CN1477586A - Fingerprint identification sensor assembly using multilayer electrode and its mfg. method - Google Patents
Fingerprint identification sensor assembly using multilayer electrode and its mfg. method Download PDFInfo
- Publication number
- CN1477586A CN1477586A CNA021462453A CN02146245A CN1477586A CN 1477586 A CN1477586 A CN 1477586A CN A021462453 A CNA021462453 A CN A021462453A CN 02146245 A CN02146245 A CN 02146245A CN 1477586 A CN1477586 A CN 1477586A
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- China
- Prior art keywords
- end electrode
- fingerprint recognition
- illuminating part
- sensory package
- electrode
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000000034 method Methods 0.000 title claims description 11
- 229920000642 polymer Polymers 0.000 claims abstract description 40
- 238000004519 manufacturing process Methods 0.000 claims abstract description 12
- 230000001953 sensory effect Effects 0.000 claims description 35
- 239000000126 substance Substances 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 9
- 230000001939 inductive effect Effects 0.000 claims description 8
- 230000015572 biosynthetic process Effects 0.000 claims description 6
- 239000007767 bonding agent Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000004078 waterproofing Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims description 2
- 239000004411 aluminium Substances 0.000 claims description 2
- 229910052782 aluminium Inorganic materials 0.000 claims description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 229920000647 polyepoxide Polymers 0.000 claims description 2
- 229910052709 silver Inorganic materials 0.000 claims description 2
- 239000004332 silver Substances 0.000 claims description 2
- 239000002998 adhesive polymer Substances 0.000 claims 2
- 239000002245 particle Substances 0.000 claims 1
- 238000009413 insulation Methods 0.000 abstract 4
- 239000000758 substrate Substances 0.000 abstract 2
- 238000005755 formation reaction Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 239000004962 Polyamide-imide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000005283 ground state Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
- G06V10/12—Details of acquisition arrangements; Constructional details thereof
- G06V10/14—Optical characteristics of the device performing the acquisition or on the illumination arrangements
- G06V10/147—Details of sensors, e.g. sensor lenses
Landscapes
- Image Input (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
A fingerprint recognition sensor module using a multi layered electrode and a manufacturing method thereof are provided to make a thickness thin, and to make assemblage easy and lower price by reducing a number of components. The module comprises a transparent substrate(100), a transparent electrode layer(120) formed on an upper part of the transparent substrate, a light emitting part(130) installed to the upper part of the transparent electrode layer, a lower electrode(140), the first insulation polymer(150), and the upper electrode(160). The lower electrode is installed around the light emitting part with a constant interval. The first insulation polymer is installed to the upper part of the lower electrode, and a part of the first insulation polymer overlaps/covers an end of the light emitting part. The upper electrode is installed to the upper side of the first insulation polymer.
Description
Technical field
The present invention relates to fingerprint recognition sensory package and manufacture method thereof, relate in particular to fingerprint recognition sensory package and the manufacture method thereof of using multi-layered electrode.
Background technology
In the past, gave the protection function that uses fingerprint recognition, and often required it to have extremely thin fingerprint Identification sensor in order to give portable information communication apparatus such as mobile phone or portable computer.
Fingerprint recognition sensory package in the past is provided with transparent 12 in the top of bottom fixed frame 10 as shown in Figure 5, forms touch luminous element 14 in described transparent 12 top.Described touch luminous element 14 is made of transparency carrier 14a, transparency electrode 14b and illuminating part 14c as shown in Figure 6.And described illuminating part 14c is shaped as rectangle.
Both sides in described touch luminous element 14 tops after the formation lower end electrode 20, form electro-insulating rubber 22 in the top of described lower end electrode 20, form upper end electrode 30 in the top of electro-insulating rubber 22.
In the top of described upper end electrode 30, top fixed frame 40 is set after, it is fastening to utilize set bolt 50 that described top fixed frame 40 is connected with bottom fixed frame 10, forms assembly.
Summary of the invention
Above-mentioned fingerprint recognition sensory package in the past, because component parts is many and thick, the problem of being brought is not only and is not suitable for carrying or miniaturization, and because the part of described fingerprint recognition sensory package is many, the assembling trouble causes cost higher.
To the objective of the invention is in order addressing the above problem, the fingerprint recognition sensory package and the manufacture method thereof that can make less thick to be provided.
Another object of the present invention provides fingerprint recognition sensory package and the manufacture method thereof that reduces structure member, reduces cost when assembling easily.
In order to achieve the above object, the fingerprint recognition sensory package that the present invention relates to is characterised in that and comprises: transparency carrier; The transparent electrode layer that is provided with in this transparency carrier top; The illuminating part that is provided with in this transparent electrode layer top; The lower end electrode that in the certain on every side interval of this illuminating part, is provided with; The insulating polymer of a part that is provided with in this lower end electrode top and the overlapping covering of front end of this illuminating part and the upper end electrode that is provided with in this insulating polymer top.
The manufacture method of the fingerprint recognition sensory package that the present invention relates in order to achieve the above object, is characterised in that and comprises: the stage that forms the transparency carrier of transparency electrode on the surface; After this transparency electrode top forms illuminating part, around illuminating part, separate certain interval, form the stage of lower end electrode; For preventing to cause upper end electrode and the illuminating part short circuit that is arranged on the lower end electrode top, form stage of insulating polymer of the overlapping covering of front end of a part of upper end electrode and illuminating part; The stage of upper end electrode is set in the top of described insulating polymer.
Described illuminating part comprises in the formation of the top of transparent electrode layer: the stage that forms the fluorescence coating that produces light image; Form the stage of inductive layer in the top of described fluorescence coating; Form the stage of water proofing property film in the top of inductive layer.
Brief Description Of Drawings
Fig. 1 is the sectional view of the fingerprint recognition sensory package of embodiments of the invention.
Fig. 2 is the sectional view that is applied to the illuminating part of embodiments of the invention.
Fig. 3 is the sectional view according to the fingerprint recognition sensory package of other embodiments of the invention.
It shown in Fig. 4 a to Fig. 4 c the synoptic diagram of fingerprint recognition sensory package significant points of the present invention.
Fig. 5 is the concise and to the point sectional view of fingerprint recognition sensory package in the past.
Fig. 6 is the synoptic diagram of fingerprint Identification sensor illuminating part in the past.
Embodiment
Bottom will describe the fingerprint recognition sensory package and the manufacture method thereof of the embodiment of the invention in detail with reference to the accompanying drawings.
As shown in Figure 1 and Figure 2, the formation of the fingerprint recognition sensory package of the embodiment of the invention comprises: first insulating polymer 150 of the overlapping covering of front end of transparency carrier 100, the transparent electrode layer 120 that is provided with in these transparency carrier 100 tops, the illuminating part 130 that is provided with in these transparent electrode layer 120 tops, the lower end electrode 140 that separates certain interval setting around this illuminating part 130, a part that is provided with in the top of this lower end electrode 140 and illuminating part 130, the upper end electrode 160 that is provided with in the top of this first insulating polymer 150.
Described transparent electrode layer 120 is formed by indium tin oxide (ITO:lndium Tin Oxide).
Described illuminating part 130 is to be made of fluorescence coating 132, inductive layer 134 and water barrier 136 as shown in Figure 2.
Described fluorescence coating 132 is made of fluorophor powder and bonding agent.
Described inductive layer 134 is to be made of dielectric medium powder and bonding agent.Can make illuminating part increase electric capacity (Capacitance), the increase of luminosity is directly proportional with the increase of electric capacity.Water barrier 136 is made of the water proofing property polymkeric substance, and its effect is to make the surface of sensor not speckle with moisture content or polluter.
On the other hand, described first insulating polymer 150 is by insulativity fine-powder and bonding polymkeric substance (binding polymer) formations such as BaTio3.
And described lower end electrode 140 forms with same form with upper end electrode 160.Described lower end electrode 140 constitutes by silver conductive metal powder such as (Ag) is mixed the back with polymer adhesive.And described lower end electrode 140 also can use aluminium (Al) or copper metal films such as (Cu) to form.
The manufacture method of the fingerprint recognition sensory package that the present invention relates to is characterised in that, comprising: the stage that transparency carrier 100 is provided; Behind the upper surface covering transparent electrode of described transparency carrier 100, form the stage of transparent electrode layer 120; After the top of described transparent electrode layer 120 forms illuminating part 130, around illuminating part 130, separate the stage that certain interval forms lower end electrode 140; For the upper end electrode 160 that prevents to be provided with between described lower end electrode 140 and the illuminating part 130 causes short circuit with illuminating part 130, the overlapping covering of front end of its part and illuminating part 130 forms the stage of first insulating polymer 150; Form the stage of the upper end electrode 160 identical with lower end electrode 140 shapes in the top of described first insulating polymer 150.
Following explanation is about the operation of fingerprint recognition sensory package of the present invention.
After the lower end electrode 140 of fingerprint recognition sensory package of the present invention applied alternating voltage with upper end electrode 160, fingerprint is contacted simultaneously the surface of upper end electrode 160 and illuminating part 130, form electric field between fingerprint surface and the lower end electrode 140, after utilizing this electric field that the electronics of the luminescent center in the fluorophor powder that is in fluorescence coating 132 is excited, irradiation visible rays when returning to ground state makes it produce the image that forms fingerprint.
On the other hand, because the thickness of described transparent electrode layer 120 is very little, resistance is very big, therefore, reduce the voltage to and minimize, the brightness of luminescent image is improved, in order to form the fingerprint image that obtains homogeneous and bright in the zone 300 at fingerprint image, form lower end electrode 140 on four sides at it.
The fingerprint recognition sensory package of other embodiments of the invention is characterized in that comprising as shown in Figure 3: transparency carrier 100; The transparent electrode layer 120 that is provided with in these transparency carrier 100 tops; The illuminating part 130 that is provided with in these transparent electrode layer 120 tops; Around this illuminating part 130, separate the lower end electrode 140 that certain interval is provided with; Be arranged on these lower end electrode 140 tops a part, with first insulating polymer 150 of the overlapping covering of front end of illuminating part 130; The cementability polymkeric substance 180 that is provided with in the top of this first insulating polymer 150; Second insulating polymer 190 that is provided with in the top of this cementability polymkeric substance 180; The upper end electrode 160 that is provided with in the top of this second insulating polymer 190.
First insulating polymer 150 between described lower end electrode 140 and the upper end electrode 160, cementability polymkeric substance 180 and second insulating polymer 190, owing to be that order forms, so, keep can also prevent short circuit bonding the time between lower end electrode 140 and the upper end electrode 160.
Described first insulating polymer 150 is by insulativity fine-powder and bonding polymkeric substance (binding polymer) formations such as BaTio3.Second insulating polymer 190 is to be made of polyamidoimide insulating polymers such as (polyamideimide).Described cementability polymkeric substance 180 is that the polymkeric substance by epoxies constitutes.
On the other hand, in fingerprint recognition sensory package of the present invention, for preventing upper end electrode 160 and lower end electrode 140 short circuits, shown in Fig. 4 a to Fig. 4 c, remove near a part of upper end electrode 160 the power supply connecting pin 240 of lower end electrode 140, cutting part 260 is set, form assembly.Reference symbol 270 among Fig. 4 is power supply connecting pins of upper end electrode 160.
In addition, illuminating part 130 is a rectangle, in fact because fingerprint does not reach the part of angle (corner), so the part 290 at the angle of illuminating part 130, lower end electrode 140 and upper end electrode 160 forms curved portions 280 respectively.Like this, form arc and can prevent from the part 290 at angle, to pile up dirt, thereby improve credible.
The invention has the advantages that because sensor itself forms assembly, the parts that are used for insulating between electrode that do not need to add are fixed it, so structure is very simple, manufacturing expense is cheap, and particularly thickness is very little, less than 1mm.
Although the present invention is illustrated with reference to accompanying drawing and preferred embodiment,, for a person skilled in the art, the present invention can have various changes and variation.Various change of the present invention, variation and equivalent are contained by the content of appending claims.
Symbol description 100: transparency carrier 120: transparent electrode layer 130: illuminating part 140: 150: the first insulating polymers 160 of lower end electrode: upper end electrode 180: 190: the second insulating polymers 240 of cementability polymer: the power supply connecting pin 270 of lower end electrode: the power supply connecting pin 280 of upper end electrode: curved portions
Claims (14)
1. fingerprint recognition sensory package is characterized in that comprising:
Transparency carrier;
The transparent electrode layer that is provided with in the top of described transparency carrier;
The illuminating part that is provided with in the top of described transparent electrode layer;
Be arranged on the top of described transparent electrode layer, around described illuminating part, separate the lower end electrode that certain interval is provided with;
First insulating polymer that is provided with in the top of described lower end electrode;
The upper end electrode that is provided with in the top of described first insulating polymer.
2. fingerprint recognition sensory package according to claim 1 is characterized in that, described illuminating part comprises:
The fluorescence coating that constitutes by fluorophor particle and bonding agent;
The inductive layer that is provided with in the top of described fluorescence coating;
The water barrier that is provided with in the top of described inductive layer.
3. fingerprint recognition sensory package according to claim 1 is characterized in that, described first insulating polymer is by insulativity fine powder BaTiO
3Constitute with adhesive polymer.
4. according to claim 1 or 3 described fingerprint recognition sensory packages, it is characterized in that the part of described first insulating polymer covers the front end and the lower end electrode of described illuminating part.
5. fingerprint recognition sensory package according to claim 1 is characterized in that, described upper end electrode forms with identical size with described lower end electrode.
6. fingerprint recognition sensory package is characterized in that comprising:
Transparency carrier;
The transparent electrode layer that is provided with in the top of described transparency carrier;
The illuminating part that is provided with in the top of described transparent electrode layer;
Around described illuminating part, separate the lower end electrode that certain interval is provided with;
First insulating polymer that be provided with in the top of described lower end electrode, its part and the overlapping covering of front end of illuminating part;
The cementability polymkeric substance that is provided with in the top of described first insulating polymer;
Second insulating polymer that is provided with in the top of described cementability polymkeric substance;
The upper end electrode that is provided with in the top of described second insulating polymer.
7. fingerprint recognition sensory package according to claim 6 is characterized in that, described first insulating polymer is by insulativity fine powder BaTiO
3Constitute with adhesive polymer;
Described second insulating polymer is the insulativity polymkeric substance that is made of polyamidoimide.
8. fingerprint recognition sensory package according to claim 6 is characterized in that, described cementability polymkeric substance is the polymkeric substance of epoxies.
9. fingerprint recognition sensory package according to claim 6 is characterized in that, described lower end electrode is to mix the back coating with the bonding agent of polymkeric substance by the conductive metal powder as silver to constitute.
10. fingerprint recognition sensory package according to claim 6 is characterized in that, described lower end electrode is to be made of the conductive metal film as aluminium or copper.
11. fingerprint recognition sensory package according to claim 6 is characterized in that described lower end electrode has the power supply connecting pin, will remove a part with the upper end electrode of described power supply connecting pin correspondence.
12. fingerprint recognition sensory package according to claim 6 is characterized in that, the angle part of described illuminating part, described upper end electrode and described lower end electrode forms arc shape.
13. the manufacture method of a fingerprint recognition sensory package is characterized in that comprising: the stage that forms the transparency carrier of transparency electrode on the surface;
After the top of transparency electrode forms illuminating part, around illuminating part, separate certain interval, form the stage of lower end electrode;
For preventing that the upper end electrode and the illuminating part that are arranged on the lower end electrode top from causing short circuit, form stage of insulating polymer of the overlapping covering of front end of a part of upper end electrode and illuminating part;
The stage of upper end electrode is set in the top of described insulating polymer.
14. the manufacture method of fingerprint recognition sensory package according to claim 13 is characterized in that, the formation of described illuminating part comprises:
In the top of described transparent electrode layer, form the stage of the fluorescence coating that produces light image;
Form the stage of inductive layer in the top of described fluorescence coating;
Form the stage of water proofing property film in the top of described inductive layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2002-0049134A KR100439633B1 (en) | 2002-08-20 | 2002-08-20 | Fingerprint Recognition Sensor Module And A Manufacturing Method Thereof, Using Multi-Layer Electrodes |
| KR200249134 | 2002-08-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1477586A true CN1477586A (en) | 2004-02-25 |
| CN1204523C CN1204523C (en) | 2005-06-01 |
Family
ID=34192002
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB021462453A Expired - Lifetime CN1204523C (en) | 2002-08-20 | 2002-10-15 | Fingerprint identification sensor assembly using multilayer electrode and its mfg. method |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR100439633B1 (en) |
| CN (1) | CN1204523C (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100455260C (en) * | 2005-10-27 | 2009-01-28 | Nec液晶技术株式会社 | Biosensor |
| CN101378046B (en) * | 2007-08-29 | 2010-09-08 | 飞信半导体股份有限公司 | Structure, method and substrate for packaging touch-slide type thin type fingerprint identifier |
| CN101382994B (en) * | 2007-09-05 | 2011-03-02 | 飞信半导体股份有限公司 | Touching and sliding type packaging structure for thin type finger print identifier |
| CN102073860A (en) * | 2010-12-06 | 2011-05-25 | 清华大学 | Optical fingerprint acquisition device, optical fingerprint identification system and method |
| CN101099676B (en) * | 2006-05-16 | 2011-06-01 | 精工爱普生株式会社 | Biological information acquisition device, method for acquiring biological information, and biometrics device |
| CN102419815A (en) * | 2010-09-28 | 2012-04-18 | 株式会社日立显示器 | Photosensor |
| US9228824B2 (en) | 2013-05-10 | 2016-01-05 | Ib Korea Ltd. | Combined sensor arrays for relief print imaging |
| US9449213B2 (en) | 2012-10-04 | 2016-09-20 | Ib Korea Ltd. | Anti-shock relief print scanning |
| US9501631B2 (en) | 2014-04-10 | 2016-11-22 | Ib Korea Ltd. | Biometric sensor for touch-enabled device |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8824792B2 (en) | 2012-07-25 | 2014-09-02 | Ib Korea Ltd. | Image element brightness adjustment |
| CN102895504B (en) * | 2012-09-04 | 2014-11-19 | 刘长灵 | Drug wine for treating hyperosteogeny |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3473658B2 (en) * | 1996-07-18 | 2003-12-08 | アルプス電気株式会社 | Fingerprint reader |
| US6091838A (en) * | 1998-06-08 | 2000-07-18 | E.L. Specialists, Inc. | Irradiated images described by electrical contact |
| KR100349113B1 (en) * | 2000-01-10 | 2002-08-17 | 테스텍 주식회사 | Method for Manufacturing Fingerprint recognition sensor and Fingerprint Recognition System |
| KR100446337B1 (en) * | 2001-09-12 | 2004-09-01 | 주식회사 코탑테크놀로지 | A fingerprint cognition element having high cognition ratio |
-
2002
- 2002-08-20 KR KR10-2002-0049134A patent/KR100439633B1/en active IP Right Grant
- 2002-10-15 CN CNB021462453A patent/CN1204523C/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100455260C (en) * | 2005-10-27 | 2009-01-28 | Nec液晶技术株式会社 | Biosensor |
| CN101099676B (en) * | 2006-05-16 | 2011-06-01 | 精工爱普生株式会社 | Biological information acquisition device, method for acquiring biological information, and biometrics device |
| CN101378046B (en) * | 2007-08-29 | 2010-09-08 | 飞信半导体股份有限公司 | Structure, method and substrate for packaging touch-slide type thin type fingerprint identifier |
| CN101382994B (en) * | 2007-09-05 | 2011-03-02 | 飞信半导体股份有限公司 | Touching and sliding type packaging structure for thin type finger print identifier |
| CN102419815A (en) * | 2010-09-28 | 2012-04-18 | 株式会社日立显示器 | Photosensor |
| CN102073860A (en) * | 2010-12-06 | 2011-05-25 | 清华大学 | Optical fingerprint acquisition device, optical fingerprint identification system and method |
| US9449213B2 (en) | 2012-10-04 | 2016-09-20 | Ib Korea Ltd. | Anti-shock relief print scanning |
| US9228824B2 (en) | 2013-05-10 | 2016-01-05 | Ib Korea Ltd. | Combined sensor arrays for relief print imaging |
| US9563801B2 (en) | 2013-05-10 | 2017-02-07 | Ib Korea Ltd. | Combined sensor arrays for relief print imaging |
| US9501631B2 (en) | 2014-04-10 | 2016-11-22 | Ib Korea Ltd. | Biometric sensor for touch-enabled device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1204523C (en) | 2005-06-01 |
| KR20040017041A (en) | 2004-02-26 |
| KR100439633B1 (en) | 2004-07-12 |
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| ASS | Succession or assignment of patent right |
Owner name: EBICRIA CO., LTD. Free format text: FORMER OWNER: TESTECH CO., LTD. Effective date: 20091225 |
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| TR01 | Transfer of patent right |
Effective date of registration: 20091225 Address after: Gyeonggi Do, South Korea Patentee after: Epicria Co.,Ltd. Address before: Chungnam, South Korea Patentee before: Testech Co.,Ltd. |
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Denomination of invention: Fingerprint identification sensor assembly using multilayer electrode and its mfg. method Effective date of registration: 20191209 Granted publication date: 20050601 Pledgee: Growth partner No.5 Co.,Ltd. Pledgor: Epicria Co.,Ltd. Registration number: Y2019990000683 |
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Granted publication date: 20050601 |
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| CX01 | Expiry of patent term |