CN1475324A - Water Bath Laser Ablation and Laser Machining Methods - Google Patents
Water Bath Laser Ablation and Laser Machining Methods Download PDFInfo
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- CN1475324A CN1475324A CNA031296084A CN03129608A CN1475324A CN 1475324 A CN1475324 A CN 1475324A CN A031296084 A CNA031296084 A CN A031296084A CN 03129608 A CN03129608 A CN 03129608A CN 1475324 A CN1475324 A CN 1475324A
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- laser
- water
- sample
- laser ablation
- water bath
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- 238000000608 laser ablation Methods 0.000 title claims abstract description 21
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 19
- 238000000034 method Methods 0.000 title claims abstract description 14
- 238000003754 machining Methods 0.000 title description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 3
- 229910052710 silicon Inorganic materials 0.000 abstract description 3
- 239000010703 silicon Substances 0.000 abstract description 3
- 238000009826 distribution Methods 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 229910052755 nonmetal Inorganic materials 0.000 abstract description 2
- 230000035939 shock Effects 0.000 abstract description 2
- 230000002411 adverse Effects 0.000 abstract 1
- 150000002843 nonmetals Chemical class 0.000 abstract 1
- 238000003672 processing method Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000002679 ablation Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
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- Laser Beam Processing (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
一种水浴激光消融和激光加工方法，将需要激光消融和激光加工的样品置于盛有水的容器中，然后放置于激光辐照的范围内进行激光消融或激光加工处理。样品放置于水浴中阻断了其暴露于空气环境中的不利情况，水浴不但降低样品表面的温度，抑制激光消融飞溅物的产生和再沉积，改善样品表面的光洁度和加工精度；而且对激光等离子体所产生的冲击波起到反向增强的作用，对表面施以压应力，可以改善样品表面的应力分布，从而提高其机械性能。本发明方法适用于耐水的样品，比如硅片、玻璃等非金属，并且适用于可在水中传播的激光波段，蓝绿激光被水吸收很小是很好的光源。
A water bath laser ablation and laser processing method, wherein a sample to be laser ablated and processed is placed in a container filled with water, and then placed within the range of laser irradiation for laser ablation or laser processing. Placing the sample in a water bath blocks the adverse situation of being exposed to an air environment. The water bath not only reduces the temperature of the sample surface, inhibits the generation and redeposition of laser ablation spatter, and improves the surface finish and processing accuracy of the sample; it also reversely enhances the shock wave generated by the laser plasma, applies compressive stress to the surface, and can improve the stress distribution on the sample surface, thereby improving its mechanical properties. The method of the present invention is suitable for water-resistant samples, such as non-metals such as silicon wafers and glass, and is suitable for laser bands that can propagate in water. Blue-green lasers are very poorly absorbed by water and are good light sources.
Description
Technical field:
The present invention relates to laser ablation and processing, the method for particularly a kind of water-bath laser ablation and Laser Processing.
Background technology:
In laser ablation, sample that need melt or workpiece (hereinafter to be referred as sample) are put generally and all are exposed in the air.Sample surfaces after the effect has various pattern defectives and stress defective, and machining accuracy also is affected.In improved method, usually in ablation procedure, adopt the nozzle act of logical inert gas or other gas (for example oxygen) to come air-isolation and remove ejecta in ablation site, the sample surfaces after the effect is had some improvement.Can not improve mechanical stress simultaneously but this method can only be improved the pattern on surface distributes; Assist in some occasion with gas simultaneously and increased operation easier.
Summary of the invention:
The objective of the invention is to when improving the pattern of sample surfaces, improve mechanical stress and distribute, improve the oeverall quality of laser ablation, a kind of water-bath laser ablation and laser processing are provided.
Purpose of the present invention realizes by following measure:
A kind of water-bath laser ablation and laser processing place the container that fills water with the sample that needs laser ablation and Laser Processing, are positioned over then to carry out laser ablation in the scope of laser irradiation or Laser Processing is handled.Sample is positioned over have been blocked it and has been exposed to rough sledding in the air ambient in the water-bath, water-bath not only reduces the temperature of sample surfaces, suppresses the generation of laser ablation splash and deposits, improves fineness and the machining accuracy of sample surfaces; And the shock wave that laser plasma produced played the effect of reverse enhancing, and the surface is imposed compression, can improve the stress distribution of sample surfaces, thereby improve its mechanical performance.
The inventive method is applicable to water-fast sample, and is nonmetal such as silicon chip, glass etc., and be applicable to can be at the laser wavelength of water transmission, and it is good light source that bluish-green laser is absorbed very for a short time by water.
In the methods of the invention, sample is soaked in the water fully, and the water surface exceeds sample top 1-10 millimeter.
Compare with technology formerly, water-bath laser ablation of the present invention and laser processing, the surface topography that not only improves sample has also improved the mechanical performance of sample, has advantages such as easy to use, with low cost and environmental protection.
Description of drawings:
Fig. 1 is a kind of schematic layout pattern of immersion method laser ablation of the present invention and processing.
The specific embodiment
Shown in Fig. 1 was, laser instrument 1 adopted the 532nm second harmonic output of Spectron-SL454G-Nd:YAG Solid State Laser.Behind laser process JD-1 (the patent No. ZL96 2 29370.9) attenuator 2, a part is monitored by power meter 4 after beam splitting chip 3 beam split.The laser that sees through spatial filter 5 shapings.6 is 45 ° of sheets that are all-trans, and with 45 ° of incident laser deflections, converges to sample 10 through aperture 7 and lens 8 again.Sample 10 is soaked in the container 9 that fills water, and the water surface exceeds sample top 5-10 millimeter.Be to carry out silicon chip punching and cutting, obtained good result with present embodiment.
Claims (3)
1, the method for a kind of water-bath laser ablation and Laser Processing is characterized in that the sample that needs melt is placed the container that fills water, then laser irradiation is carried out at the position that needs laser ablation and Laser Processing.
2, the method for water-bath laser ablation according to claim 1 and Laser Processing is characterized in that described water will cover the above 1-10 millimeter in position of laser ablation and Laser Processing at least.
3, the method for water-bath laser ablation according to claim 1 and Laser Processing is characterized in that sample is soaked in the water fully, and the water surface exceeds sample top 1-10 millimeter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031296084A CN1475324A (en) | 2003-06-27 | 2003-06-27 | Water Bath Laser Ablation and Laser Machining Methods |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA031296084A CN1475324A (en) | 2003-06-27 | 2003-06-27 | Water Bath Laser Ablation and Laser Machining Methods |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1475324A true CN1475324A (en) | 2004-02-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA031296084A Pending CN1475324A (en) | 2003-06-27 | 2003-06-27 | Water Bath Laser Ablation and Laser Machining Methods |
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| CN (1) | CN1475324A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008882A (en) * | 2012-12-12 | 2013-04-03 | 桂林电子科技大学 | Micro-processing method and system for pulse laser fragile material |
| CN103894739A (en) * | 2014-03-26 | 2014-07-02 | 华中科技大学 | Method and device for etching and processing high-quality aluminum oxide ceramics |
| CN106001939A (en) * | 2016-06-27 | 2016-10-12 | 维沃移动通信有限公司 | Cutting method of ceramic substrate and electronic device |
| CN106271057A (en) * | 2016-09-28 | 2017-01-04 | 西安交通大学 | A kind of sequential laser drilling device based on air and water environment and method |
-
2003
- 2003-06-27 CN CNA031296084A patent/CN1475324A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103008882A (en) * | 2012-12-12 | 2013-04-03 | 桂林电子科技大学 | Micro-processing method and system for pulse laser fragile material |
| CN103894739A (en) * | 2014-03-26 | 2014-07-02 | 华中科技大学 | Method and device for etching and processing high-quality aluminum oxide ceramics |
| CN106001939A (en) * | 2016-06-27 | 2016-10-12 | 维沃移动通信有限公司 | Cutting method of ceramic substrate and electronic device |
| CN106271057A (en) * | 2016-09-28 | 2017-01-04 | 西安交通大学 | A kind of sequential laser drilling device based on air and water environment and method |
| CN106271057B (en) * | 2016-09-28 | 2018-03-09 | 西安交通大学 | A kind of sequential laser drilling device and method based on air and water environment |
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