CN1482264A - Lead wire framework copper belt for IC and its producing process and method - Google Patents
Lead wire framework copper belt for IC and its producing process and method Download PDFInfo
- Publication number
- CN1482264A CN1482264A CNA031498493A CN03149849A CN1482264A CN 1482264 A CN1482264 A CN 1482264A CN A031498493 A CNA031498493 A CN A031498493A CN 03149849 A CN03149849 A CN 03149849A CN 1482264 A CN1482264 A CN 1482264A
- Authority
- CN
- China
- Prior art keywords
- copper
- lead frame
- copper strip
- adopt
- iron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Conductive Materials (AREA)
- Continuous Casting (AREA)
- Metal Rolling (AREA)
Abstract
The copper belt for IC lead frame may have varying alloy components and different production technological process for certain conductivity and certain mechanical performance indexes. It consists of copper 99.75-99.82 wt%, iron 0.05-0.15 wt%, phosphorus 0.025-0.040 wt% and inevitable impurity less than 0.15 wt%; and its making process includes smelting, casting block ingot, hot rolling and water quenching, face milling, precise rolling, bright annealing, bending, precise shearing and winding to form. Its performance indexes include conductivity 85 % IACS, strength 3.85 MPa, specific elongation not less than 4 % and Vickers hardness HV110-130.
Description
Technical field:
The present invention relates to the metal material processing technical field, a kind of lead frame copper strip and process for making thereof that is used for big, the power integrated circuit of IC industry.
Background technology:
In the IC industry of constantly development, the lead frame copper strip material and the process for making thereof of unicircuit are constantly being weeded out the old and bring forth the new, both at home and abroad all in research and development, external on the one hand to Chinese blocking technology, want on the other hand to introduce technology or import one cover production unit, its investment is also very big.In order to excavate this enterprise potential, rely on oneself and improve oneself, rely on the technician constantly to make great efforts to probe into and learn, do not having ready-made technical information, do not have under the situation that domestic colleague's experience can learn yet, independently researched and developed IC with lead frame copper strip and process for making thereof.
Summary of the invention:
In view of reality as mentioned above, purpose of the present invention is utilized the technical force of oneself, research and develop a kind of domestic each related production producer that is applicable to, propose the IC industry lead frame copper strip that different demands and concrete working conditions require, and its processing method of manufacturing is provided, the situation of most dependence imported materials and items is made moderate progress, and then alternative gradually import, save foreign exchange, reduce cost development of national industry.
The present invention adopts following technical scheme to realize the foregoing invention purpose:
Described IC lead frame copper strip, under different working conditionss, for example say: under the situation that satisfies certain electric conductivity requirement,, can adopt different alloying ingredient compositions according to its different mechanical performance index requirement, take different process for making to handle, the present invention has proposed two kinds of material mixture ratios and corresponding two kinds of different manufacture crafts, and one: with copper is base-material, add iron material, add phosphate material again; By weight ratio: copper product 99.75%-99.82%, iron material 0.05%-0.15%, phosphate material 0.025%-0.040%, surplus is to be not more than 0.15% unavoidable impurities; Through melting-Hei ingot casting (direct water-cooling)-hot rolling hardening-mill face-high-precision rolling-clean annealing-stretch-bending straightening-accurate sub-cut-batch moulding; Its performance index: electric conductivity 85%IACS, intensity 〉=385%mpa, unit elongation 〉=4%, vickers hardness hv 115-130.
Described IC is applicable to that under the another kind of working conditions situation, its material is base-material with copper: add iron material, add phosphate material, add rare earth material and make additive with the another kind of raw material ratio that lead frame copper strip adopts; By weight ratio: copper product 96.75%-97.80%, iron material, phosphate material 2.0%-2.7%, phosphate material 0.05-0.15%, rare earths material additive 0.05%-0.4% also contains and is not more than 0.15% unavoidable impurities; Through melting-red ingot casting (non-direct water-cooling)-hot rolling hardening-mill face-high-precision rolling-clean annealing-finish rolling-thermomechanical treatment-stretch-bending straightening-accurate sub-cut-batch type of making; Its performance index are: electric conductivity 65%IACS, intensity 〉=578mpa, unit elongation 〉=5%, vickers hardness hv 165-170.
The present invention is owing to adopt technical scheme as mentioned above, and it has following superiority:
The IC lead frame copper strip, at different service requirementss, guaranteeing to have adopted different material mixture ratios under certain requirement condition, different treatment process condition, in order that reduce production costs, reduce price, satisfy the different user requirement, lower production cost greatly, alleviate burden for users, for example guaranteeing under certain electric conductivity 65% working conditions, treatment process and corresponding other process for making of red ingot casting (non-direct water-cooling) have been adopted, and correspondingly improved the mechanical performance index requirement, increased its intensity, Vickers' hardness etc.
The drawing explanation:
Fig. 1 is a kind of manufacture craft schema of IC with lead frame copper strip;
Fig. 2 is the another kind of manufacture craft schema of IC with lead frame copper strip;
Embodiment one:
When manufacturing specification is the copper base alloy band lead frame copper strip of 0.381mm * 22mm, iron with 0.05%, the phosphorus of adding 0.025% and 99.92% copper, weigh respectively in proportion, drop into induction furnace, in atmosphere, furnace temperature risen to 1250-1350 ℃ after, treat that metal melts fully after, after the stokehold chemical analysis is qualified, adopt black ingot casting (direct water-cooling) to become ingot blank; Adopt 850 ℃ of hot rollings, and use the normal-temperature water hardening, carry out solution treatment, through high precision rolling, clean annealing, stretch-bending straightening is effectively eliminated the unrelieved stress in the copper strips; Through art breading such as accurate sub-cut-finished product batch, reach quality standards again, meet the production customer requirements.
Embodiment two:
Manufacturing specification is the copper base alloy lead frame copper strip of 0.2 * 18mm, iron with 2.3%, the phosphorus of adding 0.04%, add 0.2% mishmetal raw material again and do the copper of additive and 97.46%, weigh in proportion respectively, drop into induction furnace, after in atmosphere, furnace temperature being risen to 1250-1350 ℃, treat that metal melts fully after, add rare earths material and do additive, after the stokehold chemical analysis is qualified, adopt semicontinuous red ingot to be cast as ingot blank, 900-980 ℃ of hot rolling, and use the normal-temperature water hardening, carry out solution treatment, through high precision rolling-clean annealing-finish rolling-distortion thermal treatment, carry out interrupted aging repeatedly and separate out, again stretch-bending straightening, effectively eliminate the unrelieved stress in the copper strips, carry out finished product after the accurate sub-cut and batch.Meet the product requirement warehouse-in after testing, satisfy making user's service requirements.
Claims (7)
1, a kind of IC lead frame copper strip, under different working conditionss, under the situation that satisfies certain electric conductivity requirement, according to its different mechanical performance index requirement, can adopt different alloying ingredient compositions, take different process for making to handle, the present invention is characterised in that: described IC lead frame copper strip, it can be to be base-material with copper, adds iron material, adds phosphate material again; By weight ratio: copper product 99.75%-99.82%, iron material 0.05%-0.15%, phosphate material 0.025%-0.040%, surplus is to be not more than 0.15% unavoidable impurities; Through melting-Hei ingot casting (direct water-cooling)-hot rolling hardening-mill face-high-precision rolling-clean annealing-stretch-bending straightening-accurate sub-cut-batch moulding; Its performance index: electric conductivity 85%IACS, intensity can 〉=385%mpa, unit elongation 〉=4%, vickers hardness hv 110-130.
2, IC lead frame copper strip as claimed in claim 1, it is characterized in that: it can also adopt another kind of raw material ratio, adopts another kind of treatment process condition, and its material is base-material with copper: add iron material, add phosphate material, add rare earths material and make additive; By weight ratio: copper product 96.75%-97.80%, iron material 2.0%-2.7%, phosphate material 0.05-0.15%, rare earths material additive 0.05%-0.4% also contains and is not more than 0.15% unavoidable impurities; Through melting-red ingot casting (non-direct water-cooling)-hot rolling hardening-mill face-high-precision rolling-clean annealing-high-precision is rolling-thermomechanical treatment-stretch-bending straightening-accurate sub-cut-batch moulding; Its performance index are: electric conductivity 65%IACS, intensity 〉=578mpa, unit elongation 〉=5%, vickers hardness hv 165-170.
3, implement the processing method of making copper base alloy band lead frame copper strip as claimed in claim 1, it is characterized in that: its technical process is: at manufacturing specification be: during 0.381 (thick) * 22mm (wide) copper alloy lead wire frame copper strips, iron with 0.05%, the phosphorus of adding 0.025% and 99.92% copper, weigh respectively in proportion, drop into induction furnace, after in atmosphere, furnace temperature being risen to 1250-1350 ℃, after treating that metal melts fully, after the stokehold chemical analysis is qualified, adopt black ingot casting (direct water-cooling) to become ingot blank.
4, implement the processing method of making copper base alloy band lead frame copper strip as claimed in claim 1, it is characterized in that: the hot rolling hardening in its technical process: adopt 850 ℃ of hot rollings, and use the normal-temperature water hardening, carry out solution treatment.
5, implement the processing method of making copper base alloy band lead frame copper strip as claimed in claim 2, it is characterized in that: be: during the copper base alloy lead frame copper strip of 0.2 (thick) * 18mm (wide) at manufacturing specification, iron with 2.3%, the phosphorus of adding 0.04%, add 0.2% mixed rare-earth materials again and do additive, 97.46% copper, weigh in proportion respectively, drop into induction furnace, after in atmosphere, furnace temperature being risen to 1250-1350 ℃, treat that metal melts fully after, add rare earth material and do additive, after the stokehold chemical analysis is qualified, adopt red ingot casting (non-direct water-cooling) to become ingot blank.
6, implement the processing method of making copper base alloy band lead frame copper strip as claimed in claim 2, it is characterized in that: the hot rolling hardening in its technical process, adopt 900-980 ℃ of hot rolling, and use the normal-temperature water hardening, carry out solution treatment.
7, implement the processing method of making copper base alloy band lead frame copper strip as claimed in claim 2, it is characterized in that: in its technical process through high-precision rolling-thermomechanical treatment, carry out interrupted aging repeatedly and separate out.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03149849 CN1226433C (en) | 2003-07-28 | 2003-07-28 | Lead wire framework copper belt for IC and its producing process and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 03149849 CN1226433C (en) | 2003-07-28 | 2003-07-28 | Lead wire framework copper belt for IC and its producing process and method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1482264A true CN1482264A (en) | 2004-03-17 |
| CN1226433C CN1226433C (en) | 2005-11-09 |
Family
ID=34156373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 03149849 Expired - Fee Related CN1226433C (en) | 2003-07-28 | 2003-07-28 | Lead wire framework copper belt for IC and its producing process and method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1226433C (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100337553C (en) * | 2005-06-28 | 2007-09-19 | 华南农业大学 | Sour milk contg. fruit meat of litchi chinensis, and its prepn. method |
| CN100457309C (en) * | 2007-06-08 | 2009-02-04 | 广州铜材厂有限公司 | Process for manufactruing blaster fuse frame copper alloy strip steel rolled stock used for integrate circuit |
| CN101919037B (en) * | 2009-03-23 | 2012-08-22 | 田中电子工业株式会社 | Coated copper wire for ball bonding |
| US8409375B2 (en) * | 2006-06-01 | 2013-04-02 | The Furukawa Electric Co., Ltd. | Method of producing a copper alloy wire rod and copper alloy wire rod |
| CN105568015A (en) * | 2014-12-26 | 2016-05-11 | 上海飞轮有色新材料股份有限公司 | Iron alloy phosphor copper bar melting process |
| CN107447121A (en) * | 2017-06-22 | 2017-12-08 | 安徽晋源铜业有限公司 | A kind of preparation method for significantly improving lead frame Cu alloy material surface defect |
| CN114000179A (en) * | 2021-11-08 | 2022-02-01 | 安徽有研吸气材料有限公司 | Easy-to-weld copper strip for vacuum device |
| CN117403095A (en) * | 2023-11-15 | 2024-01-16 | 铜陵学院 | Copper alloy material containing rare earth Y and preparation method thereof |
-
2003
- 2003-07-28 CN CN 03149849 patent/CN1226433C/en not_active Expired - Fee Related
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100337553C (en) * | 2005-06-28 | 2007-09-19 | 华南农业大学 | Sour milk contg. fruit meat of litchi chinensis, and its prepn. method |
| US8409375B2 (en) * | 2006-06-01 | 2013-04-02 | The Furukawa Electric Co., Ltd. | Method of producing a copper alloy wire rod and copper alloy wire rod |
| CN100457309C (en) * | 2007-06-08 | 2009-02-04 | 广州铜材厂有限公司 | Process for manufactruing blaster fuse frame copper alloy strip steel rolled stock used for integrate circuit |
| CN101919037B (en) * | 2009-03-23 | 2012-08-22 | 田中电子工业株式会社 | Coated copper wire for ball bonding |
| CN105568015A (en) * | 2014-12-26 | 2016-05-11 | 上海飞轮有色新材料股份有限公司 | Iron alloy phosphor copper bar melting process |
| CN107447121A (en) * | 2017-06-22 | 2017-12-08 | 安徽晋源铜业有限公司 | A kind of preparation method for significantly improving lead frame Cu alloy material surface defect |
| CN107447121B (en) * | 2017-06-22 | 2019-04-30 | 安徽晋源铜业有限公司 | A kind of preparation method significantly improving lead frame Cu alloy material surface defect |
| CN114000179A (en) * | 2021-11-08 | 2022-02-01 | 安徽有研吸气材料有限公司 | Easy-to-weld copper strip for vacuum device |
| CN117403095A (en) * | 2023-11-15 | 2024-01-16 | 铜陵学院 | Copper alloy material containing rare earth Y and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1226433C (en) | 2005-11-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104946936B (en) | A kind of aerial condutor high conductivity rare earth duralumin monofilament material | |
| CN105274386B (en) | High-performance complex multi-element phosphor bronze alloy material and preparation method thereof | |
| CN109930026B (en) | High-strength high-conductivity stress relaxation-resistant copper alloy lead frame material and preparation method thereof | |
| CN106636729A (en) | Polybasic copper alloy plate and strip for power battery connector and preparation method thereof | |
| CN108193080A (en) | High intensity, highly conductive proof stress relaxation corson alloy material and preparation method thereof | |
| CN102312123A (en) | Brass alloy | |
| CN106399748A (en) | Novel copper-nickel-silicon system alloy material for lead frame and preparation method of novel copper-nickel-silicon system alloy material | |
| CN103014410A (en) | Copper alloy and fabrication method thereof | |
| CN1226433C (en) | Lead wire framework copper belt for IC and its producing process and method | |
| CN108411150B (en) | Sleeve high-performance copper alloy material and manufacturing method | |
| CN101654749A (en) | Easily-cutting brass and processing method of strips thereof | |
| CN112708791A (en) | Preparation method of C17410 beryllium copper strip | |
| CN102443717B (en) | Low-cost elastic brass alloy | |
| CN102560192B (en) | A kind of High-strength high-plasticity copper alloy and preparation method thereof | |
| CN107739876A (en) | A kind of polynary low beryllium content copper alloy and preparation method thereof | |
| CN102485925A (en) | Copper-nickel-tin alloy and preparation method for wires thereof | |
| JPS5893860A (en) | Manufacture of high strength copper alloy with high electric conductivity | |
| CN100422365C (en) | ISIC leading wire frame copper tape and its production process | |
| CN113981267A (en) | Copper alloy lead frame material | |
| JP4199320B2 (en) | Manufacturing method of support | |
| KR100946721B1 (en) | High strength copper alloy and casting thereof | |
| CN114196853B (en) | Anti-tarnishing wear-resistant copper alloy and preparation method thereof | |
| CN110042274A (en) | A kind of high elastic modulus, copper alloy of stress relaxation-resistant and preparation method thereof | |
| KR940002684B1 (en) | Copper-iron-cobalt-titanium alloy with high mechanial and electrical characteristics and its production process | |
| CN110306078A (en) | A kind of high strength and high conductivity Cutting free C97 alloy material and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PP01 | Preservation of patent right |
Effective date of registration: 20060105 Pledge (preservation): Preservation |
|
| PD01 | Discharge of preservation of patent |
Date of registration: 20070105 Pledge (preservation): Preservation |
|
| ASS | Succession or assignment of patent right |
Owner name: CHINALCO LUOYANG COPPER CO., LTD. Free format text: FORMER OWNER: LUOYANG COPPER PROCESSING GROUP CO LTD Effective date: 20070202 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20070202 Address after: 471039 No. 50, Jianshe Road, Henan, Luoyang Patentee after: Zhonglu Luoyang Copper Industry Co., Ltd. Address before: 471039 Henan city of Luoyang province Jianshe Road No. 50 Luoyang copper processing group company chief engineer office Patentee before: Luoyang Copper Processing Group Co., Ltd. |
|
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20051109 Termination date: 20130728 |