CN1444244A - Image display device and dissection processing method and element recovery method - Google Patents

Abstract

To reuse glass used in a flat panel display, processing suitable for global environment such as processing of separating a lead component must be realized. A disassembly processing method for a flat panel display having a structure in which a face plate and rear plate mainly containing glass are airtightly joined via a frame with frit glass is characterized by including the step of separating the face plate and rear plate joined with the frit glass. The separation step is characterized by separating the face plate and rear plate by cutting, dissolution, or melting.

Description

Image display device and disassembly processing method thereof and component recovery method

The application be the application number submitted to February 28 calendar year 2001 be 99810357.8 be entitled as dividing an application of " image display device and disassembly processing method thereof and component recovery method ".

The present invention relates to be used to make disassembling method by utilizing sintered glass the airtight flat-panel monitor that constitutes of combining of two substrates to be scrapped with framework for protecting the global environment; said two substrates promptly mainly contains the panel (face glass substrate) and the backboard (back side glass substrate) of glass; also relate to and utilize flat-panel monitor again; separate and reclaim the lead as the poisonous metal element of the metallic element that is used for flat-panel monitor; and utilize the method for other precious metal element and rare earth element effectively again; also relate to the method for disassembling the image processing system that welds with sintered glass and reclaiming its panel and backboard; the method that also relates to the recovery and reuse separator; from being used for by utilizing electron beam or ultraviolet radiation to apply the method that the luminous panel display apparatus of fluorescent material part or CRT (cathode ray tube) reclaim fluorescent material; the manufacture method of display unit; be suitable for removing; the image display device of disassembling and utilizing again; be used for detecting the poisonous metal amount detecting device of contained poisonous metal amounts such as waste material, be used for the fluorescent material recovery method and the device of flat panel display screen board.

Usually, majority is scrapped commercial device and is all pulverized, and for example valuable material such as metal is recovered, and all the other materials are scavenged into " burying a little of minimum control " as industrial waste, only are buried in the underground hole of digging at this this refuse.

In recent years, the deficiency of removing the some capacity becomes serious problems, and harmful substance causes environmental pollution also to become serious problems.For example, the cathode ray tube of television set has used a large amount of flint glass.Calculate according to the test of environment mechanism, scrap that institute's lead tolerance reaches 20000t every year in the cathode ray tube, most lead are buried in burying a little of minimum control.Yet the rainwater naturally osmotic is buried a little to minimum control, and these put unequipped any drainage arrangement.Have recognized that the lead as harmful substance can spread.

In this case, must rethink conventional processing method.About the cathode ray tube of television set, civil electronic device association is being ground into cathode-ray tube glass cullet (little sheet glass) and they is being applied to study aspect the cathode ray tube more.Wherein, developed from the television set main body and taken out cathode ray tube, and cathode ray tube has been ground into system's (for example, seeing " Electrotechnology " in January, 1997) of glass fragment.

The method of a kind of recovery as the glass of fragment for example disclosed among the Japanese Laid-Open Patent Application 61-50688.Also known have cathode-ray tube glass is ground into fragment (little sheet glass), and they are applied to the method (for example, Japanese Laid-Open Patent Application 9-193762) of cathode ray tube again.For example disclose among the Japanese Laid-Open Patent Application 05-185064 and a kind ofly cathode ray tube has been separated into panel and cone, and they have been pulverized fragmented method according to material.In addition, disclose among the Japanese Laid-Open Patent Application 7-037509 and a kind of cathode ray tube is separated into panel and cone, peels off fluorescent material and black matrix (blackmask), utilizes the method for panel again from panel.

For utilizing cathode-ray tube glass again, this glass must be separated into screen board glass and contain lead cone glass.This be because, if the above lead of scheduled volume is mixed in the screen board glass, the deepening phenomenon will take place, flint glass can not be again as the raw material of screen board.For this reason, cathode ray tube is separated into screen board and cone.Therefore, propose to limit the method (Japanese Laid-Open Patent Application 9-115449) of the position of cutting cathode ray tube and the sintered glass of melted join screen board and cone, separated the method (Japanese Laid-Open Patent Application 7-45198) of screen board and cone thus.

About separating with the cone of sintered glass welding and the technology of screen board, known have a disclosed technology of utilizing thermal deformation in the heat treatment to separate screen board and cone among Japanese Laid-Open Patent Application 5-151898,7-029496,9-200654 and the 9-200657.

In recent years, people hanker after using the research of cold cathode element very much.The example of cold cathode element has surface conductive type electronic emission element, field emission type electronic emission element, metal/insulator/metal mold electronic emission element.Compare with the hot cathode element, cold cathode element is emitting electrons at low temperatures.Cold cathode element is without any need for heater, and the specific heat cathode element is simple on the structure, can constitute than small components.Both just on the substrate high density many elements are set, for example problems such as heat fusing of substrate also can take place hardly.In addition, because the hot cathode element works utilizing under the condition of heater heats, so the speed of response is low, and the response speed height of cold cathode element.

In the cold cathode element, surface conductive type electronic emission element has simple structure, makes easily, allows to form on large tracts of land a large amount of elements.As disclosed among the Japanese Laid-Open Patent Application 64-31332 that the applicant applied for, developed a kind of method that is provided with and drives a large amount of elements.

About the application of surface conductive type electronic emission element, for example,, developed electric charge electron gun etc. as image processing systems such as image display device and image recording structures.

Particularly about the application in image display device, as disclosed among U.S. Pat 5066883 and Japanese Laid-Open Patent Application 2-257551 and the 4-28137, developed a kind of image display device that adopts surface conductive type electronic emission element and utilize the luminous fluorescent material combination of electron beam irradiation.Estimate to adopt this image display device of surface conductive type electronic emission element and fluorescent material combination, will show than the more excellent characteristic of conventional other types of image display unit.For example, because this image display device is the spontaneous emission type, without any need for backlight, the visual angle is wide, so be better than popular in recent years liquid crystal indicator.

The method of many field emission type electronic emission elements that a kind of driving is arranged side by side is for example disclosed in the U.S. Pat 4904895.The application of known FE type electronic emission element in image display device is the flat-panel monitor (R.Meyer: " RecentDevelopment on Micro-tips Display at LETI " of people such as R.Meyer report, Tech.Digest of 4thInt.Vacuum Micro-electronics Conf., Nagahama, pp.6-9 (1991)).

A kind of many metal/insulators that the is arranged side by side/application of metal mold electronic emission element in image display device disclosed among the Japanese Laid-Open Patent Application 3-55738.

In the image processing system that adopts electronic emission element, the thin flat plate display is saved space and in light weight, has caused the very big concern of people's notes as the substitute of cathode ray tube type image display device.

Gas-tight container inside is maintained at about 10 in the image processing system ^-6The vacuum of torr.Because the display area of image display device increases, so gas-tight container need prevent that backboard and panel are because distortion or the destruction that gas-tight container external and internal pressure difference causes.If backboard and panel are made thicklyer, can increase the weight of image display device, when diagonal is seen, can produce image fault and inconsistent.So gas-tight container generally adopts separator, each separator all by constituting than thin glass plate, is coated with antistatic film on its surface.

Except that an above-mentioned emission type electron source display (FED) and mim type display, comprise that vacuum fluorescent display (VFD), plasma display (PDP) and surface conductive type electron source display flat-panel monitors such as (SED) can both save space and in light weight, caused people's attention as the substitute of cathode ray tube type display unit.Many flat-panel monitors have been developed and have developed.

For example, the applicant has proposed several suggestions about constituting electron source and utilize the image display device of this electron source by the surface conductive type electronic emission element that many cold cloudy lattice electronic emission elements as a type are set on substrate.

For example specifically introduce the structure of surface conductive type electronic emission element among the Japanese Laid-Open Patent Application 7-235255 and utilized the structure etc. of its image display device, will do simple the introduction below.

Figure 68 A and 68B show the structure of surface conductive type electronic emission element.Reference number 411 expression substrates, 412 and 413 is a pair of element electrodes, the 414th, office has the conducting film of electron emission part 415.Substrate 411, element electrode 412 and 413, conducting film 414 and electron emission part 415 constitute electronic emission element 416.

About forming the method for electron emission part 415, be making alive between a pair of element electrode 412 and 413, make the conducting film distortion, change the part of conducting film characteristic or destruction conducting film, thereby increase resistance.This is called " playing electrical forming processing ".For utilizing this method to form the electron emission part with good electron emission characteristic, conducting film better is to be made of thin conductive particle.An example of its material is thin PdO particle.The voltage that has been used for electrical forming processing better is pulse voltage.This process technology can adopt a kind of method that applies the pulse with predetermined peak value shown in Figure 69 A or a kind of method that applies the pulse that its peak value increases gradually shown in Figure 69 B.

For forming thin conductive particle film, thin conductive particle can utilize the direct deposit of gas deposit.Owing to do not need vacuum device, thus the compound solution of conducting film composition element also can be contained with coating, and coating annealing is formed the method for the conducting film of wishing, low cost of manufacture, and can form big electron source.About applying the method for organic metal compound solution, because this method is without any need for the additional step of patterning conductive film, so wish to adopt ink discharge device only in the method that needs position coating solution.

After forming electron emission part, in containing the appropriate atmosphere of organic material, between element electrode, add pulse voltage (this will be called " activating processing ").Then, electron emission part and near the deposited film of the main carbon containing of formation, flow through the electric current of element with increase, and improve electron emission characteristic.

Then, better be to implement so-called " stabilization processes " step.In this treatment step, in heating, vacuum container and electronic emission element, keep the emptying vacuum tank,, thereby stablize the characteristic of electronic emission element with abundant removal organic substance etc.

Disclose a kind of employing ink discharge device among the Japanese Laid-Open Patent Application 8-273529, utilized surface conductive type electronic emission element to form the method for the conducting film of electron source.

To simply introduce ink discharge device below.The method of discharging China ink from ink discharge device roughly is divided into two types.According to first method, utilize the systolic pressure of the piezoelectric element that is arranged on the nozzle place, liquid is discharged as drop.This method is called the piezo jet method.In this method, conducting membrane material is stored in the print cartridge, and predetermined voltage is added on electric signal input end, cylindrical piezoelectric element is shunk, thereby liquid is discharged as drop.

According to second method, utilize the heating resistor heating liquid, make it to bubble, discharge drop.This method is called the steam bubble gunite.In steam bubble ejection-type ink discharge device, heating resistor produces heat, so that the liquid foaming, thereby discharge drop from nozzle.

Utilize this ink discharge device, only in the precalculated position as droplet applying organo-metallic compound solution.After the solution drying,, make the organo-metallic compound thermal decomposition, form conducting film by metal or metal oxide granule by heat treated.

Fig. 1 shows the structure of image display device.Among Fig. 1, reference number 1 expression backboard, the 2nd, have the panel of fluorescent film 2b, metal backing 2c etc. on the inner surface that is formed on substrate 2a, the 3rd, support frame.Backboard 1, support frame 3 and panel 2 utilize sintered glass in conjunction with also gas-tight seal, composing images display unit 15.

Wish sharply to increase flat panel display size and output with this structure.In these flat-panel monitors, the sintered glass that is used to seal is leaded.The fluorescent material 2b of effect image forming part, separator 4 etc. belong to expensive parts.Similar with cathode-ray tube glass, with regard to " harmless process technology ", " volume reduces " reached " utilizing " again, the foundation of recovery system became major issue.

To introduce problem solved by the invention in the following order below, and introduce example and the embodiment that deals with problems in proper order by this.

(problem 1) FPD has the structure that is different from cathode ray tube, needs other processing method.That is, FPD is by utilizing sintered glass, by airtight panel and the back side formation that promptly mainly contains glass in conjunction with two substrates of framework.In general, employing contains a large amount of lead compositions so that can carry out the sintered glass of low-temperature bake.

The reason identical with cathode ray tube, FPD also must be separated into glass and the flint glass that does not contain any lead, so that profit has glass again.When the parts that utilize again except that glass, must remove delead.

The invention solves the problems referred to above, its objective is provides a kind of processing method of scrapping FPD of utilizing again easily.

Another purpose of (problem 2) the present invention provides a kind of disassembly processing method, comprises as the separation/recovery method of the lead of poisonous metal and the recovery that for example alkene such as noble metal components and rare earth element has element/utilize again method.

(problem 3) owing to during making or finish useful life when producing defective and scrapping, whole display is pulverized and is scrapped, and has increased rejection number at flat-panel monitor.In recent years, produced and will reduce to minimum society need along with the refuse that industrial activity produces, utilizing again of parts become extremely urgent problem.

When constituent material contains harmful element etc., must separate harmful element.Have the expensive substrate of the normal employing of backboard of the electronic emission element of decision image display device performance, just realizing consistent element characteristic.Particularly, the element electrode that at first is formed on the backboard often is made of the strong material that can tolerate later step.

The invention solves this problem, its objective is that providing a kind of is used as the method for having scrapped the important composition composition of image display device again with backboard easily, a kind of separation/recovery method that is used for the leaded element of constituent material for example is provided, and forms the conducting film of the electron emission part that comprises a plurality of electronic emission elements that will form effectively.

(problem 4) owing to during making or finish useful life when producing defective and scrapping, whole display is pulverized and is scrapped at flat-panel monitor because constituent material contains the higher cost material, so from economic angle be do not wish such.Especially, screen board adopts many separators, because glass must form thin slice, and must form conducting film, so the manufacturing of separator needs high manufacturing cost and long time period.Even when display was scrapped owing to any reason, separator had problem seldom to become reason, and separator often can utilize without any problem again.

For this reason, in scrapping flat-panel monitor, wish separator and other isolation of components, recovery and reuse.

As mentioned above, separator is a thin plate, and is made by glass substrate, and when removing display, separator can be damaged.So, wish a kind of method that can reclaim separator of research without any damage ground.

(problem 5) in general, rare-earth element almost can't from use the back scrappage display unit reclaim.

This is owing to rare earth element used in (1) each display unit is considerably less, reclaim very difficulty, (2) rare earth element does not use as simple substance, but use as compound or alloy, so separation costs height, (3) under the situation of wishing very much, can low-cost obtain the unessential rare earth element of lower cost.

Yet, keep and stablize the angle of rare earth element source supply from environment, wish to promote the recovery of these materials.The method that reclaims rare earth element from industrial products becomes major issue.Notice that rare earth element mainly is included in the fluorescent material.

Fluorescent material also contains chromium and sulphur element, keeps angle from environment, also wishes to reclaim these elements.

On the other hand, the inner surface fineness that therefrom reclaims the panel of fluorescent material is almost completely lost.For a bit, this panel generally is ground into fragment, is buried in burying a little of minimum control, or again as glass material.In recent years, replace panel is ground into fragment, proposed a kind of method of utilizing acid treatment to make the recovery of inner surface fineness and utilizing panel again.Yet, because burying of minimum control a little has been tending towards saturated, so this method is no longer valid.In addition, acid treatment is wet treatment, with regard to cost and processing environment, does not wish like this.

Consider that above-mentioned condition made the present invention, its objective is the method that contained fluorescent material in a kind of effective recovery display unit is provided, when keeping or its inner surface fineness is restored, reclaims and utilize again panel.

(problem 6)

Have the image display device that remains below the gas-tight container under the atmospheric pressure in order to remove, to disassemble and utilizing again, must make gas-tight container inside return to atmospheric pressure.When recovering atmospheric pressure and since with gas-tight container in the pressure reduction of pressing bigger, so for example a large amount of gases such as air usually can flow into suddenly in the gas-tight container, cause the damage of gas-tight container inside or destroy gas-tight container.From security standpoint, do not wish gas-tight container is broken to the scattering fragment.When CRT was ground into fragment and is used as glass material again, this can cause serious problems.Yet, for utilizing each parts of image display device to greatest extent again, answer resource to keep, this destruction has for example not only increased refuses such as rubbish, and can waste energy and work.Particularly in FPD, introduce the members of anti-atmospheric pressure the such as many for example separators in the container.This destruction meeting major injury member of anti-the atmospheric pressure, ruined parts can damage and destroy image display device gas-tight container inside, hinder the utilization again of these parts.Because the separator side view is made evenly or is evenly scribbled the film with conductivity that the specification with image display device adapts on the separator, to prevent image fault, so the cost that separator need be higher than other parts.

The invention solves the problems referred to above, its objective is, utilize the parts of removing and disassembling again by successfully the inside of the gas-tight container of image display device emptying being returned to external pressure.

(problem 7) at flat-panel monitor owing to during making or finish useful life when producing defective and scrapping, whole display is pulverized and is scrapped, can cause environmental problem,, consider it also is bad from economic angle because the constituent material of element comprises the higher cost material.For example, screen board adopts many separators.Owing to glass dust must be broken into thin slice, and must form conducting film, so separator needs high manufacturing cost and long time period.In addition, suitably handled the part that needs to repair under this state after, can utilize backboard, panel and support frame again.

For this reason, need be without any each parts of damage ground recovery and reuse, and removing because manufacturing or reclaim resource when finishing the flat-panel monitor that produces defective useful life effectively.

The present invention also a purpose one provide a kind of safe, easily flat-panel monitor is splitted into the method for each member and be suitable for this flat-panel monitor of disassembling.

(problem 8) is when disassembling and decompose cathode ray tube, flat-panel monitor etc., for having reclaimed the refuse that stays behind each Knock-Down Component that utilizes again, must survey the poisonous metal amount quantitatively, and no matter whether residual quantity is below permissible value, must detect and the confirmation residual quantity, to prevent the pollution of the environment/to destroy.As for each Knock-Down Component that utilizes again, wish according to exist/not having lead, lead (poisonous metal) residual quantity that quantitative detection decomposes.

Be the lead in the exploring block, the detection method that adopts fluorescent X-ray etc. is arranged.Yet this method must scan the whole surface of detected parts, and by many inspected object, it is cumbersome to become for for example glass fragment etc.Inspected object is limited, can not carry out detection by quantitative, is difficult to carry out this method.

The invention solves this general issues, its objective is provides a kind of poisonous metal residual quantity checkout gear, the amount of can detection by quantitative staying the poisonous metals such as for example lead in the inspected object such as the glass component that for example decomposes or refuse, under the situation that does not limit inspected object especially, can detect, and easily when disassembling and decompose flat-panel monitor screen board etc. under the situation without any troublesome operations, can detection by quantitative poisonous metal amount.

(problem 9) is used for utilizing disassembling among treatment technology developing of flat-panel monitor screen board again, can not directly adopt conventional correlation technique.For example, if disclosed cathode-ray tube glass is disassembled treatment technology among the employing Japanese Laid-Open Patent Application 9-193762, then the weight of backboard or panel can be added on the separator 4, can damage it when separating separator 4.This technology can not be applied to disassembling of flat-panel monitor screen board.

The invention solves this general issues, its objective is provides a kind of flat-panel monitor disassembling apparatus, can utilize suitable step to disassemble processing, can be under the situation in any damage not, reclaim and directly can utilize member, and can utilize recovery part again.

The structure of (problem 10) FPD is different from the structure of cathode ray tube, needs other processing method.FPD is by utilizing sintered glass, by airtight panel and the back side formation that promptly mainly contains glass in conjunction with two substrates of framework.In general, employing contains the sintered glass that a large amount of lead compositions become just can carry out low-temperature bake.In some cases, except that sintered glass, the constituent material of wiring material and panel is also leaded.The reason identical with cathode ray tube must be separated into FPD glass and the flint glass that does not contain any feedback, so that utilize glass again.In addition, when the parts that utilize again except that glass, also must remove delead.

For removing delead, it is effective utilizing the aqueous solution selective dissolution of acid or alkali and the method for separation of lead composition.Yet, the aqueous solution of a large amount of soluble lead of needs when implementing this method on a large scale, cleaning step needs big water gaging subsequently.For heating and making flow of solution, must use big energy.Improved processing cost.

The invention solves the problems referred to above, the method that provides a kind of low-cost processes to scrap FPD is provided.

Reclaim the display that (problem 11) rare earth element almost can't be scrapped after using.Be owing to rare earth element used in (1) each display unit is considerably less, reclaim very difficulty, and can't automation, (2) rare earth element does not use as simple substance, but use as compound or alloy, so separation costs height, (3) under the situation of wishing very much, can low-cost obtain the unessential rare earth element of lower cost.

Yet, keep and stablize the angle of rare earth element source supply from environment, wish to promote the recovery of these materials.The method that reclaims rare earth element from industrial products becomes major issue.Some product for civilian use producer has begun the recovery business of CRTs, thereby wishes to promote immediately the recovery operation of flat-panel monitor.

Consider that the problems referred to above have made the present invention, its objective is provides a kind of fluorescent material recovery method and device, can be effectively and easily remove the flat-panel monitor screen board, particularly reclaim fluorescent material effectively.

(problem 12) FPD (flat-panel monitor) has the structure that is different from cathode ray tube, needs other processing method.FPD is by utilizing sintered glass, by airtight panel and the back side formation that promptly mainly contains glass in conjunction with two substrates of framework.In general, employing contains the sintered glass that a large amount of lead compositions become just can carry out low-temperature bake.In some cases, except that sintered glass, the constituent material of wiring material and panel is also leaded.The reason identical with cathode ray tube must be separated into FPD glass and the flint glass that does not contain any lead, so that utilize glass again.In addition, when the parts that utilize again except that glass, also must remove delead.

For removing delead, it is effective utilizing the aqueous solution selective dissolution of acid or alkali and the method for separation of lead composition.Yet the aqueous solution of a large amount of soluble lead of needs must prepare and be used for the big water gaging of cleaning step subsequently when implementing this method on a large scale.In addition, for heating and making flow of solution, must use big energy.For suppressing cost, finish processing at short notice, must handle many glass plates that demolishing and scrapping FPD obtains by they being put into immediately the immersion treatment groove.In addition, transmitting glass plate between treatment trough fast needs the instant connecting gear that transmits a large amount of glass plates,

Consider that the problems referred to above have made the present invention, its objective is provides a kind of substrate processing method using same and device of realizing effective and suitable immersion treatment.

(problem 13) will separate backboard 1 and panel 2 from other parts when utilizing base plate glass again, remove the wiring that is formed on the substrate, element etc., to obtain single glass workpiece.Glass workpiece can be used as substrate again, maybe can be ground into fragment, and is used as the material of glass substrate or other products again.

Yet, on glass substrate, form wiring, electronic emission element, sintered glass, and when making substrate, can form film in advance from the teeth outwards with soda-lime glass.Some material ground can closely contact with glass substrate, or some element can be diffused in the diffusion substrate gradually.So, be difficult to film is separated from base plate glass fully.

When used glass dust being broken into fragment and utilizing them again, if the element except that constituting element is sneaked in the glass fragment, the element of then sneaking into can influence the physical property and the color of glass.The glass of impure element can't utilize again.Even when glass is used as substrate again, wish that also this glass returns to pristine glass substrate state as far as possible.

Consider that the problems referred to above have made the present invention, its objective is provides a kind of glass substrate processing method, realizes that the reality of base plate glass is utilized effectively again.

To introduce the scheme that the present invention deals with problems by the order of utilizing the invention described above to solve corresponding problem below.

(solution 1) for achieving the above object, according to the present invention, a kind of disassembly processing method that is used for FPD, said FPD has panel and the backboard that two substrates promptly mainly contains glass and utilizes sintered glass to pass through the structure of the airtight combination of framework, said method is characterised in that, separates the part of the framework of using the combination of fuse glass from remainder.

According to the present invention, be used to introduce separator and on the inner surface of panel, had the disassembly processing method of fluoroscopic FPD, it is characterized in that, be included in when separating with the framework of sintered glass combination a part of, stay the separator and the phosphor screen at remainder place.

The invention is characterized in the part of cutting panel and backboard, a part of separating the framework of using the sintered glass combination from remainder.

In the present invention, the method for determining cutting position comprises the method for surveying with the position of the frame of sintered glass combination (video camera).

(solution 2) for achieving the above object, a kind of FPD with following structure according to the present invention, said FPD have two substrates and promptly utilize the panel that mainly contain glass and the backboard of sintered glass by the airtight combination of framework, it is characterized in that, comprise and use the nitric acid dissolve joint portion, peel off panel and backboard.In the present invention, can introduce the separator that utilizes the sintered glass combination among the FPD.

About method,, be safe so in nitric acid, soak the method for bound fraction because nitric acid must penetrate into the clinkering bound fraction deeply with the nitric acid dissolve sintered glass.The present invention adopts this method, but also can adopt the method for for example spraying nitric acid from nozzle to bound fraction.

To can adopt (1) that all bound fractions are all immersed nitric acid to dissolve and to peel off them with the clinkering bound fraction of nitric acid dissolve, and separate, pulverize and utilize again the method for each several part, (2) part that will utilize again keeps, make it not by acid corrosion, and remainder immerses dissolving in the nitric acid, peels off, and pulverizes them.Any method can only be separated with the harmful lead composition in the metal ingredient of nitric acid dissolve, and can all the other elements of cycling and reutilization.

(solution 3) for achieving the above object, according to the present invention, the backboard round-robin method may further comprise the steps: during scrapping image display device, welding portion is immersed in the salpeter solution, the dissolving sintered glass; Utilize ink-jet method to form conducting film; Said image display device is made of backboard, panel and support frame at least, backboard has a plurality of electronic emission elements, each electronic emission element all is made of a pair of element electrode and conducting film, panel has image forming part, the electronic emission element electrons emitted bumps and form image on image forming part, support frame connects backboard and panel, presses in keeping, and backboard, panel and support frame utilize sintered glass to weld together.

According to the present invention, by the chemolysis sintered glass, rather than method such as machine cuts is removed backboard.So, can be under the situation of not damaging backboard substrate and element electrode, the recovery and reuse backboard.Refuse can reduce, and can effectively utilize resource, and can reduce cost.For example element such as Pb is washed out in soaking salpeter solution, so can reclaim them easily.When reclaiming panel, utilize ink-jet method to form conducting film.Because the conduction film formation material only is used in necessary part, so the amount of conducting membrane material can reduce.Even when conduction forms back discovery defective, also can only form defect part again.

(solution 4) considers that the problems referred to above have made the present invention.According to the present invention, the recovery method of separator in a kind of flat-panel monitor is provided, flat-panel monitor has backboard at least, panel frame and separator, the said back side has a plurality of electronic emission elements, panel is arranged in the face of backboard, has image displaying part, separator is used to keep the interval between backboard and panel, Chinese People's Anti-Japanese Military and Political College's air pressure, backboard, panel, framework and separator utilize sintered glass to weld together, and it is characterized in that, when soaking welding portion between separator and backboard or panel when dissolving sintered glass in salpeter solution, adopt separator to reclaim anchor clamps, to avoid between each spacing body of branch or separator and contacting between parts on every side.

The separator that adopts in the program of the present invention reclaims anchor clamps and comprises the flat board with the one or more grooves that can deposit separator.Separator in another program reclaims anchor clamps and comprises having the end that can press and fix each separator and can make the said end anchor clamps of mobile arm in any direction.

According to the present invention, owing to when removing flat-panel monitor, can almost not reclaim separator,, can effectively utilize resource so can easily utilize them again with damaging, reduce cost.In addition, since recycling step without any need for careful artificial, so can reclaim separator safely.

(solution 5) according to the present invention, a kind of be coated on the substrate and cause from fluorescent material luminously it is characterized in that to reclaim the method for fluorescent material the display unit of implementing to show, utilize brush and pump unit to reclaim the fluorescent material that is coated on the substrate.

According to display device manufacturing method of the present invention, it is characterized in that, be used further to display unit with utilizing the method from display unit recovery fluorescent material of the present invention to remove the substrate of going up fluorescent material from it.

The present invention can be used to reclaim fluorescent material and for example come the substrates such as panel of display unit such as CRT or panel display apparatus freely effectively, in the said display unit, fluorescent material for example is coated on the substrate such as panel, and because of electron beam or ultraviolet radiation luminous.Scribble the substrate surface of fluorescent material with the brush sweeping, sweeping fluorescent material, or fluorescent material and black matrix composition.Can keep or not damage under the situation of substrate surface fineness, substrate can utilize again, and fluorescent material and black matrix composition are sucked device and sweep and pick up.Fluorescent material and black matrix are further transferred to the fluorescent material separating technology.When keeping or not damaging surface smoothness, for example take out substrates such as panel from this step, then, substrate is directly again as substrates such as for example panels.

About being used for by making the luminous panel display apparatus that shows of fluorescent material, comprise the display unit of utilizing electronic emission element (will introduce later on) and utilizing the luminous vaccum fluorescent tube of low-velocity electron beam with the device of electron beam radiofluorescence material.Utilize ultraviolet device to comprise plasma display system.During with electron beam or ultraviolet radiation fluorescent material, can send visible light from the back side from the front, fluorescent material is coated on the panel of panel display apparatus.When visible light is sent on the surface that utilizes low-velocity electron beam radiofluorescence material, as vacuum fluorescent display, fluorescent material is coated on the backboard.

(solution 6) according to the present invention, and to achieve these goals, a kind of image display device is characterised in that, comprises display unit, the gas-tight container of display image and is used for as required with the device that changes to gradually in the gas-tight container near the gas-tight container external pressure.

The invention is characterized in that image display device also comprises exhaust apparatus, be used for that gas-tight container inside is become device near the outer pressure of gas-tight container and be arranged on the gas-tight container and the different position of device that connects exhaust apparatus.The device that gas-tight container inside is changed near the gas-tight container external pressure is characterised in that, comprises essential filter.

The invention is characterized in, comprise the device that the structure member of anti-atmospheric pressure the in the display unit that is used for display image, the gas-tight container that keeps external pressure, the gas-tight container, the exhaust apparatus interior with being used for the emptying gas-tight container are connected and be used for as required gas-tight container inside being changed to gradually device near the gas-tight container external pressure.

Owing to having, the image display device with this structure gradually the gas-tight container internal pressure is become, so the internal part of gas-tight container is subjected to any hardly because the stress that pressure change causes during removing and disassembling near atmospheric device.

So parts are seldom destroyed, can prevent the secondary damage that destroyed parts sheet causes.

(solution 7) is according to the present invention, a kind of flat-panel monitor, at least has backboard, panel, support frame, separator, said backboard has a plurality of electronic emission elements, panel is arranged to face with backboard, has image displaying part, separator is used to keep the interval Chinese People's Anti-Japanese Military and Political College air pressure between backboard and panel, backboard, panel, support frame and separator utilize sintered glass to weld together, it is characterized in that, the combination of backboard and support frame and panel adopt the sintered glass with different softening temperatures with combining of support frame, have the sintered glass that is not less than in said two kinds of sintered glasses than the softening temperature of high softening temperature in conjunction with adopting between separator and substrate.

Every kind in the multiple sintered glass is characterised in that, it is poor to have with the softening temperature of at least 20 ℃ of the softening temperature differences of all the other sintered glasses.

Separator among the present invention is characterised in that, with any combines in backboard and the panel.

Flat-panel monitor disassembling method according to the present invention is characterised in that, comprise flat-panel monitor is heated to softening temperature that is not less than the sintered glass with minimum softening temperature and the softening temperature that is not higher than all the other sintered glasses, only make sintered glass fusing with minimum softening temperature, selectivity is only separated the bound fraction with this sintered glass combination, repeat identical process, have than separating plate display screen board on the bound fraction of the sintered glass that hangs down softening temperature from utilization then.

Separate method with the bound fraction of sintered glass combination with high softening temperature, comprise that the heating sintered glass is to the softening temperature that is not less than this sintered glass of fusing, thereby the method for separating this bound fraction, or or to comprise with this sintered glass of suitable dissolution with solvents the method for separating and combining part.

A kind of flat-panel monitor with gas-tight container, at least depositing a substrate with a plurality of electronic emission elements and one in the said gas-tight container is arranged in the face of said substrate and substrate with image displaying part, it is characterized in that each substrate and the bound fraction utilization between gas-tight container have the sintered glass combination of the softening temperature of corresponding different un-mate sequence.

A kind of flat-panel monitor, have at least one backboard, a panel and a support frame and make member, said backboard has a plurality of electronic emission elements, said panel is arranged in the face of said backboard, and have image displaying part, and said support frame is used to support each substrate, and each member welds with sintered glass, it is characterized in that the sintered glass with different softening temperatures is adopted in the combination of the combination of backboard and support frame and panel and support frame.

Flat-panel monitor with shell of depositing electronic emission element, it is characterized in that, between the combination between the backboard that constitutes shell and support frame and panel and support frame in conjunction with adopting two kinds of sintered glasses with different softening temperatures, be used to keep the separator of each substrate distance to be higher than the softening temperature of two kinds of sintered glasses or the sintered glass that equals the softening temperature of any sintered glass combines with bound fraction employing softening temperature between at least one substrate.

A kind of flat-panel monitor disassembling method, it is characterized in that, be included in when disassembling flat-panel monitor, progressively the heated plate display, fusing and have the bound fraction separating plate display of the sintered glass of low clinkering glass then from utilization, thus disassemble flat-panel monitor.

In flat-panel monitor according to the present invention, can separate the parts that constitute shell successively, so can during disassembling, not damage under the situation of shell and internal part, utilize safety and simple method to reclaim each parts.Therefore, each parts can be used as and utilizes parts to reclaim again, has effectively utilized resource, has reduced cost.

(solution 8) for achieving the above object, be used for the poisonous metal residual quantity checkout gear of test example as the contained amount as poisonous metals such as lead of inspected object such as the parts disassembling for circulation and decompose or refuse, comprise: first washes out device, has the acid solution that is used for washing out the contained poisonous metal of inspected object at the groove that is used for soaking inspected object; Cleaning device is used for cleaning inspected object utilizing first to wash out after device washes out; Second washes out device, is being used for soaking the groove that utilizes the detection material that cleaning device cleaned, and has to be used to wash out the acid solution of staying the poisonous metal on the inspected object; And the detection by quantitative device, be used for the poisonous metal amount that acid solution that detection by quantitative second washes out device washes out.

In poisonous metal residual quantity checkout gear of the present invention, inspected object is immersed in first and washes out in the groove of device, so that wash out the poisonous metal that contains in the inspected object with the acid solution in the groove.Then, inspected object is transferred to cleaning device, cleans at this.Then, detection material is immersed in second and washes out in the groove of device, washes out the poisonous metal of staying on the inspected object to utilize the acid solution in the groove.This wash solution is provided to the detection by quantitative device, the amount of contained poisonous metal in this detection by quantitative wash solution.

Therefore, when disassembling and decomposing flat-panel monitor etc., can detection by quantitative for example lead etc. stay as decomposing the amount of the poisonous metal on the inspected object such as glass component.

(solution 9) is according to the present invention, a kind of flat-panel monitor disassembling apparatus, be used to disassemble and reclaim flat-panel monitor, in the said flat-panel monitor, frame parts is inserted between backboard and panel, the flat vacuum tank of structure face, be used to keep the separator of gap Chinese People's Anti-Japanese Military and Political College air pressure between two plates to be fixed on two plates or one of two plates, said flat-panel monitor disassembling apparatus comprises: first bracing or strutting arrangement, be used on the plate that is fixed on the separator that supports this plate, adding pulling force, so that carry out the step of split-frame from the vacuum tank; Second bracing or strutting arrangement is used at an edge that holds after the framework apart with the plate of support fixation on separator; The separator retracting device is used to carry out separate separator from utilizing second support component to hold with the plate that supports.

According to flat-panel monitor disassembling apparatus of the present invention, also comprise conveyer, be used for after having separated the step of frame parts, holding supporting bracket from first bracing or strutting arrangement from vacuum tank, hold and support an edge of this plate, and this plate is sent to second bracing or strutting arrangement.

In flat-panel monitor disassembling apparatus according to the present invention, conveyer has the load that prevents to be fixed to the plate on the separator and is added on structure on the separator.

In the flat-panel monitor disassembling apparatus with this set according to the present invention, first bracing or strutting arrangement is by applying pulling force, the plate of support fixation on separator the step of split-frame parts from vacuum tank.Separator is unsettled, is not subjected to the weight effect of fixed head, can be under the situation that separator is not applied any load the split-frame parts.

After the framework apart, second bracing or strutting arrangement holds the edge with the plate of support fixation to the separator.At this moment, separator is unsettled, is not subjected to the weight effect of fixed head.Hold the step of separating separator from second bracing or strutting arrangement, when holding plate is received and supports, undertaken by the separator retracting device with the plate that supports.In addition, in separator separation/recovery step, separator is not subjected to extra weight effect, can prevent damage.

(solution 10)

According to the present invention, a kind of flat-panel monitor disassembly processing method that is used for flat-panel monitor, said flat-panel monitor has such structure, wherein the two substrates panel and the backboard that promptly mainly contain glass utilizes leaded sintered glass by airtight combination by framework, said method is characterised in that, may further comprise the steps: from flat-panel monitor separation and taking-up part that comprises panel and the part that comprises backboard that will scrap; Collect a plurality of taking-up parts that comprise the taking-up part of panel and comprise backboard respectively, at once these parts are put into treatment trough respectively, carry out immersion treatment.

The present invention also comprises following feature:

" immersion treatment comprises the aqueous solution processing that utilizes acid or alkali; "

" immersion treatment comprises that the aqueous solution that utilizes acid or alkali is handled and water or organic solvent cleaning subsequently; "

" by making the mobile immersion treatment of carrying out of Treatment Solution in the treatment trough; "

" circulate between the treatment trough and the external world by making Treatment Solution, carry out immersion treatment; "

" carry out immersion treatment by heat treated solution; " and

", carry out immersion treatment by to wanting handled object to apply vibration or ultrasonic wave.”

(solution 11) is according to the present invention, a kind of dull and stereotyped main body solid unit who is used for fixing the dull and stereotyped main body that obtains in conjunction with a pair of screen board that faces with each other by framework, comprise be arranged to collapsible with respect to dull and stereotyped main body so that surround the stationary fixture be located at the dull and stereotyped main body on the pedestal, wherein geometrical clamp swing, and around dull and stereotyped main body, contacting, thereby fixed flat planar main body with dull and stereotyped main body.

According to dull and stereotyped main body fixture of the present invention, it is characterized in that, also comprise: be used for respect to the move around driving mechanism of stationary fixture of dull and stereotyped main body; Be used for detecting the position detecting device of the position of stationary fixture according to the amount of movement of stationary fixture; And being used for the controller of controlling and driving mechanism, the size of dull and stereotyped main body is detected by the positional information of the stationary fixture that utilizes position detecting device to obtain.

According to dull and stereotyped main body fixture of the present invention, it is characterized in that, also comprise the sticking hole sticking that is used for by being formed at pedestal and the holding device of fixed flat planar main body.

According to the present invention, a kind of flat-panel monitor fluorescent material retracting device that is used for reclaiming the fluorescent material of flat-panel monitor, said flat-panel monitor comprises panel, backboard and framework, this flat-panel monitor is luminous because electron radiation is coated on fluorescent material on the panel, said device is characterised in that, comprise the said fixing device, panel is fixed from four direction by stationary fixture.

According to flat-panel monitor fluorescent material retracting device of the present invention, it is characterized in that, this device comprises a plurality of being used for from reclaimed the processing unit of fluorescent material by the fixing panel of fixture, and said processing unit is driven according to the positional information that position detecting device obtains by controller.

According to flat-panel monitor fluorescent material retracting device of the present invention, it is characterized in that processing unit comprises: the cutter sweep that is used to separate panel and backboard; With the retracting device that is used to sweep and aspirate the fluorescent material on the panel.

According to flat-panel monitor fluorescent material retracting device of the present invention, it is characterized in that the processing operation of the cutter of cutter sweep and the recovery of retracting device brush is subjected to the control of said controller, thereby processes in the predetermined range of work.

Flat-panel monitor fluorescent material retracting device according to the present invention also comprises the fluorescent material checkout gear that is used to detect the amount of staying the fluorescent material on the panel, and the action of retracting device is according to fluorescent material checkout gear resulting fluorescence quality information and controlled.

According to flat-panel monitor fluorescent material retracting device of the present invention, it is characterized in that fluorescence quality information is crossed the visible light transmittance of panel or absorbed by transmission and limits.

According to flat-panel monitor fluorescent material retracting device of the present invention, it is characterized in that fluorescence quality information is limited by the fluorescence intensity that the inner surface with ultraviolet ray or visible radiation panel produces.

According to flat panel display fluorescent material retracting device of the present invention, it is characterized in that the fluorescent material checkout gear moves in the working range of the recovery brush of retracting device.

According to the present invention, a kind of flat-panel monitor fluorescent material recovery method that reclaims fluorescent material in the flat-panel monitor, wherein flat-panel monitor comprises panel, backboard and framework, and by be coated on fluorescent material on the panel with electron radiation and luminous, said method is characterised in that, may further comprise the steps: the swing stationary fixture, from being arranged at the four direction fixed flat planar display of the flat-panel monitor on the pedestal; The panel and the backboard that separate fixing flat-panel monitor; And the recycling step of the fluorescent material of cleaning and suction panel.

According to flat-panel monitor fluorescent material recovery method of the present invention, it is characterized in that, further comprising the steps of: as, to detect the position of stationary fixture according to the amount of movement of the stationary fixture that is used for fixing flat-panel monitor.

According to flat-panel monitor fluorescent material recovery method of the present invention, it is characterized in that, further comprising the steps of: by being formed at the sticking hole in the pedestal, sticking and fixed flat planar display.

According to flat-panel monitor fluorescent material recovery method of the present invention, it is characterized in that control utilizes the cutting work of cutter, so that during separating panel and backboard, according to the positional information of stationary fixture, the size of matching panel.

According to flat-panel monitor fluorescent material recovery method of the present invention, it is characterized in that control utilization is reclaimed the recovery operation of brush, so that during the fluorescent material that reclaims panel, according to the positional information of stationary fixture, the size of matching panel.

According to flat-panel monitor fluorescent material recovery method of the present invention, it is characterized in that, further comprising the steps of: detect the amount of the fluorescent material that stays on the panel, and the work that said recovery is brushed according to detection fluorescence quality information Control.

According to flat-panel monitor fluorescent material recovery method of the present invention, it is characterized in that further comprising the steps of: brush is received in control, make it to do to move in the scope the recovery dataller.

According to the present invention, the flat-panel monitor on the pedestal is fixed from the four direction of flat-panel monitor by stationary fixture by the swing stationary fixture.At this moment, according to the amount of movement of stationary fixture, detect the position of moving stationary fixture, this positional information can be effectively applied to procedure of processing subsequently.That is, when driving is used to separate the cutter of panel and backboard, utilize the positional information of stationary fixture, control is used to clear away and aspirate the working range of recovery brush, cutter and the recovery brush of the fluorescent material on the panel.

As a result, can be effectively and reclaim fluorescent material on the panel reliably.Stationary fixture can be effectively changes with the screen board size of flat-panel monitor, so very practical.

(solution 12) according to the present invention, and a kind of substrate processing method using same of disassembling mainly the substrate that is made of a pair of glass substrate by the airtight combination of framework is characterized in that, may further comprise the steps: separate this substrate to combination; Keep the substrate of a plurality of separation parallel to each other with predetermined gap; Transmit a plurality of fixing substrates immediately, carry out predetermined process.

According to substrate processing method using same of the present invention, it is characterized in that, fix each substrate, the surperficial perpendicular of each substrate is stood.

According to substrate processing method using same of the present invention, it is characterized in that the predetermined portions that contacts each substrate by linearity supports each substrate.

According to the present invention, a kind of substrate processing method using same of disassembling mainly the substrate that constitutes by a pair of glass substrate by the airtight combination of framework, it is characterized in that, comprise with predetermined gap and be set parallel to each other a plurality of support components, each substrate that separates is fixed between each support component, so that perpendicular is stood.

According to substrate processing method using same of the present invention, it is characterized in that the support component with each substrate contacts partly is circle or arc at least.

According to the present invention, a kind of flat-panel monitor disassembly processing method that is used for flat-panel monitor, said flat-panel monitor has such structure, wherein the panel and the back side that is made of a pair of substrate that mainly contains glass utilizes leaded sintered glass, by the airtight combination of framework, institute's method is characterised in that, be included in the glass substrate that transmission is taken out from the flat-panel monitor that will disassemble, and when carrying out immersion treatment, utilize one of aforesaid substrate processing method to handle panel or backboard.

According to flat-panel monitor disassembly processing method of the present invention, it is characterized in that, comprise and adopt the aforesaid substrate processing unit.

The present invention includes and be used for fixing glass plate, and carry out the device of immersion treatment so that transmit the glass plate that the FPDs of many demolishing and scrappings obtains immediately.Owing to better be to fix many substrates immediately, the present invention can realize that low-cost processes scraps the method for FPDs.

(solution 13) is according to the present invention, a kind of surface state that detects glass substrate and according to the glass substrate processing method on detection architecture treatment substrate surface, it is characterized in that, comprise: detect step, with primary X-ray radiant glass substrate surface, detect the fluorescent X-ray that is produced, to detect the element that exists on the glass baseplate surface; Remove step,, remove the element except that glass constitutes element on the glass baseplate surface according to the testing result that detects step.

According to glass substrate processing method of the present invention, it is characterized in that, detect the detection step of the element that exists on the glass baseplate surface, comprise the relative position that changes glass substrate and fluorescent X-ray detector according to the size of glass substrate.

According to glass substrate processing method of the present invention, it is characterized in that the wideer zone, zone that the fluorescent X-ray detector can detect than fluorescent X-ray with the primary X-ray radiation.

According to glass substrate processing method of the present invention, it is characterized in that the incidence angle when primary X-ray incides on the glass substrate is not more than the critical angle of primary X-ray.In addition,, it is characterized in that,, be used for the removal step of glass baseplate surface by the polished glass substrate surface according to glass substrate processing method of the present invention.

According to glass substrate processing method of the present invention, it is characterized in that, repeat to be used for the detection step of glass baseplate surface and remove step.

According to the present invention, a kind of glass substrate circulation process method of flat-panel monitor, said flat-panel monitor comprises backboard, panel and support frame, the said back side has a plurality of electronic emission elements that are formed on the glass substrate, said panel has the image displaying part that is formed on the glass substrate, said support frame is in conjunction with each plate, they are faced with each other, said method is characterised in that, be included in after backboard separates with panel and take out, the substrate surface of backboard or panel is carried out above-mentioned processing method.

According to flat panel display glass substrate recovery and treatment method of the present invention, it is characterized in that, on the glass substrate of backboard, form the wiring that mainly contains Ag.

According to flat panel display glass substrate recovery and treatment method of the present invention, it is characterized in that, on the glass baseplate surface that constitutes backboard, form the film that contains the element except that glass constitutes element.

According to glass substrate recovery and treatment method of the present invention, it is characterized in that the sintered glass of melted join backboard, panel and framework separates backboard, panel and framework.

According to the present invention, a kind of flat panel display glass substrate recycling and processing device, said flat-panel monitor comprises backboard, panel and support frame, the said back side has a plurality of electronic emission elements that are formed on the glass substrate, said panel has the image displaying part that is formed on the glass substrate, said support frame is in conjunction with each plate, they are faced with each other, said device is characterised in that, comprise: the surface of penetrating the glass substrate of backboard that radiation constitutes separation/taking-up or panel with X, and detect the fluorescent X-ray that produces, be present in the mechanism of the element on the glass baseplate surface with detection; Remove the mechanism of the element except that glass constitutes element on the glass baseplate surface.

According to the present invention, utilize simple method just can detect residue on the glass baseplate surface, in the step of handling used base plate glass, can remove all elements except that glass constitutes element.Thereby, can not utilize glass lavishly effectively again.

Figure 1A is a partial cut-away perspective view that show to utilize the example of the flat-panel monitor that disassembly processing method according to the present invention handled;

Figure 1B is the profile of flat-panel monitor shown in Figure 1A;

Fig. 2 is the schematic diagram of showing according to surface conductive type electron source display in the flat-panel monitor of the present invention;

Fig. 3 A is the plane graph that is illustrated in according to flat-panel monitor processing method middle plateform cutting position of the present invention;

Fig. 3 B is a profile dull and stereotyped shown in Fig. 3 A;

Fig. 4 is the flow chart of showing according to FPD disassembly processing method of the present invention;

Fig. 5 shows according to the flow chart of scrapping each step of flat-panel monitor disassembling method of the present invention;

Fig. 6 A shows to utilize method of the present invention to disassemble the amplification diagrammatic sketch of the state of whole screen board simultaneously;

Fig. 6 B is the diagrammatic sketch of the state of the each several part of screen board shown in the separation graph 6A;

Fig. 7 A shows to disassemble the diagrammatic sketch that screen board stays its certain part simultaneously in the method for the invention;

Fig. 7 B is a diagrammatic sketch of showing the state that lifts the panel of being furnished with separator shown in Fig. 7 A;

Fig. 8 A shows in the method for the invention, disassembles the diagrammatic sketch that screen board stays its certain part simultaneously;

Fig. 8 B is a diagrammatic sketch of showing the state of backboard shown in Fig. 8 A that lifts;

Fig. 9 is the perspective view as the surface conductive type electron source display (SED) of FPD that schematic presentation will utilize that method of the present invention disassembles;

Figure 10 shows the partial cut-away perspective view that has the example of the image display device of the backboard of circulation according to the present invention;

Figure 11 A is the introduction figure that shows according to each step of backboard recovery/round-robin method of the present invention;

Figure 11 B is a diagrammatic sketch of showing the state of peeling off the backboard among Figure 11 A;

Figure 12 is a perspective view of showing the example of the backboard substrate that utilizes round-robin method cleaning of the present invention;

Figure 13 A-13E is presented in the schematic diagram that forms each step of electronic emission element on the backboard;

Figure 14 is a perspective view of showing another example of the backboard substrate that utilizes round-robin method cleaning of the present invention;

Figure 15 is the diagrammatic sketch of showing according to the embodiment of separator recovery method of the present invention;

Figure 16 A is a plane graph of showing the used separator returnable of the inventive method;

Figure 16 B is the profile of the separator returnable among the exploded view 16A;

Figure 17 A is a plane graph of showing used another separator returnable of the inventive method;

Figure 17 B is the profile of the separator returnable among the exploded view 17A;

Figure 18 is another embodiment diagrammatic sketch of showing according to separator recovery method of the present invention;

Figure 19 A and 19B are the diagrammatic sketch of showing the separator among the present invention;

Figure 20 A-20E is the diagrammatic sketch of the example of each step when reclaiming separator according to the present invention;

Figure 21 is a diagrammatic sketch of showing flat-panel monitor screen board cutting method of the present invention;

Figure 22 a-22D is the diagrammatic sketch of another example of each step when showing recovery separator of the present invention;

Figure 23 A-23E is the diagrammatic sketch of an example again of each step when showing recovery separator of the present invention;

Figure 24 A-24C is the diagrammatic sketch of the another example of each step when showing recovery separator of the present invention;

Figure 25 shows the flow chart that reclaims each step of fluorescent material according to the present invention from display unit;

Figure 26 is a diagrammatic sketch of showing the operation of the type brush that rotatablely moves;

Figure 27 is that the displaying pestle is smash the diagrammatic sketch of the operation of sports type brush;

Figure 28 A and 28B are respectively the diagrammatic sketch of showing the different structure of brush and pump unit;

Figure 29 is a perspective view of showing the display unit of utilizing separator;

Figure 30 is a schematic diagram of showing the structure of image display device of the present invention;

Figure 31 is the perspective view of showing according to the present invention as the FPD of an example of image display device;

Figure 32 is the perspective view of showing according to the present invention as the SED of another example of image display device;

Figure 33 A and 33B are respectively profile and the plane graphs of showing the embodiment of flat-panel monitor of the present invention;

Figure 34 A-34D is a diagrammatic sketch of showing an embodiment of flat-panel monitor disassembling method of the present invention;

Figure 35 A-35C is a diagrammatic sketch of showing another embodiment of flat-panel monitor disassembling method of the present invention;

Figure 36 A-36E is the diagrammatic sketch of an embodiment again of showing flat-panel monitor disassembling method of the present invention;

Figure 37 A is the diagrammatic sketch of showing according to an example of electronic emission element of the present invention;

Figure 37 B is the profile of electronic emission element among the exploded view 37A;

Figure 38 A-38C is the diagrammatic sketch of showing according to an embodiment of flat-panel monitor manufacture method of the present invention;

Figure 39 A-39C is the diagrammatic sketch of showing according to another embodiment of flat-panel monitor manufacture method of the present invention;

Figure 40 A-40C is the diagrammatic sketch of showing according to flat-panel monitor manufacture method of the present invention of an embodiment again;

Figure 41 shows the diagrammatic sketch of the setting of poisonous metal residual quantity checkout gear according to an embodiment of the invention;

Figure 42 is a flow chart of introducing the detection processing that utilizes poisonous metal residual quantity checkout gear shown in Figure 41 successively;

Figure 43 A is the partial cut-away perspective view of showing flat-panel monitor;

Figure 43 B is the profile of exploded view 43A middle plateform display;

Figure 44 A is the perspective view of displaying according to the setting of the flat-panel monitor disassembling apparatus of first embodiment of the invention;

Figure 44 B is the plane graph of the disassembling apparatus among the exploded view 44A;

Figure 45 is the side diagrammatic sketch of workbench and bracing or strutting arrangement among Figure 44 A and the 44B;

Figure 46 A is a front view of showing conveyer among Figure 44;

Figure 46 B is a side diagrammatic sketch of showing conveyer among Figure 44;

Figure 47 A is the front view of another example of conveyer among exploded view 44A and the 44B;

Figure 47 B is the side diagrammatic sketch of conveyer among exploded view 44A and the 44B;

Figure 48 is the end view that separator reclaims anchor clamps among exploded view 44A and the 44B;

Figure 49 is the end view that separator reclaims another example of anchor clamps among exploded view 44A and the 44B;

Figure 50 introduces the flow chart of disassembling step that utilizes flat-panel monitor disassembling apparatus shown in Figure 44 A and the 44B successively;

Figure 51 A is the perspective view of displaying according to the setting of the flat-panel monitor disassembling apparatus of second embodiment of the invention;

Figure 51 B is the plane graph of disassembling apparatus among the exploded view 51A;

Figure 52 shows according to the present invention the schematic diagram of the setting of liquid handling groove in the FPD disassembly processing method;

Figure 53 is the flow chart of introducing according to FPD disassembly processing method of the present invention;

Figure 54 is the flow chart of showing according to the basic step of fluorescent material recycling of the present invention;

Figure 55 A shows that removable stop type geometrical clamp according to the present invention has the plane graph of setting;

Figure 55 B is the side diagrammatic sketch of removable stop type anchor clamps among the exploded view 55A;

Figure 56 is a perspective view of showing the separating step of panel and backboard according to the present invention;

Figure 57 is that the structure of brush and the diagrammatic sketch of operation are reclaimed in displaying according to the present invention;

Figure 58 shows the diagrammatic sketch that reclaims each step of fluorescent material according to the present invention from flat-panel monitor;

Figure 59 shows the glass sheet support mechanism according to FPD disassembly processing method of the present invention.

Figure 60 is the diagrammatic sketch of displaying according to the setting of the liquid handling groove of FPD disassembly processing method of the present invention.

Figure 61 is the flow chart of displaying according to an example of each step of FPD disassembly processing method of the present invention;

Figure 62 is the flow chart that displaying flat-panel monitor according to the present invention is disassembled treatment step;

Figure 63 shows the diagrammatic sketch that is used to detect the fluorescent x-ray analyzer of the element that exists on the glass baseplate surface according to the present invention;

Figure 64 A and 64B are the schematic diagrames of showing the state of the relative position that changes sample and detector according to the present invention in the fully-reflected type fluorescent x-ray analyzer;

Figure 65 is the schematic diagram of showing according to the radiation area of primary X-ray in the fully-reflected type fluorescent x-ray analyzer of the present invention;

Figure 66 A and 66B are the schematic diagrames of showing according to the detection zone of fluorescent X-ray in the reflection-type fluorescent x-ray analyzer that is all-trans of the present invention;

Figure 67 is the schematic diagram of showing according to glass baseplate surface burnishing device of the present invention;

Figure 68 A shows the plane graph that can be used for electronic emission element of the present invention;

Figure 68 B is the profile of electronic emission element among the exploded view 68A;

Figure 69 A and 69B show the waveform precedence diagram that applies voltage when being formed for electronic emission element of the present invention.

Specifically introduce various embodiments of the present invention below in conjunction with accompanying drawing.The quantity of each embodiment and example is corresponding to the quantity of the problems referred to above and solution.

(embodiment 1)

Specifically introduce embodiments of the invention 1 below in conjunction with accompanying drawing.This embodiment is used for the processing of disassembling of FPD with illustration, has introduced separator among the said FPD, and have phosphor screen on the inner surface of panel, shown in Figure 1A, 1B and 2.

Among Figure 1A and the 1B, reference number 1 expression backboard, the 2nd, panel, the 3rd, framework, the 4th, separator.Leaded sintered glass 5 is used for the bound fraction between backboard 1, panel and the framework 3 shown in Figure 1A and the 1B black part branch.

Separator 4 utilizes sintered glass etc., is attached on any of panel side and backboard side or on these both sides.Among this embodiment, separator 4 only is attached to the panel side.The example of backboard, panel and frame material has silica glass, contain the glass of glass, sodium-calcium glass and the stacked silicon dioxide layer preparation on soda-lime glass of small amount of impurities such as Na for example.On panel, on the inner surface of glass plate 2a, be formed with fluorescent film 2b, on the inner surface of fluorescent film, be formed with the metal backing 2c that contains Al.Separator is made of glass substantially.The surface of separator can apply antistatic film.

In addition, the blast pipe (not shown) that is used for emptying FPD generally is fixed on FPD.In general, blast pipe is made of leaded low-melting glass.

Fig. 2 shows among surface conductive type electron source display (SED) as the example of FPD, Fig. 2, and the wiring 12 and 13 that surface conductive type electron source 11 and being used to drives electron source is formed on backboard.Wiring 12 and 13 is directions X (Dox1, Dox2 ..., Doxm) with Y direction (Doy1, Doy2 ..., Doyn) element wiring is made of Ag, Pd etc.Directions X wiring and the wiring of Y direction insulating barrier insulation by locating in their crosspoints at least.Insulating barrier is made of the glass that contains a large amount of lead.

As mentioned above, the each several part of FPD adopts lead-containing materials.In these parts, the sintered glass on the framework contains a large amount of lead.The invention is characterized in, with remainder separate processes framework.That is, shown in Fig. 3 A and 3B,, cut FPD at line of cut A-A, A '-A ', B-B, B '-B ' according to FPD disassembly processing method of the present invention.

Fig. 4 is a flow chart of showing each step of the FPD device disassembly processing method of introducing this embodiment of the invention.Step (1)-(3) as this method first half are the predetermined process steps, comprise from the shell of FPD device and take out FPD, and remove attached wiring and terminal.In step (4)-(6), utilize suitable method, discharge the vacuum among the FPD, pull down blast pipe then, because blast pipe is leaded, thus handle it, and again as flint glass.

Measure FPD in step (7), obtain about with the area in the zone of sintered glass seal frame, information is determined cutting position.In general, sintered glass is deceived, and its existence can be passed through the glass substrate optical detection.More specifically say, survey FPD, can measure area, and the gained video image is carried out graphical analysis with the zone of sintered glass seal frame by utilizing video camera images.In this case, line of cut is located in the zone of using the sintered glass seal frame.When the position of known framework and width fall into preset range, detect the edge of FPD simply, setting the line that leaves the edge certain distance is line of cut.

Step (8) is the separating step of framework and remainder.Line of cut cutting frame along step (7) setting.Cutting method can be the conventional method of glass-cutting.Cutting method comprises (1) with hard metallic roll delineation glass, and applies thermal stress, (2) diamond cut certificate, (3) diamond wheel, (4) laser treatment, (5) sonicated scrapping on the part.Utilize this step, the FPD that delineates is divided into four parts, i.e. framework (9), interior screen board parts (11), panel (13) and back board part (20).To introduce the processing method of each parts below.

Pulverize framework (9), and again as flint glass (10).

If have separator (glass) as interior screen board parts, grid (metal) etc. in the step (11), then reclaim and utilize again their (step (12)).

About the panel in the step (13), remove fluorescent material in step (14), reclaim it in step (15).Step (16) is to remove the step of residual sintered glass.After having reclaimed the lead in the residual sintered glass in this step, glass substrate is ground into glass fragment in step (18).Step (19) can be made panel and backboard substrate with these glass fragments again.

About the backboard in the step (20), remove wiring in step (21), reclaim in the wiring and contain metal (Ag, Pb etc.), and glass substrate is ground into glass fragment in step (23).Step (24) can be made panel and backboard substrate with these glass fragments again.

(example 1)

Adopt example 1 specifically to introduce the present invention below in conjunction with Figure 1A and 1B-4.

(routine 1-1)

Disassemble the surface conductive type electron source display (SED) of matrix driving mode shown in Figure 2.This SED has the screen plate structure that contains separator shown in Figure 1.

According to the handling process of disassembling of FPD device among Fig. 4, from the shell of SED device, take out SED, remove attached wiring and terminal.Then, the vacuum among the cancellation SED is removed blast pipe.Handle blast pipe, and again as flint glass.

Survey this SED with video camera images, utilize image processing apparatus to obtain its image.Can be identified as the zone darker to the image-region that applies sintered glass than remainder.Image is by binarization (binarized), so that measure the area that applies the sintered glass zone.

Pre-treatment step (1)-(5) are disassembled in execution.From panel display apparatus, take out flat-panel monitor, and load gained panel display apparatus (step (1) and (2)).Remove attached wiring and terminal (step (3)).Utilize suitable processing for example to remove the sealing of blast pipe mounting portion, the vacuum of cancellation vacuum tank.The inside of vacuum tank returns to atmospheric pressure (step (4)).Then, pull down blast pipe (step (5)).Reclaim and utilize again blast pipe (step (6)).Measure the size of flat-panel monitor, determine its line of cut (step (7)).

Then, split-frame parts 3 (step (8)) from the flat-panel monitor 20.This separation is adopted the wedge shape cutter is compressed into bound fraction between frame part 3 and two plates 1 and 2 so that separate their method or the method for spraying salpeter solution.

The frame parts 3 (step (9)) that pulverizing separates in step (7), and again as the new glass material (step (10)) that recycles.

Reclaim separator 4 (step (11)).At this moment, separation and recovery separator 4 (step (12)).

After having reclaimed separator 4, if plate member is panel 2 (step (13)), then reclaim fluorescent material 2b (step (14)), and pulverize panel 2 from panel 2.Simultaneously, remove lead composition, panel 2 is used as the new glass material (step (15)) of cycling and reutilization again.Then, remove residual sintered glass (step (16)).Pulverize glass substrate (step (18)), and again as base plate glass (step (19)).

If plate member is backboard 1 (step (20)), then remove wiring (step (21)) from backboard 1.Pulverize backboard 1 (step (23)), and be used as the new glass material (step (24)) of cycling and reutilization again.

According to measurement result, in zone, set line of cut A-A, A '-A ', B-B, B '-B ' with the sintered glass seal frame.When applying abrasive solution, cut SED along line of cut with the diamond cut saw.

By cutting, SED is divided into frame part 3, panel 2 and backboard 1.Some separator 4 comes off in the cutting, and some separator 4 keeps the adhesion with panel 2.All separators 4 of manual recovery, screening also utilizes recycling separator 4 again.

Pulverize frame parts 3, and again as the flint glass material.Get on except behind the fluorescent material from panel 2, remove residual sintered glass, pulverize and utilize again glass substrate with nitric acid.After removing wiring from backboard 1, pulverize and utilize again glass substrate.

(routine 1-2)

Disassemble the surface conductive type electron source display (SED) of matrix driving mode shown in Figure 2.Till the step of setting line of cut A-A, A '-A ', B-B, B '-B ' with routine 1-1 in identical.With the line of cut delineation SED of hard metallic roll along SED.Then, with the part of gas burner heating delineation, in city gas (city gas), add oxygen in the gas burner.As a result, along the line of cut glass-cutting, SED is divided into frame part 3, panel 2 and backboard 1.Step subsequently is identical with routine 1-1.

Because routine 1-2 does not adopt any abrasive solution, so each parts of recovery and reuse easily.

(embodiment 2)

Specifically introduce embodiments of the invention 2 down in conjunction with the accompanying drawings.

Fig. 5 is the flow chart of showing according to the FPD disassembly processing method of present embodiment of the present invention.This embodiment illustration is had as shown in Figure 1 separator FPD disassemble processing.

Among Fig. 1, reference number 1 expression backboard; The 2nd, panel; The 3rd, framework; The 4th, separator.Each bound fraction that leaded sintered glass 5 is represented as black among Figure 1A, the 1B and 2.Separator 4 is attached on any of panel 2 and backboard 1 or on both.Among this embodiment, separator 4 only is attached on the panel 1.

Backboard 1, panel 2 and framework 3 examples of material have silica glass, contain a small amount of as the glass of impurity such as Na, soda-lime glass and pass through on soda-lime glass as sputtering deposit SiO ₂The glass of preparation.On panel 2, on the inner surface of glass substrate 2a, be formed with and contain the fluorescent film 2b that comprises as the fluorescent material of rare earth elements such as Y, be formed with metal backing 2c on the inner surface of fluorescent film.

Separator 4 is made of glass basically.The surface of separator scribbles antistatic film.The example of conducting membrane material is just like the nitride and the carbon of oxide, Al and the transition metal alloy of metals such as Cr, Ni and Cu.

About the material of sintered glass 5, adopt to contain a large amount of lead compositions so that can carry out the sintered glass of low-temperature bake, mainly contain PbO.

According to the present invention, the lead (Pb) that is used in the sintered glass 5 of bound fraction is dissolved in nitric acid, peels off each parts at bound fraction, to disassemble display.The concentration of nitric acid that the present invention adopts better is 0.1N-2N at 0.1N (equivalent concentration)-several N.Soak time better was 10 hours-24 hours at several hours-tens hours.

Specifically introduce this disassembling method according to the flow chart of Fig. 5 in conjunction with Fig. 6 below.

(1) remove shell, the outside terminal of the container of dismantling only takes out display (S1-S3).

(2) about vacuum system, bleed vacuum (S4).

(3) whole display is immersed in the groove that is filled with nitric acid (S5).At this moment, be scratched, in groove 22, sink to the netted cage 21 that constitutes by the teflon resin for preventing glass.Display 50 sinks to (Fig. 6 A) in the netted cage 21.

(4) lift netted cage 21, reclaim the parts of peeling off from the clinkering bound fraction (S6 and S7).Each parts is transferred in the rinse bath of pure water 25 (S8), then, be divided into recycling parts and scrap parts (Fig. 6 B) (S9 and S10).

(5) filter salpeter solution (S11), it is separated into filtrate and soluble thing (S12 and S13).

At this moment, soluble thing is the thing that is insoluble to nitric acid in the nitric acid insoluble matter of clinkering composition and separator coating composition.In filtrate (S13), lead, precious metal element and rare earth element (S14 and S16) have been dissolved.

(6) utilize electrolysis, the metal separation in the filtrate is become plumbous and other metal.

At this moment, plumbous as PbO ₂Be deposited on the negative electrode, and other metal deposition that contains noble metal is on anode.

(7) reclaim the PbO that is deposited on the negative electrode ₂, and the removing (S15) of enforcement harmful waste.

(8) noble metal etc. is deposited on the anode, reclaims and utilizes (S16).

(9) if be mixed with rare earth metal (S19), the pH value of solution is adjusted to equals 0, and add oxalic acid, make it to deposit as oxalates.Filter this solution, reclaim oxalates.

According to this method, also can reclaim noble metal.About other method.In filtrate (6), add sulfate ion, produce the deposit (PbSO of lead composition ₄), separation of lead.In this case, precious metal element also deposits, and is difficult to reclaim.When the amount of precious metal element is little, and when not needing to reclaim or when not containing noble metal, this method is simple and convenient.

According to said method, whole screen board is immersed in the nitric acid.Stay recycling parts and only the surplus parts of base are immersed the method for nitric acid also basically according to this method.

Be presented in the step that the local soaking screen board is also handled in the nitric acid below in conjunction with Fig. 7 A, 7B, 8A and 8B.

Fig. 7 A, 7B, 8A and 8B show and only soak backboard 1 and panel 2 (Fig. 7 A and 8A) in nitric acid, and pull out and utilize panel 2 that has framework and the method that has the backboard 1 (Fig. 7 B and 8B) of framework 3.The processing of salpeter solution is similar to the method for soaking whole display.

In this case, must accurately control the position component that is immersed in the nitric acid.This method can rule of thumb be implemented.At this moment, be that teflon platform 31 is set easily.In having the display of separator, when separator will be reused, can adopt the method for soaking whole display and only soak clinkering method partly, they are identical with said method basically.

(example 2)

Introduce the present invention below by illustration example 2.

(routine 2-1)

-the method for the whole display of immersion in nitric acid-

To introduce routine 2-1 in conjunction with Fig. 5,6A, 6B and 9.

Fig. 9 is a schematic diagram of showing the FPD that is used for routine 2-1.Represent identical parts with reference number identical among Fig. 1.This display is the surface conductive type electron source display (SED) that has electrode, wiring, insulating barrier, electronic emission element etc. on glass back plate.On soda-lime glass, scribble SiO on the backboard 1 ₂At SiO ₂Form the element electrode that faces with each other on the coating and be made of Pt, each is formed on two interelectrode electronic emission elements 11 and is made of Pd.In addition, form by what Ag, Pb, B etc. constituted and go up wiring 13 and connect up 12 down, and these PbO insulating barriers that connect up up and down of insulation.Framework 3 also is made of soda-lime glass.Reference character D x01-Dx0m and Dy01-Dy0n represent the outside terminal of container.

On panel 12, on the inner surface of soda-lime glass substrate 2a, be formed with the fluorescent film 2b that constitutes by secret note and fluorescent material, Al metal backing 2c is formed on the inner surface of fluorescent film.Secret note is made of PbO and C (carbon), and fluorescent material is made of ZnS and YS.Separator 4 utilizes the glass clinkering to be attached on the inner surface of display.

Separator 4 is made of glass substrate, and its surface scribbles conductivity ceramics.

Following this screen board of disassembling.

(1) from shell, only take out display, and the outside terminal of the container of dismantling.

(2) bleed vacuum makes it to return to atmospheric pressure.

(3) whole display is immersed in the nitric acid groove of 1.2N 24 hours.At this moment, be scratched, in the nitric acid groove, sink to the netted cage 21 that constitutes by the teflon resin for preventing glass.Display sinks to (Fig. 6 A) in the netted cage 21.

(4) from salpeter solution, pull on backboard, panel, framework and the separator of peeling off from the clinkering bound fraction, and they are transferred in the pure water rinse bath, then, be divided into recycling parts and scrap parts (Fig. 6 B).

(5) pull on each parts after, filter salpeter solution, it is separated into filtrate and soluble thing.

(6) the lead in sintered glass, the part A g in part Pd in the electronic emission element film and the wiring etc. is dissolved in this filtrate.For separating and reclaiming these metals, following enforcement electrolysis.

With reference to silver/silver chlorate normal electrode, filtrate is set in+current potential of 1.4-1.7V.Recovery and reuse are deposited on Pd and the Ag on the negative electrode, and implement the removing of harmful waste.

(7) be dissolved in filtrate owing to be used for the Y (yttrium) of fluorescent material, thus filtrate is adjusted to pH=0, so that reclaim Y.Then, add oxalic acid, deposition and recovery are as Y ₂(C ₂O ₄) ₃Y.

(routine 2-2)

The method of-the display that immersion (has framework and separator) except that panel in nitric acid-

Introduce routine 2-2 below in conjunction with Fig. 5,7A and 7B.

Following disassemble with routine 2-1 in identical FPD.

(1) carry out with routine 2-1 in (1) technology identical with (2).

(2) at the framework of two the part mark displays parallel with the nitric acid liquid level.Display is arranged on the teflon platform 31, and is adjusted to and makes liquid level under the mark of panel side, so that only soak the bound fraction of framework and backboard in nitric acid.Under this state, in the nitric acid groove of 1.2N, soak display 24 hours (Fig. 7 A).

(3) pull on the panel that has framework and separator, and transfer in the pure water rinse bath, clean the part that is immersed in the nitric acid, and utilize (Fig. 7 B) again.

(4) with routine 2-1 in (5) and (6) similar method treatment of nitric acid solution.

(routine 2-3)

-the method for the display of immersion except that backboard (having framework) in nitric acid-

Introduce routine 2-3 below in conjunction with Fig. 5,8A and 8B.

Followingly disassemble the FPD identical with Fig. 2-1.

(1) carry out with routine 2-1 in (1) technology identical with (2).

(2) similar with routine 2-2, the mark framework.Similar with routine 2-2, in the nitric acid groove of 1.2N, soaked display 24 hours, so that only in nitric acid, soak the bound fraction (Fig. 8 A) between framework and backboard.

(3) similar with routine 2-2, pull on the backboard that has framework, clean and utilize again (Fig. 8 B).

(4) filter salpeter solution, and in filtrate, add sulfuric acid, produce PbSO ₄Deposit.By this deposit of isolated by filtration, and implement harmful waste scavenging.

(5) because salpeter solution contains the Y in the fluorescent material, so solution is adjusted to pH=0.Add oxalic acid, deposition also reclaims as Y ₂(C ₂O ₄) ₃Y.

(comparative example 2)

For scrap or utilize again with routine 2-1 in identical FPD, by heat fused and peel off the sintered glass part, as method from the bound fraction peeling member.

Yet, being the PbO of fusing as the sintered glass composition, fusing point must be made as high to about more than 900 ℃.Clinkering bound fraction part is being set in show off high temperature following time, under certain conditions, glass substrate distortion or be full of cracks.Be difficult to set the condition of utilizing substrate again.

(embodiment 3)

Below by preferred another embodiment of illustration, specifically introduce the present invention.

More specifically say, a kind of backboard of image display device that reclaims is so that the method for the backboard in the image display device that recovery and reuse are discarded, said image display device is by backboard 1, panel 2 and support frame 3 constitute, said backboard 1 has a plurality of electronic emission elements, each electronic emission element by the element electrode of a pair of electronic emission element with said element electrode the conducting film that is connected is constituted, and has electron emission part at the part place of conducting film, said panel 2 has image forming part, when colliding, form image with the electronic emission element electrons emitted, said support frame 3 is connected with panel with backboard, press in keeping, backboard 1, panel 2 and framework 3 utilize sintered glass 5 to weld together, said method may further comprise the steps: soak welding portion in salpeter solution, dissolving sintered glass 5; Utilize ink-jet method to form conducting film.

Figure 10 is a diagrammatic sketch of showing the structure of image display device.Among Figure 10, backboard 1 comprises a plurality of electronic emission elements 11.Panel 2 comprises the image forming part that forms image with the collision of electronic emission element 11 electrons emitted.Support frame 3 is connected with panel 2 with backboard 1, keeps internal pressure.The sintered glass of reference number 4 expression seal back plate 1, panel 2 and support frames 3.These composed component composing images display unit 15.

As shown in figure 11, when interior forcing down, leak the image display device 15 of the outside terminal etc. of the container of having dismantled from it.Then, image display device 15 is immersed in the salpeter solution groove 6 that nitric acid is housed (Figure 11 A).In some cases, image display device 15 is introduced separator and is made the support component of anti-the atmospheric pressure.In the time of in being immersed in nitric acid, regulate the amount of salpeter solution as required, thus easy peel-away backings 1, and the workbench (not shown) is arranged in the salpeter solution groove 6, so that take off backboard 1 (Figure 11 B) from image display device 15.In this case, be coated onto near 4 dissolvings of the sintered glass of backboard.Perhaps, entire image display unit 15 can be dipped into the salpeter solution groove 6 that nitric acid is housed, and is separated into each member so that will install 15, thereby takes out backboard 1.The concentration of nitric acid of this moment is 0.1N (equivalent concentration)-several N, better is 0.1-2N.

Soak time is preferably several hours to tens hours, and being more preferably is 10 hours-24 hours.The backboard 1 that takes out is transferred to the pure water rinse bath, clean and drying.Inhomogeneous when preventing drying as required, can be cleaned backboard 1 with for example ketone or pure equal solvent.Can form drop (will introduce later on) cleaning backboard 1 with conducting film, so that when utilizing again, help to form conducting film.Figure 12 shows the situation of the backboard 1 that takes out in this way and clean.Reference number 41 expression backboard substrates, 42 and 43 is element electrodes.After the cleaning, remove conducting film and printed wiring, element electrode 42 and 43 is stayed on the backboard substrate 41.

The examples of material that is used for the substrate 41 of backboard 1 has silica glass, contain on a small quantity glass as impurity such as Na, soda-lime glass, by utilizing sputter, CVD or liquid phase epitaxy deposit SiO on soda-lime glass ₂The glass substrate of preparation and last deposit P doping SiO thereof ₂Glass substrate.The special restriction that the electrode material of element electrode is not had is as long as the material conduction just can.Be made of the noble metal that for example its characteristic such as Pt or Au can not change in nitric acid at element electrode, element electrode is stayed on the backboard substrate of cleaning, and can utilize again.When element electrode was made of its characteristic material that meeting changes in salpeter solution, element electrode was dissolved in the salpeter solution, so only utilize the backboard substrate again.

Among Figure 12, the upward wiring and the following wiring that are electrically connected to drive them with element electrode 42 and 43 are dissolved in the salpeter solution.Yet,, can stay on the backboard substrate so comprise the following wiring of element electrode because in element electrode and the following wiring can be formed simultaneously by same material.About being used for the sintered glass of bound fraction, adopting the sintered glass that contains a large amount of lead compositions so that can low-temperature bake, and mainly contain PbO.Lead composition in the sintered glass is dissolved in the salpeter solution, can reclaim by electrolysis deposition or as the deposit of acid/alkali reaction.

Backboard 1 utilizes the back substrate 41 with element electrode 42 and 43 to make.For example Y direction wiring 13 is formed on the element electrode 42, forms cutting 46, and forms directions X wiring 12.Wiring and interlayer insulating film can utilize method formation such as printing.Then, utilize ink discharge device to form the film that is used as the conducting film precursor by ink-jet method discharging conducting solution.Dry behind the solvent, the heat treatment resulting structures forms conducting film 49.In this way, just can utilize the backboard 1 of image display device 15 again.

(example 3)

Utilize example 3 specifically to introduce the present invention below.

(routine 3-1)

Introduce routine 3-1 below in conjunction with Figure 10-13E.

Figure 10 shows the structure according to the image display device of routine 3-1.Among Figure 10, reference number 1 expression backboard; The 2nd, on the inner surface of substrate 2a, have the panel of fluorescent film 2b, metal backing 2c etc.; The 3rd, support frame.Backboard 1, support frame 3 and panel 2 utilize sintered glass sealing, composing images display unit 15.Reference character D ox1, Dox2 ..., Dox (m-1), Doxm and Doy1, Doy2 ..., Doy (n-1), Doyn represents the outside terminal of container.

Among Figure 10, reference number 11 presentation surface conduction type electronic emission elements.In Figure 12, the Y direction that reference number 42 and 43 expressions are connected with a pair of element electrode of surface conductive electronic emission element among Figure 13 A-13E connect up 13 and directions X connect up 12.

Backboard substrate 41 scribbles SiO on soda-lime glass ₂Element electrode 42 and 43 is made of Pt.Y direction wiring 13 and directions X wiring 12 are made of Ag cream, and interlayer insulating film 45 is made of the PbO glass cream; Conducting film 49 is made of Pd.

Figure 11 A and 11B are the schematic diagrames of showing according to backboard recovery/round-robin method of the present invention.Among Figure 11 A and the 11B, reference number 1 expression has the backboard of a plurality of electronic emission elements; 2 expressions have by forming the panel of the image forming part of image with electronic emission element 11 electrons emitted collisions; The 3rd, connect backboard 1 and panel 2 and keep interior support frame of pressing; The 4th, be used for the sintered glass of seal back plate 1, panel 2 and support frame 3.These member composing images display unit 15.

Owing to press in low and be soaked in the salpeter solution groove 6 that 1.2N nitric acid is housed, leaked the image display device 15 of the outside terminal etc. of the container of having dismantled from it.Figure 11 A shows this state.In the time of in being immersed in nitric acid, the amount of nitric acid is adjusted to easy peel-away backings 1, and takes out backboard 1 (Figure 11 B) from image display device 15.The backboard 1 that takes out is transferred in the pure water rinse bath to clean backboard 1, with ketone or isopropyl alcohol clean and be dry again.

Figure 12 shows the backboard that takes out in this way and clean.Reference number 41 expression backboard substrates; 42 and 43 expression element electrodes.After the cleaning, remove conducting film and printed wiring, element electrode 42 and 43 is stayed on the backboard substrate 41.

Filter salpeter solution, following electrolysis filtrate.

With respect to silver/silver chlorate normal electrode, filtrate is set in+current potential of 1.4-1.7V.So Pd and Ag are deposited on the anode, PbO ₂Be deposited on the negative electrode.Reclaim these metals.Utilize Pd and Ag again, to PbO ₂The enforcement waste scavenging is handled.

Utilization has the backboard substrate 41 of element electrode 42 and 43 and makes backboard 1.Figure 13 A-13E is a diagrammatic sketch of showing each step of making backboard 1.

Ag cream has on the backboard substrate 41 of element electrode 42 and 43 (Figure 13 A) with the reservation shape silk screen printing, and is heated and roasting, forms Y direction wiring 13.Notice that the Y direction connects up thick about 20 microns, 100 microns of width (Figure 13 B).

Glass cream is printed as reservation shape, and is heated and roasting, forms interlayer insulating film 45.At this moment, cutting 46 forms not cladding element electrode 43.The width of interlayer insulating film is about 250 microns, thick about 20 microns of the part of interlayer insulating film and Y direction cloth line overlap, at remaining part thick about 35 microns (Figure 13 C).

Then, printing Ag cream on interlayer insulating film 45, and heating and roasting form directions X wiring 12.Note about 200 microns of the width of directions X wiring, thick about 15 microns, (Figure 13 D).

Piezo jet type ink discharge device applies the drop of the solution of organic palladium-monoethanolamine complex, thereby forms the film as the conducting film precursor.Dry behind the solvent, about 10 minutes of 300 ℃ of heating, precursor film is become the conducting film 49 that constitutes by thin PdO particle.Conducting film roughly has cylindrical, and diameter is 40 microns, and thickness is 15 microns (Figure 13 E).

In this way, reclaim backboard 1.With sintered glass welding backboard 1 and panel and support frame.Emptying receptacles satisfactorily, and form and handle and activate and handle, constitute image display device 15 shown in Figure 10.

The image display device of manufacturing is without any image aspect obvious defects or luminance deviation.

(routine 3-2)

Except that following, routine 3-2 relates to the round-robin method identical with routine 3-1.

In routine 3-1, Y direction wiring 13 is to print electrode.On the contrary, in routine 3-2, Y direction wiring 13 is made of Pt, forms simultaneously with element electrode 42 and 43, is connected with element electrode 42.As shown in figure 14, in being immersed in salpeter solution and after being cleaned, element electrode is stayed on the backboard with the Y direction wiring 13 that is connected with one of element electrode.

The ink discharge device that example is used to apply drop among the 3-1 is the piezo jet type.Example 3-2 need not this injection apparatus, and with spraying the alveolitoid device.Use this device, can the male recycling backboard 1 that is used for image display device 15.

(embodiment 4)

More specifically introduce the present invention below.

The invention is characterized in that the straightforward procedure without any damage reclaims separator when disassembling flat-panel monitor by utilizing, and utilizes it again.

According to separator recovery method of the present invention, the part with sintered glass welding separator and flat board or substrate is immersed in the salpeter solution, with the dissolving welding portion, thereby only separates separator.At this moment, adopt the anchor clamps deposit or support separator, avoid contacting any damage that causes with other separator or peripheral components.

Figure 15 is a schematic diagram of showing separator recovery method of the present invention and retracting device.Among Figure 15, reference number 151 expression salpeter solution grooves; 153 expression salpeter solutions, the 153rd, backboard or panel; The 154th, separator; The 155th, the separator container; The 156th, be used for the strutting piece of backboard or panel; The 157th, sintered glass.

Separator 154 can be welded on panel, backboard or the two boards.In this case, separator 154 is welded on the panel.

When panel and separator keep by the sintered glass welding, separate backboard, panel and framework.The method of separating backboard, panel and framework comprises patterning method, sintered glass parts spraying salpeter solution dissolving sintered glass or the method for soaking the sintered glass part in salpeter solution by welding at each several part, the method for passing through the heating for dissolving sintered glass.Owing to can not damage separator, wish to adopt this method with the method for nitric acid dissolve.

Then, separator and panel are immersed in the salpeter solution.By strutting piece 156 support panels 153, and the 154 prone whiles of separator, separator and panel soaked, as shown in figure 15.

Sintered glass 157 dissolvings that separator 154 and panel are 153 separate them.At this moment, the container 155 shown in Figure 16 A and the 16B is used to prevent that separator 157 from falling into salpeter solution container 151, contacts with other separator or peripheral components to be damaged.

The size of container 155 is almost identical with panel 153, according to the layout of separator 154, has groove 148.Container 155 can not damage separator by for example stable with respect to nitric acid made such as fluoroplastics.For preventing that solution from staying said groove, the bottom of entire container or groove can be netted.Container 155 is arranged on separator below 154, the separator 154 that separates with the panel of depositing from groove 148 153, thus prevent 154 contacts of each separator.

After removing panel 153, from salpeter solution container 151, pull on container 155.Then, in leaving this container in, separator is carried out subsequently cleaning step and drying steps.

Notice that the shape of separator container 155 is not limited to above-mentioned situation.Shape shown in Figure 16 A and the 16B only is the example of container shapes.As shown in figure 17, the many recessed container 149 that can adopt each to be a bit larger tham separator 154, and be arranged under the separator, to deposit the separator 154 that separates from panel 153.When this method of employing, the container 149 that pulls from salpeter solution container 151 can concentrate in the close limit.So, can reduce the size of rinse bath and dry slot subsequently.

Figure 18 is the diagrammatic sketch of showing according to another embodiment of separator recovery method of the present invention and retracting device.Among Figure 18, reference number 151 expression salpeter solution grooves; The 152nd, salpeter solution; The 153rd, backboard or panel; The 154th, separator; The 157th, sintered glass; The 158th, the workbench of backboard or panel; The 159th, separator support arm, the 160th, the end of each arm.

Separate backboard, panel and framework, disassemble into separator 154 and keep utilizing sintered glass to be welded on state on the backboard.Then, separator 154 is immersed in the salpeter solution groove 151.

Separator 154 can be welded on panel, substrate or two plates.Although the present invention can be applicable to any situation, supposition separator 154 is welded on the panel.

According to infusion method, panel 153 is located on the workbench 158, and separator 154 faces down.Then, clamp the end of each separator 154 with the end 160 of respective arms 159.Workbench 158 moves down, so that panel 153 and welding portion 157 are immersed in the salpeter solution 152.Since predetermined fixed separator 154, fall from the separator 154 that panel 153 separates preventing.This can prevent the separator damaged.Notice that arm 159 and its end 160 must be made of for example stable with respect to nitric acid materials such as fluorine-based compound.

When utilizing terminal 160 to fix, can carry out cleaning step and drying steps subsequently to separator 154.In cleaning step, stay sintered glass 157 dissolving on the separator 154, and remove the attachment material again that dissolves from panel 153 and substrate.Cleaning step generally carries out in new salpeter solution groove.Then, separator 154 is transferred in the pure water groove, at this last separator 154 that cleans.

Drying steps can adopt any method, as long as evaporating pure water just can.For example, can utilize hot gas drying separator 54.

When utilizing dry separator again, must detect them and whether be damaged.Can adopt suitable detection method.For example, can adopt naked eyes to confirm the existence whether method of defective, or whether have the method for be full of cracks by the heating detection.

Figure 19 A and 19B are the diagrammatic sketch of showing separator 154.In general, separator 154 has thin sheet form, and its length and width are tens mm, and thickness is below 300 microns, constitutes by form anisotropic conductive film 162 on the surface of insulated substrate 161.For reaching a large amount of separators 154 that this purpose needs, and be fixed to sintered glass on the surface of the inner surface of panel 153 or substrate with being spaced of needs.When separator 154 is fixed on the backboard, handle them to be fixed to the identical mode of situation on the panel with separator 154.

The example of conducting membrane material has for example nitride and the carbon of oxide, aluminium and the transition metal alloy of metals such as chromium, nickel and copper.

Insulated substrate 161 examples of material of separator 154 have silica glass, contain a small amount of glass as impurity such as Na, soda-lime glass and pass through stacked SiO on above-mentioned each substrate ₂The substrate of insulating barrier preparation.

As mentioned above, conducting film 162 is formed on the surface of separator.According to material, conducting film 162 can the stable or dissolving with respect to nitric acid.When conducting film 162 is made of the material stable with respect to nitric acid, after cleaning, drying and the detection step, recycling separator.When conducting film 162 is made of the material that is dissolved in nitric acid, fully is dissolved in salpeter solution, cleaning, drying and detects step having carried out film, and after forming conducting film again, can utilize separator again.

(example 4)

Utilize example 4 specifically to introduce the present invention below.

(routine 4-1)

Utilize and shown in Figure 15 reclaim separator according to separator retracting device of the present invention.The sintered glass 157 of the bound fraction that device dissolving panel 153 among Figure 15 and separator are 153 separates panel 153 and separator 154.Among Figure 15, reference number 151 expression salpeter solution grooves; The 152nd, salpeter solution; The 153rd, panel; The 154th, separator; The 155th, the separator container; The 156th, the panel support part; The 157th, sintered glass.

Figure 20 is the schematic diagram of showing according to each step state of separator recovery method of the present invention.Figure 20 A shows the step of separating base plate, panel and framework.Figure 20 B shows the step of separating panel and separator, and Figure 20 C and 20D show the separator cleaning step, and Figure 20 E shows the separator drying steps.

Example 4-1 adopts 25 separators 154 to be welded on the panel 153 that is made of the soda-lime glass that is of a size of 300mm * 250mm * 2.8mm.Each separator 154 by at height be 2.8mm, thick be that 200 microns and length are to form nitride film on the soda-lime glass substrate of 40mm to make conducting film and form.

Specifically introduce routine 4-1 below in conjunction with Figure 15,16A, 16B and 20A-20E.

(1) disassembles shell, take out the unit that constitutes by the backboard 163, panel 153 and the framework 164 that utilize sintered glass 157 welding.

(2) salpeter solution of spraying 0.2N on welding portion is to dissolve them gradually.After having dissolved nearly all sintered glass, utilize strutting piece 156 that panel 153 is pulled, and with framework apart (Figure 20 A).

(3) container 155 of depositing separator sinks in the salpeter solution groove 151 of long 400mm, wide 350mm, contains the salpeter solution of 0.2N in the solution tank.As shown in figure 16, this container is long 300mm * wide 250mm * high 10mm, according to the distribution of separator, have 25 grooves (long: 50mm, wide: 5mm, the degree of depth: 4mm).This container is made of the fluoroplastics stable with respect to nitric acid, can not damage separator.Each groove part is netted, can not deposit any solution.

Separator 154 welding panel 153 thereon is immersed in the salpeter solution groove 151, and separator 154 faces down.The sintered glass dissolving that separator 154 and panel are 153 is to separate them.Each separator 154 drops in the corresponding recesses of container 155.

After having taken out the panel 153 that separates from separator 154, from the salpeter solution groove, container 155 pulled (Figure 20 B).

(4) separator 154 sinks in the cleaning salpeter solution groove of the salpeter solution that 0.2N is housed with container 155.In this step, stay the sintered glass dissolving on the separator 154, and removed the attachment material again (Figure 20 C) that dissolves from panel 153 and substrate.

(5) separator is transferred in the pure water groove with container 155, cleaned separators 154 at last with pure water 165 at this.Notice that nitric acid rinse bath and pure water rinse bath nitric acid groove big or small and among Figure 20 B equates (Figure 20 D).

(6) blow separator 154 in the container 155 with hot gas 166, dry they (Figure 20 E).

(7) when utilizing the separator that reclaims in this way again, detect separator 154.About detection method, peel off, whether exist scuffing, deposit and other dirt with optics microscopic examination conducting film.Then, detect whether there is be full of cracks, get rid of separator with defective glass substrate by heating.In in being contained in container or after taking out one by one, separator is carried out these detections.The result who detects is, has 10% separator to be excluded because of defective approximately, and most separators can utilize again.Directly utilize the zero defect separator, assemble new display.

(routine 4-2)

Example 4-2 adopts the display that has with routine 4-1 same structure.Except that by cutting from shell split-frame, backboard and panel, adopt the method identical to reclaim separator with routine 4-1.

As shown in figure 21, cutting frame, substrate and panel separate four welding portions and the peripheral region that has separator.Separator recovery method after the cutting is identical with step (3)-(6) among the routine 4-1.

The result who detects is, about 15% separator is owing to defective is excluded, and most separators can utilize again.

(routine 4-3)

Example 4-3 adopts the display that has with routine 4-1 same structure.Except that when separating panel and separator, adopting shown in Figure 17 A and the 17B the container, utilizes the method recovery separator identical with routine 4-1.

Introduce routine 4-3 below in conjunction with Figure 15,16A, 16B, 17A, 17B and 22a-22D.

Adopt the separating of panel and framework with routine 4-1 in step (1) method identical with (2).

(3) fix 25 containers 167 that are used to deposit separator 154 on pedestal 168, quantity equates with separator, and sinks in the salpeter solution groove that the 0.2N salpeter solution is housed.

Each container has rectangular-shaped, long 60mm, wide 10mm, high 10mm.Shown in Figure 17 A and 17B.Long 50mm, wide 5mm, the groove of dark 8mm is formed on above the container.Each groove reticulates, and can not deposit any solution, and groove is made of the fluoroplastics stable with respect to nitric acid, can not damage separator.These containers are fixed on the pedestal, so as to be located at each separator under, and sink in the salpeter solution groove 151.

Separator 154 welding panel 153 thereon is immersed in the salpeter solution groove 151, and separator 154 faces down.Sintered glass 157 dissolvings are to separate panel 153 and separator 154.Each separator 154 is fallen in the groove of corresponding container.

After moving the panel 153 that separates from separator 154, from the salpeter solution groove, with pedestal 168 container 167 is pulled that (Figure 22 a).

(4) close to each other each container is set again after, separator is sunk in the cleaning salpeter solution groove that the 0.2N salpeter solution is housed with each container.In this step, stay the sintered glass dissolving on the separator, and remove the attachment material again (Figure 22 B) that dissolves from panel and substrate.

(5) utilize the method identical, clean separator, dry and detection with pure water with routine 4-1.The rinse bath of noting being used for routine 4-3 is than being used for the little of routine 4-1, and length is 200mm, and wide is 150mm (Figure 22 C and 22D).

The result who detects is, about 10% separator is owing to defective is excluded, and most separators can utilize again.

(routine 4-4)

In routine 4-4, utilize the device identical to reclaim separator with routine 1-1.Example 4-4 adopt with routine 4-1 in identical 25 separators weld thereon panel.Each separator is by forming nickel oxide (NiO on the silica glass substrate ₂) film prepares as conducting film.

Separate, clean and dry each separator with the method identical with step (1)-(6) among the routine 4-1.

Detect the separator that reclaims in this way.About the method that detects,, peels off by light microscope but confirming the scuffing and the film of deposit, other dirt, conducting film.Then, detect whether there is be full of cracks, to get rid of the defective separator by heating.The result who detects is, about 10% separator is owing to defective is excluded, and most separators can utilize again.

(routine 4-5)

Example 4-5 adopts the flat-panel monitor with routine 4-1 same structure.

About the separator retracting device, routine 4-5 adopts device as shown in figure 18.Among Figure 18, reference number 151 expression salpeter solution grooves; The 152nd, salpeter solution; The 153rd, backboard or panel; The 154th, separator; The 157th, sintered glass; The 158th, the workbench of backboard or panel; The 159th, separator support arm, the 160th, the end of each arm.The 150th, be configured for the elastomeric element of support table with fluoroplastics.Workbench 158 and arm 159 are made of the fluoroplastics stable with respect to nitric acid, and terminal 160 are made of the fluorubber that does not damage separator.

Introduce routine 4-5 below in conjunction with Figure 18 and 23A-23E.

Panel and framework separate step (1) method identical that adopts with routine 4-1 with (2).

(3) panel 135 is arranged on the workbench 158, and separator faces up, and then, clamps the end (Figure 23 A) of each separator 154 with the end 160 of support arm 59.Workbench 158 moves down, thereby soaks the welding portion 157 of panel 153 in containing the salpeter solution groove 151 of 0.2N salpeter solution.Confirmed the sintered glass dissolving, separated separator 154 after, from the salpeter solution groove, pull on separator 154 (Figure 23 B).

(4) when separator clamps with support component, they are sunk in the cleaning salpeter solution groove that the 0.2N salpeter solution is housed.In this step, sintered glass on the separator is stayed in dissolving, and removes the attachment material again (Figure 23 C) that dissolves from panel and substrate.

(5) separator is transferred to the pure water groove, cleaned (Figure 23 D) at last at this.

(6) with hot gas drying separator (Figure 23 E).

(7) utilize the method identical with routine 4-1 to detect the separator of recovery, find about 10% separator owing to defective is excluded, most separators can utilize again.

(routine 4-6)

Outside divide spare was welded on substrate and the panel, routine 4-6 adopted the display that has with routine 4-1 same structure.

Introduce routine 4-6 below in conjunction with Figure 15 and 24A-24C.

(1) from shell, takes out the unit that constitutes by substrate 163, panel 153 and framework 164 with the sintered glass welding.

(2) utilize with routine 4-2 in identical method, the welding portion between cutting frame, substrate and panel (Figure 24 A).

(3) gradually this unit is dipped in the salpeter solution groove 151 that contains the 0.2N salpeter solution, real estate is downward.When the welding portion between substrate and separator sank to solution, the infusion unit process stopped (Figure 24 B).

In this way, only dissolve the sintered glass between substrate and separator, thereby they are separated (Figure 24 C).

(4) from the salpeter solution groove, pull on substrate after, utilize with routine 4-1 in step (3)-(7) identical method, separate and the recovery separator from panel.

After utilizing this method to reclaim, about 15% separator is owing to defective is excluded, and most separators can utilize again.

(embodiment 5)

Figure 25 shows according to the present invention the flow chart of each step that reclaims the method for fluorescent material from display unit.Introduce each recycling step below in conjunction with Figure 25.

Handled/display unit (S20) of scrapping is to scribble fluorescent material on the panel and by electron beam or the luminous display of ultraviolet radiation fluorescent material.The example of this demonstration generally has panel to scribble the CRTs and the flat-panel monitor of fluorescent material.

Before CRT or flat-panel monitor separate, utilize the pattern of transducer identification display device from shell.Take data (for example shape of size, display disassembling method, the brush size that is applicable to panel-shaped, shape, pump unit) from database read in later step.

According to the data that obtain in the identification step, from shell, take out display, display is fixed on the anchor clamps, so that disassemble panel from display easily.About used anchor clamps this moment,, select anchor clamps for use with optimum shape according to the resulting data of identification step.When plastics and metal parts were attached to display, requiring needed, dismantle they (S21).

After having discharged the decompression state in the display that is fixed on the anchor clamps, display is sent into next step.

Separate (disassembling) step (S22) at panel,, pull down panel from display along between the cone of panel and CRT or the sintered glass part between the framework of panel and flat-panel monitor.About disassembling method, can adopt the method for cutting panel and interpyramidal display and with the sintered glass method partly of stripping solution peel seal panel and cone.About the CRT disassembling method, can adopt method (Japanese Laid-Open Patent Application 07-029496) with heater strip cutting CRT, cause thermal deformation disassemble the method for CRT (Japanese Laid-Open Patent Application 05-151898), in heating, apply ultrasonic vibration with the method for disassembling CRT, and make the method (Japanese Laid-Open Patent Application 07-045198) of stripping solution with nitric acid.Need for a long time with expensive owing to prevent the wet treatment that thermal deformation produces, so better be the cutting of sawing with wire.Utilize the glass dust of pump unit suction generation this moment and remove it.Cone and backboard are ground into glass fragment.

The panel of removing is fixed on the anchor clamps, and inner surface makes progress, and delivers to sweeping and drawing step (S28).

If only reclaim fluorescent material, then sweeping step can only utilize a cleaning operation to finish.For utilizing panel again, can repeat the sweeping step, till inner surface satisfies specification requirement.In this case, can take to be used for the sweeping that the polishing wheel of mirror finish inner surface replaces removing fluorescent material.

About the used brush of sweeping step of the present invention,, select the brush of its shape corresponding to the R (radius) of panel inner surface for general CRT.For Flat-Panel CRT or flat-panel monitor, select the brush that adapts with planar surface.When adopting pestle to smash motion process (introducing later on), even after having considered that pestle is smash motion, also in the treatment step of flat board, adopt brush with the R bending.

Motion to the used brush of the present invention is not particularly limited, and comprises simple rotation motion and at panel 2 lip-deep crankmotions.If adopting, the motion of brush causes that brush 171 is rotated motion and gyration (Figure 26) simultaneously, or in a some rotating shaft around the method (Figure 27) of center line along its rotary brush, then clear away fluorescent material, complanation inner surface easily fast.

To the nozzle form of the used pump unit of the present invention and suction force without limits, as long as can aspirating and recycle fluorescent material 2b and the secret note that brush sweeps, pump unit just can.Pump unit can be installed in the brush, or is arranged on around the brush, to prevent the fluorescent material scattering.Be the fluorescent material of suction face panel area satisfactorily, pump unit better is mounted in the brush.

Utilize method is separated and purification the present invention reclaims the fluorescent material 2b and the secret note of known employing any device.For example, can be with containing NaOH, NaClO and H ₂O ₂The fluorescent material that handle to reclaim of the aqueous solution, and handle (Japanese Laid-Open Patent Application 06-108047) with weak acid.Perhaps, the fluorescent material that can utilize weak acid handle to reclaim, thus leaching goes out rare earth element, can add oxalic acid, and rare earth element is changed into oxalates, then, and can the roasting oxalates, to obtain rare earth oxide (Japanese Laid-Open Patent Application 08-333641).

About the example of flat-panel monitor, below will introduce the structure of the panel display apparatus that adopts surface conductive type electronic emission element.Figure 29 is a perspective view of showing the display unit that has adopted separator, and wherein screen board is by local excision, to show internal structure.

Among Figure 29, reference number 11 expression electronic emission elements; The 1st, backboard; The 3rd, sidewall (framework); The 2nd, panel.Backboard 1, sidewall 3 and panel 3 constitute gas-tight container (shell 15), to keep display screen intralamellar part vacuum.Separator 4 is set if desired, is damaged by atmospheric pressure and be out of shape to prevent shell.When the assembling gas-tight container, must seal each parts, to obtain enough intensity, keep airtight conditions.For example, apply sintered glass, and in air or the nitrogen atmosphere, at 400-500 ℃ of following sintering more than 10 minutes, to seal each parts at binding site.

Substrate 41 is fixed on the backboard 1, and N * M cold cathode type electronic emission element 11 is formed at that (N and M=are equal to or greater than 2 positive integer, can set according to the display pixel number of hope on the substrate 41.For example, in the image processing system of high definition television display, wish to set more than the N=3000, more than the M=1000).N * M cold cathode type electronic emission element 11 pressed the simple matrix form and arranged, and has wiring 12 of M bar directions X and N bar Y direction wiring 13.

Among this embodiment, multiple electron beam source substrate 41 is fixed on the backboard 1 of gas-tight container.Yet if the substrate of multiple electron beam source 41 has enough intensity, the substrate 41 of multiple electron beam source can be as the backboard 1 of gas-tight container.

Fluorescent film 2b is formed on the lower surface of panel 2.For colour display device, it is the three primary colors fluorescent materials that fluorescent film 2b is coated with the red, green and blue that is used for the CRT field.Secret note is formed between each fluorescent material.Even forming the purpose of secret note is to prevent that the electron beam irradiation position from having skew slightly, can't discern display color.And, prevent display contrast's decline by preventing outside reflection of light.

Note, when forming monochromatic display panel, can on fluorescent film 2b, add monochromatic fluorescent material, always do not need to use secret note.

The known metal backing 2c in CRT field is formed on the surface of the fluorescent film 2b on the backboard side.The purpose that forms the 2c of metal backing is to utilize the direct reflection of the light of fluorescent film 2b emission partly to improve light utilization efficiency; protection fluorescent film 2b does not collide with anion; adopt metal backing 2c to apply the electrode of beam voltage, and adopt metal backing 2c to make the conducting path of the electronics of fluorescence excitation film 2b.Metal backing 2c is by forming fluorescent film 2b, make the fluorescent film smooth surface and utilizing vacuum deposition deposit Al on smooth surface to form on display panel substrate 2a, note, when the fluorescent material that is used for low accelerating voltage is used as fluorescent film 2b, can be without metal backing 2c.

For applying accelerating voltage or improving the conductibility of fluorescent film, the transparency electrode that ITO for example etc. constitutes can be set between display panel substrate 2a and fluorescent film 2b.

Reference character D x1-Dxm and Dy1-Dyn and Hv represent the electric connection terminal of airtight construction, are used to be electrically connected display panel and electronic circuit (not shown).Dx1-Dxm is used to be electrically connected the directions X wiring of multiple electron beam source; Dy1-Dyn is used to be electrically connected the Y direction wiring of multiple electron beam source, and Hv is used to be electrically connected 2c at the bottom of the metal black of panel.

(example 5)

Specifically introduce this example of the present invention below in conjunction with accompanying drawing.

(routine 5-1)

Be made of panel, framework and backboard, and adopt the panel display apparatus of surface conductive type electronic emission element, be fixed on the anchor clamps, panel faces down, and the pressue device with rubber suction nozzle closely contacts with backboard, with fixing display.Break the end of blast pipe, discharge the vacuum state in the display,, disassemble this display with the clinkering parts between energy cuts device cutting panel and framework.

Remove backboard and framework.With the inner surface of rotating brush (seeing Figure 27) sweeping panel 2 with pump unit sweeping fluorescent material (about 20 minutes) and to carry out when pestle smashes motion, suction fluorescent material 2b and secret note, and reclaim them from SS 172.

After having reclaimed fluorescent material 2b fully, polished inner surface 30 minutes is to realize mirror finish.

Black matrix part on the inner surface of panel is suppressed to below 15 microns with the ripple that scribbles fluorescent material 2b part, and confirms that panel can be directly as the panel that recycles.

(comparative example 5-1)

Similar with routine 5-1, the panel of disassembling is immersed in the oxalic acid aqueous solution, remove fluorescent material, remove black matrix with water under high pressure then.Observe about 85 microns ripple in part that is coated with fluorescent material and the part that is coated with black matrix.

(routine 5-2)

CRT under being separated by shell cuts electron gun and deflecting coil.CRT is fixed on the anchor clamps, and panel faces down.Pressue device with rubber suction nozzle closely contacts with cone, with fixation of C RT.Peel off around the explosion-proof band at the sintered glass position of CRT, and remove adhesive by grinding operation.With the energy cuts device CRT is divided into panel and cone.

Remove cone, with the inner surface of gyration brush (seeing Figure 26,28A and 28B) the sweeping panel with pump unit, the cleaning fluorescent material aspirates and reclaims fluorescent material and black matrix simultaneously.

After having removed fluorescent material fully, replace rotating brush with polishing wheel.Polished inner surface 30 minutes is to realize mirror finish.

Black matrix part on the inner surface of panel is suppressed to below 15 microns with the ripple that scribbles fluorescent material 2b part, and confirms that panel can be directly as the panel that recycles.

Figure 28 A and 28B are the profiles of showing the structure of brush and pump unit.In Figure 28 A, SS is formed in the brush 171, and dust is sucked mechanism's 173 suctions.In Figure 28 B, be coated with pump unit 174 on the brush 171, be used to aspirate dust.In addition, utilize the air-flow that aspirates to be changed into and rotatablely move, and be used as the actuating force of brush 171 by worm gear machine 175.

(embodiment 6)

Specifically introduce embodiments of the invention 6 below in conjunction with accompanying drawing.Among this embodiment, when reclaiming panel, backboard, framework, separator etc., the gas-tight container among the FPD must return to standard atmospheric pressure, is because gas-tight container is in and is lower than about 10 ^-5Under the air pressure of pa.In this case, if gas-tight container inside is returned under the situation of standard atmospheric pressure, FPD is handled in directly cutting, fusing etc., can't effectively reclaim each parts.But a step of the method that reclaims about recirculation will be introduced the process that vacuum airtight container is returned to standard atmospheric pressure.

Figure 30 is the schematic diagram of showing according to the embodiment of image display device of the present invention.Among Figure 30, reference number 201 presentation video displays; 202 expressions are used to keep the gas-tight container of image display device pressure; The 203rd, introduce gas-tight container, be used to the parts of anti-atmosphere that keep gas-tight container stable; The 204th, be connected to realize the device of pressure with exhaust apparatus; The 205th, make gas-tight container inside recover atmospheric device gradually.

Figure 31 shows the schematic diagram of FPD conduct according to the example of the embodiment of image display device of the present invention.Among Figure 31, reference number 2 expressions are made of glass substrate 2a, phosphor screen 2b and metal backing 2c as the panel of image display; The 1st, backboard; The 3rd, framework.Panel 2, backboard 1 and framework 3 constitute gas-tight container 202.Gas-tight container 202 comprises that the device 204 and the gas-tight container inside that makes shown in Figure 30 that are connected with exhaust apparatus return to atmospheric device 205.Gas-tight container 202 comprises separator 4, as an example of the member of anti-the atmospheric pressure.

Be applicable to that image display device of the present invention is to keep inner display unit under pressure below atmospheric pressure.The example of this display unit is just like image display devices such as CRT, plasma panel plate (PDP), the flat-panel picture display device that comprises surface conductive type electronic emission element, a flat-panel picture display device that comprises emission (FE) type electronic emission element, the flat-panel picture display device that comprises metal/insulator/metal (MIM) type electronic emission element, vacuum fluorescent display, a Flat-Panel CRT and thin FPD.

Compare with the electroluminescence screen board with liquid crystal indicator, for example the image display 15 of image display device such as CRT remains on the pressure of depressing far below standard atmosphere.This is that light is controlled as the cause of displays image information because the thin fluorescent material of electron radiation etc. are luminous.In other words, unless with hypotension to can set can eliminate satisfactorily as with the atmosphere of the barrier of electron collision, otherwise uncontrollable electron orbit.The pressure that can control electron orbit better is below the 10Pa, more preferably below the 1Pa preferably according to the structure choice of image display device.

About the material of the gas-tight container that keeps image display 15 internal pressures, panel 2 is mainly by can outsidely showing internal image information and constituting to the various glass materials of the visible light transmissive that is enough to keep internal pressure by force.Panel 2.Framework 3 and backboard 1 better are made of thermal coefficient of expansion material much at one, keeping inner airtight, and can be with having the sealings such as sintered glass of thermal coefficient of expansion much at one.

In internal pressure and external pressure very not simultaneously, for example adopt the members of anti-atmospheric pressure the such as separator 4,, prevent gas-tight container 202 distortion to increase the intensity of gas-tight container 202.Specifically, in the large-screen image display unit, if gas-tight container 202 is made thickly, increase the intensity of container, then the weight of image display device strengthens, and image display device is difficult to use in civilian.

For reducing the weight of image display device, except that the outer wall of airtight container 202, adopt the member of anti-the atmospheric pressure.In thin FPD, can be consistent as the interval of 1 of the panel 2 of the interior image displaying part of the screen board that constitutes gas-tight container 202 and backboard, thereby on the surface of entire image display unit, obtain uniform images.For this reason, many separator 4 is set as the member of anti-the atmosphere, keep panel 2 and as 1 of the backboard in the screen board of gas-tight container 202 apart from basically identical.

When screen board becomes big, must in screen board, adopt separator 4 in many positions, to suppress the deformation of 1 of panel 2 and backboard.The shape of separator 4 and quantity etc. according to the size of panel 2 and backboard 1, intensity and between distance, the decisions such as intensity of framework 3.

Have the device 204 that is connected with exhaust apparatus such as for example vacuum pump owing to have in this way the gas-tight container 202 of the image display that constitutes, can reduce the interior pressure of gas-tight container 202.After gas-tight container 202 is evacuated to sufficient low pressure, can seal gas-tight container, with the inside that keeps gas-tight container 202 in low pressure.Then, drive the image demonstration of image display device.

Gas-tight container 202 is connected to the inside that makes gas-tight container 202 and progressively returns to atmospheric device.In general, the amount Q of the gas that flows during leakage is provided by following formula

Q＝C(P1-P0)[Pa·m ²/s]????????????????…(1)

C wherein: be conductivity [m ²/ s]

P1: atmospheric pressure [Pa]

P0: the interior pressure [Pa] of gas-tight container

P1-P0: poor [Pa] between pressing in atmospheric pressure and the gas-tight container

For preventing infringement, must prevent that gas from flowing into gas-tight container suddenly to gas-tight container and internal structure.For this purpose, wish the amount Q of gas is suppressed to about 10 ¹Pam ²Below/the s.From equation (1), the mechanism that will have the leakage device with the following conductivity C of about 10-4m2/s is attached to gas-tight container 202, as making gas-tight container inside progressively return to atmospheric device 205.

About making gas-tight container inside progressively return to atmospheric device 205, the elongated pipeline or the porous material that slow leak valve are provided, adapt with its specification to gas-tight container.Make gas-tight container inside progressively return to atmospheric device 205 and be attached to device 205 is connected gas-tight container 202 with the extraneous air side position.Device 205 also is connected to exhaust apparatus from the extraneous air side, with the sealing gas-tight container.Utilize this structure, when gas-tight container 202 keeps low pressure, gas-tight container 202 also with the deadend of extraneous air side.So that when utilizing image display device again, the sealed contacts on the cancellation extraneous air side is so that the interior pressure of gas-tight container progressively returns to atmospheric pressure in the inside of leaking gas-tight container.

Among this embodiment, make gas-tight container inside progressively return to atmospheric device 205 and be attached on the side of gas-tight container 202.Yet device 205 position is not limited thereto, and device 205 is attached on the position of the side surface of turning, lower surface or gas-tight container 202 for example, can not hinder the work of image displaying part at this device 205.

If desired, filter etc. can be set, and it is connected to the mechanism that progressively introduces gas.

When utilizing used image display device again, according to processing subsequently, introduce inert gas, nitrogen, air gradually, do not have the air of wet steam etc.

When the defective of Chan Shenging need be repaired during manufacture, select suitably to introduce gas, so that do not influence manufacturing step subsequently, the gas-tight container 202 that remains on low pressure progressively returns to atmospheric pressure, disassembles and repair image display.

(example 6)

Utilize example 6 specifically to introduce the present invention below.

(routine 6-1)

Introduce routine 6-1 below in conjunction with Figure 30 and 31.Figure 30 is a plane graph of showing the structure of image display device of the present invention.Figure 31 shows the example of FPD as image display device of the present invention.

The separator 214 that acts on anti-atmospheric pressure structure is arranged in the gas-tight container 202 as image display, and image display is made of panel 2, backboard 1 and framework 3.Gas-tight container 202 is connected with the exhaust jockey 204 that is connected to exhaust apparatus.After inside remains on low pressure, the sealing gas-tight container.In routine 6-1, be emptied to about 5 * 10 ^-2Behind the Pa, the sealing gas-tight container.Gas-tight container 202 is connected to atmospheric pressure recovery device 205, is used to make gas-tight container inside progressively to return to atmospheric pressure.Example 6-1 adopts has about 10 ^-7m ²The slow leak valve of the conductivity C of/s.Also be emptied to about 5 * 10 in air side ^-2Behind the pa, seal this slow leak valve.For disassembling image display device, the extraneous air side that is used to make gas-tight container inside progressively return to atmospheric device 205 is opened, and gas-tight container 202 is leaked.After disassembling and removing, confirmation screen board inside does not find that separator 4 is compromised, and particularly gas-tight container 202 internal parts are not scratched.

As a comparison, open the exhaust jockey 204 that is connected with the exhaust apparatus of identical image display unit, leak the gas in the gas-tight container 202.Screen board inside is opened wide to atmospheric pressure fast.Yet inner separator 4 is damaged, and fragment can produce many scuffings on panel 2, backboard 1 and framework 3.

(routine 6-2)

Example 6-2 uses the surface conductive type electron source display (SED) of matrix driving mode as image display device illustration shown in figure 32.The wiring 12 and 13 that is used for the electron source of drive surfaces conduction type electron source is formed at backboard 1.The wiring 12 and 13 be directions X (Dox1, Dox2 ..., Doxm) and the Y direction (Doy1, Doy2 ..., Doyn) element wiring.SED has the structure that comprises separator 4, as shown in figure 31.Similar with routine 6-1, routine 6-2 also adopts atmospheric pressure recovery device 205, is used to make the inside of gas-tight container progressively to return to atmospheric pressure.

After screen board is finished basically, find part screen board defectiveness.So the outer air side that is used to make the inside of gas-tight container progressively to return to atmospheric atmospheric pressure recovery device 205 is opened wide, and screen board is leaked, and repair-deficiency.Then, emptying screen board inside, and utilize the exhaust jockey 204 that is connected with exhaust apparatus to seal again again.Simultaneously, emptying and sealing are used to make the inside of gas-tight container progressively to return to the outer air side of atmospheric atmospheric pressure recovery device 205, finish image display device.When image display device is driven display image, find to have repaired defective, there is not defective to produce.

(embodiment 7)

Introduce embodiments of the invention 7 below in conjunction with accompanying drawing.

Figure 33 A is the embodiment profile of showing according to flat-panel monitor of the present invention, and Figure 33 B is the plane graph that cut away the part of flat-panel monitor shown in Figure 33 A.

Flat-panel monitor of the present invention comprises backboard 222, panel 224, support frame 225 and separation frame 226 at least, said backboard has many electronic emission elements 221 that are arranged on the glass substrate, panel 204 is arranged in the face of backboard 222, and having an image displaying part 223, separator 226 is used to keep the interval Chinese People's Anti-Japanese Military and Political College air pressure of 224 of backboard 222 and panels.Backboard 222, panel 224, support frame 225 and separator 226 utilize sintered glass 229 combination airtightly, constitute flat-panel monitor.Sintered glass 229 generally is the low-melting glass that mainly contains lead oxide etc.

In conjunction with each parts the time, separator and substrate utilize the first sintered glass combination, and backboard and support frame utilize 228 combinations of the second fuse glass, and panel and support frame utilize 229 combinations of the 3rd sintered glass.In three kinds of sintered glasses, sintered glass 228 and 229 has different softening temperatures.In conjunction with first sintered glass 227 of separator 226 have be equal to or higher than in the second and the 3rd sintered glass 228 and 229 arbitrary and in than high softening temperature.Any softening temperature all drops on 350 ℃-470 ℃, better is that the temperature with all the other sintered glasses differs more than 20 ℃.

In multiple sintered glass, any in the second and the 3rd sintered glass 228 and 229 have according to technology determine than high softening temperature.Separator 226 is attached on any of backboard 222 and panel 224, and the plate of institute's combination can be determined arbitrarily.

In manufacture process, by applying bound fraction with sintered glass, and the heating sintered glass is to it more than softening temperature, in conjunction with each parts.In practical operation, under about 300 ℃, in air, carry out heat treated, to remove so-called adhesive ingredients (this step is so-called calcining) in the sintered glass.Then, more than 400 ℃, in inert gas Ar, carry out heat treated, with the solder bond part.Process to bonded block is not particularly limited.Multiple sintered glass can apply simultaneously, and is heated to above the temperature of the softening temperature of all sintered glasses, thereby at once in conjunction with each parts.Can adopt subsequently to utilize and have than the sintered glass of high softening temperature method in conjunction with each several part.The reason of preferred this method is can be with the infusible temperature of the sintered glass of previous bound fraction successively in conjunction with each parts.

Softening temperature of the present invention is corresponding to 10 ^7.65The sintered glass viscosity of dPa.s (pool).Each parts can be by being heated to above sintered glass temperature (sintering temperature) combination of softening temperature.

Separator generally has plate-shaped, and length and width are about tens mm, and thick is below 300 microns, and constitutes by form antistatic film on the surface of insulated substrate.The a large amount of separators that need for this purpose being spaced on demand.

The example of the insulating material of separator has silica glass, contain glass, sodium-calcium glass and the stacked substrate as preparations such as silicon dioxide layers on above-mentioned soda-lime glass of small amount of impurities such as Na for example.

The example of conducting membrane material has for example nitride and the carbon of oxide, aluminium and the transition metal alloy of metals such as chromium, nickel and copper.

To introduce the structure of panel 224 below.Among Figure 33 A and the 33B, by on glass substrate, forming fluorescent film 230 and metal backing 231 formation panels.This part is as image display area.About the monochrome image display unit, fluorescent film 230 only is made of fluorescent material.Being color display, is that the red, green and blue fluorescent material forms image forming portion (after this being also referred to as pixel) by three primary colors, and fluorescent material is isolated with unlicensed tour guide's electricity parts.Unlicensed tour guide's electricity parts are known as secret note or black matrix according to its shape.Metal backing 231 is formed by conductive films such as Al.Metal backing 231 increases brightness by the light that the reflected fluorescent light material produces to glass substrate, and light advances towards the electron source that is made of electronic emission element 221.Simultaneously, metal backing 231 can prevent fluorescent material to stay the ion bombardment that the gas in the screen board produces undermined because of electron beam ionization.

Metal backing 231 makes the image display area conduction of panel 224, accumulates to prevent electric charge, and is used as anode with respect to electron source.Notice that metal backing 231 is electrically connected to high-pressure side Hv, and can apply external voltage by high-pressure side Hv.

Introduce disassembling method below according to flat-panel monitor of the present invention.

Figure 34 A-34D is the embodiment that shows according to disassembling method of the present invention.Among Figure 34 A-34D, reference number 222 expression backboards; 224 surface panels; The 225th, support frame; The 226th, separator; 227 is first sintered glasses; 228 is second sintered glasses; 229 is the 3rd sintered glasses.In Figure 34, first, second that is used for each bound fraction is three kinds of sintered glasses (Figure 34 A) with different softening temperatures with the 3rd sintered glass.For example, suppose that than the high softening temperature order be first sintered glass, 227＞the second sintered glasses 228＞the 3rd sintered glass 229.

It is as follows to disassemble process.In the heating furnace that it is suitable that screen board is packed into.The heating screen board is to the softening temperature that is equal to or higher than the 3rd sintered glass 229 and be equal to or less than the temperature of the softening temperature of all the other sintered glasses, thereby only melts the 3rd sintered glass 229.When keeping this temperature, separate panel 224 (Figure 34 B) from support frame 225.Heating-up temperature is elevated to the softening temperature that is equal to or higher than second sintered glass 228 and is equal to or less than the temperature of the softening temperature of first sintered glass 227.When 228 fusings of second sintered glass, support frame 225 separates (Figure 34 C) with backboard 222.Heating-up temperature further raises, and melts first sintered glass 227, thereby separates separator 226 and backboard 222.

The method of separating the bound fraction that utilizes first sintered glass 227 is not limited to heating means.For example, as shown in figure 35, to state shown in Figure 34 C, screen board can immerse in the sintered glass solvent soln 239 after separating screen board, with the dissolving sintered glass, separates separator 226 and backboard 222.Preferred solution is salpeter solution.

After the separation,, and carry out cleaning step, reclaim each parts with residual sintered glasses of removal such as nitric acid.Each parts that reclaims are transferred to and are utilized step or the more accurate step of adding again.

Figure 36 is the schematic diagram of showing according to another embodiment of disassembling method of the present invention.In Figure 36,, adopt three kinds of sintered glasses (Figure 36 A) with different softening temperatures at each bound fraction.For example, suppose that the order than high softening temperature is first sintered glass 227＞the 3rd sintered glass 229＞the second sintered glasses 228.

It is as follows to disassemble process.In the heating furnace that it is suitable that screen board is packed into.The heating screen board is to the softening temperature that is equal to or higher than second sintered glass 228 and be equal to or less than the temperature of the softening temperature of all the other sintered glasses, thereby only melts second sintered glass 229.In the heating screen board, screen board is divided into panel 224, support frame 225, backboard 222 and separator 226 (Figure 36 B).About the previous case, heating-up temperature is elevated to the softening temperature that is equal to or higher than second sintered glass 228.Because 228 fusings of second sintered glass, support frame 225 separates (Figure 36 C) with backboard 222.Notice that backboard 222 utilizes the method identical with first embodiment to separate with separator 226.

(example 7)

Utilize example 7 specifically to introduce the present invention below.In the example 7, sintered glass is suitably selected from the listed sintered glass of table 1:

Table 1

The sintered glass type	Main component	Softening temperature
			????I	????PbO·B 2O 3	????365℃
????II	????PbO·B 2O 3	????390℃
			????III	????PbO·B2O 3	????410℃

(routine 7-1)

Figure 33 A is the profile of showing according to the setting of flat-panel monitor of the present invention, and Figure 33 B is the plane graph of the partial cut of flat-panel monitor shown in Figure 33 A.Flat-panel monitor of the present invention comprises backboard 222, panel 224, support frame 225 and separator 226 at least, backboard 222 has many electronic emission elements 221 that are arranged on the glass substrate, panel 204 is arranged in the face of backboard 222, and having an image displaying part 223, separator 226 is used to keep the interval Chinese People's Anti-Japanese Military and Political College air pressure of 224 of backboard 222 and panels.Backboard 222, panel 224, support frame 225 and separator 226 utilize sintered glass 229 combination airtightly, constitute flat-panel monitor.

Among the example 7-1, making wherein, 25 separators 226 are welded on the backboard 222 that is formed by the soda-lime glass that is of a size of 300mm * 250mm * 2.8mm.Each separator is by highly being that 200 microns, length are to form thick about 100nm on the soda-lime glass substrate of 40mm to prepare as the aluminium nitride film of conducting film for 2.8mm, thickness.

III in the table 1 (softening temperature: 410 ℃) is as the sintered glass 227 of 222 of separator 26 and backboards.II in the table 1 (softening temperature: 390 ℃) is as the sintered glass 228 of 225 of backboard 222 and support frames.I in the table 1 (softening temperature: 365 ℃) sintered glass 229 is as the sintered glass 229 of 225 of panel 224 and support frames.

About electronic emission element 221, form the surface conductive type electronic emission element shown in Figure 37 A and the 37B.

Below in conjunction with Figure 33 A, 33B, 37A, 37B, 38A and 38B introduction flat-panel monitor according to routine 7-1 of the present invention.

(1) makes backboard with soda-lime glass, utilize Pt on substrate, to form element electrode 235 and 236.At this moment, element electrode interval L1 is set at 10 microns; Element electrode width W 1 is set at 500 microns, and the element electrode thickness d is set at 100nm.The position of the hope that comprises element electrode applied organic contain palladium solution after, carried out heat treated 10 minutes at 300 ℃, form fine particle film 234 (average diameters: 7nm) by thin palladium oxide (PdO) particle.

A plurality of electronic emission elements 221 are formed on the substrate, obtain backboard 222.Make image display unit 223 by coating fluorescent material on glass substrate, the preparation panel.

(2) introduce the encapsulating method among the routine 7-1 below.Separator 226 utilizes sintered glass III (softening temperature: 410 ℃) to be welded to backboard 222 (Figure 38 A).

(3) outer rim (being coated with the part 240 of sintered glass among Figure 33 B) at backboard 222 applies sintered glass II (softening temperature: 390 ℃).In addition, on similar position on the panel 224, apply sintered glass (softening temperature: 365 ℃).Then, when accurately aiming at, overlapping panel 224, support frame 225 and backboard 222 (Figure 38 B).Panel 224, support frame 225 and backboard 222 utilize anchor clamps to be fixed together, thereby panel 224 and backboard 222 are not moved, under 400 ℃, at kiln roasting more than 10 minutes.

In this way, in conjunction with panel, backboard and support frame (Figure 38 ℃).

(4) internal tank for making in the emptying above-mentioned steps is after encapsulation process, by attached to the blast pipe (not shown) emptying receptacles on support frame 225 grades.Then, sealing blast pipe.

(routine 7-2)

In routine 7-2, make the display that has with routine 7-1 same structure.In routine 7-2, utilize sintered glass III (softening temperature: 410 ℃) in conjunction with separator and backboard.Utilize sintered glass I (365 ℃ of softening temperatures) in conjunction with backboard 222 and support frame 225, utilize sintered glass II (softening temperature: 390 ℃) in conjunction with panel 224 and support frame 225.

The manufacturing of example 7-2 middle plateform display adopt with routine 7-1 in identical method.

(routine 7-3)

In routine 7-3, make the display that has with routine 7-1 same structure.In routine 7-3, utilize sintered glass IV (softening temperature: 450 ℃) in conjunction with separator 226 and backboard 222.Utilize sintered glass III (softening temperature: 410 ℃) in conjunction with backboard 222 and support frame 225, utilize sintered glass II (softening temperature: 390 ℃) in conjunction with panel 224 and support frame 225.

The backboard 222 of example 7-3 middle plateform display and the manufacturing of panel 224 adopt with routine 7-1 in (1) identical method.

(2) introduce the encapsulating method among the routine 7-3 below.Utilize sintered glass IV (softening temperature: 450 ℃) welding separator 226 and backboard 222 (Figure 38 A).

(3) sintered glass III (softening temperature: 410 ℃) is coated in the outer rim (scribbling the part 240 of sintered glass among Figure 33 B) on the backboard 222.In addition, sintered glass II (softening temperature: 390 ℃) is coated in the similar position on the panel 224.Then, when accurately aiming at, overlapping panel 224 and supporting back board 222 (Figure 33 B).Panel 224 and backboard 222 utilize anchor clamps to fix, so that they are moved, at 420 ℃ kiln roastings more than 10 minutes.

As a result, in conjunction with panel 224, backboard 222 and support frame 225 (Figure 38 C).

(4) inside of the container of making for the emptying above-mentioned steps is after encapsulation process, by attached to the blast pipe (not shown) emptying receptacles on support frame 225 grades.Then, sealing blast pipe.

(routine 7-4)

In routine 7-4, make the display that has with routine 7-1 same structure.In routine 7-4, utilize sintered glass III (softening temperature: 410 ℃) in conjunction with separator 226 and panel 224.Utilize sintered glass II (softening temperature: 390 ℃) in conjunction with backboard 222 and support frame 225, utilize sintered glass I (softening temperature: 365 ℃) in conjunction with panel 224 and support frame 225.

The backboard 22 of example 7-4 middle plateform display and the manufacturing of panel 224 adopt with routine 7-1 in (1) identical method.

(2) introduce encapsulating method among the routine 7-4 below in conjunction with Figure 39.Utilize sintered glass III (softening temperature: 410 ℃) welding separator 226 and panel 224 (Figure 39 A).

(3) sintered glass II (softening temperature: 390 ℃) is coated on the outer rim on the backboard 222.In addition, sintered glass I (softening temperature: 365 ℃) is coated in the similar position on the panel.Then, when accurately aiming at, overlapping panel 224, support frame 225 and supporting back board 222 (Figure 39 B).Panel 224, support frame 225 and backboard 222 utilize anchor clamps to fix, so that panel 224 and backboard 222 are moved, and at 420 ℃ kiln roasting more than 10 minutes.

In this way, in conjunction with panel 224, backboard 222 and support frame 225 (Figure 39 C).

(4) inside of the container of making for the emptying above-mentioned steps is after encapsulation process, by attached to the blast pipe (not shown) emptying receptacles on support frame 225 grades.Then, sealing blast pipe.

(routine 7-5)

In routine 7-5, make the display that has with routine 7-1 same structure.In routine 7-5, utilize sintered glass II (softening temperature: 390 ℃) in conjunction with separator 226 and backboard 222.Utilize sintered glass II (softening temperature: 390 ℃) in conjunction with backboard 222 and support frame 225, utilize sintered glass I (softening temperature: 365 ℃) in conjunction with panel 224 and support frame 225.

The backboard 222 of example 7-5 middle plateform display and the manufacturing of panel 224 adopt with routine 7-1 in (1) identical method.

(2) introduce encapsulating method among the routine 7-5 below in conjunction with Figure 40 A-40C.Utilize sintered glass II (softening temperature: 390 ℃) welding separator 226 and support frame 225 and backboard 222 (Figure 40 A).

(3) sintered glass I (softening temperature: 365 ℃) is coated on the outer rim on the panel 224.When accurately aiming at, overlapping panel 224 and support frame 225 (Figure 40 B).Panel 224 and support frame 225 utilize anchor clamps to fix, so that they are moved, at 420 ℃ kiln roastings more than 10 minutes.

In this way, in conjunction with panel 224 and support frame 225 (Figure 40 C).

(4) inside of the container of making for the emptying above-mentioned steps is after encapsulation process, by attached to the blast pipe (not shown) emptying receptacles on support frame 225 grades.Then, sealing blast pipe.

(routine 7-6)

Example 7-6 relates to the method for disassembling flat-panel monitor described in the routine 7-1.Introduce this disassembling method below in conjunction with Figure 34 A-34D.

(1) releasing is introduced air to the sealing of the hermetic unit of blast pipe, thereby eliminates the vacuum (not shown) in the container.

(2) display is packed in the heating furnace, backboard 222 and panel 224 utilize suitable anchor clamps to fix, and then, display are heated to 380 ℃.When heating-up temperature surpassed 365 ℃, the sintered glass I with support frame 225 melted gradually in conjunction with panel 224.Lift the anchor clamps of fixed panel 224, separate panel 224 and support frame 225 (Figure 34 A and 34B).

(3) with after the suitable anchor clamps fixed support frame 225, heating-up temperature is elevated to 400 ℃.When heating-up temperature surpassed 390 ℃, the sintered glass II with support frame 225 melted gradually in conjunction with backboard 222.Lift the anchor clamps of fixed support framework 225, separate support frame 225 and backboard 222 (Figure 34 C).

(4) with suitable anchor clamps fixedly behind the separator 226, heating-up temperature is elevated to 450 ℃.When heating-up temperature surpassed 410 ℃, the sintered glass III with separator 226 melted gradually in conjunction with backboard 222.Lift the fixedly anchor clamps of separator 226, separate backboard 222 and separator 226 (Figure 34 D).

Clean the parts of each recovery with the salpeter solution of 0.2N, remove residual sintered glass, then cleaning part and dry.By detecting step screening separator and support frame, there be not delivering to of defective to utilize step again.Backboard and panel be sent to the recycling step that is used to form the resource on these substrates, be used for substrate self utilize step etc. again.In the flat-panel monitor of disassembling according to routine 7-6, in the processing procedure, panel 224, backboard 222, support frame 7-6 and separator 226 almost are without damage.

(routine 7-7)

Example 7-7 relates to the disassembling method of the flat-panel monitor described in the routine 7-2.Introduce this disassembling method below in conjunction with Figure 36 A-36E.

(1) releasing is introduced air to the sealing of the hermetic unit of blast pipe, thereby eliminates the vacuum (not shown) in the container.

(2) display is packed in the heating furnace, backboard 222 and panel 224 utilize suitable anchor clamps to fix, and then, display are heated to 380 ℃.When heating-up temperature surpassed 365 ℃, the sintered glass I with support frame 225 melted gradually in conjunction with panel 224.Lift the anchor clamps of fixed panel 224, separate two parts, be i.e. panel 224 and support frame 225 and backboard 222 and separator 226 (Figure 36 A, 36B and 36C).

(3) in two parts that separate, panel 224 and support frame 225 are heated to 410 ℃ in stove, to melt sintered glass II gradually, lift the anchor clamps of fixed support framework 225, by with routine 7-6 in similarly method separate panel 224 and support frame 225 (Figure 36 E).

(4) on the other hand, use the method identical to separate backboard 222 and separator 226 (Fig. 3 D) with (4) among the routine 7-6.Clean the parts of each recovery with the salpeter solution of 0.2N, remove residual sintered glass, then cleaning part and dry.By detecting step screening separator 226 and support frame, there be not delivering to of defective to utilize step again.Backboard 222 and panel 224 be sent to the recycling step that is used to form the resource on these substrates, be used for substrate self utilize step etc. again.In the flat-panel monitor of disassembling according to routine 7-7, in the processing procedure, panel, backboard, support frame and separator almost are without damage.

(routine 7-8)

Example 7-8 relates to the disassembling method of the flat-panel monitor described in the routine 7-3.Introduce this disassembling method below in conjunction with Figure 34 A-34D and 35A-35C.

Utilize step among the routine 7-6 (1)-(3), separate panel 224 and support frame 225 up to state shown in Figure 34 C from display.

(4) backboard is fixed with suitable anchor clamps, and the bound fraction of backboard 222 and separator 226 is immersed in the solution tank 237 of the salpeter solution 239 that 0.2N is housed (Figure 35 A).Introduce netted teflon container 238 in the solution tank 237.When this bound fraction immerses in the salpeter solution 239, sintered glass IV fusion, separator 226 is recovered in the container 238.After having confirmed that all separators 226 are separated, lift backboard 222 (Figure 35 B).Also from salpeter solution 239, lift separator 226 with container 238.

Remove residual sintered glass from each recovery part, cleaning part is also dry.Screen each parts by detecting step, and deliver to and utilize again or more accurate recycling step.In the flat-panel monitor of disassembling according to routine 7-8, in processing procedure, panel, backboard, support frame and separator almost are without damage.

(routine 7-9)

Example 7-7 relates to the disassembling method of the flat-panel monitor described in the routine 7-4.Utilize identically, display is heated to 360 ℃, separate two parts and promptly carry on the back 222 and support frame 225 and panel 224 and separator 226 with (1) described in the routine 7-7-(2).

In two separated components, utilize the method identical to separate backboard 225 and support frame 225 with (3) among the routine 7-7.

Utilize the method identical to separate panel 224 and separator 226 with (4) among the routine 7-6.

In the flat-panel monitor of disassembling according to routine 7-9, in processing procedure, panel, backboard, support frame and separator almost are without damage.

(routine 7-10)

Example 7-10 relates to the method for disassembling the described flat-panel monitor of routine 7-5.Utilize among the routine 7-6 (1) to separate panel 224 up to state shown in Figure 34 B from display with (2).

(3) with behind suitable fixture while fixed support framework 225 and the separator 226, heating-up temperature is elevated to 410 ℃.When heating-up temperature surpassed 390 ℃, the sintered glass II with support frame 225 and backboard and separator 226 melted gradually in conjunction with backboard 222.Lift the anchor clamps of fixed support framework 225 and separator 226, separate each parts.

In the flat-panel monitor of disassembling according to routine 7-10, in processing procedure, panel 224, backboard 222, support frame 225 and separator 226 almost are without damage.

(comparative example 7-1)

Divide spare 226 and backboard 222, backboard 222 and support frame 225 and panel and support frame 225 utilize outside sintered glass II (softening temperature: the 390 ℃) combination, the flat-panel monitor of disassembling among the comparative example 7-1 method manufacturing identical with routine 7-1.

Followingly disassemble this flat-panel monitor.

Behind the emptying receptacles, display is packed in the heating furnace.After backboard 222, panel 224 and support frame 225 utilized suitable fixture fixing, display was heated to 410 ℃.When heating-up temperature surpassed 390 ℃, sintered glass II began fusing.Because the bound fraction between backboard, framework and panel melts simultaneously, although backboard, framework and panel are fixed by anchor clamps, it is unstable that stationary state becomes.Under some situation, these parts contact with each other or anchor clamps contact with them, can defective component.Specifically, many separators have been damaged with plate-shaped.

(embodiment 8)

Embodiment below in conjunction with accompanying drawing introduction poisonous metal residual quantity checkout gear according to the present invention.

Figure 41 is a diagrammatic sketch of showing the poisonous metal residual quantity checkout gear according to the present invention.

As shown in figure 41, this checkout gear test example is as disassembling and split the amount of contained poisonous metal lead of inspected object X such as the parts that are used for utilizing again, refuse etc.This checkout gear mainly washes out by being used to wash out and reclaim plumbous lead/and recoverer 130, cleaning part 131, residual lead washes out part 132 and residual plumbous amount test section 133 constitutes.

Disassemble and split parts or the refuse that obtains behind the device that mainly contains glass component because inspected object X comprises, said glass component is flat-panel monitor or the cathode ray tube for being made of backboard 1, panel 2, framework 3 and separator 4 for example.As described below, this checkout gear utilizes nitre to join and washes out lead.Therefore, this device can detect insoluble to salpeter solution, and inspected object X is not limited to glass component.

Among Figure 41, lead washes out/and recovery section 130 is filled with acid solution A at the soaking compartment 100 that is used for soaking inspected object X, and this part washes out poisonous metal contained in the inspected object (lead).Soaking compartment 100 links to each other by pipeline 101 with accumulator tank 102.Plumbous wash solution is fed to accumulator tank 102 by close/open valve 103, and solution transfer pump 104 is arranged on the middle part of pipeline 101.

The transmission outlet of conveyer 105 is located at the upper limb place when soaking compartment 100, and for example the inspected object X such as parts of Chai Fening load from disassembling the processing section (not shown).Netted cage 106 is set in the soaking compartment 100.Inspected object X falls the netted cage 106 from conveyer 105, and the predetermined time that washes out by lifting the handle of netted cage 106, is taken out inspected object after going over.

Cleaning part 131 is equipped with pure water B at the rinse bath 110 that is used for soaking inspected object X, be used for utilize lead wash out/after recovery section 130 washes out, clean inspected object X.That is, the netted cage 106 that lifts from soaking compartment 100 is placed in the rinse bath 110.

Residual lead washes out part 132 and at the soaking compartment 120 that is used for soaking inspected object X acid solution C is housed, and is used to wash out stay the lead that utilizes on the inspected object X that cleaning part 131 cleaned.Soaking compartment 120 links to each other by pipeline 121 with close/open valve 122, solution transfer pump 123 and switching valve 124.Residual plumbous wash solution is fed to residual plumbous amount test section 133.Ultrasonic vibrator 125 is set under soaking compartment 120, in soaking compartment 120, acid solution C is applied ultrasonic vibration, wash out with promotion.

The other end of switching valve 124 links to each other with pipeline 126 in extending to soaking compartment 100.The residue that is contained in the acid solution C in the soaking compartment 120 is fed to soaking compartment 100, utilizes this residue again at this.Utilizing acid solution C and utilizing the acid solution A of acid solution C again is salpeter solution for example, and the concentration of salpeter solution better is 0.1N (equivalent concentration)-1N.

The suitable setting of detection by quantitative (will introduce later on) is adopted in residual plumbous amount test section 133, is used for from the wash solution detection by quantitative lead of being accepted.

The preferred example of groove 100,102,110 and 120 material has for example resin and lead-free glass such as teflon, must anti-storage and be contained in acid solution A and C in these grooves.Similarly, acid solution A and C that must the be anti-netted cage 106 of the material of netted cage 106 immerses wherein, preferred example is a resin such as teflon for example.

Say that more specifically in this checkout gear, inspected object X is immersed among the acid solution A (salpeter solution) of soaking compartment 100, to wash out lead composition contained among the inspected object X.Then, clean inspected object X, and be immersed among the acid solution C (new salpeter solution) of soaking compartment 120 and wash out residual lead with the pure water B in the rinse bath 110.Utilize residual plumbous amount test section 133, carry out lead amount detection by quantitative, to detect residual plumbous amount.

Figure 42 is a flow chart of introducing the testing process of utilizing poisonous metal residual quantity checkout gear shown in Figure 41 successively.Introduce the situation of disassembling flat-panel monitor shown in Figure 43 below.

The pre-treatment step of disassembling (1)-(3).Pull down for example contact (step (1)) such as terminal from the shell of panel display apparatus, and only take out display unit main body (step (2)).Vacuum in the gas-tight container of cancellation formation display unit main body returns to atmospheric pressure (step (3)).

Disassemble display unit main body with suitable device, and split.Each parts that splits and all the other refuses are as inspected object X.

With conveyer 105 this inspected object X is sent to lead and washes out/recovery section 130, be immersed among the acid solution A (salpeter solution) of soaking compartment 100 (step (4)).

After passing by at the fixed time, lift netted cage 106, take out the parts of peeling off from sintered glass (step (5)).

The netted cage that lifts is transferred to cleaning part 131, and sinks to rinse bath 110, so that clean the salpeter solution (step (6)) be attached on the inspected object X with pure water.

After the cleaning, netted cage 106 is transferred to residual lead and washes out part 132, sinks to soaking compartment 120, and is immersed in (step (7)) among the salpeter solution C.At this moment, excitation ultrasound vibrator 125 adds vibration on soaking compartment 120, washes out efficient thereby improve.

Then, close/open valve 122 work are fed to residual plumbous amount test section 133 with the wash solution in the soaking compartment 120, take out the wash solution (step (8)) of supply at this.Extracted amount reaches tens cc.

Residual plumbous amount test section 133 adds iodide in the wash solution that is received, produce color, and measure absorption (step (9)).Measuring wavelength better is about 340nm, to realize the high analyte precision.Residual plumbous amount test section 133 from survey absorb plumbum ion concentration.

Obtain plumbum ion concentration, so that the relation (calibration curve) between plumbum ion concentration that gets standard samples in advance and absorption, calibration curve is meant the absorption that obtains plumbum ion concentration.At this moment, plumbous quantitative values value for referencial use in the salpeter solution during employing is used.

Perhaps, residual plumbous amount test section 133 can be carried out the plasma emission spectrum of the wash solution that receives and be analyzed (ICP), to detect plumbum ion concentration.At this moment, with regard to sensitivity, measuring wavelength better is 220.4nm.

Utilizing the lead amount lower limit of absorption process is about 1ppm, is about 0.05ppm and utilize under the lead amount lower limit of ICP method.

Notice that by operation switching valve 124, the residual salpeter solution of the wash solution that takes out for detection is fed to and soaks 100, utilizes salpeter solution again at this.Can advantageously cut the waste like this.

If the plumbum ion concentration value that aforesaid way obtains is equal to or less than predetermined tolerance (for example tens ppm), think that inspected object X is without any residual lead.Be higher than the situation of tolerance for plumbum ion concentration, handle turning back to step (7), in new salpeter solution, soaking inspected object X again, and repeating step (8)-(10) (step (10)).In this case, after all salpeter solutions in step (8) emitted, the new salpeter solution of can packing in the soaking compartment 120 maybe can provide a large amount of soaking compartment 120 standby.Because plumbum ion concentration is the relative quantity that increase/minimizings according to solution amount changes, then be that the new salpeter solution of soaking compartment 120 preparations must keep this solution amount and concentration value constant.

On the other hand, after the step (4), by operation close/open valve 103, to the salpeter solution (step (11)) of accumulator tank 102 supply soaking compartments 100.The extra sulfate ion that adds in accumulator tank 102 make lead and sulfate ion reaction in the salpeter solution, thereby deposition is as the lead of lead sulfate.Filter, reclaim gained solution, and leaded harmful substance is carried out suitable waste scavenging.

Utilize above-mentioned setting, in the poisonous metal residual quantity checkout gear of embodiment 8, be immersed in lead at inspected object X to wash out/soaking compartment 100 of recovery section 130 in the time, utilize the salpeter solution (acid solution) in the soaking compartment 100 to wash out institute's leaded (poisonous metal) among the inspected object X.Inspected object X is fed to cleaning part 131, cleans detection material X at this.Then, inspected object X is immersed in the soaking compartment 120 that residual lead washes out part 132, so that utilize the salpeter solution (acid solution C) in the soaking compartment 120, washes out the lead of staying on the inspected object X (poisonous metal).Wash solution is fed to residual plumbous amount test section 133, contained plumbum ion concentration in the detection by quantitative wash solution (poisonous metal amount).

Therefore, when disassembling and splitting flat-panel monitor etc., can detection by quantitative such as lead etc. stay as the poisonous metal on the inspected object X such as glass splitting piece or refuse.In this case, inspected object is immersed in the soaking compartment 100 and 120 that acid solution A and C are housed simply, then can be under the situation of loaded down with trivial details operation, easy detection by quantitative poisonous metal amount.As long as inspected object X is not dissolved in acid solution A and C, for example just can wash out poisonous metals such as lead.The material of inspected object X, shape etc. are not particularly limited, can detect various parts.

(embodiment 9)

Embodiment below in conjunction with accompanying drawing introduction flat-panel monitor screen board disassembling apparatus according to the present invention.

(embodiment 9-1)

Figure 44 A and 44B-49 show the first embodiment of the present invention.Figure 44 A is a perspective view of showing the setting of flat-panel monitor disassembling apparatus, and Figure 44 B is its plane graph.Figure 45 is the plane graph of workbench and bracing or strutting arrangement among exploded view 44A and the 44B.Figure 46 A is the plane graph of transmitting device among exploded view 44A and the 44B, and Figure 46 B is a side diagrammatic sketch of showing transmitting device.Figure 47 A is another example plane graph of the transmitting device among exploded view 44A and the 44B, and Figure 47 B is an end view of showing this transmitting device.Figure 48 is that separator recovery anchor clamps have end view among exploded view 44A and the 44B.Figure 49 is the end view that separator reclaims another example of anchor clamps among exploded view 44A and the 44B.

In Figure 44 A and 44B, reference number 50 expression flat-panel monitors; The 57th, the workbench of flat-panel monitor 50 is set; The 54th, by on flat-panel monitor 50, adding the bracing or strutting arrangement of pulling force support flat panel display 50; The 55th, the controller of generation pulling force on bracing or strutting arrangement 54; 71 (72) is that separator reclaims anchor clamps; The 300th, transmitting device.

The flat-panel monitor of disassembling 50 has above-mentioned structure shown in Figure 43.Flat-panel monitor 50 is arranged on the workbench 57, and plate member is fixed on last separator 4.Bracing or strutting arrangement 54 contacts with the upper surface of flat-panel monitor 50, applies predetermined pull on flat-panel monitor 50, to fix it.Figure 45 shows separator 4 and is fixed to example at least one panel 2.When flat-panel monitor 50 being set thereon, workbench 57 can vertically raise.

Bracing or strutting arrangement 54 links to each other with controller 55.The type of flat-panel monitor 50 is imported, and controller 55 makes bracing or strutting arrangement 54 produce predetermined pull, supports the weight of upper surface.

The device that utilizes bracing or strutting arrangement 54 to produce pulling force for example adopts devices such as evacuator, come to lift power support flat panel display 50 by the power of finding time generation from evacuator, or for example adopt device such as aspirator, be used for producing pulling force support flat panel display 50 by suction force from aspirator.Embodiment 8 adopts the setting of evacuator, and bracing or strutting arrangement 54 links to each other with evacuator 56.Note, the pulling force of bracing or strutting arrangement 54 is not set at the value of the total weight that can support the flat-panel monitor 50 that is arranged on the workbench 57, but be set to the value of the weight that is enough to support the flat-panel monitor 50 that has separated frame parts 3 from it, that is the value that, is enough to the plate portion of support fixation to the separator 4.Pulling force better is set at greater than this weight 1kg.

After frame parts 3 separated from flat-panel monitor 50, the plate member that transmitting device 300 will be fixed on the separator 4 was transferred to separator recovery unit 73 (74).Conveyer 300 moves along guide rail 100, with the transmission board parts.Device shown in Figure 46 A and the 46B is used for separator 4 and is fixed to the display of two plates 1 and 2 on any.Figure 47 A and 47B shown device are used for separator 4 and are fixed to display on two plates 1 and 2.

The post 61 of transmitting device 300 can front and back side-to-side movement on workbench 60.Post 61 is equipped with arm 63, and the level of arm 63 can be regulated.Arm 63 is furnished with press fixture 62.

Press fixture 62 is fixed by the plate member that will be fixed on the separator 4 from both sides clamping plate parts.Say that more specifically a pair of right side and left davit 321R and 321L and 322R and 322L are attached to the front and back of arm 63. Davit 321R, 321L, 322R and 322L have claw 321R1 and 321R2,321L1 and 321L2 and 322R1 and 322R2 and 322L1 and 322L2, and every pair of claw separates with perpendicular separation d1.Perpendicular separation d1 is set at even as big as backboard 1 or panel 2 are installed.The horizontal opening angle and the front/rear position that are attached to the press fixture 62 on 63 arms can be regulated.

Separator recovery anchor clamps 71 (72) hold the edge with the plate of support fixation on separator 4.Separator with setting shown in Figure 48 reclaims anchor clamps 71, is used for separator 4 and is fixed to the display of two plates 1 and 2 on any.Separator with setting shown in Figure 49 reclaims anchor clamps 72, is used for separator 4 and is fixed to display on two plates 1 and 2.

Hold and reclaim anchor clamps 71 (72) with the separator of supporting bracket parts and leave separator in and reclaim in the unit 73 (74), separated and reclaim at this separator 4.

Reclaim anchor clamps 71 about separator, gash depth d2 is made as the height that is equal to or greater than each separator 4, groove width d3 is made as the distance of the area that is equal to or greater than separator 4, receives opening d4 and is made as and is equal to or greater than separator and reclaims that anchor clamps 71 hold and the width of the plate member that supports.Reclaim anchor clamps 72 for separator, lower groove depth d 5 is made as the thickness that is equal to or greater than plate member, and backing thickness d6 is made as the interval that is equal to or less than 2 of backboard 1 and panels, that is, and and the thickness of the frame parts 3 that formerly separates in the step.Load avoids anchor clamps 70 to be arranged on the bottom that separator reclaims the groove of anchor clamps 72, with prevent any load be added on the separator on the plate member being held/support.

Separator reclaims unit 73 (74) and deposits the separator recovery anchor clamps 71 (72) that hold with the supporting bracket parts.Reclaim in the unit 73 (74) at separator, separate and recovery separator 4.

Be to separate and reclaim separator 4, separator 4 for example is immersed in the acid solution such as salpeter solution or is heated.In other words, utilize acid solution soaking compartment 73 to realize that separator reclaims the unit.Separator reclaims anchor clamps 71 (72) and is immersed in the acid solution, so that separate separator 4 from the plate member holding/supports, and recovery concentrates on the separator 4 of channel bottom.In addition, separator reclaims 74 realizations of unit by using heating furnace.Separator reclaims anchor clamps 71 (72) and is heated, so that from the plate member separation separator 4 that holds/supports.Separator anchor clamps 71 (72) are removed, and concentrate on the separator 4 of channel bottom with recovery.

An example of acid solution is the 0.2N salpeter solution.When separator reclaimed the configuration of anchor clamps employing immersion separator in acid solution, separator reclaimed anchor clamps 71 (72) by constituting as acid resisting materials such as plastics.When separator reclaimed the configuration of anchor clamps employing heating separator, separator reclaimed anchor clamps 71 (72) by constituting as heat proof materials such as metals.

Figure 50 shows and introduces the flow chart of disassembling technology that utilizes flat-panel monitor disassembling apparatus shown in Figure 44 A and the 44B successively.

The pre-treatment step of disassembling (1)-(5).The flat-panel monitor 50 (step (1)) of from the shell of flat display devices, dismantling, and be arranged on the workbench 57, plate member is fixed on last separator 4 (step (2)).Dismantle attached wiring and terminal (step (3)).For example take the suitable treatments of sealing of the attachment members of blast pipe apart, thereby make the inner extensive atmospheric pressure (step (4)) that obtains of vacuum tank.Then, the blast pipe (step (5)) of dismantling.

As shown in figure 45, the upper surface of the flat-panel monitor 50 on bracing or strutting arrangement 54 and the workbench 57 contacts, to utilize predetermined pull fixed flat planar display 50 (step (6)).

Split-frame parts 3 from the flat-panel monitor 50 then, separate adopt simple cutting flat-panel monitor 50, in frame parts 3 and two plates 1 and 2 methods of pressing wedge anchorage shape instruments or spraying salpeter solution, to separate them.

The frame parts 3 (step (8)) that pulverizing separates in step (7).Simultaneously, remove lead composition, the gained material is as the new glass Reuse of materials (step (9)) that recycles.

The plate member of utilizing the transmitting device 300 shown in Figure 46 A and the 46B will be fixed on the separator 4 is fixed (step (10)), does not have guide rail 100 to move, and is transferred to separator recovery anchor clamps 71 (72).More specifically say, regulate the opening angle of davit 321L and 321R and 322L and 322R, and by claw 321L1 and 321L2,321R1 and 321R2 and 322L1 and 322L2,322R1 and 322R2 clamping, suspension and support.Workbench 60 moves along guide rail 100, utilizes the program opposite with suspension/support program, plate member is transferred to separator reclaim on the anchor clamps 71 (72).

Then, reclaim separator 4 (step (12)).For this reason, hold separator with the plate member of support fixation to the separator 4 and reclaim anchor clamps 71 (72) and leave separator in and reclaim in the unit 73 (74), in this separation with reclaim separator 4.

After separator 4 reclaims, when plate member is panel 2 (step (13)), reclaim fluorescent material (step (14)) from panel 2.Pulverize panel 2, remove lead composition, the gained material is again as recycling new glass material (step (15)).

When plate member is backboard 1 (step (16)), remove wiring (step (17)) from backboard 1.Pulverize backboard 1, remove lead composition, the gained material is again as recycling new glass material (step (18)).

Utilize said apparatus, in the flat-panel monitor disassembling apparatus of embodiment 9,, apply pulling force, the plate member of support fixation to the separator 4 from bracing or strutting arrangement 54 by when showing main body (vacuum tank) split-frame parts 3.Separator 4 is draped, and does not bear the weight of institute's fixed plate part, can not apply split-frame 3 under any load situation on the separator 4.This can prevent any damage to separator 4.

After having separated frame part 3, separator anchor clamps 71 (72) hold and the edge of support fixation to the plate of separator 4.At this moment, separator 4 is draped, and does not bear the weight of institute's fixed plate part.Separator reclaim unit 73 (74) hold with the supporting bracket parts in, carry out reclaiming anchor clamps 71 (72) and holding the step of separating separator 4 with the plate member that supports from being separated part.In addition, in the separation/recovery step of separator 4, separator 4 does not bear any extra weight, can prevent damaged.

In other words, can utilize suitable step to disassemble processing, and can under situation, for example reclaim separator 4 etc. and can directly utilize member again without any damage.As a result, can advantageously recycling each member.

(embodiment 9-2)

Figure 51 A and 51B show embodiments of the invention 9-2.Figure 51 A is a perspective view of showing the setting of flat-panel monitor disassembling apparatus, and Figure 51 B is its plane graph.

In embodiment 9-2, by apply pulling force on the upper surface of flat-panel monitor 50, the bracing or strutting arrangement of support flat panel display 50 is realized by aspirator 240, is used for producing pulling force, support flat panel display 50 by the suction force from aspirator.Transmitting device 301 is attached to the arm 63 on its top around post 61 rotations.In the rotating range of arm 63, workbench 57, separator recovery unit 73 (74) and separator are set reclaim anchor clamps 71 (72).Note, represent same parts, with the introduction of omitting them with reference number identical among the embodiment 9-1.

In this case disassemble identical among technology and the embodiment 9-1.In each step, separating 4 can be draped.Can under the situation that does not apply any weight, separate and recovery separator 4, and can prevent its damaged.Can disassemble each parts, and they are used as the new glass material that recycles again.That is, disassemble processing and can utilize suitable step to carry out, can recycling each member of favourable land used.

(embodiment 10)

Specifically introduce embodiments of the invention 10 below in conjunction with accompanying drawing.Embodiment 10 introduces separator with illustration and have the processing of disassembling of fluoroscopic FPD on the inner surface of panel, shown in Figure 43 A, 43B and 32.

Figure 43 A is the partial cut-away perspective view of showing FPD, and Figure 43 B is a profile.In Figure 43 A and 43B, reference number 1 expression backboard; The 2nd, panel; The 3rd, framework; The 4th, separator.Each bound fraction that leaded sintered glass 5 is represented as black among Figure 43 A and the 43B.

Backboard 1, panel 2 and framework 3 examples of material have silica glass, contain the glass of glass, sodium-calcium glass and the stacked silicon dioxide layer preparation on soda-lime glass of small amount of impurities such as Na for example.

On panel 2, on the inner surface of glass plate 2a, be formed with fluorescent film 2b, on the inner surface of fluorescent film, be formed with the metal backing 2c that contains Al.

In separator 4 and panel and the backboard any or both combine.In this embodiment, separator 4 only combines with panel.Separator 4 is made of glass substantially.The surface of separator can apply antistatic film.

In addition, be used to the to find time blast pipe (not shown) of FPD generally is attached to FPD.In general, blast pipe is made of leaded low-melting glass.

FPD shown in Figure 32 is an example of the surface conductive type electron source display of matrix driving mode.Figure 32 is a perspective view of showing the local excision of FPD.Among Figure 32, be formed with surface conductive type electron source 11 on the backboard 1 and connect up 12 and 13, be used to drive electron source.The wiring 12 and 13 be directions X (Dox1, Dox2 ... Doxm) the Y direction (Doy1, Doy2 ... Doyn) element wiring is made of Ag, Pd etc.The insulating barrier (not shown) insulation that directions X wiring 12 and Y direction wiring 13 are located by the crosspoint that is positioned at them at least.This insulating barrier is made of the glass that contains a large amount of lead.

As mentioned above, the each several part of FPD adopts lead-containing materials.Target of the present invention is the method by the shape that is applicable to parts to be processed, removes plumbous processing effectively and glass etc. is processed into recycling state.

Figure 53 is a flow chart of opening up each step of the FPD device disassembling method of explaining embodiments of the invention.The same with the first half of this method, step (1)-(3) are pre-treatment step, comprise from the shell of FPD device and take out FPD, and remove the attached wiring and the step of terminal.In step (4)-(6), utilize the vacuum among the suitable method cancellation FPD, the blast pipe of dismantling then.Because blast pipe is leaded, thus it handled, and it is used as flint glass again.

In step (7),, screen board is separated into each parts by cutting frame.Perhaps, in (8), the sintered glass of melted join part separates each parts.By step (7) or (8), the FPD that scraps is divided into framework, interior screen board parts, panel and backboard.To introduce the processing method of each parts below.

Pulverize frame part, and again as flint glass.

If separator (glass) or grid (metal) etc. exist as interior screen board parts, then reclaim and utilize again their (step (9)).

About panel, remove (step (10)) and reclaim (step (11)) fluorescent material.In step (12), panel is put into the liquid handling groove, to remove residual sintered glass.Figure 52 is a schematic diagram of showing the setting of used treatment trough this moment.Treatment trough 81 can be handled a large amount of panels 82 simultaneously.Panel 82 is asked for an advance on one's pay and is supportted the framework (not shown), is set in parallel in the treatment trough 81 with a determining deviation, to come in contact between the surface that prevents them.Panel 82 is immersed in the liquid 83 (for example rare nitric acid) of dissolving sintered glass.Notice that treatment trough 81 is made by erosion-resistant materials such as for example stainless steels.

For quickening the sintered glass dissolving, suitable method has: (1) makes liquid flow; (2) on panel, apply vibration or sound wave; Or (3) are by heating arrangements rising fluid temperature.The Treatment Solution that sintered glass is washed out usefulness is guided to the Treatment Solution cycling and reutilization with device 86 from this treatment trough 81, reclaim lead and wash out material (step (13)) at this.As a result, cycling and reutilization Treatment Solution, and they are returned treatment trough 81.By utilizing the Treatment Solution cycling mechanism, it is constant that the treatment trough internal environment almost can keep, and can carry out the processing of removing residual sintered glass from panel 82 continuously.Arrow among Figure 52 has schematically shown flowing of Treatment Solution.

Then, panel is transferred to rinse bath from treatment trough, clean panel (step (14)) at this.In cleaning step, clean used liquid (for example water) and be used to remove the Treatment Solution that is attached on the panel.The structure of rinse bath and effect be identical with the treatment trough shown in Figure 52 basically.Passed through the glass of cleaning step,, can be used as display panel substrate again by pulverizing or clinkering step again.

About backboard,, backboard is put into the groove of liquid handling shown in Figure 52, to remove wiring in step (15).Similar with panel, backboard is asked for an advance on one's pay and is supportted the framework (not shown), is set in parallel at certain intervals in the treatment trough 81.Backboard is immersed in the liquid 83 (for example rare nitric acid) of dissolving wiring material, can handle many backboards simultaneously.The structure of backboard treatment trough and effect be identical with the panel treatment trough basically.After in this treatment trough, removing a wiring, reclaim institute's containing metal (Ag, Pb etc.) (step (16)) in the wiring.

Then, backboard is transferred to rinse bath from treatment trough, clean backboard (step (17)) at this.In cleaning step, clean used liquid (for example water) and be used to remove the Treatment Solution that is attached on the backboard.The structure of rinse bath and effect be identical with above-mentioned treatment trough basically.Passed through the glass of cleaning step,, can be used as the backboard substrate again by pulverizing or melting step again.

(example 10)

Utilize example 10 specifically to introduce the present invention below in conjunction with Figure 32,43A, 43B, 52 and 53.

(routine 10-1)

(cutting with separates after carry out groove processing method)

Surface conductive type electron source display (SED), each SED that disassembles 10 matrix driving patterns shown in Figure 32 has screen plate structure shown in Figure 43 A that comprises separator and the 43B.

According to the handling process of disassembling of FPD device among Figure 53, from the shell of SED device, take out SED, will remove attached wiring and terminal.Vacuum among the cancellation SED, the blast pipe of dismantling.Handle blast pipe, and again as flint glass.

Line of cut is set in the SED screen board district that applies sintered glass, and when applying abrasive solution, with the diamond cut saw, along line of cut cutting SED.

10 SEDs are carried out this operation.By cutting, each SED is divided into framework, panel and backboard.Some separator comes off in the cutting, and some separator still combines with panel.All separators of manual recovery, and screen and utilize again separator capable of circulation.

Pulverize frame part, and again as the flint glass material.After having removed metal backing and fluorescent material, 10 panels are put into the liquid handling groove at once.Figure 52 is a schematic diagram of showing the setting of used treatment trough this moment.The nitric acid that 0.2-N is housed in the treatment trough 81 is as Treatment Solution 83.Each panel 82 be arranged in parallel and is immersed in the Treatment Solution 83.Introduce the support frame (not shown) in the treatment trough 81, so that the panel 82 that be arranged in parallel at certain intervals.Treatment Solution 83 is under the effect of liquid flow device 84, along the Surface runoff of panel 82.Simultaneously, Treatment Solution is being heated in 50 ℃, was handling panel 82 1 hours with heater 85.

Simultaneously, Treatment Solution 83 is fed to Treatment Solution circulating device 86, at this circular treatment solution 83, and makes it to turn back to treatment trough 81.Treatment Solution circulating device 86 usefulness filters remove solid state component, and utilize electrolysis to separate and reclaim the composition of dissolving.

10 panels 82 are transferred to rinse bath from treatment trough 81 at once, clean at this.The structure of rinse bath is identical with treatment trough basically.Use water as cleaning solution, cleaned panel 30 minutes.The glass of cleaning step has been passed through in pulverizing or fusing, and again as display panel substrate.

10 backboards are put into the liquid handling groove shown in Figure 52, so that remove residual sintered glass and wiring.Treatment Solution is the nitric acid of 0.2-N.Treatment Solution is being heated in 50 ℃, is utilizing ultrasonic wave bringing device 87, applying ultrasonic wave, handling backboard 2 hours.

10 backboards are transferred to rinse bath from treatment trough at once, clean at this.The structure of rinse bath and treatment trough basic identical.Use water as cleaning solution, cleaned backboard 30 minutes.The glass of cleaning step has been passed through in pulverizing or fusing, and again as the backboard substrate.

(routine 10-2)

(dissolving with separate after carry out batch processing method)

According to the handling process of disassembling of FPD device among Figure 53, from the shell of SED device, take out SED, will remove attached wiring and terminal.Vacuum among the cancellation SED, the blast pipe of dismantling.Handle blast pipe, and again as flint glass.

Each SED screen board is immersed in the salpeter solution, with the sintered glass of dissolving screen board bound fraction.As a result, each screen board is divided into framework, panel and backboard.

10 SEDs are carried out this operation.

Cleaning step to panel and backboard is all identical with routine 10-1.The dry glass that has passed through cleaning step, and again as panel or backboard substrate.

Because glass-cutting substrate not among the routine 10-2 is so can directly be used as the SED parts again with the glass substrate that reclaims.

(embodiment 11)

Below in conjunction with the accompanying drawing introduction according to the fluorescent material recovery method of flat-panel monitor of the present invention and the preferred embodiment of device.

Among the embodiment 11, display to be processed is the flat-panel monitor of being made by panel, backboard and framework, and wherein fluorescent material is coated on the inner surface of panel, and borrows the radioluminescence of electron beam.

Fluorescent material retracting device of the present invention adopts a fixture, this device have be arranged to scalable with respect to flat-panel monitor so that around the stationary fixture that is arranged on the flat-panel monitor on the first-class pedestal of workbench or work zone for example, this fixture is by the swing stationary fixture, make it to contact with flat-panel monitor, fix flat-panel monitor from the four direction of flat-panel monitor.

Figure 54 illustrates each basic step of handling among the present invention.

Among Figure 54, from shell, separate the display (S40) that to handle/scrap.In this case, display is located on the workbench, and the panel of display faces down.The peripheral of display temporarily fixed with the removable type stationary fixture of reading of the present invention.In addition, be attached to the sucker work on the workbench, with abundant fixed flat planar display.

Detect the position of used stationary fixture according to displacement, detect the dimension information (S41) of flat-panel monitor from this positional information.This information is sent to control end (controller), the working range that (retracting device) brushed in the moving range of used cutter or fluorescent material recovery subsequently during this control end decision cutting frame (will introduce later on).Rubber or plastic seal are attached to around the adsorption orifice of sucker, with touch panel more closely.

Aspirator moves down, aspirating backboard, and according to the information cutting frame (S44) from control end.Utilize for example method of the sintered glass at heat fusing framework place, separate panel, backboard, framework (S45 and S49).Backboard and framework (S45) have been removed from panel.After for example having removed precious metal element such as gold, silver and palladium (S47), backboard and framework are transferred to fragment form step (S48).

About panel, the fluorescent material that has adsorbing mechanism reclaims brush and repeatedly is moved down into panel, and repeatedly move reciprocatingly on panel (S50), thereby reclaims fluorescent material (S51).In this case, use the fluorescent material checkout gear, be used to detect the amount of staying the fluorescent material on the panel.According to the fluorescence quality information that the fluorescent material checkout gear obtains, control is as the operation of the recovery brush of retracting device.

About utilize the method with the terminal point of fluorescent material checkout gear decision fluorescent material recovery operation according to the present invention, the device that for example can adhere to visible emitting on workbench and detect transmissivity is determined the terminal point of work.Perhaps, can after reclaiming brush, the fluorescence Spectra detecting unit be set, become below 0.5% of initial value, or better be 0.2% when following, can determine the work terminal point in the fluorescence intensity of fluorescent material.

Perhaps, after backboard and the framework apart, can be with anchor clamps conversely with panel, can be from operation brush under the panel, fluorescent material is fallen and reclaim it.This method is without any need for the layout of the energy and the recovery tube of brush adsorbing mechanism, and can more effectively work.

Utilize distilled water or can dissolve the aqueous solution such as for example oxalic acid aqueous solution of fluorescent material easily, the panel that has removed most fluorescent materials is from it carried out cleaning step.As a result, can fully reclaim and remove fluorescent material.Consider the cost of oxalic acid recycling step subsequently, wish in the sweeping step sweeping fluorescent material satisfactorily, so that only clean panel (S52) with distilled water.

To carrying out drying steps through the panel of cleaning step, so as to use again make panel (S53), and it is delivered to panel manufacturing step (S55).When inner surface does not reach the panel standard, panel is ground into fragment, fusing also is used as general glass (S54) again, or is used as the part of panel component again.

The fluorescent material that utilizes known method to separate and purify and reclaim.This method is not particularly limited.For example, with containing NaOH, NaCl and H ₂O ₂The fluorescent material that handle to reclaim of the aqueous solution, and handle (Japanese Laid-Open Patent Application 6-108047) with weak acid.Perhaps, can handle the fluorescent material that reclaims,, can add oxalic acid, rare earth element is transformed into oxalates with the leaching rare earth element with weak acid.The roasting oxalates obtains rare earth oxide (Japanese Laid-Open Patent Application 8-333641) then.

In this case,, utilize controller, drive and control included fixture, cutter or brush etc. in apparatus of the present invention with CPU according to preset program.Promptly, controller passes through according to the positional information of stationary fixture and the fluorescence quality information of fluorescent material checkout gear, to the suitable driving command control and treatment work of corresponding driving mechanism issue, said instruction is the instruction about the amount of movement of for example parts such as cutter or brush and ON/OFF operation.

(example 11)

Introduce object lesson of the present invention below.

(routine 11-1)

Figure 58 shows each step that reclaims fluorescent material according to routine 11-1 from flat-panel monitor.

Pull down peripheral screen element from flat-panel monitor 260.Trip out the fixed screw of display periphery with screwdriver etc., with the display casing of dismantling.Dismantle feed cable, high-voltage power feeding unit, adjuster and flexible cable are deposited metal and plastics respectively, only stay screen board.

Shown in Figure 55 A, 55B and 56, the screen board (flat-panel monitor 260) that takes out is arranged on the workbench with vacuum cup 271, panel 2 faces down simultaneously.Flat-panel monitor 260 is fixing by the movable stop type anchor clamps 270 that are connected with control end.Shown in Figure 55 A, fixedly the anchor clamps 270a of screen board upper and lower side and 270b progressively move in vertical direction, up to they contact screen boards.Simultaneously, anchor clamps 270c that fixedly holds about screen board and 270d progressively move in the horizontal direction, contact with screen board up to them.That is, anchor clamps 270 move, up to it detect screen board upper and lower side and about the end till.

The detection of end about in fact, detection of the upper and lower side of screen board/move and screen board/move and hocket.These operations hocket, till detecting arbitrary end, detect an end after, do not detect detection on the direction of end/move and continue.Observe moving of anchor clamps 270,, use fixedly screen board of anchor clamps 270 so that when reducing at interval gradually.The positional information of anchor clamps 270 is delivered to control end, the working range that control end is used for determining the moving range of cutter (will introduce later on) and has the brush of adsorbing mechanism.

Screen board is completely fixed on the workbench 261 by sucker by being formed at the adsorption hole 262a on the workbench 261.In this case, the adsorption orifice of sucker 262 and near its seal 263 of using fully seal.

Shown in Figure 55 A and 55B, with having four periphery 270a, 270b, 270c, the aspirator 270 of 270d is by suction mode stationary backplate 1.Shown in Figure 58, with the cutter 272 of its moving range controlled terminal control, cutting and separate screen board between panel 2 and framework.Backboard 1 and framework 3 are removed by aspirator, and are sent to the used noble metal recycling step of wiring.Backboard is stored mainly as glass fragment.

About panel 2, shown in Figure 57,, and adsorb and reclaim with brush 273 sweeping fluorescent materials.In this case, utilize the residual quantity of fluorescent material on the fluorescence spectrophotometer (not shown) confirmation panel 2, and handle this information, to determine the operating time of brush 273 with control end.In this stage, can remove 99.5% of used fluorescent material when making, and can reclaim 99.2%.

Reclaim through the panel 2 of cleaning step and the fluorescent material that stays as dust.In this stage, not existing on the panel 2 can detected fluorescent material.In addition, can reclaim 99.4% of used fluorescent material when making.Detect panel 2 and whether can be used as panel again,, then can utilize again if panel 2 by experiment.Otherwise panel 2 is sent to the step that it is ground into glass fragment, and again as the glass source.

(routine 11-2)

Introduce routine 11-2 below.

In routine 11-2, except that backboard 1 separate with framework 3 rear board 2 with anchor clamps conversely, reclaim fluorescent material similarly with routine 11-1.

Similar with you 11-1, not existing on the panel 2 can detected fluorescent material.The rate of recovery of fluorescent material is 99.6%.

(routine 11-3)

In routine 11-3,, reclaim fluorescent material similarly with routine 11-1 except that using visible light transmittance as the fluorescent material detection means.In this case, when transmissivity does not change, finish the sweeping step.

Behind the treatment step, measure residual fluorescence quality, confirmed about 1% fluorescent material residual with fluorescence spectrophotometer.The rate of recovery of fluorescent material is 99.2%.

(embodiment 12)

Below in conjunction with the preferred embodiment of accompanying drawing introduction according to substrate processing method using same of the present invention and device.

Embodiment 12 has introduced separator with illustration, and has the processing of disassembling of fluoroscopic FPD on panel inner surface, shown in Figure 43 A, 43B and 32.

In Figure 43 A and 43B, reference number 1 expression backboard; The 2nd, panel; The 3rd, framework; The 4th, separator.The bound fraction that black is represented in Figure 43 A and 43B is with leaded sintered glass 5.

Separator 4 combines with in panel 2 and the backboard 1 one or two.Among this embodiment, separator 4 only is attached on the panel 2.Backboard 1, panel 2 and framework 3 examples of material have silica glass, contain the glass of glass, sodium-calcium glass and the stacked silicon dioxide layer preparation on soda-lime glass of small amount of impurities such as Na for example.On panel 2, on the inner surface of glass plate 2a, be formed with fluorescent film 2b, on the inner surface of fluorescent film 2b, be formed with the metal backing 2c that contains Al.

Separator 4 is made of glass substantially.In some cases, the surface of separator 4 can apply antistatic film.Except that these members, the blast pipe (not shown) that is used for emptying FPD generally is fixed on FPD.In general, blast pipe is made of leaded low-melting glass.

Shown in figure 32, FPD surface conductive type electron source display (SED) that example is the matrix driving pattern.Among Figure 32, the wiring 12 and 13 that surface conductive type electron source 11 and being used to drives electron source is formed on backboard.Wiring 12 and 13 is directions X (Dox1, Dox2 among Figure 32 ..., Doxm) with Y direction (Doy1, Doy2 ..., Doym) element wiring is made of Ag, Pd etc.Directions X wiring and the wiring of Y direction insulating barrier insulation by locating in their crosspoints at least.Insulating barrier is made of the glass that contains a large amount of lead.

As mentioned above, the each several part of FPD adopts lead-containing materials.According to the present invention, utilize the method for the shape be suitable for wanting processing unit effectively to handle, removing lead, and glass etc. changed into can utilize state.

Figure 61 is a flow chart of showing each step of the FPD device disassembly processing method of introducing this embodiment of the invention.

Step (1)-(3) as this method first half are the predetermined process steps, comprise from the shell of FPD device and take out FPD, and remove attached wiring and terminal.In step (4)-(6), utilize suitable method, the vacuum among the cancellation FPD is pulled down blast pipe then, because blast pipe is leaded, thus handle it, and again as flint glass.

In step (7),, screen board is separated into each parts by cutting frame.Perhaps, utilize the step (8) of the sintered glass of dissolving bound fraction that screen board is separated into each parts.By step (7) or (8), the FPD that scraps is separated into frame part (9), interior screen board parts (11), panel (13) and backboard (20).Introduce the processing method of each parts below.

Pulverize frame part (9), and again as flint glass (step (10)).If separator (glass), grid (metallic) etc. exist as interior screen board parts (11),, then reclaim and utilize again their (step (12)).

About panel, remove fluorescent material in step (14), reclaim it in step (15).In being used as the glass plate fixture of substrate board treatment of the present invention, store glass plate, and they are put into the liquid handling groove, to remove residual sintered glass (step (16)) as display panel substrate.

Figure 59 A and 59B are the diagrammatic sketch of introducing the setting of used glass plate fixture this moment.Introduce the setting and the effect of this glass plate fixture below in conjunction with Figure 59 A and 59B.Be stored in a plurality of glass plates 286 keeping parallelism at certain intervals in this device.In the solution-treated groove, this can make Treatment Solution fully mobile along glass surface.For removing solution satisfactorily, make from the Treatment Solution of from treatment trough, taking away minimumly, glass plate 286 better is to be fixed as the surface standing upright almost that makes glass plate 286.Shown in chain line, glass plate 286 can keep appropriate tilt.

Generally have cylindricality with the corresponding strutting piece 287 that contacts at glass plate 286, owing to the support component 287 with substrate contacts has circle or arc, thus support component 287 and glass plate 286 linear contacts, to fix it.This structure also can reduce the amount of taking away of Treatment Solution.

In this glass plate fixture, in addition the removal meeting of Treatment Solution, can remove Treatment Solution from glass plate with methods such as blowing air owing to the shape of support component 287 grades is improved.When fixing a plurality of equidimension glass plate and fixedly during a plurality of glass plate of different size, can adopt fixture.

When the many glass plate 286 of storage, the glass plate fixture must move rapidly between the liquid handling groove.For this reason, this device do as a whole must be very firm.In addition.The necessary anti-erosion of this device is so that adapt with the processing that utilizes bronsted lowry acids and bases bronsted lowry solution.For example, the glass plate fixture can be made of for example materials such as stainless steel, teflon or polypropylene.

Figure 60 is the setting of showing used treatment trough this moment.In treatment trough 81, glass plate utilizes fixture to be arranged in parallel with predetermined space, so that prevent any contact on their surfaces.Glass plate is immersed in the treatment fluid 83 (for example rare nitric acid) of dissolving sintered glass.

For quickening the dissolving of sintered glass, suitable method has: (1) flows treat liquid 83; (2) on glass plate, apply vibration or ultrasonic wave; Or (3) are by heating arrangements rising fluid temperature.The Treatment Solution that sintered glass is washed out usefulness is taken out from this treatment trough 81.Reclaim lead and wash out material (seeing Figure 61) in step (17).As a result, the Treatment Solution again that circulates, and they are returned treatment trough 81.By utilizing the cycling mechanism of Treatment Solution 83, it is constant that the internal environment of treatment trough 81 almost can keep, and can carry out removing from glass plate the processing of residual sintered glass continuously.Arrow among Figure 60 has schematically shown flowing of Treatment Solution 83.Notice that treatment trough 81 is made of erosion-resistant materials such as for example stainless steels.

Glass plate as panel 2 is stored in the glass plate fixture, simultaneously they is transferred to rinse bath from treatment trough 81, clean glass plate (step (18)) at this.At cleaning step, the liquid that is used to clean (for example water) is used to remove Treatment Solution 83.The structure of rinse bath and effect be identical with treatment trough 81 basically.Passed through the glass of cleaning step,, can be used as display panel substrate (step (19)) again by pulverizing or melting step again.

In the backboard 1 (20) in Figure 61, the glass plate that is used as backboard 1 is stored in the glass plate fixture, and is placed in the liquid handling groove, to remove wiring (step (16)).The structure of glass plate fixture is identical with the device that is used for panel basically with effect.

Glass plate is borrowed the glass plate fixture, is set in parallel at certain intervals in the treatment trough 81, to prevent any contact between their surfaces.Glass plate is immersed in the liquid (for example rare nitric acid) of dissolving wiring material.The structure with the panel treatment trough is identical basically with effect for the structure of backboard treatment trough, in step (21), in treatment trough, removed wiring after, reclaim contained metal (Ag, Pb etc.) in the wiring.

Glass plate as backboard 1 is stored in the glass plate fixture, simultaneously they is transferred to rinse bath from treatment trough 81, clean glass plate at this.In cleaning step (step (23)), the liquid that is used to clean (for example water) is used to remove Treatment Solution.The structure of rinse bath and effect be identical with above-mentioned treatment trough basically.Passed through the glass of cleaning step,, can be used as panel backboard (step (24)) again by pulverizing or melting step again.

(example 12)

Below in conjunction with Figure 43 A, 43B, 32,59A and 59B-61, introduce object lesson of the present invention.

(routine 12-1)

In routine 12-1 of the present invention, a plurality of glass plates 286 that are stored in Figure 59 A and the glass plate fixture shown in the 59B are with the parallel placement of certain interval.Every glass plate is fixed into the surface standing upright almost that makes glass plate 286.

In routine 12-1, can store the glass plate 286 of 10 thick 3mm.The support component 287 that contacts with corresponding glass plate 286 has cylindricality, with glass plate 286 linear contacts, to fix it.These parts that contact with glass plate 286 are made by teflon.

The glass plate fixture of example 12-1 is reinforced by many crossbeams that stainless steel constitutes, so that allow the fast moving between the liquid handling groove when 10 glass plates 286 of storage.These crossbeams have shape and the layout that does not hinder Treatment Solution in the liquid handling groove to flow.The horizontal plane of every crossbeam limits very for a short time, so that when lifting the glass plate fixture of routine 12-1 from the liquid handling groove, the Treatment Solution of taking away is minimum.

(routine 12-2)

Example 12-2 is with the processing of disassembling of 10 surface conductive type electron source displays of illustration matrix driving pattern shown in figure 32.

This SED has the screen plate structure that comprises separator, shown in Figure 43 A and 43B.The treatment step of disassembling according to FPD device among Figure 61 takes out SED from the shell of SED device, and removes attached wiring and terminal.Vacuum among the cancellation SED, the blast pipe of dismantling.Handle blast pipe, and again as flint glass.

Line of cut is set in the SED screen board district that applies sintered glass, and when applying abrasive solution, with the diamond cut saw, along line of cut cutting SED.10 SEDs are carried out this operation.

By cutting, each SED is divided into framework, panel and backboard.Some separator comes off in the cutting, and some separator still combines with panel.All separators of manual recovery, and screen and utilize again separator capable of circulation.Pulverize frame part, and again as the flint glass material.After having removed metal backing and fluorescent material, 10 panels are stored in the glass plate fixture 282 shown in Figure 59 A and 59B.

For removing residual lead composition, glass plate is fixed 282 put into the liquid handling groove.Figure 60 is a schematic diagram of showing the setting of used treatment trough this moment.The nitric acid that 0.2-N is housed in the treatment trough is as Treatment Solution.Treatment Solution is under the effect of liquid flow device 84, along the Surface runoff of panel.

Treatment Solution is being heated in 50 ℃ with heater 85, was handling panel one hour.

Simultaneously, Treatment Solution is fed to the Treatment Solution circulating device, at this circular treatment solution, and makes it to turn back to treatment trough.The Treatment Solution circulating device is removed solid state component with filter, and utilizes electrolysis to separate and reclaim the composition of dissolving.Then, the glass plate fixture of routine 12-2 is transferred to rinse bath from treatment trough, clean at this.The structure of rinse bath is identical with treatment trough basically.Use water as cleaning solution, cleaned panel 30 minutes.From the glass plate fixture, take out the glass that has passed through cleaning step, pulverize also and melt it again, and again as display panel substrate.

10 backboards are stored in shown in Figure 59 A and the 59B in the glass plate fixture 282.Glass plate fixture 282 is put into the liquid handling groove shown in Figure 60, so that remove residual sintered glass and wiring.Treatment Solution is the nitric acid of 0.2-N.Treatment Solution is being heated in 50 ℃, is utilizing ultrasonic wave bringing device 87, applying ultrasonic wave, handling backboard 2 hours.

The glass plate fixture 282 of 10 backboards of storage is transferred to rinse bath from treatment trough, clean at this.The structure of rinse bath and treatment trough basic identical.Use water as cleaning solution, cleaned backboard 30 minutes.From glass plate fixture 282, take out the glass passed through cleaning step, pulverize or melt it, and again as the backboard substrate.

The electron source base board that below introduction is had many surface conductive type electronic emission elements is formed on the glass plate that utilizes method processing of the present invention, and utilizes this electron source base board to make the situation of image processing system.

Form and photoetching by vacuum diaphragm, on the glass substrate that recycles, press matrix form and form the Pt electrode.In this case, be 20 microns at interval between element electrode; The width of each element electrode is 500 microns; Thick is 100nm; The layout spacing of element is 1mm.Then, press matrix form by printing and form the Ag wiring.

Utilize spin coater, between element electrode, apply the solution of acid chloride-monoethanolamine, and heat and roasting 10 minutes, thereby obtain film by thin palladium oxide (PdO) particle formation at 270 ℃.By photoetching and dry etching, this film is processed into 300 microns wide conductive films.

In a vacuum, making alive between element electrode forms processing, thereby forms the slit-shaped electron emission part in conducting film.

The element that passes through electrical forming is excited processing.Among this embodiment, introduce ethylene gas in a vacuum, and between element electrode, repeat to add the pulse 30 minutes that peak value is 20V.By this exciting step, near electron emission part, the compound of the main carbon containing of the about 10nm of deposit.

Make backboard with the electron source base board with many surface conductive electronic emission elements, this backboard constitutes shell with panel and support frame.The enclosure of finding time, and sealing obtain the image processing system that has display panel and be used to realize the drive circuit that TV shows.This image processing system forms the high quality graphic without any non-radiating portion (picture element flaw).

(embodiment 13)

Introduce the preferred embodiments of the present invention below in conjunction with accompanying drawing.Embodiment 13 is with the processing of disassembling of illustration flat-panel monitor shown in Figure 29.

Figure 62 is the flow chart of showing according to each step of embodiment 13 disassembly processing methods.After will from shell, taking out dismantle (S61) such as wirings, terminal of the flat-panel monitor of (S60), the vacuum in the cancellation flat-panel monitor, the blast pipe of dismantling (S62).Flat-panel monitor is separated into each member, that is, and (S63) such as panel (S64), backboard (S70) and frameworks.In general, the sintered glass in conjunction with these parts is made of the low-melting glass that mainly contains lead oxide.About separation method, can melt sintered glass by heating or with suitable solvent.

Utilize suitable method (S65), get on except behind fluorescent material, black material and the metal backing,, clean panel, to remove residual sintered glass with for example nitric acid and water equal solvent from the panel (S64) that separates.And cleaning glass surface (S66).In addition, clean the backboard (S70) that separates with water (S71 and S72), remove the some or all constituent materials that are formed on the substrate with suitable solvent.

Detect the element that exists on the surface of the over and done with glass plate that removes step.

Figure 63 is a schematic diagram of showing the fluorescent X-ray analysis instrument of the present invention that is used to detect the element that exists on the glass surface.Among Figure 63, reference number 301 is the workbench that are used for glass plate 302; The 302nd, as the glass substrate of sample; The 303rd, x-ray source; The 304th, monochromator; The 305th, primary X-ray; The 306th, fluorescent X-ray; The 307th, semiconductor detector; The 308th, cooling device; The 309th, prime amplifier; The 310th, amplifier; The 311st, the multichannel analyzer; 312 computers.

By following program detection elements.Monochromator 304 is with primary X-ray 305 monochromatizations of x-ray source 303 emissions.And incide with the θ angle on the surface of the glass substrate 302 on the workbench 301.X-ray source has even as big as exciting the energy of the element that exists on the glass plate 302.For example, adopt W-La ray, Au-La ray, Mo-Ka ray etc.Utilize the surface of the glass substrate 302 of primary X-ray 305 radiation to produce fluorescent X-ray, the semiconductor detector 307 that is arranged on the glass substrate 302 can detect this fluorescent X-ray.About said detector, adopt Si (Li) semiconductor detector.By prime amplifier 309, amplifier 310 and multichannel analyzer 311, utilize computer 312, handle detection signal from semiconductor detector 307.Computer 312 obtains corresponding to the type of the lip-deep element of glass substrate 302 and the signal strength signal intensity of concentration.Notice that semiconductor detector 307 and prime amplifier 309 are by cooled with liquid nitrogen.

If the incidence angle θ of primary X-ray 305 is set at the angle of whole reflection X ray, promptly be equal to or less than the low-angle of the critical angle of total reflection, then X ray only enters several approximately nm of sample surfaces, can produce fluorescent X-ray effectively.Thus, can be on sample surfaces in the zone below several nm, with about 10 ⁹Atom/cm ²Low detection limit, carry out responsive elementary analysis.The critical angle of total reflection can by $\mathrm{\θc}\≅1.64\×{10}^5\×{\mathrm{\ρ}}^{1/2}\×\mathrm{\λ}$ (ρ: substrate density (g/cm ³), λ: the wavelength of X ray (cm)).

Big glass substrate 302 among this embodiment has tens centimetres side edge length.The present invention seeks to this large tracts of land to be carried out elementary analysis effectively with low cost.For utilizing this method, with the high-sensitivity measurement element, the general better sample surfaces that contacts as far as possible of detector.In this case, analysis area depends on the diameter of detector basically, and this diameter generally is about tens mm φ.Yet, when measuring large tracts of land, when sample and detector lean on very closely each other, must obtain data at many spot scan samples, maybe many detectors must be set.So just, long time period and high installation cost have been caused.

For preventing that such thing from taking place, the present invention adopts a kind of size according to substrate to change sample surfaces and detector relative position, so that under the situation of desensitization not, and the method for carrying out elementary analysis effectively.Introduce the method for change relative position of the present invention below in conjunction with Figure 64.

Among Figure 64 A and the 64B, reference number 310 expressions are used for the workbench of glass substrate 302; The 302nd, as the glass substrate of sample; The 307th, semiconductor inspection detector; The 314th, semiconductor element; The 315th, X penetrates transmissive window; The 316th, collimator.Semiconductor detector 307 has shown in Figure 64 A and the 64B and is provided with.Semiconductor element 314 can receive promptly to have by X from the represented district of dotted line penetrates the size of transmissive window 315 and with the relative position of semiconductor element 314 etc. and depend on the X ray in district of angle φ of area decision of the size I of semiconductor element 314 self.

When semiconductor detector 307 moved closer to sample surfaces, shown in Figure 64 A, analysis area became no better than that X penetrates the diameter of transmissive window 315.In contrast, when semiconductor detector 307 moves to state shown in Figure 64 B away from sample surfaces, the X ray intensity decreases that can detect from cellar area, but detectable regions is widened.Therefore, penetrate when the glass substrate 302 with side edge length L is surveyed at fluorescence X, being set at apart from d of 307 of glass substrate 302 and semiconductor detectors obtains 2dtan φ L.When the whole surface of primary X-ray radiant glass substrate 302, measure fluorescent X-ray.As a result, receive X ray, sensitivity is descended from whole glass substrate 302.

Be the zone of wishing with X-radiation, the beam diameter a of primary X-ray is according to the Wsin θ decision that obtains from the incidence angle θ that wants radiation area W and primary X-ray, shown in Figure 65.Note, when glass substrate 302 is too big,, be difficult to guarantee apart from d accordingly, glass substrate 302 can be divided into a plurality of districts and and duplicate measurements with regard to installing.

The X ray transmissive window 315 of semiconductor detector 307 better is the rectangle with the shape that is similar to glass substrate 302.For example, Figure 66 A and 66B show X and penetrate transmissive window 315 when having round-shaped (seeing Figure 66 A) and window 315 when having the shape (seeing Figure 66 B) that is similar to glass substrate 302, the difference of the detection interval of fluorescent X-ray.Among Figure 66, reference number 302 expression glass substrates (plane graph), dotted line or dashed region are represented the X ray detecting area.In X ray transmissive window 315 is that circle is, its shape and glass substrate 302 are inconsistent, so detection efficient is always not high.On the contrary, among Figure 66 B, detecting x-ray effectively.Although the depth-width ratio of glass substrate 302 is non-constant, according to the type and the quantity that will use glass substrate of glass substrate, select suitable transmissive window shape, can realize more high efficiency detection steps.By utilizing this method to survey the fluorescent X-rays that glass substrate 93 surfaces produce, the existence that can detect the relict element on the substrate surface and be diffused into the element in the substrate whether, and the existence that is formed at the film on the substrate surface is whether.

When in above-mentioned steps, detecting the element that constitutes except that glass the element, remove the step of detected element.Although can adopt the whole bag of tricks to make the removal method, the surface finish method of preferred glass substrate 302 especially.

Figure 67 is a schematic diagram of showing the example of burnishing device of the present invention.In Figure 67, reference number 327 expressions are used for the workbench of glass substrate 328; The 328th, glass substrate; The 329th, rubbing head; The 330th, the rotation support stick; The 331st, support arm; The 332nd, motor; The 333rd, post; The 334th, polished surface.The glass substrate 328 that polishes is placed on the workbench 327, and burnishing surface is towards last.Rubbing head 329 is pressed onto on the polished surface.Motor 332 work make rotation support stick and rubbing head 329 rotations.Simultaneously, the slurry that contains polishing agent such as cesium oxide for example is fed on the polished surface 334 beginning polished glass substrate surface 334.

The glass substrate 328 that cleaning polishing is crossed, and carry out above-mentioned elementary analysis again.Repeat element detects and to the polishing of polished surface 334, constitutes the element up to the glass except that glass substrate, when detecting less than other element till.The glass substrate 328 that passes through this step is ground into fragment, can be by melting the material that step is used as flat display substrate or other products more again.

(example 13)

Utilize example 13 more specifically to introduce the present invention below.Example 13 will introduce matrix driving pattern as shown in figure 29 surface conductive type electron source display disassemble processing.

(routine 13-1)

At 13-1, panel 2 and backboard substrate are that the silica glass substrate of 800mm * 800mm * 2.8mm forms by every block size.Mainly contain the cold cathode element 11 of Pd by on substrate, forming, mainly to contain the wiring 12 etc. of Ag, Pt electrode, to constitute backboard.By on substrate, forming fluorescent material 2b, black material, metal backing 2c etc., form panel 2.Introduce the disassembling method of display with this setting below in conjunction with Figure 63,64A, 64B, 67 and 29.

(1) pulls down shell, take out the unit that constitutes by the backboard 1 that welds together with sintered glass, panel 2 and framework 3.

(2) unit of backboard 1, panel 2 and framework 3 formations immerses in the salpeter solution of 0.2N, dissolves welding portion gradually, thereby separates each parts.

(3) in fact scrapped the member that is formed on backboard 1 and the panel 2 after, again backboard 1 and panel 2 immersed in the salpeter solution of 0.2N, and applies ultrasonic vibration thereon.Clean backboard 1 and panel 2 with pure water, remove sintered glass and other dissolved substance on the substrate.

(4) shown in Figure 63, utilize fluorescent X-ray analysis instrument to detect the element that exists on each substrate surface.(λ=0.12764nm), make x-ray source, the X ray incidence angle θ on the substrate is set at more than the critical angle of total reflection with the Aul-La ray.Be the whole surface with the X-radiation glass substrate, the X-radiation substrate that has the above beamwidth of 0.15mm and the above degree of depth of 80nm shown in Figure 65.The X ray transmissive window is square, is set at 40mm apart from d shown in Figure 64 A and the 64B between glass substrate and detector.

Utilize these to set, in 200 second time, received the fluorescent X-ray that produces on the whole surface of glass substrate, measure.As a result, except that Si, detect Pt and Ag from the backboard substrate, and except that Si, from panel, do not detect other element as the substrate element.

(5) utilize burnishing device shown in Figure 67, polishing detects the surface of the backboard substrate of Pt and Ag from it.Rubbing head 329 is pressed on the polished surface of substrate, and at the rotary finishing head, and supply is when to have average diameter be 10 microns cesium oxide slurry, polishing whole base plate 5 minutes.

(6) the backboard substrate of crossing with the pure water cleaning polishing, and carry out elementary analysis again.As a result, confirm that Pt and Ag have been removed to below the detectable limit, have removed all residues on the substrate.

(7) do not need backboard is ground into fragment, just the backboard substrate that passes through above-mentioned steps can be used as substrate again with the panel that does not need polishing step.

(routine 13-2)

In routine 13-2, display panel substrate is that the soda-lime glass substrate of 80mm * 800mm * 2.8mm forms by every block size, and back substrate is by the SiO by the 100nm that stacked size is identical with the backboard substrate on the soda-lime glass substrate ₂Film forms.Mainly contain the cold cathode element 11 of Pd by on substrate, forming, mainly to contain the wiring 12 etc. of Ag, Pt electrode, to constitute backboard.By on substrate, forming fluorescent material, black material, metal backing etc., form panel.Introduce the disassembling method of this display below.

Utilize with routine 13-1 in step (1)-(3) identical method, separate backboard, panel and framework, removal is formed at some constituent materials of the element on the substrate.

(4) then, detect the element that exists on each substrate surface.In routine 13-2, (λ=0.12764nm), make x-ray source, the X ray incidence angle θ on the substrate are set at 0.1 degree of the critical angle that is equal to or less than total reflection with the Au-La ray.Be the whole surface with the X-radiation glass substrate, the X-radiation substrate that has the above beamwidth of 0.15mm and the above degree of depth of 80nm shown in Figure 65.The X ray transmissive window is square, is set at 40mm apart from d shown in Figure 64 A and the 64B between glass substrate and detector.

Utilize these to set, in 200 second time, received the fluorescent X-ray that produces on the whole surface of glass substrate, carry out elements are contained.As a result,, detect Pt, Ag and Pb, except that constituting element, detect Pb from panel from the backboard substrate except that as the substrate element.

(5) utilize burnishing device shown in Figure 67, the surface of polishing backboard and display panel substrate.Rubbing head 329 is pressed on the polished surface of each substrate.At the rotary finishing head, and supply is when to have average diameter be 10 microns cesium oxide slurry, polishing whole base plate 5 minutes.

(6) the backboard substrate of crossing with the pure water cleaning polishing, and carry out elementary analysis again.As a result, confirm that Pt and Ag are removed to below the detectable limit, have low-density Ag, except that substrate constitutes element, from panel, do not detect other element and still detect.

(7) utilize the burnishing device shown in Figure 67, the surface of polishing the backboard substrate again.Utilize and step (5) method mutually polishing whole base plate 15 minutes.

(8) the backboard substrate of crossing with the pure water cleaning polishing, and carry out elementary analysis again.As a result, confirm, except that substrate constitutes element, do not detect other element, can remove the residue on the substrate and be diffused into the interior element of substrate.

(9) will be ground into fragment, and melt step, again as flat display substrate through the backboard substrate and the display panel substrate of these steps.

(routine 13-3)

In routine 13-3, panel and backboard substrate are that the silica glass substrate of 300mm * 250mm * 2.8mm forms by every block size.Introduce the disassembly processing method have in addition with the flat-panel monitor of the identical setting of routine 13-1 below.

Utilize with routine 13-1 in step (1)-(3) identical method, separate backboard, panel and framework, use salpeter solution, removal is formed at some the element constituent materials on the substrate.

(4) then, shown in Figure 63, utilize the fully-reflected type fluorescent X-ray analysis instrument to detect the element that exists on each substrate surface.In routine 13-3, (λ=0.12764nm), make x-ray source, the X ray incidence angle θ on the substrate are set at 0.1 degree with the Au-La ray.Be the whole surface with the X-radiation glass substrate, the X-radiation substrate that has the above beamwidth of 0.6mm and the above degree of depth of 300mm shown in Figure 65.The X ray transmissive window is square, is set at 150mm apart from d shown in Figure 64 A and the 64B between glass substrate and detector.

Utilize these to set, in 200 second time, received the fluorescent X-ray that produces on the whole surface of glass substrate, carry out elements are contained.As a result, except that Si, detect Pt and Ag from the backboard substrate as the substrate element.The counter plate substrate except that Si, does not detect other element.

Utilize with routine 13-1 in step (5)-(7) identical method, polished glass surface, all residues on the removal substrate.The backboard substrate that passes through above steps is used as substrate again with the display panel substrate that does not need polishing step, and does not need the backboard substrate powder is broken into fragment.

(routine 13-4)

In routine 13-4, the backboard substrate is by at every block size being the P doping SiO of stacked 1 micron thickness on 300mm * 250mm * 2.8mm soda-lime glass substrate ₂Film forms.Introduce the disassembling method in addition have with the display of the identical setting of routine 13-1 below.

Utilize with routine 13-1 in step (1)-(3) identical method, separate backboard, panel and framework, removal is formed at some constituent materials of the element on the substrate.

(4) then, shown in Figure 63, utilize the fully-reflected type fluorescent X-ray analysis instrument to detect the element that exists on each substrate surface.(λ=0.07107nm), make x-ray source, the X ray incidence angle θ on the substrate are set at 0.1 degree with the Ao-Ka ray.Be the whole surface with the X-radiation glass substrate, the X-radiation substrate that has the above beamwidth of 0.6mm and the above degree of depth of 300mm shown in Figure 65.The X ray transmissive window is square, is set at 150mm apart from d shown in Figure 64 A and the 64B between glass substrate and detector.

Utilize these to set, in 200 second time, received the fluorescent X-ray that produces on the whole surface of glass substrate, carry out elements are contained.As a result, detect Si, P, Pt, Ag and Pb, except that substrate constitutes element, detect Pb from panel from the backboard substrate.

(5) utilize burnishing device shown in Figure 67, the surface of polishing backboard and display panel substrate.Rubbing head 329 is pressed on the polished surface of each substrate, and at the rotary finishing head, and supply is when to have average diameter be 10 microns cesium oxide slurry, polishing whole base plate 5 minutes.

(6) the backboard substrate of crossing with the pure water cleaning polishing, and carry out elementary analysis again.As a result, confirm that Pt, Ag and Pb have been removed to below the detection inspection limit, have only Si and P still can detect, except that substrate constitutes element, from panel, do not detect other element.

(7) utilize the burnishing device shown in Figure 67, the surface of polishing the backboard substrate again.Utilize and the identical method of step (5), polished whole surperficial 5 minutes.

(8) the backboard substrate of crossing with the pure water cleaning polishing, and carry out elementary analysis again.As a result, P has been removed to below the detectable limit, but still can detect K, the Ca etc. that constitute element as glass.Confirm to have removed P doping SiO thus ₂Layer, and removed all residues on the substrate.

(9) will be ground into fragment, and melt step, again as flat display substrate through the backboard substrate and the display panel substrate of these steps.

Introduce a kind of situation below, that is, and the image processing system that utilizes method of the present invention on glass substrate, to form electron source base board and utilize this electron source base board to make with many surface conductive type electronic emission elements.

Form and photoetching by vacuum diaphragm, on the glass substrate that recycles, press matrix form and form the Pt electrode.In this case, be 20 microns at interval between element electrode; The width of each element electrode is 500 microns; Thick is 100nm; The layout spacing of element is 1mm.Then, press matrix form by printing and form the Ag wiring.

Utilize spin coater, between element electrode, apply the solution of acid chloride-monoethanolamine, and heat and roasting 10 minutes, thereby obtain film by thin palladium oxide (PdO) particle formation at 270 ℃.By photoetching and dry etching, this film is processed into 300 microns wide conductive films.

In a vacuum, making alive between element electrode forms processing, thereby forms the slit-shaped electron emission part in conducting film.

To exciting processing through the electric element that causes shaping.Among this embodiment, introduce ethylene gas in a vacuum, and between element electrode, repeat to add the pulse 30 minutes that peak value is 20V.By this exciting step, near electron emission part, the compound of the main carbon containing of the about 10nm of deposit.

Make backboard with the electron source base board with many surface conductive electronic emission elements, this backboard constitutes shell with panel and support frame.The enclosure of finding time, and sealing obtain the image processing system that has display panel and be used to realize the drive circuit that TV shows.This image processing system forms the high quality graphic without any any non-radiating portion (picture element flaw).

To list effect of the present invention according to the number of the foregoing description and example below.

(effect 1 of the present invention) in disassembling processing, can be separated into glass and the flint glass that does not conform to any lead according to the present invention with scrapping FPD, helps to disassemble and utilize.In addition, can prevent the lead contamination environment.

(effect 2 of the present invention) the present invention helps scrapping of FPD and utilizes the processing of disassembling of needs again.

Because separable and recovery conduct causes the lead of the poisonous metal of serious problems, so can reduce the environmental pressure that waste product causes.Since can recovery and reuse used rare element and rare earth element such as noble metal for example, so saved resource effectively.

(effect 3 of the present invention) according to the method for utilizing again of the present invention, can utilize again as the backboard of scrapping the important component of screen board display, so but efficent use of resources reduce cost.

(effect 4 of the present invention) according to the present invention owing to during the flat-panel monitor of dismantling, can almost not damage ground recovery and reuse separator, so but efficent use of resources reduce cost.In addition, since recycling step without any need for meticulous artificial, so can reclaim separator safely.

(effect 5 of the present invention) the present invention can provide a kind of method, regardless of type of device, can both effectively reclaim fluorescent material and almost not have the recycling panel of ripple from CRT and flat-panel monitor.

(effect 6 of the present invention) according to image display device of the present invention, comprising: the device that is connected with exhaust apparatus with gas-tight container under remaining below atmospheric pressure; Be used for progressively said internal tank being returned to atmospheric device.When making gas-tight container return to atmospheric pressure, can not destroy and damage structure member of anti-atmospheric pressure the and image display device basically.So, utilize the parts after pulling down easily.In addition, repair the defective that produces during the manufacturing easily.

(effect 7 of the present invention) can separate each parts that constitutes shell successively in flat-panel monitor according to the present invention, so can not damage under the situation of shell and internal part during disassembling technology, utilize simple method safety to reclaim each parts.Therefore, each parts can be reclaimed as recycling parts, can effectively utilize resource, can reduce cost.

(effect 8 of the present invention) poisonous metal residual quantity checkout gear according to the present invention shows following excellent beneficial effect.

In poisonous metal residual quantity checkout gear of the present invention, inspected object is immersed in first and washes out in the groove of device, so that wash out poisonous metal contained in the inspected object with the acid solution in the groove.Inspected object is transferred in the cleaning device, cleaned at this.Then, detection material is soaked second and is washed out in the groove of device, so that wash out the poisonous metal of staying on the inspected object with the acid solution in the groove.Said wash solution is fed in the detection by quantitative device, contained poisonous metal amount in the detection by quantitative wash solution.Therefore, when disassembling and splitting flat-panel monitor etc., can detection by quantitative stay the amount of the poisonous metals such as for example lead on the inspected object such as for example splitting glass component or refuse.

In this case, inspected object is immersed in the soaking compartment that acid solution is housed simply, so, under condition without any loaded down with trivial details operation, can its amount of detection by quantitative.As long as inspected object is not dissolved in the acid solution, just can wash out poisonous metals such as for example lead contained in the inspected object.The material that detects, shape etc. are not particularly limited, can detect various parts.

(effect 9 of the present invention) flat-panel monitor disassembling apparatus according to the present invention shows following excellent effect.

In flat-panel monitor disassembling apparatus of the present invention, to go up from display unit main body (vacuum tank) the step of split-frame parts, first bracing or strutting arrangement is by adding pulling force, the plate of support fixation to the separator.Separator is unsettled, and the weight of the plate of not fixed can be under the condition that applies any load on the separator, the split-frame parts.So can prevent any damage to separator.

After having separated framework, second bracing or strutting arrangement holds and the edge of support fixation to the plate of separating.At this moment, separator is unsettled, the weight of the plate of not fixed.When plate is received and supports, utilize the separator retracting device, from hold the step of separating separator by second bracing or strutting arrangement with the plate that supports.In addition, in separator separation/recovery step, separator is not subjected to any weight, can prevent damaged.

That is, can utilize appropriate steps to disassemble processing, can without any damage reclaim the member that separator for example etc. can directly utilize again.As a result, can each member of cycling and reutilization.

(effect 10 of the present invention) the present invention can be during demolishing and scrapping FPD, utilizing immersion treatment to separate from glass plate the step of composition such as lead for example, handles a large amount of glass substrates immediately.Therefore, the demand of (1) Treatment Solution is little, and it is few that (2) handle energy needed, and (3) can handle many glass at short notice.Therefore, can significantly reduce the cost that FPD is scrapped in processing.

(effect 11 of the present invention) the present invention has improved panel stationary fixture and the fixing means that is used for from the recovery operation of such flat-panel monitor recovery fluorescent material.In addition, according to the positional information of stationary fixture, drive the brush that is used to reclaim fluorescent material.Can be effectively and reclaim fluorescent material reliably.

(effect 12 of the present invention) the present invention can be easily during demolishing and scrapping FPD, utilizing immersion treatment to separate from glass plate the step of composition such as lead for example, handles a large amount of glass substrates immediately.The present invention can be safely and is reclaimed a large amount of glass substrates apace, makes the processing automation easily.Therefore, can greatly reduce the cost that FPD is scrapped in processing.

(effect 13 of the present invention) the present invention can utilize method simply, detects the residue on the substrate surface and is diffused into element in the substrate.Simultaneously, except that glass constituted element, the present invention can remove all elements.So can utilize glass effectively again, not waste scrap.

Claims (64)

1, the recovery method of separator in a kind of flat-panel monitor, said flat-panel monitor has backboard at least, panel, frame part and separator, said backboard has a plurality of electronic emission elements, panel is arranged in the face of backboard and is had image displaying part, separator is used to keep interval between backboard and panel with Chinese People's Anti-Japanese Military and Political College's air pressure, backboard, panel, frame part and separator utilize sintered glass to weld together, it is characterized in that, when in salpeter solution, soaking welding portion between separator and backboard or panel when dissolving sintered glass, adopt separator to reclaim anchor clamps, to avoid between each separator or separator and contacting between parts on every side.

2, according to the separator recovery method of claim 1, wherein separator is a plate shape, and thickness is not more than 300 microns.

3, according to the separator recovery method of claim 1, wherein separator recovery anchor clamps comprise the flat board with the one or more grooves that can deposit separator.

4, according to the separator recovery method of claim 1, wherein separator recovery anchor clamps comprise having the end that can clamp and fix each separator and can make the said end anchor clamps of mobile arm in any direction.

5, according to the separator recovery method of claim 1, wherein separator reclaims partly or entirely being formed by fluoroplastics of anchor clamps.

6, according to the separator recovery method of claim 1, wherein the substrate of separator comprises glass.

7, according to the separator recovery method of claim 1, wherein sintered glass contains lead oxide.

8, according to the separator recovery method of claim 1, wherein, separate backboard, panel and framework by cutting or sintered glass dissolving.

9, a kind of separator retracting device that is used for flat-panel monitor, said flat-panel monitor has backboard, panel, frame part and the separator with a plurality of electronic emission elements at least, it is characterized in that, comprising:

Be used to dissolve the salpeter solution groove of welding portion between separator and backboard or panel; And be used to prevent that the separator that contacts between separator and peripheral components from reclaiming anchor clamps.

10, a kind of method that reclaims fluorescent material from display unit, in said display unit, fluorescent material is coated on the substrate, causes luminously to show implementing, and it is characterized in that, utilizes brush and pump unit to reclaim the fluorescent material that is coated on the substrate.

11, according to the method for the recovery fluorescent material of claim 10, it is characterized in that the substrate that reclaims fluorescent material from it comprises the panel that separates and reclaim from the flat display devices that is made of panel, frame part and backboard.

12, according to the method for the recovery fluorescent material of claim 11, it is characterized in that separator is inserted between panel and the backboard.

13, according to the method for the recovery fluorescent material of claim 10, it is characterized in that the substrate that reclaims fluorescent material from it comprises the screen board that separates and reclaim from the CRT that is made of panel and cone.

14, according to the method for the recovery fluorescent material of claim 10, it is characterized in that brush comprises rotating brush, utilize this rotating brush to make any surface finish of the substrate that scribbles fluorescent material.

15, a kind of display device manufacturing method is characterized in that, comprising: the method that reclaims fluorescent material from display unit of utilizing claim 10 to limit has been removed the substrate of fluorescent material, be used further to display unit.

16, a kind of image display device is characterized in that, comprises display unit, the gas-tight container that is used for display image and is used to make the inside of said gas-tight container progressively to change into device near said gas-tight container external pressure as required.

17, a kind of image display device according to claim 16, it is characterized in that, said device also comprises exhaust apparatus, the device near said gas-tight container external pressure is progressively changed in the said inside that is used to make said gas-tight container, is arranged on the different position of device that links to each other with said exhaust apparatus on the said gas-tight container.

According to the image display device of claim 16, it is characterized in that 18, the device that said gas-tight container inside is changed near the gas-tight container external pressure comprises essential filter.

19, according to the image display device of claim 16, wherein said gas-tight container has been introduced the structure member of anti-the atmospheric pressure, and the structure member of anti-the atmospheric pressure comprises separator.

20, according to the image display device of claim 16, it is characterized in that, make said gas-tight container inside change to device near the gas-tight container external pressure and comprise and adopt slow leak valve, be provided with and adopt in the porous material any corresponding to the elongated tubular of certain specification.

21, a kind of image display device, it is characterized in that, comprise the structure member of anti-atmospheric pressure the in the display unit of display image, the gas-tight container that is used to keep external pressure, said gas-tight container, is connected with exhaust apparatus the said gas-tight container inside that is used to find time device, reach the device that makes said gas-tight container inside progressively change into approaching said gas-tight container external pressure as required.

22, a kind of poisonous metal residual quantity checkout gear, be used for test example as being used for the contained amounts of inspected object such as recycling parts of disassembling and decomposing or refuse as poisonous metals such as lead, it is characterized in that, comprise: first washes out device, at the groove that is used for soaking inspected object, has the acid solution that is used for washing out the contained poisonous metal of detection material; Cleaning device is used for cleaning inspected object utilizing first to wash out after device washes out; Second washes out device, is being used for soaking the groove that utilizes the detection material that cleaning device cleaned, and has to be used to wash out the acid solution of staying the poisonous metal on the inspected object; And the detection by quantitative device, be used for the poisonous metal amount that acid solution that detection by quantitative second washes out device washes out.

According to the poisonous metal residual quantity checkout gear of claim 22, it is characterized in that 23, said detection by quantitative device comprises the detection by quantitative device that utilizes absorption process detection by quantitative poisonous metal amount.

According to the poisonous metal residual quantity checkout gear of claim 22, it is characterized in that 24, said detection by quantitative device comprises the detection by quantitative device that utilizes plasma emission spectra analytical method detection by quantitative poisonous metal amount.

According to the poisonous metal residual quantity checkout gear of claim 22, it is characterized in that 25, inspected object comprises the glass component that constitutes flat-panel monitor etc.

26, according to the poisonous metal residual quantity checkout gear of claim 22, it is characterized in that, utilize the poisonous metal of said detection by quantitative device detection by quantitative to comprise lead.

According to the poisonous metal residual quantity checkout gear of claim 22, it is characterized in that 27, said first washes out device or said second washes out the used acid solution of device and comprise salpeter solution.

According to the poisonous metal residual quantity checkout gear of claim 23, it is characterized in that 28, absorption process is included in and adds iodide in the lead ion in the salpeter solution to show color, measure then and absorb, thereby from absorption value, obtain plumbum ion concentration.

According to the poisonous metal residual quantity checkout gear of claim 24, it is characterized in that 29, plasma emission spectra analytic approach comprises and obtains the concentration of lead ion in salpeter solution.

30, a kind of flat-panel monitor disassembling apparatus, be used to disassemble and recycling flat-panel monitor, in the said flat-panel monitor, frame part is inserted between backboard and panel, constitute flat vacuum tank, be used to keep the separator of gap Chinese People's Anti-Japanese Military and Political College air pressure between two plates to be fixed on two plates or one of two plates, it is characterized in that, comprising:

First bracing or strutting arrangement is used for adding upper pulling force and supporting this plate being fixed in plate on the separator, so that carry out the step of split-frame from the vacuum tank; Second bracing or strutting arrangement is used at an edge that holds after the framework apart with the plate of support fixation on separator; The separator retracting device is used to carry out separate separator from utilizing second support component to hold with the plate that supports.

According to the flat-panel monitor disassembling apparatus of claim 30, it is characterized in that 31, said first bracing or strutting arrangement comprises evacuator, be used for producing the power of lifting and come supporting bracket by suction force from evacuator.

According to the flat-panel monitor disassembling apparatus of claim 30, it is characterized in that 32, said first bracing or strutting arrangement comprises aspirator, be used for producing the power of lifting and come supporting bracket from the suction force of aspirator.

According to the flat-panel monitor disassembling apparatus of claim 30, it is characterized in that 33, said separator retracting device comprises the acid solution soaking compartment, be used for separating separator from the plate that is received/supports by soaking said second bracing or strutting arrangement at acid solution.

According to the flat-panel monitor disassembling apparatus of claim 30, it is characterized in that 34, said separator retracting device comprises heating furnace, be used for separating separator from the plate that is received/supports by heating said second bracing or strutting arrangement.

35, according to the flat-panel monitor disassembling apparatus of claim 30, it is characterized in that, also comprise conveyer, be used for after having separated the step of frame parts from vacuum tank, hold supporting bracket from first bracing or strutting arrangement, hold and support an edge of this plate, and this plate is sent to said second bracing or strutting arrangement.

According to the flat-panel monitor disassembling apparatus of claim 35, it is characterized in that 36, said conveyer has the load that prevents to be fixed to the plate on the separator and is added on structure on the separator.

37, a kind of dull and stereotyped main body solid unit is used for fixing by framework in conjunction with the dull and stereotyped main body that a pair of screen board that faces with each other obtains, and it is characterized in that, comprising:

Be arranged to collapsible with respect to dull and stereotyped main body so that surround the stationary fixture be located at the dull and stereotyped main body on the pedestal, wherein stationary fixture swing, and around dull and stereotyped main body, contacting, thereby fixed flat planar main body with dull and stereotyped main body.

38, according to the dull and stereotyped main body fixture of claim 37, it is characterized in that, also comprise:

Be used for respect to the move around driving mechanism of stationary fixture of dull and stereotyped main body;

Be used for detecting the position detecting device of said stationary fixture position according to the amount of movement of stationary fixture; And

Be used to control the controller of said driving mechanism,

The size of dull and stereotyped main body is detected by the positional information of the said stationary fixture that utilizes said position detecting device to obtain.

39, according to the dull and stereotyped main body fixture of claim 37, it is characterized in that, also comprise the sticking hole sticking that is used for by being formed at pedestal and the holding device of fixed flat planar main body.

40, a kind of flat-panel monitor fluorescent material retracting device, be used for reclaiming the fluorescent material of flat-panel monitor, said flat-panel monitor comprises panel, backboard and framework, and this flat-panel monitor is luminous because electron radiation is coated on fluorescent material on the panel, it is characterized in that, comprising:

In the said fixture that claim 37 limits, said panel is fixed from four direction by said stationary fixture.

41, the flat board according to claim 38 shows device fluorescent material retracting device, it is characterized in that, said device comprises a plurality of being used for from reclaimed the processing unit of fluorescent material by the fixing panel of said fixture, and said processing unit is driven according to the positional information that said position detecting device obtains by said controller.

42, according to the flat-panel monitor fluorescent material retracting device of claim 41, it is characterized in that said processing unit comprises: the cutter sweep that is used to separate panel and backboard; With the retracting device that is used to sweep and aspirate the fluorescent material on the panel.

According to the flat-panel monitor fluorescent material retracting device of claim 42, it is characterized in that 43, the processing operation of the cutter of said cutter sweep and the recovery of retracting device brush is subjected to the control of said controller, thereby handles in the predetermined process scope.

44, according to the flat panel display fluorescent material retracting device of claim 42, it is characterized in that, also comprise the fluorescent material checkout gear that is used to detect the fluorescence quality of staying on the panel, the action of said retracting device is according to said fluorescent material checkout gear resulting fluorescence quality information and controlled.

According to the flat panel display fluorescent material retracting device of claim 44, it is characterized in that 45, fluorescence quality information is limited by the visible light transmittance or the absorptivity that see through panel.

According to the flat panel display fluorescent material retracting device of claim 44, it is characterized in that 46, fluorescence quality information is limited by the fluorescence intensity that the inner surface that utilizes ultraviolet ray or visible radiation panel produces.

According to the flat panel display fluorescent material retracting device of claim 44, it is characterized in that 47, said fluorescent material checkout gear moves in the working range of the recovery brush of said retracting device.

48, a kind of flat-panel monitor fluorescent material recovery method, be used for reclaiming the fluorescent material of flat-panel monitor, wherein flat-panel monitor comprises panel, backboard and framework, and by be coated on fluorescent material on the panel with electron radiation and luminous, said method is characterised in that, may further comprise the steps:

The swing stationary fixture is from being arranged at the four direction fixed flat planar display of the flat-panel monitor on the pedestal;

The panel and the backboard that separate fixing flat-panel monitor; And

The recycling step of the fluorescent material of cleaning and suction panel.

49, according to the flat-panel monitor fluorescent material recovery method of claim 48, it is characterized in that, further comprising the steps of: the position of detecting stationary fixture according to the amount of movement of the stationary fixture that is used for fixing flat-panel monitor.

50, according to the flat-panel monitor fluorescent material recovery method of claim 48, it is characterized in that, further comprising the steps of: by being formed at the sticking hole in the pedestal, sticking and fixed flat planar display.

According to the flat-panel monitor fluorescent material recovery method of claim 48, it is characterized in that 51, control utilizes the cutting work of cutter, so that during separating panel and backboard, according to the positional information of stationary fixture, the size of matching panel.

According to the flat-panel monitor fluorescent material recovery method of claim 48, it is characterized in that 52, control utilization is reclaimed the recovery operation of brush, so that during the fluorescent material that reclaims panel, according to the positional information of stationary fixture, the size of matching panel.

53, according to the flat-panel monitor fluorescent material recovery method of claim 52, it is characterized in that, further comprising the steps of: detect the fluorescence quality that stays on the panel, and the work that said recovery is brushed according to the information Control of detection fluorescence quality.

According to the flat-panel monitor fluorescent material recovery method of claim 52, it is characterized in that 54, further comprising the steps of: brush is reclaimed in control, make it to do to move in the scope the recovery dataller.

55, a kind of glass substrate processing method detects the surface state of glass substrate and according to testing result treatment substrate surface, it is characterized in that, comprising:

Detect step,, detect the fluorescent X-ray that is produced, to detect the element that exists on the glass baseplate surface with primary X-ray radiant glass substrate surface;

Remove step,, remove glass from glass baseplate surface and constitute element outside the element according to the testing result that detects step.

56, according to the glass substrate processing method of claim 55, it is characterized in that, detect the detection step of the element that exists on the glass baseplate surface, comprise the relative position that changes glass substrate and fluorescent X-ray detector according to the size of glass substrate.

57, according to the glass substrate processing method of claim 55, it is characterized in that, the fluorescent X-ray detector with the primary X-ray radiation than the wideer zone, zone that can detect fluorescent X-ray.

According to the glass substrate processing method of claim 55, it is characterized in that 58, the incidence angle when primary X-ray incides on the glass substrate is not more than the critical angle of primary X-ray.

59, according to the glass substrate processing method of claim 55, it is characterized in that,, be used for the removal step of glass baseplate surface by the polished glass substrate surface.

60, according to the glass substrate processing method of claim 55, it is characterized in that, repeat to be used for the detection step of glass baseplate surface and remove step.

61, a kind of glass substrate circulation process method of flat-panel monitor, said flat-panel monitor comprises backboard, panel and support frame, said backboard has a plurality of electronic emission elements that are formed on the glass substrate, said panel has the image displaying part that is formed on the glass substrate, said support frame is in conjunction with each plate, they are faced with each other, said method is characterised in that, after backboard separated with panel and takes out, the processing method that claim 55 limits was applied to the substrate surface of backboard or panel.

62, according to the flat panel display glass substrate circulation process method of claim 61, it is characterized in that, on the glass substrate of backboard, form the wiring that mainly contains Ag.

63, according to the flat panel display glass substrate circulation process method of claim 61, it is characterized in that, on the glass baseplate surface that constitutes backboard, form the film that contains the element outside the glass formation element.

According to the flat panel display glass substrate circulation process method of claim 61, it is characterized in that 64, dissolving separates backboard, panel and framework in conjunction with the sintered glass of backboard, panel and framework.

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