CN1479109A - Method of judging continuous failure occuring position using wave shape - Google Patents
Method of judging continuous failure occuring position using wave shape Download PDFInfo
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- CN1479109A CN1479109A CNA021415013A CN02141501A CN1479109A CN 1479109 A CN1479109 A CN 1479109A CN A021415013 A CNA021415013 A CN A021415013A CN 02141501 A CN02141501 A CN 02141501A CN 1479109 A CN1479109 A CN 1479109A
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Abstract
A method for judging the connection failure position in module by waveform includes such steps as using time-domain reflection measurer to measure the reflected waveform of reference module, recording and storing it, measuring the reflected waveform of the module to be tested, and comparing both resultant waveforms with each other.
Description
Technical field
The present invention relates to a kind of method of utilizing waveform judge to connect the inefficacy occurrence positions, refer to a kind of physical arrangement waveform with to be measured especially, be compared to the physical arrangement sample waveform of sample, promptly can judge the method that connects invalid position.
Background technology
At present, along with the lifting of people's quality of the life and the progress of science and technology, feasible science and technology also is not used person's the development of demand thereupon, fast development as electronic product, make manufacturing technology improve and the product price reduction, the relative people that make more increase the dependency degree of electronic product, for example desk-top computer and mobile computer etc. are used in the life at large, and electronic product is to satisfy short and small frivolous and demand that processing speed is fast, so constantly promote the density of the lead of its inner electronic package, the volume of electronic package reduced; Yet promote the degree of difficulty that wire density also relatively increases processing procedure, can become very important problem by the complete assembly that is passed to guarantee signal so increase process rate.
When several assemblies connect the system generation signal problem of transmission of composition, need to analyze and judge the failed areas of inner electronic package, in order to help the producer to strengthen production procedure control, the mode of its analysis has two kinds usually, for electronic package being done non-destructive failure analysis and destructive structure analysis; Wherein the non-destructive failure analysis is to adopt visual testing and X-ray analysis method; Yet visual testing is generally the observation electronic package outward appearance of summary, and understanding electronic package that can't be very correct links invalid position, also can't understand the connection invalid position of electronic packaging component inside, so utilize X-ray to do the non-destructive failure analysis in addition; Though X-ray can do local trickle analysis, can't definitely understand electronic package usually and link invalid position, cause and can't do further in-depth analysis this electronic package.
Destructive structure analysis then will destroy the structure of electronic package in addition, with the check lead whether blemishes is arranged.Though the method can directly reflect the situation of the structural region of destruction, also may destroy previous well-formed zone, and cause the invalid position misjudgment, and be difficult for destroying exactly predetermined zone; When in addition destruction work being done in a plurality of uncertain regions, easily cause wasting many times and resource, so be difficult to provide the producer to understand processing procedure and production problem.
Summary of the invention
Fundamental purpose of the present invention is to provide a kind of waveform that utilizes to judge the method that connects the inefficacy occurrence positions in order to overcome above-mentioned the deficiencies in the prior art part; This method can be carried out assembly and connect failure analysis under nondestructive situation, and judges the connection invalid position according to this.
Secondary objective of the present invention is judge to connect the method for inefficacy occurrence positions in order to provide a kind of with waveform, both can do analysis to the system that several assemblies connect composition, in order to understanding the problem that connects between system's inner assembly, and judges and connects the inefficacy occurrence positions.
Another object of the present invention is judge to connect the method for inefficacy occurrence positions in order to provide a kind of with waveform, both can check single component internal connectivity problem, and can judge the connection invalid position.
Purpose of the present invention can realize by following measure:
According to aforementioned goal of the invention, the present invention is a kind of method that connects the inefficacy occurrence positions of judging with waveform, this method is to utilize the waveform of otdr measurement device (TDR) can directly reflect the physical structural characteristic of interconnection, and set up the reflection configuration model of sample, measure to be measured reflection configuration again, and compare with sample waveform model, judge assembly according to this and connect the inefficacy occurrence positions.That is:
A kind of method with waveform judgement connection inefficacy occurrence positions, its step comprises:
Signal is imported sample, and receive the reflection wave that stores this sample, in order to set up sample reflection wave model;
Signal is imported to be measured and write down its reflection wave signal; And
With the reflection wave model comparison of this reflection wave of to be measured and this sample, can judge connection inefficacy occurrence positions.
The square-wave signal of above-mentioned signal for rising or descending and be exceedingly fast.
Be the square wave of 35ps-200ps the rising/fall time of the square-wave signal that above-mentioned rising or decline are exceedingly fast.
The reflection signal of above-mentioned sample stores with graphics mode.
Above-mentioned signal transfers to this sample by the otdr measurement device.
Above-mentioned signal transfers to this to be measured by the otdr measurement device.
It is to export this sample to signal and this position of to be measured is identical that above-mentioned signal inputs to this sample and this position of to be measured.
Purpose of the present invention also can realize by following measure:
A kind of method with waveform judgement connection inefficacy occurrence positions, its step comprises:
Utilize the otdr measurement device to send to rise or descend the square-wave signal that is exceedingly fast to input to sample, and receive the reflection wave of this sample and stored, in order to set up sample reflection wave model in same position;
The otdr measurement device is sent the square-wave signal that is exceedingly fast that rises or descend input to be measured, and receive to be measured reflection configuration signal, and write down this reflection configuration signal in same position; And
With the comparison of the reflection configuration signal of this reflection wave of to be measured and this sample, utilize the waveform of this reflection wave of to be measured flex point to occur and return the distance or the relative distance of time corresponding physical structure accordingly, can judge and connect the inefficacy occurrence positions.
Above-mentioned signal inputs to this sample and this position of to be measured exports this sample to signal and this position of to be measured is identical.
Be the square wave of 35-200ps the rising/fall time of the square-wave signal that above-mentioned rising or decline are exceedingly fast.
In addition: the physical significance of the rising of the square wave that TDR sends/representative fall time is a resolution, and the time, shorter expression resolution was higher, and the time, longer expression resolution was lower.Need to use higher resolution as being 50-100ps so when measuring packaging part (package) problem, find the problem of reduced size because of need; Finding the problem of large-size because of need when measuring printed-wiring board (PWB) (PCB) problem can use lower resolution as being 200ps.
The invention has the advantages that: the present invention utilizes the waveform of otdr measurement device can directly reflect the physical structural characteristic of interconnection, the time that is its reflection wave is corresponding with the distance of the physical arrangement of interconnection, when physical component does not communicate, the flex point that the waveform of reflection wave promptly rises herein or descends and dispersing; Utilize this principle to carry out the non-destructive failure analysis to be measured, can under nondestructive situation, understand the situation of several assemblies that are connected rapidly, and can be by the clear origination point of judging connectivity problem of waveform, carry out single component or partial analysis again, so can judge and connect the tram of losing efficacy and taking place, and analyze the connection invalid position of package assembling inside easily, institute is so that provide the producer to understand processing procedure and production problem, follows the track of the overturned cart avoiding; And improved analysis efficiency.
Description of drawings
Fig. 1 is an otdr measurement device arrangement plan of the present invention;
Fig. 2 is the first kenel sample side view of the present invention;
Fig. 3 is the second kenel sample side view of the present invention;
Fig. 4 is the 3rd a kenel sample side view of the present invention;
Fig. 5 is first to be measured side view of the present invention;
Fig. 6 is second to be measured side view of the present invention;
Fig. 7 is the otdr measurement device reflectogram of systematic analysis of the present invention;
Fig. 8 is the 4th a kenel sample side view of the present invention;
Fig. 9 is the 5th a kenel sample side view of the present invention;
Figure 10 is the 3rd a to be measured side view of the present invention;
Figure 11 is the otdr measurement device reflectogram that single component of the present invention is analyzed;
Figure 12 is the 6th a kenel sample side view of the present invention;
Figure 13 is the 4th a to be measured side view of the present invention;
Figure 14 is the reflectogram that check of the present invention connects the otdr measurement device of lead.
Embodiment
The present invention also will be described in further detail embodiment in conjunction with the accompanying drawings:
Preferred embodiment
The present invention is a kind of method that connects the inefficacy occurrence positions of judging with waveform, see also shown in Figure 1, be to utilize the waveform of otdr measurement device can directly react the physical structural characteristic of interconnection, and set up this reflection configuration model of various aspect, utilize the otdr measurement device to receive to be measured reflection configuration again, and compare with the reflection wave model of kenel sample, can judge assembly and connect the inefficacy occurrence positions.
Therefore, can do analysis, in order to understanding intrasystem assembly connectivity problem, and judge and connect the inefficacy occurrence positions the system that several assemblies connect.As shown in Figure 2, printed circuit board (PCB) 10 is considered as the first kenel sample 20; Shown in Figure 3, when being welded on printed circuit board (PCB) 10, tin ball 11 is considered as the second kenel sample 21; Shown in Figure 4, substrate 12, tin ball 11 and printed circuit board (PCB) 10 are welded to connect in regular turn and are considered as the 3rd kenel sample 22; Utilize the signal generator 2 of otdr measurement device to send extremely short square-wave signal of rise or fall time as 120ps, and input on the lead of printed circuit board (PCB) 10 of the first kenel sample 20, this moment the otdr measurement device oscillograph 1 receive the first kenel sample 20 simultaneously at the signal input position reflection wave 10a with reference to Fig. 7, and its record stored; And measure the reflection configuration of the second kenel sample 21 and the 3rd kenel sample 22 with identical method, wherein the reflection wave 10a of the first kenel sample reflection wave 11a that is set at pink colo(u)r streak, the second kenel sample reflection wave 12a that is set at green line and the 3rd kenel sample is set at blue line; Measure to be measured reflection wave and record as shown in Figure 7 according to above-mentioned steps more in addition, it records first to be measured 23 the light blue colo(u)r streak of reflection wave 13a, can find the pink colo(u)r streak of reflection wave 10a of 20 in the first kenel sample and first to be measured 23 the light blue line overlap of reflection wave 13a this moment, first to be measured 23 reflection wave that has only printed circuit board (PCB) 10 as can be known so promptly, so can judge first to be measured 23 10 of tin ball 11 and printed circuit board (PCB)s and have being connected inefficacy generation, this also is fit to first to be measured the 23 tin ball 11 with reference to Fig. 5 and is not welded on the printed circuit board (PCB) 10; In addition, measure second to be measured 24 reference as Fig. 6, write down its reflection configuration 14a of second to be measured 24 simultaneously in Fig. 7, the reflection wave 14a purple line that can find the reflection wave 11a green line of the second kenel sample 21 and second to be measured 24 this moment is overlapping, second to be measured 24 reflection wave that does not have substrate 12 as can be known whereby, can judge whereby that 12 of tin ball 11 and substrates have being connected lost efficacy to take place, second to be measured the 24 tin ball 11 as shown in Figure 6 that so also coincide is not welded on the substrate 12, can be overlapped in the reflection wave 12a black line of the 3rd kenel sample 22 of Fig. 7 certified products in addition by to be measured reflection configuration (figure does not show), can judge tin ball 11 in view of the above and be welded on 12 of printed circuit board (PCB) 10 and substrates, so can judge by reflection configuration whether to be measured intrasystem inter-module connects inefficacy, and can utilize the waveform of this reflection wave of to be measured flex point to occur and the distance that returns time corresponding physical structure accordingly judges that further it connects the inefficacy occurrence positions.
Wherein, see also as Fig. 7, can recognize further that the longitudinal axis is to be magnitude of voltage voltage, transverse axis is to be the Times of chronomere, and as can be known by the reflection configuration 12a of reflection wave 10a to the three kenels of first kenel, the reflection wave 10a of the first kenel sample 20 is that early start is significantly climb and risen to peak, and climb at this first mark 13 a little is set, the reflection configuration 12a of the 3rd kenel sample 22 begins significantly to climb to rise to peak the latest, and climb at this 3rd mark 15 a little is set, and the beginning of the reflection configuration 11a of the second kenel sample 21 is significantly climb and is risen to the highest time point second mark 14 is set, this second mark 14 is between between the time point of first mark 13 and the 3rd mark 15, the 3rd kenel sample 22 is to be printed circuit board (PCB) 10 as can be known in view of the above, tin ball 11 and substrate 12 engage in regular turn, so the time of reflection wave passback also adds up in regular turn, and the long reflection wave passback time is arranged.The first kenel sample 20 has only printed circuit board (PCB) 10, so also have only the reflection wave 10a signal passback time of printed circuit board (PCB) 10, and the signal of each kenel sample output implantation site is corresponding, so the passback time of the same components of each kenel sample is also identical, so that the reflection wave 11a of the reflection wave 10a of the first kenel sample 20 and the second kenel sample 21 all has reflection wave 12a with the 3rd kenel sample 22 part that is superimposed, when to be measured reflection configuration is shown in Fig. 7, the time point that can begin significantly upwards to climb by to be measured reflection wave passback time and this reflection wave is corresponding to the reflection wave model of kenel sample, can judge and connect the inefficacy occurrence positions, and can be by mark 13,14,15 setting is judged to connect the inefficacy occurrence positions apace.
Another embodiment is the connection state that can check in the single component, package assembling for example, and can utilize auxiliary clamp to be connected the tie point (figure does not show) of package assembling, be beneficial to the otdr measurement device and measure the reflection wave of its assembly, so can be with its reflection configuration record as in Figure 11, and connect the inefficacy occurrence positions so as to judging.The 5th sample kenel 26 that the blue line of reflection wave 15a that at first utilizes the otdr measurement device to measure and set up the substrate 12 of the 4th sample kenel 25 as shown in Figure 8 reaches as shown in Figure 9 is substrate 12, chip-covered boss 16 and chip 17 weld good reflection wave 16a green line such as Figure 11 in regular turn, other measures the 3rd to be measured 27 reflection wave 17a black line as shown in figure 10, and the 3rd to be measured 27 reflection wave 17a black line is compared to the reflection configuration 15a of sample, 16a, the beginning that both can find the 3rd to be measured 27 reflection configuration 17a is significantly climb and is risen to that the highest time point is positioned at the reflection configuration 15a of the 4th kenel sample 25 and significantly the climbing of reflection configuration 16a of the 5th kenel sample 26 rises between the highest time point, so can observe out the 3rd to be measured 27 reflection wave that substrate 12 is arranged as shown in figure 10 by the time that reflection wave is back to the otdr measurement device, but the reflection wave of chipless 17, both can having judged the 3rd in view of the above, to hold the connection invalid position of surveying part 27 be to be chip-covered boss 16, and coincide and be not welded on the chip 17 at the 3rd to be measured 27 chip-covered boss 16 as shown in figure 10.
In the ordinary course of things, as long as can judge to first and second measurement of to be measured its inefficacy is to occur on printed circuit board (PCB) 10, tin ball 11 and substrate 12 what person; As long as judging its inefficacy is to occur on substrate 12, chip-covered boss 16 and chip 17 what person, might not find out the detailed distance and position of its definite physical arrangement to the 3rd to be measured measurement.
Certainly, the further characteristics of method of the present invention are to find out the particular location that lost efficacy and take place.The principle of specifically finding out invalid position is: utilize the waveform of to be measured reflection wave flex point to occur and return the distance of time corresponding physical structure accordingly, can judge and connect the inefficacy occurrence positions.Its principle is: the signal and the reflection wave transmission speed thereon thereof that have been determined the otdr measurement device by the material characteristic of the structure of single component or a plurality of assemblies and dielectric layer, again according to the relative time that connects the passback of inefficacy nidus, it is the time that the reflection wave at flex point place is back to the otdr measurement device, this time is the twice of signal passing time to the physical arrangement of the nidus that lost efficacy in the reference data position of physical arrangement of otdr measurement device, calculates its physical arrangement relative distance with following formula then: the relative distance of the relative time/2 * transmission speed=inefficacy place physical arrangement of inefficacy place passback.Its concrete method is: " the reference data position of physical arrangement " of " relative time " or " relative distance " found out in the comparison by oscillogram, and this " reference data " to the transmission speed of this inefficacy place is unique, calculates " relative distance " with regard to available above-mentioned formula; Should " the reference data position of physical arrangement " may be the measured place wherein, also may be to leave the position that tin ball 11 enters substrate 12 among Fig. 7, it also may be the position that enters substrate 12 among Figure 11, or leave the position that substrate 12 enters chip-covered boss 16, mainly be according to the oscillogram of inefficacy place and sample oscillogram relatively after, how to choose the calculating that this " reference data position of physical arrangement " can help invalid position most.(2) at the physical arrangement of each the different transmission speed till inefficacy place from the measured place, utilize above-mentioned formula to calculate its relative distance respectively, totalling can draw the physical arrangement distance till inefficacy place from the measured place, to find out the location point that circuit disconnects.
In addition, can further check lead whether normal by the present invention, wherein send the normal wires 18 that square-wave signal that the rise or fall time is about 50ps inputs to the 6th kenel sample 28 as shown in figure 12 by the otdr measurement device, and receive and store the reflection configuration 19a blue line as shown in figure 14 of its 6th kenel sample 28, in order to set up the sample reflection wave model of normal wires 18; In addition, with reference to Figure 13, the 4th to be measured 29 lead 19 is measured reflection wave 20a red line such as Figure 14 of the 4th to be measured by the otdr measurement device, the blue line of not superimposed fully the reflection configuration 19a of the 4th to be measured 29 reflection wave 20a this moment in the 6th kenel sample 28, and the 4th to be measured 29 reflection wave 20a significantly upwards climbs ahead of time, promptly flex point appears in the waveform of this reflection wave of to be measured 29, can judge that in view of the above this 4th to be measured 29 is the leads 19 for fracture, and the shown in Figure 13 the 4th to be measured 29 the fracture lead 19 of also coincideing.Simultaneously flex point occurs and return the distance of time corresponding physical structure accordingly, can judge the occurrence positions of wire fracture according to the waveform of reflection wave.Its principle is: by the material of lead, and the difference of the geometric cross section shape of the material characteristic of the dielectric medium at lead place and lead, and the signal and the reflection wave transmission speed thereon thereof of otdr measurement device have been determined, again according to the relative time of wire fracture nidus passback, it is the time that the reflection wave at flex point place is back to the otdr measurement device, this time is the twice of signal passing time to the physical arrangement at wire fracture place in the measuring position of otdr measurement device, calculates its physical arrangement distance with following formula then: the distance of the physical arrangement of relative time/2 * transmission speed=wire fracture place to the measured place of wire fracture place passback.
According to the above, the method with waveform judgement connection inefficacy occurrence positions of the present invention may further comprise the steps:
A, utilize the otdr measurement device to send to rise or descend the square-wave signal that is exceedingly fast to input to sample, and receive the reflection wave of this sample and stored, in order to set up sample reflection wave model in same position;
B, the otdr measurement device is sent the square-wave signal that is exceedingly fast that rises or descend input to be measured, and receive to be measured reflection configuration signal, and write down this reflection configuration signal in same position; And
C, will this reflection wave of to be measured and the reflection configuration signal comparison of this sample, can judge and connect the inefficacy occurrence positions.
Only the above only is a preferable possible embodiments of the present invention, and non-so inflexible limit claim of the present invention so the equivalent structure that uses instructions of the present invention and icon content to do such as changes, all in like manner all within the scope of the present invention, is stated hereby.
Claims (10)
1, a kind of method with waveform judgement connection inefficacy occurrence positions, its step comprises:
Signal is imported sample, and receive the reflection wave that stores this sample, in order to set up sample reflection wave model;
Signal is imported to be measured and write down its reflection wave signal; And
With the reflection wave model comparison of this reflection wave of to be measured and this sample, can judge connection inefficacy occurrence positions.
2, the method with waveform judgement connection inefficacy occurrence positions as claimed in claim 1 is characterized in that the square-wave signal of described signal for rising or descending and be exceedingly fast.
3, the method with waveform judgement connection inefficacy occurrence positions as claimed in claim 2, be the square wave of 35ps-200ps the rising/fall time that it is characterized in that the square-wave signal that described rising or decline are exceedingly fast.
4, the method with waveform judgement connection inefficacy occurrence positions as claimed in claim 1 is characterized in that the reflection signal of described sample stores with graphics mode.
5, the method with waveform judgement connection inefficacy occurrence positions as claimed in claim 1 is characterized in that described signal transfers to this sample by the otdr measurement device.
6, the method with waveform judgement connection inefficacy occurrence positions as claimed in claim 1 is characterized in that described signal transfers to this to be measured by the otdr measurement device.
7, as claimed in claim 1ly judge to connect the method for inefficacy occurrence positions, it is characterized in that it is to export this sample to signal and this position of to be measured is identical that described signal inputs to this sample and this position of to be measured with waveform.
8, a kind of method with waveform judgement connection inefficacy occurrence positions, its step comprises:
Utilize the otdr measurement device to send to rise or descend the square-wave signal that is exceedingly fast to input to sample, and receive the reflection wave of this sample and stored, in order to set up sample reflection wave model in same position;
The otdr measurement device is sent the square-wave signal that is exceedingly fast that rises or descend input to be measured, and receive to be measured reflection configuration signal, and write down this reflection configuration signal in same position; And
With the comparison of the reflection configuration signal of this reflection wave of to be measured and this sample, utilize the waveform of this reflection wave of to be measured flex point to occur and return the distance or the relative distance of time corresponding physical structure accordingly, can judge and connect the inefficacy occurrence positions.
9, the method with waveform judgement connection inefficacy occurrence positions as claimed in claim 8 is characterized in that described signal inputs to this sample and this position of to be measured exports this sample to signal and this position of to be measured is identical.
10, the method with waveform judgement connection inefficacy occurrence positions as claimed in claim 8, be the square wave of 35-200ps the rising/fall time that it is characterized in that the square-wave signal that described rising or decline are exceedingly fast.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02141501.3A CN1275046C (en) | 2002-08-30 | 2002-08-30 | Method of judging continuous failure occuring position using wave shape |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN02141501.3A CN1275046C (en) | 2002-08-30 | 2002-08-30 | Method of judging continuous failure occuring position using wave shape |
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| Publication Number | Publication Date |
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| CN1479109A true CN1479109A (en) | 2004-03-03 |
| CN1275046C CN1275046C (en) | 2006-09-13 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN02141501.3A Expired - Lifetime CN1275046C (en) | 2002-08-30 | 2002-08-30 | Method of judging continuous failure occuring position using wave shape |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106353634A (en) * | 2016-10-17 | 2017-01-25 | 深圳市太赫兹科技创新研究院 | Terahertz time-domain reflecting system |
| CN110646679A (en) * | 2018-06-26 | 2020-01-03 | 深圳光峰科技股份有限公司 | Detection method and detection system for laser driving |
| CN114487788A (en) * | 2022-04-02 | 2022-05-13 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Failure positioning method of packaging device |
-
2002
- 2002-08-30 CN CN02141501.3A patent/CN1275046C/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106353634A (en) * | 2016-10-17 | 2017-01-25 | 深圳市太赫兹科技创新研究院 | Terahertz time-domain reflecting system |
| CN110646679A (en) * | 2018-06-26 | 2020-01-03 | 深圳光峰科技股份有限公司 | Detection method and detection system for laser driving |
| CN110646679B (en) * | 2018-06-26 | 2022-04-15 | 深圳光峰科技股份有限公司 | Detection method and detection system for laser driving |
| CN114487788A (en) * | 2022-04-02 | 2022-05-13 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Failure positioning method of packaging device |
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| Publication number | Publication date |
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| CN1275046C (en) | 2006-09-13 |
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