CN1523685A - Packaging method for organic LED - Google Patents
Packaging method for organic LED Download PDFInfo
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- CN1523685A CN1523685A CNA031048277A CN03104827A CN1523685A CN 1523685 A CN1523685 A CN 1523685A CN A031048277 A CNA031048277 A CN A031048277A CN 03104827 A CN03104827 A CN 03104827A CN 1523685 A CN1523685 A CN 1523685A
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- emitting diode
- light emitting
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- organic light
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Abstract
A packaging method for an organic light emitting diode includes separately processing organic adhesion layer, inorganic blocking layer and organic light emitting diode element then coating surroundings of the base plate by adhesive to package the diode element by the blocking layer to get the aim of water-proof or moisture proof to prolong the life of the element, finally to bake it with UV-light or low temperature, so glass of the adhesive layer transfers the heat to make the two closely combine with each other.
Description
Technical field
The invention relates to a kind of Organic Light Emitting Diode (Organic Electro-Luminescence Element; Or Light Emitting Diode; OLED) method for packing of wafer, particularly a kind of about protective layer and Organic Light Emitting Diode being made last technology of again both being fitted both with sticker individually.
Background technology
Organic Light Emitting Diode (OLED) or title E L element, normally be formed among a pair of electrically opposite electrode layer as a sandwich shape by a luminous organic material layer, electronics is by an electrode layer directive luminous organic material layer, the electricity hole is then by another electrode directive luminous organic material layer, therefore electronics and electric hole will be incorporated into the luminous organic material layer, and produce light.EL element is compared with traditional bulb-type light-emitting component, has excellent shatter-proof ability and frivolous characteristic, therefore very is fit to as display element.Its major defect is:
EL element the back emitting characteristics, particularly luminosity of using a period of time and the uniformity with just enable the preliminary phase ratio, the degeneration of some degree is arranged.Find that according to the study wherein most important reason is to be easy to absorb aqueous vapor from EL element.And in case be adsorbed in after the surface of organic EL, just become the part that organic EL is formed, aqueous vapor will find that soon not irradiative dim spot generates, because the supply of electric power of this position is intercepted by aqueous vapor then toward the defective invasion of organic EL.
Therefore, prevent that organic EL chance tide from becoming important topic.People such as Kawami obtain United States Patent (USP) the 5th, 882, and No. 761, exercise question is " Organic EL Element ", are an embodiment who prevents the aqueous vapor invasion.With reference to shown in Figure 1, organic light emission pipe 6 comprises an ITO (indium-tin oxide electrode) 3, an organic luminous layer 4 and a negative electrode 5, seals with a transparent driving fit container 1, to prevent the invasion of water gas.Driving fit container 1 comprises that a glass substrate 2 and takes up the glass packaging box 7 of dry material 8, with encapsulants 9 sealings.
The method that Kawami provided is simple, but two big shortcomings are obviously arranged:
1, this structure will make that whole EL element has lost fully can be flexible;
2, in addition, whole element is because many containers, and it is many to make also that therefore thickness increases.
Another conventional method can be improved the described defective of Kawami patent, with reference to United States Patent (USP) the 6th, 198, No. 217, be by patents that the people obtained such as Suzuki, exercise question is " ORGNIC ELECTROLUMINESCENCENT DEVICEHAVING APROTECTIVE COVERING COMPRISING ORGANIC AND INORGANICLAYERS "
The structure that Suzuki proposed, with reference to shown in Figure 2, organic illuminating element U comprises an anode 10, one electric hole transport layer 12, an organic luminous layer 14, an electron transfer layer 16 and a negative electrode 18, is stacked in regular turn on the substrate 24.Organic illuminating element U again with organic barrier layer 20 and an inorganic barrier layer 22 as protective layer coating in succession.
Generally speaking, organic barrier layer 20 is preferable with the affinity of the negative electrode 18 of metal or alloy material, and can override the defective of light-emitting component U, and the whole surface of smoothing.And inorganic barrier layer 22 SiO for example
2, SiO, GeO, Al
2O
3, TiN or Si
3O
4Deng the protective layer that utilizes after vapour deposition method (vapor deposition) or sputtering method (sputtering) form lining.Organic barrier layer 22 has the water proofing property more preferable than organic barrier layer 20.
In the described processing procedure, there is no small trap, mainly is to handle with great care, otherwise just nullifies all the advantages.For example organic barrier layer 20 is a stratified film normally.Wherein parent material layer particular importance can be selected from photo-curing monomer (photocurable monomers), oligomers, thermoplastic resin or glass transition temperature macromolecule be arranged or low molecule.Thermoplastic resin needs and can anti-aqueous vapor arrive to a certain degree, and photo-curing monomer and oligomers then need the low volatility high-melting-point.Utilize to inject mould (casting) or spin-coating or vacuum evaporation and form, injecting mould or faster than vacuum evaporation with spin-coating production capacity, but carefully in the process moisture directly penetrate in the organic illuminating element U.Otherwise do not wait product to sell, element just can be not luminous.
Vacuum evaporation does not then have described problem, because it is to carry out under a kind of condition of decompression, therefore relatively can prevent that airborne moisture from mixing.But shortcoming is for large-area display, and its evaporation time will need very long, and production capacity certainly will be limited.
In addition, for example macromolecular material when coating, just need be heat-treated near its glass transition temperature usually, so that it softens, the defective that the while also can maintenance organic illuminating element U.But, the glass transition temperature of macromolecular material must be lower than the glass transition temperature of arbitrary layer of the constituent of organic illuminating element U, otherwise, will this organic illuminating element of deterioration U.
Summary of the invention
The method for packing that the purpose of this invention is to provide a kind of Organic Light Emitting Diode comprises the barrier layer and Organic Light Emitting Diode (EL element) the processing procedure separate processes of organic adhesion coating and inorganic barrier layer; Utilize adhesive to coat around the substrate again,, and reach waterproof, moistureproof to prolong the purpose in EL element life-span so that barrier layer is sealed EL element; Utilize ultraviolet light or low-temperature bake at last again, make both driving fits, reach the purpose of encapsulation cycle time of accelerating E L element with the glass transition temperature that reaches organic adhesion coating.
The object of the present invention is achieved like this: a kind of method for packing of Organic Light Emitting Diode is characterized in that: it comprises following steps in regular turn at least:
(1) provides a substrate and be formed at organic light-emitting diode element on this substrate;
(2) provide one not to be stained with film;
(3) forming an inorganic barrier layer is not stained with on the film in this;
(4) form an organic adhesion coating on this inorganic barrier layer; (5) coating one glue seal is around this substrate;
(6) utilize this glue seal and this organic adhesion coating will this organic adhesion coating to place the outer surface of this Organic Light Emitting Diode;
(7) remove this and be not stained with rete;
(8) impose heat treatment, so that the outer surface driving fit of this organic adhesion coating and this Organic Light Emitting Diode.
Described inorganic barrier layer is to be selected from ITO, SiO
2, SiO, GeO, Al
2O
3, TiN or Si
3O
4Wherein a kind of or its combination in any.Described organic barrier layer is wherein a kind of or its combination in any that is selected from polyethylene, polypropylene, epoxy resin or does not have the ring-type resin.Described glue seal is wherein a kind of or its combination in any that is selected from polyethylene, polypropylene, epoxy resin or does not have the ring-type resin.Described stickup step is to utilize the roller bearing pressing.Described stickup step is to utilize the cylinder pressing.Described heat treatment is to heat less than 120 ℃ of bakings.Described heat treatment is with the UV-irradiation heating less than 120 ℃.
Describe in detail below in conjunction with preferred embodiment and accompanying drawing.
Description of drawings
Fig. 1 is the protection against the tide encapsulation schematic diagram of traditional E L element.
Fig. 2 is the moistureproof encapsulation schematic diagram of second kind of traditional E L element.
Fig. 3-Fig. 5 is a moistureproof encapsulation schematic flow sheet of the present invention.
Embodiment
Consult shown in Figure 3, method of the present invention comprises that each layer that EL element is required comprises: EL element layers 100 such as an anode 110, one electric hole transport layer 112, an organic luminous layer 114, an electron transfer layer 116 and a negative electrode 118 are formed on the substrate 124 in regular turn.
Subsequently, consult shown in Figure 4ly, prepare one and be not stained with film (release film) 150, then utilize evaporation or sputtering method to form a thickness and be about inorganic barrier layer 122 less than 1 μ m in not being stained with on the film 150, inorganic barrier layer 122 can be selected from ITO, SiO
2, SiO, GeO, Al
2O
3, TiN or Si
3O
4A kind of Deng wherein;
And then, form an organic adhesion coating 130 again on inorganic barrier layer 122, organic adhesion coating 130 can be to be selected from polyethylene (PE), polypropylene (PP), epoxy resin (epoxy resin) or not have wherein a kind of such as ring-type resin (Acrylic resin).
And then, as shown in Figure 5, be coated with one deck adhesive (sealing agent) 40 at substrate 124 all around, adhesive can be selected from and described organic adhesion coating 130 identical materials or other material; At last, again with described comprise organic adhesion coating 130, inorganic barrier layer 122 and be not stained with rete 150 with cylinder (not shown) organic adhesion coating 130 is pasted on the cathode layer 118 of EL element.
At last, after stickup, utilize the mode of low-temperature bake again, or heat organic adhesion coating 130 in ultraviolet light irradiation mode, temperature is controlled at less than 120 ℃, to promote the driving fit of organic adhesion coating 130 and cathode layer 118.
According to described processing procedure, the present invention has following some benefit:
1, protective layer 122 and 130 can be prior to the EL element processing procedure, but also the EL element processing procedure carries out simultaneously, compares with conventional art, and spoke shortens waiting time greatly.
2, be suitable for large scaleization.
3, for soft substrate, use method encapsulation of the present invention, still can keep its characteristic.
The above is preferred embodiment of the present invention only, is not in order to qualification protection scope of the present invention, and all other do not break away from the equivalence of being finished under the disclosed spirit and change or modification, all should be included within protection scope of the present invention.
Claims (8)
1, a kind of method for packing of Organic Light Emitting Diode is characterized in that: it comprises following steps in regular turn at least:
(1) provides a substrate and be formed at organic light-emitting diode element on this substrate;
(2) provide one not to be stained with film;
(3) forming an inorganic barrier layer is not stained with on the film in this;
(4) form an organic adhesion coating on this inorganic barrier layer;
(5) form a glue seal around this substrate;
(6) utilize this glue seal and this organic adhesion coating will this organic adhesion coating in the outer surface of this Organic Light Emitting Diode;
(7) remove this and be not stained with rete;
(8) impose heat treatment, so that the outer surface driving fit of this organic adhesion coating and this Organic Light Emitting Diode.
2, the method for packing of Organic Light Emitting Diode according to claim 1 is characterized in that: described inorganic barrier layer is to be selected from ITO, SiO
2, SiO, GeO, Al
2O
3, TiN or Si
3O
4Wherein a kind of or its combination in any.
3, the method for packing of Organic Light Emitting Diode according to claim 1 is characterized in that: described organic barrier layer is wherein a kind of or its combination in any that is selected from polyethylene, polypropylene, epoxy resin or does not have the ring-type resin.
4, the method for packing of Organic Light Emitting Diode according to claim 1 is characterized in that: described glue seal is wherein a kind of or its combination in any that is selected from polyethylene, polypropylene, epoxy resin or does not have the ring-type resin.
5, the method for packing of Organic Light Emitting Diode according to claim 1 is characterized in that: described stickup step is to utilize the roller bearing pressing.
6, the method for packing of Organic Light Emitting Diode according to claim 1 is characterized in that: described stickup step is to utilize the cylinder pressing.
7, the method for packing of Organic Light Emitting Diode according to claim 1 is characterized in that: described heat treatment is to heat less than 120 ℃ of bakings.
8, the method for packing of Organic Light Emitting Diode according to claim 1 is characterized in that: described heat treatment is with the UV-irradiation heating less than 120 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031048277A CN100342563C (en) | 2003-02-20 | 2003-02-20 | Packaging method for organic LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031048277A CN100342563C (en) | 2003-02-20 | 2003-02-20 | Packaging method for organic LED |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1523685A true CN1523685A (en) | 2004-08-25 |
| CN100342563C CN100342563C (en) | 2007-10-10 |
Family
ID=34282387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031048277A Expired - Lifetime CN100342563C (en) | 2003-02-20 | 2003-02-20 | Packaging method for organic LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100342563C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101916831A (en) * | 2010-06-30 | 2010-12-15 | 华南理工大学 | Method for preparing organic light-emitting diode (OLED) display screen by full printing process |
| CN102244203A (en) * | 2011-05-19 | 2011-11-16 | 友达光电股份有限公司 | Organic light emitting device |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5965907A (en) * | 1997-09-29 | 1999-10-12 | Motorola, Inc. | Full color organic light emitting backlight device for liquid crystal display applications |
| CN1200463C (en) * | 2001-04-13 | 2005-05-04 | 翰立光电股份有限公司 | Organic LED and its making process |
| US6480389B1 (en) * | 2002-01-04 | 2002-11-12 | Opto Tech Corporation | Heat dissipation structure for solid-state light emitting device package |
-
2003
- 2003-02-20 CN CNB031048277A patent/CN100342563C/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101916831A (en) * | 2010-06-30 | 2010-12-15 | 华南理工大学 | Method for preparing organic light-emitting diode (OLED) display screen by full printing process |
| CN102244203A (en) * | 2011-05-19 | 2011-11-16 | 友达光电股份有限公司 | Organic light emitting device |
| CN102244203B (en) * | 2011-05-19 | 2014-01-22 | 友达光电股份有限公司 | organic light emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100342563C (en) | 2007-10-10 |
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Granted publication date: 20071010 |