CN1518020A - Sheet solid electrolytic condensor with small size and simple structure - Google Patents
Sheet solid electrolytic condensor with small size and simple structure Download PDFInfo
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- CN1518020A CN1518020A CNA2004100035543A CN200410003554A CN1518020A CN 1518020 A CN1518020 A CN 1518020A CN A2004100035543 A CNA2004100035543 A CN A2004100035543A CN 200410003554 A CN200410003554 A CN 200410003554A CN 1518020 A CN1518020 A CN 1518020A
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- solid electrolytic
- type solid
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- 239000007787 solid Substances 0.000 title claims abstract description 44
- 239000011347 resin Substances 0.000 claims abstract description 69
- 229920005989 resin Polymers 0.000 claims abstract description 69
- 238000005242 forging Methods 0.000 claims abstract description 15
- 238000004382 potting Methods 0.000 claims description 58
- 238000009434 installation Methods 0.000 claims description 39
- 230000015572 biosynthetic process Effects 0.000 claims description 35
- 238000000034 method Methods 0.000 claims description 15
- 238000003466 welding Methods 0.000 claims description 12
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 11
- 239000010949 copper Substances 0.000 claims description 7
- 238000009413 insulation Methods 0.000 claims description 7
- 239000007784 solid electrolyte Substances 0.000 claims description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000010931 gold Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 abstract description 16
- 238000004806 packaging method and process Methods 0.000 abstract 4
- 238000004519 manufacturing process Methods 0.000 description 10
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 5
- ROSDCCJGGBNDNL-UHFFFAOYSA-N [Ta].[Pb] Chemical compound [Ta].[Pb] ROSDCCJGGBNDNL-UHFFFAOYSA-N 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 101100400452 Caenorhabditis elegans map-2 gene Proteins 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 238000010273 cold forging Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- MIVBAHRSNUNMPP-UHFFFAOYSA-N manganese(2+);dinitrate Chemical compound [Mn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O MIVBAHRSNUNMPP-UHFFFAOYSA-N 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000197 pyrolysis Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 150000003481 tantalum Chemical class 0.000 description 1
- PBCFLUZVCVVTBY-UHFFFAOYSA-N tantalum pentoxide Inorganic materials O=[Ta](=O)O[Ta](=O)=O PBCFLUZVCVVTBY-UHFFFAOYSA-N 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
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Classifications
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- E—FIXED CONSTRUCTIONS
- E04—BUILDING
- E04G—SCAFFOLDING; FORMS; SHUTTERING; BUILDING IMPLEMENTS OR AIDS, OR THEIR USE; HANDLING BUILDING MATERIALS ON THE SITE; REPAIRING, BREAKING-UP OR OTHER WORK ON EXISTING BUILDINGS
- E04G11/00—Forms, shutterings, or falsework for making walls, floors, ceilings, or roofs
- E04G11/36—Forms, shutterings, or falsework for making walls, floors, ceilings, or roofs for floors, ceilings, or roofs of plane or curved surfaces end formpanels for floor shutterings
- E04G11/48—Supporting structures for shutterings or frames for floors or roofs
- E04G11/50—Girders, beams, or the like as supporting members for forms
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/008—Terminals
- H01G9/012—Terminals specially adapted for solid capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/04—Electrodes or formation of dielectric layers thereon
- H01G9/042—Electrodes or formation of dielectric layers thereon characterised by the material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
- H01G9/10—Sealing, e.g. of lead-in wires
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S257/00—Active solid-state devices, e.g. transistors, solid-state diodes
- Y10S257/924—Active solid-state devices, e.g. transistors, solid-state diodes with passive device, e.g. capacitor, or battery, as integral part of housing or housing element, e.g. cap
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/43—Electric condenser making
- Y10T29/435—Solid dielectric type
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Architecture (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Civil Engineering (AREA)
- Structural Engineering (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. The terminal extends along the mount surface and the side surface to have an outer surface exposed from the packaging resin and to have an inner surface opposite to the outer terminal surface. The inner surface has a stepwise shape formed by forging.
Description
The application requires the priority of previous Japanese publication JP2003-16177, and it openly is comprised in for referencial use herein.
Technical field
The present invention relates to single piece type solid electrolyte capacitators and manufacture method thereof.
Background technology
The example of single piece type solid electrolyte capacitators comprises: a capacity cell covers a potting resin of this capacity cell and is electrically connected on this capacity cell and is incorporated into the anode terminal and the cathode terminal of this potting resin.This potting resin has an installation surface and is adjacent to a side of this installation surface.The chip-type solid electrolytic condenser of this form is disclosed among the Japanese uncensored public announcement of a patent application NO:291079/1993 and with connection with figures and describes in detail.
Reduce in trial under the size and situation highly of this a kind of chip-type solid electrolytic condenser, this anode and cathode terminal have increased the volumetric ratio of this chip-type solid electrolytic condenser.When the volumetric ratio of this anode terminal and this cathode terminal had increased, to a part of volume of influential this capacity cell of capacitance ratio with respect to this capacitor total measurement (volume), promptly volumetric efficiency had descended.For example, when the thickness (highly) of this capacitor (potting resin) was 0.8mm, this volumetric efficiency of capacity cell may be low to moderate 20% or lower.
Summary of the invention
Therefore a purpose of the present invention provides a kind of chip-type solid electrolytic condenser, and this capacitor has: small size and simple structure and to the part of influential this capacity cell of the capacitance high volumetric efficiency with respect to this capacitor total measurement (volume).
Another object of the present invention provides a kind of method that can easily make a kind of like this chip-type solid electrolytic condenser.
According to an aspect of the present invention, provide a kind of chip-type solid electrolytic condenser, this capacitor comprises: a capacity cell; Cover this capacity cell and have an installation surface and a potting resin that is adjacent to a side of this installation surface; Be electrically connected on this capacity cell and be incorporated into a terminal of this potting resin, this terminal extends to have the outer surface that exposes from this potting resin and to have an inner surface relative with this terminal outer surface along this installation surface and this side surface, and this inner surface has a step shape of making by forging.
According to another aspect of the present invention, provide a kind of chip-type solid electrolytic condenser, this capacitor comprises: the capacity cell with an anode tap and a cathode layer; Cover this capacity cell and have an installation surface and in abutting connection with a potting resin of this installation surface and each side respect to one another; Be electrically connected on this anode tap and be incorporated into an anode terminal of this potting resin; Be electrically connected on this cathode layer and be incorporated into a cathode terminal of this potting resin; Each anode terminal and cathode terminal extend to have the outer surface that exposes from this potting resin and to have an inner surface relative with this side surface along this installation surface and each side surface, and this inner surface has a step shape of making by forging.
Another aspect that also has according to the present invention provides a kind of method of making the single piece type solid electrolyte capacitators, and this capacitor comprises: the capacity cell with an anode tap and a cathode layer; Cover this capacity cell and have an installation surface and in abutting connection with a potting resin of this installation surface and a plurality of sides respect to one another; Be electrically connected on this anode tap and be incorporated into an anode terminal of this potting resin; Be electrically connected on this cathode layer and be incorporated into a cathode terminal of this potting resin; This method comprises: preparation has the lead frame that an anode terminal forms part and cathode terminal formation part; Form forging one step shape on the part partly at this anode terminal; This anode tap is connected in this anode terminal forms part; This cathode layer is connected in this cathode terminal forms part; Remove this anode terminal and form outside the part and a cathode terminal formation part partly of part, cover this capacity cell with a potting resin; With cut out this chip-type solid electrolytic condenser from this lead frame.
By reading the detailed description of this specification, other purpose of the present invention, characteristics and advantage will become obviously.
Description of drawings
Fig. 1 is a sectional elevation that shows existing chip-type solid electrolytic condenser one example;
Fig. 2 is a cross sectional view that shows according to the single piece type solid electrolyte capacitators of of the present invention one preferential embodiment;
Fig. 3 is an inner three-dimensional view of displayed map 2 illustrated chip-type solid electrolytic condensers;
Fig. 4 is a three-dimensional view of displayed map 2 illustrated chip-type solid electrolytic condensers;
Fig. 5 A to 5D is each view of describing a kind of method of chip-type solid electrolytic condenser constructed in accordance;
Fig. 6 A and Fig. 6 B describe according to different embodiment, the three-dimensional view of step after the step of Fig. 5 A to 5D;
Fig. 7 is a three-dimensional view of describing Fig. 6 A step step afterwards;
Fig. 8 A is the end view that the illustrated anode terminal of Fig. 7 forms part, and corresponding with Fig. 6 A;
Fig. 8 B is an end view that is similar to Fig. 8 A, but that correspondence is Fig. 6 B;
Fig. 9 A and 9B are the views of describing the illustrated step of Fig. 7 step afterwards; With
Figure 10 A to 10D is each view that shows chip-type solid electrolytic condenser according to various embodiments of the present invention;
Embodiment
For easy to understand the present invention, will at first describe above mentioned existing chip-type solid electrolytic condenser.
With reference to figure 1, this existing chip-type solid electrolytic condenser comprises: a capacitor element 101 that uses valve metal; One anode terminal 104; One cathode terminal 105; With a potting resin 103.
This capacity cell 101 has: first and second member end surface 101a and the 101b that are formed in an end and another end vertically, with an element periphery surface 101c, surperficial 101c is formed between this first and second member end surface 101a and the 101b and is provided with an anode tap 102a who draws from this first member end surface 101a; An and cathode surface (cathode layer) 102b on this component periphery surface 101c and this second member end surface 101b.
Make the chip-type solid electrolytic condenser as follows.One cathode terminal 105 of one terminal frame 107 is connected to the cathode surface 102b of the capacity cell 101 that passes through electroconductive binder preparation in advance.The contact area that the anode tap 102a of this capacity cell 101 and the anode terminal 104 of this terminal frame 107 contact with each other is soldered.This capacity cell 101 and this terminal frame 107 cover with resin by mold pressing, make the part of this anode terminal frame 107 expose.This terminal frame 107 is along an outer surface bending of this potting resin 103.So, made this capacitor.
Above mentioned existing chip-type solid electrolytic condenser has this shortcoming of mentioning in the technical background of this specification.
Referring now to accompanying drawing single piece type solid electrolyte capacitators according to one embodiment of the invention is described.
Referring to figs. 2 to 4, be suitable for being installed on an electronic installation or the electronic equipment according to the single piece type solid electrolyte capacitators of one embodiment of the invention.In after a while with the mode of describing in detail, this chip-type solid electrolytic condenser comprises: a capacity cell 11 that uses valve metal; One anode terminal 14; One cathode terminal 17; With a potting resin 13.
This capacity cell 11 has: along first and second a member end surface 11a and a 11b who axially is formed in an end and another end, with an element periphery surface 11c, surface 11c is between this first and second member end surface 11a and 11b, and capacity cell 11 is provided with an anode tap 12a and a cathode surface (cathode layer) 12b on this component periphery surface 11c and this second member end surface 11b that draws from this first member end surface 11a.
This anode terminal 14 is connected in this anode tap 12a of this capacity cell.This cathode terminal 17 is connected in the cathode surface 12 of this capacity cell.
This potting resin 13 covers these capacity cells 11, exposes a part of anode terminal 14 and a part of cathode terminal 17 simultaneously.These parts are adjacent one another are.Also have, this potting resin 13 is provided with surperficial 19a of first and second potted ends (side) and 19b and is formed in a package perimeter surface between this first and second potted ends surface 19a and the 19b.This package perimeter surface comprises an installation surface 18, and it is used for this capacitor is installed to an installation surface of a circuit board (not shown).
In addition, this anode terminal 14 has the step shape that forms by forging (cold forging or forge hot), punching out or etching.This step shape is made of a second plate terminal step 14b and a first anode terminal step 14a, and the part of second plate terminal step 14b is exposed from this installation surface 18, and a first anode terminal step 14a part is exposed from this first package surface 19a.
This second plate terminal step 14b supports this cathode surface 12b of this capacity cell 11 in this potting resin 13, and this potting resin 13 has the cathode surface 12b with this anode terminal 14 electric insulations.
The thickness that this first anode terminal step 14a has is supporting this cathode surface 12b of this capacity cell 11 in this potting resin 13 than the big of second plate terminal step 14b and the cathode surface by being electrically connected with this anode terminal 14.
This cathode terminal 17 exposes from the part of this installation surface 18 and the part of this potted ends surface 19b.These parts are adjacent one another are.
This cathode terminal 17 has a step shape.This step shape is made of one second cathode terminal step 17b and one first cathode terminal step 17a, the part of the second cathode terminal step 17b is exposed to these installation surface 18, the first cathode terminal step 17a parts and is exposed to this second potted ends surface 19b.
This second cathode terminal step 17b is supporting this cathode surface 12b of this capacity cell 11 in this potting resin 13, and this potting resin 13 has the cathode surface 12b that is electrically connected on this cathode terminal 17.
The thickness that this first cathode terminal step 17a has is greater than the second cathode terminal step 17b, and is provided with the wall surface part 17c that is electrically connected on this cathode surface 12b.
In this chip-type solid electrolytic condenser, the thickness of this second plate terminal step 14b and this second cathode terminal step 17b is little, and therefore is disposed in the below of this capacity cell 11.Therefore, this second plate terminal step 14b and this second cathode terminal step 17b mode that can save the space is installed on the circuit board.
In addition, the anode-side zone of this capacity cell 11 is not only fixed by this anode tap 12a and is supported but also fixing and support by this anode-side zone of this cathode surface 12b, this anode tap 12a is supported by this first anode terminal step 14a of this anode terminal 14 and is fixing that this cathode surface 12b is supported by this second plate terminal step 14b.Therefore, when---the anode-side zone of its capacity cell is only supported by this anode tap---when comparing, this chip-type solid electrolytic condenser is superior aspect intensity with existing capacitor.Especially, because a panel is made between this second plate terminal step 14b and the anode-side zone, fixes and support with making these capacity cell 11 high strength.
This structure will describe in detail hereinafter.With reference to figure 2, the installation surface on this installation surface 18 and this second plate terminal step 14b in cathode surface 12b is scattered in apart apart from t1.This installation surface 18 is scattered in each other at a distance of a minimum range t2 with the periphery surface of this anode tap 12a.The thickness of this second plate terminal step 14b of this anode terminal 14 less than this apart from t1, the thickness of this first anode terminal step 14a of this anode terminal 14 greater than this apart from t2.Also have, a step difference d is greater than difference (t2-t1).This difference (t2-t1) is the minimum range between the periphery surface of this installation surface on this second plate terminal step 14b of this anode terminal 14 among this cathode surface 12b and this anode tap 12a.
Now, will a kind of method of making this chip-type solid electrolytic condenser according to embodiments of the invention be described.
At first, made capacity cell 11.
In the present invention, this method generally includes following steps: an anode terminal that anode tap 12a is connected in a lead frame forms on the part, and this lead frame is used to make anode terminal 14; A cathode terminal that the cathode surface 12b of capacity cell 11 is connected in this lead frame forms on the part, and this lead frame is used to make cathode terminal 17; Remove this anode terminal and form outside the part and this cathode terminal formation part part of part, cover these capacity cells 11 with potting resin 13; Cut out a thin slice from this lead frame as the chip-type solid electrolytic condenser.
This anode terminal Connection Step comprises to be made this anode terminal form a part of attenuation of part and makes this anode terminal be made for a step of step shape by forging.
Also have, this cathode terminal Connection Step comprises to be made this cathode terminal form a part of attenuation of part and makes this cathode terminal be made for a step of step shape by forging.
Shown in Fig. 5 A, an electric insulation resin film 41 and be carried on this lead frame 40 as one silver-plated (Ag) film 42 of conducting film.Anode terminal forms part 43 and cathode terminal formation part 44 is made by punching press shown in Fig. 5 B and 5C.
Anode terminal forms the part of part 43 and a part that cathode terminal forms part 44 and is thinned shown in Fig. 5 D or reduces thickness to about 1/4, forms part 44 and is made for a step shape respectively by forging so anode terminal forms part 43 and cathode terminal.
Best is, the ductility that is used to make the electric insulation resin of this electric insulation resin film 41 is superior, so that withstand forging and pressing.Yet this electric insulation resin can form on the part 43 deposited the lid at this anode terminal after the forging.
In addition, apply this conducting film that covers on this cathode terminal formation part 44 and be confined to silver-plated film 42.For example, except that using the plating, can form technology by the film of other common usefulness and make silverskin.Also have, can adopt by silver (Ag), gold (Au), copper (Cu), and palladium (Pd) in a kind of film of making replace silverskin.Still have plenty of, can adopt and contain alloy at least a in silver, gold, copper, the palladium and make film.
The step that anode tap 12a is connected to the anode terminal formation part 43 of lead frame 40 hereinafter will be described.
As shown in Figure 6A, two protuberances 51 are formed on the anode terminal formation part 43.Yet, shown in Fig. 6 B, only there is a protuberance 51 to be formed in anode terminal and forms on the part 43.In each structure, this protuberance 51 and an adjacent domain are welded in the laser welding part of anode tap 12a.
Secondly, with reference to figure 7 and 8A, the anode tap 12a of capacity cell 11 is arranged between the protuberance 51 of anode terminal formation part 43.One laser beam irradiation is in a zone of containing protuberance 51 and anode tap 12a.Protuberance 51 is melted by laser beam irradiation, surrounds anode tap 12a, and solidifies.So made a firm welding portion.
With reference to figure 8B, under the situation of a protuberance 51, the anode tap 12a of capacity cell 11 is arranged to form in abutting connection with anode terminal the side surface of the protuberance 51 of part 43.Laser beam irradiation is in a zone of containing protuberance 51 and anode tap 12a.Protuberance 51 is melted by laser beam irradiation, surrounds anode tap 12a, and solidifies.So made a firm welding portion.
At this anode tap is that the anode terminal that is welded in this lead frame by electric resistance welding forms under the situation of part, forms on the part at this anode terminal and has made a flat surface or a V-type slot part.This positive wire is brought into this flat surface or this V-type slot part and contacts.Then, this anode tap is soldered to this anode terminal by electric resistance welding and forms part.
After this, following steps will be described: cover with potting resin 13 and remove anode terminal and form the capacity cell 11 outside the part of part 43 and the part that cathode terminal forms part 44 and cut out this thin slice as this chip-type solid electrolytic condenser from lead frame 40.
Shown in Fig. 9 A and 9B, the anode terminal of using potting resin 13 covering capacity cells 11 and this lead frame forms part 43 and cathode terminal formation part 44, and the part and the cathode terminal formation part partly that make anode terminal form part 43 are exposed this potting resin 13.Secondly, shown in Fig. 9 A, potting resin 13 is cut along two cutting surfaces 81 and this thin slice as the chip-type solid electrolytic condenser is provided.Yet potting resin 13 can be cut along 4 cutting surfaces 81 shown in Fig. 9 B.When potting resin 13 when 4 surfaces are cut, the volumetric efficiency of this thin slice is than the volumetric efficiency height along the thin slices of 2 cutting surface cuttings.
Hereinafter will describe the method for improving the bond strength between this anode, cathode terminal and this potting resin, peel off from anode, cathode terminal so that prevent this potting resin thermal stress or mechanical stress inner because of this thin slice or outside generation.
Shown in Figure 10 A to 10D, an exposing surface of anode terminal 14 exposes from the first potted ends surface of potting resin 13, in other words, is rectangular shape perpendicular to the cross-sectional surperficial integral body of the anode terminal 14 of above-mentioned axial direction.
Figure 10 A shows an example of the exposing surface of the anode terminal 14 with a rectangular shape, and this rectangular shape has the wedge shape recessed portion 142 that is formed in its left side and right side.More particularly, this exposing surface is formed between two edges 141 that are basically perpendicular to installation surface 18, and this recessed portion 142 then is the groove that is recessed into from this edge respectively.
Figure 10 B shows another example of the exposing surface of the anode terminal 14 with a rectangular shape, and this rectangular shape has the semicircle recessed portion 143 that is formed in its left side and right side, has replaced this wedge shape recessed portion 142.Yet the shape of each recessed portion is not limited to shown in Figure 10 A or the 10B.
Figure 10 C has also shown another example of the exposing surface of the anode terminal 14 with a rectangular shape, and this rectangular shape has the projection 145 that is formed in its left side and right side.More particularly, this exposing surface is formed between an installation surface 18 and the edge 144, and edge 144 is relative with installation surface 18, and projection 145 is made near the edge 144.Yet the shape of each projection not office is shown in Figure 10 C.
Figure 10 D shows another example of the exposing surface of the anode terminal 14 with a trapezoidal shape, and especially, an inverted trapezoidal shape has the following and than a top of this time length of side of installation surface 18 places that are positioned at this thin slice.In other words, one first edge 146 of this exposing surface with installation surface of being adjacent to 18 is with relative with this first edge and than one second edge of growing with first edge 146 147.
In this thin slice shown in Figure 10 A to 10D, the not easily separated or disengagement of anode terminal 14.In other words, potting resin 13 is difficult for peeling off from anode terminal 14.
In addition, one exposing surface of this cathode terminal that exposes from this second potted ends surface of potting resin 13, promptly be perpendicular to the surface, a cross section of axial anode terminal 17, may also have a common rectangular shape, this rectangular shape has a part recessed or a protrusion maybe may have an inverted trapezoidal shape, as the anode terminal 14 shown in Figure 10 A to 10D.
Hereinafter will describe more specific embodiment of the present invention in detail referring to figs. 2 to 10.
First embodiment
A kind of method of making capacity cell 11 at first, hereinafter will be described.
Used tantalum (Ta) as a kind of valve metal.Using stamping machine is formed in the tantalum powder on the one tantalum lead as anode tap 12a.This tantalum lead sinters in high vacuum and hot environment.In the present invention, this valve metal is rendered as a kind of like this metal: form oxide-film when oxidized, this oxide-film plays valve action.
The tantalum powder of the tantalum lead of sintering above form oxide-film Ta2O5 thereafter.
Next step after this tantalum sintered object is dipped into manganese nitrate liquid, makes MnO2 by this pyrolysis of being soaked body.
This soaked the cathode surface 12b that body on made graphite and silver thereafter.
So, made capacity cell 11.
Secondly with reference to figure 5A to 5D, will the formation of lead frame 40 be described.
Shown in Fig. 5 A, electric insulation resin film 41 and silver-plated film 42 on lead frame 40, have been formed.As Fig. 5 B and 5C shown in, by punching press this lead frame 40 make anode terminal form part 43 and cathode terminal formation part 44 thereafter.
Anode terminal forms the part of part 43 and a part that cathode terminal forms part 44 and is thinned or reduces thickness to about 1/4 shown in Fig. 5 D, forms part 44 and is formed into a step shape respectively so form part 43 and cathode terminal by the forging anode terminal.
When anode terminal forms part 43 and cathode terminal and forms part 44 and be formed into a step shape, also made protuberance 51 as shown in Figure 6A.This protuberance 51 and neighboring region become to being welded on the laser welding part of anode tap 12a.
Secondly, capacity cell 11 is fixed on the lead frame 40.
In other words, being coated in this silver-plated film 42 of silver-plated film 42---at the conductive adhesive that contains silver is made on the cathode terminal formation part 44 of lead frame 40---afterwards, capacity cell 11 is disposed on the lead frame 40.
Next step as shown in Figure 7, is welded on anode terminal to capacity cell 11 by laser welding and forms on the part 43.In Fig. 7, except anode terminal formed part 43, lead frame 40 had been omitted on diagram.Before laser beam irradiation, anode tap 12a positions by protuberance 51, and the protuberance 51 that is melted after laser beam irradiation covers.
With regard to the lead frame of making shown in Fig. 9 A 40, a part and the cathode terminal of removing anode terminal formation part 43 form outside the part of part 44, and this lead frame 40 utilizes potting resin 13 mold pressings to form.
As Fig. 9 A shown in along cutting surface 81 cut potting resins 13, and this chip-type solid electrolytic condenser thus be provided thereafter.
Second embodiment
In the second embodiment of the present invention, protuberance 51 is formed on the anode terminal formation part 43 shown in Fig. 6 B.Anode tap 12a contacts with the side surface of protuberance 51.Anode tap 12a and protuberance 51 are used laser beam irradiation.Protuberance 51 is melted and reacts with the periphery surface of anode tap 12a.So made welding portion.
Other making step among second embodiment is basically the same as those in the first embodiment.In a second embodiment, this metal of this anode terminal formation part forms easier slightly than first embodiment.
The 3rd embodiment
With reference to figure 10A, in the third embodiment of the present invention, wedge shape recessed portion 142 is on the left side and right side 141 of the exposing surface of anode terminal formation part 43 (cathode terminal forms part 44), and this exposing surface exposes from first potted ends surface 19a (second potted ends surface 19b).In this structure, potting resin 13 enters in the wedge shape recessed portion 142, and the adhesion strength that causes potting resin 13 antianode terminals to form part 43 (cathode terminal forms part 44) is improved.
The formation of wedge shape recessed portion 142 and anode terminal form the attenuate or being formed in the same step of protuberance 51 of part 43 (cathode terminal forms part 44) and finish.
Identical among other manufacturing step among the 3rd embodiment and first or second embodiment.
The 4th embodiment
With reference to figure 10B, in the fourth embodiment of the present invention, semicircle recessed portion 143 is built in a left side and the right side of the exposing surface of anode terminal formation part 43 (cathode terminal forms part 44), and this exposing surface exposes from first potted ends surface 19a (second potted ends surface 19b).In this structure, potting resin 13 enters in the semicircle recessed portion 143, and the adhesion strength that causes potting resin 13 antianode terminals to form part 43 (cathode terminal forms part 44) is improved.
The formation of semicircle recessed portion 143 and anode terminal form the attenuate or being formed in the same step of protuberance 51 of part 43 (cathode terminal forms part 44) and finish.
Other manufacturing steps in the 4th embodiment are identical with other steps of the 3rd embodiment.
The 5th embodiment
With reference to figure 10C, in the fifth embodiment of the present invention, projection 145 is on the left side and right side 141 of the exposing surface of anode terminal formation part 43 (cathode terminal forms part 44), and this exposing surface exposes from first potted ends surface 19a (second potted ends surface 19b).In this structure, potting resin 13 enters below this projection 145, and the adhesion strength that causes potting resin 13 antianode terminals to form part 43 (cathode terminal forms part 44) is improved.
The formation of projection 145 and anode terminal form the attenuate or being formed in the same step of protuberance 51 of part 43 (cathode terminal forms part 44) and finish.
Other manufacturing step among the 5th embodiment also those steps with the 3rd embodiment is identical.
The 6th embodiment
With reference to figure 10D, in the sixth embodiment of the present invention, the anode terminal formation part of exposing from first potted ends surface 19a (the surperficial 19b of second potted ends) 43 (cathode terminal forms part 44) is formed in the inverted trapezoidal shape, and this trapezoidal shape has the bottom 146 at installation surface 18 places that are positioned at this thin slice and the tops 147 of following 146 length of ratio.In this structure, potting resin 13 enters below each limit of this trapezoidal shape, and the adhesion strength that causes potting resin 13 antianode terminals to form part 43 (cathode terminal forms part 44) is improved.
The formation of the manufacturing of trapezoidal shape and lead frame 40, anode terminal form the attenuate or being formed in the same step of protuberance 51 of part 43 (cathode terminal forms part 44) and finish.
Other manufacturing step among the 6th embodiment also those steps with the 3rd embodiment is identical.
The 7th embodiment
In the 7th embodiment, by electric resistance welding anode tap is soldered to anode and forms on the part (negative electrode formation part).In the case, the flat surface of this lead frame can directly be used as the flat surface on this anode terminal formation part (cathode terminal formation part), and does not need to make the metal processing operation of this protuberance.Yet this V-type slot part can be fabricated on this anode terminal and form on the part (this cathode terminal forms part).When having made the V-type slot part, just finish easily the location of this anode tap.
Other manufacturing step among the 7th embodiment also those steps with the 3rd embodiment is identical.
In any chip-type solid electrolytic condenser constructed in accordance so far, the volume of a part that influences the capacity cell of capacitance is increased to the twice that is about existing chip-type solid electrolytic condenser to the efficient of the total measurement (volume) of this capacitor.In addition, because terminal or lead frame do not need bending process, treatment step has advantageously reduced.
Though the present invention is described in conjunction with some embodiments so far, will at an easy rate the present invention be put into practice with various alternate manners for the technical staff.
Claims (20)
1. chip-type solid electrolytic condenser comprises:
One capacity cell;
One potting resin, it covers described capacity cell and has an installation surface and a side surface that is adjacent to this described installation surface; With
One terminal, it is electrically connected with described capacity cell and combines with described potting resin, described terminal extends so that have an outer surface that exposes from described potting resin and have an inner surface relative with described terminal outer surface along described installation surface and described side surface, and described inner surface has the step shape by forging formation.
2. according to the chip-type solid electrolytic condenser of claim 1, it is characterized in that: described inner surface have the first step that is adjacent to described side surface and with a described side surface second step separately, apart from the described first step of described installation surface in height than described second step height.
3. according to the chip-type solid electrolytic condenser of claim 2, it is characterized in that: described capacity cell has an anode tap that extends towards described side surface, and described terminal is connected to described anode tap as an anode terminal.
4. according to the chip-type solid electrolytic condenser of claim 3, it is characterized in that: described capacity cell has a periphery surface, have a specific range between described anode tap and the described periphery surface on described height, described first step and described second step have the ad hoc distance greater than described specific range.
5. according to the chip-type solid electrolytic condenser of claim 2, it is characterized in that: described capacity cell has a cathode layer, and described terminal is connected to described cathode layer as a cathode terminal.
6. according to the chip-type solid electrolytic condenser of claim 5, it is characterized in that: described cathode terminal has the film that is formed on its at least a portion, and described film contains at least a in silver (Ag), gold (Au), copper (Cu) and the palladium (Pd).
7. according to the chip-type solid electrolytic condenser of claim 5, it is characterized in that: described cathode layer is to contain silver-colored conductive adhesive by application to be connected on the described cathode terminal.
8. according to the chip-type solid electrolytic condenser of claim 1, it is characterized in that: described terminal has and is exposed to described side surface place and is being basically perpendicular to the exposing surface that limits between two edges of described installation surface, described exposing surface has recessed portion, and this recessed portion is recessed from described edge respectively.
9. chip-type solid electrolytic condenser according to Claim 8, it is characterized in that: each the female partly is a wedge-shaped slot.
10. chip-type solid electrolytic condenser according to Claim 8, it is characterized in that: each the female partly is a semi-circular groove.
11. chip-type solid electrolytic condenser according to claim 1, it is characterized in that: this terminal has an exposing surface that is exposed to described side surface place and limits between a described installation surface edge relative with described installation surface, described exposing surface has near the recessed portion described edge.
12. chip-type solid electrolytic condenser according to claim 1, it is characterized in that: described terminal has an exposing surface that is exposed to described side surface place, described exposing surface is one trapezoidal, and this is trapezoidal to have first edge and one second relative with described first edge and longer than described first edge edge that is adjacent to described installation surface.
13. a chip-type solid electrolytic condenser comprises:
One capacity cell, it has an anode tap and a cathode layer;
One potting resin, it covers described capacity cell and has: an installation surface and be adjacent to described installation surface and a plurality of side surface respect to one another;
One anode terminal, it is electrically connected on described anode tap and combines with described potting resin; With
One cathode terminal, it is electrically connected on described cathode layer and combines with described potting resin, and each in described anode terminal and the cathode terminal extended along described installation surface and each described side surface and had: an outer surface that exposes from described potting resin with have an inner surface relative with described outer surface; Described inner surface has a step shape that forms by forging.
14. make a kind of method of single piece type solid electrolyte capacitators, comprising: a capacity cell, it has an anode tap and a cathode layer; One potting resin, it covers described capacity cell and has: an installation surface and be adjacent to described installation surface and a plurality of side surfaces respect to one another; One anode terminal, it is electrically connected on described anode tap and combines with described potting resin; With a cathode terminal, it is electrically connected on described cathode layer and combines with described potting resin, and described method comprises:
Preparation-lead frame, it has, and an anode terminal forms part and a cathode terminal forms part;
Carry out forging to form a step shape on the part that forms part at described anode terminal;
Described anode tap is connected in described anode terminal forms part;
Described cathode layer is connected in described cathode terminal forms part;
Remove described anode terminal and form outside the part and a described cathode terminal formation part partly of part, cover described capacity cell with a potting resin; With
Cut out described chip-type solid electrolytic condenser from described lead frame.
15. the method according to claim 14 also comprises: before described cathode layer is connected to cathode terminal formation part, carry out forging to form a step shape on the part that forms part at described cathode terminal.
16. the method according to claim 14 also comprises: before described anode terminal formation part is made with described step shape, form the deposited electric insulation resin that adds of described part of part to described anode terminal.
17. the method according to claim 15 also comprises: before described cathode terminal formation part is made with described step shape, on the described part of described cathode terminal formation part, form an at least a film that contains in silver (Ag), golden (Au), copper (Cu) and the palladium (Pd).
18. the method according to claim 14 is characterized in that, the Connection Step of this anode terminal comprises:
Form formation one protuberance on the part at described anode terminal;
The described anode terminal that has anode tap is arranged to contact with described protuberance; With
By laser welding described anode terminal is fixed and be connected electrically in to described anode tap forms on the part.
19. the method according to claim 14 is characterized in that, the Connection Step of this anode terminal comprises:
Form two protuberances of formation on the part at described anode terminal;
Between described protuberance, arrange described anode tap; With
By laser welding described anode terminal is fixed and be connected electrically in to described anode tap forms on the part.
20. the method according to claim 14 is characterized in that, the Connection Step of this anode terminal comprises:
Described anode tap is contacted with an existing flat surface or a V-type slot part, and this V-type slot part is formed in described anode terminal and forms on the part; With
Making described anode tap fix and be electrically connected on described anode terminal by electric resistance welding forms on the part.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16177/2003 | 2003-01-24 | ||
JP2003016177A JP2004228424A (en) | 2003-01-24 | 2003-01-24 | Chip electrolytic capacitor, and manufacturing method thereof |
JP16177/03 | 2003-01-24 |
Publications (2)
Publication Number | Publication Date |
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CN1518020A true CN1518020A (en) | 2004-08-04 |
CN100444292C CN100444292C (en) | 2008-12-17 |
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ID=32732817
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CNB2004100035543A Expired - Fee Related CN100444292C (en) | 2003-01-24 | 2004-01-29 | Sheet solid electrolytic condensor with small size and simple structure |
Country Status (4)
Country | Link |
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US (2) | US7135754B2 (en) |
JP (1) | JP2004228424A (en) |
KR (1) | KR20040068471A (en) |
CN (1) | CN100444292C (en) |
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Also Published As
Publication number | Publication date |
---|---|
CN100444292C (en) | 2008-12-17 |
US20040145065A1 (en) | 2004-07-29 |
US7135754B2 (en) | 2006-11-14 |
KR20040068471A (en) | 2004-07-31 |
US20060270115A1 (en) | 2006-11-30 |
JP2004228424A (en) | 2004-08-12 |
US7337513B2 (en) | 2008-03-04 |
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