CN1486132A - Heat emission module structure for electronic device - Google Patents
Heat emission module structure for electronic device Download PDFInfo
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- CN1486132A CN1486132A CNA031523072A CN03152307A CN1486132A CN 1486132 A CN1486132 A CN 1486132A CN A031523072 A CNA031523072 A CN A031523072A CN 03152307 A CN03152307 A CN 03152307A CN 1486132 A CN1486132 A CN 1486132A
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- housing
- circuit board
- pcb
- printed circuit
- heat
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Abstract
The invention is a cooling mould structure of an electron device, it includes: a shell, which has a top, bottom, the first flank and the second flank, the first flank opposites the second flank; a cooling fan on the first flank of the shell; the first vent region on the second flank of the shell; the second vent region on the top of the shell; and a printing circuit board in the shell. It forms the first gas flow channel between the top and the circuit board, and forms the second gas flow channel between the circuit board and the bottom. The heat generated in the second channel is higher than the one in the first channel, and the distance from the circuit board to bottom is bigger than the distance from the top to the circuit board.
Description
Technical field
The present invention relates to a kind of heat radiation modular structure of electronic installation, especially a kind of heat radiation modular structure of power supply unit.
Background technology
Indispensable basic outfit when power supply unit (power supply) is the running of various electric equipment or information products.Along with the requirement of various electric equipment or information products miniaturization, power supply unit is in design also gradually towards small size and high power development.Except that above-mentioned design was considered, the another consideration emphasis of power supply unit was a heat dissipation problem.Have many electronic components in the power supply unit, these electronic components can produce very high heat when power supply unit operates, and these heats will make that the temperature in the housing is more and more higher, if can't effectively heat be removed, then certainly will impact the usefulness of power supply unit and the life-span of its electronic component.
See also Fig. 1, it is the heat radiation modular structure sectional view of conventional power source supply.Power supply unit with ATX (Advanced Technology expanding) specification is an example, and it comprises a housing 11, a radiator fan 12, a printed circuit board (PCB) 13, a plurality of electronic component 14 and one or more radiator (heatsink) 15 etc.Wherein, radiator fan 12 is arranged in the housing 11, can when running the hot-air in the power supply unit housing 11 be seen through the vent region (not shown) and blow out housing 11, or cool exterior air is blown in the housing 11 with heat radiation.In addition, printed circuit board (PCB) 13 has a first surface 131 and a second surface 132, many electronic components 14 wherein are set on the first surface 131 usually, and most of electronic component 14 can produce heat when power supply unit operates, therefore become the main thermal source district in the power supply unit.13 bottom surfaces that are directly fixed on housing 11 of printed circuit board (PCB), and only keep the distance of about 8.5mm between the bottom surface of the second surface 132 of printed circuit board (PCB) 13 and housing 11.
One or more radiators 15 can be set on the first surface 131 of printed circuit board (PCB) 13 usually; wherein the position of radiator 15 settings is good with the big electronic component 14 of contact heating amount; its heat that electronic component 14 can be produced when operating sees through radiator 15 and is transferred in power supply unit housing 11 volume inside; and the air-flow that is driven by radiator fan 12 blows out hot-air in power supply unit housing 11, to reach the effect of heat radiation.
See also Fig. 2, it is the power supply unit shell structure schematic diagram of ATX specification shown in Figure 1.As shown in Figure 2, power supply unit housing 11 has six faces, wherein end face 111 is relative with bottom surface 112, and first side 113 is relative with second side 114.Housing 11 has a reticular part 115, one or more first vent region 116 and one or more second vent region 117 in addition, wherein reticular part 115 is formed on first side 113 of housing 11, first vent region 116 is formed on second side 114 of housing 11,117 of second vent region are formed on the end face 111 of housing 11, and with respect to first surface 131 (not shown) of printed circuit board (PCB) 13.In addition, 12 of radiator fans are arranged on the position of reticular part 115, running by radiator fan 12 can make air-flow enter from first and second vent region 116,117, keeping the demand of system to air, and produces the heat that effective air-flow is produced with the power supply unit inside that leaves.
Yet the problem that the conventional power source supply but has radiating efficiency to promote.See also Fig. 3, it is the air flow direction schematic diagram of power supply unit when running of ATX specification.When the power supply unit of ATX specification is arranged in the system and during running, effective air-flow Q1 by first vent region 116 heat that power supply unit thermal source district is produced that is commonly used to leave, and second vent region 117 is because near the position of system processor, therefore the air-flow Q2 by second vent region 117 is used to the demand of the system that keeps to air.Yet, in the power supply unit of traditional ATX specification, effective air-flow Q1 by first vent region 116 can't promote the flow of effective air-flow Q1, and then has influence on the radiating efficiency of power supply unit integral body because of being subjected to the influence by the air-flow of second vent region 117.
Therefore, how to overcome above-mentioned defective, and develop the power supply unit of the preferable heat dissipation of a kind of tool, the real problem that presses for solution for present industry.
Summary of the invention
Main purpose of the present invention provides a kind of heat radiation modular structure of electronic installation, and it is by the design of heat dissipation channel and/or heat-conducting plate, with effective air flow rate of promoting electronic installation and increase area of dissipation, and then improves the radiating efficiency of electronic installation.
One embodiment of the invention are a kind of heat radiation modular structure of electronic installation, and it comprises: a housing, and it has an end face, a bottom surface, one first side and one second side, and wherein this first side is relative with this second side; One radiator fan, it is arranged at this first side of this housing; One first ventilation hole, it is arranged at this second side of this housing; One second ventilation hole, it is arranged at this end face of this housing; And a printed circuit board (PCB), it is arranged in this housing, between this housing end face and this printed circuit board (PCB), forming one first gas channel, and between this housing bottom surface and this printed circuit board (PCB) formation one second gas channel.Wherein, the heat height that the heat that this printed circuit board (PCB) is produced in this second gas channel is produced in than this first gas channel, and this second gas channel is bigger to the distance of this housing end face by this printed circuit board (PCB) than this first gas channel to the distance of this housing bottom surface by this printed circuit board (PCB).
According to conception of the present invention, wherein this electronic installation is a power supply unit.
According to conception of the present invention, wherein this of this housing first side has a reticular part.
According to conception of the present invention, wherein this radiator fan is arranged on this reticular part.
According to conception of the present invention, wherein this printed circuit board (PCB) has a first surface and a second surface, this first surface is arranged in this second gas channel, and on this first surface set electronic component number in fact more than electronic component number set on this second surface.
According to conception of the present invention, wherein the heat radiation modular structure of electronic installation also comprises at least one heat-conducting plate (heat conducting plate), and this heat-conducting plate is with electronic component produced on this printed circuit board (PCB) transfer of heat this bottom surface to this housing.
According to conception of the present invention, wherein an end of this heat-conducting plate is fixed in this first surface of this printed circuit board (PCB), and the other end contacts with this bottom surface of this housing.Wherein, this bottom surface of this heat-conducting plate and this housing is good with the screw locking.
According to conception of the present invention, wherein an end of this heat-conducting plate is fixed in this first surface of this printed circuit board (PCB), and this bottom surface of the other end and this housing is then by conductive medium conduction heat.
According to conception of the present invention, wherein the heat radiation modular structure of this electronic installation also comprises at least one radiator (heat sink), and the one end is fixed in this first surface of this printed circuit board (PCB).
According to conception of the present invention, wherein the distance of this end face of this printed circuit board (PCB) and this housing is essentially between the 10mm to 50mm.
Another embodiment of the present invention is a kind of heat radiation modular structure of electronic installation, and it comprises: a housing, and it has an end face, a bottom surface, one first side and one second side, and wherein this first side is relative with this second side; One radiator fan, it is arranged at this first side of this housing; One first ventilation hole, it is arranged at this second side of this housing; One second ventilation hole, it is arranged at this end face of this housing; One printed circuit board (PCB), it is arranged in this housing, in between this housing end face and this printed circuit board (PCB), to form one first gas channel, and between this housing bottom surface and this printed circuit board (PCB), form one second gas channel, wherein, the heat height that produced in than this first gas channel of the heat that in this second gas channel, produced of this printed circuit board (PCB); And at least one heat-conducting plate, it is arranged in this second gas channel, the heat that electronic component was produced on this printed circuit board (PCB) is conducted to this bottom surface of this housing.
According to conception of the present invention, wherein this second gas channel is bigger to the distance of this housing end face by this printed circuit board (PCB) than this first gas channel to the distance of this housing bottom surface by this printed circuit board (PCB).
By following accompanying drawing and embodiment, can be illustrated more clearly in the present invention.
Description of drawings
Fig. 1: the heat radiation modular structure sectional view that is depicted as the conventional power source supply.
Fig. 2: the shell structure schematic diagram that is depicted as power supply unit shown in Figure 1.
Fig. 3: be depicted as the air flow direction schematic diagram of power supply unit shown in Figure 1 when running.
Fig. 4: the heat radiation modular structure sectional view that is depicted as the power supply unit of preferred embodiment of the present invention.
Fig. 5: the shell structure schematic diagram that is depicted as power supply unit shown in Figure 4.
Fig. 6: be depicted as the air flow direction schematic diagram of power supply unit shown in Figure 4 when running.
Wherein, description of reference numerals is as follows:
Known:
11: housing 12: radiator fan 13: printed circuit board (PCB) 14: electronic component
15: radiator 111: end face 112: 113: the first sides, bottom surface
The side 115 in 114: the second: reticular part
117: the second vent region of 116: the first vent region
131: first surface 132: second surface
Of the present invention:
21: housing 22: radiator fan 23: printed circuit board (PCB) 24: electronic component
25: heat-conducting plate 26: radiator 27: screw
29: the second gas channels of 28: the first gas channels
211: end face 212: 214: the second sides, 213: the first sides, bottom surface
215: 217: the second vent region of 216: the first vent region of reticular part
231: first surface 232: second surface
Embodiment
The present invention is a kind of heat radiation modular structure of electronic installation, though following examples illustrate technology of the present invention with the heat radiation modular structure of power supply unit, yet the electronic installation that can use the technology of the present invention is not limited to power supply unit, any electronic installation that is suitable for following technical characterictic all can be incorporated reference at this.
See also Fig. 4, it is the power supply unit heat radiation modular structure sectional view of preferred embodiment of the present invention.Power supply unit with ATX (Advanced Technology expanding) specification is an example, and it comprises a housing 21, a radiator fan 22, a printed circuit board (PCB) 23, a plurality of electronic component 24 and one or more heat-conducting plate 25.Wherein, radiator fan 22 is arranged in the housing 21, can when running the hot-air in the housing 21 be seen through the vent region (not shown) and blow out housing 21, or cool exterior air is blown in the housing 21 with heat radiation.
See also Fig. 5, it is the shell structure schematic diagram of power supply unit shown in Figure 4.As shown in Figure 5, power supply unit housing 21 has six faces, and wherein end face 211 is relative with bottom surface 212, and first side 213 is relative with second side 214.Housing 21 has a reticular part 215, one or more first vent region 216 and one or more second vent region 217 in addition, wherein reticular part 215 is formed on first side 213 of housing 21, first vent region 216 is formed on second side 214, and 217 of second vent region are formed on the end face 211 of housing 21.In addition, 22 of radiator fans are arranged on the position of reticular part 215, can when radiator fan 22 runnings air-flow be entered from first and second vent region 216,217 by this, and discharge from reticular part 215, to reach the purpose of heat radiation.
Please consult Fig. 4 and Fig. 5 again.Printed circuit board (PCB) 23 can be arranged on the ad-hoc location in the housing 21, to form one first gas channel 28 in housing end face 211 and 23 of printed circuit board (PCB)s, and form one second gas channel 29 in housing bottom surface 212 and 23 of printed circuit board (PCB)s, the heat height that produced in than first gas channel 28 of the heat that in second gas channel 29, produced of printed circuit board (PCB) 23 wherein, and second gas channel 29 is bigger to the distance of housing end face 211 by printed circuit board (PCB) 23 than first gas channel 28 to the distance of housing bottom surface 212 by printed circuit board (PCB) 23.
Printed circuit board (PCB) 23 has a first surface 231 and a second surface 232, wherein first surface 231 is arranged in second gas channel 29, and the number of set electronic component 24 is many more than electronic component set on the second surface 232 24 numbers on the first surface 231.In this embodiment, the distance of 211 of the end faces of printed circuit board (PCB) 23 and housing 21 is good to maintain about 10-50mm.
See also Fig. 6, it is the air flow direction schematic diagram of power supply unit shown in Figure 4 when running.First gas channel 28 has enough air-flow Q2 to pass through from second vent region 217, to keep the demand of system to air-flow.In addition, second gas channel 29 is mainly the thermal source district of power supply unit, formation by second gas channel 29, the influence of the air-flow Q2 of second vent region 217 because the effective air-flow Q1 that enters from first vent region 216 no longer is subjected to flowing through, therefore can produce more effectively air-flow through the thermal source district, so just can promote the radiating efficiency of power supply unit integral body further.Do one relatively with Fig. 3 and structure shown in Figure 6, under identical external condition, effective air-flow Q1 that known technology produced is about 9.3cfm, and effective air-flow Q1 that the technology of the present invention produced is about 11.5cfm.Therefore can find out significantly that technology of the present invention can promote 23.6% with effective air flow rate, so just can promote the radiating efficiency of power supply unit integral body further.
In addition, please consult Fig. 4 again, the transfer of heat for the electronic component 24 on printed circuit board (PCB) 23 first surfaces 231 is produced can be provided with one or more heat-conducting plate 25 on the first surface 231 of printed circuit board (PCB) 23.The effect of heat-conducting plate 25 mainly is the bottom surface 212 that the heat that printed circuit board (PCB) 23 is produced is conducted to housing 21, uses the increase area of dissipation.In addition, an end of heat-conducting plate 25 can be fixed on the first surface 231 of printed circuit board (PCB) 23, and is contacted with the big electronic component of caloric value 24.The other end of heat-conducting plate 25 then contacts with the bottom surface 212 of housing 21, and its fixed form can be by screw 27 lockings.Certainly, an other end of heat-conducting plate 25 and the bottom surface 212 of housing 21 also can see through a conductive medium (not shown) and conduct heat, therefore not directly contact.In addition, the material of bottom surface 212 can be identical or different with other side of housing 21, and it can be made by any metal material or the aluminum or aluminum alloy material of the preferable conductive coefficient of tool.Owing to the other end of heat-conducting plate 25 contacts with the bottom surface 212 of housing 21 or conducts heat by conductive medium, so the heat that the electronic component 24 on printed circuit board (PCB) 23 first surfaces 231 is produced just can see through the bottom surface 212 that heat-conducting plate 25 be transferred to housing 21, therefore just can with lower cost produce bigger area of dissipation because the bottom surface 212 of housing 21 has bigger area of dissipation this moment.
In addition, except that heat-conducting plate 25, one or more radiator 26 is set on the first surface 231 of printed circuit board (PCB) 23 as known technology optionally also.One end of radiator 26 can be fixed on the first surface 231 of printed circuit board (PCB) 23, its other end then optionally is provided with heat-dissipating fin and does not contact with the bottom surface 212 of housing 21, because the principle of radiator is the same with known technology with set-up mode, therefore repeat no more.
In sum, the invention provides a kind of heat radiation modular structure of electronic installation, it mainly is the particular design by gas channel, to increase effective air flow rate, by this to promote the heat dissipation of electronic installation integral body.In addition, because the heat-conducting plate two ends are connected with printed circuit board (PCB) and housing bottom surface respectively, therefore the heat that electronic component produced on the printed circuit board (PCB) first surface just can see through heat-conducting plate and be transferred to the housing bottom surface, because the housing bottom surface has bigger area of dissipation, therefore just can produce bigger area of dissipation with lower cost.
Claims (10)
1. the heat radiation modular structure of an electronic installation, it comprises:
One housing, it has an end face, a bottom surface, one first side and one second side, and wherein this first side is relative with this second side;
One radiator fan, it is arranged at this first side of this housing;
One first vent region, it is arranged at this second side of this housing;
One second vent region, it is arranged at this end face of this housing; And
One printed circuit board (PCB), it is arranged in this housing, with formation one first gas channel between this housing end face and this printed circuit board (PCB), and forms one second gas channel between this housing bottom surface and this printed circuit board (PCB); Wherein, the heat height that the heat that this printed circuit board (PCB) is produced in this second gas channel is produced in than this first gas channel, and this second gas channel is bigger to the distance of this housing end face by this printed circuit board (PCB) than this first gas channel to the distance of this housing bottom surface by this printed circuit board (PCB).
2. the heat radiation modular structure of electronic installation as claimed in claim 1 is characterized in that, this electronic installation is a power supply unit.
3. the heat radiation modular structure of electronic installation as claimed in claim 1, it is characterized in that, this printed circuit board (PCB) has a first surface and a second surface, this first surface is arranged in this second gas channel, and on this first surface set electronic component number more than electronic component number set on this second surface.
4. the heat radiation modular structure of electronic installation as claimed in claim 3 is characterized in that, this modular structure also comprises at least one heat-conducting plate, and this heat-conducting plate is with transfer of heat that this printed circuit board (PCB) produced this bottom surface to this housing.
5. the heat radiation modular structure of electronic installation as claimed in claim 4 is characterized in that, an end of this heat-conducting plate is fixed in this first surface of this printed circuit board (PCB), and the other end contacts with this bottom surface of this housing.
6. the heat radiation modular structure of electronic installation as claimed in claim 4 is characterized in that, an end of this heat-conducting plate is fixed in this first surface of this printed circuit board (PCB), then conducts heat by a conductive medium between this bottom surface of the other end and this housing.
7. the heat radiation modular structure of electronic installation as claimed in claim 3 is characterized in that, this modular structure also comprises at least one radiator, and the one end is fixed in this first surface of this printed circuit board (PCB).
8. the heat radiation modular structure of electronic installation as claimed in claim 1 is characterized in that, the distance of this end face of this printed circuit board (PCB) and this housing is between the 10mm to 50mm.
9. the heat radiation modular structure of an electronic installation, it comprises:
One housing, it has an end face, a bottom surface, one first side and one second side, and wherein this first side is relative with this second side;
One radiator fan, it is arranged at this first side of this housing;
One first vent region, it is arranged at this second side of this housing;
One second vent region, it is arranged at this end face of this housing;
One printed circuit board (PCB), it is arranged in this housing, with formation one first gas channel between this housing end face and this printed circuit board (PCB), and forms one second gas channel between this housing bottom surface and this printed circuit board (PCB); Wherein, the heat height that produced in than this first gas channel of the heat that in this second gas channel, produced of this printed circuit board (PCB); And
At least one heat-conducting plate, it is arranged in this second gas channel, the heat that this printed circuit board (PCB) was produced is conducted to this bottom surface of this housing.
10. the heat radiation modular structure of electronic installation as claimed in claim 9 is characterized in that, this second gas channel is bigger to the distance of this housing end face by this printed circuit board (PCB) than this first gas channel to the distance of this housing bottom surface by this printed circuit board (PCB).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03152307 CN1243463C (en) | 2003-07-28 | 2003-07-28 | Heat emission module structure for electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03152307 CN1243463C (en) | 2003-07-28 | 2003-07-28 | Heat emission module structure for electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1486132A true CN1486132A (en) | 2004-03-31 |
| CN1243463C CN1243463C (en) | 2006-02-22 |
Family
ID=34156538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03152307 Expired - Fee Related CN1243463C (en) | 2003-07-28 | 2003-07-28 | Heat emission module structure for electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1243463C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100401866C (en) * | 2004-12-03 | 2008-07-09 | 台达电子工业股份有限公司 | Electronic device with heat radiating structure |
| CN102270614A (en) * | 2010-06-02 | 2011-12-07 | 晶致半导体股份有限公司 | Radiator fan system with backup functions |
| CN112739141A (en) * | 2019-10-14 | 2021-04-30 | 致茂电子(苏州)有限公司 | Power supply |
-
2003
- 2003-07-28 CN CN 03152307 patent/CN1243463C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100401866C (en) * | 2004-12-03 | 2008-07-09 | 台达电子工业股份有限公司 | Electronic device with heat radiating structure |
| CN102270614A (en) * | 2010-06-02 | 2011-12-07 | 晶致半导体股份有限公司 | Radiator fan system with backup functions |
| CN112739141A (en) * | 2019-10-14 | 2021-04-30 | 致茂电子(苏州)有限公司 | Power supply |
| CN112739141B (en) * | 2019-10-14 | 2023-11-07 | 致茂电子(苏州)有限公司 | Power supply |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1243463C (en) | 2006-02-22 |
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Granted publication date: 20060222 Termination date: 20180728 |