CN1444439A - Screen sealed layer with conductive coating or equipment cover of screen wall - Google Patents
Screen sealed layer with conductive coating or equipment cover of screen wall Download PDFInfo
- Publication number
- CN1444439A CN1444439A CN03122697A CN03122697A CN1444439A CN 1444439 A CN1444439 A CN 1444439A CN 03122697 A CN03122697 A CN 03122697A CN 03122697 A CN03122697 A CN 03122697A CN 1444439 A CN1444439 A CN 1444439A
- Authority
- CN
- China
- Prior art keywords
- equipment cover
- layer
- equipment
- shielding wall
- shield gasket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/0015—Gaskets or seals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
Device housing with a shielding gasket or wall that has a conductive coating, said conductive coating being formed as a thin layer of tin or a tin alloy.
Description
Technical field
The present invention relates to a kind of equipment cover of electronic equipment, it has the shield gasket layer or the shielding wall that have conduction to apply at least, and this electronic equipment is made in a large number as telecommunication terminal equipment (particularly mobile phone) and used.
Technical background
People know, when producing the electromagnetic shielding sealant of this equipment cover, can use a lot of technology, recently a kind of what is called " distribution " technology (Dispens-Technik) wherein obtains promoting, in other words, behind the encapsulant of computer-controlled discharging shower nozzle or nozzle coating materials paste, it is carried out cure process by one.In addition, also know such shield gasket layer, these sealants are to be injected into (usually will under higher temperature) that forms in the mould by a mould that is installed in the equipment cover corresponding site and with the encapsulant of liquid or pasty.In addition, everybody also knows, the sealant of prefabricated (extruding) forms the structure of (annular) for no reason, they be installed in especially near the outer rim of equipment cover and special be arranged on the groove match there.
In order to make top said sealant have the conductivity that when carrying out the EMI shielding action, requires, same known different technology.
Widely used especially be in the encapsulant of liquid or paste, add electric conducting material (metal particularly, but also carbon and other similar substance) than granule, the ratio of additive will be enough to guarantee that sealing block has enough volume conductances.But the shortcoming of this method is, need to use a large amount of electric conducting materials, and the high-quality of one side in order to guarantee to shield, exigent compactedness, reduce influence simultaneously again as far as possible, between to find a compromise proposal raw material elasticity and compressed capability parameter.Also there is a deposition problems in this method in addition, and it may influence the applicability of the conductive seal material that is used for certain applications that is added.
Another way is exactly to be coated with the conductive sealant that last layer is made of pure encapsulant.This layer both can apply protective layer as elastomeric material of the encapsulant of an other conductive fill in the above described manner-that is to say-also can be applied with one deck simple metal thin layer.This method also exists certain defective in its various embodiment, be subjected to necessarily for the restriction that principle caused for first kind of scheme, particularly shielding action, and the metal material in second kind of scheme is then corroded and mechanical damage easily.
Summary of the invention
The objective of the invention is to, provide that a kind of cost is low, the equipment cover of the simple above-mentioned form of technology, make it satisfy requirement electromagnetic sealing degree or compatibility (EMV).
This purpose requires the equipment of the feature in 7 or 8 to realize according to the equipment cover of the feature of a first aspect of the present invention by having claim 1 with according to of the present invention second relatively independent aspect by the cum rights profit.Dependent claims relates to favourable concrete schemes more of the present invention.
Solution according to first aspect above-mentioned, an equipment cover is provided, even its EMI shielding around environment very under the condition of severe-such as in outdoor application, with under chemical corrosivity atmosphere, perhaps when often opening and closing equipment cover, higher durable/stability can be arranged also.In addition, the cost of producing the shield gasket layer is low, and technology is simple, thereby has reduced the cost of entire equipment cover.
Use tin and the plumbous ashbury metal that mixes in the preferred embodiment on this meaning of the present invention, wherein lead content is very low, and quality is particularly than being less than 5%.This alloy composition is different with the general soldering alloy composition that uses, no matter be that shielding all is fit closely for EMI aspect conductivity or aspect machinery and serviceability.
In the cost form of implementation that slightly height but shielding character are good especially, conductive coating has a metal that has a high conduction performance-especially copper or the basal layer of copper alloy-composition and the double-decker that is made of as protective layer the thin layer that tin or ashbury metal are formed.Thus, the basal layer with highly conductive performance can make the shield gasket layer advantageously reduce sheet resistance, and protective layer then makes whole coating have very high chemistry and physical property.
In a further advantageous embodiment, the gross thickness of conductive coating is between 0.5 μ m to 10 μ m.Although as special purpose the time thicker coating can be arranged, top said this coating layer thickness can reach desired EMI characteristic when using for standard fully, and relatively saves material, and cost is also corresponding lower.
In the significant form of implementation of another one of the present invention, shield gasket layer or shielding wall are to be formed by a kind of elastomer that is distributed on the substrate.This allows specially the shield gasket layer of being with smaller cross-sectional area to be carried out favourable processing in miniaturized electronics, and this elastomer also makes sealant have extraordinary mechanical stability simultaneously.
Substrate is certain part of equipment cover normally, it can itself be made by metal group, form the gauze screen of sealing, or carry out metalized coatedly, at this moment the conductive surface of shield gasket layer has the part of the equipment cover of shielding action to be connected with another one equally.But this substrate-or at that and the contacted equipment unit of shield gasket laminar surface on its opposite-be a parts substrate (particularly printed circuit board (PCB)).
If have " shielding wall " that applies according to top scheme in the equipment cover, this shielding wall advantageously is made up of the elastomer or the higher elastomer (it highly is at least the twice of width) of independent one deck of a lot of bar mutual superposition so.Such shielding wall has in the above for the described advantage of shield gasket layer of distributing.The method of the inside of equipment cover being separated by the shielding wall that forms by this way can make the structure of modification of equipment cover simple and rapid in addition, because like this when the structure of reforming equipment cover, do not need to change mould and basically only need to known distributing equipment and to apply the equipment reprogramming of above-mentioned conductive layer just passable.
According to an apparent in view aspect of the present invention, shield gasket layer or shielding wall are made of a kind of thermoplasticity or thermoset plastics polymer substantially.This polymer satisfies necessary mechanical seal effect under structural environment by the suitable additive (plasticizer etc.) that influences physical characteristics such as elasticity and compressibility, the substrate of the coating of being mentioned above also being suitable as very much simultaneously with shielding action.
When making particularly shield gasket layer or the sealed wall relevant with the method for die casting in a preferred embodiment, just have more advantage so technically with baseplate material.Because so, just can save the independent process of making shield gasket layer or sealed wall basic configuration, thereby further save the cost of production equipment cover.
If desired, the material that uses when shield gasket layer or sealed wall has electric conducting material, particularly during the filler of Dao Dian metal and/or carbon granule, so the shielding action of the shield gasket layer of the equipment cover of aforesaid way or shielding wall will further improve-will use more electric conducting material so certainly, and expense has also improved with regard to corresponding.
The conductive coating of top tin of mentioning or ashbury metal by a vacuum covering layer process-particularly as vacuum evaporation rete or sputtering layer-can produce with constant quality with high industrial.Also can use the spraying coating (under atmospheric pressure producing) of " tradition ".The last coating processes that is used for metallized or metallic layer that also can use other is as electroplating or immersion plating.
Here said equipment cover is mobile radio terminal equipment or other telecommunication terminal equipment or form the EMI source or to the parts of this responsive mobile radio network (particularly base station), also can be that EMI is disturbed responsive data communication or the data processing equipment or the part of these equipment particularly.It also can be equipment and radio navigation device and other equipment that is used for sensing technology, operation measuring technology and process control technology field in addition.
Brief description of drawings
From the preferred embodiments of the present invention of following concise and to the point narration and various aspects its advantage and applicability as can be seen.Wherein two schematic diagrames have drawn respectively:
Fig. 1: the cross section schematic diagram of equipment cover according to a first embodiment of the invention and
Fig. 2: according to the cross section schematic diagram of the equipment cover of second embodiment of the present invention.
The description of embodiment
Shown in Fig. 1 is a cross section part of equipment cover 10, this equipment cover by metal for example the aluminium flake of deep-draw make, equipment cover respectively has a shell 12 and 11 up and down, and they link together by the fastener means of not representing in the drawings (as screw or card/joint connection).In a fringe region of equipment cover 10, on the shell 11 and 12 a dogleg section 11a and 12a are arranged respectively also, between these two dogleg section, insert an equipment cover outer containment layer 13 that plays shielding action.
This outer containment layer 13 of equipment cover by two mutual superposition the elastomer layer 14a and the 14b that are assigned to above the dogleg section 11a of the shell 11 below the equipment cover constitute.Wherein Xia Mian elastomer 14a tightly is attached on the surface of equipment cover hypostratum 11, and top elastomer 14b is owing to be directly to overlay above the 14a after below the elastomer 14a moulding, so as one man link to each other with its material.At first place a thin layer made of copper above the basic seal 14a/14b as basal layer 15 at this then with high conduction performance; then place a protective layer 16 that is made of the ashbury metal that contains a small amount of lead more in the above, these two layers all apply with the high vacuum coating processes.The thickness of basal layer 15 and protective layer 16 is according to the requirement of the deformability of equipment cover outer containment layer 13 and its shield effectiveness determined; while is according to the concrete application target of equipment cover 10; fully take into account the durable/stability that is subjected to surrounding environment influence (humidity, salt solution etc.) of equipment cover.
Fig. 2 schematically illustrates a cross-sectional view of a part of the equipment cover 20 that employing plastics-die casting (notes) method makes with thermoplastic polymer, wherein, only expresses a lower casing part 21 that has vertical partition wall 22.Partition wall 22 is mechanically separated with first equipment cover zone 20A and the second area 20B of electromagnetic sealing ground with relative EMI shielding.The top of partition wall 22 is seal lip portion 23 that a cross section diminishes gradually and bending deformed, lays a printed circuit board (PCB) 24 that has electronic component on it, and the square frame below it schematically illustrates an EMI senser 25.
The first area 20A of equipment cover upwards is closed hermetically basically by face coat 26 electromagnetic grounds on the printed circuit board (PCB) 24 that electric action is arranged.And downwards and the electromagnetic shielding of side regions be that the ashbury metal layer 27 that the whole face on the surface of the left side section of the parts 21 by the equipment cover bottom and coupled partition wall 22 (left side) applies guarantees.
Form of implementation of the present invention not only is confined to these examples, improves this improvement but can have equally much to belong within the professional treatment scope.Particularly when different equipment cover structures die casting and be used in combination with the shield gasket layer of distribution with the shielding wall that equipment cover part material as one man forms in case of necessity.Similarly, having the shield gasket layer of unit piece thin layer of tinbase or shielding wall can be in same equipment cover and the two elements conductive layer combination with a basic unit (copper, silver etc.) and a tin protective layer composition.
Claims (13)
1. the shield gasket layer of conduction coating or the equipment cover of shielding wall are arranged, it is characterized by, this conductive coating is the thin layer that is made of tin or ashbury metal.
2. according to the equipment cover of claim 1, it is characterized by, ashbury metal is tin/lead alloy, and wherein Qian content is very low, and its mass ratio is particularly less than 5%.
3. according to the equipment cover of claim 1 or 2, it is characterized by, conductive coating is double-deck, comprises one by the metal of the high conduction performance basal layer that constitutes of copper or copper alloy particularly, and the protective layer thin layer that is made of tin or ashbury metal.
4. the equipment cover that one of requires according to aforesaid right is characterized by, the conductive coating gross thickness at 0.5 μ m between the 10 μ m.
5. according to the equipment cover of one of aforesaid right requirement, it is characterized by, shield gasket layer or shielding wall are made up of the elastomer that is distributed on the substrate.
6. according to the equipment cover of claim 5, it is characterized by, form basically by the elastomer of mutual superposition or one deck elastomer that total height is at least its width twice by multilayer for shielding wall.
7. particularly according to the described shield gasket layer of conduction coating or the equipment cover of shielding wall of having of one of claim 1 to 4, it is characterized by, shield gasket layer or shielding wall are made up of a kind of thermoplastic polymer basically.
8. particularly according to the described shield gasket layer of conduction coating or the equipment cover of shielding wall of having of one of claim 1 to 4, it is characterized by, shield gasket layer or shielding wall are made up of a kind of thermoset plastics polymer basically.
9. according to the equipment cover of claim 7 or 8, it is characterized by, shield gasket layer or shielding wall are particularly made with casting die relatively with baseplate material.
10. the equipment cover that one of requires according to aforesaid right is characterized by, and the material that constitutes shield gasket layer or shielding wall has by the material of band conductive capability particularly a conducting metal and/or a carbon filler that material is formed.
11. the equipment cover according to aforesaid right one of requires is characterized by, conductive coating or be protective layer at least is the evaporation rete or the sputtering layer of a vacuum.
12. the equipment cover according to one of in the claim 1 to 10 is characterized by, conductive coating is a protective layer at least perhaps, is jetted layers.
13. have equipment, it is characterized in that it is designed to long-range or data communications equipment according to the equipment cover of one of aforesaid right requirement.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE10210577 | 2002-03-11 | ||
| DE10210577.4 | 2002-03-11 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN1444439A true CN1444439A (en) | 2003-09-24 |
Family
ID=27762853
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN03122697A Pending CN1444439A (en) | 2002-03-11 | 2003-03-11 | Screen sealed layer with conductive coating or equipment cover of screen wall |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20040071970A1 (en) |
| EP (1) | EP1345486A3 (en) |
| CN (1) | CN1444439A (en) |
| DE (1) | DE10310598A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105409344A (en) * | 2013-03-12 | 2016-03-16 | 全耐塑料公司 | Box section housing motor vehicle power equipment forming electromagnetic screening |
| CN106572292A (en) * | 2016-11-10 | 2017-04-19 | 协创数据技术股份有限公司 | Panoramic camera with anti-shake function |
| CN111537042A (en) * | 2012-05-23 | 2020-08-14 | 罗斯蒙特储罐雷达股份公司 | Guided wave radar level gauge and method for determining a filling level of a product |
| CN112005623A (en) * | 2018-06-06 | 2020-11-27 | 宝马股份公司 | Method for shielding a component |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090008431A1 (en) * | 2007-07-03 | 2009-01-08 | Kossi Zonvide | Solderable EMI Gasket and Grounding Pad |
| US8570747B2 (en) * | 2008-12-04 | 2013-10-29 | Hewlett-Packard Development Company, L.P. | Carbon laminated enclosure |
| US11017820B1 (en) * | 2020-02-21 | 2021-05-25 | Seagate Technology Llc | Electromagnetic shielding for electronic devices |
| DE102022207527A1 (en) | 2022-07-22 | 2024-01-25 | Volkswagen Aktiengesellschaft | Sealing arrangement in an electronics housing |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4467002A (en) * | 1981-12-15 | 1984-08-21 | Raychem Limited | Dimensionally-recoverable article |
| US4678863A (en) * | 1985-06-27 | 1987-07-07 | Rca Corporation | Corrosion resistant conductive elastomers |
| JPH0787275B2 (en) * | 1988-10-28 | 1995-09-20 | 北川工業株式会社 | Conductive sealing material |
| US5045635A (en) * | 1989-06-16 | 1991-09-03 | Schlegel Corporation | Conductive gasket with flame and abrasion resistant conductive coating |
| US5222294A (en) * | 1990-12-03 | 1993-06-29 | Motorola, Inc. | High isolation packaging method |
| GB9111633D0 (en) * | 1991-05-30 | 1991-07-24 | Raychem Ltd | Dimensionally-recoverable article |
| DE4319965C3 (en) * | 1993-06-14 | 2000-09-14 | Emi Tec Elektronische Material | Method of manufacturing an electromagnetic shielding case |
| CA2129073C (en) * | 1993-09-10 | 2007-06-05 | John P. Kalinoski | Form-in-place emi gaskets |
| US5573857A (en) * | 1995-09-29 | 1996-11-12 | Neptco Incorporated | Laminated shielding tape |
| HUP9901617A3 (en) * | 1996-01-19 | 1999-11-29 | Tiburtius Bernd | Electrically screening housing |
| US5804762A (en) * | 1996-03-22 | 1998-09-08 | Parker-Hannifin Corporation | EMI shielding gasket having shear surface attachments |
| DE29706914U1 (en) * | 1997-04-17 | 1997-06-19 | Rehau Ag & Co | Housing part made of plastic |
| US5881945A (en) * | 1997-04-30 | 1999-03-16 | International Business Machines Corporation | Multi-layer solder seal band for semiconductor substrates and process |
| US5847317A (en) * | 1997-04-30 | 1998-12-08 | Ericsson Inc. | Plated rubber gasket for RF shielding |
| US6255581B1 (en) * | 1998-03-31 | 2001-07-03 | Gore Enterprise Holdings, Inc. | Surface mount technology compatible EMI gasket and a method of installing an EMI gasket on a ground trace |
| DE60030481T2 (en) * | 2000-02-18 | 2007-05-03 | Parker-Hannifin Corp., Cleveland | IN-SITU-PREPARATION OF AN ELECTROMAGNETIC SHIELDED SEAL WITH LOW CLOSURE POWER |
| KR20020086586A (en) * | 2000-02-28 | 2002-11-18 | 아메스 베리 그룹, 인크 | Methods and apparatus for emi shielding |
| US6541698B2 (en) * | 2001-03-13 | 2003-04-01 | Schlegel Systems, Inc. | Abrasion resistant conductive film and gasket |
| US6809254B2 (en) * | 2001-07-20 | 2004-10-26 | Parker-Hannifin Corporation | Electronics enclosure having an interior EMI shielding and cosmetic coating |
-
2003
- 2003-03-11 EP EP20030005329 patent/EP1345486A3/en not_active Withdrawn
- 2003-03-11 DE DE2003110598 patent/DE10310598A1/en not_active Ceased
- 2003-03-11 CN CN03122697A patent/CN1444439A/en active Pending
- 2003-03-11 US US10/386,368 patent/US20040071970A1/en not_active Abandoned
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111537042A (en) * | 2012-05-23 | 2020-08-14 | 罗斯蒙特储罐雷达股份公司 | Guided wave radar level gauge and method for determining a filling level of a product |
| CN111537042B (en) * | 2012-05-23 | 2022-04-08 | 罗斯蒙特储罐雷达股份公司 | Guided wave radar level gauge and method for determining a filling level of a product |
| CN105409344A (en) * | 2013-03-12 | 2016-03-16 | 全耐塑料公司 | Box section housing motor vehicle power equipment forming electromagnetic screening |
| CN106572292A (en) * | 2016-11-10 | 2017-04-19 | 协创数据技术股份有限公司 | Panoramic camera with anti-shake function |
| CN112005623A (en) * | 2018-06-06 | 2020-11-27 | 宝马股份公司 | Method for shielding a component |
| US11596089B2 (en) | 2018-06-06 | 2023-02-28 | Bayerische Motoren Werke Aktiengesellschaft | Method for shielding components |
| CN112005623B (en) * | 2018-06-06 | 2023-09-29 | 宝马股份公司 | Method for producing a vehicle chassis component |
Also Published As
| Publication number | Publication date |
|---|---|
| DE10310598A1 (en) | 2003-10-09 |
| EP1345486A2 (en) | 2003-09-17 |
| EP1345486A3 (en) | 2006-04-19 |
| US20040071970A1 (en) | 2004-04-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |