4 is the schematic appearance of the IC wafer device of testing electrical properties of second embodiment of the invention antistatic destruction;
Fig. 5 is the front schematic view of a door structure among Fig. 4.
Illustrated symbol description:
10 IC wafer device of testing electrical properties, 12 temperature-controlled oven housings
14 fire doors, 16 element under tests
18 test boards, 20 exotic materials
Slit 24 golden fingers on 22 exotic materials
26 slots, 30 IC wafer device of testing electrical properties
32 temperature-controlled oven housings, 34 fire doors
36 element under tests, 38 test boards
40 high temperature resistant adiabatic clamp bar 42 linkage type guide rods
44 slide glasses, 46 heat insulation foams
48 metallic plates, 50 fire door main bodys
52 insulated cabinets, 54 jumper wire board structures
56 jumper wire boards, 58 slots
60 IC wafer device of testing electrical properties, 62 temperature-controlled oven housings
64 fire doors, 70 high temperature resistant adiabatic clamp bars
72 linkage type guide rods, 74 slide glasses
76 heat insulation foams, 78 refractory metal plates
80 fire door main bodys, 82 insulated cabinets
84 jumper wire board structures, 86 jumper wire boards
Embodiment
Please refer to Fig. 2 and Fig. 3, Fig. 2 is the schematic appearance of the IC wafer device of testing electrical properties 30 of first embodiment of the invention antistatic destruction, and Fig. 3 is the front schematic view of fire door 34 structures among Fig. 2.IC wafer device of testing electrical properties 30 includes that a temperature-controlled oven housing 32, a fire door 34 are linked to this temperature-controlled oven housing 32, plural number is located on the fire door (only showing five pairs among the figure) high temperature resistant adiabatic clamp bar 40, and a linkage type guide rod 42 is located in the fire door 34.Wherein, high temperature resistant adiabatic clamp bar 40 can be made by macromolecular material, for example high-temperature resistant rubber.Be noted that IC wafer device of testing electrical properties 30 of the present invention includes, but not limited to heat board-like (heating plate type) and thermal convection formula heating furnace.IC test mode of heating is not an emphasis of the present invention, is interspersed on the fire door to carry out the occasion of testing electrical property as long as the IC test board need utilize, and all should belong to application category of the present invention.
See also Fig. 3, fire door 34 generally is divided into three parts (detailed structure is decided on the different platform kenel): fire door main body 50, insulated cabinet 52 and jumper wire board structure 54.A plurality of jumper wire boards (jump board) 56 are wherein arranged on the jumper wire board structure 54, can external measurement circuit by jumper wire board structure 54, test signals such as required electric current, voltage so that test to be provided.There is leader's (not shown) to open or pass upper furnace door 34 on the fire door main body 50 with convenient.Insulated cabinet 52 is to protrude from fire door 34, a similar rectangular box chamber, and its surface coverage whole piece metallic plate 48 has five microscler hole (not shown)s on the metallic plate 48, can be covered sealing by five pairs of high temperature resistant adiabatic clamp bars 40 by the inboard respectively.Include linkage type guide rod 42 and one deck heat insulation foam 46 at least in the insulated cabinet 52.Linkage type guide rod 42 is to be a driving bearing, which is provided with five pairs of long strip type slide glasses 44, and each connects each respectively to slide glass 44 and drives high temperature resistant adiabatic clamp bar 40 about to high temperature resistant adiabatic clamp bar 40 and energy and move, and carries out the open and close action.In addition, linkage type guide rod 42 an external switch (switch) (not shown)s, for example automatic button formula or manual draw bar formula device, also can be designed to the far-end remote control device, by this switch controls linkage type guide rod 42, the every pair of slide glass 44 on the drive linkage type guide rod 42 is so that every pair of high temperature resistant adiabatic clamp bar 40 closure or openness.Wherein, the mode that linkage type guide rod 42 drives slide glass 44 can be electrodynamic type or mechanical type, for instance, linkage type guide rod 42 can be a driving screw, drive moving of slide glass 44 through gear provided thereon and winding, when each outwards is moved apart slide glass 44, connection high temperature resistant adiabatic clamp bar 40 is thereon split around, the microscler hole that exposes iron plate 48, can allow the test board 38 of having placed element under test 36 by and can not touch metallic plate 48 or high temperature resistant adiabatic clamp bar 40; When each to slide glass 44 by gear and winding drive towards each other near the time, each just can be driven by slide glass 44 the high temperature resistant adiabatic clamp bar 40 that is connected in slide glass 44 and closure, this moment, high temperature resistant adiabatic clamp bar 40 just can be clamped the test board 38 that has inserted on the fire door 34, with the temperature inside and outside the closely isolated temperature-controlled oven.46 of heat insulation foams are the insulation effects that is used to improve whole temperature-controlled oven, fasten in insulated cabinet 52 inside with screw, and are same, and five slit (not shown)s of incision are also arranged on the heat insulation foam 46, aim at five holes on the metallic plate 48 respectively.These five slits are the thickness that is a bit larger tham test board 38, make test board 38 can not produce electrostatic phenomenon because of touching the heat insulation foam 46 that rubs when passing this slit.
When carrying out the testing electrical property of IC wafer, the inventive method is as described below.Operating personnel open fire door 34 earlier, utilize the switch control linkage type guide rod 42 of linkage type guide rod 42, make each open (promptly splitting around) to high temperature resistant adiabatic clamp bar 40, the test board 38 that to place element under test 36 then passes each high temperature resistant adiabatic clamp bar 40 to opening, insert on the fire door 34, then make each clamp each test board 38 with switch control linkage type guide rod 42 again to high temperature resistant adiabatic clamp bar 40 closures, close fire door 34, subsequently by the jumper wire board 56 that inserts on the jumper wire board structure 54, feed voltage and electric current, carry out test jobs.The mode of after test finishes element under test 36 being taken off then is earlier fire door 34 to be opened, utilize linkage type guide rod 42 that each is opened high temperature resistant adiabatic clamp bar 40, from fire door 34 each test board 38 of choosing down, so that will take out the slot 58 of each element under test 36 from test board 38.
See also Fig. 4 and Fig. 5, Fig. 4 is the schematic appearance of the IC wafer device of testing electrical properties 60 of second embodiment of the invention antistatic destruction, and Fig. 5 is the front schematic view of a fire door 64 structures among Fig. 4.Be provided with two temperature-controlled oven housings 62, two fire doors 64 in IC wafer device of testing electrical properties 60, each fire door 64 is provided with 20 pairs of high temperature resistant adiabatic clamp bars 70 and two linkage type guide rods 72 in each.As shown in Figure 5, be provided with a slice refractory metal plate 78, for example iron plate on insulated cabinet 82 surfaces, and ten pairs of high temperature resistant adiabatic clamp bars 70, but every pair of high temperature resistant adiabatic clamp bar 70 each slide glass 74 with a pair of move left and right are connected with linkage type guide rod 72, and the material of slide glass 74 is refractory metal, for example iron.Wherein, ten microscler hole (not shown)s are arranged on the refractory metal plate 78, be located at the rear of every pair of high temperature resistant adiabatic clamp bar 70.Unlatching and closure by every pair of high temperature resistant adiabatic clamp bar 70 of linkage type guide rod 72 may command; And same device is also arranged at the another side (with fire door main body 80 contact positions) of insulated cabinet 82, and being provided with ten pairs of high temperature resistant adiabatic clamp bars 70 and a linkage type guide rod 72, both link to each other with slide glass 74.Two linkage type guide rods 72 in insulated cabinet 72 connect a manual or automatic switch (not shown) in addition, can control linkage type guide rod 72 by this switch, and then 20 pairs of high temperature resistant adiabatic clamp bars 70 on the insulated cabinet 82 are opened simultaneously with closed.When high temperature resistant adiabatic clamp bar 70 is opened, can make the test board (not shown) of having placed element under test pass the microscler hole of high temperature resistant adiabatic clamp bar 70 and refractory metal plate 78 and insert on the fire door 64, and can not produce the situation of electrostatic breakdown element under test.In insulated cabinet 82, also can fill other heat insulation materials, increase the heat utilization of temperature-controlled oven.
In the present embodiment, two clamp test board to the interior outside of insulated cabinet 82 (respectively) high temperature resistant adiabatic clamp bar 70 before and after all can having each test board, therefore can provide better insulation effect to whole temperature-controlled oven.Moreover, one IC wafer device of testing electrical properties 60 has two temperature-controlled ovens, and the fire door 64 of each temperature-controlled oven can insert ten built-in testing plates altogether, so can once test more sample, obtain better average test data, and this two temperature-controlled oven also can be tested element under test with different temperature, electric current, voltage simultaneously, so IC wafer device of testing electrical properties 60 not only can be saved the shared space of testing equipment, also provides test condition more to select.
Compared to known IC wafer device of testing electrical properties, the present invention utilizes the linkage type guide rod to control the unlatching of high temperature resistant adiabatic clamp bar with closed, so, no matter operating personnel will insert in test board on the fire door or from fire door and take off, can not produce the electrostatic breakdown element under test, therefore can effectively prevent electrostatic breakdown IC wafer because touching rubs this high temperature resistant adiabatic clamp bar.On the other hand, employed test board need just can directly not be used among the present invention through any change in the known IC wafer device of testing electrical properties, so do not need to make new test board again at the present invention.Hence one can see that, spent testing time when the present invention not only can save many known device of testing electrical properties and uses, also IC wafer injured probability in test can be dropped to minimumly, and then improve the accuracy of reliability testing, also can help the cost control of IC wafer factory.
Employed material of IC wafer device of testing electrical properties of the present invention and temperature-controlled oven can provide the testing electrical property of 350 ℃ of temperature, be the general electrical required temperature of reliability testing of IC wafer, but for different testing requirements, also can utilize spirit of the present invention, design the device of testing electrical properties that meets testing requirement, for example cooperate thermal source that higher temperature is provided with different equipment materials.
The above only is preferred embodiment of the present invention, and all equalizations of being done according to the present patent application claim change and modify, and all should belong to the covering scope of patent of the present invention.
Claims (17)
1. the IC wafer device of testing electrical properties that destroys of an antistatic is characterized in that this testing equipment includes:
One temperature-controlled oven housing;
One fire door is linked to this temperature-controlled oven housing;
At least one pair of is high temperature resistant, and adiabatic clamp bar is located at one of this fire door side, with the temperature inside and outside isolated this temperature-controlled oven; And
One linkage type guide rod is located in this fire door, connect this to high temperature resistant adiabatic clamp bar with control this to the unlatching of high temperature resistant adiabatic clamp bar with closed, make this when opening, can allow a test board of placing element under test pass this high temperature resistant adiabatic clamp bar to plug on this fire door to high temperature resistant adiabatic clamp bar, and do not touch this high temperature resistant adiabatic clamp bar that rubs, avoid producing electrostatic phenomenon by this.
2. testing equipment as claimed in claim 1 is characterized in that: this is high temperature resistant, and adiabatic clamp bar is made of the high temperature-resistant polymer material.
3. testing equipment as claimed in claim 1 is characterized in that: this testing equipment comprises a switch in addition to be located at outside this temperature-controlled oven housing, can control this unlatching and closure to high temperature resistant adiabatic clamp bar.
4. testing equipment as claimed in claim 3 is characterized in that: this switch is an automatic button formula device.
5. testing equipment as claimed in claim 3 is characterized in that: this switch is a manual draw bar formula device.
6. testing equipment as claimed in claim 1, it is characterized in that: this testing equipment includes a heat insulation foam in addition and is located in this fire door, be used to seal the inside and outside temperature of isolated this temperature-controlled oven, wherein have the slit of at least one incision on this heat insulation foam, plug on this fire door for this test board passes from this slit.
7. testing equipment as claimed in claim 6 is characterized in that: the slit on this heat insulation foam is the thickness greater than this test board, can not produce electrostatic phenomenon because of touching this heat insulation foam that rubs when making this test board pass this slit.
8. testing equipment as claimed in claim 1 is characterized in that: this testing equipment is to be used to measure the electrical of element under test.
9. method of using IC wafer device of testing electrical properties antistatic to destroy, wherein this testing equipment comprises a temperature-controlled oven housing, a fire door and is connected in this temperature-controlled oven housing, at least two pairs of high temperature resistant adiabatic clamp bars and is located at the outside in this fire door respectively and is located in this fire door to seal the temperature inside and outside the isolated stove to seal temperature, a high temperature resistant heat insulation cotton inside and outside isolated this temperature-controlled oven, and at least two linkage type guide rod may command each to unlatching of high temperature resistant adiabatic clamp bar with closed, it is characterized in that this method comprises the following step:
Utilize this linkage type guide rod that each is opened high temperature resistant adiabatic clamp bar;
With the test board of placing element under test pass each to the high temperature resistant adiabatic clamp bar opened to insert on this fire door;
Utilize this linkage type guide rod to make each to high temperature resistant adiabatic clamp bar closure;
Close this fire door; And
Carry out test jobs.
10. method as claimed in claim 9 is characterized in that this method comprises the following step in addition:
After carrying out test jobs, utilize this linkage type guide rod that each is opened high temperature resistant adiabatic clamp bar; And
This test board is taken off from this fire door.
11. method as claimed in claim 9 is characterized in that: when each is opened high temperature resistant adiabatic clamp bar, can allow this test board pass and do not touch this high temperature resistant adiabatic clamp bar that rubs, avoid producing electrostatic phenomenon by this.
12. method as claimed in claim 9 is characterized in that: this is high temperature resistant, and adiabatic clamp bar is made of high temperature polymeric materials.
13. method as claimed in claim 9 is characterized in that: this linkage type guide rod is to be located at the outer switch of this temperature-controlled oven housing with one to be controlled, by this switch controls of operation each unlatching and closure to high temperature resistant adiabatic clamp bar.
14. method as claimed in claim 13 is characterized in that: this switch is an automatic button formula device.
15. method as claimed in claim 13 is characterized in that: this switch is a manual draw bar formula device.
16. method as claimed in claim 9, it is characterized in that: the slit that has at least one incision on this high temperature resistant heat insulation cotton, for passing from this slit, this test board plugs on this fire door, and this slit is greater than this test board, can be because of the touching cotton electrostatic phenomenon that produces of this high temperature resistant heat insulation that rubs when making this test board pass this slit.
17. method as claimed in claim 9 is characterized in that: this testing equipment is to be used to measure the electrical of element under test.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03109045 CN1253935C (en) | 2003-04-02 | 2003-04-02 | IC wafer electrical property testing equipment for prerenting electrostatic destruction and method of preventing electrostatic destruction |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03109045 CN1253935C (en) | 2003-04-02 | 2003-04-02 | IC wafer electrical property testing equipment for prerenting electrostatic destruction and method of preventing electrostatic destruction |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1534752A true CN1534752A (en) | 2004-10-06 |
| CN1253935C CN1253935C (en) | 2006-04-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03109045 Expired - Lifetime CN1253935C (en) | 2003-04-02 | 2003-04-02 | IC wafer electrical property testing equipment for prerenting electrostatic destruction and method of preventing electrostatic destruction |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1253935C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104020407A (en) * | 2013-03-01 | 2014-09-03 | 深圳市海洋王照明工程有限公司 | Method for testing electrostatic protection performance of integrated circuit |
-
2003
- 2003-04-02 CN CN 03109045 patent/CN1253935C/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104020407A (en) * | 2013-03-01 | 2014-09-03 | 深圳市海洋王照明工程有限公司 | Method for testing electrostatic protection performance of integrated circuit |
| CN104020407B (en) * | 2013-03-01 | 2016-12-28 | 深圳市海洋王照明工程有限公司 | A kind of method of testing of Integrated circuit electrostatic barrier propterty |
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| Publication number | Publication date |
|---|---|
| CN1253935C (en) | 2006-04-26 |
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Granted publication date: 20060426 |