CN1465738A - Method for treating tin soldering wettability by using cathode electric arc ion plating technology - Google Patents
Method for treating tin soldering wettability by using cathode electric arc ion plating technology Download PDFInfo
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- CN1465738A CN1465738A CNA021214190A CN02121419A CN1465738A CN 1465738 A CN1465738 A CN 1465738A CN A021214190 A CNA021214190 A CN A021214190A CN 02121419 A CN02121419 A CN 02121419A CN 1465738 A CN1465738 A CN 1465738A
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- ion plating
- arc ion
- wettability
- soldering
- tin soldering
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Abstract
The present invention relates to a method for treating soft soldering wettability for cathode arc ion plating technology, and is characterized by that the surface of the component to be soft-soldered is preplated with a layer of metal material film with good soft soldering wettability so as to make said surface have good wettability and can implement reliable connection between components by means of soft soldering process.
Description
The present invention is to use the cathodic arc ion plating technology that component are treated that surface that soldering connects carries out plated film and make it present tin soldering wettability, thereby can make originally and can't realize that soldering connected with the workpiece that soldering connects, a kind of film coating method that belongs to physical gas phase deposition technology (PVD) is an important step of soldering technology.
Known method is to utilize chemical Ni-plating layer that the treatment process of tin soldering wettability (is seen a day disclosure special permission communique A, clear 55-128571.1980,10,4 inventor's stone wells are just beautiful, Zhong Xi is permanent male) various chemical nickel plating method (seeing people such as people such as U.S.Pat4.371.573 1983,2,1 inventor Januschkowetz and U.S.Pat 4.483.711 1984,11,20 inventor Harbulak) will use expensive nickel plating solution, and unavoidably contain the objectionable impurities phosphorus of serious environment pollution, the phosphorated result also can have a strong impact on tin soldering wettability, wettability is descended, so that can not obtain reliable soldering product.Inventors such as the positive U.S. of stone well have studied phosphorus content in great detail the influence of tin soldering wettability have been pointed out, at phosphorus content less than 5% o'clock, can obtain tin soldering wettability preferably, and desire to make phosphorus content to be lower than 5%, though can use special chemical nickel-plating solution finishes, but this singular solution is compared with general chemical nickel-plating solution, and the cost height yields poorly.So this inventor is placed on general chemical Ni-plating layer in 300-600 ℃ the air furnace and heat-treats, so that make its dephosphorization.Result not only complex process but also Application Areas is narrow, to much not bearing the workpiece of 300--600 ℃ of Temperature Treatment, can not be suitable for as Al system workpiece.
Task of the present invention is to create a kind of treatment process of using the cathodic arc ion plating technology to tin soldering wettability.According to this method, technological process is carried out under vacuum, does not use the solution of any environmental pollution, can plate the good material of any tin soldering wettability, as nickel, copper etc., and can accomplish not contain hazardous substance phosphorus, boron, and cost is low, is suitable for suitability for industrialized production.
Task of the present invention is undertaken by following program: at first the workpiece surface for the treatment of soldering is cleaned out and dewatered, be fixed in then on the special-purpose work rest, pack in the vacuum chamber of cathodic arc ion plating film machine, close door for vacuum chamber, vacuum chamber is carried out exhaust find time, reach 100-10 in vacuum
-2During Pa, feed an amount of argon gas, vacustat in a certain process value, light cathode arc and make mould material evaporation and ionization, work rest rotates simultaneously thereupon, add the negative bias that 0-600 lies prostrate to workpiece, make the steam of mould material and ion under electromagnetic field and self-diffusion, fly to surface filming to be plated.
The present invention compares with currently known methods has environmentally safe, and coating does not contain harmful impurity, the tin soldering wettability height, and simple and reliable process, cost is low, is suitable for advantages such as suitability for industrialized production.And the wettability skin-material is not limited only to nickel, also can use other wettabilitys good, and the mould material that cost is low is as copper etc.
As example of the present invention, can carry out the processing of tin soldering wettability to the soldering surface for the treatment of of a large amount of split unit-welded Aluminium Radiators that use in the computer industry.
This scatterer is made up of the wing 1 of scatterer and the base plate 2 of scatterer as shown in drawings, and the material of scatterer is Al, can not soldering between the wing and the base plate, can only connect with soldering.The wing of Al material can not bear the temperature more than 300 ℃, otherwise the wing can soften, so that can not keep the perfect form of scatterer, can not use the treatment process of the tin soldering wettability of the chemical Ni-plating layers that the author invented such as the positive U.S. of stone well.According to the present invention, can be the base plate of the wing of scatterer and scatterer through special mould clamp, shelter from do not need surface that wettability handles after, the internal diameter of packing into is Φ 1800mm, length is in the vacuum chamber of cathodic arc ion plating film machine of 3500mm, closes door for vacuum chamber, vacuum chamber is carried out exhaust find time.When vacuum tightness reaches 10
-2Behind the Pa, in vacuum chamber, charge into the argon gas of 300-400SCCM, vacuum tightness is maintained 3 * 10
-1Pa, the starter cathode arc source is lighted the nickel cathode electric arc of Φ 100 diameters, and steam and nickel ion that the nickel cathode discharge is produced are issued to the nickel dam that the scatterer workpiece surface formation with negative 100 volts bias voltages has tin soldering wettability at the environment of electromagnetic field and diffusion.Coating process is controlled workpiece temperature, makes it 300 ℃ of following film forming.After the short period of time cooling, to the vacuum chamber inflation, when reaching the stove inside and outside air pressure balance, open door for vacuum chamber, take off workpiece, remove jig, the soldering streamline of packing into uses the tin cream of COBAR board, finishes the flow process of soldering.According to the above-mentioned technical process that exemplifies, scatterer shown in the drawings is carried out soldering, when the lower surface area 3 of scatterer is 90 * 60mm
2The time, its tensile strength proves that greater than 50Kg tin soldering wettability is good.
Claims (5)
1. use the cathodic arc ion plating technology to be to the treatment process of tin soldering wettability, treat the soldering surface to what desire adopted part that soldering connects or parts, adopt technology plating one deck tin soldering wettability good metal material film of cathodic arc ion plating in advance, realize soldering by the soldering technical process again.
2. according to claim 1, using the cathodic arc ion plating technology is that treating processes will be finished in cathodic arc ion plating film machine to the characteristics of the treatment process of tin soldering wettability.Coating process passes to the negative voltage that 0-600 lies prostrate on the workpiece to be plated, vacuum tightness is at 100Pa-10
-2Between the Pa, working gas is an argon gas.
3. according to claim 1, use the cathodic arc ion plating technology to be to the characteristics of the treatment process of tin soldering wettability, arc cathode can be cylindrical, annular, rectangle and former tubular, material is nickel or copper.
4. according to claim 1, use the cathodic arc ion plating technology to be to the characteristics of the treatment process of tin soldering wettability, the processed part or the material of parts can be that any tin soldering wettability is bad, can't directly realize the material of soldering technology, as aluminium, titanium etc.
5. according to claim 1, use the cathodic arc ion plating technology to the characteristics of the treatment process of tin soldering wettability to be, the cathodic arc ion plating technology of indication also comprises electric arc agglutinating sputtering method (being called for short the ABS method) and sputter and electric arc layering alternative method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021214190A CN1306060C (en) | 2002-06-21 | 2002-06-21 | Method for treating tin soldering wettability by using cathode electric arc ion plating technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB021214190A CN1306060C (en) | 2002-06-21 | 2002-06-21 | Method for treating tin soldering wettability by using cathode electric arc ion plating technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1465738A true CN1465738A (en) | 2004-01-07 |
| CN1306060C CN1306060C (en) | 2007-03-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CNB021214190A Expired - Fee Related CN1306060C (en) | 2002-06-21 | 2002-06-21 | Method for treating tin soldering wettability by using cathode electric arc ion plating technology |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101700592B (en) * | 2009-11-27 | 2011-08-03 | 哈尔滨工业大学 | Method for soldering specific metal difficult to solder by ion injection deposition pretreatment |
| CN103143801A (en) * | 2011-12-06 | 2013-06-12 | 中国科学院电子学研究所 | Surface treatment method before brazing space traveling-wave tube collector and radiator |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0627422A (en) * | 1992-07-09 | 1994-02-04 | Yoshioka Megane Kk | Method for joining spectacle frame and spectacle frame member |
| JPH0748667A (en) * | 1993-08-04 | 1995-02-21 | Mitsubishi Materials Corp | Sputtering target having high joining strength |
| US5550398A (en) * | 1994-10-31 | 1996-08-27 | Texas Instruments Incorporated | Hermetic packaging with optical |
| CN1129678C (en) * | 2000-04-28 | 2003-12-03 | 大连理工大学 | Electric arc ion-plating deposition technology of titanium niobium nitride superhard gradient film |
-
2002
- 2002-06-21 CN CNB021214190A patent/CN1306060C/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101700592B (en) * | 2009-11-27 | 2011-08-03 | 哈尔滨工业大学 | Method for soldering specific metal difficult to solder by ion injection deposition pretreatment |
| CN103143801A (en) * | 2011-12-06 | 2013-06-12 | 中国科学院电子学研究所 | Surface treatment method before brazing space traveling-wave tube collector and radiator |
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| Publication number | Publication date |
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| CN1306060C (en) | 2007-03-21 |
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