CN1472073A - Fluid jetter and producing method thereof - Google Patents
Fluid jetter and producing method thereof Download PDFInfo
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- CN1472073A CN1472073A CNA021275963A CN02127596A CN1472073A CN 1472073 A CN1472073 A CN 1472073A CN A021275963 A CNA021275963 A CN A021275963A CN 02127596 A CN02127596 A CN 02127596A CN 1472073 A CN1472073 A CN 1472073A
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Abstract
A fluid jet is composed of substrate with fluid cavity and a surface, the first through hole on said surface and communicated with said fluid cavity, air bubble generator arranged on said surface and near the first through hole, protecting layer on said surface, and metallic layer on said protecting layer outside the fluid cavity and with the second through hole communicated with the first one. Its preparing process is also disclosed.
Description
Technical field
The present invention relates to a kind of fluid ejection apparatus and manufacture method thereof, particularly relate to a kind of fluid ejection apparatus and manufacture method thereof that improves service efficiency and life-saving.
Background technology
At present fluid ejection apparatus applies on the assemblies such as ink gun, fuel injector mostly, the wherein a large amount of especially use heat of the ink gun bubble type design that becomes.
Fig. 1 is the single petrochemical fluid jet device 1 of No. the 6th, 102,530, a kind of existing United States Patent (USP), its with a silicon base 10 as body, and on silicon base 10, form a structure sheaf 12, and between silicon base 10 and structure sheaf 12, form a fluid cavity 14, in order to hold fluid 26; And on structure sheaf 12, be provided with a primary heater 20 and a secondary heater 22, primary heater 20 is in order to produce one first bubble 30 in fluid cavity 14, secondary heater 22 is in order to produce one second bubble 32, so that the fluid in the fluid cavity 14 26 is penetrated in fluid cavity 14.
Because the fluid ejection apparatus 1 of single petrochemical industry has the design of virtual air valve (virtual valve), and have a characteristic of high arranging density, low interactive interference, loss low in calories, and need not to utilize in addition assembling mode to engage spray nozzle sheet, therefore can reduce production costs.
Yet, in the fluid ejection apparatus 1 of existing single petrochemical industry, structure sheaf 12 mainly is made up of the silica of low stress, on manufacture craft, its thickness limits to some extent, therefore for the integrally-built life-span its influence is arranged, and owing to be subjected to drop that the bubble extruding flies away from device, and have the shortcoming that direction can't correcting because of structure sheaf 12 thickness deficiencies; Secondly, heater 20,22 is positioned on the structure sheaf 12, and the heat of generation can be transmitted to the fluid 26 in the fluid cavity 14 in large quantities, but the relative amount of residual heat will that still has part can be accumulated in structure sheaf 12, the operating frequency of remote-effects total system.
Summary of the invention
The object of the present invention is to provide a kind of fluid ejection apparatus and manufacture method thereof, it can improve service efficiency, but and life-saving.
For reaching above-mentioned purpose, the invention provides a kind of fluid ejection apparatus, it comprises a base material, one first through hole, an air Bubble generating apparatus, a protective layer and a metal level; Base material has a fluid cavity and a surface, and first through hole is arranged at the surface and is connected with fluid cavity; Air Bubble generating apparatus is arranged at surperficial going up and contiguous first through hole, and is positioned at outside the fluid cavity of base material; Protective layer is arranged on the surface, and metal level is arranged on the protective layer to be positioned at the outer mode of fluid cavity, and has one second through hole, and wherein second through hole is communicated with first through hole.
In a preferred embodiment, form a plurality of fins at metal level away from the side on the surface of base material, in order to strengthen the radiating effect of metal level.
In another preferred embodiment, the diameter of the end that second through hole is communicated with first through hole is bigger than the diameter of the other end that is not communicated with first through hole.
In another preferred embodiment, fluid ejection apparatus also comprises an adhesion coating, and it is arranged between base material and the metal level, in order to the adhesion between reinforcement metal layer and base material.
The material that will be appreciated that adhesion coating can be aluminium (Al), and the material of metal level can be nickel cobalt (alloy) (Ni-Co alloy), gold (Au), gold cobalt alloy (Au-Co alloy).
In another preferred embodiment, form a third through-hole on the structure sheaf, and form a fourth hole corresponding on the protective layer with third through-hole, by fourth hole, use for metal level directly to be connected with silicon base.
In another preferred embodiment; form a third through-hole on the structure sheaf; and form a fourth hole corresponding on the protective layer with third through-hole; and base material more comprises an adhesion coating; it is arranged on the structure sheaf and between protective layer and structure sheaf; and via third through-hole and silicon base butt, via fourth hole and metal level butt, in order to being connected between reinforcement metal layer and silicon base.
Again in the present invention, provide a kind of manufacture method of fluid ejection apparatus, comprise the following steps: to provide a wafer; On wafer, form a structure sheaf, and form a fluid cavity limiting between wafer and the structure sheaf; One air Bubble generating apparatus is set on structure sheaf, wherein air Bubble generating apparatus is positioned at outside the fluid cavity; On structure sheaf, form a protective layer; And on protective layer, form a metal level; On structure sheaf, form one first through hole that is communicated with fluid cavity.
Will be appreciated that metal level covers air Bubble generating apparatus; and metal level is coated on the protective layer by electroforming (electroforming), electroless plating (electroless plating), physical vapor deposition (PVD), chemical vapor deposition (CVD), and the material of structure sheaf is silicon nitride (SiNx).
In a preferred embodiment, manufacture method also comprises the following steps: to form one second through hole in metal level, and second through hole is communicated with first through hole.
In another preferred embodiment, manufacture method also comprises the following steps: to form an adhesion coating on structure sheaf, in order to the adhesion between reinforcement metal layer and wafer before forming metal level on the structure sheaf.
In another preferred embodiment; manufacture method also comprises the following steps: to form after the protective layer on structure sheaf; on protective layer, form a third through-hole; and on structure sheaf, form a fourth hole that is communicated with third through-hole; by third through-hole and fourth hole, use for metal level directly to be connected with wafer.
In another preferred embodiment, manufacture method also comprises the following steps: to form on wafer after the structure sheaf, forms a third through-hole on structure sheaf, and forms an adhesion coating on structure sheaf, and it is connected with wafer via third through-hole.
Description of drawings
Fig. 1 is the schematic diagram of the fluid ejection apparatus of existing single petrochemical industry;
Fig. 2 is the schematic diagram of first embodiment of fluid ejection apparatus of the present invention;
Fig. 3 a～Fig. 3 e is the schematic diagram of the manufacture method of the fluid ejection apparatus among Fig. 2, wherein only shows the P1 part among Fig. 2;
Fig. 4 a is the schematic diagram of the variation of the fluid ejection apparatus among Fig. 2;
Fig. 4 b～Fig. 4 d is the schematic diagram of another variation of the fluid ejection apparatus among Fig. 2;
Fig. 5 is the schematic diagram of second embodiment of fluid ejection apparatus of the present invention;
Fig. 6 is the schematic diagram of the 3rd embodiment of fluid ejection apparatus of the present invention;
Fig. 7 a～Fig. 7 d is the schematic diagram of the manufacture method of the fluid ejection apparatus among Fig. 6, wherein only shows the P2 part among Fig. 6;
Fig. 8 is the schematic diagram of the 4th embodiment of fluid ejection apparatus of the present invention;
Fig. 9 a～Fig. 9 f is the schematic diagram of the manufacture method of the fluid ejection apparatus among Fig. 8, wherein only shows the P3 part among Fig. 8.
The specific embodiment first embodiment
With reference to figure 2, it shows first embodiment of fluid ejection apparatus of the present invention, and the fluid ejection apparatus 100 of present embodiment comprises a base material 110, one first through hole 114, an air Bubble generating apparatus 120, a protective layer 130 and a metal level 140.
Air Bubble generating apparatus 120 is arranged on the surface 1122 (with reference to figure 3a) of structure sheaf 112, and contiguous first through hole 114, and is arranged in outside the fluid cavity 113 of base material 110; In the present embodiment, air Bubble generating apparatus 120 comprises a primary heater 121 and a secondary heater 122, primary heater 121 is as prior art, in order in fluid cavity 113, to produce one first bubble (with reference to figure 1), secondary heater 122 and primary heater 121 lay respectively at the opposite side of first through hole 114, and as prior art, in order in fluid cavity 113, to produce one second bubble (with reference to the 1st figure) so that the fluid in the fluid cavity 113 is penetrated.
The material that will be appreciated that metal level can be nickel cobalt (alloy) (Ni-Co alloy), gold (Au), the gold cobalt alloy higher materials of thermal conductivity factor such as (Au-Co alloy) is preferably, and the material of structure sheaf is a silicon nitride.
The formation of the fluid ejection apparatus of present embodiment illustrates the manufacture method of a kind of fluid ejection apparatus of present embodiment as mentioned above below with reference to Fig. 3 a～Fig. 3 e.
Provide a wafer as silicon base 111, and on silicon base 111, form a structure sheaf 112, and between silicon base 111 and structure sheaf 112, form a fluid cavity 113, shown in Fig. 3 a; Then, air Bubble generating apparatus 120 is set on structure sheaf 112, this air Bubble generating apparatus 120 is positioned at outside the fluid cavity 113, shown in Fig. 3 b; Then, on structure sheaf 120, form a protective layer 130, shown in Fig. 3 c, on protective layer 130, form a metal level 140 afterwards, shown in Fig. 3 d; At last, form first through hole 114, fifth hole 131, second through hole 141 that is interconnected respectively on structure sheaf 112, structure sheaf 130, metal level 140, shown in Fig. 3 e, wherein first through hole 114 is communicated with fluid cavity 113.
Will be appreciated that metal level 140 covers air Bubble generating apparatus 120, and metal level 140 can be coated on the protective layer 130 by modes such as electroforming, electroless plating, physical vapour deposition (PVD), chemical vapour deposition (CVD)s.
As mentioned above, the fluid ejection apparatus of present embodiment is at its outside metal level that forms one deck thick film, can strengthen the structural strength of fluid ejection apparatus on the one hand, utilize the higher thermal conductivity factor of metal level on the one hand, make the residual heat of the heater of air Bubble generating apparatus promptly be delivered in the air or other zone such as base material, operating frequency is improved by metal level.
Again, the passage that the thick film metal layer also can make drop fly away from increases, and makes the disengaging direction that flies away from drop more stable.
In addition, with reference to figure 4a, it shows a variation of the fluid ejection apparatus of present embodiment, among the fluid ejection apparatus 100a in Fig. 4 a, form a plurality of fins 142 at its metal level 140a away from the side on the surface of base material 110a, in order to strengthen the radiating effect of metal level 140, the surface of metal level 140a also can all form fin 142 certainly, and only local formation fin 142 also can reach radiating effect.
Again, with reference to figure 4b, it shows another variation of the fluid ejection apparatus of present embodiment, among the fluid ejection apparatus 100b in Fig. 4 b, it changes the shape of the second through hole 141b, make the diameter of the end that the second through hole 141b is communicated with first through hole 114 bigger, so that the disengaging direction of drop can be more stable than the diameter of the other end that is not communicated with first through hole 114.
Finish as the fluid ejection apparatus 100b among Fig. 4 b, can utilize eurymeric or negative type photoresist 160, to obtain up-narrow and down-wide photoresist external form, shown in Fig. 4 c, after carrying out the electroforming manufacture craft again and removing photoresist, can form the metal level external form shown in Fig. 4 d, use the dry ecthing manufacture craft at last, finish the second through hole 141b as the orifice shown in Fig. 4 b.
Because the second through hole 141b among the fluid ejection apparatus 100b among Fig. 4 b forms in the mode of orifice, can make the disengaging direction that flies away from drop more stable.Second embodiment
Fig. 5 is the schematic diagram of second embodiment of fluid ejection apparatus of the present invention, in the fluid ejection apparatus 100d of present embodiment, air Bubble generating apparatus 120 is made of single heating device 120d, this is the difference with the fluid ejection apparatus 100 of first embodiment, all identical as for other formation with first embodiment, omit its explanation at this.
Owing to also be formed with metal level in the fluid ejection apparatus outside of present embodiment, therefore also can reach the effect identical with first embodiment, promptly, can strengthen the structural strength of fluid ejection apparatus, can promptly be delivered to residual heat in the air or other zone such as base material, and make the disengaging direction that flies away from drop more stable.The 3rd embodiment
With reference to figure 6; it shows the 3rd embodiment of fluid ejection apparatus of the present invention; the fluid ejection apparatus 100e of present embodiment comprises a silicon base 111e, a structure sheaf 112e, one first through hole 114, an air Bubble generating apparatus 120, a protective layer 130e, a metal level 140e and one second through hole 141; wherein the formation of first through hole 114, air Bubble generating apparatus 120 and second through hole 141 is identical with first embodiment; omit its explanation at this, and be marked with identical symbol.
The difference of the present embodiment and first embodiment is: in the present embodiment; structure sheaf 112e goes up and forms a third through-hole 1121e (with reference to figure 7a); and protective layer 130e goes up and forms a fourth hole 132e (with reference to figure 7c) corresponding with third through-hole 1121e; by fourth hole 132e, use for metal level 140e directly to be connected with silicon base 111e.
Difference between the manufacture method of the manufacture method of the fluid ejection apparatus 100e of present embodiment and the fluid ejection apparatus 100 of first embodiment is: when forming structure sheaf 112e on silicon base 111e; on structure sheaf 112e, form a third through-hole 1121e; shown in Fig. 7 a; then after forming protective layer 130e on the structure sheaf 112e; shown in Fig. 7 b; on protective layer 130e, form a fourth hole 132e; shown in Fig. 7 c; on protective layer 130e, form metal level 140e at last, shown in Fig. 7 d.
Present embodiment makes metal level 140e directly be connected with silicon base 111e by fourth hole 132e, can more strengthen radiating effect thus.
Again, owing to also be formed with metal level in the fluid ejection apparatus outside of present embodiment, therefore also can reach the effect identical with first embodiment, promptly, can strengthen the structural strength of fluid ejection apparatus, can be delivered to residual heat in the air rapidly or other zone such as base material, and make the disengaging direction that flies away from drop more stable.The 4th embodiment
With reference to figure 8; it shows the 4th embodiment of fluid ejection apparatus of the present invention; the fluid ejection apparatus 100f of present embodiment comprises a silicon base 111f; one structure sheaf 112f; one first through hole 114; one air Bubble generating apparatus 120; one protective layer 130f; one metal level 140f; one second through hole 141; one adhesion layer 150a; an and dielectric layer 170; first through hole 114 wherein; air Bubble generating apparatus 120; and the formation of second through hole 141 is identical with first embodiment; omit its explanation at this; and be marked with identical symbol; and structure sheaf 112f; protective layer 130f; and the formation of metal level 140f is identical with the 3rd embodiment, also omits its explanation at this.
The difference of present embodiment and the 3rd embodiment is: in the present embodiment; fluid ejection apparatus 100f also comprises an adhesion coating 150a and a dielectric layer 170; wherein adhesion coating 150a and dielectric layer 170 are arranged between the structure sheaf 112f and metal level 140f of base material 110; adhesion coating 150a is via the fourth hole 132f (with reference to figure 9e) of protective layer 130f and metal level 140f butt and via third through-hole 1121f (with reference to figure 9a) and the silicon base 111f butt of structure sheaf 112f, in order to being connected between reinforcement metal layer 140f and silicon base 111f.
The material that will be appreciated that adhesion coating 150a can be aluminium, and it should be noted because the material of adhesion coating 150a has electric conductivity, therefore can not contact with air Bubble generating apparatus 120, but based on the consideration of manufacture craft, can be when forming adhesion coating 150a, form a conductor layer 150b, but must have between adhesion coating 150a and the conductor layer 150b at interval.
Difference between the manufacture method of the manufacture method of the fluid ejection apparatus 100f of present embodiment and the fluid ejection apparatus 100 of first embodiment is: when forming structure sheaf 112f on silicon base 111f, shown in Fig. 9 a, on structure sheaf 112f, form a third through-hole 1121f, shown in Fig. 9 b, then on structure sheaf 112f, form a dielectric layer 170, shown in Fig. 9 c, on dielectric layer 170, form an adhesion layer 150a afterwards, shown in Fig. 9 d; Then, after forming protective layer 130f on the adhesion layer 150a, on protective layer 130f, form a fourth hole 132f, shown in Fig. 9 e, on protective layer 130f, form metal level 140f at last, shown in Fig. 9 f.
Present embodiment is by adhesion layer 150, make between metal level 140f and silicon base 111f be connected more firm.
Again, owing to also be formed with metal level in the fluid ejection apparatus outside of present embodiment, therefore also can reach the effect identical with first embodiment, promptly, can strengthen the structural strength of fluid ejection apparatus, can be delivered to residual heat in the air rapidly or other zone such as base material, and make the disengaging direction that flies away from drop more stable.
Though disclosed the present invention in conjunction with above preferred embodiment; yet it is not in order to limit the present invention; any those skilled in the art can do a little change and retouching, so protection scope of the present invention should be with being as the criterion that claim was defined without departing from the spirit and scope of the present invention.
Claims (40)
1. a fluid ejection apparatus comprises
One base material has a fluid cavity and a surface;
One first through hole is arranged at this surface and is connected with this fluid cavity;
One air Bubble generating apparatus is arranged on this surface and contiguous this first through hole, and is positioned at outside the fluid cavity of this base material;
One protective layer is arranged on this surface; And
One metal level is arranged on this protective layer to be positioned at the outer mode of this fluid cavity, and has one second through hole, and wherein this second through hole is communicated with this first through hole.
2. fluid ejection apparatus as claimed in claim 1, wherein this air Bubble generating apparatus comprises:
One primary heater is arranged on this surface to be positioned at the outer mode of this fluid cavity, in order to produce one first bubble in this fluid cavity; And
One secondary heater is arranged on this surface to be positioned at the outer mode of this fluid cavity, and lays respectively at the opposite side of this first through hole with this primary heater, in order to produce one second bubble so that the fluid in this fluid cavity is penetrated in this fluid cavity.
3. fluid ejection apparatus as claimed in claim 1, wherein this air Bubble generating apparatus comprises a heater.
4. fluid ejection apparatus as claimed in claim 1 wherein forms a plurality of fins at this metal level away from the side on the surface of this base material, in order to strengthen the radiating effect of this metal level.
5. fluid ejection apparatus as claimed in claim 1, wherein the diameter of the end that is communicated with this first through hole of this second through hole is bigger than the diameter of the other end that is not communicated with this first through hole.
6. fluid ejection apparatus as claimed in claim 1 also comprises:
One adhesion coating is arranged between this base material and this metal level, in order to strengthen the adhesion between this metal level and this base material.
7. fluid ejection apparatus as claimed in claim 6, wherein the material of this adhesion coating is an aluminium.
8. fluid ejection apparatus as claimed in claim 1, wherein the material of this metal level is a nickel cobalt (alloy).
9. fluid ejection apparatus as claimed in claim 1, wherein the material of this metal level is a gold.
10. fluid ejection apparatus as claimed in claim 1, wherein the material of this metal level is a gold cobalt alloy.
11. fluid ejection apparatus as claimed in claim 1, wherein this base material comprises:
One silicon base; And
One structure sheaf is arranged on this silicon base, and and this silicon base between form this fluid cavity.
12. fluid ejection apparatus as claimed in claim 11 wherein forms a third through-hole, and forms a fourth hole corresponding with this third through-hole on this protective layer on this structure sheaf, by this fourth hole, use for this metal level directly to be connected with this silicon base.
13. fluid ejection apparatus as claimed in claim 11 wherein forms a third through-hole on this structure sheaf, and form a fourth hole corresponding with this third through-hole on this protective layer, and this base material also comprises:
One adhesion coating is arranged on this structure sheaf and between this protective layer and this structure sheaf, and via this third through-hole and this silicon base butt, via this fourth hole and this metal level butt, in order to strengthen being connected between this metal level and this silicon base.
14. fluid ejection apparatus as claimed in claim 13, wherein the material of this adhesion coating is an aluminium.
15. the manufacture method of a fluid ejection apparatus comprises:
One wafer is provided;
On this wafer, form a structure sheaf, and form a fluid cavity limiting between this wafer and this structure sheaf;
One air Bubble generating apparatus is set on this structure sheaf, and wherein this air Bubble generating apparatus is positioned at outside this fluid cavity;
On this structure sheaf, form a protective layer;
On this protective layer, form a metal level; And
On this structure sheaf, form one first through hole that is communicated with this fluid cavity.
16. the manufacture method of fluid ejection apparatus as claimed in claim 15, wherein this metal level covers this air Bubble generating apparatus.
17. the manufacture method of fluid ejection apparatus as claimed in claim 15, wherein this metal level is coated on this protective layer by electroforming.
18. the manufacture method of fluid ejection apparatus as claimed in claim 15, wherein this metal level is coated on this protective layer by electroless plating.
19. the manufacture method of fluid ejection apparatus as claimed in claim 15, wherein this metal level is coated on this protective layer by physical vapour deposition (PVD).
20. the manufacture method of fluid ejection apparatus as claimed in claim 15, wherein this metal level is coated on this protective layer by chemical vapour deposition (CVD).
21. the manufacture method of fluid ejection apparatus as claimed in claim 15 wherein forms a plurality of fins at this metal level away from a side of this wafer surface, in order to strengthen the radiating effect of this metal level.
22. the manufacture method of fluid ejection apparatus as claimed in claim 15 wherein also comprises the following steps:
In this metal level, form one second through hole, and this second through hole is communicated with this first through hole.
23. the manufacture method of fluid ejection apparatus as claimed in claim 22, wherein this second through hole is formed in this metal level in the diameter of the end that is communicated with this first through hole big mode of diameter than the other end that is not communicated with this first through hole.
24. the manufacture method of fluid ejection apparatus as claimed in claim 15 wherein before forming this metal level on this structure sheaf, forms an adhesion coating, in order to strengthen the adhesion between this metal level and this wafer on this structure sheaf.
25. the manufacture method of fluid ejection apparatus as claimed in claim 15; wherein on this structure sheaf, form a third through-hole; and on this protective layer, form a fourth hole that is communicated with this third through-hole,, use for this metal level directly to be connected with this wafer by this fourth hole.
26. the manufacture method of fluid ejection apparatus as claimed in claim 15 wherein forms on this wafer after this structure sheaf, forms a third through-hole on this structure sheaf, and form an adhesion coating on this structure sheaf, it is connected with this wafer via this third through-hole.
27. the manufacture method of fluid ejection apparatus as claimed in claim 15, wherein the material of this metal level is a nickel cobalt (alloy).
28. the manufacture method of fluid ejection apparatus as claimed in claim 15, wherein the material of this metal level is a gold.
29. the manufacture method of fluid ejection apparatus as claimed in claim 15, wherein the material of this metal level is a gold cobalt alloy.
30. the manufacture method of fluid ejection apparatus as claimed in claim 15, wherein the material of this structure sheaf is a silicon nitride.
31. a fluid ejection apparatus, it comprises:
One base material has a fluid cavity and a surface;
One first through hole is arranged at this surface and is connected with this fluid cavity;
One air Bubble generating apparatus is arranged on this surface and contiguous this first through hole, and is positioned at outside the fluid cavity of this base material;
One protective layer is arranged on this surface; And
One metal level is to be positioned at that the outer mode of this fluid cavity is arranged on this protective layer and the effect that reaches heat radiation.
32. fluid ejection apparatus as claimed in claim 31 wherein forms a plurality of fins at this metal level away from a side of this substrate surface, in order to strengthen the radiating effect of this metal level.
33. fluid ejection apparatus as claimed in claim 31 also comprises:
One adhesion coating is arranged between this base material and this metal level, in order to strengthen the adhesion between this metal level and this base material.
34. fluid ejection apparatus as claimed in claim 33, wherein this adhesion coating also is a conductive layer.
35. fluid ejection apparatus as claimed in claim 31, wherein the material of this metal level is a nickel cobalt (alloy).
36. fluid ejection apparatus as claimed in claim 31, wherein the material of this metal level is a gold.
37. fluid ejection apparatus as claimed in claim 31, wherein the material of this metal level is a gold cobalt alloy.
38. fluid ejection apparatus as claimed in claim 31, wherein this base material comprises:
One silicon base; And
One structure sheaf is arranged on this silicon base, and and this silicon base between form this fluid cavity.
39. fluid ejection apparatus as claimed in claim 38 wherein forms a third through-hole, and forms a fourth hole corresponding with this third through-hole on this protective layer on this structure sheaf, by this fourth hole, use for this metal level directly to be connected with this silicon base.
40. fluid ejection apparatus as claimed in claim 38 wherein forms a third through-hole on this structure sheaf, and form a fourth hole corresponding with this third through-hole on this protective layer, and this base material more comprises:
One adhesion coating is arranged on this structure sheaf and between this protective layer and this structure sheaf, and via this third through-hole and this silicon base butt, via this fourth hole and this metal level butt, in order to strengthen being connected between this metal level and this silicon base.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02127596 CN1223460C (en) | 2002-08-01 | 2002-08-01 | Fluid jetter and producing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02127596 CN1223460C (en) | 2002-08-01 | 2002-08-01 | Fluid jetter and producing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1472073A true CN1472073A (en) | 2004-02-04 |
| CN1223460C CN1223460C (en) | 2005-10-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02127596 Expired - Fee Related CN1223460C (en) | 2002-08-01 | 2002-08-01 | Fluid jetter and producing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100389960C (en) * | 2005-06-01 | 2008-05-28 | 明基电通股份有限公司 | Method for manufacturing fluid jet equipment |
| JP2017113905A (en) * | 2015-12-21 | 2017-06-29 | キヤノン株式会社 | Recording element substrate, recording head, and recording device |
-
2002
- 2002-08-01 CN CN 02127596 patent/CN1223460C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100389960C (en) * | 2005-06-01 | 2008-05-28 | 明基电通股份有限公司 | Method for manufacturing fluid jet equipment |
| JP2017113905A (en) * | 2015-12-21 | 2017-06-29 | キヤノン株式会社 | Recording element substrate, recording head, and recording device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1223460C (en) | 2005-10-19 |
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Granted publication date: 20051019 Termination date: 20130801 |