CN1480010A - Ultra-thin type capacity microphone assembly and method for assembling the same - Google Patents
Ultra-thin type capacity microphone assembly and method for assembling the same Download PDFInfo
- Publication number
- CN1480010A CN1480010A CNA018204961A CN01820496A CN1480010A CN 1480010 A CN1480010 A CN 1480010A CN A018204961 A CNA018204961 A CN A018204961A CN 01820496 A CN01820496 A CN 01820496A CN 1480010 A CN1480010 A CN 1480010A
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- base ring
- insulation board
- ultra
- oscillating plate
- thin type
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R19/00—Electrostatic transducers
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- Engineering & Computer Science (AREA)
- Acoustics & Sound (AREA)
- Signal Processing (AREA)
- Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
Abstract
The present invention relates to the ultra/thin type condenser micriphone assembly and method for assembling the same. The present invention unifies the microphone assembling process into a process of accumulating independent and individual components such as adiaphragm assembly, a spacer ring, the second base ring, a dielectric plate, the first base ring a PCB and so forth. According toa preferred implementation of the present invention, dielectric plates and base rings are not subject to any deformation or other damage caused by press fitting process. Furthermore, the final ultra-thin type condenser microphone may be manufactured with a high productivity and may have significantly improved quality. Thepresent invention naturally integrates dielectric plates and baserings, as independent and individual components, with other structures without any press fitting assembly process. As a result, the high quality of the final ultra-thin type microphone assembly may be maintained.
Description
Technical field
The present invention relates to a kind of microphone, for example a kind of electrostatic microphone.Particularly, the present invention relates to a kind of ultra-thin type capacity microphone device, (for example, insulation board and base ring) assembly technology has had very big improvement, therefore by this device, has improved mass productivity and quality widely because some element.
Background technology
Recently, along with the fast development of the technology relevant, also improve for the requirement of the microphone that acoustic energy is changed into electric energy with communication equipment such as phone or portable phone and the stereo set such as loudspeaker thereupon.
The traditional microphone that is used for this purpose, as a kind of electrostatic microphone, in a lot of patents, obtained at length disclosing, as 5,490, No. 220 United States Patent (USP)s " solid state electrostatic microphone device ", 5,870, No. 482 United States Patent (USP)s " miniature silicon condenser microphone ", 6,088, No. 463 United States Patent (USP)s " solid state silicon substrate electrostatic microphone ", 1999-266, No. 499 Japan Patents " dielectric electrostatic microphone ", 1999-88989 Japan Patent " dielectric electrostatic microphone ", 2000-19963 Korean Patent " electrostatic microphone that is used for mobile radio communication terminal ", 1999-55502 Korean Patent " electrostatic microphone " etc.
Traditional electrostatic microphone generally include above one that the printed circuit board (PCB) (" PCB ") that forms a series of electrical models, one are positioned at that PCB goes up and under the effect of the sound wave that enters by the external world vibrative oscillating plate, one by a predetermined slit and oscillating plate insulation board arranged apart, and one can be held whole described elements, the i.e. container of PCB, oscillating plate and insulation board.
As shown in 2000-12516 Korean Patent " dead ring of electrostatic microphone and installation method ", for example, an insulation board is closely being twined by a base ring group that comprises " a metal bottom seat ring and an insulator foot circle ", and firmly is positioned in the container.Owing to placed the base ring group, between PCB and insulation board, formed the rear cavity of a definite size.
Herein, because " slit between oscillating plate and the insulation board " and " rear cavity between PCB and the insulation board " is positioned on the main propagation ducts that sound wave enters from the external world, " slit " and " rear cavity " just can greatly influence the overall performance of microphone.Therefore, at present a large amount of effort has been carried out in the research of slit and rear cavity structure.For example, often study and accurately regulate the depth of parallelism.
Usually, traditional microphone with said structure assembles by series of processes, as " insulation board and base ring group are installed to operation in the device by interference fit ", " between PCB and oscillating plate, insert insulation board/base ring device and with pack into successively operation in the container of PCB, insulation board/base ring device and oscillating plate ".
Yet, if insulation board and base ring group are combined by a series of interference fit operations, to apply a certain size thrust inevitably in the junction of insulation board and base ring group so, and insulation board and base ring group will deform under the effect of transmitting the thrust of coming inevitably.Simultaneously, each link of insulation board and base ring group is torn compacted power and is damaged.
In addition, because insulation board and base ring group are all very little usually, in the compression fit process, even the serious problems that small mismachining tolerance all may cause these parts to be damaged.
As previously mentioned, " in the slit that forms between oscillating plate and the insulation board " is positioned on the main propagation ducts of the sound wave that enters from the external world, therefore greatly influences the overall performance of microphone.Therefore, if insulation board and base ring deform or destroy, thereby, for example, the depth of parallelism in " in the slit that forms between oscillating plate and the insulation board " is owing to be damaged under " pressure " or " mismachining tolerance " effect that applies in the process of interference fit, and the performance and the productivity ratio of ultimatum tube decrease.
Simultaneously, as explained, if by a series of compression fit technologies, " insulation board and base ring group " formed an independent device, forming two base rings of base ring group so, that is " metal bottom seat ring and insulator foot circle ", will closely link together inevitably.In this case, may produce unsettled compression fit between insulation board and base ring, therefore, the insulation board of final microphone device is uneven on " rear cavity that the base ring group forms ", understands to the left or the right side inclination.The result is the depth of parallelism of having destroyed insulation board, and reduces the performance and the productivity ratio of final microphone inevitably.
In addition, as mentioned above, interconnect if form the base ring of base ring group, the inner space of the rear cavity that is formed by the base ring group may closure.Therefore, the pressure in the inner space of rear cavity can not with the surrounding air balance.Therefore, the frequency characteristic of final microphone device can be subjected to serious destruction.
For with microphone as one independently assembly unit assemble, as previously mentioned, operation such as " insulation board and base ring group are installed to operation in the device by interference fit " and " insert insulation board/base ring device between PCB and oscillating plate, and with pack into successively operation in the container of PCB, insulation board/base ring device and oscillating plate " and so on will be carried out separately.In this case, assembly line is divided into two lines inevitably.Therefore, required operation number will increase, thereby seriously reduce productivity ratio.
Summary of the invention
Target of the present invention is that an insulation board and base ring and other structure are installed together, form a complete microphone device, therefore, get rid of traditional compression fit that " insulation board and base ring " is installed from the overall assembly line of microphone, thereby prevent contingent in the process of compression fit " distortion of insulation board " or " damage of insulation board and base ring ".
Another target of the present invention is contingent in the process of the compression fit of carrying out in advance by preventing " distortion of insulation board " or " damage of insulation board and base ring " and by making " slit that forms between oscillating plate and the insulation board " parallel, thereby can make final ultra-thin type capacity microphone keep high-performance and high production rate.
Another target of the present invention is between two base rings, for example, between metal bottom seat ring and the insulator foot circle, form the slit of a definite size, when insulation board and base ring are in independently single state, link together with other structure, thereby prevent because the insulation board depth of parallelism variation of combining closely and being produced of base ring, therefore go up in " rear cavity that the base ring group forms " and can keep the height of insulation board parallel, and between the inner space of rear cavity and external environment the stable current path of formation.
Another target of the present invention is parallel and form stable current path between the inner space of rear cavity and external environment by go up the height that keeps insulation board in " base ring group form rear cavity ", improves the frequency characteristic and the productivity ratio of final ultra-thin type capacity microphone.
Another target of the present invention is, by assembly technology with two operations of traditional comprising " compression fit technology " and " technology of packing into ", unification is an assembly technology that the single operation of each parts is installed successively, thereby the assembly line of ultrathin microphone is integrated into a line, has so greatly improved the productivity ratio of final ultra-thin type capacity microphone.
By the reference accompanying drawing preferred embodiment of the present invention is described, will be more clear to target of the present invention and characteristic.
In order to realize target above-mentioned, the invention provides a kind of method of assembling ultra-thin type capacity microphone, be included in the operation that oscillating plate is installed on the container floor; Shading ring is installed on described oscillating plate, second base ring is installed so that the contacted operation of inwall of it and described container then on shading ring; On described oscillating plate, form the operation of determining the slit at the inside of described second base ring fitting insulating panels so that by described shading ring; On the described insulation board first base ring is being installed so that on described second base ring, form the operation of determining the slit, and the operation that PCB is installed on described first base ring.
Except the method for assembling ultra-thin type capacity microphone according to the present invention, according to the present invention, comprise that the ultra-thin type capacity microphone device of a container, an oscillating plate, insulation board, first base ring, second base ring and a PCB will be set forth hereinafter.Be different from traditional situation, in this case, between first and second base rings, form the slit of a definite size.
The accompanying drawing summary
Fig. 1 illustrates the assembling process according to a kind of ultra-thin type capacity microphone device of the present invention.
Fig. 2 is the constitutional diagram according to a kind of ultra-thin type capacity microphone device of the present invention.
Fig. 3 is the enlarged drawing according to second base ring of a kind of ultra-thin type capacity microphone device of the present invention.
Embodiment
Now will be in detail with reference to the preferred structure and the assembly method thereof of ultra-thin type capacity microphone device among the present invention, these illustrate in the accompanying drawings.
As shown in Figure 1, ultra-thin type capacity microphone device of the present invention (10) comprising: the hydrostatic column (1) with combination of a series of sound wave inlets and oscillating plate device (11), a shading ring (4), second base ring (7), an insulation board (5), first base ring (6) and a PCB (9), these all are placed in the described container (1) and the inner space of described container (1) of packing into successively.In this case, oscillating plate device (11) is made of the assembly of a polar ring and an oscillating plate.
When these elements are packed the inner space of described container (1) into, at first, an oscillating plate device (11) is installed in the bottom of described container (1).
Then, with a shading ring (4) be installed in described oscillating plate device (11) around, subsequently, with second base ring (7) be installed in described shading ring (4) around, therefore second base ring (7) contacts with the inwall of described container (1).
In the present invention, in second base ring (7), a circular insulating board (5) is installed in subsequently shading ring (4) around.Thereby, between described insulation board (5) and described oscillating plate (3), keep the slit of a definite size by described shading ring (4).
When passing through said process, when described oscillating plate device (11), described shading ring (4), described second base ring (7) and described insulation board (5) are all packed the inside of described container (1) into, in described second base ring (7), first base ring (6) is installed in described insulation board (5) around.Herein, as shown in Figure 1, because the diameter of described second base ring (7) is bigger than the diameter of described first base ring (6), if with described first base ring (6) be installed in described insulation board around and be placed on the inside of described second base ring (7), will produce the slit of determining size naturally.
After this, PCB (9) is installed in described first base ring (6) around.Then, the limit of described container (1) is crooked to seal the inner space of described container (1) towards described PCB (9).As a result, ultra-thin type capacity microphone device of the present invention has just been finished.
As previously explained, in the present invention, the discrete component of ultra-thin type capacity microphone, promptly, described oscillating plate device (11), described shading ring (4), described second base ring (7), described insulation board (5), described first base ring (6) and described PCB (9) install under separate state successively, form a final ultra-thin type capacity microphone device (10).Do not adopt this installation method in the former technology.
In traditional microphone, the process that ultra-thin type capacity microphone is installed comprises two operations, first operation is " insulation board and base ring group are installed to operation in the device by interference fit ", second operation is " insert insulation board/base ring device between PCB and oscillating plate and with pack into successively operation in the container of PCB, insulation board/base ring device and oscillating plate ".
In this traditional method, because a series of compression fit technology of " insulation board and base ring group " is installed, " insulation board " deforms or is damaged with " junction that base ring is connected with insulation board ".Therefore, can not the strict guarantee oscillating plate and the depth of parallelism of insulation board, therefore can produce serious problem, as the inhomogeneous depth of parallelism in slit between oscillating plate and the insulation board.Simultaneously, because total technological process is divided into " interference fit technology " and " technology of packing into ", the productivity ratio and the quality of final ultra-thin type capacity microphone will be reduced significantly.
On the contrary, according to the present invention, because the installation process of ultra-thin type capacity microphone is unified into " one single independent component being installed: an oscillating plate (11); a shading ring (4); second base ring (7); an insulation board (5), the technology of first base ring (6) and a PCB (9) ", insulation board (5) is not easy to produce any deformation and failure under compression fit.As a result, final ultra-thin type capacity microphone (10) has the very high slit of the depth of parallelism on certain plane, and therefore, the productivity ratio and the quality of described ultra-thin type capacity microphone are effectively improved.
As shown in Figure 2, according to the present invention, ultra-thin type capacity microphone (10) by aforementioned technology assembling has this structure, one of them oscillating plate device (11), a shading ring (4), second base ring (7), an insulation board (5), first base ring (a 6) and PCB (9) etc. are packed into successively and are had in the cylinder shape metal container (1) of a lot of sound wave inlets.
In this case, between described oscillating plate (3) and described insulation board (5), form the slit G1 that determines size by described shading ring (4), and described slit G1 is placed on sound wave to be passed through on the mobile main propagation path of described sound wave inlet (1a), and therefore the overall performance to ultra-thin type capacity microphone has very big influence.Certainly, with respect to traditional electrostatic microphone, because slit G1 is not subjected to the influence of compression fit process, electrostatic microphone according to the present invention can keep the better depth of parallelism than traditional electrostatic microphone.Herein, described oscillating plate (3) and described insulation board (5) are separated from each other installation with respect to slit G1, form capacitance type structure.
Herein, described container (1) is made by aluminium (Al), and polar ring (2) is made by the copper sheet of nickel plating (Ni), and shading ring (4) is made by nearly 35 microns～45 microns PET (Polyetyleneterephtalate) film.
Simultaneously, as shown in Figure 2, oscillating plate (3) has this structure, wherein has about 2.5 microns～3.5 microns gold (Au) or nickel (Ni) coating on PET film (3a).The described insulation board (5) that is separated from each other placement by described slit G1 and described oscillating plate (3) has this structure, wherein FEP (PEP) thin layer (5a) and gold (Au) or nickel (Ni) coating (5b) are positioned at the surface of copper sheet (5c), and another gold (Au) or nickel (Ni) coating (5d) are positioned at the another side of copper sheet (5c).
First base ring (6) is supporting insulation board (5), and is connected with electric means with PCB (9).Second base ring (7) is twining first base ring (6) and is contacting with the inwall of container (1).Herein, first base ring (6) is made by the copper sheet that contains gold, and second base ring (7) is made by the glass container that contains plastic material.
When the FET that packed into (field-effect transistor) (8), capacitor etc., also be included in described PCB with PCB (9) that first base ring (6) is connected with electric means and go up the formed rear cavity of first base ring (6) (9a) is installed.The rear cavity (9a) that is installed on the major avenues of approach of sound wave in the sound wave inlet (1a) by container (1) has very big influence to the overall performance of ultrathin microphone (10).
As previously mentioned, the compression fit technology that is different from traditional complexity, according to the present invention, ultra-thin type capacity microphone is only installed by carrying out following technology successively, " technology of second base ring (7) is installed " at the circumference of shading ring (4), " in the technology of the circumference fitting insulating panels (5) of the inherent shading ring of second base ring (7) (4) ", " technology of around the inherent insulation board of second base ring (7) (5), diameter first base ring (6) littler than second base ring (7) being installed." therefore, after finishing these mounting processs, as shown in Figure 2, between first base ring (6) and second base ring (7), formed slit G2.
Because in this case, do not form slit G2 if there is the compression fit technology of base ring (6,7) separately, the oscillating plate (3) that is supported by base ring (6,7), insulation board (5) etc. just are not subjected to the influence of interference fit technology.Therefore, can guarantee the depth of parallelism of certain level.In this case, as shown in Figure 2, the insulation board (5) that forms final microphone device (10) can keep level on rear cavity (9a).Therefore, frequency characteristic and the productivity ratio according to ultra-thin type capacity microphone of the present invention (10) can be greatly improved.
Simultaneously, when forming slit G2 as previously mentioned, the air in the rear cavity (9a) outwards flows apace by current path shown in Figure 2.Therefore, air in the rear cavity (9a) and outside air keep a stable correspondence.Thereby final ultra-thin type capacity microphone (10) according to the present invention can have good frequency characteristic on certain level.
As shown in Figure 3, provide the air discharge duct (7a) of some (for example, 3) on the limit of second base ring (7), air discharge duct is to container (1) closure.Because described air discharge duct (7a) forms other exhaust channel with described slit G2, this exhaust channel extends to the slit of air discharge duct (7a) and the inlet (1a) of sound wave from " inside of rear cavity ", when these air discharge ducts were provided, the air in the rear cavity (9a) can be discharged to the external world at an easy rate.
In ultra-thin type capacity microphone device according to the present invention (10), if certain sound wave, for example, user's sound enters from the sound wave of container (1) inlet (1a), and under the effect of sound wave, oscillating plate (3) is with certain speed vibration.
As previously mentioned, if oscillating plate (3) begins vibration, because vibration, the slit G1 between oscillating plate (3) and the insulation board (5) changes with certain speed.Then, according to the variation of slit G1, the electric capacity between oscillating plate (3) and the insulation board (5) also changes.Thereby corresponding to sound wave, the electromotive force of insulation board (5) promptly changes.
Then, when the changing value of the electromotive force of foregoing insulation board (5) is delivered to FET (8) among the PCB (9) by first base ring (6), will amplifies currency and export to the external world according to the changing value FET (8) of electromotive force.As a result, just realized intrinsic function according to ultra-thin type capacity microphone device of the present invention (10): will convert the signal of telecommunication to and make it enhancing by the sound wave of sound wave inlet input.Industrial applicability
As explain in detail the front, can be integrated into the process of the independently individual installation oscillating plate of conduct device, shading ring, second base ring, insulation board, first base ring and PCB according to the assembling process of ultra-thin type capacity microphone of the present invention.
According to the present invention, insulation board and base ring are not easy to deform or be damaged in compression fit technology.Therefore, oscillating plate, insulation board etc. can the strict guarantee depth of parallelisms.Therefore, ultra-thin type capacity microphone device according to the present invention can improve the productivity ratio and the quality of certain level.
Simultaneously, in the present invention, insulation board and base ring independently are being assembled together with other structure under the single status, thereby are not having " assembly technology of compression fit " to form according to final ultra-thin type capacity microphone device of the present invention down.
According to embodiments of the invention, between first base ring and second base ring, can form a series of slits of the air that can discharge in the rear cavity naturally.Therefore, the air pressure in rear cavity and the outside air can be consistent.Therefore, ultra-thin type capacity microphone device according to the present invention can keep high-quality on certain level.
Claims (3)
1. ultra-thin type capacity microphone device comprises:
A hydrostatic column forms serial sound wave inlet on hydrostatic column;
Be installed in the disc oscillating plate in the described container, under the effect of the sound wave that enters by described sound wave inlet, oscillating plate produces vibration;
Be installed in the disc insulation board in the described container, insulation board and described oscillating plate keep certain slit;
Support first base ring of described insulation board;
When twining described first base ring and contacted second base ring of described internal tank; And
Be installed in the PCB in the described container, PCB has a series of electrical models, contacts and have a rear cavity that is formed by described first base ring and described insulation board in described slit with first base ring is electric, it is characterized in that:
Between described first base ring and described second base ring, form the slit of certain size.
2. according to the ultra-thin type capacity microphone device of claim 1, it is characterized in that also having a plurality of air discharge ducts to be installed on the edge of described second base ring towards described container.
3. method that ultra-thin type capacity microphone is installed comprises following operation:
Oscillating plate is installed in bottom surface at container;
On described oscillating plate, shading ring is installed, second base ring is installed then, thereby second base ring can be contacted the inwall of described container on described shading ring;
Fitting insulating panels in described second base ring, thus the slit of certain size on described oscillating plate, formed by shading ring;
First base ring is installed on described insulation board, thereby on second base ring, is formed the slit of certain size;
On described first base ring, PCB is installed; And
Seal the inside of described container.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020000075671A KR100349200B1 (en) | 2000-12-12 | 2000-12-12 | Ultra-thin type condenser microphone assembly and method for assembling the same |
| KR2000/75671 | 2000-12-12 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1480010A true CN1480010A (en) | 2004-03-03 |
Family
ID=19702992
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA018204961A Pending CN1480010A (en) | 2000-12-12 | 2001-12-11 | Ultra-thin type capacity microphone assembly and method for assembling the same |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP3869796B2 (en) |
| KR (1) | KR100349200B1 (en) |
| CN (1) | CN1480010A (en) |
| AU (1) | AU2002222743A1 (en) |
| WO (1) | WO2002049393A1 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1813490B (en) * | 2005-07-07 | 2012-08-22 | 宝星电子株式会社 | Package structure of silicon capacitor microphone and fabrication method thereof |
| CN101426170B (en) * | 2008-08-20 | 2013-01-09 | 瑞声声学科技(深圳)有限公司 | Microphone manufacturing method |
| CN104066022A (en) * | 2014-06-24 | 2014-09-24 | 中山市天键电声有限公司 | Novel single-directivity microphone |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100523029B1 (en) * | 2002-06-14 | 2005-10-24 | 주식회사 씨에스티 | Ultra-small-size/ultra-thin type cardioid condenser microphone assembly and singleness type phase delay device assembled the same |
| KR100544285B1 (en) * | 2002-10-12 | 2006-01-23 | 주식회사 비에스이 | Apparatus for assembling condenser microphone |
| KR100615391B1 (en) * | 2005-02-21 | 2006-08-25 | 주식회사 비에스이 | Electret condenser microphone fabrication method |
| KR100740459B1 (en) * | 2005-03-18 | 2007-07-18 | 주식회사 비에스이 | Curling Method For Condenser Microphone |
| KR100675510B1 (en) * | 2005-04-25 | 2007-01-30 | 주식회사 비에스이 | Dual base and electret condenser microphone using the same |
| KR100675505B1 (en) * | 2005-04-29 | 2007-01-30 | 주식회사 비에스이 | Case for condenser microphone |
| KR100608461B1 (en) * | 2005-05-23 | 2006-08-02 | 주식회사 비에스이 | Condenser microphone for air flow and method of making the same |
| CN111711904B (en) * | 2020-06-24 | 2021-06-25 | 歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
| CN111711902B (en) * | 2020-06-24 | 2021-08-06 | 歌尔微电子有限公司 | Miniature microphone dust keeper and MEMS microphone |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6352600A (en) * | 1986-08-22 | 1988-03-05 | Sony Corp | Electroacoustic transducer |
| JPH02149199A (en) * | 1988-11-30 | 1990-06-07 | Matsushita Electric Ind Co Ltd | Electlet condenser microphone |
| JPH04257200A (en) * | 1991-02-12 | 1992-09-11 | Matsushita Electric Ind Co Ltd | Electret capacitor microphone |
-
2000
- 2000-12-12 KR KR1020000075671A patent/KR100349200B1/en not_active IP Right Cessation
-
2001
- 2001-12-11 JP JP2002550754A patent/JP3869796B2/en not_active Expired - Fee Related
- 2001-12-11 CN CNA018204961A patent/CN1480010A/en active Pending
- 2001-12-11 WO PCT/KR2001/002141 patent/WO2002049393A1/en active Application Filing
- 2001-12-11 AU AU2002222743A patent/AU2002222743A1/en not_active Abandoned
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1813490B (en) * | 2005-07-07 | 2012-08-22 | 宝星电子株式会社 | Package structure of silicon capacitor microphone and fabrication method thereof |
| CN101426170B (en) * | 2008-08-20 | 2013-01-09 | 瑞声声学科技(深圳)有限公司 | Microphone manufacturing method |
| CN104066022A (en) * | 2014-06-24 | 2014-09-24 | 中山市天键电声有限公司 | Novel single-directivity microphone |
| CN104066022B (en) * | 2014-06-24 | 2018-05-18 | 中山市天键电声有限公司 | A kind of new uni-directional microphone |
Also Published As
| Publication number | Publication date |
|---|---|
| KR100349200B1 (en) | 2002-08-21 |
| JP3869796B2 (en) | 2007-01-17 |
| AU2002222743A1 (en) | 2002-06-24 |
| JP2004516725A (en) | 2004-06-03 |
| KR20020046343A (en) | 2002-06-21 |
| WO2002049393A1 (en) | 2002-06-20 |
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