CN1490908A - Adaptive coupled semiconductor laser butterfly sealing devices - Google Patents
Adaptive coupled semiconductor laser butterfly sealing devices Download PDFInfo
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- CN1490908A CN1490908A CNA02146846XA CN02146846A CN1490908A CN 1490908 A CN1490908 A CN 1490908A CN A02146846X A CNA02146846X A CN A02146846XA CN 02146846 A CN02146846 A CN 02146846A CN 1490908 A CN1490908 A CN 1490908A
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- semiconductor laser
- optical fiber
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- heat sink
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Abstract
This invention is a butterfly-shaped packaging device for self-adapting couple semiconductor laser, this device includes: butterfly case, a semiconductor refrigerator welded in the butterfly case; a silicon heat sink carrying the semiconductor laser, optical fiber, back light detector, and microwave microstrip circuit is fixed on the semiconductor refrigerator of butterfly-shaped packaging device , the case pin are fixed on the both side of case; onnects the microwave microstrip circuits on the silicon heat sink with the case pins.
Description
Technical field
The invention belongs to technical field of optical fiber communication, the butterfly encapsulation coupled apparatus of more specifically saying so and belonging to semiconductor laser and optical fiber.
Background technology
In Fibre Optical Communication Technology, adopt the signal source of semiconductor laser usually as optical fiber communication.For the laser that semiconductor laser is produced imports in the optical fiber, the semiconductor laser coupling need be encapsulated in the middle of certain specific packing forms, reach the light signal that semiconductor laser is produced and be coupled to reliably quietly in the middle of the optical fiber, and the purpose of the signals of telecommunication such as direct current biasing, modulation signal being introduced semiconductor laser.Common coupling packing forms has coaxial packaging, butterfly encapsulation, dip, small outline dual straight cutting encapsulation or the like.Wherein the butterfly encapsulation is equipped with semiconductor cooler and thermo-sensitive resistor usually, and can places some microwave microstrip circuits because the inner space is bigger.By semiconductor cooler and thermo-sensitive resistor, in conjunction with external control circuit, can guarantee that semiconductor laser keeps a constant working temperature, this is very important to the very responsive semiconductor laser of working temperature for performances such as emission wavelengths; And microwave microstrip circuit plays clearly effect for reducing encapsulation for the influence of semiconductor laser high-frequency response characteristic.Because the semiconductor laser of butterfly encapsulation has many benefits, make applications such as its wavelength division multiplexing, two-forty, long distance become a kind of packing forms of extensive employing in optical fiber communication.In the common butterfly packaging device for semiconductor laser, optical fiber is fixed on the pedestal of butterfly shell with laser welding or gluing mode or on the shell in the additional tail pipe usually, there is the difficulty that is coupled and aligned in this coupled modes, the optical-fibre precise adjustment need be aimed at the optical position that of semiconductor laser, thereby cause production efficiency low, the skilled worker is required height, the problem that production cost is high; And in the butterfly packaging device for semiconductor laser course of work, because the heating of semiconductor laser itself, the heat migration of semiconductor cooler, reasons such as the variations in temperature of surrounding environment, can cause the position at semiconductor laser place and the position of fixed fiber to produce certain temperature gradient, like this material expand with heat and contract with cold and inconsistent, finally cause the position of semiconductor laser relative variation to take place with the position of optical fiber, influence the photostability that of device, when serious even can not have light output fully.For the semiconductor laser coupling that adopts the fiber waveguide position alignment of behind heat sink making alignment mark, carrying out semiconductor laser again, still need the position of semiconductor laser is accurately aimed at alignment mark, this process time is longer, also there is certain difficulty, and also need to use comparatively expensive back-off welding equipment in this process, production cost is also higher.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of self adaptation coupling butterfly packaging device for semiconductor laser, this device can reach the fast and convenient coupling work of carrying out semiconductor laser and optical fiber, coupling speed is fast, the production efficiency height, production cost is low, and temperature stability is also better.
The technical scheme that the present invention solves its technical problem is:
A kind of self adaptation coupling of the present invention butterfly packaging device for semiconductor laser is characterized in that this device comprises: a butterfly shell; The semiconductor refrigerator freezes in butterfly shell the inside; One has heat sink being fixed on the semiconductor cooler of silicon of semiconductor laser, optical fiber and back light detector and microwave microstrip circuit; Shell pin is fixed on butterfly shell both sides; Connect microwave microstrip circuit and the shell pin of silicon on heat sink with the interconnection spun gold.
Wherein on silicon is heat sink, make optical fiber V shape groove, vertical V-shaped groove and V-shaped groove backlight; On silicon is heat sink, makes microwave microstrip circuit and evenly distribute four independently circular electrodes with the same one side of each V-shaped groove, the position size of this circular electrode is corresponding with four independent circular electrodes on the semiconductor laser electrode surface, the fiber waveguide of semiconductor laser and optical fiber V shape groove and V-shaped groove backlight are coaxial, the high-frequency electrode of semiconductor laser is used for being connected with microwave microstrip circuit, back-off is fixed with the semiconductor laser between optical fiber V shape groove and V-shaped groove backlight, is fixed with a back light detector at the other end of V-shaped groove backlight; Side at optical fiber V shape groove and semiconductor laser is manufactured with thermistor; The optical fiber of one conical head is fixed in the optical fiber V shape groove with curing glue.
Wherein metal layer on back has been made at the heat sink back side of silicon.
Wherein the end at the butterfly shell is fixed with a shell tail pipe.
Wherein this shell tail pipe fluid sealant shutoff.
The invention has the beneficial effects as follows: can fast and conveniently reliably carry out the coupling encapsulation of butterfly packaging device for semiconductor laser efficiently, need not to use expensive high accuracy back-off welding equipment to aim at, need not artificial position and the fiber position of accurately adjusting semiconductor laser, reach and enhance productivity, the purpose that reduces production costs, and the high frequency characteristics of device and temperature stability are also better.
Description of drawings
The present invention is further described below in conjunction with drawings and Examples in order to further specify technology contents of the present invention, wherein:
Fig. 1 is the top view of semiconductor laser in the self adaptation coupling butterfly packaging device for semiconductor laser.
Fig. 2 is the heat sink front view of silicon in the self adaptation coupling butterfly packaging device for semiconductor laser.
Fig. 3 is the heat sink side sectional view along the transverse center direction of principal axis of silicon in the self adaptation coupling butterfly packaging device for semiconductor laser.
Fig. 4 is the cut-away view of self adaptation coupling butterfly packaging device for semiconductor laser.
Embodiment
See also Fig. 1, make in the process of semiconductor laser 7, making high-frequency electrode 17 and four on its electrode surface is four independent circular electrodes 19 that the symmetry axis strictness distributes symmetrically and evenly with fiber waveguide 16, and microelectronic technique can guarantee the relative position of independent circular electrode 19 and fiber waveguide 16.Before the coupling work of carrying out semiconductor laser 7, on four independent circular electrodes 19, fire the tin ball in advance.
See also Fig. 2 and Fig. 3, utilize the micromachining technology of wet etching on silicon heat sink 1, to make optical fiber V shape groove 5, vertical V-shaped groove 4 and V-shaped groove backlight 3 respectively.Use microelectronic technique on silicon heat sink 1, to make microwave microstrip circuit 2 and four the independently circular electrodes 8 that evenly distribute then, make back side gold layer at the back side of silicon heat sink 1.In this process, utilize the accuracy of micromachining technology and microelectronic technique to be easy to guarantee strict optical fiber V-shaped groove 5 and even four the independently center lines of circular electrode 8 that distribute aimed at.With semiconductor laser 7 positions roughly with silicon heat sink 1 on the aligned in position of four independent circular electrodes 8, heat and freeze, then leave standstill natural cooling.Because four independent circular electrodes 19 of semiconductor laser 7 and four independent circular electrodes 8 on the silicon heat sink 1 are complete correspondences, in the cooling procedure of tin ball, the surface tension effects of tin ball can make that semiconductor laser is adaptive and move on the correct position, thereby finish fiber waveguide 16 positions of semiconductor laser 7 and aiming at of optical fiber V shape groove 4 positions, also just can finish the work that is coupled and aligned of semiconductor laser 7 and optical fiber 10.The head of optical fiber 10 obtains conical shape by the way that grinds or high temperature draws moulding, can improve the numerical aperture NA of optical fiber 10, thereby improves the coupling efficiency of optical fiber 10 and semiconductor laser 7.Optical fiber 10 is adjusted front and back position in optical fiber V shape groove 5, and is fixed in the optical fiber V shape groove 5 with ultra-violet curing glue.The laser that vertical V-shaped groove 4 provides a semiconductor laser 7 to send enters the space of optical fiber 10.The degree of depth of optical fiber V shape groove 5 and the diameter of optical fiber 10 have all passed through accurate Calculation, make the center of optical fiber 10 be on the same horizontal surface position of fiber waveguide 16 of semiconductor laser 7, this has just guaranteed the accurate contraposition that optical position of optical fiber 10 and semiconductor laser 7, thereby is easy to such an extent that just can obtain very high coupling efficiency (looking the coupling efficiency of different situations acquisition 20%～60%).In the process of being coupled and aligned, do not need a lot of labour's time, technical merit to the skilled worker requires also lower, in the coupling efficiency that guarantees novel semi-conductor laser butterfly packaging device, reached and enhanced productivity like this, reduced the purpose of production cost.Back light detector 9 also back-off and is welded on the silicon heat sink 1.The inclined-plane by V-shaped groove backlight 3 rear ends backlight of semiconductor laser 7 can reflex on the incidence surface of back light detector 9, and the angle on this inclined-plane is 54 degree, can prevent that the reverberation of back light detector 9 incidence surfaces from influencing the operating state of semiconductor laser 7.Devices such as thermo-sensitive resistor 6 and inductance also are welded on the silicon heat sink 1.
In Fig. 4, semiconductor cooler 14 freezes in butterfly shell 11 the insides, and the silicon heat sink 1 that will have semiconductor laser 7, optical fiber 10 and back light detector 9 freezes on semiconductor cooler 14.With microwave microstrip circuit 2 and shell pin 13 that interconnection spun gold 15 connects on the silicon heat sink 1, optical fiber 10 stretches out from shell tail pipe 12, and seals shell tail pipe 12 with fluid sealant.Cover enclosure cap (not drawing among the figure), filling under the nitrogen environment with parallel seam sealing machine seam welded tube cap.
Claims (5)
1, a kind of self adaptation coupling butterfly packaging device for semiconductor laser is characterized in that this device comprises:
One butterfly shell;
The semiconductor refrigerator freezes in butterfly shell the inside;
One has heat sink being fixed on the semiconductor cooler of silicon of semiconductor laser, optical fiber and back light detector and microwave microstrip circuit;
Shell pin is fixed on butterfly shell both sides;
Connect microwave microstrip circuit and the shell pin of silicon on heat sink with the interconnection spun gold.
2, self adaptation coupling butterfly packaging device for semiconductor laser according to claim 1 is characterized in that, wherein makes optical fiber V shape groove, vertical V-shaped groove and V-shaped groove backlight on silicon is heat sink; On silicon is heat sink, makes microwave microstrip circuit and evenly distribute four independently circular electrodes with the same one side of each V-shaped groove, the position size of this circular electrode is corresponding with four independent circular electrodes on the semiconductor laser electrode surface, the fiber waveguide of semiconductor laser and optical fiber V shape groove and V-shaped groove backlight are coaxial, the high-frequency electrode of semiconductor laser is used for being connected with microwave microstrip circuit, back-off is fixed with the semiconductor laser between optical fiber V shape groove and V-shaped groove backlight, is fixed with a back light detector at the other end of V-shaped groove backlight; Side at optical fiber V shape groove and semiconductor laser is manufactured with thermistor; The optical fiber of one conical head is fixed in the optical fiber V shape groove with curing glue.
3, self adaptation coupling butterfly packaging device for semiconductor laser according to claim 1 and 2 is characterized in that wherein metal layer on back has been made at the heat sink back side of silicon.
4, self adaptation coupling butterfly packaging device for semiconductor laser according to claim 1 is characterized in that wherein the end at the butterfly shell is fixed with a shell tail pipe.
5, self adaptation coupling butterfly packaging device for semiconductor laser according to claim 4 is characterized in that, wherein this shell tail pipe fluid sealant shutoff.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02146846 CN1208884C (en) | 2002-10-15 | 2002-10-15 | Adaptive coupled semiconductor laser butterfly sealing devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02146846 CN1208884C (en) | 2002-10-15 | 2002-10-15 | Adaptive coupled semiconductor laser butterfly sealing devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1490908A true CN1490908A (en) | 2004-04-21 |
| CN1208884C CN1208884C (en) | 2005-06-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02146846 Expired - Fee Related CN1208884C (en) | 2002-10-15 | 2002-10-15 | Adaptive coupled semiconductor laser butterfly sealing devices |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051954A (en) * | 2014-06-19 | 2014-09-17 | 中国科学院半导体研究所 | Optical coupling structure applied to optical signal monitoring of photoelectronic devices |
| CN110335850A (en) * | 2019-04-15 | 2019-10-15 | 中国科学院半导体研究所 | A kind of encapsulating structure of photoelectric chip |
| CN110516357A (en) * | 2019-08-27 | 2019-11-29 | 西安电子科技大学 | Gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property determines method |
| CN110635350A (en) * | 2019-08-02 | 2019-12-31 | 国科光芯(海宁)科技股份有限公司 | Voltage-withstanding preparation method of pluggable semiconductor laser |
-
2002
- 2002-10-15 CN CN 02146846 patent/CN1208884C/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051954A (en) * | 2014-06-19 | 2014-09-17 | 中国科学院半导体研究所 | Optical coupling structure applied to optical signal monitoring of photoelectronic devices |
| CN110335850A (en) * | 2019-04-15 | 2019-10-15 | 中国科学院半导体研究所 | A kind of encapsulating structure of photoelectric chip |
| CN110635350A (en) * | 2019-08-02 | 2019-12-31 | 国科光芯(海宁)科技股份有限公司 | Voltage-withstanding preparation method of pluggable semiconductor laser |
| CN110635350B (en) * | 2019-08-02 | 2020-12-01 | 国科光芯(海宁)科技股份有限公司 | Voltage-withstanding preparation method of pluggable semiconductor laser |
| CN110516357A (en) * | 2019-08-27 | 2019-11-29 | 西安电子科技大学 | Gold ribbon flexible interconnection thermal sensitive parameter towards microwave components electrical property determines method |
| CN110516357B (en) * | 2019-08-27 | 2020-12-08 | 西安电子科技大学 | Gold belt flexible interconnection thermosensitive parameter determination method for electric performance of microwave assembly |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1208884C (en) | 2005-06-29 |
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