CN1473001A - Metal substrate repairing method and apparatus thereof - Google Patents
Metal substrate repairing method and apparatus thereof Download PDFInfo
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- CN1473001A CN1473001A CNA021284059A CN02128405A CN1473001A CN 1473001 A CN1473001 A CN 1473001A CN A021284059 A CNA021284059 A CN A021284059A CN 02128405 A CN02128405 A CN 02128405A CN 1473001 A CN1473001 A CN 1473001A
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- metal substrate
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Abstract
The present invention relates to a repairing method using a metal base plate and the repairing equipment. The repairing method includes the following steps: preheating the metal base plate to a predetermined temperature; keeping the temperature constant, removing the components having trouble on the board and soldering new components; decreasing the temperature of the repaired board after soldering. The repairing equipment includes a house and a heating device and a temperature dropping device disposed in the house. The invention can heat repaired board uniformly, prevent local deformation due to local too high temperature and avoid the components from being damaged, which are positioned around the area of the metal base plate which is heated. When repairing, the temperature gradient between the components, the soldering pan and the metal base plate can be decreased, the heat loss from the tools such as soldering iron can be reduced, the temperature rising time of base pins and soldering pan can be shortened.
Description
Technical field
The present invention relates to the circuit board service technique, be specifically related to that a kind of to adopt aluminium base or metal liner base plate be the repair method of the metal substrate of base material, the invention still further relates to a kind of repairing facility of described method that be used for.
Background technology
Along with electric product progressively develops to high-power and high integrated direction, must bring the ground connection and the heat dissipation problem of device on the veneer like this, adopting metal substrate is the base material heat radiation, has the efficient height, therefore advantages such as ground connection is effective have obtained extensive use, in process of production in electric product, the defective products that produces owing to partly device quality or welding procedure needs place under repair, to reduce cost; The existing repairing technology of device on the metal substrate that adopts adopts following method to carry out:
Use electric iron, hot air tool etc., set a temperature, carry out manual repairing according to the size of device.Adopt this method place under repair to have following shortcoming:
Because the base material of metal substrate is a metal, thickness is also bigger, and thermal capacity is big.When carrying out manual repairing of electric iron, the temperature of device bonding pad will reach more than 183 ℃ (Sn63/Pb37 scolders) as early as possible, and reaches about 220 ℃ of best welding temperatures, needs the long time, can cause following harmful effect:
1) owing to the metal substrate rapid heat dissipation, pin, pad equitemperature rise slowly, make device longer in the following time of higher temperature, may the long-term reliability of device (particularly temperature-sensitive device) be impacted.
2) the veneer part is subjected to high temperature, and the inequality of being heated is prone to distortion, damages veneer and other components and parts.
Summary of the invention
The invention provides a kind of metal substrate repair method, can solve when repairing, because metal substrate thermal capacity is big, the device bonding pad that heat transfer speed causes soon is long heating time, damages problems such as veneer and other components and parts.
The present invention also provides a kind of equipment that metal substrate is repaired that is used for, and can improve and repair efficient and repairing quality.
Method to off-grade metal substrate place under repair provided by the invention comprises the steps:
(1) metal substrate to be repaired is preheated to design temperature;
(4) keep design temperature constant, remove problematic device on the plate, the new unit of burn-oning;
(5) to the metal substrate processing of lowering the temperature after the welding;
(4) metal substrate after the cooling is checked.
On above-mentioned dismounting plate, the problem device is arranged, also comprise the steps: the residual tin on the clear board in the new unit step of burn-oning; On pad, add and mend new scolding tin; Be attached on the pad new unit and correction; Make the new melts soldering tin on the pad; With the device weldering onboard;
The present invention also provides a kind of equipment that is used for off-grade metal substrate place under repair, and equipment comprises frame, also comprises being arranged in the described frame, and the device that metal substrate is heated reaches the device that the metal substrate after the heating is lowered the temperature.
In the said equipment, described heater comprises on the platen that is arranged on described frame, be used to place the metal electric boiling plate of metal substrate, the temperature regulating device that is connected with described electric boiling plate, described heat sink comprises on the platen that is arranged on described frame, and be used to place the metallic heat radiating plate of metal substrate, be evenly equipped with a plurality of ventilation holes on the described heating panel, below described heating panel, be provided with fan to described ventilation hole air-supply.
Implement repair method provided by the invention and equipment, compare, have following advantage with existing repair method:
1) realizes the even heating of metal substrate, prevent that local temperature is too high and produce local deformation, avoid damaging multilayer veneer heat affected zone peripheral devices;
When 2) repairing, reduce the temperature gradient between device, device bonding pad, the metal substrate, reduce the thermal losses of hand tools such as flatiron, shorten the heating-up time of pin, pad, avoid components and parts under too high temperature, to be detained the oversize time and influence reliability, life-span;
3) shorten the repairing time, improve and repair efficient.
Description of drawings
Fig. 1 is the FB(flow block) of repair method of the present invention;
Fig. 2 is the present invention's front view of repairing facility;
Fig. 3 is the end view of repairing facility shown in Figure 2;
Fig. 4 is the vertical view of repairing facility shown in Figure 2;
Fig. 5 is the rearview of repairing facility shown in Figure 2;
Fig. 6 is the circuit theory diagrams of repairing facility shown in Figure 2.
Embodiment
The repairing of metal substrate is different from common pcb board, because thermal capacity is big, adopts electric iron to repair separately and is difficult to make weld point temperature to reach the solder fusing requirement.Must add the temperature compensation to metal substrate and just can make the solder joint fusing; Before welding, improve the temperature of metal substrate by preheating, when repairing, can reduce the temperature gradient of device bonding pad and metal substrate centre.
Heat transmission has three kinds of modes, thermal radiation, thermal convection, heat conduction.Radiation and convection current are transmitted heat by non-contacting mode, this dual mode requires to have certain operating space, and environmental condition, be subjected to such environmental effects bigger, produce fluctuation, more main is to be unfavorable for the operator near manual operation, adopts the needs of this dual mode to increase adjustable security protection setting of some complexity, avoids security incident to take place.Heat conduction is to transmit heat by transmitting medium, medium has certain thermal capacity, the fluctuation that can offset, the mitigating circumstances factor causes, keep the stable of temperature, and medium is less to the environmental radiation heat, the operator is easily near operation (as long as the operator does not run on the medium, just can not burnt), also protection easily.Have temperature stabilization, simple in structure, be easy to the advantage of personnel, so the present invention adopts heat conducting mode as the preheating method of repairing the metal substrate product near operation.
Concrete structure of repairing facility provided by the invention such as Fig. 2, Fig. 3, Fig. 4, shown in Figure 5; Has frame 7, on frame 7, be provided with platen 701, on platen 701, be provided with the metal electric boiling plate 3 that is used to place metal substrate, in frame 7, be provided with the temperature regulating device (not shown) that is connected with electric boiling plate 3, on the platen 701 of frame 7, also be provided with the metallic heat radiating plate 4 that is used to place metal substrate, on heating panel 4, be evenly equipped with a plurality of ventilation holes 401 that lead in frame 7 inner chambers, on the sidewall of frame 7, be provided with fan 10,11 and fan swicth 9 to ventilation hole 401 air-supplies, on another sidewall of frame 7, also be provided with fresh air inlet 8, to accelerate radiating rate.
For preventing that the operator from running into heating plate 3, can the protection boss 1 that be higher than platen 701 planes be set on the front and the left side of frame platen, as shown in Figure 4.
Temperature regulating device comprises temperature display meter 2, temperature control switch 5, the mains switch 6 that is arranged on the frame, is arranged in the temperature-adjusting circuit (not shown) of frame 7, Figure 6 shows that the temperature-adjusting circuit schematic diagram.
In above-mentioned repairing facility, a typical heating plate is of a size of 250mm * 250mm, and the height of heating plate boss is 10mm, and the flatness of heating plate boss is 0.05mm.Requirement to temperature regulating device is, arrive design temperature after 30 seconds accuracy of temperature control be ± 1 ℃, temperature overshot can not be above 5 ℃ of set points.The efficiency of heating surface should guarantee that metal substrate can be raised to 200 ℃ from 25 ℃ of room temperatures in 5 minutes.Can adopt test to come the efficiency of heating surface is tested with metal substrate, test board is of a size of 250mm * 250mm * 7mm, and material is an aluminium sheet.Can adopt following two kinds of method of testings test efficiency of heating surface:
A, heating plate is heated to 200 ℃, will tests with metal substrate being positioned on the heating plate again, can the test metal substrate reach 200 ℃ in 5 minutes.
B, will test with the metal liner base plate and be positioned on the heating plate of normal temperature, heating simultaneously then, can survey the metal liner base plate reach 200 ℃ in 5 minutes.
Except that the heat conducting mode of above-mentioned employing adds the hot fix plate, can also adopt the mode of thermal radiation (infrared ray etc.) or hot air convection to heat to repairing plate, can supporting guide be set on the platen of frame or refractory rigid glass support frame is maked somebody a mere figurehead the support metal substrate, be convenient to radiant heat or hot blast heats metal substrate.
Adopt present device as follows to the step of off-grade metal substrate place under repair:
Metal substrate to be repaired is placed on the heating plate 3 of repairing facility, open temperature control switch 5, make metal substrate be preheated to design temperature 200 ℃ ± 1;
Keep design temperature 200 ℃ ± 1 constant, remove problematic device on the plate; Residual tin on the clear board; On pad, add and mend new scolding tin; Be attached on the pad new unit and correction; Under design temperature, make new melts soldering tin on the pad (or weld with flatiron); With the device weldering onboard;
Metal substrate after the welding well is placed on the heating panel 4, opens radiator fan the cooling of the metal substrate on the heating panel 4 processing;
Metal substrate after the cooling is carried out quality examination.
Claims (10)
1, a kind of method to off-grade metal substrate place under repair is characterized in that, comprises the steps:
(1) metal substrate to be repaired is preheated to design temperature;
(2) keep design temperature constant, remove problematic device on the plate, the new unit of burn-oning;
(3) to the metal substrate processing of lowering the temperature after the welding;
(4) metal substrate after the cooling is checked.
2, according to the described method of claim 1, it is characterized in that, also comprise the steps: the residual tin on the clear board in the described step (2); On pad, add and mend new scolding tin; Be attached on the pad new unit and correction; Make the new melts soldering tin on the pad, onboard with the device weldering.
According to the described method of claim 1, it is characterized in that 3, described preheating method is one of following manner: heat conduction, thermal radiation, thermal convection; Described design temperature is 200 ℃ ± 1 ℃.
According to the described method of claim 1, it is characterized in that 4, it is to adopt the fan cooling of drying that described cooling is handled.
5, a kind of equipment that is used for off-grade metal substrate place under repair, comprise frame (7), the platen (701) that is connected with frame (7), it is characterized in that, also comprise being arranged in the described frame, the device that metal substrate is heated, the device that the metal substrate after the heating is lowered the temperature.
6, according to the described equipment of claim 5, it is characterized in that, described heater comprises and being arranged on the described platen (701), be used to place the metal electric heating plate (3) of metal substrate, the temperature regulating device that is connected with described electric hot plate (3), described heat sink comprises and being arranged on the described platen (701), be used to place the metallic heat radiating plate (4) of metal substrate, be evenly equipped with a plurality of ventilation holes (401) that lead in described frame (7) inner chamber on the described heating panel (4), on the sidewall of described frame (7), be provided with fan, on another sidewall of described frame (7), be provided with fresh air inlet to described ventilation hole (401) air-supply.
According to the described equipment of claim 6, it is characterized in that 7, described temperature regulating device comprises temperature display meter (2), temperature-adjusting circuit and temperature control switch (5,6).
8, according to claim 5 or 6 or 7 described equipment, it is characterized in that, also be provided with the protection boss (1) that is higher than described platen (701) plane on the front and the left side of described platen (701).
9, according to the described equipment of claim 5, it is characterized in that, described heater comprises and is arranged on the bracing frame that the guide rail that is used for the support metal substrate on the described frame platen or refractory rigid glass are made, below described guide rail or bracing frame, be provided with heat radiation device to the metal substrate heating, the temperature regulating device that is connected with described heat radiation device, described heat sink comprises on the platen that is arranged on described frame, be used to place the metallic heat radiating plate of metal substrate, be evenly equipped with a plurality of ventilation holes on the described heating panel, below described heating panel, be provided with fan to described ventilation hole air-supply.
10, according to the described equipment of claim 5, it is characterized in that, described heater comprises and is arranged on the bracing frame that the guide rail that is used for the support metal substrate on the described frame platen or refractory rigid glass are made, below described guide rail or bracing frame, be provided with hot air apparatus to the metallic plate heating, the temperature regulating device that is connected with described hot air apparatus, described heat sink comprises on the platen that is arranged on described frame, be used to place the metallic heat radiating plate of metal substrate, be evenly equipped with a plurality of ventilation holes on the described heating panel, below described heating panel, be provided with fan to described ventilation hole air-supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02128405 CN1223245C (en) | 2002-08-02 | 2002-08-02 | Metal substrate repairing method and apparatus thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02128405 CN1223245C (en) | 2002-08-02 | 2002-08-02 | Metal substrate repairing method and apparatus thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1473001A true CN1473001A (en) | 2004-02-04 |
| CN1223245C CN1223245C (en) | 2005-10-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02128405 Expired - Fee Related CN1223245C (en) | 2002-08-02 | 2002-08-02 | Metal substrate repairing method and apparatus thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1223245C (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163100A (en) * | 2016-09-09 | 2016-11-23 | 广西大学 | A kind of air energy BGA welding stage heated base |
| CN110022649A (en) * | 2018-01-09 | 2019-07-16 | 佛山市顺德区顺达电脑厂有限公司 | Mainboard plug-in element method for maintaining |
-
2002
- 2002-08-02 CN CN 02128405 patent/CN1223245C/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106163100A (en) * | 2016-09-09 | 2016-11-23 | 广西大学 | A kind of air energy BGA welding stage heated base |
| CN106163100B (en) * | 2016-09-09 | 2018-09-21 | 广西大学 | A kind of air energy BGA welding stage heated bases |
| CN110022649A (en) * | 2018-01-09 | 2019-07-16 | 佛山市顺德区顺达电脑厂有限公司 | Mainboard plug-in element method for maintaining |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1223245C (en) | 2005-10-12 |
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