CN1452283A - 激光器引脚和底座的封装结构及其封装方法 - Google Patents
激光器引脚和底座的封装结构及其封装方法 Download PDFInfo
- Publication number
- CN1452283A CN1452283A CN 02108878 CN02108878A CN1452283A CN 1452283 A CN1452283 A CN 1452283A CN 02108878 CN02108878 CN 02108878 CN 02108878 A CN02108878 A CN 02108878A CN 1452283 A CN1452283 A CN 1452283A
- Authority
- CN
- China
- Prior art keywords
- base
- pin
- laser
- holes
- encapsulating structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Landscapes
- Semiconductor Lasers (AREA)
Abstract
Description
Claims (15)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02108878 CN1253982C (zh) | 2002-04-20 | 2002-04-20 | 激光器引脚和底座的封装结构及其封装方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN 02108878 CN1253982C (zh) | 2002-04-20 | 2002-04-20 | 激光器引脚和底座的封装结构及其封装方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1452283A true CN1452283A (zh) | 2003-10-29 |
CN1253982C CN1253982C (zh) | 2006-04-26 |
Family
ID=29220788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN 02108878 Expired - Fee Related CN1253982C (zh) | 2002-04-20 | 2002-04-20 | 激光器引脚和底座的封装结构及其封装方法 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN1253982C (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110867722A (zh) * | 2018-08-27 | 2020-03-06 | 肖特股份有限公司 | 具有由玻璃制成的馈通件的to封装件 |
US11088096B2 (en) | 2017-10-09 | 2021-08-10 | Schott Ag | Transistor outline housing with high return loss |
-
2002
- 2002-04-20 CN CN 02108878 patent/CN1253982C/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11088096B2 (en) | 2017-10-09 | 2021-08-10 | Schott Ag | Transistor outline housing with high return loss |
CN110867722A (zh) * | 2018-08-27 | 2020-03-06 | 肖特股份有限公司 | 具有由玻璃制成的馈通件的to封装件 |
CN110867722B (zh) * | 2018-08-27 | 2021-08-17 | 肖特股份有限公司 | 具有由玻璃制成的馈通件的to封装件 |
US11256048B2 (en) | 2018-08-27 | 2022-02-22 | Schott Ag | Transistor outline package with glass feedthrough |
Also Published As
Publication number | Publication date |
---|---|
CN1253982C (zh) | 2006-04-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN102299132B (zh) | 半导体装置用封装及其制造方法、以及半导体装置 | |
CN102683561B (zh) | 光学元件,含有该元件的光电器件及其制备 | |
CN101132044B (zh) | 半导体发光器件封装方法以及模制的半导体发光器件条 | |
CN102598345B (zh) | 具有保护覆盖物的oled器件 | |
US6802929B2 (en) | Process for transmission laser welding of plastic parts | |
US5516727A (en) | Method for encapsulating light emitting diodes | |
US7256428B2 (en) | Optoelectronic component and method for the production thereof | |
JP6316403B2 (ja) | 発光材料を有する気密封止された照明装置及びその製造方法 | |
CA2229570A1 (en) | Optical coupling system using gel resin and the mounting structure | |
US20140004633A1 (en) | Method for manufacturing led package | |
US20090127690A1 (en) | Package and Manufacturing Method for a Microelectronic Component | |
CN102299125A (zh) | 半导体装置用封装及其制造方法、以及半导体装置 | |
CN102447042A (zh) | Led封装结构及制程 | |
CN1253982C (zh) | 激光器引脚和底座的封装结构及其封装方法 | |
JPH06204622A (ja) | 光モジュールおよびカプセル封止方法 | |
CN100487933C (zh) | 发光二极管的封装结构及其封装方法 | |
CN2548330Y (zh) | 激光装置的引脚和底座封装结构 | |
CN103337496B (zh) | 基于双面硅基板的led集成封装结构及制作方法 | |
CN103078064A (zh) | 一种oled面板封装结构及封装方法 | |
CN204927324U (zh) | 照明装置 | |
GB2452121A (en) | Packaging structure of a light emitting diode | |
CN206524346U (zh) | 一种带有独立碗杯的氮化铝陶瓷基板led光源 | |
CN205809436U (zh) | 自发光激光匀光管 | |
US20070117248A1 (en) | Method for the production of light-emitting semiconductor diodes | |
WO2017126094A1 (ja) | 積層造形物およびそれを有する機器ならびに造形方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Ambit Electronics (Zhongshan) Co., Ltd. Assignor: Foxconn (Kunshan) Computer & Connectors Co., Ltd.|Hon Hai Precision Industry Co., Ltd. Contract fulfillment period: 2007.1.1 to 2013.1.1 contract change Contract record no.: 2009990000150 Denomination of invention: Laser pin and base packaging structure and packaging method Granted publication date: 20060426 License type: Exclusive license Record date: 2009.3.4 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2007.1.1 TO 2013.1.1; CHANGE OF CONTRACT Name of requester: GUOJI ELECTRONICS (ZHONGSHAN) CO., LTD. Effective date: 20090304 |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20060426 Termination date: 20130420 |