CN1450851A - Positioning method for support pin of printed circuit board - Google Patents
Positioning method for support pin of printed circuit board Download PDFInfo
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- CN1450851A CN1450851A CN 02108830 CN02108830A CN1450851A CN 1450851 A CN1450851 A CN 1450851A CN 02108830 CN02108830 CN 02108830 CN 02108830 A CN02108830 A CN 02108830A CN 1450851 A CN1450851 A CN 1450851A
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- thimble
- circuit board
- printed circuit
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Abstract
A positioning method includes the following steps: selecting a piece of printec circuit board product which is the same as the printed circuit board to be produced, confirming support points on the selected printed circuit board, making the positioning hole at each support point to build punching template, placing the punching template at normal position of production device, placing a centre under each positioning hole of the punching template to make centre of centre support end to point at centre of circle of relevant positioning hole and to fix it on centre fixing desk by magnetic force, moving the upnching template away and obtaining support centre for the printed circuit board with accurate positioning.
Description
Technical field
The present invention relates to field of printed circuit board fabrication, more particularly, relate to the localization method of the support pin of printed circuit board in a kind of SMT of being used for (Surface Mounting Technology, surface installation technique) technology.
Background technology
Continuous development along with science and technology, in electronic equipments such as various controls, communication, it is also more and more higher to stencil the printed circuit board complexity, therefore in the printing with paste operation of SMT, support requirement to printed circuit board (PCB) is also just more and more higher, often has following problem in the prior art:
When 1, producing complicated double-sided printed-circuit board, there often have soldering paste to scrape on the steel mesh to be unclean, needs debugging repeatedly, wasted a large amount of production times;
2, Yin Shua solder paste thickness is blocked up or thin excessively, causes occurring connecting after reflow ovens tin or few tin;
3,,, may cause the damage of printed circuit board (PCB), scraper and steel mesh because passive thimble pushes up components and parts for double-sided printed-circuit board.
Along with the increase of printed circuit board (PCB) complexity, above-mentioned three problems become more and more outstanding, more and more obvious.
Wherein a kind of support scheme of the prior art is to adopt special-purpose support fixture to come supporting printing board, may further comprise the steps: at first determine overall dimension, promptly determine the overall dimension of support fixture, for example length according to the structure of the TABLE platform of printing machine; Be to determine the Support Position then, promptly according to the layout of device on CAD (computer-aided design) drawing, selection proper supporting point also marks on drawing; Be the anchor clamps processing at last, promptly process this anchor clamps according to design drawing.
The advantage of this support scheme is that support effect is good and standardization is good, but has following shortcoming: first versatility is poor, and each anchor clamps is only applicable to a kind of product; It two is bad adaptability, because different printing machine Table platform structure differences, these anchor clamps are only applicable to one type printing machine, for the printing machine of different model, needs the different special-purpose support fixture of design; It three is to cost an arm and a leg, and particularly for some complicated printed circuit board (PCB), the manufacturing cost of anchor clamps is up to thousands of even up to ten thousand yuans.
Another kind of support scheme of the prior art is the Formflex (flexible thimble bracing or strutting arrangement) that adopts DEK (can) company to provide.Its operation principle as depicted in figs. 1 and 2, each thimble 2 among the figure is to be controlled by the oil pressure in the oil pocket of oil storage body 1, each thimble is equivalent to the piston of the moving cylinder of an oil, their bottom is connected together, so this bracing or strutting arrangement is the printing of the printed circuit board (PCB) of arbitrary shape at the bottom of being declared to be applicable to supporting bracket, the reverse side that is specially adapted to the face that is printed of printed circuit board (PCB) also has the situation of SMD devices such as (surface patch devices).
If adopt this bracing or strutting arrangement, when changing the line of production, need to be provided with once at every turn, as shown in Figure 1, on steel mesh 4, add a specialized apparatus template 3 before being provided with, require it to be close to steel mesh 4; Use single-step mode (Step Mode) operation then, one printed circuit board 7 of clamping in orbit, make it to rise to printing height (Print Height), open switch is set, promote the oil pocket that oil 6 in the oil storage body 1 is filled into each thimble 2 places by the air pressure in the machine, thimble is risen, contact with components and parts 8 at the bottom of the bottom of the printed circuit board (PCB) 7 of correspondence position, the plate or steel mesh 4 respectively, therefore the time template 3 is set and pushes down steel mesh 4, so the thrust of thimble 2 will make it to present level; Continue to increase air pressure when the pressure of each thimble reaches 250gf, cut off with outside, stop oil-filledly, finish whole setting up procedure by the oil pocket of valve 5 with oil storage body 1.Wherein the active force of thimble 2 is shown in the arrow that makes progress among the figure, and the active force that template 3 is set is shown in arrow downward among the figure.
As shown in Figure 2, when normal printing, take away template 3 is set, put other printed circuit board (PCB) of same model, move on steel mesh 4 with the scraper 9 of slightly being longer than printed circuit board (PCB), soldering paste is printed onto on the printed circuit board (PCB) 7 through the aperture on the steel mesh 4, and the oil of oil pocket can not increase yet and can not flow out this moment, so its pressure remains unchanged.The advantage of this scheme is applicable to any product, but has following shortcoming:
1, the solder paste thickness after the printing differs, and especially printed circuit board (PCB) is hour even more serious, and the printed circuit board (PCB) minimum dimension that this bracing or strutting arrangement is suitable for is 38mm*50mm, and full-size is 254mm*508mm;
If 2 thimbles just in time withstand the IC pin at the bottom of the plate, the IC pin there is certain injury;
3, as shown in Figure 2, in the periphery of printed circuit board (PCB) 7, because the active force of thimble 2 is greater than the active force of steel mesh 4, steel mesh can produce distortion;
4, expense is higher, is that a printing machine configuration Formflex needs 1.4 ten thousand dollars, and 14 printing machines need increase by ten thousand dollars of equipment investment 14 * 1.4=19.6;
5, be only applicable to DEK265 Infinity printing machine, be not suitable for DEK265 GS/GSX, the printing machine of other models such as MPM.
Summary of the invention
The technical problem to be solved in the present invention is, at the above-mentioned defective of printed circuit board supports scheme in the existing SMT technology, provides a kind of method of placing the printed circuit board (PCB) thimble exactly by the punching locating template.
The localization method of the support pin of printed circuit board in the technical solution of the present invention may further comprise the steps:
A, choose a finished product printed circuit board (PCB) identical with printed circuit board (PCB) to be produced;
B, on selected printed circuit board (PCB), determine the strong point;
C, make location hole, make punching template at described each strong point place;
D, described punching template put into the normal position of production equipment;
E, under each location hole of described punching template, place a thimble, make the center of circle of the corresponding location hole of centrally aligned of described thimble support end, and be fixed on the thimble fixed station by magnetic force;
F, take punching template away, obtain the support pin of printed circuit board of accurate positioning.
The printed circuit board (PCB) that wherein is used to make punching template can be chosen finished product printed circuit board (PCB) or the making brassboard of scrapping identical with printed circuit board (PCB) to be produced.
In method of the present invention, determine the strong point according to the following steps: on printed circuit board (PCB), draw the horizontal and vertical bisector of spacing, again in the edges of boards line of 8mm place, the edge of distance printed circuit board (PCB) picture perpendicular to the track limit less than 70mm; At proximal most position place, crosspoint, choose and mark out the strong point of no components and parts in the radius 5mm scope apart from described horizontal line, vertical line and edges of boards line.If can't select the strong point of no components and parts in the radius 5mm scope, can also choose and mark out the special strong point of no components and parts in the radius 4mm scope.If have through hole to reflux and Fine Pitch (close spacing) device, then need to increase in its lower section the strong point; If the distance between selected adjacent two strong points greater than 100mm, then also need increase a strong point between described two strong points.
In method of the present invention, described thimble is rank shape structures, comprises support end and the bigger base of diameter that diameter is less.
In method of the present invention, punch according to the following steps: all supporting point positions of mark on printed circuit board (PCB), drill diameter are approximately greater than the small through hole of described thimble support end diameter; In all the other small through hole positions except that the edge and the special strong point on the printed circuit board (PCB), drill diameter approximately greater than the diameter of described thimble base and with described small through hole concentric large through-hole.
In method of the present invention, for the thimble below the large through-hole, place according to the following steps: get the support end that a locator entangles described thimble, its support end is stretched out by the flange end of locator; Catch the extension of described thimble support end, allow thimble pass large through-hole on the punching template, till locator is printed circuit board and blocks; Unclamp the extension of described thimble support end, allow thimble freely fall on the thimble fixed station; The vertical locator that takes out.The external diameter of wherein said locator equals or approximately greater than the base diameter of described thimble and less than the diameter of described large through-hole, greater than the diameter of described thimble support end, the length of described locator is provided with defining flange less than the support end length of described thimble and at tail end to the internal diameter of described locator approximately.
In method of the present invention, for the described small through hole of edges of boards and special supporting point position, thimble is put on the fixed station moves, until the center of the support end centrally aligned small through hole of thimble.
Utilize method of the present invention to determine and the placement thimble to have advantages such as support effect is good, quick, flexible, low cost, can improve the printing with paste quality, enhance productivity.
Description of drawings
Fig. 1 is the schematic diagram when carrying out initial setting up with the Formflex of DEK company device;
Fig. 2 is the schematic diagram when adopting the DEK Formflex of company device to come supporting printing board;
Fig. 3 is a schematic diagram of determining the strong point in the method for the present invention on template;
Fig. 4 is the profile of locator among the present invention;
Fig. 5 is the profile of stairstepping thimble among the present invention;
Fig. 6 is the cross section view when utilizing punching template of the present invention and locator to place thimble;
Fig. 7 is that the thimble shown in Fig. 6 is placed and takes away the later vertical view of locator.
Embodiment
The invention will be further described below in conjunction with drawings and Examples.
One, chooses template
Can choose finished product printed circuit board (PCB) or the making brassboard identical scrapped with printed circuit board (PCB) to be produced.Require preferably to be welded with on the circuit board all devices on the normal production board, circuit board has certain intensity, and distortion and difficult the generation are not out of shape.
Two, determine the strong point
1, at first according to the information in the technological procedure, determines whether to print glue, if seal glue is then determined supporting point position at the TOP face, if perfecting tin is then determined supporting point position at the BOTTOM face.
2, draw on printed circuit board (PCB) laterally and vertical bisector with ruler and color pencil with reference to table 1 according to printed circuit board sizes, the spacing between adjacent two lines of the principle of five equilibrium is drawn the edges of boards line perpendicular to the track limit again less than 70mm, edges of boards linear distance edges of boards 8mm.When advancing the plate direction when uncertain, four edges of boards all need the drawing board sideline, so that determine the strong point in next step.
The five equilibrium mode of table 1-different size circuit board
| Length (width) size (mm) | ???421-490 | ???351-420 | ???281-350 | ??211-280 | ???141-210 | ???≤140 |
| Five equilibrium | Seven five equilibriums | Six five equilibriums | Five five equilibriums | The quartering | Trisection | Halve |
3, at proximal most position place, crosspoint, be the check measurer of 10mm, choose and mark out the strong point of no components and parts in the radius 5mm scope by internal diameter apart from described horizontal line, vertical line and edges of boards line.If components and parts are arranged comparatively dense on the printed circuit board (PCB), can't select the strong point of no components and parts in the radius 5mm scope, the point that can also choose and mark out the interior no components and parts of radius 4mm scope is as the special strong point, and makes strong point mark with another color.
If the spacing between the 4 determined two adjacent strong points greater than 100mm, then need increase a strong point again between two strong points; If have through hole to reflux and Fine Pitch device, should consider to increase in its lower section the strong point.
5, determine after the strong point center, make a mark in strong point center with color pencil.Be illustrated in figure 3 as the printed circuit board (PCB) of a 420*350mm, herein with its length six five equilibriums, width five five equilibriums, supporting point position are near the dot in crosspoint among the figure.
Three, make location hole
1, as shown in Figure 5, the support end diameter of used stairstepping thimble 22 is 4mm in the present embodiment, base diameter is 19mm, therefore earlier be that little drill bit all strong point mark positions on printed circuit board (PCB) of 4.2mm drill through the hole with diameter, and at special mark of next door work of the aperture of the special strong point.
2, except the position of the edges of boards and the special strong point, the equal drill diameter in remaining position is the through hole of 20mm, and the wherein special strong point not drill diameter is that the through hole of 20mm is to cause deviation for fear of placing in the step at the thimble of back.
Earlier drill bit is reduced to printed circuit board (PCB) upper surface 5mm place when 3, holing, aperture on the mobile printing circuit board again, when aperture centrally aligned bit central position, fix printed circuit board (PCB) with briquetting, open the drilling machine start button, then drill bit is pressed on the surface of printed circuit board (PCB) gently, in the boring procedure, should notice that the strength that presses down is not too big, after the hole is drilled through, drill bit is lifted to initial position the powered-down switch.
4, after all Kong Jun finish, remove burr on the plate face with file, with clear water template is cleaned up again.
Four, place thimble
Among the present invention, be in the center in hole in order to ensure the support end of thimble, designed a kind of locator 21 as the auxiliary instrument of establishing of placing thimble, its structure as shown in Figure 4, the external diameter of locator equals or approximately greater than the base diameter of described thimble and less than the diameter of described large through-hole, greater than the diameter of described thimble support end, the length of locator is provided with defining flange less than the support end length of described thimble and at tail end to the internal diameter of locator approximately.
When placing thimble, earlier with punching template 23 normal placements of making in orbit, for large through-hole, as shown in Figure 6, by locator 21 thimble is placed downwards from the location hole of punching template 23, get the support end that a locator entangles described thimble earlier, its support end is stretched out by the flange end of locator; Catch the extension of described thimble support end then, allow thimble pass large through-hole on the punching template, till locator is printed circuit board and blocks; Unclamp the extension of described thimble support end, allow thimble freely fall to and be fixed on the thimble fixed station 24 by magnetic force; The last vertical locator that takes out, the thimble that places as shown in Figure 7.
For the small through hole of edges of boards and special supporting point position, then can not adopt locator, move but thimble is put on the fixed station, till the center of the support end centrally aligned small through hole of thimble.
With method of the present invention compared with prior art, have the following advantages: be applicable to any printing machine, chip mounter also can use, and Formflex is only applicable to DEK265 INFINITY; Low price because utilize the print circuit plates making of scrapping, is made quick, simple; Use locating template among the present invention, can avoid thimble to touch components and parts and cause damage; Operation fast, conveniently, simply.
Claims (10)
1, a kind of localization method of support pin of printed circuit board is characterized in that, may further comprise the steps:
A, choose a finished product printed circuit board (PCB) identical with printed circuit board (PCB) to be produced;
B, on selected printed circuit board (PCB), determine the strong point;
C, make location hole, make punching template at described each strong point place;
D, described punching template put into the normal position of production equipment;
E, under each location hole of described punching template, place a thimble, make the center of circle of the corresponding location hole of centrally aligned of described thimble support end, and be fixed on the thimble fixed station by magnetic force;
F, take punching template away, obtain the support pin of printed circuit board of accurate positioning.
2, method according to claim 1 is characterized in that, in described step a, can choose finished product printed circuit board (PCB) or the making brassboard identical with printed circuit board (PCB) to be produced scrapped.
3, method according to claim 1 is characterized in that, in described step b, determines the strong point according to the following steps:
On printed circuit board (PCB), draw the horizontal and vertical bisector of spacing, again in the edges of boards line of 8mm place, the edge of distance printed circuit board (PCB) picture perpendicular to the track limit less than 70mm;
At proximal most position place, crosspoint, choose and mark out the strong point of no components and parts in the radius 5mm scope apart from described horizontal line, vertical line and edges of boards line.
4, method according to claim 3 is characterized in that, if can't select the strong point of no components and parts in the radius 5mm scope, can also choose and mark out the special strong point of no components and parts in the radius 4mm scope.
5, according to claim 3 or 4 described methods, it is characterized in that,, then need to increase in its lower section the strong point if there is through hole to reflux and close spacing device; If the distance between selected adjacent two strong points greater than 100mm, then also need increase a strong point between described two strong points.
6, device according to claim 1 is characterized in that, described thimble is rank shape structures, comprises support end and the bigger base of diameter that diameter is less.
7, device according to claim 5 is characterized in that, in described step c, punches according to the following steps:
All supporting point positions of mark on printed circuit board (PCB), drill diameter are approximately greater than the small through hole of described thimble support end diameter;
In all the other small through hole positions except that the edge and the special strong point on the printed circuit board (PCB), drill diameter approximately greater than the diameter of described thimble base and with described small through hole concentric large through-hole.
8, method according to claim 7 is characterized in that, the support end diameter of described stairstepping thimble is 4mm, and base diameter is 19mm; The diameter of described small through hole is 4.2mm, and the diameter of large through-hole is 20mm.
9, the method for stating according to claim 7, it is characterized in that, in described step e, for large through-hole, adopt a locator to place described thimble, the external diameter of described locator equals or approximately greater than the base diameter of described thimble and less than the diameter of described large through-hole, and the internal diameter of described locator is approximately greater than the diameter of described thimble support end, the length of described locator is provided with defining flange less than the support end length of described thimble and at tail end, places step and comprises:
Get the support end that a locator entangles described thimble, its support end is stretched out by the flange end of locator;
Catch the extension of described thimble support end, allow thimble pass large through-hole on the punching template, till locator is printed circuit board and blocks;
Unclamp the extension of described thimble support end, allow thimble freely fall on the thimble fixed station;
The vertical locator that takes out.
10, method according to claim 7 is characterized in that, in described step e, for the described small through hole of edges of boards and special supporting point position, thimble is put on the fixed station moves, until the center of the support end centrally aligned small through hole of thimble.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02108830 CN1200594C (en) | 2002-04-10 | 2002-04-10 | Positioning method for support pin of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 02108830 CN1200594C (en) | 2002-04-10 | 2002-04-10 | Positioning method for support pin of printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1450851A true CN1450851A (en) | 2003-10-22 |
| CN1200594C CN1200594C (en) | 2005-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 02108830 Expired - Fee Related CN1200594C (en) | 2002-04-10 | 2002-04-10 | Positioning method for support pin of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1200594C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068180A (en) * | 2011-10-21 | 2013-04-24 | 佛山市顺德区顺达电脑厂有限公司 | Device capable of precisely placing thimbles and method |
| CN109661110A (en) * | 2019-01-11 | 2019-04-19 | 歌尔股份有限公司 | A kind of localization method and its positioning device of support pin of printed circuit board |
| CN112846886A (en) * | 2020-12-31 | 2021-05-28 | 广州科源数控科技有限公司 | Hole site positioning method of machine tool based on graphic file |
-
2002
- 2002-04-10 CN CN 02108830 patent/CN1200594C/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103068180A (en) * | 2011-10-21 | 2013-04-24 | 佛山市顺德区顺达电脑厂有限公司 | Device capable of precisely placing thimbles and method |
| CN103068180B (en) * | 2011-10-21 | 2015-08-19 | 佛山市顺德区顺达电脑厂有限公司 | The device and method of accurate placement thimble |
| CN109661110A (en) * | 2019-01-11 | 2019-04-19 | 歌尔股份有限公司 | A kind of localization method and its positioning device of support pin of printed circuit board |
| CN109661110B (en) * | 2019-01-11 | 2020-08-25 | 潍坊歌尔微电子有限公司 | Positioning method and positioning device for supporting thimble of printed circuit board |
| CN112846886A (en) * | 2020-12-31 | 2021-05-28 | 广州科源数控科技有限公司 | Hole site positioning method of machine tool based on graphic file |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1200594C (en) | 2005-05-04 |
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Granted publication date: 20050504 Termination date: 20160410 |