CN1501482A - Small setting of photovoltaic assembly - Google Patents
Small setting of photovoltaic assembly Download PDFInfo
- Publication number
- CN1501482A CN1501482A CNA031362591A CN03136259A CN1501482A CN 1501482 A CN1501482 A CN 1501482A CN A031362591 A CNA031362591 A CN A031362591A CN 03136259 A CN03136259 A CN 03136259A CN 1501482 A CN1501482 A CN 1501482A
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- Prior art keywords
- conductive material
- electrically non
- material body
- bias line
- little seat
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- Light Receiving Elements (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
Abstract
A submount for electro optical device of a high speed electro optical module is provided to reduce the transmission loss and the reflection loss of the data by drastically reducing the parasitic effect remained at the peripheral of the wire bonding. A submount for electro optical device of a high speed electro optical module includes a dielectric material(20), a pair of ground lines(22a,22c), a signal line(22b), a bias line(22d), a ground plane(28) and a via hole. The dielectric material(20) is in the shape of ''L''. The pair of ground lines(22a,22c), the signal line(22b) and the bias line(22d) are stacked on the top surface of the dielectric material(20) by using a co-planar waveguide-ground(CPW-G). The ground plane(28) is positioned inside of the dielectric material(20). And, the via hole is connected the ground lines(22a,22c) to the ground plane(28).
Description
The mutual reference of related application
The application is based on korean patent application 2002-71501 number of proposing in Korea S Department of Intellectual Property on November 18th, 2002.Here the content of introducing this application is for reference.
Technical field
The present invention relates to install the little seat that optoelectronic component is used.More particularly, the present invention relates to be used to install a kind of improved little seat of the optoelectronic component of high speed optoelectronic sub-component.
Background technology
Because the IT technology is improved, therefore require to improve the quality of information communication service.Can obtain high-quality information communication by optical communication system.The transmission system that has had at present 2.5Gbps, the commercial system that has used 10Gbps recently.Yet because the user needs quicker and higher-quality transmission system, so the researcher still provides higher-quality communication in research.
Have report to claim, can utilize the wavelength separation multiplex techniques to set up ultrahigh speed broadband communications network, this network uses the photoelectron subassembly of transmission speed as 2.5Gbps, can support the transmission speed of 40～100Gbps.Yet,, need comprise that transmission speed is at least the optical element of 10Gbps and the photoelectron subassembly of electric component for data capacity is increased by 160～640Gbps.In addition, for T (drawing very much) bps is provided the optical communication service of level, need comprise that transmission speed is the optical element of 20～40Gbps and the photoelectron subassembly of electric component.
Yet in fact, when transmission speed surpassed 10Gbps, the transmission reliability of current photoelectron subassembly seriously reduced, and this is an obstacle of development high speed optical communication system.
Current photoelectron subassembly comprises a light-emitting element assembly (for example laser diode module) and an assembly (for example photelectric receiver assembly) that receives the element of light.Light-emitting element assembly can comprise that an electronic signal that the outside is applied is converted to the laser diode of optical signalling, a little seat and a thermoelectric (al) type cooler of actual this laser diode of supporting.Receive the optical element assembly and can comprise a photoelectric detector that optical signalling is converted to electronic signal; Actual supporting laser diode is with the little seat that laser diode is connected with an electronic component; With the preamplifier of an amplification by the next electronic signal of photoelectric detector transmission.
In this photoelectron subassembly, little seat should stably support light-emitting component and optical receiver element, and makes signal transmission reliably between two elements.
Fig. 5 represents the little seat of a miniature laser of prior art.As shown in Figure 5, the little seat 8 with optoelectronic component 6 is installed on the substrate 4 with internal circuit figure, and a plurality of terminal 2 is given prominence to outside.Preamplifier 10 is installed on the substrate 4, and a metallic shield housing 14 is covered with substrate 4 and other parts.By the optical fiber 12 of metallic shield housing 14, utilize the connection lead to be connected with terminal.
In this case, therefore well-known because the line lead forms an electric path, exist parasitism (parasitic) composition at the periphery of lead.This parasitic component causes the tiny distortion of transfer of data in the optical delivery assembly of 2.5Gbps, but in the ultrahigh speed transmission system more than 2.5Gbps, can make data distortion really, is a unacceptable problem therefore.
Summary of the invention
The present invention proposes in order to address the above problem.
According to the present invention, can be formed on does not have parasitic component, the ultrahigh speed transmission system of transmission speed more than 10Gbps on the electric path between photoelectric subassembly and the electric component.Of the present inventionly transfer being characterized as of system, it has the little seat of photoelectric subassembly that is used to install photoelectric cell of enhancing.
The little seat of a feature is made by non electrically conductive material according to the present invention, wherein, an earth connection, a signal line and a bias line are stacked on this electrically non-conductive material body.Photoelectric cell is ground connection on earth connection directly, therefore, can reduce to minimum with the interconnected length that is connected lead of holding wire and bias line.Therefore, can reduce greatly because reflection loss and the transmission loss that near the parasitic component the connection lead causes.
Description of drawings
The accompanying drawing that constitutes a present disclosure part is represented one embodiment of the present of invention, and it is used to illustrate principle of the present invention with specification.
Fig. 1 represents the perspective view of little seat according to an embodiment of the invention;
Fig. 2 represents the rearview of little seat shown in Figure 1;
Fig. 3 represents a little embodiment who is applied in the high-speed photoelectric subassembly shown in Figure 1;
Fig. 4 represents to measure the figure of the characteristic of high-speed photoelectric subassembly according to an embodiment of the invention;
Fig. 5 represents the little holder assembly of the miniature laser of prior art.
Embodiment
Below, describe the preferred embodiments of the present invention in detail with reference to accompanying drawing.
Fig. 1 represents the perspective view of little seat according to an embodiment of the invention.Shown little seat is made by the electrically non-conductive material 20 that forms predetermined shape, and comprises that many are connected to each other line 22a-22d by the arrangement of CPW-G (co-planar waveguide-ground connection) formula.More particularly, the side of electrically non-conductive material body 20 is " L " font.Go up in addition, comprise earth connection 22a, holding wire 22b, many interconnected line 22a～22d of earth connection 22c and bias line 22d, place abreast with the upper surface of the ledge of electrically non-conductive material body 20, wherein, interconnected line passes electrically non-conductive material body 20, and along Surface Vertical extension thereafter.A common photoelectric cell 24 can easily be installed on this little seat.
In addition, earth connection 22a is connected with a ground plane 28 of imbedding by through hole 26 in the electrically non-conductive material body 20 with electric the going up of 22c.
According to said structure,, can easily make electric characteristic reach optimum by adjusting the gap between holding wire 22b and earth connection 22a and the 22c.
In addition, be provided with a stack substrate that utilizes through hole 26 that earth connection 22a and 22c are connected with ground plane 28.Simultaneously, because nonconducting dielectric material has been used in the bottom of electrically non-conductive material body 20, so ground direct and below the assembly is connected (this will be explained below) bottom it, so the ground connection performance can not worsen.
As shown in Figure 2, photoelectric cell 24 is directly installed on the vertically extending earth connection 22c in the rear surface of electrically non-conductive material body 20, and by connecting lead, electric going up is connected with bias line 22d with holding wire 22b.
According to this structure,, therefore do not use the connection lead of ground connection because the bottom surface of optical element 24 is directly grounded.In addition and since connect holding wire 22b and bias line 22d to be connected conductor length shorter, therefore parasitic component can be reduced to minimum.
And for example shown in Figure 3, by electrically non-conductive material body 20 being installed on the upper surface of substrate 4, little seat of the present invention can be connected with common photoelectric subassembly.In this case,, therefore do not need to be connected, install easily with the additional electrical of substrate 4 because electrically non-conductive material body 20 comprises a ground plane 28.In addition, earth connection 22a and 22c in the electrically non-conductive material body 20, holding wire 22b and bias line 22d are connected with the given circuitous pattern of substrate 4 by connecting lead or connecting band.
Fig. 4 represents to measure by the figure of the element that uses reception light as the characteristic of a made high-speed photoelectric subassembly of the foregoing description of photoelectric cell.Reflection loss is by being added on the little seat, but the terminal electric signal of little seat causes because the parasitic component in the holding wire does not reach.Simultaneously, transmission loss is used to measure the electric signal that reaches little seat end undistortedly.
Fig. 4 is illustrated in below the 20GHz, the reflection loss of the high-speed photoelectric subassembly of present embodiment and transmission loss respectively less than-15dB and-1dB, therefore be suitable for the following signal transmission of 10Gbps.
As mentioned above, structure of the present invention can reduce the length of the connection lead that is connected with corresponding signal lines to greatest extent, and can directly make photoelectric cell ground connection in packaging process.Therefore, because the parasitic component that connects in the lead reduces, the present invention has the effect that obviously reduces reflection loss and transmission loss.This effect is to realizing that ultrahigh speed photoelectricity assembly is favourable.
Though, in conjunction with most realistic and preferred embodiment the present invention has been described, should be appreciated that the present invention only is confined to described embodiment, on the contrary, it can be encompassed in various improvement and structure of equal value in the determined spirit and scope of appended claims.
Claims (10)
1. little of a high-speed photoelectric subassembly, it comprises:
An electrically non-conductive material body;
, an earth connection, a signal line and a bias line; These lines are stacked on the upper surface of a ledge of this electrically non-conductive material body, and along the wall vertical extent of this electrically non-conductive material body;
Imbed a ground plane in this electrically non-conductive material body; With
The through hole that this ground plane is connected with earth connection;
Wherein, a photoelectric cell is directly grounded to the earth connection between holding wire and bias line.
2. little seat as claimed in claim 1 is characterized by, and the side of this electrically non-conductive material body forms " L " font.
3. little seat as claimed in claim 1 is characterized by, described earth connection, and holding wire and bias line form the CPW-G form.
4. little seat as claimed in claim 1 is characterized by, and this photoelectric cell is electrically connected with described holding wire and bias line by connecting lead respectively.
5. as each described little seat among the claim 1-4, it is characterized by, the bottom surface of electrically non-conductive material body is made by nonconducting dielectric material.
6. a manufacturing is packaged in the method for little seat wherein with a photoelectric cell, may further comprise the steps:
The side of an electrically non-conductive material body is formed " L " font;
Arrange a plurality of interconnection lines from the upper surface of the ledge of described electrically non-conductive material body to the wall of described electrically non-conductive material body;
A ground plane is set in this electrically non-conductive material body; With
Form a through hole, the described interconnection line of this ground plane and at least one is connected.
7. little seat as claimed in claim 6 is characterized by, and described a plurality of interconnection lines comprise an earth connection, a signal line and a bias line, and wherein said earth connection is between described holding wire and bias line.
8. little seat as claimed in claim 6 is characterized by, described earth connection, and holding wire and bias line form the CPW-G form.
9. high-speed photoelectric subassembly, it comprises:
One photoelectric cell;
One assembly matrix;
Be used to encapsulate described photoelectric cell and be installed in little seat on the described matrix;
Wherein, described little seat comprises:
The side forms an electrically non-conductive material body of " L " font;
, an earth connection, a signal line and a bias line; These lines are stacked on the CPW-G form on the upper surface of ledge of electrically non-conductive material body, and along the wall vertical extent of this electrically non-conductive material body, in order to a photoelectric cell to be installed;
Imbed a ground plane in this electrically non-conductive material body; With
The through hole that this ground plane is connected with earth connection;
Wherein, this photoelectric cell directly with holding wire and bias line between ground connection, and be electrically connected with holding wire and bias line by the connection lead respectively.
10. little seat as claimed in claim 9 is characterized by, and also is included in the nonconducting dielectric material between described little seat and the described assembly matrix.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0071501A KR100440431B1 (en) | 2002-11-18 | 2002-11-18 | opto-electronic submount for photo electric modules |
| KR0071501/02 | 2002-11-18 | ||
| KR0071501/2002 | 2002-11-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1501482A true CN1501482A (en) | 2004-06-02 |
| CN1256770C CN1256770C (en) | 2006-05-17 |
Family
ID=34270527
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03136259 Expired - Fee Related CN1256770C (en) | 2002-11-18 | 2003-05-20 | Small setting of photovoltaic assembly |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100440431B1 (en) |
| CN (1) | CN1256770C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104767103A (en) * | 2015-03-30 | 2015-07-08 | 青岛海信宽带多媒体技术有限公司 | Connecting structure for laser device and laser device assembly |
| US9864155B2 (en) | 2015-03-30 | 2018-01-09 | Hisense Broadband Multimedia Technologies Co,. Ltd. | Optical component |
| CN108152606A (en) * | 2017-12-28 | 2018-06-12 | 中国电子产品可靠性与环境试验研究所 | Electric field passive probe |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09172221A (en) * | 1995-12-18 | 1997-06-30 | Oki Electric Ind Co Ltd | Mounting structure of optical semiconductor device |
| JPH11317566A (en) * | 1998-05-07 | 1999-11-16 | Mitsubishi Electric Corp | Optical module |
| US6472748B1 (en) * | 2000-03-06 | 2002-10-29 | Harris Broadband Wireless Access, Inc. | System and method for providing MMIC seal |
| JP3722279B2 (en) * | 2001-01-26 | 2005-11-30 | 日本電気株式会社 | Optical transceiver module |
| KR100400081B1 (en) * | 2001-11-24 | 2003-09-29 | 한국전자통신연구원 | Submount for opto-electronic module and packaging method using the submount |
-
2002
- 2002-11-18 KR KR10-2002-0071501A patent/KR100440431B1/en not_active IP Right Cessation
-
2003
- 2003-05-20 CN CN 03136259 patent/CN1256770C/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104767103A (en) * | 2015-03-30 | 2015-07-08 | 青岛海信宽带多媒体技术有限公司 | Connecting structure for laser device and laser device assembly |
| CN104767103B (en) * | 2015-03-30 | 2017-12-19 | 青岛海信宽带多媒体技术有限公司 | A kind of laser attachment structure and laser assembly |
| US9853414B2 (en) | 2015-03-30 | 2017-12-26 | Hisense Broadband Multimedia Technologies Co., Ltd. | Connection structure for laser and laser assembly |
| US9864155B2 (en) | 2015-03-30 | 2018-01-09 | Hisense Broadband Multimedia Technologies Co,. Ltd. | Optical component |
| CN108063362A (en) * | 2015-03-30 | 2018-05-22 | 青岛海信宽带多媒体技术有限公司 | A kind of laser |
| US10302881B2 (en) | 2015-03-30 | 2019-05-28 | Hisense Broadband Multimedia Technologies Co., Ltd. | Optical component |
| US10587093B2 (en) | 2015-03-30 | 2020-03-10 | Hisense Broadband Multimedia Technologies Co., Ltd. | Connection structure for laser and laser assembly |
| CN108152606A (en) * | 2017-12-28 | 2018-06-12 | 中国电子产品可靠性与环境试验研究所 | Electric field passive probe |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100440431B1 (en) | 2004-07-14 |
| CN1256770C (en) | 2006-05-17 |
| KR20040043282A (en) | 2004-05-24 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060517 Termination date: 20110520 |